Abstract

A resin composition includes: 70 parts by weight of a vinyl-containing resin; 3 parts by weight to 45 parts by weight of a polymer A; and 5 parts by weight to 55 parts by weight of a divinylbenzene-styrene-ethylene terpolymer, wherein the vinyl-containing resin includes a vinyl-containing polyphenylene ether resin, a maleimide resin, a vinyl-containing polyolefin or a combination thereof, and the polymer A includes a compound represented by Formula (1), a compound represented by Formula (2), a compound represented by Formula (3), a compound represented by Formula (4), a compound represented by Formula (5), a compound represented by Formula (6) or a combination thereof, A resin composition includes: 70 parts by weight of a vinyl-containing resin; 3 parts by weight to 45 parts by weight of a polymer A; and 5 parts by weight to 55 parts by weight of a divinylbenzene-styrene-ethylene terpolymer, wherein the vinyl-containing resin includes a vinyl-containing polyphenylene ether resin, a maleimide resin, a vinyl-containing polyolefin or a combination thereof, and the polymer A includes a compound represented by Formula (1), a compound represented by Formula (2), a compound represented by Formula (3), a compound represented by Formula (4), a compound represented by Formula (5), a compound represented by Formula (6) or a combination thereof, A resin composition includes: 70 parts by weight of a vinyl-containing resin; 3 parts by weight to 45 parts by weight of a polymer A; and 5 parts by weight to 55 parts by weight of a divinylbenzene-styrene-ethylene terpolymer, wherein the vinyl-containing resin includes a vinyl-containing polyphenylene ether resin, a maleimide resin, a vinyl-containing polyolefin or a combination thereof, and the polymer A includes a compound represented by Formula (1), a compound represented by Formula (2), a compound represented by Formula (3), a compound represented by Formula (4), a compound represented by Formula (5), a compound represented by Formula (6) or a combination thereof, wherein n1 to n6 and R1 to R5 are as defined in the specification.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08F 212/36 - Divinylbenzene
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08K 3/36 - Silica
• C08K 5/01 - Hydrocarbons
• C08K 5/14 - Peroxides
• C08K 7/18 - Solid spheres inorganic

Abstract

A resin composition includes 100 parts by weight of a maleimide resin, 50 to 100 parts by weight of a maleic anhydride-modified polyolefin resin and 0.1 to 1.5 parts by weight of a free radical scavenger, wherein the maleimide resin has a structure of Formula (1), and the free radical scavenger includes o-methylhydroquinone, a nitroxide radical compound having a tetramethylpiperidine structure or a combination thereof. The resin composition may be used to make various articles, including a resin-coated copper, a resin film, a laminate or a printed circuit board, and one or more of the properties can be improved, including copper foil peeling strength, resin flow and 5° C. shelf life.

IPC Classes  ?

• C09D 7/48 - Stabilisers against degradation by oxygen, light or heat
• C09D 7/63 - Additives non-macromolecular organic
• C09D 179/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C09J 11/06 - Non-macromolecular additives organic
• C09J 179/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• H05K 1/03 - Use of materials for the substrate

Abstract

A resin composition includes: 100 parts by weight of a maleimide resin including 50 parts by weight to 100 parts by weight of a maleimide resin represented by Formula (1); 2 parts by weight to 30 parts by weight of a polymer, including a structural unit represented by Formula (2), a structural unit represented by Formula (5), a structural unit represented by Formula (3) and a structural unit represented by Formula (4), wherein the structural units represented by Formula (3) and Formula (4) are located between the structural unit represented by Formula (2) and the structural unit represented by Formula (5); and 0.5 parts by weight to 5 parts by weight of a silicon-containing compound; A resin composition includes: 100 parts by weight of a maleimide resin including 50 parts by weight to 100 parts by weight of a maleimide resin represented by Formula (1); 2 parts by weight to 30 parts by weight of a polymer, including a structural unit represented by Formula (2), a structural unit represented by Formula (5), a structural unit represented by Formula (3) and a structural unit represented by Formula (4), wherein the structural units represented by Formula (3) and Formula (4) are located between the structural unit represented by Formula (2) and the structural unit represented by Formula (5); and 0.5 parts by weight to 5 parts by weight of a silicon-containing compound; A resin composition includes: 100 parts by weight of a maleimide resin including 50 parts by weight to 100 parts by weight of a maleimide resin represented by Formula (1); 2 parts by weight to 30 parts by weight of a polymer, including a structural unit represented by Formula (2), a structural unit represented by Formula (5), a structural unit represented by Formula (3) and a structural unit represented by Formula (4), wherein the structural units represented by Formula (3) and Formula (4) are located between the structural unit represented by Formula (2) and the structural unit represented by Formula (5); and 0.5 parts by weight to 5 parts by weight of a silicon-containing compound; wherein n and R1 to R4 are defined in the specification. The invention also provides an article manufactured using the aforesaid resin composition.

IPC Classes  ?

• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08K 3/36 - Silica
• C08K 5/3445 - Five-membered rings
• C08K 7/26 - Silicon-containing compounds
• C08K 9/06 - Ingredients treated with organic substances with silicon-containing compounds

Abstract

A resin composition includes a vinyl group-containing resin, which includes a vinyl group-containing polyphenylene ether resin, a maleimide resin, a vinyl group-containing polyolefin resin, a vinyl group-containing aromatic fluorene compound or a combination thereof, and a prepolymer, which is prepared from a mixture subjected to a prepolymerization reaction, the mixture including a vinyltoluene-divinylbenzene copolymer, a vinyl group-containing aromatic fluorene compound and a benzocyclobutene-modified polybutadiene diacrylate. The resin composition may be useful for making different articles, including a resin-coated copper, a laminate or a printed circuit board.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
• C08F 212/36 - Divinylbenzene
• C08F 222/10 - Esters
• C08G 61/10 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aromatic carbon atoms, e.g. polyphenylenes
• C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors

Abstract

The present disclosure provides a resin composition, including a vinyl group-containing resin and a phosphorus-containing copolymer. The phosphorus-containing copolymer is polymerized from a monomer represented by Formula (1) and a monomer represented by Formula (2). Further, the present disclosure also provides an article made from the aforesaid resin composition, including a prepreg, a resin film, a laminate, or a printed circuit board. The present disclosure provides a resin composition, including a vinyl group-containing resin and a phosphorus-containing copolymer. The phosphorus-containing copolymer is polymerized from a monomer represented by Formula (1) and a monomer represented by Formula (2). Further, the present disclosure also provides an article made from the aforesaid resin composition, including a prepreg, a resin film, a laminate, or a printed circuit board.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08L 15/00 - Compositions of rubber derivatives
• C08L 65/02 - Polyphenylenes
• H05K 1/03 - Use of materials for the substrate

Abstract

A resin composition includes a vinyl group-containing resin and a phosphorus-containing copolymer, wherein the phosphorus-containing copolymer is prepared from a mixture subjected to a copolymerization reaction, and the mixture includes a vinyl group-containing benzocyclobutene of Formula (1) and a phosphorus-containing compound of Formula (2). The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and one or more of the properties can be improved, including dissipation factor, copper foil peeling strength, flame resistance and X-axis coefficient of thermal expansion. A resin composition includes a vinyl group-containing resin and a phosphorus-containing copolymer, wherein the phosphorus-containing copolymer is prepared from a mixture subjected to a copolymerization reaction, and the mixture includes a vinyl group-containing benzocyclobutene of Formula (1) and a phosphorus-containing compound of Formula (2). The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and one or more of the properties can be improved, including dissipation factor, copper foil peeling strength, flame resistance and X-axis coefficient of thermal expansion.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08K 3/36 - Silica
• C08K 5/14 - Peroxides
• C08L 9/00 - Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
• C08L 65/02 - Polyphenylenes

Abstract

A resin composition includes 100 parts by weight of a thermosetting resin, 10 parts by weight to 40 parts by weight of a fluorene-containing compound and 210 parts by weight to 400 parts by weight of silica. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one or more of the following properties can be improved, including PCT water absorption ratio, dielectric constant, dissipation factor, copper foil peeling strength, thermal conductivity and glass transition temperature. A resin composition includes 100 parts by weight of a thermosetting resin, 10 parts by weight to 40 parts by weight of a fluorene-containing compound and 210 parts by weight to 400 parts by weight of silica. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one or more of the following properties can be improved, including PCT water absorption ratio, dielectric constant, dissipation factor, copper foil peeling strength, thermal conductivity and glass transition temperature.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08K 3/26 - CarbonatesBicarbonates
• C08K 3/28 - Nitrogen-containing compounds
• C08K 3/36 - Silica
• C08K 5/01 - Hydrocarbons
• C08K 5/14 - Peroxides
• C08L 9/06 - Copolymers with styrene
• C08L 35/06 - Copolymers with vinyl aromatic monomers
• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors

Abstract

A resin composition includes 100 parts by weight of a vinyl group-containing resin and 35 parts by weight to 65 parts by weight of a phosphorus-containing compound of Formula (1). The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and one or more of the properties can be improved, including dissipation factor, copper foil peeling strength, flame resistance and X-axis coefficient of thermal expansion. A resin composition includes 100 parts by weight of a vinyl group-containing resin and 35 parts by weight to 65 parts by weight of a phosphorus-containing compound of Formula (1). The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and one or more of the properties can be improved, including dissipation factor, copper foil peeling strength, flame resistance and X-axis coefficient of thermal expansion.

IPC Classes  ?

• C08K 5/5397 - Phosphine oxides
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08K 3/36 - Silica
• C08K 5/14 - Peroxides
• C08K 5/5313 - Phosphinic compounds, e.g. R2=P(:O)OR'
• C08K 5/5373 - Esters of phosphonic acids containing heterocyclic rings not representing cyclic esters of phosphonic acids
• C08K 5/5399 - Phosphorus bound to nitrogen
• C08L 9/00 - Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
• C08L 65/02 - Polyphenylenes
• C08L 71/12 - Polyphenylene oxides

Abstract

A resin composition is disclosed. The resin composition includes 100 parts by weight of maleimide resin represented by the formula (1); 1.5 parts by weight to 20 parts by weight of hydrogenated polybutadiene; and 10 parts by weight to 35 parts by weight of a vinylbenzyl-containing compound, A resin composition is disclosed. The resin composition includes 100 parts by weight of maleimide resin represented by the formula (1); 1.5 parts by weight to 20 parts by weight of hydrogenated polybutadiene; and 10 parts by weight to 35 parts by weight of a vinylbenzyl-containing compound, A resin composition is disclosed. The resin composition includes 100 parts by weight of maleimide resin represented by the formula (1); 1.5 parts by weight to 20 parts by weight of hydrogenated polybutadiene; and 10 parts by weight to 35 parts by weight of a vinylbenzyl-containing compound, wherein n is an average number of a repeating unit based on a number-average molecular weight, n is a numerical value ranging from 1 to 20, and each R1to R4 independently is H or C1-3 alkyl. The invention also provides an article manufactured using the aforesaid resin composition.

IPC Classes  ?

• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08K 5/01 - Hydrocarbons

Abstract

A resin composition is provided, comprising 5 parts by weight to 25 parts by weight of a divinylbenzene-styrene-ethylene copolymer and 2 parts by weight to 15 parts by weight of an acryloyloxy group-containing compound, comprising an acryloyloxy group-containing compound having a structure represented by Formula (1), an acryloyloxy group-containing compound having a structure represented by Formula (2), an acryloyloxy group-containing compound having a structure represented by Formula (3) or an acryloyloxy group-containing compound having a structure represented by Formula (4). Also, an article made from the resin composition is provided, comprising a resin-coated copper, a laminate or a printed circuit board that has improvements in one or more properties. A resin composition is provided, comprising 5 parts by weight to 25 parts by weight of a divinylbenzene-styrene-ethylene copolymer and 2 parts by weight to 15 parts by weight of an acryloyloxy group-containing compound, comprising an acryloyloxy group-containing compound having a structure represented by Formula (1), an acryloyloxy group-containing compound having a structure represented by Formula (2), an acryloyloxy group-containing compound having a structure represented by Formula (3) or an acryloyloxy group-containing compound having a structure represented by Formula (4). Also, an article made from the resin composition is provided, comprising a resin-coated copper, a laminate or a printed circuit board that has improvements in one or more properties.

IPC Classes  ?

• C09D 4/06 - Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups
• C09D 125/08 - Copolymers of styrene
• C09D 135/00 - Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least another carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereofCoating compositions based on derivatives of such polymers
• C09D 135/02 - Homopolymers or copolymers of esters
• C09D 171/12 - Polyphenylene oxides
• H05K 1/03 - Use of materials for the substrate

Abstract

A resin composition includes 100 parts by weight of vinyl-containing polyphenylene ether resin; 8 parts by weight to 20 parts by weight of a compound represented by the following formula (1); and 0.5 parts by weight to 2.5 parts by weight of a compound represented by the following formula (2), A resin composition includes 100 parts by weight of vinyl-containing polyphenylene ether resin; 8 parts by weight to 20 parts by weight of a compound represented by the following formula (1); and 0.5 parts by weight to 2.5 parts by weight of a compound represented by the following formula (2), wherein each R1, R2, R3 and R4 respectively is C1-4 alkyl or H, and each R5, R6, R7, R8, R9, R10, R11, R12, R13, R14, R15, R16, R17 and R18 respectively is C1 alkyl or H. An article manufactured using the aforesaid resin composition is also provided.

IPC Classes  ?

• C08L 65/02 - Polyphenylenes
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

Abstract

A resin composition is provided, comprising a vinyl group-containing resin and a prepolymer. The prepolymer is made from a mixture by a prepolymerization reaction, and the mixture comprises a compound represented by Formula (1) and a compound represented by Formula (2). Also, an article made from the resin composition is provided, comprising a prepreg, a resin film, a laminate or printed circuit board. A resin composition is provided, comprising a vinyl group-containing resin and a prepolymer. The prepolymer is made from a mixture by a prepolymerization reaction, and the mixture comprises a compound represented by Formula (1) and a compound represented by Formula (2). Also, an article made from the resin composition is provided, comprising a prepreg, a resin film, a laminate or printed circuit board.

IPC Classes  ?

• C08F 283/08 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to polyethers, polyoxymethylenes or polyacetals on to polyphenylene oxides
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

Goods & Services

Copper clad laminates for use in the manufacture of printed circuit boards semi-cured resin sheets for use in the manufacture of circuit boards, films and sheets made out of resin for use in the manufacture of circuit boards prepregs being glass fiber fabrics impregnated with a resin composition and semi-cured with the resin composition; glass fiber fabrics impregnated and semi-cured with a resin composition

Abstract

A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin; 20 parts by weight to 60 parts by weight of a compound represented by the following formula (1); and 20 parts by weight to 60 parts by weight of an ethylene-styrene-divinylbenzene terpolymer, A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin; 20 parts by weight to 60 parts by weight of a compound represented by the following formula (1); and 20 parts by weight to 60 parts by weight of an ethylene-styrene-divinylbenzene terpolymer, A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin; 20 parts by weight to 60 parts by weight of a compound represented by the following formula (1); and 20 parts by weight to 60 parts by weight of an ethylene-styrene-divinylbenzene terpolymer, wherein n is an integer ranging from 1 to 20. An article manufactured using the aforesaid resin composition is also provided.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

Abstract

A vinyl group-containing phosphoric copolymer, a resin composition comprising the phosphoric copolymer and an article made from the resin composition are disclosed. The vinyl group-containing phosphoric copolymer includes a structural unit of Formula (1-1) and a structural unit of Formula (1-2). The resin composition includes 100 parts by weight of a vinyl group-containing polyphenylene ether resin and 55 to 80 parts by weight of a vinyl group-containing phosphoric copolymer. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength, flame retardancy, glass transition temperature and PCT water absorption ratio. A vinyl group-containing phosphoric copolymer, a resin composition comprising the phosphoric copolymer and an article made from the resin composition are disclosed. The vinyl group-containing phosphoric copolymer includes a structural unit of Formula (1-1) and a structural unit of Formula (1-2). The resin composition includes 100 parts by weight of a vinyl group-containing polyphenylene ether resin and 55 to 80 parts by weight of a vinyl group-containing phosphoric copolymer. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength, flame retardancy, glass transition temperature and PCT water absorption ratio.

IPC Classes  ?

• C08F 230/02 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing phosphorus
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08L 71/12 - Polyphenylene oxides
• C08L 85/02 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbonCompositions of derivatives of such polymers containing phosphorus

Abstract

A resin composition includes a polymer, which has a first structural unit of Formula (1) and a second structural unit of Formula (2). The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength and warpage at high temperature. A resin composition includes a polymer, which has a first structural unit of Formula (1) and a second structural unit of Formula (2). The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength and warpage at high temperature.

IPC Classes  ?

• C08F 283/04 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to polycarbonamides, polyesteramides or polyimides

Abstract

A resin composition is provided, which comprises: 100 parts by weight of resin A including vinyl group-containing polyphenylene ether resin or maleimide resin; 5 parts by weight to 15 parts by weight of a compound having a structure represented by Formula (1); and 2 parts by weight to 15 parts by weight of a compound B including a compound having a structure represented by Formula (2), a compound having a structure represented by Formula (3) or a compound having a structure represented by Formula (4). Also, a product made from the aforesaid resin composition is provided, including a resin-coated copper, a laminate or a printed circuit board. A resin composition is provided, which comprises: 100 parts by weight of resin A including vinyl group-containing polyphenylene ether resin or maleimide resin; 5 parts by weight to 15 parts by weight of a compound having a structure represented by Formula (1); and 2 parts by weight to 15 parts by weight of a compound B including a compound having a structure represented by Formula (2), a compound having a structure represented by Formula (3) or a compound having a structure represented by Formula (4). Also, a product made from the aforesaid resin composition is provided, including a resin-coated copper, a laminate or a printed circuit board.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08K 5/103 - EstersEther-esters of monocarboxylic acids with polyalcohols
• C08K 5/3492 - Triazines
• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors

Abstract

A resin composition includes a vinyl group-containing resin and a phosphorus-containing compound of Formula (1) or a prepolymer thereof, wherein: relative to 100 parts by weight of the vinyl group-containing resin, the phosphorus-containing compound of Formula (1) is 35 to 60 parts by weight; or relative to 100 parts by weight of the vinyl group-containing resin, the prepolymer of the phosphorus-containing compound of Formula (1) is 50 to 90 parts by weight. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and one or more properties can be improved. A resin composition includes a vinyl group-containing resin and a phosphorus-containing compound of Formula (1) or a prepolymer thereof, wherein: relative to 100 parts by weight of the vinyl group-containing resin, the phosphorus-containing compound of Formula (1) is 35 to 60 parts by weight; or relative to 100 parts by weight of the vinyl group-containing resin, the prepolymer of the phosphorus-containing compound of Formula (1) is 50 to 90 parts by weight. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and one or more properties can be improved.

IPC Classes  ?

• C08L 85/02 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbonCompositions of derivatives of such polymers containing phosphorus
• C08G 65/48 - Polymers modified by chemical after-treatment
• C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

Abstract

A resin composition is provided, which comprises: 1 part by weight to 20 parts by weight of a first resin represented by the following formula (1); and 70 parts by weight of a vinyl group-containing polyphenylene ether resin, wherein m is an integer ranging from 10 to 250. The present invention also provides an article manufactured using the aforesaid resin composition.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

Abstract

A resin composition is disclosed. The resin composition includes 100 parts by weight of vinyl group-containing polyphenylene ether, 20 parts by weight to 60 parts by weight of ethylene-styrene-divinylbenzene copolymer, and 5 parts by weight to 15 parts by weight of a compound represented by the Formula (1). An article made from the composition is also disclosed, and the article includes prepreg, resin film, laminate, or printed circuit board. A resin composition is disclosed. The resin composition includes 100 parts by weight of vinyl group-containing polyphenylene ether, 20 parts by weight to 60 parts by weight of ethylene-styrene-divinylbenzene copolymer, and 5 parts by weight to 15 parts by weight of a compound represented by the Formula (1). An article made from the composition is also disclosed, and the article includes prepreg, resin film, laminate, or printed circuit board.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08K 5/01 - Hydrocarbons
• C08K 7/18 - Solid spheres inorganic
• H05K 1/03 - Use of materials for the substrate

Abstract

A resin composition includes 100 parts by weight of a prepolymer and 150 to 200 parts by weight of a ceramic filler, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes a maleimide resin and a diamine compound in a molar ratio of between 1:2 and 2:1; the ceramic filler has a thermal conductivity of greater than 30 W/(m·K); and the diamine compound includes a compound of Formula (1), a compound of Formula (2), a compound of Formula (3) or a combination thereof. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one or more properties can be improved.

IPC Classes  ?

• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08G 73/02 - Polyamines
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08K 3/38 - Boron-containing compounds
• H05K 1/03 - Use of materials for the substrate

Goods & Services

Copper clad laminates for use in the manufacture of printed circuit boards. prepreg; films and sheets for use in the manufacture of circuit boards; glass fiber fabric impregnated and semi-cured with a resin composition for use in the manufacture of printed circuit boards; semi-cured resin sheets for use in the manufacture of printed circuit boards.

Abstract

A resin composition is provided, which comprises: 75 parts by weight of vinyl group-containing polyphenylene ether resin; 35 parts by weight to 60 parts by weight of an insoluble flame retardant; and 0.4 parts by weight to 5 parts by weight of a compound represented by the following formula (1): 3 and n are defined in the specification. The present invention also provides an article manufactured using the aforesaid resin composition.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08K 5/00 - Use of organic ingredients
• C09D 171/12 - Polyphenylene oxides
• C09J 171/12 - Polyphenylene oxides

Abstract

A prepolymer and a resin composition containing the prepolymer are provided. The prepolymer is obtained from a prepolymerization reaction of a mixture, the mixture at least including dicyclopentadiene-ethylidenenorbornene copolymer and acenaphthylene in a weight ratio of between 1:1 and 5:1. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one of the following properties can be improved, including dielectric constant, dissipation factor, copper foil peeling strength, X-axis coefficient of thermal expansion and glass transition temperature.

IPC Classes  ?

• C08L 51/00 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers
• C08F 232/08 - Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
• C08F 236/20 - Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds unconjugated
• C08F 279/00 - Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08L 45/00 - Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring systemCompositions of derivatives of such polymers

Abstract

A prepolymer and a resin composition containing the prepolymer are provided. The prepolymer is obtained from a prepolymerization reaction of a mixture, the mixture including 100 parts by weight of a compound of Formula (1) and 0.01 to 0.09 part by weight of a Grubbs catalyst. The resin composition may be used to make various articles, including a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength and passive intermodulation.

IPC Classes  ?

• C08F 12/08 - Styrene
• C08F 4/80 - MetalsMetal hydridesMetallo-organic compoundsUse thereof as catalyst precursors selected from metals not provided for in group selected from iron group metals or platinum group metals
• C08G 61/08 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring

Abstract

A resin composition includes a first compound and a second compound, wherein: the first compound has a structure of Formula (1); the second compound comprises bis(vinylphenyl) ethane, divinylbenzene-ethylstyrene-styrene copolymer, ethylene-propylene-ethylidenenorbornene copolymer or a combination thereof; and a weight ratio of the first compound and the second compound is between 1:5 and 5:1. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including varnish shelf life, temperature coefficient of dielectric constant, dielectric constant and solder floating thermal resistance of multi-layer board.

IPC Classes  ?

• C08K 5/01 - Hydrocarbons
• C08F 212/08 - Styrene
• C08F 212/36 - Divinylbenzene
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08L 23/16 - Ethene-propene or ethene-propene-diene copolymers

Abstract

A resin composition includes: (A) 100 parts by weight of an epoxy resin; (B) 10 to 30 parts by weight of a phenoxy resin; (C) 30 to 50 parts by weight of hydrogenated trimellitic anhydride; and (D) 250 to 400 parts by weight of a co-sintered body of aluminum nitride and boron nitride. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including visible light reflectivity, routing distance, flame retardancy and copper foil peeling strength.

IPC Classes  ?

• C08G 59/24 - Di-epoxy compounds carbocyclic
• C08G 59/30 - Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen, and nitrogen
• C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
• C08J 5/18 - Manufacture of films or sheets
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08K 3/28 - Nitrogen-containing compounds
• C08K 3/38 - Boron-containing compounds

Abstract

A resin composition includes a prepolymer which is prepared from a mixture subjected to a prepolymerization reaction, the mixture including 100 parts by weight of a first maleimide resin, 40 to 60 parts by weight of a siloxane compound and 10 to 30 parts by weight of a diamine compound, wherein: the first maleimide resin includes bisphenol A diphenyl ether bismaleimide; the siloxane compound includes a compound of Formula (I), having a molecular weight of 2200 to 2600 g/mol; and the diamine compound includes 4-aminophenyl-4-aminobenzoate. The resin composition may be used to make various articles, such as a varnish, a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including resin compatibility and X-axis coefficient of thermal expansion.

IPC Classes  ?

• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08G 73/06 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromoleculePolyhydrazidesPolyamide acids or similar polyimide precursors
• C08G 73/12 - Unsaturated polyimide precursors
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

Abstract

A resin composition includes 120 parts by weight of a vinyl group-containing polyphenylene ether resin, 5 parts by weight to 10 parts by weight of a compound of Formula (1), 15 parts by weight to 25 parts by weight of a compound of Formula (2), and 70 parts by weight to 110 parts by weight of an inorganic filler. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including difference rate of dissipation factor, gel time stability and stickiness.

IPC Classes  ?

• C08G 65/48 - Polymers modified by chemical after-treatment
• C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08J 5/18 - Manufacture of films or sheets
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08K 3/36 - Silica
• C08K 3/38 - Boron-containing compounds
• C08K 5/057 - Metal alcoholates
• C08K 5/159 - Heterocyclic compounds having oxygen in the ring having more than two oxygen atoms in the ring
• C08K 5/544 - Silicon-containing compounds containing nitrogen

Abstract

A phosphorus-containing compound of Formula (1) and a preparation method thereof are provided. The phosphorus-containing compound is a compound having a reactive functional group and containing a phosphorus atom in its structure. The preparation method includes: (1) reacting magnolol and phosphoryl chloride in a first alkaline environment to obtain an intermediate product; and (2) reacting the intermediate product and a benzenediol in a second alkaline environment to obtain the phosphorus-containing compound.

IPC Classes  ?

• C07F 9/12 - Esters of phosphoric acids with hydroxyaryl compounds

Goods & Services

copper clad laminates for use in the manufacture of printed circuit boards; metal clad substrates for use in the manufacture of printed circuit boards

Goods & Services

Prepregs which are glass fiber fabrics impregnated with a resin composition and semi-cured with the resin composition; Glass fiber fabrics impregnated and semi-cured with a resin composition

Goods & Services

Prepregs which are glass fiber fabrics or non-woven mats impregnated with a resin composition and semi-cured with the resin composition; glass fiber fabrics impregnated and semi-cured with a resin composition

Goods & Services

copper clad laminates for use in the manufacture of printed circuit boards; metal clad substrates for use in the manufacture of printed circuit boards

Abstract

A resin composition includes 100 parts by weight of a vinyl group-containing polyphenylene ether resin, 10 parts by weight to 20 parts by weight of a polyolefin, 15 parts by weight to 45 parts by weight of a first phosphorus-containing compound and 5 parts by weight to 15 parts by weight of a second phosphorus-containing compound, wherein the polyolefin includes a styrene-butadiene-maleic anhydride terpolymer or a butadiene-maleic anhydride copolymer, the first phosphorus-containing compound includes a compound of Formula (I), and the second phosphorus-containing compound includes a compound of Formula (II), a compound of Formula (III) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including difference rate of dissipation factor before and after 24 hours of water absorption, Z-axis coefficient of thermal expansion and dissipation factor after 24 hours of water absorption.

IPC Classes  ?

• C08L 71/02 - Polyalkylene oxides
• C08L 47/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bondsCompositions of derivatives of such polymers
• C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes

Goods & Services

copper clad laminates for use in the manufacture of printed circuit boards; metal clad substrates for use in the manufacture of printed circuit boards

Goods & Services

Resin coated copper foil, made from a semi-cured resin composition which is on a copper foil, for use in the manufacture of circuit boards Films and sheets made from polymers and plastics for use in the manufacture of circuit boards; Semi-cured resin sheets for use in the manufacture of circuit boards Prepregs which are glass fiber fabrics impregnated with a resin composition and semi-cured with the resin composition; Glass fiber fabrics impregnated and semi-cured with a resin composition

Goods & Services

copper clad laminates for use in the manufacture of printed circuit boards; metal clad substrates for use in the manufacture of printed circuit boards

Goods & Services

resin coated copper foil, made from a semi-cured resin composition which is on a copper foil, for use in the manufacture of circuit boards films and sheets made from polymers and plastics for use in the manufacture of circuit boards; semi-cured resin sheets for use in the manufacture of circuit boards prepregs which are glass fiber fabrics or non-woven mats impregnated with a resin composition and semi-cured with the resin composition; glass fiber fabrics impregnated and semi-cured with a resin composition

Goods & Services

copper clad laminates for use in the manufacture of printed circuit boards; metal clad substrates for use in the manufacture of printed circuit boards

Goods & Services

Resin coated copper foil, made from a semi-cured resin composition which is on a copper foil, for use in the manufacture of circuit boards Films and sheets made from polymers and plastics for use in the manufacture of circuit boards; Semi-cured resin sheets for use in the manufacture of circuit boards Prepregs which are glass fiber fabrics or non-woven mats impregnated with a resin composition and semi-cured with the resin composition; Glass fiber fabrics impregnated and semi-cured with a resin composition

Goods & Services

copper clad laminates for use in the manufacture of printed circuit boards; metal clad substrates for use in the manufacture of printed circuit boards. prepreg; films and sheets for use in the manufacture of circuit boards; glassfiber fabric impregnated and semi-cured with a resin composition; semi-cured resin sheets; resin coated copper foil.

Goods & Services

copper clad laminates for use in the manufacture of printed circuit boards; metal clad substrates for use in the manufacture of printed circuit boards. prepreg; films and sheets for use in the manufacture of circuit boards; glassfiber fabric impregnated and semi-cured with a resin composition; semi-cured resin sheets; resin coated copper foil.

Goods & Services

copper clad laminates for use in the manufacture of printed circuit boards; metal clad substrates for use in the manufacture of printed circuit boards. prepreg; films and sheets for use in the manufacture of circuit boards; glassfiber fabric impregnated and semi-cured with a resin composition; semi-cured resin sheets; resin coated copper foil.

Abstract

A resin composition includes 10 parts by weight of a first prepolymer and 5 parts by weight to 30 parts by weight of a vinyl group-containing polyphenylene ether resin, wherein the first prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction, and the reaction mixture including a polyphenylmethane maleimide, a compound of Formula (1) and a compound of Formula (2) at a weight ratio of 100:10-30:15-45, and the resin composition is absent of a second prepolymer which is prepared by subjecting a maleimide and bis(trifluoromethyl)benzidine to a prepolymerization reaction. An article made from the resin composition may achieve improvement in at least one of the properties including ratio of electroless copper plating, storage modulus and copper foil peeling strength.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal

Abstract

A resin composition includes 50 parts by weight of a vinyl-containing polyphenylene ether resin, 1 part by weight to 30 parts by weight of a styrene-butadiene-styrene block copolymer and 0.5 part by weight to 30 parts by weight of a zinc molybdate-covered silica, wherein the zinc molybdate-covered silica has a mass ratio of zinc molybdate to silica of between 1:9 and 2:8. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including gel time stability, copper foil peeling strength, difference rate of dissipation factor and conductive anodic filament test.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

Abstract

A resin composition includes 100 parts by weight of a fluorine-containing compound, which includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane polymer or a combination thereof; 2 parts by weight to 6 parts by weight of a butyral copolymer, which includes a unit of Formula (I), a unit of Formula (II) and a unit of Formula (III), wherein 1 is an integer of 40 to 250, m is an integer of 5 to 380, n is an integer of 55 to 2500, and wherein the butyral copolymer has a content of hydroxyl group of 21 mol % to 80 mol %; and 20 parts by weight to 150 parts by weight of an inorganic filler. The resin composition may achieve improvements in at least one of the following properties of the article made therefrom including dielectric constant, dissipation factor, X-axis coefficient of thermal expansion, weight loss percentage, tensile strength and comparative tracking index.

IPC Classes  ?

• C08L 27/18 - Homopolymers or copolymers of tetrafluoroethene
• C08K 3/36 - Silica
• C08L 29/14 - Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
• C09D 127/18 - Homopolymers or copolymers of tetrafluoroethene
• C08K 3/22 - OxidesHydroxides of metals
• C08K 3/38 - Boron-containing compounds

Abstract

The present invention provides a resin composition comprising maleimide-containing pre-polymerized resin and article made therefrom. The resin composition comprises: 100 weight parts of vinyl-containing polyphenylene ether resin; 35 to 45 weight parts of bis(vinylphenyl)ethane; and 30 to 60 weight parts of maleimide-containing pre-polymerized resin; wherein the maleimide-containing pre-polymerized resin is obtained by pre-polymerization of aromatic maleimide resin and long chain maleimide resin. The articles made from the resin composition improve at least one characteristic of glass transition temperature variation, copper foil peeling strength, percentage of thermal expansion, coefficient of thermal expansion and surface appearance.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
• B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
• B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
• C09J 171/12 - Polyphenylene oxides

Abstract

A resin composition includes: (A) 100 parts by weight of a thermosetting resin, which includes a vinyl-containing polyphenylene ether resin, a maleimide resin, or a combination thereof; (B) 15 parts by weight to 50 parts by weight of a sintered body formed by aluminum nitride and boron nitride; and (C) 180 parts by weight to 280 parts by weight of titanium dioxide. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

IPC Classes  ?

• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08L 71/00 - Compositions of polyethers obtained by reactions forming an ether link in the main chainCompositions of derivatives of such polymers
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
• H05K 1/03 - Use of materials for the substrate

Abstract

A resin composition includes 20 parts by weight to 45 parts by weight of a phosphorus-containing bismaleimide and 100 parts by weight of a thermosetting resin, wherein the phosphorus-containing bismaleimide has a structure of Formula (I); the thermosetting resin is selected from a vinyl-containing polyphenylene ether resin, a maleimide resin, a polyolefin resin, a prepolymer of maleimide resin, and a combination thereof. The resin composition may be used to make a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including flame retardancy, outgassing properties, arc resistance, copper foil peeling strength, X-axis coefficient of thermal expansion, glass transition temperature and water absorption rate.

IPC Classes  ?

• C08L 85/02 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbonCompositions of derivatives of such polymers containing phosphorus
• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08L 71/12 - Polyphenylene oxides
• C08L 25/10 - Copolymers of styrene with conjugated dienes
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
• B32B 5/08 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments the fibres or filaments of a layer being specially arranged or being of different substances
• C08L 71/00 - Compositions of polyethers obtained by reactions forming an ether link in the main chainCompositions of derivatives of such polymers
• C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
• C09J 171/00 - Adhesives based on polyethers obtained by reactions forming an ether link in the main chainAdhesives based on derivatives of such polymers
• B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
• B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
• B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper

Abstract

A resin composition includes 100 parts by weight of an unsaturated C═C double bond-containing polyphenylene ether resin; 15 parts by weight to 40 parts by weight of a hydrogenated styrene-butadiene-styrene triblock copolymer; 1 part by weight to 20 parts by weight of a compound of Formula (1); and 0.001 part by weight to 0.5 part by weight of a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

IPC Classes  ?

• C08L 65/02 - Polyphenylenes
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

Abstract

A resin composition includes a prepolymer and an additive, wherein: the prepolymer is prepared from a mixture subjected to a prepolymerization reaction, and the mixture includes 100 parts by weight of a maleimide resin, 15 to 30 parts by weight of a siloxane compound and 4 to 16 parts by weight of a diamine compound; the maleimide resin includes bisphenol A diphenyl ether bismaleimide, 3,3′-dimethyl-5,5′-diethyl-4,4′-diphenylmethane bismaleimide or a combination thereof; the siloxane compound includes a compound of Formula (I), wherein n is an integer of 5 to 40; and the diamine compound includes a compound of Formula (II) or Formula (III). The resin composition is made by using a preparation method. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board.

IPC Classes  ?

• C08G 73/12 - Unsaturated polyimide precursors
• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08K 5/00 - Use of organic ingredients
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors

Abstract

A resin composition includes 100 parts by weight of a vinyl-containing polyphenylene ether resin; 2 parts by weight to 50 parts by weight of any compound having a structure of Formula (1) or a combination thereof; and 20 parts by weight to 80 parts by weight of a polyolefin resin; the polyolefin resin includes styrene-butadiene-divinylbenzene terpolymer, styrene-butadiene-maleic anhydride terpolymer, styrene-butadiene copolymer, hydrogenated styrene-butadiene copolymer, polybutadiene, maleic anhydride-butadiene copolymer or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

IPC Classes  ?

• C08K 5/3492 - Triazines
• C08L 71/12 - Polyphenylene oxides

Abstract

A resin composition includes 100 parts by weight of a fluorine-containing compound and 1 part by weight to 15 parts by weight of a compound of Formula (1); in Formula (1), m and n are individually an integer of 10 to 100; and the fluorine-containing compound includes tetrafluoroethylene homopolymer, perfluoroalkoxy alkane or a combination thereof. Moreover, also provided is an article made from the resin composition, which comprises a prepreg, a resin film, a laminate or a printed circuit board, wherein the article achieves improvement in at least one of the following properties: dielectric constant, dissipation factor, Z-axis coefficient of thermal expansion, MIT bending resistance and tensile strength.

IPC Classes  ?

• C08L 27/18 - Homopolymers or copolymers of tetrafluoroethene

Abstract

A prepolymer is prepared by subjecting a compound of Formula (I) and a vinyl-containing compound to a prepolymerization reaction, and a resin composition includes the prepolymer. The vinyl-containing compound includes bis(vinylphenyl) ethane, divinylbenzene, modification of divinylbenzene or a combination thereof. A ratio in part by weight of the compound of Formula (I) to the vinyl-containing compound in the prepolymerization reaction is 8:2 to 6:4. The resin composition includes the prepolymer and an additive, and an article made from the resin composition may include a resin film, a prepreg, a laminate or a printed circuit board.

IPC Classes  ?

• C08F 283/00 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass
• C08F 4/80 - MetalsMetal hydridesMetallo-organic compoundsUse thereof as catalyst precursors selected from metals not provided for in group selected from iron group metals or platinum group metals
• C08G 61/06 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
• C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chainCompositions of derivatives of such polymers
• C08K 3/16 - Halogen-containing compounds
• C08G 61/02 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes

Abstract

A resin composition includes 80 parts by weight to 160 parts by weight of a vinyl-containing resin, 0.1 part by weight to 1.0 part by weight of a first compound and 0.1 part by weight to 2.0 parts by weight of a second compound; wherein the vinyl-containing resin includes a vinyl-containing polyphenylene ether resin, a maleimide resin, a bis(vinylphenyl)ethane, a triallyl isocyanurate, a vinyl-containing polyolefin resin or a combination thereof, the first compound includes a structure of Formula (1) to Formula (3) or a combination thereof, and the second compound includes a structure of Formula (4) to Formula (6) or a combination thereof. Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors

Abstract

A resin composition includes 60 parts by weight of a maleimide resin; 10 parts by weight to 30 parts by weight of an epoxy resin of Formula (I), wherein n represents an integer of 0 to 10: and 2 parts by weight to 40 parts by weight of a methylenebis (diethylaniline). Moreover, an article may be made from the resin composition, including a prepreg, a resin film, a laminate or a printed circuit board.

IPC Classes  ?

• B32B 27/26 - Layered products essentially comprising synthetic resin characterised by the use of special additives using curing agents
• B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
• B32B 27/38 - Layered products essentially comprising synthetic resin comprising epoxy resins
• C08G 59/24 - Di-epoxy compounds carbocyclic
• C08G 59/50 - Amines
• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

Abstract

A resin composition includes a first prepolymer and a second prepolymer, the first prepolymer being prepared from a first mixture subjected to a prepolymerization reaction, the second prepolymer being prepared from a second mixture subjected to a prepolymerization reaction, wherein the first mixture includes a maleimide resin and a benzoxazine resin, and the second mixture includes a maleimide resin and a bis(trifluoromethyl)benzidine. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including copper foil peeling strength, dissipation factor, ratio of thermal expansion, cure shrinkage and glass transition temperature.

IPC Classes  ?

• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08G 73/02 - Polyamines
• C08K 5/00 - Use of organic ingredients
• C08K 5/101 - EstersEther-esters of monocarboxylic acids
• C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08F 36/14 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds conjugated containing elements other than carbon and hydrogen
• C08G 73/06 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromoleculePolyhydrazidesPolyamide acids or similar polyimide precursors
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

Abstract

The present disclosure provides a resin composition which comprises: 90 parts by weight of vinyl-containing polyphenylene oxide resin; 35 to 70 parts by weight of chemically synthetic silica; and 10 to 30 parts by weight of spherical inorganic fillers, wherein the spherical inorganic fillers include spherical boron nitride, spherical hollow boron silicate or a combination thereof. The present disclosure also provides an article made from the resin composition, wherein the article includes a prepreg, a resin film, a laminate or a printed circuit board. The resin composition of the invention can make the article made therefrom achieve better peeling strength, dielectric constant, dissipation factor, no weave exposure produced and no stripes of branch-like pattern produced at the laminate edge.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08K 3/36 - Silica
• C08K 3/38 - Boron-containing compounds
• C08L 71/00 - Compositions of polyethers obtained by reactions forming an ether link in the main chainCompositions of derivatives of such polymers
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• H05K 1/03 - Use of materials for the substrate
• B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups

Abstract

A resin composition includes: a vinyl-containing polyphenylene ether resin; a compound of Formula (1); and a compound of Formula (2), a compound of Formula (3), a compound of Formula (4) or a combination thereof. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, prepreg stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength, dissipation factor and laminate appearance.

IPC Classes  ?

• C08L 53/00 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers
• C08F 293/00 - Macromolecular compounds obtained by polymerisation on to a macromolecule having groups capable of inducing the formation of new polymer chains bound exclusively at one or both ends of the starting macromolecule
• C08F 299/02 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
• C08K 5/3435 - Piperidines
• C08K 5/50 - Phosphorus bound to carbon only
• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
• B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
• B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
• C08K 5/3415 - Five-membered rings
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08L 71/12 - Polyphenylene oxides

Abstract

A resin composition includes a vinyl group-containing polyphenylene ether resin, a polyolefin and a magnesium and aluminum combination ionic compound, wherein the magnesium and aluminum combination ionic compound has a thermal resistance of greater than or equal to 600° C. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including glass transition temperature, copper foil peeling strength, thermal resistance and dissipation factor.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08L 25/10 - Copolymers of styrene with conjugated dienes
• C08L 33/06 - Homopolymers or copolymers of esters of esters containing only carbon, hydrogen, and oxygen, the oxygen atom being present only as part of the carboxyl radical
• C08L 47/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bondsCompositions of derivatives of such polymers
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08K 3/26 - CarbonatesBicarbonates

Abstract

A resin composition comprises: a vinyl-containing polyphenylene ether resin, a bis(vinylphenyl)ethane and a modification of divinylbenzene. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dielectric constant, dissipation factor, copper foil peeling strength, glass transition temperature, ratio of thermal expansion, thermal expansion coefficient, precipitation property of varnish, solder dipping thermal resistance, solder floating thermal resistance of multi-layer board, reflow thermal resistance of multi-layer board and T300 thermal resistance.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08F 212/36 - Divinylbenzene
• C08L 67/00 - Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chainCompositions of derivatives of such polymers
• C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chainCompositions of derivatives of such polymers
• C08L 33/08 - Homopolymers or copolymers of acrylic acid esters
• C08L 33/24 - Homopolymers or copolymers of amides or imides
• C08K 5/01 - Hydrocarbons
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins

Abstract

A prepolymerized resin prepared by subjecting a composition to a pre-reaction in the presence of a polymerization inhibitor. The composition at least includes bis(vinylphenyl)ethane and polybutadiene. The polybutadiene has a 1,2-vinyl content of 85% or above and a number average molecular weight of less than 3000, wherein the pre-reaction has a conversion rate of between 30% and 90%. During the pre-reaction, components in the composition are partially crosslinked to leave residual vinyl groups. The composition further includes vinyl-containing polyphenylene ether and has a number average molecular weight of between 4,000 and 12,000.

IPC Classes  ?

• C08F 12/34 - Monomers containing two or more unsaturated aliphatic radicals
• C08F 2/40 - Polymerisation using regulators, e.g. chain terminating agents using retarding agents
• C08F 236/06 - Butadiene
• C08G 81/02 - Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers at least one of the polymers being obtained by reactions involving only carbon-to-carbon unsaturated bonds
• C08K 5/00 - Use of organic ingredients

Abstract

A resin composition comprises: an unsaturated bond-containing polyphenylene ether resin; a maleimide resin of Formula (1); and a compound of Formula (2) or Formula (3). The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following improvements can be achieved, including prepreg viscosity variation ratio, stickiness resistance, amount of void after lamination, multi-layer board thermal resistance, glass transition temperature, ratio of thermal expansion, copper foil peeling strength and dissipation factor.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
• B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
• B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
• H05K 1/03 - Use of materials for the substrate

Abstract

A phosphorus-containing resin composition comprises a first phosphorus-containing compound, a second phosphorus-containing compound and a maleimide resin; wherein the first phosphorus-containing compound comprises a compound of Formula (I), a compound of Formula (II), or a combination thereof, and wherein the second phosphorus-containing compound is different from the first phosphorus-containing compound, and the second phosphorus-containing compound is absent of a group capable of reacting with the maleimide resin.

IPC Classes  ?

• C08K 5/51 - Phosphorus bound to oxygen
• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08K 5/00 - Use of organic ingredients
• C08K 3/013 - Fillers, pigments or reinforcing additives

Abstract

Provided is a resin composition, which comprises 1 to 10 parts by weight of a bifunctional aliphatic long-chain acrylate and 30 to 50 parts by weight of a thermosetting resin. Moreover, an article is also provided, which is made from the resin composition described above. The article may comprise a prepreg, a resin film, a laminate or a printed circuit board.

IPC Classes  ?

• C08L 33/10 - Homopolymers or copolymers of methacrylic acid esters
• C08L 33/08 - Homopolymers or copolymers of acrylic acid esters
• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08K 5/00 - Use of organic ingredients
• C08K 3/013 - Fillers, pigments or reinforcing additives

Abstract

Disclosed are an epoxy resin composition and an article made therefrom, the epoxy resin composition comprising an epoxy resin and a co-hardener, wherein: relative to the epoxy resin having a total equivalent of epoxy group of 1, the co-hardener comprises: (A) an acid anhydride having a total equivalent of acid anhydride group of 0.044-0.183; (B) a polyester having a total equivalent of ester group of 0.120-0.550; (C) a first phenolic resin having an equivalent of hydroxyl group of 0.092-0.550; and (D) a second phenolic resin having an equivalent of hydroxyl group of 0.143-0.592; and a sum of equivalent of functional groups of the co-hardener is 0.84-1.11.

IPC Classes  ?

• C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
• C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

Abstract

A resin composition and an article made from the resin composition are provided. The resin composition comprises: 30 parts by weight of thermosetting resin; 50 to 125 parts by weight of maleimide resin; and 5 to 35 parts by weight of monofunctional long-chain alkyl acrylate monomer. The resin composition is capable of achieving a proper viscosity and a good filling property whiling maintaining a high glass transition temperature.

IPC Classes  ?

• C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
• C08L 33/08 - Homopolymers or copolymers of acrylic acid esters
• C08L 67/00 - Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chainCompositions of derivatives of such polymers
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08L 33/14 - Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08J 5/18 - Manufacture of films or sheets
• C08G 73/06 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromoleculePolyhydrazidesPolyamide acids or similar polyimide precursors

Abstract

A resin composition and an article made from the resin composition are disclosed. The resin composition comprises: a first vinyl-containing polyphenylene oxide resin, a prepolymer thereof or both; and a second vinyl-containing polyphenylene oxide resin or a prepolymer thereof; wherein the first vinyl-containing polyphenylene oxide resin has a number average molecular weight of between 500 and 1500, and the second vinyl-containing polyphenylene oxide resin has a number average molecular weight of between 1600 and 3500.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• H05K 1/03 - Use of materials for the substrate
• C08G 65/48 - Polymers modified by chemical after-treatment
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08K 5/00 - Use of organic ingredients
• H01B 3/42 - Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes polyesters, polyethers, polyacetal

Abstract

Disclosed is an assembly manufacturing method comprising: cutting a prepreg into a prepreg sheet according to a first parameter; moving the prepreg sheet to an assembly arrangement area according to a second parameter; superimposing a metal foil and a plate according to a fourth parameter to form a copper foil set; and assembling the copper foil set and the prepreg sheet according to a third parameter to form an assembly.

IPC Classes  ?

• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
• B32B 27/00 - Layered products essentially comprising synthetic resin
• B32B 38/00 - Ancillary operations in connection with laminating processes
• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• B32B 15/18 - Layered products essentially comprising metal comprising iron or steel
• B32B 27/04 - Layered products essentially comprising synthetic resin as impregnant, bonding, or embedding substance
• B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer

Abstract

A phosphorus-containing flame retardant, a preparation method thereof, a resin composition comprising the phosphorus-containing flame retardant and an article made therefrom are disclosed. The phosphorus-containing flame retardant is characterized by having the advantages of high phosphorus content, high resin compatibility, not increasing gel time of varnish and low water absorption rate, and is therefore suitable for use as a flame retardant of various resin materials.

IPC Classes  ?

• C09K 21/12 - Organic materials containing phosphorus
• C07F 9/6571 - Heterocyclic compounds, e.g. containing phosphorus as a ring hetero atom having phosphorus atoms, with or without nitrogen, oxygen, sulfur, selenium or tellurium atoms, as ring hetero atoms having phosphorus and oxygen atoms as the only ring hetero atoms
• C09D 5/18 - Fireproof paints
• C09D 123/02 - Coating compositions based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCoating compositions based on derivatives of such polymers not modified by chemical after-treatment
• C09D 171/12 - Polyphenylene oxides
• C09D 123/08 - Copolymers of ethene
• C08K 5/5313 - Phosphinic compounds, e.g. R2=P(:O)OR'

Abstract

A prepolymerized resin and a preparation method thereof are provided, the method comprising a step of pre-reacting bis(vinylphenyl)ethane and polybutadiene. Bis(vinylphenyl)ethane may include 1,2-bis(4-vinylphenyl)ethane, 1,2-(3-vinylphenyl-4-vinylphenyl)ethane, 1,2-bis(3-vinylphenyl) ethane or a combination thereof. Polybutadiene has a 1,2-vinyl content of 85% or above and a number average molecular weight of less than 3000. A resin composition comprising the prepolymerized resin and an article made from the resin composition are also provided.

IPC Classes  ?

• C08F 12/34 - Monomers containing two or more unsaturated aliphatic radicals
• C08F 2/40 - Polymerisation using regulators, e.g. chain terminating agents using retarding agents
• C08F 236/06 - Butadiene
• C08G 81/02 - Macromolecular compounds obtained by interreacting polymers in the absence of monomers, e.g. block polymers at least one of the polymers being obtained by reactions involving only carbon-to-carbon unsaturated bonds
• C08K 5/00 - Use of organic ingredients

Abstract

A powder gathering apparatus includes at least two rotating plates and a driving mechanism. The at least two rotating plates are disposed with respect to each other. Each of the rotating plates includes at least one spherical member. The at least one spherical member protrudes from the rotating plate. The driving mechanism drives at least one of the at least two rotating plates to move, such that the at least two rotating plates get close to or away from each other. The driving mechanism drives the at least two rotating plates to rotate.

IPC Classes  ?

• B02C 7/02 - Crushing or disintegrating by disc mills with coaxial discs
• B02C 7/12 - Shape or construction of discs
• B02C 7/14 - Adjusting, applying pressure to, or controlling distance between, discs
• B02C 23/20 - Adding fluid, other than for crushing or disintegrating by fluid energy after crushing or disintegrating
• B02C 23/10 - Separating or sorting of material, associated with crushing or disintegrating with separator arranged in discharge path of crushing or disintegrating zone
• H05K 3/22 - Secondary treatment of printed circuits

Abstract

Disclosed is a vinylbenzyl imide resin useful in conjunction with other components to prepare a resin composition for making such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, having improved one or more properties including resin flow, resin filling property, flame retardancy, glass transition temperature, thermal resistance, dielectric constant, dissipation factor and interlayer bonding strength. Also disclosed is a method of preparing the vinylbenzyl imide resin, its prepolymer, a resin composition comprising the vinylbenzyl imide resin and/or its polymer and an article made therefrom.

IPC Classes  ?

• C08G 73/12 - Unsaturated polyimide precursors
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08G 85/00 - General processes for preparing compounds provided for in this subclass
• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08J 5/18 - Manufacture of films or sheets
• C08K 5/00 - Use of organic ingredients
• C08F 222/40 - Imides, e.g. cyclic imides
• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs

Abstract

Disclosed is a resin composition which comprises a compound with at least two DOPO groups or a combination thereof as the flame retardant and an aliphatic long-chain maleimide compound. The resin composition is useful for the preparation of various articles, such as a prepreg, a resin film, a resin film with copper foil, a laminate or a printed circuit board, achieving at least one, more or all properties improved of laminate formability, reliability of multiple laminations, chemical resistance, thermal resistance, dielectric constant, dissipation factor, interlayer bonding strength, storage modulus and so on.

IPC Classes  ?

• C08K 5/529 - Esters containing heterocyclic rings not representing cyclic esters of phosphoric or phosphorous acids
• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08L 75/14 - Polyurethanes having carbon-to-carbon unsaturated bonds
• C08K 5/00 - Use of organic ingredients
• C08K 5/5313 - Phosphinic compounds, e.g. R2=P(:O)OR'
• C08K 5/3415 - Five-membered rings

Abstract

The present invention discloses vinyl-modified maleimide, a resin composition using the same and a preparation thereof. The vinyl-modified maleimide has better solvent selectivity and solvent compatibility. The obtained preparation can satisfy the properties of no crack between multilayer boards and high frequency and low dielectric properties maintained after moisture absorption.

IPC Classes  ?

• C08G 73/12 - Unsaturated polyimide precursors
• C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C09D 179/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08K 3/36 - Silica
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• H05K 1/03 - Use of materials for the substrate
• C08K 7/18 - Solid spheres inorganic
• C09J 179/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08K 5/00 - Use of organic ingredients

Abstract

Disclosed is an assembly arrangement system, comprising a feeding unit, a conveyor unit and an assembling unit. The feeding unit comprises a supplying part and a cutting part. The supplying part is provided with a prepreg and configured to supply the prepreg to the cutting part. The cutting part cuts the prepreg to continuously form one or more prepreg sheets. The conveyor unit receives and conveys the prepreg sheet. The assembling unit comprises a metal foil supplying part, a first assembling part and a second assembling part. The second assembling part assembles a plate and a metal foil from the metal foil supplying part with the prepreg sheet from the conveyor unit into an assembly, and the first assembling part bears the assembly. Also provided is an assembly manufacturing method.

IPC Classes  ?

• B32B 15/00 - Layered products essentially comprising metal
• B32B 27/00 - Layered products essentially comprising synthetic resin
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• B32B 39/00 - Layout of apparatus or plants, e.g. modular laminating systems
• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• B32B 15/18 - Layered products essentially comprising metal comprising iron or steel
• B32B 27/04 - Layered products essentially comprising synthetic resin as impregnant, bonding, or embedding substance
• B32B 38/00 - Ancillary operations in connection with laminating processes
• B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer

Abstract

The disclosure relates to a phosphorus-containing vinyl polyphenylene ether obtained by reacting a phosphorus-containing vinyl compound with a vinyl polyphenylene ether, a resin composition including the phosphorus-containing vinyl polyphenylene ether and a product thereof. Various products can be made from the resin composition, such as resin films, prepregs, resin-coated coppers, laminates or printed circuit boards, and they have one, multiple or all of the following properties: lower coefficient of thermal expansion, lower thermal expansion, higher thermal resistance, better flame retardancy, lower dielectric constant, lower dielectric loss and so forth.

IPC Classes  ?

• C08K 7/18 - Solid spheres inorganic
• C08F 230/02 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing phosphorus

Abstract

The disclosure relates to a resin composition, comprising an epoxy resin, a high molecular weight polyetheramine and an amine-terminated acrylonitrile rubber. Various products can be made from the resin composition, such as prepregs, laminates, printed circuit boards or rigid-flex boards, in which one, multiple or all of the following properties can be met: low resin flow, low dust weight loss, high peel strength at room temperature and at high temperature, low moisture absorption rate, and better varnish stability.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08G 59/50 - Amines
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• D06M 15/53 - Polyethers
• D06M 15/55 - Epoxy resins
• D06M 15/61 - Polyamines
• D06M 15/693 - Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials with macromolecular compoundsSuch treatment combined with mechanical treatment with natural or synthetic rubber, or derivatives thereof

Abstract

The present invention provides a novel phosphorus-containing olefin polymer that comprises cycloolefin as a first component and a vinyl phosphorus-containing compound as a second component. The present invention further provides a method for producing such phosphorus-containing olefin polymer and a composition and an article comprising the same.

IPC Classes  ?

• C08F 230/02 - Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing phosphorus, selenium, tellurium or a metal containing phosphorus
• C08F 232/08 - Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
• H05K 1/03 - Use of materials for the substrate
• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Abstract

Provided is a process of making a polyphenylene oxide prepolymer, comprising a step of reacting a reactive cycloolefin and a vinyl-containing polyphenylene oxide in the presence of a ruthenium catalyst. The reactive cycloolefin may be selected from dicyclopentadiene monomer, dicyclopentadiene oligomer, dicyclopentadiene polymer, norbornene monomer, norbornene oligomer, norbornene polymer, and a combination thereof; the vinyl-containing polyphenylene oxide may be selected from divinylbenzyl polyphenylene oxide resin, vinylbenzyl-modified polyphenylene oxide resin, methacrylic polyphenylene oxide resin, and a combination thereof; the ruthenium catalyst may be a Grubbs catalyst. Also provided are a polyphenylene oxide prepolymer made by the process, a resin composition containing the polyphenylene oxide prepolymer, and a product made from the resin composition.

IPC Classes  ?

• C08F 216/16 - Monomers containing no hetero atoms other than the ether oxygen
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08K 3/36 - Silica
• C08L 29/10 - Homopolymers or copolymers of unsaturated ethers

Abstract

A resin composition, a copper-clad laminate using the same, and a printed circuit board using the same are introduced. The resin composition comprises a specific phosphorus-containing salt and a prepolymer of vinyl-containing polyphenylene ether. The resin composition features specific ingredients and proportion to thereby achieve satisfactory properties of prepreg made from the resin composition, and attain satisfactory laminate properties, such as high degree of heat resistance and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper-clad laminates and printed circuit boards.

IPC Classes  ?

• C08K 5/53 - Phosphorus bound to oxygen bound to oxygen and to carbon only
• C08J 5/18 - Manufacture of films or sheets
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/03 - Use of materials for the substrate

Abstract

The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): wherein R′ is R″ is R′″ is hydrogen, Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.

IPC Classes  ?

• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08K 3/36 - Silica
• C08K 5/14 - Peroxides
• C08L 73/00 - Compositions of macromolecular compounds obtained by reactions forming a linkage containing oxygen or oxygen and carbon in the main chain, not provided for in groups Compositions of derivatives of such polymers
• C09D 179/00 - Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups
• C08G 65/48 - Polymers modified by chemical after-treatment
• C08K 5/3415 - Five-membered rings
• C08K 5/5399 - Phosphorus bound to nitrogen
• H05K 1/03 - Use of materials for the substrate

Abstract

A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.

IPC Classes  ?

• H05K 1/18 - Printed circuits structurally associated with non-printed electric components
• H05K 1/02 - Printed circuits Details
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/03 - Use of materials for the substrate

Abstract

A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

A multi-layer printed circuit board comprises: at least two insulation layers, respectively having glass fiber cloth and cured resin covering thereon, the insulation layers being stacked on each other; an internal trace layer formed between two neighboring insulation layers; and an external trace layer formed on an outer surface of the outermost insulation layer; wherein the insulation layers have a dielectric constant of 3.4 or less, and the internal and external trace layers have a trace width between 40 and 75 micrometers, such that the multi-layer printed circuit board has a characteristic impedance between 45 and 55Ω in single-ended signaling and between 90 and 110Ω in differential signaling.

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H01P 3/08 - MicrostripsStrip lines
• H05K 1/03 - Use of materials for the substrate

Abstract

A resin composition, including (A) a polyimide resin; (B) a pre-polymerized maleimide resin; (C) a thermosetting resin; and (D) a flame retardant. The reactants for use in synthesizing the polyimide resin include an acid anhydride and a diamine, with the diamine including 4,4′-diaminodiphenylmethane and its analogous compounds and polyetherdiamines. The resin composition has the following advantages, a resin film or a prepreg is manufactured from the resin composition comprises a polyimide resin synthesized from a diamine of a specific structure and a pre-polymerized maleimide resin, so as to achieve satisfactory characteristics of circuit laminates, such as a low dielectric constant, a low dissipation factor, high heat resistance, and high adhesiveness, so as to be for use in the manufacturing of metal clad laminates and printed circuit boards.

IPC Classes  ?

• C08L 7/02 - Latex
• C08L 77/06 - Polyamides derived from polyamines and polycarboxylic acids
• H05K 1/03 - Use of materials for the substrate
• C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors

Abstract

A halogen-free resin composition includes (A) 100 parts by weight of polyphenylene oxide resin; (B) 10 to 50 parts by weight of maleimide resin; (C) 5 to 100 parts by weight of polybutadiene copolymer; (D) 5 to 30 parts by weight of cyanate ester resin; and (E) 15 to 150 parts by weight of phosphazene. The halogen-free resin composition is characterized by specific ingredients and proportions thereof to achieve circuit board laminate properties, such as a high glass transition temperature, low coefficient of thermal expansion, low dielectric properties, heat resistance, flame retardation, and being halogen-free, and thus is applicable to the manufacturing of a prepreg or resin film, thereby being applicable to the manufacturing of metal laminates and printed circuit boards.

IPC Classes  ?

• C08G 79/02 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon a linkage containing phosphorus
• B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08L 71/02 - Polyalkylene oxides
• H05K 1/03 - Use of materials for the substrate

Abstract

A phosphazene compound having a vinyl group is manufactured by a reaction between a vinyl compound and a phosphazene compound having a hydroxyl group and added to a resin composition for manufacturing a prepreg or a resin film so as to be applicable to copper-clad laminates and printed circuit boards to thereby achieve satisfactory circuit laminate properties, namely low coefficient of thermal expansion, low dielectric properties, heat resistant, fire resistant, and halogen-free.

IPC Classes  ?

• C08L 71/12 - Polyphenylene oxides
• C08L 79/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups
• C08G 79/02 - Macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon a linkage containing phosphorus
• C08L 85/02 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbonCompositions of derivatives of such polymers containing phosphorus
• B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
• B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
• C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors

Abstract

A resin composition includes (A) an epoxy resin; (B) a benzoxazine (BZ) resin; (C) a styrene maleic anhydride (SMA) copolymer; and (D) a polyester. The resin composition includes specific ingredients of a polyester and is characterized by specific proportions thereof so as to achieve a low delta Tg value of copper clad laminates manufactured in accordance with the resin composition and attain a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high fire retardation of the copper clad laminates and printed circuit boards manufactured in accordance with the resin composition.

IPC Classes  ?

• B32B 27/38 - Layered products essentially comprising synthetic resin comprising epoxy resins
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins

Abstract

A resin composition includes (A) 100 parts by weight of epoxy resin; (B) 20 to 100 parts by weight of polybutadiene styrene divinylbenzene graft terpolymer resin; (C) 2 to 20 parts by weight of di-tert-butylhydroquinone (DTBHQ); (D) 5 to 50 parts by weight of polyphenyl ether modified cyanate ester resin; and at least one of (E) inorganic filler, (F) chain extending sealing agent, and (G) catalyst. The resin composition is characterized by specific ingredients and proportions thereof to attain high heat resistance, low dielectric constant Dk, and low dielectric dissipation factor Df, and being halogen-free, and therefore is applicable to protective film of printed circuit boards, insulating protective film of electronic components, and resin insulation film of leadframes.

IPC Classes  ?

• B32B 27/38 - Layered products essentially comprising synthetic resin comprising epoxy resins
• C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
• C09D 151/00 - Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCoating compositions based on derivatives of such polymers
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08L 51/00 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers
• C08K 5/08 - Quinones
• C08K 5/315 - Compounds containing carbon-to-nitrogen triple bonds
• B32B 15/092 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising epoxy resins

Abstract

A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 1 to 100 parts by weight of benzoxazine resin per 100 parts by weight of (A); (C) 1 to 100 parts by weight of styrene-maleic anhydride per 100 parts by weight of (A); (D) 0.5 to 30 parts by weight of amine curing agent per 100 parts by weight of (A); and (E) 5 to 150 parts by weight of halogen-free flame retardant per 100 parts by weight of (A). The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• B32B 15/092 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising epoxy resins
• B32B 27/04 - Layered products essentially comprising synthetic resin as impregnant, bonding, or embedding substance
• B32B 27/18 - Layered products essentially comprising synthetic resin characterised by the use of special additives
• B32B 27/38 - Layered products essentially comprising synthetic resin comprising epoxy resins
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08G 59/20 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the epoxy compounds used
• C08G 59/50 - Amines
• C08G 59/56 - Amines together with other curing agents
• B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
• C08G 59/42 - Polycarboxylic acidsAnhydrides, halides, or low-molecular-weight esters thereof
• C08L 35/06 - Copolymers with vinyl aromatic monomers
• C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
• C08G 73/02 - Polyamines
• C08L 79/02 - Polyamines
• C08K 5/00 - Use of organic ingredients
• C08K 5/49 - Phosphorus-containing compounds

Abstract

The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 10 to 150 parts by weight of phosphazene; and (E) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

IPC Classes  ?

• C08G 73/06 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromoleculePolyhydrazidesPolyamide acids or similar polyimide precursors
• C08K 3/00 - Use of inorganic substances as compounding ingredients
• C08K 3/26 - CarbonatesBicarbonates
• C08K 3/36 - Silica
• C08K 5/09 - Carboxylic acidsMetal salts thereofAnhydrides thereof
• C08K 5/5399 - Phosphorus bound to nitrogen
• H05K 1/03 - Use of materials for the substrate
• H05K 3/22 - Secondary treatment of printed circuits
• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chainCompositions of derivatives of such polymers
• C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
• C08L 35/06 - Copolymers with vinyl aromatic monomers
• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Abstract

The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 5 to 100 parts by weight of maleimide; (E) 10 to 150 parts by weight of phosphazene; and (F) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition of the invention offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

IPC Classes  ?

• C08K 3/00 - Use of inorganic substances as compounding ingredients
• C08K 5/5399 - Phosphorus bound to nitrogen
• C08K 3/36 - Silica
• C08K 5/09 - Carboxylic acidsMetal salts thereofAnhydrides thereof
• C08L 79/04 - Polycondensates having nitrogen-containing heterocyclic rings in the main chainPolyhydrazidesPolyamide acids or similar polyimide precursors
• H05K 1/03 - Use of materials for the substrate
• H05K 3/22 - Secondary treatment of printed circuits
• C08L 35/06 - Copolymers with vinyl aromatic monomers
• C08K 3/26 - CarbonatesBicarbonates
• C08G 73/06 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromoleculePolyhydrazidesPolyamide acids or similar polyimide precursors
• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Abstract

A resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 25 parts by weight of nitrogen and oxygen containing heterocyclic compound; (C) 5 to 75 parts by weight of polyphenylene oxide resin; and (D) 5 to 100 parts by weight of oligomer of phenylmethane maleimide. By using specific components at specific proportions, the resin composition of the invention offers the features of low dielectric constant and low dissipation factor and can be made into prepreg that may be used in printed circuit board.

IPC Classes  ?

• C08K 5/357 - Six-membered rings