Devices and methods for a microLED array and a bonded CMOS driver chip. An example array includes a plurality of microLEDs having backside contacts, a plurality of through-substrate vias, a CMOS driver chip bonded to the backside contacts of the microLEDs, and an encapsulating layer forming an integrated surface of the array. At least one through-substrate via is paired with each microLED. Each through-substrate via electrically connects the paired microLED to the CMOS driver chip.
H10H 20/812 - Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
H10H 20/832 - Electrodes characterised by their material
H10H 29/14 - Integrated devices comprising at least one light-emitting semiconductor component covered by group comprising multiple light-emitting semiconductor components
H10H 29/854 - Encapsulations characterised by their material, e.g. epoxy or silicone resins
Devices and methods for analyzing polymer arrays formed on integrated surfaces of microLEDs. One microarray includes a plurality of individually controllable microLED elements, a plurality of photodetector elements, an integrated surface, and a CMOS driver chip. Each microLED element is paired with a photodetector element. The CMOS driver chip controls activation of the microLED elements and the photodetector elements.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
H10F 30/223 - Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PIN barrier
H10F 55/00 - Radiation-sensitive semiconductor devices covered by groups , or being structurally associated with electric light sources and electrically or optically coupled thereto
H10F 77/00 - Constructional details of devices covered by this subclass
H10H 29/24 - Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group comprising multiple light-emitting semiconductor devices
A microarray includes: a) a plurality of individually controllable microLED elements; b) an integrated surface, and c) a CMOS driver chip. Each microLED element is paired with a corresponding activation circuit on the CMOS driver chip. The activation circuit is configured to control activation of the microLED elements. The microarray may also include a plurality of photodetector elements, where each photodetector element is paired with a corresponding microLED and its corresponding activation circuit.
B01J 19/12 - Processes employing the direct application of electric or wave energy, or particle radiationApparatus therefor employing electromagnetic waves
C40B 50/14 - Solid phase synthesis, i.e. wherein one or more library building blocks are bound to a solid support during library creationParticular methods of cleavage from the solid support
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
B01J 19/00 - Chemical, physical or physico-chemical processes in generalTheir relevant apparatus
4.
MICROLED ARRAY WITH PAIRED THROUGH-SUBSTRATE VIAS FOR IN-SITU POLYMER SYNTHESIS
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H05B 45/00 - Circuit arrangements for operating light-emitting diodes [LED]
5.
MICROLED ARRAY WITH PAIRED THROUGH-SUBSTRATE VIAS FOR IN-SITU POLYMER SYNTHESIS
Devices and methods for a microLED array and a bonded CMOS driver chip. An example array includes a plurality of microLEDs having backside contacts, a plurality of through-substrate vias, a CMOS driver chip bonded to the backside contacts of the microLEDs, and an encapsulating layer forming an integrated surface of the array. At least one through-substrate via is paired with each microLED. Each through-substrate via electrically connects the paired microLED to the CMOS driver chip.
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
H05B 45/00 - Circuit arrangements for operating light-emitting diodes [LED]
G02B 6/43 - Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
Devices and methods for analyzing polymer arrays formed on integrated surfaces of microLEDs. One microarray includes a plurality of individually controllable microLED elements, a plurality of photodetector elements, an integrated surface, and a CMOS driver chip. Each microLED element is paired with a photodetector element. The CMOS driver chip controls activation of the microLED elements and the photodetector elements.
Provided herein is technology relating to microarrays and particularly, but not exclusively, to microarray devices and systems, methods for producing microarrays, and methods of using microarrays.
Provided herein is technology relating to microarrays and particularly, but not exclusively, to microarray devices and systems, methods for producing microarrays, and methods of using microarrays.
C12P 19/34 - Polynucleotides, e.g. nucleic acids, oligoribonucleotides
C40B 40/06 - Libraries containing nucleotides or polynucleotides, or derivatives thereof
C40B 40/10 - Libraries containing peptides or polypeptides, or derivatives thereof
H10H 29/14 - Integrated devices comprising at least one light-emitting semiconductor component covered by group comprising multiple light-emitting semiconductor components
Provided herein is technology relating to microarrays and particularly, but not exclusively, to microarray devices and systems, methods for producing microarrays, and methods of using microarrays.
H01L 27/15 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier, specially adapted for light emission
C12P 19/34 - Polynucleotides, e.g. nucleic acids, oligoribonucleotides
C40B 40/06 - Libraries containing nucleotides or polynucleotides, or derivatives thereof
C40B 40/10 - Libraries containing peptides or polypeptides, or derivatives thereof
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