A method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method.
This invention relates to a die tool, a device and a method for producing, in particular embossing, a monolithic lens wafer that has a large number of microlenses.
A chuck for clamping workpieces or tools in a clamping space with a clamping force (F). The chuck includes at least two chuck jaws movable in translation along one clamping plane (E) in the direction of one center Z of the clamping space and a gear train located at least largely within the chuck for transfer of a driving torque of a drive motor, which can be coupled to the gear train by coupling means of the gear train, to the chuck jaws for movement of the chuck jaws. The coupling means able to be coupled to a corresponding coupling connection of the drive motor. The movement from the maximum size of the clamping space to the minimum size of the clamping space is executed via the gear train from the drive motor.
B23B 31/26 - Chucks characterised by features relating primarily to remote control of the gripping means using mechanical transmission through the working-spindle
B23B 31/16 - Chucks with simultaneously-acting jaws, whether or not also individually adjustable moving radially
B23B 31/24 - Chucks characterised by features relating primarily to remote control of the gripping means
B23B 31/163 - Chucks with simultaneously-acting jaws, whether or not also individually adjustable moving radially actuated by one or more spiral grooves
B29D 11/00 - Producing optical elements, e.g. lenses or prisms
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.
B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B32B 37/00 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
B32B 38/00 - Ancillary operations in connection with laminating processes
6.
Method for stripping a product substrate from a carrier substrate
Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.
B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
8.
Device for stripping a product substrate from a carrier substrate
Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.
B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
9.
Device and method for stripping a product substrate from a carrier substrate
Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.
B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
10.
Device for releasing an interconnect layer that provides connection between a carrier and a wafer
A device for releasing an interconnect layer that provides a connection between a carrier and a wafer which forms a carrier-wafer combination. The device includes rotation means for rotation of the carrier-wafer combination in a release position, and a connection release means for providing an immersion bath that receives the carrier-wafer combination.
B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
B65G 47/00 - Article or material-handling devices associated with conveyors; Methods employing such devices
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
12.
Device for detaching a product substrate off a carrier substrate
Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.
B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B32B 37/00 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
B32B 38/00 - Ancillary operations in connection with laminating processes
13.
System having two oscillation components for machining a workpiece
A workpiece holding fixture for receiving a workpiece and for use in a device for the machining of a workpiece with: a tool holding fixture for receiving the tool, a workpiece holding fixture for receiving the workpiece, characterized in that, during the machining, at least one first oscillation component in a Z-direction and a second, in particular simultaneous, oscillation component in the X- and/or Y-direction can be introduced by means of oscillation components.
B23Q 1/34 - Relative movement obtained by use of deformable elements, e.g. piezoelectric, magnetostrictive, elastic or thermally-dilatable elements
B23P 25/00 - Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress
B24B 1/04 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
B65G 47/00 - Article or material-handling devices associated with conveyors; Methods employing such devices
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B29D 11/00 - Producing optical elements, e.g. lenses or prisms
B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate. A substrate holder is located opposite the carrier substrate holder. The substrate holder has a substrate holding surface which can be located parallel to the holding surface of the carrier substrate holder. A separating means is provided for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.
B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
A chuck for clamping workpieces or tools in a clamping space with a clamping force (F). The chuck includes at least two chuck jaws movable in translation along one clamping plane (E) in the direction of one center Z of the clamping space and a gear train located at least largely within the chuck for transfer of a driving torque of a drive motor, which can be coupled to the gear train by coupling means of the gear train, to the chuck jaws for movement of the chuck jaws. The coupling means able to be coupled to a corresponding coupling connection of the drive motor. The movement from the maximum size of the clamping space to the minimum size of the clamping space is executed via the gear train from the drive motor.
B23B 31/24 - Chucks characterised by features relating primarily to remote control of the gripping means
B23B 31/163 - Chucks with simultaneously-acting jaws, whether or not also individually adjustable moving radially actuated by one or more spiral grooves
B25B 1/10 - Arrangements for positively actuating jaws using screws
B25B 1/18 - Arrangements for positively actuating jaws motor driven, e.g. with fluid drive, with or without provision for manual actuation
B25B 1/24 - Vices - Details, e.g. jaws of special shape, slideways
B23B 31/10 - Chucks characterised by the retaining or gripping devices or their immediate operating means
B23B 31/26 - Chucks characterised by features relating primarily to remote control of the gripping means using mechanical transmission through the working-spindle
B23Q 3/12 - Devices holding, supporting, or positioning, work or tools, of a kind normally removable from the machine for securing to a spindle in general
18.
Die tool, device and method for producing a lens wafer
This invention relates to a die tool, a device and a method for producing, in particular embossing, a monolithic lens wafer that has a large number of microlenses.
Method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means.
Handling device for handling of a wafer in the processing of the wafer with the following features: a carrier with a flat receiving side for holding the wafer, an especially lattice-like grid structure which is raised on the receiving side relative to the receiving side, a flexible cover which covers the grid structure relative to the carrier, sealing it, for fixing of the wafer on the carrier, and a grid space which is bordered by the cover and the carrier can be exposed to negative pressure, characterized in that the grid structure and the cover with the receiving side form an especially trough-shaped receiving space for holding of receiving structures which are provided on the wafer and which are raised relative to the wafer receiving side.
B65G 49/07 - Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers
This invention relates to a method for producing a microlens with a carrier wafer, in which a lens in one opening of the carrier wafer is molded into the carrier wafer by stamping of the lens and to a corresponding device for executing the method and to a microlens which has been produced using the method. Furthermore the invention relates to a device for producing a microlens as well as a microlens.
Device for stripping a product substrate off a carrier substrate connected to the product substrate by an bonding layer by means of a film frame, a flexible film which is connected to the film frame and which has an adhesive layer for holding the product substrate in a contacting surface section of the film, the film being connected to the film frame in an attachment section of the film which surrounds the contacting surface section, as well as a solvent reservoir formed by the film frame and the film, especially of variable volume, for holding the solvent for detaching the bonding layer, and the product substrate and the bonding layer can be accommodated in the solvent reservoir, and by delivery means for delivering the solvent into the solvent reservoir and by stripping means for stripping the product substrate off the carrier substrate.
B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B32B 37/00 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
B32B 38/00 - Ancillary operations in connection with laminating processes
23.
Device and method for separating a substrate from a carrier substrate
Device for separating a substrate from a carrier substrate which is connected to the substrate by an interconnect layer. The device includes a carrier substrate holder with a holding surface for holding the carrier substrate, and a substrate holder which is located opposite the carrier substrate holder with a substrate holding surface which can be located parallel to the holding surface for accommodating the substrate. There are separating means for parallel displacement of the substrate relative to the carrier substrate in the interconnected state of the substrate and carrier substrate.
The invention relates to a workpiece receiving device for receiving a workpiece and for use in a system for machining a workpiece (5), comprising: a tool holder for receiving the tool (6), a workpiece receiving device for receiving the workpiece (5), characterized in that during the machining operation at least one first oscillation component can be introduced in a Z direction, and a second, in particular simultaneous, oscillation component can be introduced in the X and/or Y directions by oscillation components (2, 2', 3, 3', 4, 7).
B23Q 1/34 - Relative movement obtained by use of deformable elements, e.g. piezoelectric, magnetostrictive, elastic or thermally-dilatable elements
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
B23P 25/00 - Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress
B24B 1/04 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
25.
SYSTEM HAVING TWO OSCILLATION COMPONENTS FOR MACHINING A WORKPIECE
The invention relates to a workpiece receiving device for receiving a workpiece and for use in a system for machining a workpiece (5), comprising: a tool holder for receiving the tool (6), a workpiece receiving device for receiving the workpiece (5), characterized in that during the machining operation at least one first oscillation component can be introduced in a Z direction, and a second, in particular simultaneous, oscillation component can be introduced in the X and/or Y directions by oscillation components (2, 2', 3, 3', 4, 7).
B23Q 1/34 - Relative movement obtained by use of deformable elements, e.g. piezoelectric, magnetostrictive, elastic or thermally-dilatable elements
B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
B24B 1/04 - Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
B23P 25/00 - Auxiliary treatment of workpieces, before or during machining operations, to facilitate the action of the tool or the attainment of a desired final condition of the work, e.g. relief of internal stress
26.
Device and method for detaching a semiconductor wafer from a substrate
Device for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, the device having stripping means for effecting a stripping of the product substrate from the carrier substrate from a periphery of the product substrate.
Furthermore, the invention relates to a method for stripping a product substrate from a carrier substrate connected to the product substrate by an interconnect layer by means of a flexible film that is mounted on a film frame and that comprises an adhesive layer for holding the product substrate in a bonding surface section of the film, the film being mounted on the film frame in an attachment section of the film that surrounds the bonding surface section, and the film comprising a stripping section that is located between the bonding surface section and the attachment section, and a stripping of the product substrate from the carrier substrate from the periphery of the product substrate being caused by the stripping means.
B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
B32B 43/00 - Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
27.
Receiving device for receiving semiconductor substrates
at least one negative pressure channel which penetrates the holding body with one suction end on the holding side, the holding side having a defined suction structure of soft material.
B25B 11/00 - Work holders or positioners not covered by groups , e.g. magnetic work holders, vacuum work holders
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.
H05K 13/00 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
The invention relates to a method and a device for producing, in particular for stamping, a lens wafer (25) that has a plurality of microlenses (24), to a lens wafer, and to microlenses produced from the lens wafer.
The invention relates to an apparatus for coating a surface (2o) of a wafer (2), - comprising a receptacle device (16) for receiving the wafer (2) on a receptacle surface (19) and - a nozzle device (10) for coating the wafer (2) in a Z-direction, characterized in that on a lateral circumference (2a) of the wafer (2) it is possible to arrange a ring (4) surrounding the wafer (2) with an inner circumference (4i) and serving for extending a coating area when coating the wafer (2).
The invention relates to a device for processing substrates, in particular wafers (15), comprising at least one pre-treatment module (9), at least one post-treatment module (11) and at least one main treatment module (10), wherein the pre-treatment module (9) and the post-treatment module (11) can be switched as transfer channels for the main treatment module (10), and to a corresponding method for processing substrates, in particular wafers.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
32.
STAMPING TOOL, DEVICE AND METHOD FOR PRODUCING A LENS WAFER
The invention relates to a stamping tool, a device and a method for producing, especially stamping, a monolithic lens wafer (10) comprising a plurality of microlenses (20).
The invention relates to a chuck (1) for clamping workpieces or tools in a clamping space (21) with a clamping force (F), comprising: at least two clamping jaws (2) that can be moved in a translational manner along a clamping plane (E) in the direction of a center (Z) of the clamping space (21), said clamping space (21) being formed by end faces (2s) of the clamping jaws (2); and at least one transmission system which lies predominantly in the interior of the chuck (1) and which is purely mechanical in particular, preferably purely form-fitting, for transmitting a drive torque of a drive motor (20), which can be coupled to the transmission system by coupling means of the transmission system, onto the clamping jaws (2) in order to move the clamping jaws (2). The coupling means which are purely mechanical in particular, preferably purely form-fitting, can be coupled to a corresponding coupling connection of the drive motor (20) in an automated manner, and a movement from the maximum size of the clamping space (21) to the minimum size of the clamping space (21) can be carried out solely by the drive motor (20) and the clamping jaw movement that is carried out by the drive motor (20) via the transmission system. The invention further relates to a system consisting of a chuck (1) according to one of the previous claims and the drive motor (20), in particular provided in a chuck receiving portion (13) for receiving the chuck (1) and/or the drive motor (20), as well as an exchanging device for exchanging the chuck, in particular a robot arm.
B23B 31/163 - Chucks with simultaneously-acting jaws, whether or not also individually adjustable moving radially actuated by one or more spiral grooves
The invention relates to a handling device for handling a wafer when machining the wafer, having the following features: a support with a flat receiving face for receiving the wafer; a grid structure which is located on the receiving face, which is raised in relation to the receiving face, and which is lattice-shaped in particular; and a flexible cover for fixing the wafer on the support, said cover covering the grid structure in a sealing manner in relation to the support. A grid chamber which is delimited by the cover and the support can be supplied with negative pressure. The handling device is characterized in that the grid structure and the cover form a receiving chamber with the receiving face, said receiving chamber being tub-shaped in particular, in order to receive receiving structures which are provided on the wafer and which are raised in relation to a wafer receiving face.
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Device and method for stripping a wafer from a carrier that is connected to the wafer by an interconnect layer. The device includes a receiving means for accommodating the carrier-wafer combination consisting of the carrier and the wafer, a connection release means for breaking the connection provided by the interconnect layer between the carrier and the wafer, and stripping means for stripping the wafer from the carrier, or for stripping the carrier from the wafer. The connection release means operates in a temperature range from 0° to 350° C., especially from 10° to 200° C., preferably from 20° to 80° C., and more preferably at ambient temperature. The method includes the steps of accommodating the carrier-wafer combination on a receiving means, breaking the connection provided by the interconnect layer by a connection release means, and stripping the wafer from the carrier, or stripping the carrier from the wafer by stripping means.
B08B 3/00 - Cleaning by methods involving the use or presence of liquid or steam
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
37.
DEVICE AND METHOD FOR DETACHING A PRODUCT SUBSTRATE FROM A CARRIER SUBSTRATE
Device for detaching a product substrate from a carrier substrate, which is connected to the product substrate by a connecting layer, by means of a film frame, a flexible film connected to the film frame and having an adhesive layer for receiving the product substrate in a contact-making area section of the film, wherein the film is connected to the film frame in a fixing section of the film, said fixing section surrounding the contact-making area section, and also a, more particularly volume-variable, solvent container formed by the film frame and the film and serving for receiving solvent for dissolving the connecting layer, wherein the product substrate and the connecting layer can be received in the solvent container, and by introduction means for introducing the solvent into the solvent container and by detachment means for detaching the product substrate from the carrier substrate. Furthermore, the invention relates to a method for detaching a product substrate from a connected to the product substrate by forming a solvent container formed by a film frame and a flexible film, connected to the film frame, and serving for receiving solvent for dissolving the connecting layer, and by receiving the product substrate and the connecting layer in the solvent container, and by introducing solvent into the solvent container and by detaching the product substrate from the carrier substrate.
The invention relates to a method for producing a micro-lens using a carrier wafer, in which a lens is molded in an opening of the carrier wafer by embossing the lens in the carrier wafer, and also to a corresponding device for carrying out the method and to a micro-lens produced by the method. The invention further relates to an apparatus for producing a micro-lens and to a micro-lens.
The invention relates to a device and a method for detaching a semiconductor wafer (4) from a substrate (2), which is joined to the semiconductor wafer (4) by an connecting layer (6), by means of a flexible film (3) mounted on a film frame (1). The flexible film has an adhesive layer (3s) for retaining the semiconductor wafer (4) in a contacting surface portion (3k) of the film (3), wherein the film (3) is mounted on the film frame (1) at a fastening portion (3b) of the film (3) that surrounds the contacting surface portion (3k). The film (3) comprises a tensible portion (3a) lying between the contacting face portion (3k) and the fastening portion (3b). The semiconductor wafer (4) is detached from the substrate (2) starting from an outside edge (4u).
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
The invention relates to a receiving device for receiving flat semiconductor substrates, having a carrier, a receiving body fixed on the carrier or that can be fixed on the carrier and having a receiving side facing away from the carrier and at least one vacuum channel permeating the receiving body and having a suction end on the receiving side, wherein the receiving side comprises a defined vacuum structure made of soft material.
B25B 11/00 - Work holders or positioners not covered by groups , e.g. magnetic work holders, vacuum work holders
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
The invention relates to a device for aligning and pre-attaching a flat substrate on a carrier substrate for further processing of the substrate, having the following features: alignment means for aligning an outer substrate contour of the substrate relative to an outer carrier substrate contour of the carrier substrate by acting on the outer substrate contour, wherein the alignment takes place along a substrate plane E spanned by a contact surface between the substrate and the carrier substrate, and attaching means for partially pre-attaching the aligned substrate to the carrier substrate. The invention further relates to a method for aligning and pre-attaching a flat substrate on a carrier substrate for further processing of the substrate, having the following features: aligning an outer substrate contour of the substrate relative to an outer carrier substrate contour of the carrier substrate by acting on the outer substrate contour by aligning means, wherein the alignment takes place along a substrate plane E spanned by a contact surface between the substrate and the carrier substrate, and attaching means for partially pre-attaching the aligned substrate to the carrier substrate.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
43.
DEVICE AND METHOD FOR SEPARATING A SUBSTRATE FROM A CARRIER SUBSTRATE
A device for separating a substrate from a carrier substrate bonded to the substrate by a bonding layer, with a carrier substrate receptacle with a receiving surface for receiving the carrier substrate, a substrate receptacle, arranged opposite the carrier substrate receptacle, with a substrate receiving surface that can be arranged parallel to the first-mentioned receiving surface and is intended for receiving the substrate, wherein separating means are provided for the parallel displacement of the substrate with respect to the carrier substrate in a bonded state of the substrate and the carrier substrate. Furthermore, the invention relates to a method for separating a substrate from a carrier substrate bonded to the substrate by a bonding layer with the following steps: receiving a bonded substrate/carrier-substrate assembly comprising the carrier substrate, the bonding layer and the substrate, between a substrate receiving surface of a substrate receptacle and a receiving surface of a carrier substrate receptacle that can be arranged parallel to the substrate receiving surface and separation of the substrate from the carrier substrate by parallel displacement of the substrate with respect to the carrier substrate in a bonded state of the substrate and the carrier substrate.
The invention relates to a device for detaching a wafer from a carrier connected to the wafer by a connecting layer, comprising a receiving unit for receiving a carrier-wafer composite comprising the carrier and the wafer, a connection detaching means for detaching the connection provided by the connecting layer between the carrier and wafer, and detaching means for detaching the wafer from the carrier or for detaching the carrier from the wafer, wherein the connection detaching means is designed for a temperature range of 0 to 350°C, in particular 10 to 200°C, preferably 20 to 80°C, more preferably at an ambient temperature. Furthermore, the invention relates to a method for detaching a wafer from a carrier connected to the wafer by a connecting layer, comprising the following steps: receiving a carrier-wafer composite comprising the carrier and the wafer on a receiving unit; detaching the connection provided by the connecting layer between the carrier and wafer by way of a connection detaching means; and detaching the wafer from the carrier or detaching the carrier from the wafer by detaching means, wherein the connection detaching means works at a temperature range of up to 350°C, in particular 10 to 200°C, preferably 20 to 80°C, more preferably at an ambient temperature.
The invention relates to a method for bonding a plurality of individual chips (9) onto a base wafer (1), wherein the individual chips are stacked on the base wafer in multiple layers, and electrically conductive connections (7) exist between the vertically adjacent individual chips and the base wafer with the layer vertically adjacent to the base wafer, comprising the following steps in the order stated: a) fixing the base wafer onto a carrier (5), b) placing at least one layer of chips in defined positions on the base wafer, and c) thermal treatment of the chips on the base wafer fixed on the carrier.
H01L 21/98 - Assembly of devices consisting of solid state components formed in or on a common substrate; Assembly of integrated circuit devices
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
patents
