|
2018
|
Invention
|
Method for producing a microlens. A method for producing a microlens with a carrier wafer, in whi... |
|
2017
|
Invention
|
Die tool, device and method for producing a lens wafer. This invention relates to a die tool, a d... |
|
2016
|
Invention
|
Chuck adapted for automated coupling. A chuck for clamping workpieces or tools in a clamping spac... |
|
2015
|
Invention
|
Method and device for producing a lens wafer. A method and a device for producing a lens wafer wh... |
|
|
Invention
|
Method for detaching a product substrate off a carrier substrate. Device for stripping a product ... |
|
|
Invention
|
Method and device for producing a microlens.
A method for producing a microlens with a carrier w... |
|
2014
|
Invention
|
Device for stripping a product substrate from a carrier substrate. Device for stripping a product... |
|
|
Invention
|
Method for stripping a product substrate from a carrier substrate. Device for stripping a product... |
|
|
Invention
|
Device for aligning and pre-fixing a wafer. A device for aligning and prefixing a flat substrate ... |
|
2013
|
Invention
|
Device and method for stripping a product substrate from a carrier substrate. Device for strippin... |
|
|
Invention
|
Device for releasing an interconnect layer that provides connection between a carrier and a wafer... |
|
|
Invention
|
Device and method for processing of wafers. The invention relates to a device for processing of s... |
|
|
Invention
|
Device for detaching a product substrate off a carrier substrate. Device for stripping a product ... |
|
|
Invention
|
Device for separating a substrate from a carrier substrate. Device for separating a substrate fro... |
|
|
Invention
|
Method for stripping a wafer from a carrier. Method for stripping a wafer from a carrier that is ... |
|
2011
|
Invention
|
System having two oscillation components for machining a workpiece. A workpiece holding fixture f... |
|
|
Invention
|
System having two oscillation components for machining a workpiece. The invention relates to a wo... |
|
|
Invention
|
Device and method for processing wafers. The invention relates to a device for processing of subs... |
|
|
Invention
|
Device and method for processing wafers. The invention relates to a device for processing substra... |
|
|
Invention
|
Chuck that can be coupled in an automated manner. The invention relates to a chuck (1) for clampi... |
|
|
Invention
|
Device and method for loosening a polymer layer from a surface of a substrate. The invention rela... |
|
|
Invention
|
Device and method for detaching a product substrate from a carrier substrate. Device for detachin... |
|
2010
|
Invention
|
Method and device for producing a lens wafer. The invention relates to a method and a device for ... |
|
|
Invention
|
Device for coating a wafer.
The invention relates to a device for coating a surface of a wafer. ... |
|
|
Invention
|
Apparatus for coating a wafer. The invention relates to an apparatus for coating a surface (2o) o... |
|
|
Invention
|
Stamping tool, device and method for producing a lens wafer. The invention relates to a stamping ... |
|
|
Invention
|
Device and method for detaching a semiconductor wafer from a substrate. Device for stripping a pr... |
|
|
Invention
|
Device and method for detaching a semiconductor wafer from a substrate. The invention relates to ... |
|
|
Invention
|
Handling device for handling of a wafer. Handling device for handling of a wafer in the processin... |
|
|
Invention
|
Handling device for handling a wafer. The invention relates to a handling device for handling a w... |
|
|
Invention
|
Method and device for producing a microlens. This invention relates to a method for producing a m... |
|
|
Invention
|
Device and method for separating a substrate from a carrier substrate. Device for separating a su... |
|
|
Invention
|
Receiving device for receiving semiconductor substrates. at least one negative pressure channel w... |
|
|
Invention
|
Method and device for producing a micro-lens. The invention relates to a method for producing a m... |
|
|
Invention
|
Receiving device for receiving semiconductor substrates. The invention relates to a receiving dev... |
|
|
Invention
|
Device for aligning and pre-attaching a wafer. The invention relates to a device for aligning and... |
|
|
Invention
|
Device and method for separating a substrate from a carrier substrate. A device for separating a ... |
|
|
Invention
|
Device for stripping a wafer from a carrier. Device and method for stripping a wafer from a carri... |
|
|
Invention
|
Device and method for detaching a wafer from a carrier. The invention relates to a device for det... |
|
2009
|
Invention
|
Method for bonding of chips on wafers. Method for bonding a plurality of chips onto a base wafer. |
|
|
Invention
|
Method for bonding chips onto wafers. The invention relates to a method for bonding a plurality o... |
