Probe systems and methods of operating probe systems. The probe systems include a chuck that defines a support surface. The probe systems also include a cover plate. The probe systems further include a probe positioner that includes a positioner base, a manipulator that extends from the positioner base, and a probe arm that extends from the manipulator. The probe systems also include a probe operatively attached to the probe arm and a positioner attachment structure that separably attaches the positioner base to the cover plate. The positioner attachment structure includes an attachment structure body that defines a positioner base-facing side and a cover plate-facing side. The positioner attachment structure also includes an adhesive material that adheres the positioner base-facing side to the positioner base. The cover plate-facing side of the attachment structure body defines a micropatterned dry adhesive that separably attaches the attachment structure body to the cover plate.
Probes, probe blades, tools for probe blades, blade holders, and probe systems for electrically testing a device under test (DUT). In some examples, the probe blades are configured to provide a Kelvin electrical connection with the DUT. In some examples, the probe blades include an alignment structure configured to engage with a blade holder when the probe blade is received within a blade-receiving region of the blade holder. The blade holders are configured to separably and operatively attach a probe blade to a probe system. In some examples, the blade holders include the probe blade. The probe systems are configured to electrically test the DUT and include the blade holder.
Probes, probe blades, tools for probe blades, blade holders, and probe systems for electrically testing a device under test (DUT). In some examples, the probe blades are configured to provide a Kelvin electrical connection with the DUT. In some examples, the probe blades include an alignment structure configured to engage with a blade holder when the probe blade is received within a blade -receiving region of the blade holder. The blade holders are configured to separably and operatively attach a probe blade to a probe system. In some examples, the blade holders include the probe blade. The probe systems are configured to electrically test the DUT and include the blade holder.
Space transformers configured to be utilized in a probe system to facilitate electrical communication with a device under test (DUT), probe systems that include the space transformers, and related methods are disclosed herein. The space transformers include a dielectric body, a plurality of first electrical contacts supported by the dielectric body, and a plurality of second electrical contacts supported by the dielectric body. The space transformers also include an electrically conductive radio frequency (RF) signal-modifying trace. The space transformers further include an RF electrical signal-modifying structure in electrical communication with the electrically conductive RF signal-modifying trace. The RF electrical signal-modifying structure is configured to receive the RF electrical signal from an input region of the electrically conductive RF signal-modifying trace and to discharge a modified RF electrical signal to an output region of the electrically conductive RF signal-modifying trace. The RF electrical signal-modifying structure includes a coupler.
Space transformers configured to be utilized in a probe system to facilitate electrical communication with a device under test (DUT), probe systems that include the space transformers, and related methods are disclosed herein. The space transformers include a dielectric body, a plurality of first electrical contacts supported by the dielectric body, and a plurality of second electrical contacts supported by the dielectric body. The space transformers also include an electrically conductive radio frequency (RF) signal-modifying trace. The space transformers further include an RF electrical signal-modifying structure in electrical communication with the electrically conductive RF signal-modifying trace. The RF electrical signal-modifying structure is configured to receive the RF electrical signal from an input region of the electrically conductive RF signal-modifying trace and to discharge a modified RF electrical signal to an output region of the electrically conductive RF signal-modifying trace. The RF electrical signal-modifying structure includes a coupler.
G01R 29/08 - Measuring electromagnetic field characteristics
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
6.
FLEXIBLE, RADIO-FREQUENCY TRANSITIONS AND ELECTRONIC SYSTEMS THAT INCLUDE THE FLEXIBLE, RADIO-FREQUENCY TRANSITIONS
Flexible, radio-frequency transitions and electronic systems that include the flexible, radio-frequency transitions are disclosed herein. The flexible, radio-frequency transitions are configured to electrically interconnect a first electronic component and a second electronic component to facilitate radio-frequency electrical communication therebetween and include a flexible dielectric membrane and a microstrip transmission line. The microstrip transmission line is formed on the flexible dielectric membrane and includes an electrically conductive signal trace and an electrically conductive ground plane for the electrically conductive signal trace. The transition is configured to electrically interconnect the first electronic component and the second electronic component, and to permit radio-frequency electrical communication therebetween, throughout a range of transition angles. The electronic systems utilize radio-frequency communication and include the first electronic component, the second electronic component, and the transitions.
H01Q 13/20 - Non-resonant leaky-waveguide or transmission-line antennas Equivalent structures causing radiation along the transmission path of a guided wave
H01Q 1/42 - Housings not intimately mechanically associated with radiating elements, e.g. radome
H01Q 13/26 - Surface waveguide constituted by a single conductor, e.g. strip conductor
7.
FLEXIBLE, RADIO-FREQUENCY TRANSITIONS AND ELECTRONIC SYSTEMS THAT INCLUDE THE FLEXIBLE, RADIO-FREQUENCY TRANSITIONS
Flexible, radio-frequency transitions and electronic systems that include the flexible, radio-frequency transitions are disclosed herein. The flexible, radio-frequency transitions are configured to electrically interconnect a first electronic component and a second electronic component to facilitate radio-frequency electrical communication therebetween and include a flexible dielectric membrane and a microstrip transmission line. The microstrip transmission line is formed on the flexible dielectric membrane and includes an electrically conductive signal trace and an electrically conductive ground plane for the electrically conductive signal trace. The transition is configured to electrically interconnect the first electronic component and the second electronic component, and to permit radio-frequency electrical communication therebetween, throughout a range of transition angles. The electronic systems utilize radio-frequency communication and include the first electronic component, the second electronic component, and the transitions.
A roller mechanism with controlled height is used for probe tap-down in arrays of vertical probes for device testing. The height can be controlled using features of the roller, or external shims. This approach overcomes issues related to guide plate flexure during plate tap down by reducing forces on guide plates. It also avoids issues of probe damage from manual tap down.
09 - Scientific and electric apparatus and instruments
Goods & Services
Testing and inspecting apparatus and instruments; probe stations for testing and inspection of semiconductor wafers and semiconductors; testing apparatus for inspecting and testing semiconductor wafers; electrical and optical inspection apparatus for inspection of semiconductor wafers; electric apparatus and instruments for the examination of semiconductor wafers, namely, semiconductor wafer probe station apparatus and instruments.
10.
MEMS PROBES HAVING DECOUPLED ELECTRICAL AND MECHANICAL DESIGN
MEMS probes are provided having decoupled electrical and mechanical design. In these probes, electrical conduction is primarily through one or more electrically conductive rails, and mechanical compliance for vertical compression is provided by a coil. The resulting independence of electrical and mechanical design advantageously enables probes to have a combination of electrical and mechanical properties that cannot be obtained in probes where the probe body is subj ect to both electrical and mechanical design constraints.
H01R 13/24 - Contacts for co-operating by abutting resilientContacts for co-operating by abutting resiliently mounted
11.
Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors
Wafer-handling end effectors, probe systems that include wafer-handling end effectors, and methods of utilizing wafer-handling end effectors are disclosed herein. The wafer-handling end effectors are configured to selectively lift a wafer from an upper surface thereof and include a blade, a surface extension, and an attachment mechanism. The blade defines a wafer-facing blade side and includes a gas distribution manifold in fluid communication with the wafer-facing blade side. The surface extension defines a wafer-facing extension side that extends away from the blade. The surface extension extends at least partially around the wafer-facing blade side and includes at least three projecting regions that project from the wafer-facing extension side and are configured to physically contact the upper surface of the wafer. The attachment mechanism is configured to permit selective attachment of the surface extension to the blade and selective separation of the surface extension from the blade.
B25J 15/06 - Gripping heads with vacuum or magnetic holding means
B25J 11/00 - Manipulators not otherwise provided for
12.
WAFER-HANDLING END EFFECTORS CONFIGURED TO SELECTIVELY LIFT A WAFER FROM AN UPPER SURFACE OF THE WAFER, PROBE SYSTEMS THAT INCLUDE THE WAFER-HANDLING END EFFECTORS, AND METHODS OF UTILIZING THE WAFER-HANDLING END EFFECTORS
Wafer-handling end effectors, probe systems that include wafer-handling end effectors, and methods of utilizing wafer-handling end effectors are disclosed herein. The wafer-handling end effectors are configured to selectively lift a wafer from an upper surface thereof and include a blade, a surface extension, and an attachment mechanism. The blade defines a wafer-facing blade side and includes a gas distribution manifold in fluid communication with the wafer-facing blade side. The surface extension defines a wafer-facing extension side that extends away from the blade. The surface extension extends at least partially around the wafer-facing blade side and includes at least three projecting regions that project from the wafer-facing extension side and are configured to physically contact the upper surface of the wafer. The attachment mechanism is configured to permit selective attachment of the surface extension to the blade and selective separation of the surface extension from the blade.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B25J 15/06 - Gripping heads with vacuum or magnetic holding means
Methods of establishing contact between a probe tip of a probe system and a device under test, probe systems that perform the methods, and storage media that directs probe systems to perform the methods. The methods include measuring a height differential between a DUT surface of the DUT and an auxiliary surface of an auxiliary chuck and aligning the probe tip and the auxiliary chuck for contact with one another. The methods also include physically contacting the probe tip with the auxiliary surface to determine an auxiliary contact height between the probe tip and the auxiliary surface and determining a DUT contact height between the probe tip and the DUT surface. The methods further include aligning the probe tip and the DUT for contact with one another and moving the probe tip to the DUT contact height to physically contact the probe tip with the DUT surface.
G01B 7/14 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
G01C 5/00 - Measuring heightMeasuring distances transverse to line of sightLevelling between separated pointsSurveyors' levels
G01R 31/26 - Testing of individual semiconductor devices
14.
Methods of establishing contact between a probe tip of a probe system and a device under test, probe systems that perform the methods, and storage media that directs probe systems to perform the methods
Methods of establishing contact between a probe tip of a probe system and a device under test, probe systems that perform the methods, and storage media that directs probe systems to perform the methods. The methods include measuring a height differential between a DUT surface of the DUT and an auxiliary surface of an auxiliary chuck and aligning the probe tip and the auxiliary chuck for contact with one another. The methods also include physically contacting the probe tip with the auxiliary surface to determine an auxiliary contact height between the probe tip and the auxiliary surface and determining a DUT contact height between the probe tip and the DUT surface. The methods further include aligning the probe tip and the DUT for contact with one another and moving the probe tip to the DUT contact height to physically contact the probe tip with the DUT surface.
REMOTE CONTROL DEVICES FOR PROBE SYSTEMS, PROBE SYSTEMS THAT INCLUDE THE REMOTE CONTROL DEVICES, AND METHODS OF REMOTELY OPERATING A MOTORIZED POSITIONER OF A PROBE SYSTEM
Remote control devices for motorized positioners of probe systems, probe systems that include the remote control devices, and methods of remotely operating a motorized positioner of a probe system are disclosed herein. The remote control devices include a first rotary encoder, a second rotary encoder, a third rotary encoder, and a remote processing device. The probe systems include a chuck, a signal generation and analysis assembly, a probe, a motorized positioner, a local processing device, and the remote control device. The methods include generating a control signal utilizing the remote control device and transmitting the control signal to the probe system. The methods also include translating a probe of the probe system relative to a support surface of the probe system. The translating is based, at least in part, on the control signal.
09 - Scientific and electric apparatus and instruments
Goods & Services
Probe stations for testing and inspection of semiconductor wafers and semiconductors; testing apparatus for inspecting and testing semiconductor wafers; electrical and optical inspection apparatus for inspection of semiconductor wafers; electric apparatus and instruments for the examination of semiconductor wafers, namely, semiconductor wafer probe station apparatus and instruments
Improved performance for attenuated testing when probing a device under test with a probe array is provided. By moving the attenuation components from their conventional location on the printed circuit board of the probe head to the space transformer of the probe head, electrical path lengths can be decreased, thereby improving performance. This is particularly helpful in connection with loopback testing.
Improved serial communication is provided in a system where each node regenerates data and transmits it to at least one other node in the system. Pulse width modulation (PWM) is used to encode the data. Preferably, all pulse shapes of the PWM start with a synchronization feature. It is also preferred that the regeneration delay in each node be less than the system clock period.
Improved serial communication is provided in a system where each node regenerates data and transmits it to at least one other node in the system. Pulse width modulation (PWM) is used to encode the data. Preferably, all pulse shapes of the PWM start with a synchronization feature. It is also preferred that the regeneration delay in each node be less than the system clock period.
H04L 25/49 - Transmitting circuitsReceiving circuits using code conversion at the transmitterTransmitting circuitsReceiving circuits using predistortionTransmitting circuitsReceiving circuits using insertion of idle bits for obtaining a desired frequency spectrumTransmitting circuitsReceiving circuits using three or more amplitude levels
H04L 7/027 - Speed or phase control by the received code signals, the signals containing no special synchronisation information extracting the synchronising or clock signal from the received signal spectrum, e.g. by using a resonant or bandpass circuit
20.
VERTICAL PROBE ARRAY HAVING SLIDING CONTACTS IN ELASTIC GUIDE PLATE
A probe array having decoupled electrical and mechanical design constraints on the probes is provided. Each probe is a two-part structure with the two parts able to stay in electrical contact with each other as the parts slide up and down with respect to each other. The probes are disposed in through holes of an elastic matrix, each probe having its corresponding hole. The probes engage with the elastic matrix such that a restoring force in response to vertical probe compression is provided by the elastic matrix. With this approach, electrical and mechanical design are much more decoupled than in conventional spring probe design. The elastic matrix provides the mechanical compliance and restoring force, while the parts of the probe determine its current carrying capacity and electrical bandwidth.
A probe array having decoupled electrical and mechanical design constraints on the probes is provided. Each probe is a two-part structure with the two parts able to stay in electrical contact with each other as the parts slide up and down with respect to each other. The probes are disposed in through holes of an elastic matrix, each probe having its corresponding hole. The probes engage with the elastic matrix such that a restoring force in response to vertical probe compression is provided by the elastic matrix. With this approach, electrical and mechanical design are much more decoupled than in conventional spring probe design. The elastic matrix provides the mechanical compliance and restoring force, while the parts of the probe determine its current carrying capacity and electrical bandwidth.
Probes that define retroreflectors, probe systems that include the probes, and methods of utilizing the probes. The probes include the retroreflector, which is defined by a retroreflector body. The retroreflector body includes a first side, an opposed second side, a tapered region that extends from the first side, and a light-receiving region that is defined on the second side. The probes also include a probe tip, which is configured to provide a test signal to a device under test (DUT) and/or to receive a resultant signal from the DUT. The retroreflector is configured to receive light, via the light-receiving region, at a light angle of incidence. The retroreflector also is configured to emit at least an emitted fraction of the light, from the retroreflector body and via the light-receiving region, at a light angle of emission that is at least substantially equal to the light angle of incidence.
Probes that define retroreflectors, probe systems that include the probes, and methods of utilizing the probes. The probes include the retroreflector, which is defined by a retroreflector body. The retroreflector body includes a first side, an opposed second side, a tapered region that extends from the first side, and a light-receiving region that is defined on the second side. The probes also include a probe tip, which is configured to provide a test signal to a device under test (DUT) and/or to receive a resultant signal from the DUT. The retroreflector is configured to receive light, via the light-receiving region, at a light angle of incidence. The retroreflector also is configured to emit at least an emitted fraction of the light, from the retroreflector body and via the light-receiving region, at a light angle of emission that is at least substantially equal to the light angle of incidence.
Improved heat sinking of electronic and/or photonic integrated circuit chips is provided by including thermal- only contacts on unused parts of the chip. The resulting chip can be bonded to a cold plate with a process that ensures that only the thermal contacts of the chip touch the cold plate, thereby avoiding problems caused by the cold plate creating electrical shorts of the chip. For example, the thermal contacts can be higher features than any electrical features on that side of the chip. This approach is expected to be especially useful for applications requiring low temperature operation ( e. g., operation at 100K or less, preferably operation at 10 K or less ).
Improved heat sinking of electronic and/or photonic integrated circuit chips is provided by including thermal-only contacts on unused parts of the chip. The resulting chip can be bonded to a cold plate with a process that ensures that only the thermal contacts of the chip touch the cold plate, thereby avoiding problems caused by the cold plate creating electrical shorts of the chip. For example, the thermal contacts can be higher features than any electrical features on that side of the chip. This approach is expected to be especially useful for applications requiring low temperature operation (e.g., operation at 100K or less, preferably operation at 10 K or less).
H01L 23/367 - Cooling facilitated by shape of device
H01L 23/433 - Auxiliary members characterised by their shape, e.g. pistons
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/00 - Details of semiconductor or other solid state devices
A modular probe array for making temporary electrical contact to devices under test is provided. The probe array includes multiple probe heads each having a substrate disposed within a mounting block. Improved thermal cycling performance is obtained by using an O-ring between the substrate and the mounting block. Optionally, set screws can be used in combination with the O-ring to set the position of the substrate in its mounting block.
A modular probe array for making temporary electrical contact to devices under test is provided. The probe array includes multiple probe heads each having a substrate disposed within a mounting block. Improved thermal cycling performance is obtained by using an O-ring between the substrate and the mounting block. Optionally, set screws can be used in combination with the O-ring to set the position of the substrate in its mounting block.
Probe systems configured to test a device under test and methods of operating the probe systems are disclosed herein. The probe systems include an electromagnetically shielded enclosure, which defines an enclosed volume, and a temperature-controlled chuck, which defines a support surface configured to support a substrate that includes the DUT. The probe systems also include a probe assembly and an optical microscope. The probe systems further include an electromagnet and an electronically controlled positioning assembly. The electronically controlled positioning assembly includes a two-dimensional positioning stage, which is configured to selectively position a positioned assembly along a first two- dimensional positioning axis and also along a second two-dimensional positioning axis. The electronically controlled positioning assembly also includes a first one-dimensional positioning stage that operatively attaches the optical microscope to the positioned assembly and a second one-dimensional positioning stage that operatively attaches the electromagnet to the positioning assembly.
Probe systems configured to test a device under test and methods of operating the probe systems are disclosed herein. The probe systems include an electromagnetically shielded enclosure, which defines an enclosed volume, and a temperature-controlled chuck, which defines a support surface configured to support a substrate that includes the DUT. The probe systems also include a probe assembly and an optical microscope. The probe systems further include an electromagnet and an electronically controlled positioning assembly. The electronically controlled positioning assembly includes a two-dimensional positioning stage, which is configured to selectively position a positioned assembly along a first two-dimensional positioning axis and also along a second two-dimensional positioning axis. The electronically controlled positioning assembly also includes a first one-dimensional positioning stage that operatively attaches the optical microscope to the positioned assembly and a second one-dimensional positioning stage that operatively attaches the electromagnet to the positioning assembly.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
Vertical probe arrays having angled guide plates are provided. With this configuration, the probes can be straight conductors (when mechanically undeformed) and the mechanical bias provided by the angled guide plates can ensure the probes have a well-defined deformation when the probe array make contact to the device under test. This allows the use of straight conductors as probes without suffering from probe shorting and mechanical interference caused by straight probes buckling in unpredictable directions when vertically compressed.
Vertical transmission line probes having alternating capacitive and inductive sections are provided. These alternating sections can be designed to provide a desired transmission line impedance (e.g., between 10 and 100 Ohms, preferably 50 Ohms). Probe flexure in operation is mainly in the inductive sections, advantageously reducing flexure stresses on the dielectrics in the capacitive sections.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
Vertical transmission line probes having alternating capacitive and inductive sections are provided. These alternating sections can be designed to provide a desired transmission line impedance (e.g., between 10 and 100 Ohms, preferably 50 Ohms). Probe flexure in operation is mainly in the inductive sections, advantageously reducing flexure stresses on the dielectrics in the capacitive sections.
Methods of producing augmented probe system images and associated probe systems. A method of producing an augmented probe system image includes recording a base probe system image, generating the augmented probe system image at least partially based on the base probe system image, and presenting the augmented probe system image. The augmented probe system image includes a representation of at least a portion of the probe system that is obscured in the base probe system image. In some examples, a probe system includes a chuck, a probe assembly, an imaging device, and a controller programmed to perform methods disclosed herein.
G01R 13/40 - Arrangements for displaying electric variables or waveforms using modulation of a light beam otherwise than by mechanical displacement, e.g. by Kerr effect
G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
G06F 3/0484 - Interaction techniques based on graphical user interfaces [GUI] for the control of specific functions or operations, e.g. selecting or manipulating an object, an image or a displayed text element, setting a parameter value or selecting a range
G06T 19/00 - Manipulating 3D models or images for computer graphics
34.
Methods of producing augmented probe system images and associated probe systems
Methods of producing augmented probe system images and associated probe systems. A method of producing an augmented probe system image includes recording a base probe system image, generating the augmented probe system image at least partially based on the base probe system image, and presenting the augmented probe system image. The augmented probe system image includes a representation of at least a portion of the probe system that is obscured in the base probe system image. In some examples, a probe system includes a chuck, a probe assembly, an imaging device, and a controller programmed to perform methods disclosed herein.
3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H01R 12/52 - Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
36.
3D ELECTRICAL INTEGRATION USING COMPONENT CARRIER EDGE CONNECTIONS TO A 2D CONTACT ARRAY
3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.
H01L 21/04 - Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
Improved electrical testing of N-port beamforming devices is provided. For testing, an N:1 electrical network is connected to the N ports of the device under test to provide a single test port. This mode of testing can be used to determine parameters of interest (e.g., far field radiation patterns etc.) of the device under test more rapidly than with antenna range testing or with characterization of each port of the device under test. The N:1 electrical network can be passive or active. The N:1 electrical network can be integrated in a probe head to provide probe array testing of beamforming devices. Alternatively, the N:1 electrical network can be integrated with the device under test to provide onboard testing capability.
H04B 7/04 - Diversity systemsMulti-antenna systems, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
Improved electrical testing of N-port beamforming devices is provided. For testing, an N:1 electrical network is connected to the N ports of the device under test to provide a single test port. This mode of testing can be used to determine parameters of interest (e.g., far field radiation patterns etc.) of the device under test more rapidly than with antenna range testing or with characterization of each port of the device under test. The N:1 electrical network can be passive or active. The N:1 electrical network can be integrated in a probe head to provide probe array testing of beamforming devices. Alternatively, the N:1 electrical network can be integrated with the device under test to provide onboard testing capability.
H04B 7/06 - Diversity systemsMulti-antenna systems, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the transmitting station
39.
Double-sided probe systems with thermal control systems and related methods
Double-sided probe systems with thermal control systems and related methods. Thermally-controlled, double-sided probe systems include a probe assembly configured to test one or more devices under test (DUTs) of a substrate and a chuck configured to support the substrate. The probe assembly includes a thermal control system configured to at least partially control a substrate temperature of the substrate while the probe assembly tests the DUT(s). The chuck is configured to support the substrate such that the probe assembly has access to each of a first substrate side of the substrate and a second substrate side of the substrate while the substrate is operatively supported by the chuck. In some examples, methods of operating double-sided probe systems include regulating the substrate temperature with the thermal control system.
Double-sided probe systems with thermal control systems and related methods. Thermally-controlled, double-sided probe systems include a probe assembly configured to test one or more devices under test (DUTs) of a substrate and a chuck configured to support the substrate. The probe assembly includes a thermal control system configured to at least partially control a substrate temperature of the substrate while the probe assembly tests the DUT(s). The chuck is configured to support the substrate such that the probe assembly has access to each of a first substrate side of the substrate and a second substrate side of the substrate while the substrate is operatively supported by the chuck. In some examples, methods of operating double-sided probe systems include regulating the substrate temperature with the thermal control system.
Customizable probe cards, probe systems including the same, and related methods. A customizable probe card for testing one or more devices under test (DUTs) comprises a support structure, one or more probe assemblies supporting respective probes, and a probe repositioning assembly. The probe repositioning assembly is configured to facilitate selective adjustment of an orientation of at least one probe relative to the support structure. In examples, a probe system comprises a chuck for supporting a substrate that includes one or more DUTs, a customizable probe card, and a probe card holder. In examples, methods of reconfiguring a customizable probe card comprise utilizing a probe repositioning assembly to reposition the respective probe of at least one probe assembly.
Probe systems including imaging devices with objective lens isolators and related methods are disclosed herein. A probe system includes an enclosure with an enclosure volume for enclosing a substrate that includes one or more devices under test (DUTs), a testing assembly, and an imaging device. The imaging device includes an imaging device objective lens, an imaging device body, and an objective lens isolator. In examples, the probe system includes an electrical grounding assembly configured to restrict electromagnetic noise from entering the enclosure volume. In examples, methods of preparing the imaging device include assembling the imaging device such that the imaging device objective lens is at least partially electrically isolated from the imaging device body. In some examples, utilizing the probe system includes testing the one or more DUTs while restricting electrical noise from propagating from the imaging device to the substrate.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
G03B 17/00 - Details of cameras or camera bodiesAccessories therefor
43.
PROBE SYSTEMS AND METHODS FOR TESTING A DEVICE UNDER TEST
Probe systems and methods for testing a device under test are disclosed herein. The probe systems include an electrically conductive ground loop and a structure that is electrically connected to a ground potential via at least a region of the electrically conductive ground loop. The probe systems also include nonlinear circuitry. The nonlinear circuitry is configured to resist flow of electric current within the ground loop when a voltage differential across the nonlinear circuitry is less than a threshold voltage differential and permit flow of electric current within the ground loop when the voltage differential across the nonlinear circuitry is greater than the threshold voltage differential. The methods include positioning a device under test (DUT) within a probe system that includes an electrically conductive ground loop and nonlinear circuitry. The methods also include selectively resisting and permitting electric current flow within the ground loop and through the nonlinear circuitry.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
44.
Probe systems and methods for testing a device under test
Probe systems and methods for testing a device under test are disclosed herein. The probe systems include an electrically conductive ground loop and a structure that is electrically connected to a ground potential via at least a region of the electrically conductive ground loop. The probe systems also include nonlinear circuitry. The nonlinear circuitry is configured to resist flow of electric current within the ground loop when a voltage differential across the nonlinear circuitry is less than a threshold voltage differential and permit flow of electric current within the ground loop when the voltage differential across the nonlinear circuitry is greater than the threshold voltage differential. The methods include positioning a device under test (DUT) within a probe system that includes an electrically conductive ground loop and nonlinear circuitry. The methods also include selectively resisting and permitting electric current flow within the ground loop and through the nonlinear circuitry.
Probe systems including imaging devices with objective lens isolators and related methods are disclosed herein. A probe system includes an enclosure with an enclosure volume for enclosing a substrate that includes one or more devices under test (DUTs), a testing assembly, and an imaging device. The imaging device includes an imaging device objective lens, an imaging device body, and an objective lens isolator. In examples, the probe system includes an electrical grounding assembly configured to restrict electromagnetic noise from entering the enclosure volume. In examples, methods of preparing the imaging device include assembling the imaging device such that the imaging device objective lens is at least partially electrically isolated from the imaging device body. In some examples, utilizing the probe system includes testing the one or more DUTs while restricting electrical noise from propagating from the imaging device to the substrate.
G01R 31/308 - Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
G01R 31/319 - Tester hardware, i.e. output processing circuits
46.
Methods for maintaining gap spacing between an optical probe of a probe system and an optical device of a device under test, and probe systems that perform the methods
Methods for maintaining gap spacing between an optical probe of a probe system and an optical device of a device under test and probe systems that perform the methods. The methods include determining a desired relative orientation between the optical probe and the DUT and optically testing the optical device with the optical probe. The methods also include maintaining the desired relative orientation during the optically testing. The maintaining includes repeatedly and sequentially collecting an existing DUT image of a DUT reference structure of the DUT and an existing probe image of a probe reference structure of the optical probe, determining a probe-DUT offset between an existing relative orientation between the optical probe and the DUT and the desired relative orientation, and adjusting the relative orientation to return the optical probe and the DUT to the desired relative orientation.
Probe systems for optically probing a device under test (DUT) and methods of operating the probe systems. The probe systems include a probing assembly that includes an optical probe that defines a probe tip and a distance sensor. The probe systems also include a support surface configured to support a substrate, which defines a substrate surface and includes an optical device positioned below the substrate surface. The probe systems further include a positioning assembly configured to selectively regulate a relative orientation between the probing assembly and the DUT. The probe systems also include a controller programmed to control the operation of the probe systems. The methods include methods of operating the probe systems.
Probe systems and methods of characterizing optical coupling between an optical probe of a probe system and a calibration structure. The probe systems include a probe assembly that includes an optical probe, a support surface configured to support a substrate, and a signal generation and analysis assembly configured to generate an optical signal and to provide the optical signal to the optical device via the optical probe. The probe systems also include an electrically actuated positioning assembly, a calibration structure configured to receive the optical signal, and an optical detector configured to detect a signal intensity of the optical signal. The probe systems further include a controller programmed to control the probe system to generate a representation of signal intensity as a function of the relative orientation between the optical probe and the calibration structure. The methods include methods of operating the probe systems.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
49.
Calibration chucks for optical probe systems, optical probe systems including the calibration chucks, and methods of utilizing the optical probe systems
Calibration chucks for optical probe systems, optical probe systems including the calibration chucks, and methods of utilizing the optical probe systems. The calibration chucks include a calibration chuck body that defines a calibration chuck support surface. The calibration chucks also include at least one optical calibration structure that is supported by the calibration chuck body. The at least one optical calibration structure includes a horizontal viewing structure. The horizontal viewing structure is configured to facilitate viewing of a horizontally viewed region from a horizontal viewing direction that is at least substantially parallel to the calibration chuck support surface. The horizontal viewing structure also is configured to facilitate viewing of the horizontally viewed region via an imaging device of the optical probe system that is positioned vertically above the calibration chuck support surface.
G01N 21/27 - ColourSpectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands using photo-electric detection
G01B 11/02 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
G01R 31/308 - Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
G01R 35/00 - Testing or calibrating of apparatus covered by the other groups of this subclass
G01B 11/14 - Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
H01L 21/66 - Testing or measuring during manufacture or treatment
G01B 21/04 - Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
50.
Probe on carrier architecture for vertical probe arrays
A probe-on-carrier architecture is provided, where several vertical probes are disposed on each probe carrier and the probe carriers are affixed to the space transformer. Each vertical probe has two flexible members. The first flexible member makes electrical contact to the space transformer. The second flexible member makes temporary electrical contact to the device under test. A mechanical stiffener can be used to deal with the possible lack of flatness and thermal expansion of the space transformer. The mechanical stiffener can be affixed to the space transformer to bring the flatness and thermal expansion of the space transformer to within specifications. Alternatively, the mechanical stiffener can be affixed to the space transformer without trying to bring the flatness and thermal expansion of the space transformer to within specifications.
A probe-on-carrier architecture is provided, where several vertical probes are disposed on each probe carrier and the probe carriers are affixed to the space transformer. Each vertical probe has two flexible members. The first flexible member makes electrical contact to the space transformer. The second flexible member makes temporary electrical contact to the device under test. A mechanical stiffener can be used to deal with the possible lack of flatness and thermal expansion of the space transformer. The mechanical stiffener can be affixed to the space transformer to bring the flatness and thermal expansion of the space transformer to within specifications. Alternatively, the mechanical stiffener ca be affixed to the space transformer without trying to bring the flatness and thermal expansion of the space transformer to within specifications.
Microscopes with objective assembly crash detection and methods of utilizing the same are disclosed herein. For example, a microscope comprises a microscope body, an objective assembly comprising an objective lens, an objective assembly mount configured to separably attach the objective assembly to the microscope body, and an orientation detection circuit configured to indicate when a relative orientation between the microscope body and the objective assembly differs from a predetermined relative orientation.
Probe systems and methods for calibrating capacitive height sensing measurements. A probe system includes a probe assembly with a probe support body that supports a capacitive displacement sensor that terminates in a sensing tip relative to a substrate and that is configured to generate an uncalibrated capacitive height measurement. A method of utilizing the probe system to generate a calibrated capacitive height measurement includes receiving a height calibration structure architecture; calculating a layer impedance magnitude of each substrate layer of the height calibration structure; and calculating a total layer impedance magnitude of the height calibration structure. The method further includes measuring a measured impedance magnitude and calculating the calibrated capacitive height measurement.
G01B 7/06 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width, or thickness for measuring thickness
Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.
G01R 31/01 - Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass productionTesting objects at points as they pass through a testing station
Probe systems and methods for collecting an optical image of a device under test (DUT) are disclosed herein. The probe systems include a chuck, a chuck thermal module, an enclosure, an imaging device, and a flow-regulating structure. The chuck defines a support surface configured to support a substrate and the chuck thermal module is configured to regulate a temperature of the chuck. The enclosure defines an enclosed volume, which contains the support surface of the chuck, and an aperture. The imaging device is at least partially external the enclosed volume and the enclosure and the imaging device defines a gap therebetween. The gap at least partially defines a fluid conduit that permits fluid flow between the enclosed volume and an external region. The flow-regulating structure is configured to regulate fluid flow through the fluid conduit. The methods include methods of utilizing the systems.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
56.
Electrical test probes having decoupled electrical and mechanical design
Probes for testing electrical circuits having decoupled electrical and mechanical design are provided. For example, a mechanically resilient core can be surrounded by an electrically conductive shell. In this way, electrical parameters of the probes are determined by the shells and mechanical parameters of the probes are determined by the cores. An important application of this approach is to provide impedance matched transmission line probes.
Probes for testing electrical circuits having decoupled electrical and mechanical design are provided. For example, a mechanically resilient core can be surrounded by an electrically conductive shell, In this way, electrical parameters of the probes are determined by the shells and mechanical parameters of the probes are determined by the cores, An important application of this approach is to provide impedance matched transmission line probes.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 31/02 - Testing of electric apparatus, lines, or components for short-circuits, discontinuities, leakage, or incorrect line connection
G01R 31/26 - Testing of individual semiconductor devices
58.
Methods of controlling the operation of probe stations and probe stations that perform the methods, the methods including generating and executing a test routine that directs the probe station to electrically test a test subset of a plurality of DUTs and to pre-test a pre-test subset of a plurality of DUTs, which is a subset of the test subset, with a pre-test
Methods of controlling the operation of probe stations and probe stations that perform the methods. The methods including generating a test routine by constructing a substrate map, receiving a test subset input from a user, and updating the substrate map to incorporate information regarding which devices under test (DUTS) of a plurality of DUTs are in a test subset of a plurality of DUTs. The methods also include receiving a pre-test subset input from the user, wherein the pre-test subset is a subset of the test subset, and updating the substrate map to incorporate information which DUTs of the test subset are in the pre-test subset. The methods further include executing the test routine by moving a probe assembly to each DUT in the test subset, selectively performing a pre-test routine on each DUT that is in the pre-test subset, and electrically testing each DUT in the test subset.
A skate on a tip of a probe for testing electrical devices is a reduced thickness probe tip contact. Such a skate can advantageously increase contact pressure, but it can also undesirably reduce probe lifetime due to rapid mechanical wear of the skate. Here multilayer skate probes are provided where the overall shape of the probe tip is a smooth curved surface, as opposed to the conventional fin-like skate configuration. The skate layer is the most mechanically wear-resistant layer in the structure, so abrasive processing of the probe tip leads to a probe skate defined by the skate layer. The resulting probes provide the advantage of increased contact pressure without the disadvantage of reduced lifetime.
A skate on a tip of a probe for testing electrical devices is a reduced thickness probe tip contact. Such a skate can advantageously increase contact pressure, but it can also undesirably reduce probe lifetime due to rapid mechanical wear of the skate. Here multilayer skate probes are provided where the overall shape of the probe tip is a smooth curved surface, as opposed to the conventional fin- like skate configuration. The skate layer is the most mechanically wear-resistant layer in the structure, so abrasive processing of the probe tip leads to a probe skate defined by the skate layer. The resulting probes provide the advantage of increased contact pressure without the disadvantage of reduced lifetime.
Probe systems and methods including electric contact detection. The probe systems include a probe assembly and a chuck. The probe systems also include a translation structure configured to operatively translate the probe assembly and/or the chuck and an instrumentation package configured to detect contact between the probe system and a device under test (DUT) and to test operation of the DUT. The instrumentation package includes a continuity detection circuit, a test circuit, and a translation structure control circuit. The continuity detection circuit is configured to detect electrical continuity between a first probe electrical conductor and a second probe electrical conductor. The test circuit is configured to electrically test the DUT. The translation structure control circuit is configured to control the operation of the translation structure. The methods include monitoring continuity between a first probe and a second probe and controlling the operation of a probe system based upon the monitoring.
Probes with fiducial targets, probe systems including the same, and associated methods. The probes include a probe body, a probe beam, a probe tip configured to contact a device under test (DUT), and a fiducial target affixed to the probe beam. The fiducial target is configured to be visible to an optical system to determine a position of the probe tip relative to the DUT. The methods include methods of utilizing and/or manufacturing the probes.
Probes are connected to the space transformer via multiple carrier plates. Electrical contacts from the probes to the space transformer are by way of spring tail features on the probes that connect to the space transformer and not to the carrier plates. In other words, the carrier plates are purely mechanical in function. This configuration can significantly reduce probe array fabrication time relative to sequential placement of individual probes on the space transformer. Multiple probe carrier plates can be populated with probes in parallel, and the final sequential assembly of carrier plates onto the space transformer has a greatly reduced operation count. Deviations of the space transformer from flatness can be compensated for.
Probes are connected to the space transformer via multiple carrier plates. Electrical contacts from the probes to the space transformer are by way of spring tail features on the probes that connect to the space transformer and not to the carrier plates. In other words, the carrier plates are purely mechanical in function. This configuration can significantly reduce probe array fabrication time relative to sequential placement of individual probes on the space transformer. Multiple probe carrier plates can be populated with probes in parallel, and the final sequential assembly of carrier plates onto the space transformer has a greatly reduced operation count. Deviations of the space transformer from flatness can be compensated for.
Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.
Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.
Probe systems for testing a device under test are disclosed herein. The probe systems include a platen that defines an upper surface, an opposed lower surface, and a platen aperture. The probe systems also include a chuck that defines a support surface configured to support a device under test. The probe systems further include a lower enclosure extending from the lower surface of the platen and an upper enclosure extending from the upper surface of the platen. The upper enclosure includes a side wall that defines a side wall aperture, and the side wall and the platen define an intersection angle of at least 30 degrees and at most 60 degrees. The probe systems also include a manipulator, a probe shaft arm, a probe assembly, a test head, and an electrical conductor.
G01R 1/04 - HousingsSupporting membersArrangements of terminals
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
68.
VERTICAL PROBE ARRAY HAVING A TILED MEMBRANE SPACE TRANSFORMER
Vertical probe heads having a space transformer laterally tiled into several sections are provided. This change relative to conventional approaches improves manufacturing yield. These probe heads can include metal ground planes, and in embodiments where the ground planes are provided as separate metal plates parallel to the guide plates, the metal plates can also be laterally tiled into several sections. Such tiling of metal plates improves manufacturing yield and alleviates thermal mismatch issues. Probes are not mechanically connected to the space transformer, which facilitates replacement of individual probes of an array.
Vertical probe heads having a space transformer laterally tiled into several sections are provided. This change relative to conventional approaches improves manufacturing yield. These probe heads can include metal ground planes, and in embodiments where the ground planes are provided as separate metal plates parallel to the guide plates, the metal plates can also be laterally tiled into several sections. Such tiling of metal plates improves manufacturing yield and alleviates thermal mismatch issues. Probes are not mechanically connected to the space transformer, which facilitates replacement of individual probes of an array.
Improved impedance matching is provided in vertical probe arrays having conductive guide plates by providing ground pins connecting the guide plates that do not mechanically touch the device under test or the input test apparatus. Such ground pins can be disposed in predetermined patterns around corresponding signal probes to improve an impedance match between the probes and the test apparatus and/or the device under test. Preferably all impedances are matched to 50Ω as is customary for high frequency work.
Probe systems and methods including electric contact detection. The probe systems include a probe assembly and a chuck. The probe systems also include a translation structure configured to operatively translate the probe assembly and/or the chuck and an instrumentation package configured to detect contact between the probe system and a device under test (DUT) and to test operation of the DUT. The instrumentation package includes a continuity detection circuit, a test circuit, and a translation structure control circuit. The continuity detection circuit is configured to detect electrical continuity between a first probe electrical conductor and a second probe electrical conductor. The test circuit is configured to electrically test the DUT. The translation structure control circuit is configured to control the operation of the translation structure. The methods include monitoring continuity between a first probe and a second probe and controlling the operation of a probe system based upon the monitoring.
Crosstalk between probes in a vertical probe array is reduced by providing a grounded metal carrier disposed between the guide plates of the probe array. The metal carrier includes pockets that are laterally separated from each other by the metal carrier. Probes in different pockets are thereby electrically shielded from each other.
Crosstalk between probes in a vertical probe array is reduced by providing a grounded metal carrier disposed between the guide plates of the probe array. The metal carrier includes pockets that are laterally separated from each other by the metal carrier. Probes in different pockets are thereby electrically shielded from each other.
Improved wafer-scale testing of optoelectronic devices, such as CMOS image scan devices, is provided. A probe card includes an LED light source corresponding to each device under test in the wafer. The LED light sources provide light from a phosphor illuminated by the LED. A pinhole and lens arrangement is used to collimate the light provided to the devices under test. Uniformity of illumination can be provided by closed loop control of the LED light sources using internal optical signals as feedback signals, in combination with calibration data relating the optical signal values to emitted optical intensity. Uniformity of illumination can be further improved by providing a neutral density filter for each LED light source to improve uniformity from one source to another and/or to improve uniformity of the radiation pattern from each LED light source.
Improved wafer-scale testing of optoelectronic devices, such as CMOS image scan devices, is provided. A probe card includes an LED light source corresponding to each device under test in the wafer. The LED light sources provide light from a phosphor illuminated by the LED. A pinhole and lens arrangement is used to collimate the light provided to the devices under test. Uniformity of illumination can be provided by closed loop control of the LED light sources using internal optical signals as feedback signals, in combination with calibration data relating the optical signal values to emitted optical intensity. Uniformity of illumination can be further improved by providing a neutral density filter for each LED light source to improve uniformity from one source to another and/or to improve uniformity of the radiation pattern from each LED light source.
G01N 21/88 - Investigating the presence of flaws, defects or contamination
G01J 1/42 - Photometry, e.g. photographic exposure meter using electric radiation detectors
G02B 27/09 - Beam shaping, e.g. changing the cross-sectioned area, not otherwise provided for
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H04N 1/028 - Details of scanning heads for picture-information pick-up
G01J 1/08 - Arrangements of light sources specially adapted for photometry
G01J 1/32 - Photometry, e.g. photographic exposure meter by comparison with reference light or electric value intensity of the measured or reference value being varied to equalise their effects at the detector, e.g. by varying incidence angle using variation of intensity or distance of source using electric radiation detectors adapted for automatic variation of the measured or reference value
Contact engines, probe head assemblies, probe systems, and associated methods for on-wafer testing of the wireless operation of a device under test (DUT). A contact engine includes a flexible dielectric membrane having a first surface and a second surface and a plurality of probes supported by the flexible dielectric membrane. The plurality of probes are oriented to contact a plurality of contact locations on the DUT. Each probe in the plurality of probes includes a corresponding probe tip that projects from the second surface of the flexible dielectric membrane and is configured to electrically and physically contact a corresponding contact location of the plurality of contact locations. The contact engine further includes at least one membrane antenna supported by the flexible dielectric membrane. A probe head assembly includes the contact engine. A probe system includes the probe head assembly. Associated methods include methods of utilizing the contact engine.
Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting assembly extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting assembly includes an electrically conductive support surface, which is configured to support a substrate that includes the DUT. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting assembly.
G01R 31/10 - Locating faults in cables, transmission lines, or networks by increasing destruction at fault, e.g. burning-in by using a pulse generator operating a special programme
G01R 1/18 - Screening arrangements against electric or magnetic fields, e.g. against earth's field
G01N 27/42 - Measuring deposition or liberation of materials from an electrolyteCoulometry, i.e. measuring coulomb-equivalent of material in an electrolyte
G01N 31/02 - Investigating or analysing non-biological materials by the use of the chemical methods specified in the subgroupsApparatus specially adapted for such methods using precipitation
79.
Probe head assemblies and probe systems for testing integrated circuit devices
Probe head assemblies and probe systems for testing integrated circuit devices are disclosed herein. In one embodiment, the probe head assemblies include a contacting structure and a space transformer assembly. In another embodiment, the probe head assemblies include a contacting structure, a suspension system, a flex cable interface, and a space transformer including a space transformer body and a flex cable assembly. In another embodiment, the probe head assemblies include a contacting structure, a space transformer, and a planarization layer. In another embodiment, the probe head assemblies include a contacting structure, a space transformer, a suspension system, a platen, a printed circuit board, a first plurality of signal conductors configured to convey a first plurality of signals external to the space transformer, and a second plurality of signal conductors configured to convey a second plurality of signals via the space transformer. The probe systems include the probe head assemblies.
A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
81.
Shielded probe systems with controlled testing environments
Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting stack extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting stack includes an electrically conductive support surface and a temperature-controlled chuck. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting stack.
G01R 31/10 - Locating faults in cables, transmission lines, or networks by increasing destruction at fault, e.g. burning-in by using a pulse generator operating a special programme
G01R 1/18 - Screening arrangements against electric or magnetic fields, e.g. against earth's field
G01N 27/42 - Measuring deposition or liberation of materials from an electrolyteCoulometry, i.e. measuring coulomb-equivalent of material in an electrolyte
G01N 31/02 - Investigating or analysing non-biological materials by the use of the chemical methods specified in the subgroupsApparatus specially adapted for such methods using precipitation
82.
Probe systems, storage media, and methods for wafer-level testing over extended temperature ranges
Probe systems, storage media, and methods for wafer-level testing over extended temperature ranges are disclosed herein. The methods are configured to test a plurality of devices under test (DUTs) present on a substrate. The probe systems are programmed to perform the methods. The storage media include computer-readable instructions that direct a probe system to perform the methods.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
83.
Test standards and methods for impedance calibration of a probe system, and probe systems that include the test standards or utilize the methods
Test standards and methods for impedance calibration of a probe system and probe systems that include the test standards and/or utilize the methods are disclosed herein. The test standards include at least one test structure. In some embodiments, the test standard further includes an alignment structure that is associated with the test structure. In some embodiments, the test standards include a plurality of test structures. In some embodiments, the plurality of test structures includes a thin film thru test structure and a thin film offset test structure. In some embodiments, the plurality of test structures is positioned to simultaneously contact a plurality of probe regions of a probe head. The methods include methods of calibrating a probe system.
09 - Scientific and electric apparatus and instruments
Goods & Services
Probe stations for testing and inspecting integrated circuits and semiconductor devices; probe heads for testing integrated circuits and semiconductor devices; probe cards for testing integrated circuits and semiconductor devices; probe cards for use in connection with inspection of semiconductor devices and integrated circuits; probes for testing of integrated circuits and semiconductor devices; probes for the measurement of electronic signals; probe cards for inspecting integrated circuits and semiconductor devices; waveguide probes for on-wafer probing of circuits; positioners for probing microelectronic assemblies; testing, inspection and probing apparatus, testing, inspection, and probing instruments, computer hardware, and computer software for use in the process of manufacture, testing, and inspection of semiconductor devices and integrated circuits; optical inspection apparatus for semiconductor devices and integrated circuits; computer software for testing and inspecting integrated circuits; computer software for calibrating probes and probe stations; computer software for use in operating semiconductor and integrated circuit testing machines; chucks for supporting integrated circuits and semiconductor devices under test; thermal chucks for testing integrated circuits and semiconductor devices; testing, inspection and probing instruments for electronic reliability testing of integrated circuits and semiconductor devices.
09 - Scientific and electric apparatus and instruments
Goods & Services
Probe stations for testing and inspecting integrated circuits and semiconductor devices; probe heads for testing integrated circuits and semiconductor devices; probe cards for testing integrated circuits and semiconductor devices; probe cards for use in connection with inspection of semiconductor devices and integrated circuits; probes for testing of integrated circuits and semiconductor devices; probes for the measurement of electronic signals; probe cards for inspecting integrated circuits and semiconductor devices; waveguide probes for on-wafer probing of circuits; positioners for probing microelectronic assemblies; testing, inspection and probing apparatus, testing, inspection, and probing instruments, computer hardware, and computer software for use in the process of manufacture, testing, and inspection of semiconductor devices and integrated circuits; optical inspection apparatus for semiconductor devices and integrated circuits; computer software for testing and inspecting integrated circuits; computer software for calibrating probes and probe stations; computer software for use in operating semiconductor and integrated circuit testing machines; chucks for supporting integrated circuits and semiconductor devices under test; thermal chucks for testing integrated circuits and semiconductor devices; testing, inspection and probing instruments for electronic reliability testing of integrated circuits and semiconductor devices.
86.
Probes with fiducial marks, probe systems including the same, and associated methods
Probes with fiducial marks, probe systems including the same, and associated methods. The probes include a beam portion and a probe tip that is configured to contact a device under test (DUT), and further include a fiducial mark formed on the beam portion that is configured to facilitate alignment of the probe and the DUT. The fiducial mark is configured to be visible to an optical assembly, and is in focus to the optical assembly within a depth of field of the optical assembly that is smaller than a depth of field over which the beam portion is in focus to the optical assembly. The methods include methods of utilizing and/or manufacturing the probes.
Shielded probe systems are disclosed herein. The probe systems are configured to test a device under test (DUT) and include a measurement chamber that at least partially bounds an enclosed volume, an aperture defined by the measurement chamber, a probing assembly, and a shielding structure. The probing assembly includes a probe, which is oriented within the enclosed volume, a probe arm, which is operatively attached to the probe, and a manipulator, which is operatively attached to the probe arm. At least a portion of the probing assembly extends through the aperture. The shielding structure extends between the measurement chamber and the probing assembly and is configured to restrict fluid flow through the aperture and shield the enclosed volume from an ambient environment that surrounds the measurement chamber while maintaining at least a threshold separation distance from the probe arm throughout a probe arm range-of-motion thereof.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 1/18 - Screening arrangements against electric or magnetic fields, e.g. against earth's field
The method for forming a semiconductor probe tip comprises depositing a first copper layer onto exposed electrically conductive areas of a wafer. The first copper layer surrounds a non-conductive polymer structure on the wafer. The non-conductive polymer structure is removed to form a primary cavity in the first copper layer. The wafer and the primary cavity are coated with a polymer layer. Regions of the polymer layer are removed to form a secondary cavity within and alongside the primary cavity. A metal layer is deposited on exposed electrically conductive areas of the wafer and within bounds of the secondary cavity.
H01R 43/00 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
An apparatus for electrically testing a semiconductor device comprises a probe card comprising a probe, wherein the probe comprises a probe tip. Further, the probe tip comprises a foot with an arbitrarily sized cross-section and an apex with an arbitrarily sized cross-section, wherein the cross-section of the foot is wider than the cross-section of the apex.
A test socket for facilitating testing of a device under test (DUT) includes a holder comprising a mounting structure for attaching the holder to other components of the socket and a floating nest structure in which the DUT can be disposed. The floating nest structure can have a seat cavity sized and shaped to receive and hold the DUT such that at least some of the DUT terminals are in contact with corresponding contacts of a test board while the test socket is attached to the test board. A flexure located laterally between the mounting structure and the floating nest structure and can allow the nest structure to move relative to the mounting structure and thus float.
Probe systems and methods for automatically maintaining alignment between a probe and a device under test (DUT) during a temperature change. The methods include collecting an initial image of a planar offset fiducial and determining an initial height reference of a height offset fiducial. The methods further include changing a temperature of the DUT, automatically maintaining a planar alignment between a probe and the DUT during the changing, and automatically maintaining a height alignment between the probe and the BUT during the changing. The probe systems include a chuck, which defines a support surface configured to support a substrate that includes the DUT, and a probe head assembly, which includes a probe configured to contact a corresponding contact pad of the DUT. The probe systems further include a substrate thermal module, which is configured to regulate a temperature of the DUT, and a controller programmed to execute the methods.
A test socket for facilitating testing of a device under test (DUT) includes a holder comprising a mounting structure for attaching the holder to other components of the socket and a floating nest structure in which the DUT can be disposed. The floating nest structure can have a seat cavity sized and shaped to receive and hold the DUT such that at least some of the DUT terminals are in contact with corresponding contacts of a test board while the test socket is attached to the test board. A flexure located laterally between the mounting structure and the floating nest structure and can allow the nest structure to move relative to the mounting structure and thus float.
09 - Scientific and electric apparatus and instruments
Goods & Services
probe stations for testing and inspecting integrated circuits and semiconductor devices; probe heads for testing integrated circuits and semiconductor devices; probe cards for testing integrated circuits and semiconductor devices; probe cards for use in connection with inspection of semiconductor devices and integrated circuits; probes for testing of integrated circuits and semiconductor devices; probes for the measurement of electronic signals; probe cards for inspecting integrated circuits and semiconductor devices; waveguide probes for on-wafer probing of circuits; positioners for probing microelectronic assemblies; testing, inspection and probing apparatus, testing, inspection, and probing instruments, computer hardware, and computer software for use in the process of manufacture, testing, and inspection of semiconductor devices and integrated circuits; optical inspection apparatus for semiconductor devices and integrated circuits; computer software for testing and inspecting integrated circuits; computer software for calibrating probes and probe stations; computer software for use in operating semiconductor and integrated circuit testing machines; testing, inspection and probing instruments for electronic reliability testing of integrated circuits and semiconductor devices
09 - Scientific and electric apparatus and instruments
Goods & Services
probe stations for testing and inspecting integrated circuits and semiconductor devices; probe heads for testing integrated circuits and semiconductor devices; probe cards for testing integrated circuits and semiconductor devices; probe cards for use in connection with inspection of semiconductor devices and integrated circuits; probes for testing of integrated circuits and semiconductor devices; probes for the measurement of electronic signals; probe cards for inspecting integrated circuits and semiconductor devices; waveguide probes for on-wafer probing of circuits; positioners for probing microelectronic assemblies; testing, inspection and probing apparatus, testing, inspection, and probing instruments, computer hardware, and computer software for use in the process of manufacture, testing, and inspection of semiconductor devices and integrated circuits; optical inspection apparatus for semiconductor devices and integrated circuits; computer software for testing and inspecting integrated circuits; computer software for calibrating probes and probe stations; computer software for use in operating semiconductor and integrated circuit testing machines; testing, inspection and probing instruments for electronic reliability testing of integrated circuits and semiconductor devices
95.
Wiring substrate with filled vias to accommodate custom terminals
A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via.
G01R 3/00 - Apparatus or processes specially adapted for the manufacture of measuring instruments
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
A probe for engaging a conductive pad is provided. The probe includes a probe contact end for receiving a test current, a probe retention portion below the contact end, a block for holding the probe retention portion, a probe arm below the retention portion, a probe contact tip below the arm, and a generally planar self-cleaning skate disposed perpendicular below the contact tip. The self-cleaning skate has a square front, a round back and a flat middle section. The conductive pad is of generally convex shape having a granular non-conductive surface of debris and moves to engage the skate, whereby an overdrive motion is applied to the pad causing the skate to move across and scrub non-conductive debris from the pad displacing the debris along the skate and around the skate round back end to a position on the skate that is away from the pad.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 31/20 - Preparation of articles or specimens to facilitate testing
G01R 3/00 - Apparatus or processes specially adapted for the manufacture of measuring instruments
09 - Scientific and electric apparatus and instruments
Goods & Services
Computer software sold as a feature of probe systems for processing, testing, and inspecting semiconductor wafers and integrated circuits; computer software and hardware sold as a feature of probe systems for processing, testing, and inspecting semiconductor wafers and integrated circuits; semiconductor testing apparatus with automated control software; probe stations, and their components, software, and accessories, for on-wafer testing of integrated circuits and semiconductors; automated process control systems, namely, computer software and hardware used to monitor and automate industrial machinery, namely, probe systems for on-wafer testing of integrated circuits and semiconductors.
98.
Method of electrically contacting a bond pad of a device under test with a probe
The contacts of a probing apparatus are elastically supported on a replaceable coupon and electrically interconnected with conductors on a membrane or a space transformer.
H01R 43/20 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
A chuck for testing an integrated circuit includes an upper conductive layer having a lower surface and an upper surface suitable to support a device under test. An upper insulating layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper conductive layer, and a lower surface. A middle conductive layer has an upper surface at least in partial face-to-face contact with the lower surface of the upper insulating layer, and a lower surface.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
G01R 31/26 - Testing of individual semiconductor devices
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
09 - Scientific and electric apparatus and instruments
Goods & Services
computer software sold as a feature of probe systems for processing, testing, and inspecting semiconductor wafers and integrated circuits; computer software and computer hardware sold as a feature of probe systems for processing, testing, and inspecting semiconductor wafers and integrated circuits; semiconductor testing apparatus with automated control software; probe stations, and their components, software, and accessories, for on-wafer testing of integrated circuits and semiconductors; automated process control systems, namely, computer software and computer hardware used to monitor and automate industrial machinery, namely, probe stations for on-wafer testing of integrated circuits and semiconductors
