In probe heads making a large number of contacts to a device under test using flexible probes, the actual overtravel can differ from the programmed overtravel because of the total contact force from all the probes. Thus it is often important to measure the actual overtravel instead of relying on the programmed overtravel and the actual overtravel being the same. Here we provide improved sensing of actual overtravel using capacitive distance sensors that are calibrated to account for the effect of the device under test on capacitive distance measurements.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
G01R 35/00 - Testing or calibrating of apparatus covered by the other groups of this subclass
G01B 21/04 - Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
G01N 29/265 - Arrangements for orientation or scanning by moving the sensor relative to a stationary material
2.
Probe card with calibrated probe head capacitive distance monitor
In probe heads making a large number of contacts to a device under test using flexible probes, the actual overtravel can differ from the programmed overtravel because of the total contact force from all the probes. Thus it is often important to measure the actual overtravel instead of relying on the programmed overtravel and the actual overtravel being the same. Here we provide improved sensing of actual overtravel using capacitive distance sensors that are calibrated to account for the effect of the device under test on capacitive distance measurements.
09 - Scientific and electric apparatus and instruments
Goods & Services
Recorded computer software for providing supervisory control and data acquisition (SCADA) of cryogenic systems and equipment; Downloadable computer software for providing supervisory control and data acquisition (SCADA) of cryogenic systems and equipment; Recorded computer software for controlling and monitoring operation, data storage and acquisition, and user access of cryogenic systems and equipment; Downloadable computer software for controlling and monitoring operation, data storage and acquisition, and user access of cryogenic systems and equipment
Improved electrical connections to a probe head are provided by making electrical connections to a flexible circuit connected to the probes. Preferably these connections are solderless and made with a single ganged unit. Many advantages result compared to conventional approaches of making soldered connections to a flexible circuit, or coupling the flexible circuit to a printed circuit board (PCB) and making the connections from the PCB using semi-rigid coaxial cables.
G01R 31/36 - Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
Optoelectronic probe cards, optoelectronic testers, and related methods. The optoelectronic probe cards are configured for optical and electrical communication with a device under test (DUT) on a device substrate that includes a plurality of DUTs and includes an optical probe assembly and an electrical probe assembly. The optical probe assembly includes a plurality of lensed optical probes configured for non-contact optical communication with at least one optoelectronic device of the DUT. The electrical probe assembly includes a plurality of electrical probes configured for electrical communication with the DUT via electrical contact between the plurality of electrical probes and a plurality of contact pads of the DUT. The optoelectronic testers include a chuck, the optoelectronic probe card, an optical signal generation and analysis assembly, and an electrical signal generation and analysis assembly. The methods include actively and/or passively aligning components of the optoelectronic probe card with corresponding components of the DUT.
Probe supports, probe assemblies that include the probe supports, probe systems that include the probe assemblies, and related methods. The probe assemblies include the probe support, a probe support mounting structure, and a probe. The probe support may include an elongate support body that extends between a support mount and a probe mount. The probe support also may include a deformation measurement structure configured to generate a deformation output indicative of deformation of the elongate support body. The probe support mounting structure may be operatively attached to the support mount. The probe may be operatively attached to the probe mount. The probe systems include a chuck, a signal generation and analysis assembly, and the probe assembly. The methods control the operation of a probe system based, at least in part, on a deformation output.
G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
8.
OPTOELECTRONIC PROBE CARDS, OPTOELECTRONIC TESTERS, AND RELATED METHODS
Optoelectronic probe cards, optoelectronic testers, and related methods. The optoelectronic probe cards are configured for optical and electrical communication with a device under test (DUT) on a device substrate that includes a plurality of DUTs and includes an optical probe assembly and an electrical probe assembly. The optical probe assembly includes a plurality of lensed optical probes configured for non-contact optical communication with at least one optoelectronic device of the DUT. The electrical probe assembly includes a plurality of electrical probes configured for electrical communication with the DUT via electrical contact between the plurality of electrical probes and a plurality of contact pads of the DUT. The optoelectronic testers include a chuck, the optoelectronic probe card, an optical signal generation and analysis assembly, and an electrical signal generation and analysis assembly. The methods include actively and/or passively aligning components of the optoelectronic probe card with corresponding components of the DUT.
Probe supports, probe assemblies that include the probe supports, probe systems that include the probe assemblies, and related methods. The probe assemblies include the probe support, a probe support mounting structure, and a probe. The probe support may include an elongate support body that extends between a support mount and a probe mount. The probe support also may include a deformation measurement structure configured to generate a deformation output indicative of deformation of the elongate support body. The probe support mounting structure may be operatively attached to the support mount. The probe may be operatively attached to the probe mount. The probe systems include a chuck, a signal generation and analysis assembly, and the probe assembly. The methods control the operation of a probe system based, at least in part, on a deformation output.
Optical detection structures, probe systems that include the optical detection structures, and related methods are disclosed herein. The optical detection structures include a laser light source, an optical directional coupler, an optical detector, an optical fiber, and a lens assembly. The probe systems include a probe assembly, a chuck, and the optical detection structures. The methods include methods of determining when an objective lens of a lens assembly of an optical detection structure is positioned an objective focal length from a substrate surface of a substrate. The methods of mapping a surface topography of a substrate surface of a substrate.
Optical detection structures, probe systems that include the optical detection structures, and related methods are disclosed herein. The optical detection structures include a laser light source, an optical directional coupler, an optical detector, an optical fiber, and a lens assembly. The probe systems include a probe assembly, a chuck, and the optical detection structures. The methods include methods of determining when an objective lens of a lens assembly of an optical detection structure is positioned an objective focal length from a substrate surface of a substrate. The methods of mapping a surface topography of a substrate surface of a substrate.
G02B 21/36 - Microscopes arranged for photographic purposes or projection purposes
12.
OPTICAL CALIBRATION STRUCTURES FOR OPTICAL PROBES, OPTICAL PROBE SYSTEMS THAT INCLUDE THE OPTICAL CALIBRATION STRUCTURES, AND METHODS OF CALIBRATING A PLURALITY OF OPTICAL PROBES
Optical calibration structures for optical probes, optical probe systems that include the optical calibration structures, and methods of calibrating a plurality of optical probes. The optical calibration structures include a reflector, an obstructive structure, and an optical detector. The optical probe systems include the optical calibration structure, a chuck, an optical assembly, and a signal generation and analysis assembly. The methods include methods of operating the optical probe systems and/or methods of utilizing the optical calibration structures.
G01N 21/01 - Arrangements or apparatus for facilitating the optical investigation
G01N 21/84 - Systems specially adapted for particular applications
13.
MEASUREMENT MODULE ADAPTERS, PROBE ASSEMBLIES THAT INCLUDE THE MEASUREMENT MODULE ADAPTERS, PROBE SYSTEMS THAT INCLUDE THE PROBE ASSEMBLIES, AND RELATED METHODS
Measurement module adapters, probe assemblies that include the measurement module adapters, probe systems that include the probe assemblies, and related methods are disclosed herein. The measurement module adapters are configured to operatively attach a measurement module and a probe arm to a manipulator of a probe system and include an adapter plate, a bracket assembly, a plurality of inserts, and a probe arm mount. The probe assemblies include a manipulator, a measurement module adapter, a probe arm, a probe, and a measurement module. The probe systems include a chuck, a manipulator mounting surface, and a probe assembly. The methods include methods of utilizing a probe system that includes a measurement module adapter.
OPTICAL CALIBRATION STRUCTURES FOR OPTICAL PROBES, OPTICAL PROBE SYSTEMS THAT INCLUDE THE OPTICAL CALIBRATION STRUCTURES, AND METHODS OF CALIBRATING A PLURALITY OF OPTICAL PROBES
Optical calibration structures for optical probes, optical probe systems that include the optical calibration structures, and methods of calibrating a plurality of optical probes. The optical calibration structures include a reflector, an obstructive structure, and an optical detector. The optical probe systems include the optical calibration structure, a chuck, an optical assembly, and a signal generation and analysis assembly. The methods include methods of operating the optical probe systems and/or methods of utilizing the optical calibration structures.
Vibration isolation layers, measurement systems that include the vibration isolation layers, and related methods are disclosed herein. The vibration isolation layers include a platform and a plurality of vibration isolation mechanisms positioned to support the platform relative to a mounting region that supports the vibration isolation layer. The platform may define an upper surface configured to support a supported assembly that includes at least one of a probe station and a loader. The platform may define a recess sized to receive at least a region of the probe station and/or the loader. The recess may extend into the platform. The plurality of vibration isolation mechanisms may be positioned to support the platform relative to a mounting region that supports the vibration isolation layer and/or may be configured to permit relative motion between the platform and the mounting region to vibrationally isolate the platform from the mounting region.
F16F 15/00 - Suppression of vibrations in systemsMeans or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
F16F 15/027 - Suppression of vibrations of non-rotating, e.g. reciprocating, systemsSuppression of vibrations of rotating systems by use of members not moving with the rotating system using fluid means comprising control arrangements
G01N 21/95 - Investigating the presence of flaws, defects or contamination characterised by the material or shape of the object to be examined
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
16.
MEASUREMENT MODULE ADAPTERS, AND PROBE ASSEMBLIES, SYSTEMS AND METHODS INCORPORATING SAME
Measurement module adapters, probe assemblies that include the measurement module adapters, probe systems that include the probe assemblies, and related methods are disclosed herein. The measurement module adapters are configured to operatively attach a measurement module and a probe arm to a manipulator of a probe system and include an adapter plate, a bracket assembly, a plurality of inserts, and a probe arm mount. The probe assemblies include a manipulator, a measurement module adapter, a probe arm, a probe, and a measurement module. The probe systems include a chuck, a manipulator mounting surface, and a probe assembly. The methods include methods of utilizing a probe system that includes a measurement module adapter.
WAFER-HANDLING END EFFECTORS CONFIGURED TO SELECTIVELY ENGAGE A WAFER VIA A PRESSURE FORCE AND TO SELECTIVELY GRIP THE WAFER VIA A VACUUM FORCE, WAFER-HANDLING UNITS THAT INCLUDE THE WAFER-HANDLING END EFFECTORS, SYSTEMS THAT INCLUDE THE WAFER-HANDLING UNITS, AND METHODS OF UTILIZING WAFER-HANDLING END EFFECTORS
Wafer-handling end effectors configured to selectively engage a wafer via a pressure force and to selectively grip the wafer via a vacuum force, wafer-handling units that include the wafer-handling end effectors, systems that include the wafer-handling units, and methods of utilizing wafer-handling end effectors. The end effectors include a blade that defines a blade vacuum force retention side and an opposed blade pressure force retention side, a gas distribution manifold that extends at least partially within the blade and is in fluid communication with the blade pressure force retention side, and a vacuum distribution manifold that extends at least partially within the blade, is fluidically isolated from the gas distribution manifold within the blade, and is in fluid communication with the blade vacuum force retention side.
B25J 15/06 - Gripping heads with vacuum or magnetic holding means
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
18.
LENS ARRAYS, FIBER OPTIC FIXTURES THAT INCLUDE THE LENS ARRAYS, PROBE SYSTEMS THAT INCLUDE THE FIBER OPTIC FIXTURES, AND METHODS OF FORMING FIBER OPTIC FIXTURES
Lens arrays, fiber optic fixtures that include the lens arrays, probe systems that include the fiber optic fixtures, and methods of forming fiber optic fixtures are disclosed herein. The lens arrays are configured to convey a plurality of electromagnetic signals between a plurality of fiber optic conduits of a fiber optic fixture and a plurality of optical devices of a device under test (DUT). The lens arrays include a single lens block that defines a fixture-attached block side and a lensed block side. The fixture-attached block side is configured to face toward, and be operatively attached to, a fixture body of the fiber optic fixture. The lensed block side differs from the fixture-attached block side. The lens arrays also include a plurality of lenses defined on the lensed block side.
G02B 6/42 - Coupling light guides with opto-electronic elements
19.
LENS ARRAYS, FIBER OPTIC FIXTURES THAT INCLUDE THE LENS ARRAYS, PROBE SYSTEMS THAT INCLUDE THE FIBER OPTIC FIXTURES, AND METHODS OF FORMING FIBER OPTIC FIXTURES
Lens arrays, fiber optic fixtures that include the lens arrays, probe systems that include the fiber optic fixtures, and methods of forming fiber optic fixtures are disclosed herein. The lens arrays are configured to convey a plurality of electromagnetic signals between a plurality of fiber optic conduits of a fiber optic fixture and a plurality of optical devices of a device under test (DUT). The lens arrays include a single lens block that defines a fixture-attached block side and a lensed block side. The fixture-attached block side is configured to face toward, and be operatively attached to, a fixture body of the fiber optic fixture. The lensed block side differs from the fixture-attached block side. The lens arrays also include a plurality of lenses defined on the lensed block side.
Probes, probe blades, tools for probe blades, blade holders, and probe systems for electrically testing a device under test (DUT). In some examples, the probe blades are configured to provide a Kelvin electrical connection with the DUT. In some examples, the probe blades include an alignment structure configured to engage with a blade holder when the probe blade is received within a blade-receiving region of the blade holder. The blade holders are configured to separably and operatively attach a probe blade to a probe system. In some examples, the blade holders include the probe blade. The probe systems are configured to electrically test the DUT and include the blade holder.
Improved heat dissipation in probe heads for testing electrical devices is provided by the use of liquid cooled heat exchanger elements combined with heat conduction features that pass vertically through the printed circuit board of the probe head. In cases where the heat exchanger element (s) are disposed on the DUT-side of the probe head, the heat conduction features are pipes for liquid flow to and from the heat exchanger element (s). In cases where the heat exchanger element (s) are disposed on the top side of the probe head (e.g.,on the stiffener), the heat conduction features are solid thermal conduction members configured to increase thermal conduction from the DUT side of the probe head to the top side.The heat exchanger elements can be separate parts, or they can be integrated with probe head components such as the stiffener or the mounting ring.
G01R 1/04 - HousingsSupporting membersArrangements of terminals
H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01L 23/24 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel, at the normal operating temperature of the device
22.
Probe head having features to facilitate cooling with liquid-cooled heat exchanger
Improved heat dissipation in probe heads for testing electrical devices is provided by the use of liquid cooled heat exchanger elements combined with heat conduction features that pass vertically through the printed circuit board of the probe head. In cases where the heat exchanger element(s) are disposed on the DUT-side of the probe head, the heat conduction features are pipes for liquid flow to and from the heat exchanger element(s). In cases where the heat exchanger element(s) are disposed on the top side of the probe head (e.g., on the stiffener), the heat conduction features are solid thermal conduction members configured to increase thermal conduction from the DUT side of the probe head to the top side. The heat exchanger elements can be separate parts, or they can be integrated with probe head components such as the stiffener or the mounting ring.
09 - Scientific and electric apparatus and instruments
Goods & Services
Probes for testing semiconductors; Probes for testing integrated circuits
24.
WAFER-HANDLING END EFFECTORS CONFIGURED TO SELECTIVELY LIFT A WAFER FROM AN UPPER SURFACE OF THE WAFER, PROBE SYSTEMS THAT INCLUDE THE WAFER-HANDLING END EFFECTORS, AND METHODS OF UTILIZING THE WAFER-HANDLING END EFFECTORS
Wafer-handling end effectors, probe systems that include wafer-handling end effectors, and methods of utilizing wafer-handling end effectors are disclosed herein. The wafer-handling end effectors are configured to selectively lift a wafer from an upper surface thereof and include a blade, a surface extension, and an attachment mechanism. The blade defines a wafer-facing blade side and includes a gas distribution manifold in fluid communication with the wafer-facing blade side. The surface extension defines a wafer-facing extension side that extends away from the blade. The surface extension extends at least partially around the wafer-facing blade side and includes at least three projecting regions that project from the wafer-facing extension side and are configured to physically contact the upper surface of the wafer. The attachment mechanism is configured to permit selective attachment of the surface extension to the blade and selective separation of the surface extension from the blade.
Passive electrical components (e.g., capacitors) are vertically embedded in the printed circuit board of the probe head. The resulting configuration ensures the components are close to their corresponding probes by making use of the component real estate of the printed circuit board, and by having relatively short vertical connections to the probes (via the space transformer). As a result, improved compensation of probe inductance is provided for probe arrays.
Guide plates for vertical probe heads include flexure elements that provide a defined flexibility for otherwise rigid guide plates. Such flexibility can be vertical or lateral. This concept allows several disadvantages of conventional probe heads to be alleviated. For example, a vertically flexible upper guide plate can be used to alleviate issues relating to dropped probes. A vertically flexible lower guide plate can be adjusted in operation to expose more probe length as probes wear in operation.
Passive electrical components ( e.g., capacitors ) are vertically embedded in the printed circuit board of the probe head. The resulting configuration ensures the components are close to their corresponding probes by making use of the component real estate of the printed circuit board, and by having relatively short vertical connections to the probes (via the space transformer). As a result, improved compensation of probe inductance is provided for probe arrays.
Guide plates for vertical probe heads include flexure elements that provide a defined flexibility for otherwise rigid guide plates. Such flexibility can be vertical or lateral. This concept allows several disadvantages of conventional probe heads to be alleviated. For example, a vertically flexible upper guide plate can be used to alleviate issues relating to dropped probes. A vertically flexible lower guide plate can be adjusted in operation to expose more probe length as probes wear in operation.
Probe systems and methods of operating probe systems. The probe systems include a chuck that defines a support surface. The probe systems also include a cover plate. The probe systems further include a probe positioner that includes a positioner base, a manipulator that extends from the positioner base, and a probe arm that extends from the manipulator. The probe systems also include a probe operatively attached to the probe arm and a positioner attachment structure that separably attaches the positioner base to the cover plate. The positioner attachment structure includes an attachment structure body that defines a positioner base-facing side and a cover plate-facing side. The positioner attachment structure also includes an adhesive material that adheres the positioner base-facing side to the positioner base. The cover plate-facing side of the attachment structure body defines a micropatterned dry adhesive that separably attaches the attachment structure body to the cover plate.
Probes, probe blades, tools for probe blades, blade holders, and probe systems for electrically testing a device under test (DUT). In some examples, the probe blades are configured to provide a Kelvin electrical connection with the DUT. In some examples, the probe blades include an alignment structure configured to engage with a blade holder when the probe blade is received within a blade-receiving region of the blade holder. The blade holders are configured to separably and operatively attach a probe blade to a probe system. In some examples, the blade holders include the probe blade. The probe systems are configured to electrically test the DUT and include the blade holder.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
31.
PROBES, PROBE BLADES, TOOLS FOR PROBE BLADES, BLADE HOLDERS, AND PROBE SYSTEMS FOR ELECTRICALLY TESTING A DEVICE UNDER TEST
Probes, probe blades, tools for probe blades, blade holders, and probe systems for electrically testing a device under test (DUT). In some examples, the probe blades are configured to provide a Kelvin electrical connection with the DUT. In some examples, the probe blades include an alignment structure configured to engage with a blade holder when the probe blade is received within a blade -receiving region of the blade holder. The blade holders are configured to separably and operatively attach a probe blade to a probe system. In some examples, the blade holders include the probe blade. The probe systems are configured to electrically test the DUT and include the blade holder.
Space transformers configured to be utilized in a probe system to facilitate electrical communication with a device under test (DUT), probe systems that include the space transformers, and related methods are disclosed herein. The space transformers include a dielectric body, a plurality of first electrical contacts supported by the dielectric body, and a plurality of second electrical contacts supported by the dielectric body. The space transformers also include an electrically conductive radio frequency (RF) signal-modifying trace. The space transformers further include an RF electrical signal-modifying structure in electrical communication with the electrically conductive RF signal-modifying trace. The RF electrical signal-modifying structure is configured to receive the RF electrical signal from an input region of the electrically conductive RF signal-modifying trace and to discharge a modified RF electrical signal to an output region of the electrically conductive RF signal-modifying trace. The RF electrical signal-modifying structure includes a coupler.
Space transformers configured to be utilized in a probe system to facilitate electrical communication with a device under test (DUT), probe systems that include the space transformers, and related methods are disclosed herein. The space transformers include a dielectric body, a plurality of first electrical contacts supported by the dielectric body, and a plurality of second electrical contacts supported by the dielectric body. The space transformers also include an electrically conductive radio frequency (RF) signal-modifying trace. The space transformers further include an RF electrical signal-modifying structure in electrical communication with the electrically conductive RF signal-modifying trace. The RF electrical signal-modifying structure is configured to receive the RF electrical signal from an input region of the electrically conductive RF signal-modifying trace and to discharge a modified RF electrical signal to an output region of the electrically conductive RF signal-modifying trace. The RF electrical signal-modifying structure includes a coupler.
G01R 29/08 - Measuring electromagnetic field characteristics
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
34.
FLEXIBLE, RADIO-FREQUENCY TRANSITIONS AND ELECTRONIC SYSTEMS THAT INCLUDE THE FLEXIBLE, RADIO-FREQUENCY TRANSITIONS
Flexible, radio-frequency transitions and electronic systems that include the flexible, radio-frequency transitions are disclosed herein. The flexible, radio-frequency transitions are configured to electrically interconnect a first electronic component and a second electronic component to facilitate radio-frequency electrical communication therebetween and include a flexible dielectric membrane and a microstrip transmission line. The microstrip transmission line is formed on the flexible dielectric membrane and includes an electrically conductive signal trace and an electrically conductive ground plane for the electrically conductive signal trace. The transition is configured to electrically interconnect the first electronic component and the second electronic component, and to permit radio-frequency electrical communication therebetween, throughout a range of transition angles. The electronic systems utilize radio-frequency communication and include the first electronic component, the second electronic component, and the transitions.
H01Q 13/20 - Non-resonant leaky-waveguide or transmission-line antennas Equivalent structures causing radiation along the transmission path of a guided wave
H01Q 1/42 - Housings not intimately mechanically associated with radiating elements, e.g. radome
H01Q 13/26 - Surface waveguide constituted by a single conductor, e.g. strip conductor
35.
FLEXIBLE, RADIO-FREQUENCY TRANSITIONS AND ELECTRONIC SYSTEMS THAT INCLUDE THE FLEXIBLE, RADIO-FREQUENCY TRANSITIONS
Flexible, radio-frequency transitions and electronic systems that include the flexible, radio-frequency transitions are disclosed herein. The flexible, radio-frequency transitions are configured to electrically interconnect a first electronic component and a second electronic component to facilitate radio-frequency electrical communication therebetween and include a flexible dielectric membrane and a microstrip transmission line. The microstrip transmission line is formed on the flexible dielectric membrane and includes an electrically conductive signal trace and an electrically conductive ground plane for the electrically conductive signal trace. The transition is configured to electrically interconnect the first electronic component and the second electronic component, and to permit radio-frequency electrical communication therebetween, throughout a range of transition angles. The electronic systems utilize radio-frequency communication and include the first electronic component, the second electronic component, and the transitions.
A roller mechanism with controlled height is used for probe tap-down in arrays of vertical probes for device testing. The height can be controlled using features of the roller, or external shims. This approach overcomes issues related to guide plate flexure during plate tap down by reducing forces on guide plates. It also avoids issues of probe damage from manual tap down.
09 - Scientific and electric apparatus and instruments
Goods & Services
Testing and inspecting apparatus and instruments; probe stations for testing and inspection of semiconductor wafers and semiconductors; testing apparatus for inspecting and testing semiconductor wafers; electrical and optical inspection apparatus for inspection of semiconductor wafers; electric apparatus and instruments for the examination of semiconductor wafers, namely, semiconductor wafer probe station apparatus and instruments.
38.
MEMS PROBES HAVING DECOUPLED ELECTRICAL AND MECHANICAL DESIGN
MEMS probes are provided having decoupled electrical and mechanical design. In these probes, electrical conduction is primarily through one or more electrically conductive rails, and mechanical compliance for vertical compression is provided by a coil. The resulting independence of electrical and mechanical design advantageously enables probes to have a combination of electrical and mechanical properties that cannot be obtained in probes where the probe body is subj ect to both electrical and mechanical design constraints.
MEMS probes are provided having decoupled electrical and mechanical design. In these probes, electrical conduction is primarily through one or more electrically conductive rails, and mechanical compliance for vertical compression is provided by a coil. The resulting independence of electrical and mechanical design advantageously enables probes to have a combination of electrical and mechanical properties that cannot be obtained in probes where the probe body is subject to both electrical and mechanical design constraints.
Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors
Wafer-handling end effectors, probe systems that include wafer-handling end effectors, and methods of utilizing wafer-handling end effectors are disclosed herein. The wafer-handling end effectors are configured to selectively lift a wafer from an upper surface thereof and include a blade, a surface extension, and an attachment mechanism. The blade defines a wafer-facing blade side and includes a gas distribution manifold in fluid communication with the wafer-facing blade side. The surface extension defines a wafer-facing extension side that extends away from the blade. The surface extension extends at least partially around the wafer-facing blade side and includes at least three projecting regions that project from the wafer-facing extension side and are configured to physically contact the upper surface of the wafer. The attachment mechanism is configured to permit selective attachment of the surface extension to the blade and selective separation of the surface extension from the blade.
B25J 15/06 - Gripping heads with vacuum or magnetic holding means
B25J 11/00 - Manipulators not otherwise provided for
41.
WAFER-HANDLING END EFFECTORS CONFIGURED TO SELECTIVELY LIFT A WAFER FROM AN UPPER SURFACE OF THE WAFER, PROBE SYSTEMS THAT INCLUDE THE WAFER-HANDLING END EFFECTORS, AND METHODS OF UTILIZING THE WAFER-HANDLING END EFFECTORS
Wafer-handling end effectors, probe systems that include wafer-handling end effectors, and methods of utilizing wafer-handling end effectors are disclosed herein. The wafer-handling end effectors are configured to selectively lift a wafer from an upper surface thereof and include a blade, a surface extension, and an attachment mechanism. The blade defines a wafer-facing blade side and includes a gas distribution manifold in fluid communication with the wafer-facing blade side. The surface extension defines a wafer-facing extension side that extends away from the blade. The surface extension extends at least partially around the wafer-facing blade side and includes at least three projecting regions that project from the wafer-facing extension side and are configured to physically contact the upper surface of the wafer. The attachment mechanism is configured to permit selective attachment of the surface extension to the blade and selective separation of the surface extension from the blade.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B25J 15/06 - Gripping heads with vacuum or magnetic holding means
Methods of establishing contact between a probe tip of a probe system and a device under test, probe systems that perform the methods, and storage media that directs probe systems to perform the methods. The methods include measuring a height differential between a DUT surface of the DUT and an auxiliary surface of an auxiliary chuck and aligning the probe tip and the auxiliary chuck for contact with one another. The methods also include physically contacting the probe tip with the auxiliary surface to determine an auxiliary contact height between the probe tip and the auxiliary surface and determining a DUT contact height between the probe tip and the DUT surface. The methods further include aligning the probe tip and the DUT for contact with one another and moving the probe tip to the DUT contact height to physically contact the probe tip with the DUT surface.
G01B 7/14 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring distance or clearance between spaced objects or spaced apertures
G01C 5/00 - Measuring heightMeasuring distances transverse to line of sightLevelling between separated pointsSurveyors' levels
G01R 31/26 - Testing of individual semiconductor devices
43.
Methods of establishing contact between a probe tip of a probe system and a device under test, probe systems that perform the methods, and storage media that directs probe systems to perform the methods
Methods of establishing contact between a probe tip of a probe system and a device under test, probe systems that perform the methods, and storage media that directs probe systems to perform the methods. The methods include measuring a height differential between a DUT surface of the DUT and an auxiliary surface of an auxiliary chuck and aligning the probe tip and the auxiliary chuck for contact with one another. The methods also include physically contacting the probe tip with the auxiliary surface to determine an auxiliary contact height between the probe tip and the auxiliary surface and determining a DUT contact height between the probe tip and the DUT surface. The methods further include aligning the probe tip and the DUT for contact with one another and moving the probe tip to the DUT contact height to physically contact the probe tip with the DUT surface.
Remote control devices for probe systems, probe systems that include the remote control devices, and methods of remotely operating a motorized positioner of a probe system
Remote control devices for motorized positioners of probe systems, probe systems that include the remote control devices, and methods of remotely operating a motorized positioner of a probe system are disclosed herein. The remote control devices include a first rotary encoder, a second rotary encoder, a third rotary encoder, and a remote processing device. The probe systems include a chuck, a signal generation and analysis assembly, a probe, a motorized positioner, a local processing device, and the remote control device. The methods include generating a control signal utilizing the remote control device and transmitting the control signal to the probe system. The methods also include translating a probe of the probe system relative to a support surface of the probe system. The translating is based, at least in part, on the control signal.
09 - Scientific and electric apparatus and instruments
Goods & Services
Probe stations for testing and inspection of semiconductor wafers and semiconductors; testing apparatus for inspecting and testing semiconductor wafers; electrical and optical inspection apparatus for inspection of semiconductor wafers; electric apparatus and instruments for the examination of semiconductor wafers, namely, semiconductor wafer probe station apparatus and instruments
Improved performance for attenuated testing when probing a device under test with a probe array is provided. By moving the attenuation components from their conventional location on the printed circuit board of the probe head to the space transformer of the probe head, electrical path lengths can be decreased, thereby improving performance. This is particularly helpful in connection with loopback testing.
Improved performance for attenuated testing when probing a device under test with a probe array is provided. By moving the attenuation components from their conventional location on the printed circuit board of the probe head to the space transformer of the probe head, electrical path lengths can be decreased, thereby improving performance. This is particularly helpful in connection with loopback testing.
Improved serial communication is provided in a system where each node regenerates data and transmits it to at least one other node in the system. Pulse width modulation (PWM) is used to encode the data. Preferably, all pulse shapes of the PWM start with a synchronization feature. It is also preferred that the regeneration delay in each node be less than the system clock period.
Improved serial communication is provided in a system where each node regenerates data and transmits it to at least one other node in the system. Pulse width modulation (PWM) is used to encode the data. Preferably, all pulse shapes of the PWM start with a synchronization feature. It is also preferred that the regeneration delay in each node be less than the system clock period.
H04L 25/49 - Transmitting circuitsReceiving circuits using code conversion at the transmitterTransmitting circuitsReceiving circuits using predistortionTransmitting circuitsReceiving circuits using insertion of idle bits for obtaining a desired frequency spectrumTransmitting circuitsReceiving circuits using three or more amplitude levels
H04L 7/027 - Speed or phase control by the received code signals, the signals containing no special synchronisation information extracting the synchronising or clock signal from the received signal spectrum, e.g. by using a resonant or bandpass circuit
50.
VERTICAL PROBE ARRAY HAVING SLIDING CONTACTS IN ELASTIC GUIDE PLATE
A probe array having decoupled electrical and mechanical design constraints on the probes is provided. Each probe is a two-part structure with the two parts able to stay in electrical contact with each other as the parts slide up and down with respect to each other. The probes are disposed in through holes of an elastic matrix, each probe having its corresponding hole. The probes engage with the elastic matrix such that a restoring force in response to vertical probe compression is provided by the elastic matrix. With this approach, electrical and mechanical design are much more decoupled than in conventional spring probe design. The elastic matrix provides the mechanical compliance and restoring force, while the parts of the probe determine its current carrying capacity and electrical bandwidth.
A probe array having decoupled electrical and mechanical design constraints on the probes is provided. Each probe is a two-part structure with the two parts able to stay in electrical contact with each other as the parts slide up and down with respect to each other. The probes are disposed in through holes of an elastic matrix, each probe having its corresponding hole. The probes engage with the elastic matrix such that a restoring force in response to vertical probe compression is provided by the elastic matrix. With this approach, electrical and mechanical design are much more decoupled than in conventional spring probe design. The elastic matrix provides the mechanical compliance and restoring force, while the parts of the probe determine its current carrying capacity and electrical bandwidth.
Probes that define retroreflectors, probe systems that include the probes, and methods of utilizing the probes. The probes include the retroreflector, which is defined by a retroreflector body. The retroreflector body includes a first side, an opposed second side, a tapered region that extends from the first side, and a light-receiving region that is defined on the second side. The probes also include a probe tip, which is configured to provide a test signal to a device under test (DUT) and/or to receive a resultant signal from the DUT. The retroreflector is configured to receive light, via the light-receiving region, at a light angle of incidence. The retroreflector also is configured to emit at least an emitted fraction of the light, from the retroreflector body and via the light-receiving region, at a light angle of emission that is at least substantially equal to the light angle of incidence.
Probes that define retroreflectors, probe systems that include the probes, and methods of utilizing the probes. The probes include the retroreflector, which is defined by a retroreflector body. The retroreflector body includes a first side, an opposed second side, a tapered region that extends from the first side, and a light-receiving region that is defined on the second side. The probes also include a probe tip, which is configured to provide a test signal to a device under test (DUT) and/or to receive a resultant signal from the DUT. The retroreflector is configured to receive light, via the light-receiving region, at a light angle of incidence. The retroreflector also is configured to emit at least an emitted fraction of the light, from the retroreflector body and via the light-receiving region, at a light angle of emission that is at least substantially equal to the light angle of incidence.
Improved heat sinking of electronic and/or photonic integrated circuit chips is provided by including thermal- only contacts on unused parts of the chip. The resulting chip can be bonded to a cold plate with a process that ensures that only the thermal contacts of the chip touch the cold plate, thereby avoiding problems caused by the cold plate creating electrical shorts of the chip. For example, the thermal contacts can be higher features than any electrical features on that side of the chip. This approach is expected to be especially useful for applications requiring low temperature operation ( e. g., operation at 100K or less, preferably operation at 10 K or less ).
Improved heat sinking of electronic and/or photonic integrated circuit chips is provided by including thermal-only contacts on unused parts of the chip. The resulting chip can be bonded to a cold plate with a process that ensures that only the thermal contacts of the chip touch the cold plate, thereby avoiding problems caused by the cold plate creating electrical shorts of the chip. For example, the thermal contacts can be higher features than any electrical features on that side of the chip. This approach is expected to be especially useful for applications requiring low temperature operation (e.g., operation at 100K or less, preferably operation at 10 K or less).
H01L 23/367 - Cooling facilitated by shape of device
H01L 23/433 - Auxiliary members characterised by their shape, e.g. pistons
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/00 - Details of semiconductor or other solid state devices
A modular probe array for making temporary electrical contact to devices under test is provided. The probe array includes multiple probe heads each having a substrate disposed within a mounting block. Improved thermal cycling performance is obtained by using an O-ring between the substrate and the mounting block. Optionally, set screws can be used in combination with the O-ring to set the position of the substrate in its mounting block.
A modular probe array for making temporary electrical contact to devices under test is provided. The probe array includes multiple probe heads each having a substrate disposed within a mounting block. Improved thermal cycling performance is obtained by using an O-ring between the substrate and the mounting block. Optionally, set screws can be used in combination with the O-ring to set the position of the substrate in its mounting block.
Probe systems configured to test a device under test and methods of operating the probe systems are disclosed herein. The probe systems include an electromagnetically shielded enclosure, which defines an enclosed volume, and a temperature-controlled chuck, which defines a support surface configured to support a substrate that includes the DUT. The probe systems also include a probe assembly and an optical microscope. The probe systems further include an electromagnet and an electronically controlled positioning assembly. The electronically controlled positioning assembly includes a two-dimensional positioning stage, which is configured to selectively position a positioned assembly along a first two- dimensional positioning axis and also along a second two-dimensional positioning axis. The electronically controlled positioning assembly also includes a first one-dimensional positioning stage that operatively attaches the optical microscope to the positioned assembly and a second one-dimensional positioning stage that operatively attaches the electromagnet to the positioning assembly.
Probe systems configured to test a device under test and methods of operating the probe systems are disclosed herein. The probe systems include an electromagnetically shielded enclosure, which defines an enclosed volume, and a temperature-controlled chuck, which defines a support surface configured to support a substrate that includes the DUT. The probe systems also include a probe assembly and an optical microscope. The probe systems further include an electromagnet and an electronically controlled positioning assembly. The electronically controlled positioning assembly includes a two-dimensional positioning stage, which is configured to selectively position a positioned assembly along a first two-dimensional positioning axis and also along a second two-dimensional positioning axis. The electronically controlled positioning assembly also includes a first one-dimensional positioning stage that operatively attaches the optical microscope to the positioned assembly and a second one-dimensional positioning stage that operatively attaches the electromagnet to the positioning assembly.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
Vertical probe arrays having angled guide plates are provided. With this configuration, the probes can be straight conductors (when mechanically undeformed) and the mechanical bias provided by the angled guide plates can ensure the probes have a well-defined deformation when the probe array make contact to the device under test. This allows the use of straight conductors as probes without suffering from probe shorting and mechanical interference caused by straight probes buckling in unpredictable directions when vertically compressed.
Vertical transmission line probes having alternating capacitive and inductive sections are provided. These alternating sections can be designed to provide a desired transmission line impedance (e.g., between 10 and 100 Ohms, preferably 50 Ohms). Probe flexure in operation is mainly in the inductive sections, advantageously reducing flexure stresses on the dielectrics in the capacitive sections.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
Vertical transmission line probes having alternating capacitive and inductive sections are provided. These alternating sections can be designed to provide a desired transmission line impedance (e.g., between 10 and 100 Ohms, preferably 50 Ohms). Probe flexure in operation is mainly in the inductive sections, advantageously reducing flexure stresses on the dielectrics in the capacitive sections.
Methods of producing augmented probe system images and associated probe systems. A method of producing an augmented probe system image includes recording a base probe system image, generating the augmented probe system image at least partially based on the base probe system image, and presenting the augmented probe system image. The augmented probe system image includes a representation of at least a portion of the probe system that is obscured in the base probe system image. In some examples, a probe system includes a chuck, a probe assembly, an imaging device, and a controller programmed to perform methods disclosed herein.
G01R 13/40 - Arrangements for displaying electric variables or waveforms using modulation of a light beam otherwise than by mechanical displacement, e.g. by Kerr effect
G06F 3/01 - Input arrangements or combined input and output arrangements for interaction between user and computer
G06F 3/0484 - Interaction techniques based on graphical user interfaces [GUI] for the control of specific functions or operations, e.g. selecting or manipulating an object, an image or a displayed text element, setting a parameter value or selecting a range
G06T 19/00 - Manipulating 3D models or images for computer graphics
64.
3D electrical integration using component carrier edge connections to a 2D contact array
3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H01R 12/52 - Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
65.
Methods of producing augmented probe system images and associated probe systems
Methods of producing augmented probe system images and associated probe systems. A method of producing an augmented probe system image includes recording a base probe system image, generating the augmented probe system image at least partially based on the base probe system image, and presenting the augmented probe system image. The augmented probe system image includes a representation of at least a portion of the probe system that is obscured in the base probe system image. In some examples, a probe system includes a chuck, a probe assembly, an imaging device, and a controller programmed to perform methods disclosed herein.
3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.
H01L 21/04 - Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
Improved electrical testing of N-port beamforming devices is provided. For testing, an N:1 electrical network is connected to the N ports of the device under test to provide a single test port. This mode of testing can be used to determine parameters of interest (e.g., far field radiation patterns etc.) of the device under test more rapidly than with antenna range testing or with characterization of each port of the device under test. The N:1 electrical network can be passive or active. The N:1 electrical network can be integrated in a probe head to provide probe array testing of beamforming devices. Alternatively, the N:1 electrical network can be integrated with the device under test to provide onboard testing capability.
H04B 7/04 - Diversity systemsMulti-antenna systems, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
Improved electrical testing of N-port beamforming devices is provided. For testing, an N:1 electrical network is connected to the N ports of the device under test to provide a single test port. This mode of testing can be used to determine parameters of interest (e.g., far field radiation patterns etc.) of the device under test more rapidly than with antenna range testing or with characterization of each port of the device under test. The N:1 electrical network can be passive or active. The N:1 electrical network can be integrated in a probe head to provide probe array testing of beamforming devices. Alternatively, the N:1 electrical network can be integrated with the device under test to provide onboard testing capability.
H04B 7/06 - Diversity systemsMulti-antenna systems, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas at the transmitting station
69.
Double-sided probe systems with thermal control systems and related methods
Double-sided probe systems with thermal control systems and related methods. Thermally-controlled, double-sided probe systems include a probe assembly configured to test one or more devices under test (DUTs) of a substrate and a chuck configured to support the substrate. The probe assembly includes a thermal control system configured to at least partially control a substrate temperature of the substrate while the probe assembly tests the DUT(s). The chuck is configured to support the substrate such that the probe assembly has access to each of a first substrate side of the substrate and a second substrate side of the substrate while the substrate is operatively supported by the chuck. In some examples, methods of operating double-sided probe systems include regulating the substrate temperature with the thermal control system.
Double-sided probe systems with thermal control systems and related methods. Thermally-controlled, double-sided probe systems include a probe assembly configured to test one or more devices under test (DUTs) of a substrate and a chuck configured to support the substrate. The probe assembly includes a thermal control system configured to at least partially control a substrate temperature of the substrate while the probe assembly tests the DUT(s). The chuck is configured to support the substrate such that the probe assembly has access to each of a first substrate side of the substrate and a second substrate side of the substrate while the substrate is operatively supported by the chuck. In some examples, methods of operating double-sided probe systems include regulating the substrate temperature with the thermal control system.
Customizable probe cards, probe systems including the same, and related methods. A customizable probe card for testing one or more devices under test (DUTs) comprises a support structure, one or more probe assemblies supporting respective probes, and a probe repositioning assembly. The probe repositioning assembly is configured to facilitate selective adjustment of an orientation of at least one probe relative to the support structure. In examples, a probe system comprises a chuck for supporting a substrate that includes one or more DUTs, a customizable probe card, and a probe card holder. In examples, methods of reconfiguring a customizable probe card comprise utilizing a probe repositioning assembly to reposition the respective probe of at least one probe assembly.
Probe systems including imaging devices with objective lens isolators and related methods are disclosed herein. A probe system includes an enclosure with an enclosure volume for enclosing a substrate that includes one or more devices under test (DUTs), a testing assembly, and an imaging device. The imaging device includes an imaging device objective lens, an imaging device body, and an objective lens isolator. In examples, the probe system includes an electrical grounding assembly configured to restrict electromagnetic noise from entering the enclosure volume. In examples, methods of preparing the imaging device include assembling the imaging device such that the imaging device objective lens is at least partially electrically isolated from the imaging device body. In some examples, utilizing the probe system includes testing the one or more DUTs while restricting electrical noise from propagating from the imaging device to the substrate.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
G03B 17/00 - Details of cameras or camera bodiesAccessories therefor
73.
PROBE SYSTEMS AND METHODS FOR TESTING A DEVICE UNDER TEST
Probe systems and methods for testing a device under test are disclosed herein. The probe systems include an electrically conductive ground loop and a structure that is electrically connected to a ground potential via at least a region of the electrically conductive ground loop. The probe systems also include nonlinear circuitry. The nonlinear circuitry is configured to resist flow of electric current within the ground loop when a voltage differential across the nonlinear circuitry is less than a threshold voltage differential and permit flow of electric current within the ground loop when the voltage differential across the nonlinear circuitry is greater than the threshold voltage differential. The methods include positioning a device under test (DUT) within a probe system that includes an electrically conductive ground loop and nonlinear circuitry. The methods also include selectively resisting and permitting electric current flow within the ground loop and through the nonlinear circuitry.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
74.
Probe systems and methods for testing a device under test
Probe systems and methods for testing a device under test are disclosed herein. The probe systems include an electrically conductive ground loop and a structure that is electrically connected to a ground potential via at least a region of the electrically conductive ground loop. The probe systems also include nonlinear circuitry. The nonlinear circuitry is configured to resist flow of electric current within the ground loop when a voltage differential across the nonlinear circuitry is less than a threshold voltage differential and permit flow of electric current within the ground loop when the voltage differential across the nonlinear circuitry is greater than the threshold voltage differential. The methods include positioning a device under test (DUT) within a probe system that includes an electrically conductive ground loop and nonlinear circuitry. The methods also include selectively resisting and permitting electric current flow within the ground loop and through the nonlinear circuitry.
Probe systems including imaging devices with objective lens isolators and related methods are disclosed herein. A probe system includes an enclosure with an enclosure volume for enclosing a substrate that includes one or more devices under test (DUTs), a testing assembly, and an imaging device. The imaging device includes an imaging device objective lens, an imaging device body, and an objective lens isolator. In examples, the probe system includes an electrical grounding assembly configured to restrict electromagnetic noise from entering the enclosure volume. In examples, methods of preparing the imaging device include assembling the imaging device such that the imaging device objective lens is at least partially electrically isolated from the imaging device body. In some examples, utilizing the probe system includes testing the one or more DUTs while restricting electrical noise from propagating from the imaging device to the substrate.
G01R 31/308 - Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
G01R 31/319 - Tester hardware, i.e. output processing circuits
76.
Methods for maintaining gap spacing between an optical probe of a probe system and an optical device of a device under test, and probe systems that perform the methods
Methods for maintaining gap spacing between an optical probe of a probe system and an optical device of a device under test and probe systems that perform the methods. The methods include determining a desired relative orientation between the optical probe and the DUT and optically testing the optical device with the optical probe. The methods also include maintaining the desired relative orientation during the optically testing. The maintaining includes repeatedly and sequentially collecting an existing DUT image of a DUT reference structure of the DUT and an existing probe image of a probe reference structure of the optical probe, determining a probe-DUT offset between an existing relative orientation between the optical probe and the DUT and the desired relative orientation, and adjusting the relative orientation to return the optical probe and the DUT to the desired relative orientation.
Probe systems for optically probing a device under test (DUT) and methods of operating the probe systems. The probe systems include a probing assembly that includes an optical probe that defines a probe tip and a distance sensor. The probe systems also include a support surface configured to support a substrate, which defines a substrate surface and includes an optical device positioned below the substrate surface. The probe systems further include a positioning assembly configured to selectively regulate a relative orientation between the probing assembly and the DUT. The probe systems also include a controller programmed to control the operation of the probe systems. The methods include methods of operating the probe systems.
Probe systems and methods of characterizing optical coupling between an optical probe of a probe system and a calibration structure. The probe systems include a probe assembly that includes an optical probe, a support surface configured to support a substrate, and a signal generation and analysis assembly configured to generate an optical signal and to provide the optical signal to the optical device via the optical probe. The probe systems also include an electrically actuated positioning assembly, a calibration structure configured to receive the optical signal, and an optical detector configured to detect a signal intensity of the optical signal. The probe systems further include a controller programmed to control the probe system to generate a representation of signal intensity as a function of the relative orientation between the optical probe and the calibration structure. The methods include methods of operating the probe systems.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
79.
Calibration chucks for optical probe systems, optical probe systems including the calibration chucks, and methods of utilizing the optical probe systems
Calibration chucks for optical probe systems, optical probe systems including the calibration chucks, and methods of utilizing the optical probe systems. The calibration chucks include a calibration chuck body that defines a calibration chuck support surface. The calibration chucks also include at least one optical calibration structure that is supported by the calibration chuck body. The at least one optical calibration structure includes a horizontal viewing structure. The horizontal viewing structure is configured to facilitate viewing of a horizontally viewed region from a horizontal viewing direction that is at least substantially parallel to the calibration chuck support surface. The horizontal viewing structure also is configured to facilitate viewing of the horizontally viewed region via an imaging device of the optical probe system that is positioned vertically above the calibration chuck support surface.
G01N 21/27 - ColourSpectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands using photo-electric detection
G01B 11/02 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
G01R 31/308 - Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
G01R 35/00 - Testing or calibrating of apparatus covered by the other groups of this subclass
G01B 11/14 - Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
H01L 21/66 - Testing or measuring during manufacture or treatment
G01B 21/04 - Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
80.
Probe on carrier architecture for vertical probe arrays
A probe-on-carrier architecture is provided, where several vertical probes are disposed on each probe carrier and the probe carriers are affixed to the space transformer. Each vertical probe has two flexible members. The first flexible member makes electrical contact to the space transformer. The second flexible member makes temporary electrical contact to the device under test. A mechanical stiffener can be used to deal with the possible lack of flatness and thermal expansion of the space transformer. The mechanical stiffener can be affixed to the space transformer to bring the flatness and thermal expansion of the space transformer to within specifications. Alternatively, the mechanical stiffener can be affixed to the space transformer without trying to bring the flatness and thermal expansion of the space transformer to within specifications.
A probe-on-carrier architecture is provided, where several vertical probes are disposed on each probe carrier and the probe carriers are affixed to the space transformer. Each vertical probe has two flexible members. The first flexible member makes electrical contact to the space transformer. The second flexible member makes temporary electrical contact to the device under test. A mechanical stiffener can be used to deal with the possible lack of flatness and thermal expansion of the space transformer. The mechanical stiffener can be affixed to the space transformer to bring the flatness and thermal expansion of the space transformer to within specifications. Alternatively, the mechanical stiffener ca be affixed to the space transformer without trying to bring the flatness and thermal expansion of the space transformer to within specifications.
Microscopes with objective assembly crash detection and methods of utilizing the same are disclosed herein. For example, a microscope comprises a microscope body, an objective assembly comprising an objective lens, an objective assembly mount configured to separably attach the objective assembly to the microscope body, and an orientation detection circuit configured to indicate when a relative orientation between the microscope body and the objective assembly differs from a predetermined relative orientation.
Probe systems and methods for calibrating capacitive height sensing measurements. A probe system includes a probe assembly with a probe support body that supports a capacitive displacement sensor that terminates in a sensing tip relative to a substrate and that is configured to generate an uncalibrated capacitive height measurement. A method of utilizing the probe system to generate a calibrated capacitive height measurement includes receiving a height calibration structure architecture; calculating a layer impedance magnitude of each substrate layer of the height calibration structure; and calculating a total layer impedance magnitude of the height calibration structure. The method further includes measuring a measured impedance magnitude and calculating the calibrated capacitive height measurement.
G01B 7/06 - Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width, or thickness for measuring thickness
Probe systems and methods are disclosed herein. The methods include directly measuring a distance between a first manipulated assembly and a second manipulated assembly, contacting first and second probes with first and second contact locations, providing a test signal to an electrical structure, and receiving a resultant signal from the electrical structure. The methods further include characterizing at least one of a probe system and the electrical structure based upon the distance. In one embodiment, the probe systems include a measurement device configured to directly measure a distance between a first manipulated assembly and a second manipulated assembly. In another embodiment, the probe systems include a probe head assembly including a platen, a manipulator operatively attached to the platen, a vector network analyzer (VNA) extender operatively attached to the manipulator, and a probe operatively attached to the VNA extender.
G01R 31/01 - Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass productionTesting objects at points as they pass through a testing station
Probe systems and methods for collecting an optical image of a device under test (DUT) are disclosed herein. The probe systems include a chuck, a chuck thermal module, an enclosure, an imaging device, and a flow-regulating structure. The chuck defines a support surface configured to support a substrate and the chuck thermal module is configured to regulate a temperature of the chuck. The enclosure defines an enclosed volume, which contains the support surface of the chuck, and an aperture. The imaging device is at least partially external the enclosed volume and the enclosure and the imaging device defines a gap therebetween. The gap at least partially defines a fluid conduit that permits fluid flow between the enclosed volume and an external region. The flow-regulating structure is configured to regulate fluid flow through the fluid conduit. The methods include methods of utilizing the systems.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
86.
Electrical test probes having decoupled electrical and mechanical design
Probes for testing electrical circuits having decoupled electrical and mechanical design are provided. For example, a mechanically resilient core can be surrounded by an electrically conductive shell. In this way, electrical parameters of the probes are determined by the shells and mechanical parameters of the probes are determined by the cores. An important application of this approach is to provide impedance matched transmission line probes.
Probes for testing electrical circuits having decoupled electrical and mechanical design are provided. For example, a mechanically resilient core can be surrounded by an electrically conductive shell, In this way, electrical parameters of the probes are determined by the shells and mechanical parameters of the probes are determined by the cores, An important application of this approach is to provide impedance matched transmission line probes.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 31/02 - Testing of electric apparatus, lines, or components for short-circuits, discontinuities, leakage, or incorrect line connection
G01R 31/26 - Testing of individual semiconductor devices
88.
Methods of controlling the operation of probe stations and probe stations that perform the methods, the methods including generating and executing a test routine that directs the probe station to electrically test a test subset of a plurality of DUTs and to pre-test a pre-test subset of a plurality of DUTs, which is a subset of the test subset, with a pre-test
Methods of controlling the operation of probe stations and probe stations that perform the methods. The methods including generating a test routine by constructing a substrate map, receiving a test subset input from a user, and updating the substrate map to incorporate information regarding which devices under test (DUTS) of a plurality of DUTs are in a test subset of a plurality of DUTs. The methods also include receiving a pre-test subset input from the user, wherein the pre-test subset is a subset of the test subset, and updating the substrate map to incorporate information which DUTs of the test subset are in the pre-test subset. The methods further include executing the test routine by moving a probe assembly to each DUT in the test subset, selectively performing a pre-test routine on each DUT that is in the pre-test subset, and electrically testing each DUT in the test subset.
A skate on a tip of a probe for testing electrical devices is a reduced thickness probe tip contact. Such a skate can advantageously increase contact pressure, but it can also undesirably reduce probe lifetime due to rapid mechanical wear of the skate. Here multilayer skate probes are provided where the overall shape of the probe tip is a smooth curved surface, as opposed to the conventional fin-like skate configuration. The skate layer is the most mechanically wear-resistant layer in the structure, so abrasive processing of the probe tip leads to a probe skate defined by the skate layer. The resulting probes provide the advantage of increased contact pressure without the disadvantage of reduced lifetime.
A skate on a tip of a probe for testing electrical devices is a reduced thickness probe tip contact. Such a skate can advantageously increase contact pressure, but it can also undesirably reduce probe lifetime due to rapid mechanical wear of the skate. Here multilayer skate probes are provided where the overall shape of the probe tip is a smooth curved surface, as opposed to the conventional fin- like skate configuration. The skate layer is the most mechanically wear-resistant layer in the structure, so abrasive processing of the probe tip leads to a probe skate defined by the skate layer. The resulting probes provide the advantage of increased contact pressure without the disadvantage of reduced lifetime.
Probe systems and methods including electric contact detection. The probe systems include a probe assembly and a chuck. The probe systems also include a translation structure configured to operatively translate the probe assembly and/or the chuck and an instrumentation package configured to detect contact between the probe system and a device under test (DUT) and to test operation of the DUT. The instrumentation package includes a continuity detection circuit, a test circuit, and a translation structure control circuit. The continuity detection circuit is configured to detect electrical continuity between a first probe electrical conductor and a second probe electrical conductor. The test circuit is configured to electrically test the DUT. The translation structure control circuit is configured to control the operation of the translation structure. The methods include monitoring continuity between a first probe and a second probe and controlling the operation of a probe system based upon the monitoring.
Probes with fiducial targets, probe systems including the same, and associated methods. The probes include a probe body, a probe beam, a probe tip configured to contact a device under test (DUT), and a fiducial target affixed to the probe beam. The fiducial target is configured to be visible to an optical system to determine a position of the probe tip relative to the DUT. The methods include methods of utilizing and/or manufacturing the probes.
Probes are connected to the space transformer via multiple carrier plates. Electrical contacts from the probes to the space transformer are by way of spring tail features on the probes that connect to the space transformer and not to the carrier plates. In other words, the carrier plates are purely mechanical in function. This configuration can significantly reduce probe array fabrication time relative to sequential placement of individual probes on the space transformer. Multiple probe carrier plates can be populated with probes in parallel, and the final sequential assembly of carrier plates onto the space transformer has a greatly reduced operation count. Deviations of the space transformer from flatness can be compensated for.
Probes are connected to the space transformer via multiple carrier plates. Electrical contacts from the probes to the space transformer are by way of spring tail features on the probes that connect to the space transformer and not to the carrier plates. In other words, the carrier plates are purely mechanical in function. This configuration can significantly reduce probe array fabrication time relative to sequential placement of individual probes on the space transformer. Multiple probe carrier plates can be populated with probes in parallel, and the final sequential assembly of carrier plates onto the space transformer has a greatly reduced operation count. Deviations of the space transformer from flatness can be compensated for.
Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.
Improved electrically conductive guide plates for vertical probe arrays are provided by patterning a thin metal layer disposed on an insulating substrate. Holes passing through the guide plate for guiding probes can be electrically connected or isolated from each other in any pattern according to the deposition of the metal. Such structures can include several distinct ground and/or voltage planes. Furthermore, passive electrical components can be included in the guide plate, by patterning of the deposited metal and/or by integration of passive electrical components with the deposited metal traces.
Probe systems for testing a device under test are disclosed herein. The probe systems include a platen that defines an upper surface, an opposed lower surface, and a platen aperture. The probe systems also include a chuck that defines a support surface configured to support a device under test. The probe systems further include a lower enclosure extending from the lower surface of the platen and an upper enclosure extending from the upper surface of the platen. The upper enclosure includes a side wall that defines a side wall aperture, and the side wall and the platen define an intersection angle of at least 30 degrees and at most 60 degrees. The probe systems also include a manipulator, a probe shaft arm, a probe assembly, a test head, and an electrical conductor.
G01R 1/04 - HousingsSupporting membersArrangements of terminals
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
98.
VERTICAL PROBE ARRAY HAVING A TILED MEMBRANE SPACE TRANSFORMER
Vertical probe heads having a space transformer laterally tiled into several sections are provided. This change relative to conventional approaches improves manufacturing yield. These probe heads can include metal ground planes, and in embodiments where the ground planes are provided as separate metal plates parallel to the guide plates, the metal plates can also be laterally tiled into several sections. Such tiling of metal plates improves manufacturing yield and alleviates thermal mismatch issues. Probes are not mechanically connected to the space transformer, which facilitates replacement of individual probes of an array.
Vertical probe heads having a space transformer laterally tiled into several sections are provided. This change relative to conventional approaches improves manufacturing yield. These probe heads can include metal ground planes, and in embodiments where the ground planes are provided as separate metal plates parallel to the guide plates, the metal plates can also be laterally tiled into several sections. Such tiling of metal plates improves manufacturing yield and alleviates thermal mismatch issues. Probes are not mechanically connected to the space transformer, which facilitates replacement of individual probes of an array.
Improved impedance matching is provided in vertical probe arrays having conductive guide plates by providing ground pins connecting the guide plates that do not mechanically touch the device under test or the input test apparatus. Such ground pins can be disposed in predetermined patterns around corresponding signal probes to improve an impedance match between the probes and the test apparatus and/or the device under test. Preferably all impedances are matched to 50Ω as is customary for high frequency work.
