A reaction by-product collection apparatus is provided. The reaction by-product collection apparatus according to one aspect of the present invention collects powder from exhaust gas, which is a reaction by-product of a semiconductor process, and comprises: a powder collection unit for precipitating the powder from the exhaust gas and separating out and eliminating the precipitated powder; a powder transfer unit which is provided below the powder collection unit, and which transfers the powder separated out by the powder collection unit; and a powder collection unit which is detachably connected to the powder transfer unit, and which collects and stores the powder transferred by the powder transfer unit.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
C23C 16/44 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
B01D 45/14 - Separating dispersed particles from gases or vapours by gravity, inertia, or centrifugal forces by centrifugal forces generated by rotating vanes, discs, drums or brushes
The present invention relates to a bypass-type apparatus for collecting semiconductor manufacturing byproducts. The apparatus for collecting semiconductor manufacturing byproducts between a process chamber and a vacuum pump comprises: a main collection unit for collecting semiconductor manufacturing byproducts; an upper three-way valve, which branches in three directions, has a first-direction end portion connected to the process chamber, and has a second-direction end portion detachably connected to an inlet of the main collection unit; a lower valve, which branches in three directions, has a first-direction end portion connected to the vacuum pump, and has a second-direction end portion detachably connected to an outlet of the main collection unit; and a bypass collection unit, which collects semiconductor manufacturing byproducts, has one end connected to a third-direction end portion of the upper three-way valve, and has the other end connected to a third-direction end portion of the lower valve.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
C23C 16/44 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
F16K 11/087 - Multiple-way valves, e.g. mixing valvesPipe fittings incorporating such valvesArrangement of valves and flow lines specially adapted for mixing fluid with all movable sealing faces moving as one unit comprising only taps or cocks with spherical plug
F16K 49/00 - Means in or on valves for heating or cooling
B01D 53/22 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by diffusion
F16L 57/00 - Protection of pipes or objects of similar shape against external or internal damage or wear
3.
VOICE TRANSMITTING AND RECEIVING DEVICE AND METHOD USING NEAR FIELD WIRELESS COMMUNICATION
Disclosed are a voice transmitting and receiving device and method using near field wireless communication (NFC). A voice transmitting device using NFC comprises: a voice signal collecting module for collecting guide voice signals of a guide; a digital signal processing module for converting the guide voice signal of the guide collected by the voice signal collecting module to digital voice signal data; and a wireless transmitting unit for transmitting the guide voice signals of the guide, which have been converted to digital voice signals in the digital signal processing module, to a plurality of tourist user terminals connected through an NFC network. Accordingly, the transmission efficiency of voice signals can be improved.
H04W 4/06 - Selective distribution of broadcast services, e.g. multimedia broadcast multicast service [MBMS]Services to user groupsOne-way selective calling services
H04W 4/00 - Services specially adapted for wireless communication networksFacilities therefor
The present invention relates to a percussive apparatus for disassembling electronic goods, which comprises: a table having a collecting box which collects shredded pieces; a disassembling part, provided in the upper portion of the table, for disassembling waste electronic goods; a hopper for introducing the waste electronic goods into the disassembling part; and a driving part for providing driving power to the disassembling part.
B02C 18/06 - Disintegrating by knives or other cutting or tearing members which chop material into fragmentsMincing machines or similar apparatus using worms or the like with rotating knives
A small electronic product crushing device according to the present invention comprises: a table having a collection box for collecting crushed pieces; a crushing unit provided on the upper portion of the table to crush a waste electronic product; a hopper for injecting the waste electronic product into the crushing unit; and a driving unit for providing the crushing unit with driving power, wherein the crushing unit comprises a crusher body having a lower opening formed toward the collection box; a rotation shaft provided inside the crusher body and rotated by the driving unit; and a plurality of rotation blades coupled to the outer peripheral edge of the rotation shaft to rotate successively and crush the waste electronic product.
B02C 18/06 - Disintegrating by knives or other cutting or tearing members which chop material into fragmentsMincing machines or similar apparatus using worms or the like with rotating knives
The present invention relates to a high efficiency carrier for thermal evaporation, which includes: an outer container for holding an evaporation material used in thermal evaporation, the outer container transferring the heat from a heater to the evaporation material; and a mesh mounted inside the outer container for preventing the evaporation material from flowing.
The present invention relates to a thermal deposition apparatus that reduces the rate of deposition variation using a plate-shaped metal heater instead of an existing tungsten filament or molybdenum boat, and more particularly, to a thermal deposition apparatus which uses a plate-shaped metal heater installed parallel to a processing axis of a substrate, and which uses a carrier positioned on the front surface of the plate-shaped metal heater. By using the thermal deposition apparatus of the present invention, the efficiency of use of deposited materials can be improved, and the deposited materials can be deposited on the substrate in a uniform and reproducible manner.
POSTECH ACADEMY-INDUSTRY FOUNDATION (Republic of Korea)
Inventor
Ahn, Byung-Nam
Kim, Dong-Eon
Kim, Jin-Gon
Son, Jae-Sik
Kim, Dong-Su
Abstract
A liquid target producing device to which multiple capillary tubes are mountable includes a capillary tube for injecting a liquid target in a jet form; a gas storage tank connected to the capillary tube through a gas line and storing a gas to be supplied to the capillary tube; a metal jacket positioned at an outer circumference of the capillary tube such that a plurality of capillary tubes are installable thereto, the metal jacket liquefying the gas supplied through the gas line; a cryo-cooler connected to the metal jacket through a thermal conductive wire to cool the metal jacket; and a moving means for moving the metal jacket so as to set an initial position of the capillary tube.
patents