A patterned multilayer film is prepared from a first film comprising a support layer and a second film comprising a conductive layer. The preparation method comprises a first step of printing in which the support layer of the first film is pre-printed in relief with the desired patterns, followed by a second step of lamination in which the first film with the pre-printed support layer is laminated with the second film comprising the conductive layer to form the multilayer film, followed by a third step in which the conductive layer of the pre-printed/laminated multilayer film is subjected to a milling step to selectively remove predetermined portions of this conductive layer to form the patterned multilayer film, the predetermined portions having a structure corresponding to the relief pre-prints.
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
2.
PROCESS FOR PREPARING A PRODUCT COMPRISING A FLEXIBLE SUBSTRATE WITH AT LEAST ONE PATTERNED LAYER
A patterned multilayer film is prepared from a flexible multilayer film comprising a support layer and at least one conductive layer. In the preparation process, the desired patterns are pre-printed in a raised manner on the support layer of the multilayer film and the conductive layer of the pre-printed multilayer film is subjected to a step of milling to selectively remove predetermined portions of this conductive layer, the predetermined portions having a structure corresponding to the pre-printed raised patterns.
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
The present invention relates to a radio frequency identification device (RFID) without (personalized) chip, in particular to a RFID tag without (personalized) chip, also referred to as chipless RFID tag.
G06K 19/067 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
G01S 13/75 - Systems using reradiation of radio waves, e.g. secondary radar systemsAnalogous systems using transponders powered from received waves, e.g. using passive transponders
The present invention relates to a printing method comprising a step of printing a pattern on a substrate, preferably by ink jet printing, followed by a gold plating step by means of contact between the pre-printed pattern to be gold plated and a gold plating deposition device, such as a preferably conductive metal sheet, e.g. a multilayer film comprising a preferably conductive metal sheet.
H05K 1/09 - Use of materials for the metallic pattern
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
B32B 3/00 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form
B44C 1/10 - Applying flat material, e.g. leaflets, pieces of fabrics
B44C 1/14 - Metallic leaves or foils, e.g. gold leaf
G03G 9/13 - Developers with toner particles in liquid developer mixtures characterised by polymer components
G03G 9/16 - Developers not provided for in groups , e.g. solutions, aerosols
G03G 13/22 - Processes involving the combination of more than one step according to groups
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
G06K 19/07 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards with integrated circuit chips
5.
METHOD FOR DETECTING CHIPLESS RADIO FREQUENCY IDENTIFICATION DEVICES (RFID)
The present invention relates to a method for detecting chipless radio frequency identification devices (RFID), in particular chip detection, also referred to as chipless RFID tags. The present invention also relates to the devices and tags which can be used in the claimed method.
H04B 5/00 - Near-field transmission systems, e.g. inductive or capacitive transmission systems
H01Q 21/24 - Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
G06K 19/067 - Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
G01S 13/88 - Radar or analogous systems, specially adapted for specific applications
G01S 7/41 - Details of systems according to groups , , of systems according to group using analysis of echo signal for target characterisationTarget signatureTarget cross-section
G01S 13/74 - Systems using reradiation of radio waves, e.g. secondary radar systemsAnalogous systems
G01S 13/89 - Radar or analogous systems, specially adapted for specific applications for mapping or imaging
H01Q 1/22 - SupportsMounting means by structural association with other equipment or articles
The present invention relates to the field of UV-coating printing, in particular to the field of the digital printing of UV-coating without contact with the substrates, and more particularly to a device and a process that makes it possible to print, on demand, a glossy coating on printable and printed substrates and, via post-treatment, either to keep it glossy, or to render it matte.
B41M 7/00 - After-treatment of printed works, e.g. heating, irradiating
C09D 11/101 - Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
B05D 3/06 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
B41J 11/00 - Devices or arrangements for supporting or handling copy material in sheet or web form
C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
B05D 7/00 - Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
The present invention relates to a method for producing radio frequency identification devices (RFID) without personalized chip, in particular the production of RFID tags without personalized chip, also referred to as chipless RFID tags. The present invention also relates to devices and labels produced by the claimed method as well as to systems for producing said devices/labels.
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
The present invention relates to a printing method comprising a step of printing a pattern on a substrate, preferably by ink jet printing, followed by a gold plating step by means of contact between the pre-printed pattern to be gold plated and a gold plating deposition device, such as a preferably conductive metal sheet, e.g. a multilayer film comprising a preferably conductive metal sheet.
H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
9.
DEVICE AND METHOD FOR RETAINING/CONVEYING SUBSTRATES IN A PRINTING MACHINE
The invention relates to a novel device and a novel method for conveying printable substrates in a precise manner, adapted to substrates of different types, sizes and thicknesses. In addition, the invention is adapted to printing machines that do not come into contact with the substrate, such as inkjet printing machines.
B65G 54/02 - Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
B65H 5/04 - Feeding articles separated from pilesFeeding articles to machines by movable tables or carriages
10.
DEVICE AND METHOD FOR CONVEYING SUBSTRATES IN A PRINTING MACHINE
The invention relates to a novel device and a novel method for conveying printable substrates in a precise manner, adapted to substrates of different types, sizes and thicknesses. In addition, the invention is adapted to printing machines that do not come into contact with the substrate, such as inkjet printing machines.
B65G 17/34 - Individual load-carriers having flat surfaces, e.g. platforms, grids, forks
B65G 35/06 - Mechanical conveyors not otherwise provided for comprising a load-carrier moving along a path, e.g. a closed path, and adapted to be engaged by any one of a series of traction elements spaced along the path
B65G 54/02 - Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
B23Q 7/14 - Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting co-ordinated in production lines
11.
DEVICE AND METHOD FOR CONVEYING SUBSTRATES IN A PRINTING MACHINE
The invention relates to a novel device and a novel method for conveying printable substrates in a precise manner, adapted to substrates of different types, sizes and thicknesses. In addition, the invention is adapted to printing machines that do not come into contact with the substrate, such as inkjet printing machines.
patents
