Abstract

The invention relates to an aluminum resistive heater containing, a heat conductive substrate comprising an electrically insulating surface. An aluminum resistive structure is provided on the electrically insulating surface, wherein the aluminum resistive structure comprises, at least one aluminum conductive layer covering at least a part of the electrically insulating surface, wherein the aluminum conductive layer comprises aluminum and at least a first glass. The aluminum resistive structure further comprises at least two terminal contact pads contacting the aluminum conductive layer, wherein the terminal contact pads comprise silver. An overglaze comprising glass covers at least a part of the aluminum resistive structure. Furthermore the invention relates to a method for making the aluminum resistive heater.

IPC Classes  ?

• H05B 3/12 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
• H05B 3/14 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
• H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
• H05B 3/38 - Powder conductors
• H05B 3/10 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
• H05B 3/16 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being mounted on an insulating base
• H05B 3/36 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater flexible, e.g. heating nets or webs heating conductor embedded in insulating material
• C23C 4/134 - Plasma spraying
• C23C 16/06 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material

Abstract

The invention relates to an aluminum resistive heater containing, a heat conductive substrate comprising an electrically insulating surface. An aluminum resistive structure is provided on the electrically insulating surface, wherein the aluminum resistive structure comprises, at least one aluminum conductive layer covering at least a part of the electrically insulating surface, wherein the aluminum conductive layer comprises aluminum and at least a first glass. The aluminum resistive structure further comprises at least two terminal contact pads contacting the aluminum conductive layer, wherein the terminal contact pads comprise silver. An overglaze comprising glass covers at least a part of the aluminum resistive structure. Furthermore the invention relates to a method for making the aluminum resistive heater.

IPC Classes  ?

• H05B 3/16 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being mounted on an insulating base
• H05B 3/08 - Heater elements structurally combined with coupling elements or with holders having electric connections specially adapted for high temperatures
• H05B 3/26 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base

Goods & Services

Chemicals for industrial use; chemical preparations and materials for printing; chemical compositions for use in the manufacture of electronic components, in particular microcircuits and resistors; chemical compositions having conductive properties; printing chemicals, chemicals for use in electronic industry, chemicals for use in printing, chemicals used for plating non-conducting surfaces with metals; paste compositions; paste compositions for use in the manufacture of electronic components, in particular microcircuits and resistors. Printing ink; printer paste [ink]; ink for printing, marking and engraving; metallic ink; metallic printing ink; paints [other than insulating] for electronic components; printing ink with electric conductivity; polymeric ink, polymeric ink for surface micromachining; polymeric ink as sacrificial layer and sacrificial underlayer, polymeric ink as etch layer and as etch resistant layer; polymeric ink for encapsulation and protection.

Abstract

A solvent-free electroconductive composition may be used to make electroconductive lines on a surface of a substrate or electroconductive plugs within via holes of a substrate. The solvent-free electroconductive composition is generally made of about 40 to about 95 wt % of a conductive component, about 4 to about 30 wt % of a polymer or oligomer comprising a reactive functional group, up to about 20 wt % of a monomeric diluent comprising a reactive functional group, and up to about 3 wt % of a curing agent. In some instances, the solvent-free electroconductive composition further includes up to about 3 wt % of a lubricating compound. Substrates made using solvent-free electroconductive compositions may be used in printed circuit boards, integrated circuits, solar cells, capacitors, resistors, thermistors, varistors, resonators, transducers, inductors, and multilayer ferrite beads.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08K 3/08 - Metals
• C08K 5/17 - AminesQuaternary ammonium compounds
• C08K 5/5415 - Silicon-containing compounds containing oxygen containing at least one Si—O bond
• C08K 7/18 - Solid spheres inorganic
• C09D 11/52 - Electrically conductive inks

Abstract

A solvent-free electroconductive composition may be used to make electroconductive lines on a surface of a substrate or electroconductive plugs within via holes of a substrate. The solvent- free electroconductive composition is generally made of about 40 to about 95 wt% of a conductive component, about 4 to about 30 wt% of a polymer or oligomer comprising a reactive functional group, up to about 20 wt% of a monomeric diluent comprising a reactive functional group, and up to about 3 wt% of a curing agent. In some instances, the solvent-free electroconductive composition further includes up to about 3 wt% of a lubricating compound. Substrates made using solvent-free electroconductive compositions may be used in printed circuit boards, integrated circuits, solar cells, capacitors, resistors, thermistors, varistors, resonators, transducers, inductors, and multilayer ferrite beads.

IPC Classes  ?

• C09J 9/02 - Electrically-conducting adhesives
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01L 23/498 - Leads on insulating substrates
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements

Abstract

A conductive paste for use in a laser-induced pattern transfer printing process includes a conductive component; a glass component; and an inorganic vehicle, wherein the conductive paste exhibits a light reflectance of no more than 50% across a light wavelength range of about 800 to about 1300 nm and improving the transfer of the paste to the substrate. A process for laser-induced pattern transfer printing includes providing a first substrate comprising a recessed surface and a conductive paste disposed in the recessed surface; orienting the recessed surface of the first substrate toward a second substrate; irradiating the conductive paste with a laser, the laser configured to emit light having a wavelength between about 800 and about 1300 nm; and transferring the irradiate conductive paste from the first substrate to a surface of the second substrate.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

The International Bureau acknowledges receipt of Article 19 amendments received on 12 November 2019 (12.11.2019). Although the applicant appears to have indicated the basis of the amendment in the application as filed in the cover letter submitted together with the mark-up copy of Article 19 amendments, the applicant appears to not have submitted a clean copy of the new set of claims. The applicant is hereby invited to furnish the clean copy of the amended claims within a time limit of ONE MONTH from the date of mailing of this notification or within the time limit under Rule 46.1, whichever expires later.

IPC Classes  ?

• B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
• B23K 35/362 - Selection of compositions of fluxes
• C22C 9/02 - Alloys based on copper with tin as the next major constituent
• C22C 9/04 - Alloys based on copper with zinc as the next major constituent
• C22C 13/00 - Alloys based on tin
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

wherein the copper paste comprises or consists of (i) 66-99 wt.-% of at least one type of particles selected from the group consisting of copper particles, copper-rich copper/zinc alloy particles, and copper-rich copper/tin alloy particles, (ii) 0-20 wt.-% of at least one type of solder particles selected from the group consisting of tin particles, tin-rich tin/copper alloy particles, tin-rich tin/silver alloy particles, and tin-rich tin/copper/silver alloy particles, and (iii) 1-20 wt.-% of a vehicle.

IPC Classes  ?

• B23K 1/08 - Soldering by means of dipping in molten solder
• H01L 23/00 - Details of semiconductor or other solid state devices
• H05B 3/12 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering

Abstract

The invention provides a seed layer paste for contacting a solar cell electrode with a low silver laydown and yet provides a higher voltage and a comparable solar efficiency. The seed layer paste includes: 1) a silver particle at 0.1-50 wt%; 2) at least one glass frit at 5-70 wt%; and 3) an organic vehicle at 20-95 wt%. The invention also provides a method of forming a solar cell by applying the seed layer paste of the invention to a surface of a silicon wafer to form a seed layer; applying on top of the seed layer a second composition containing a silver particle, at least one glass frit, and an organic vehicle; and firing the silicon wafer with the seed layer paste and the second composition.

IPC Classes  ?

• H01L 31/0224 - Electrodes
• C03C 8/02 - Frit compositions, i.e. in a powdered or comminuted form
• H01B 1/16 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys

Abstract

The invention provides a method of preparing a metallization structure on a solar cell. The method includes patterning a first composition on a surface of a semiconductor substrate; and applying a second composition over the first composition. An area covered by the first composition is 5-95% of an area covered by the second composition. The semiconductor substrate is then subjected to firing conditions. The invention also provides a metallization structure formed using the method described herein.

IPC Classes  ?

• H01L 31/0224 - Electrodes
• C03C 8/02 - Frit compositions, i.e. in a powdered or comminuted form
• H01B 1/16 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys

Abstract

505050), a glass frit comprising at least bismuth oxide and silicon oxide, and boron oxide, at least one adhesion promoting additive comprising bismuth oxide, zinc oxide, titanium oxide, cerium oxide, or combinations thereof, and an organic vehicle.

IPC Classes  ?

• C03C 3/064 - Glass compositions containing silica with less than 40% silica by weight containing boron
• C03C 8/02 - Frit compositions, i.e. in a powdered or comminuted form
• C03C 8/18 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing free metals
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

The invention relates to an electroconductive paste composition with reduced etching characteristics. The electroconductive paste composition includes metallic particles, at least one glass frit, and an organic vehicle. The at least one glass frit is lead-free and includes about 65-95 wt% of at least SiO2, B2O3, and Bi2O3, based upon 100% total weight of the at least one glass frit, about 5-20 wt% of at least one alkaline oxide, and about 3-10 wt% of molybdenum oxide.

IPC Classes  ?

• C03C 8/02 - Frit compositions, i.e. in a powdered or comminuted form
• C03C 8/04 - Frit compositions, i.e. in a powdered or comminuted form containing zinc
• C03C 8/16 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions with vehicle or suspending agents, e.g. slip
• C03C 8/18 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing free metals
• H01B 1/16 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01L 31/0224 - Electrodes

Abstract

The invention relates to a passivated emitter rear solar cell, comprising a silicon substrate having a front and back surface, a rear passivation layer on the back surface of the silicon substrate having a plurality of open holes formed therein, an aluminum back contact layer formed in the open holes of the rear passivation layer, and at least one backside soldering tab on the back surface of the silicon substrate. The backside soldering tab is formed from an electroconductive paste composition comprising conductive metallic particles, at least one lead-free glass frit, and an organic vehicle comprising at least one silicone oil.

IPC Classes  ?

• H01L 31/0224 - Electrodes
• H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• C08K 3/08 - Metals
• C09D 11/52 - Electrically conductive inks

Abstract

A process for the incineration of activated coal-supported PGM catalysts, the process comprising a joint incineration of a multilayer arrangement, wherein the multilayer arrangement includes (i) a top layer of particulate activated coal-supported PGM catalyst, (ii) a layer of coarse charcoal located beneath said top layer and, optionally, (iii) a layer of particulate coke located beneath the charcoal layer, and wherein an upward flow of oxidizing gas is homogeneously passed through said multilayer arrangement during the incineration.

IPC Classes  ?

• C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
• C22B 11/02 - Obtaining noble metals by dry processes

Abstract

A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.

IPC Classes  ?

• C03C 8/16 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions with vehicle or suspending agents, e.g. slip
• H05K 1/02 - Printed circuits Details
• C03C 8/20 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing titanium compoundsGlass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing zirconium compounds
• C03C 8/02 - Frit compositions, i.e. in a powdered or comminuted form
• C03C 3/062 - Glass compositions containing silica with less than 40% silica by weight
• C03C 3/076 - Glass compositions containing silica with 40% to 90% silica by weight
• C03C 4/16 - Compositions for glass with special properties for dielectric glass
• C09K 5/14 - Solid materials, e.g. powdery or granular
• H05K 1/05 - Insulated metal substrate
• H05K 3/46 - Manufacturing multi-layer circuits
• C03B 19/00 - Other methods of shaping glass

Abstract

In general, the invention relates to a paste comprising : i) silver particles; ii) a particulate lead-silicate glass comprising iia) at least one oxide of silicon; iib) at least one oxide of lead; iic) at least one chloride; iid) optionally at least one further oxide being different from components iia) and iib); iii) an organic vehicle. The invention also relates to a solar cell precursor, to a process for the preparation of a solar cell, to a solar cell obtainable by this process, to a module comprising such a solar cell and to the use of a particulate lead-silicate glass as a component in a silver paste that can be used for the formation of an electrode.

IPC Classes  ?

• C03C 3/074 - Glass compositions containing silica with less than 40% silica by weight containing lead containing boron containing zinc
• C03C 8/06 - Frit compositions, i.e. in a powdered or comminuted form containing halogen
• C03C 8/16 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions with vehicle or suspending agents, e.g. slip
• C03C 8/18 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing free metals
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01L 31/0224 - Electrodes

Abstract

The invention relates to a passivated emitter rear solar cell, comprising a silicon substrate having a front and back surface, a rear passivation layer on the back surface of the silicon substrate having a plurality of open holes formed therein, an aluminum back contact layer formed in the open holes of the rear passivation layer, and at least one backside soldering tab on the back surface of the silicon substrate. The backside soldering tab is formed from an electroconductive paste composition comprising conductive metallic particles, at least one lead-free glass frit, and an organic vehicle comprising at least one silicone oil.

IPC Classes  ?

• H01B 1/16 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
• H01L 31/0216 - Coatings
• H01L 31/0224 - Electrodes
• H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• C03C 8/18 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing free metals
• C08L 83/04 - Polysiloxanes
• H01L 31/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
• H01L 31/028 - Inorganic materials including, apart from doping material or other impurities, only elements of Group IV of the Periodic System

Abstract

d-Oe, wherein 0

IPC Classes  ?

• C09D 5/24 - Electrically-conducting paints
• H01B 1/16 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
• H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
• H01L 31/0224 - Electrodes
• C01B 19/00 - SeleniumTelluriumCompounds thereof
• C03C 3/12 - Silica-free oxide glass compositions
• C03C 8/10 - Frit compositions, i.e. in a powdered or comminuted form containing lead
• C03C 8/18 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing free metals
• C09D 1/00 - Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
• C09D 5/00 - Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects producedFilling pastes
• H01L 31/0216 - Coatings
• H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• B05D 1/02 - Processes for applying liquids or other fluent materials performed by spraying
• B05D 1/18 - Processes for applying liquids or other fluent materials performed by dipping
• B05D 1/28 - Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
• B05D 1/30 - Processes for applying liquids or other fluent materials performed by gravity only, i.e. flow coating
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

The invention relates to an electroconductive paste composition comprising conductive metallic particles comprising silver, at least one glass frit, and an organic vehicle comprising at least about 0.5 wt% and no more than about 50 wt% of at least one poly-siloxane compound, based upon 100% total weight of the organic vehicle.

IPC Classes  ?

• H01B 1/16 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
• C03C 3/00 - Glass compositions
• H01L 31/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
• C08L 83/04 - Polysiloxanes

Abstract

A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt% and no more than about 50 wt% silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt% and no more than about 50 wt% alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt% and no more than about 10 wt% of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.

IPC Classes  ?

• C03C 8/16 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions with vehicle or suspending agents, e.g. slip
• C03C 8/20 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing titanium compoundsGlass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing zirconium compounds
• H05K 1/02 - Printed circuits Details

Abstract

An organic vehicle comprising at least about 0.5 wt% and no more than about 45 wt% of at least one of a natural essential oil, based upon 100% total weight of the organic vehicle, at least about 0.5 wt% and no more than about 10 wt% of at least one resin, an organic solvent, and a thixotropic agent is provided. The invention also provides a solar cell and a method of forming a solar cell with the electroconductive paste of the invention.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
• H01L 31/0224 - Electrodes

Abstract

50) of the glass composition is no more than about 5 μm, and (iii) the glass composition has a coefficient of thermal expansion of at least about 10 ppm/K and no more than about 25 ppm/K, is provided.

IPC Classes  ?

• C03C 8/02 - Frit compositions, i.e. in a powdered or comminuted form
• C03C 8/24 - Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metalGlass solders
• C03C 3/062 - Glass compositions containing silica with less than 40% silica by weight
• C03C 3/083 - Glass compositions containing silica with 40% to 90% silica by weight containing aluminium oxide or an iron compound
• H01B 3/08 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances quartzInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances glassInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances glass woolInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances slag woolInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of inorganic substances vitreous enamels
• H01B 19/02 - DryingImpregnating
• C03C 3/064 - Glass compositions containing silica with less than 40% silica by weight containing boron
• C03C 3/091 - Glass compositions containing silica with 40% to 90% silica by weight containing boron containing aluminium
• C03C 4/16 - Compositions for glass with special properties for dielectric glass
• C03C 8/16 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions with vehicle or suspending agents, e.g. slip
• C03C 8/20 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing titanium compoundsGlass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing zirconium compounds
• H01G 4/10 - Metal-oxide dielectrics
• H01G 4/12 - Ceramic dielectrics
• H01C 17/065 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick-film techniques, e.g. serigraphy

Abstract

A conductive polymer thick film composition suitable for lead-free soldering comprising metallic particles and an organic vehicle comprising at least one phenolic resin and a solvent is provided. A method of soldering to the conductive polymer thick film composition of the invention is also provided. An article comprising a substrate and a cured polymer film on a surface of the substrate formed of the conductive polymer thick film composition of the invention is provided.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
• B23K 35/362 - Selection of compositions of fluxes
• B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
• B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 35/32 - Selection of soldering or welding materials proper with the principal constituent melting at more than 1550°C
• B23K 35/365 - Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials

Abstract

e, wherein 0

IPC Classes  ?

• H01B 1/16 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
• H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
• H01L 31/0224 - Electrodes
• C03C 8/10 - Frit compositions, i.e. in a powdered or comminuted form containing lead
• C09D 5/24 - Electrically-conducting paints
• C03C 3/07 - Glass compositions containing silica with less than 40% silica by weight containing lead
• C03C 8/18 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing free metals

Abstract

An electroconductive paste composition for manufacturing a solar cell including conductive metallic particles, glass frit, and an organic vehicle which includes an organic solvent and an acrylic resin lacking an active hydrogen functionality, is provided. The electroconductive paste composition is capable of being screen printed through screen openings having a diameter of about 40 µm or less.

IPC Classes  ?

• C03C 8/18 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing free metals
• C09D 11/52 - Electrically conductive inks
• C08L 33/10 - Homopolymers or copolymers of methacrylic acid esters
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01L 31/0224 - Electrodes
• C08K 3/08 - Metals
• C08K 3/22 - OxidesHydroxides of metals

Abstract

Electrically conductive polymeric compositions adapted for use in forming electronic devices are disclosed. The compositions are thermally curable at temperatures less than about 250° C. Compositions are provided which may be solvent-free and so can be used in processing or manufacturing operations without solvent recovery concerns. The compositions utilize (i) fatty acid modified epoxy acrylate and/or methacrylate monomer(s) and/or oligomer(s), (ii) fatty acid modified polyester acrylate and/or methacrylate monomer(s) and/or oligomer(s), or combinations of (i) and (ii). Also described are electronic assemblies such as solar cells using the various compositions and related methods.

IPC Classes  ?

• H01L 31/04 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01L 31/0216 - Coatings
• H01L 31/0224 - Electrodes
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys

Abstract

An electroconductive paste composition for use in forming backside soldering pads on a solar cell including metallic particles, glass frit including Bi2O3, Al2O3, SiO2, B2O3 and at least one of Li2O or Li3PO4, and an organic vehicle is provided. The invention also provides a solar cell comprising a silicon wafer having a front side and a backside, and a soldering pad formed on the silicon wafer produced from an electroconductive paste according to the invention. The invention further provides a solar cell module comprising electrically interconnected solar cells according to the invention. A method of producing of a solar cell, comprising the steps of providing a silicon wafer having a front side and a backside, applying an electroconductive paste composition according to the invention onto the backside of the silicon wafer, and firing the silicon wafer according to an appropriate profile, is also provided.

IPC Classes  ?

• C09D 11/00 - Inks
• C08L 1/28 - Alkyl ethers
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01L 31/0224 - Electrodes
• C08K 3/08 - Metals
• C08K 3/22 - OxidesHydroxides of metals
• C09D 11/52 - Electrically conductive inks

Abstract

3, and about 10-20 wt % of organic vehicle, based upon 100% total weight of the paste, wherein the organic vehicle includes at least one viscosity-modifying component in an amount sufficient to provide the electroconductive hole plug paste with a viscosity of about 800-1,500 kcPs, is provided. A ceramic substrate assembly for an implantable medical device having the electroconductive hole plug paste of the invention, and a method of forming the same, are also provided.

IPC Classes  ?

• B32B 3/24 - Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shapeLayered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. apertured or formed of separate pieces of material characterised by an apertured layer, e.g. of expanded metal
• B32B 18/00 - Layered products essentially comprising ceramics, e.g. refractory products
• B32B 37/06 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
• B32B 38/04 - Punching, slitting or perforating
• A61N 1/05 - Electrodes for implantation or insertion into the body, e.g. heart electrode
• H01B 1/14 - Conductive material dispersed in non-conductive inorganic material
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01B 1/16 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
• C04B 41/45 - Coating or impregnating
• C08L 1/28 - Alkyl ethers
• A61L 31/02 - Inorganic materials
• A61L 31/18 - Materials at least partially X-ray or laser opaque
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H05K 3/46 - Manufacturing multi-layer circuits
• H01L 23/498 - Leads on insulating substrates

Abstract

The invention provides an electroconductive paste comprising 50-90 wt. % of copper particle, 0.5-10 wt. % of a glass frit, 0.1-5% wt. % of adhesion promoter, which is at least one selected member from the group consisting of cuprous oxide, titanium oxide, zirconium oxide, boron resinate, zirconium resinate, amorphous boron, lithium phosphate, bismuth oxide, aluminum oxide, and zinc oxide, and 5-20 wt. % of an organic vehicle. An article comprising an aluminum nitride substrate and electroconductive paste of the invention is also provided. A method of forming an electroconductive circuit comprising is also provided.

IPC Classes  ?

• H01B 1/16 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
• H05K 1/00 - Printed circuits
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/24 - Reinforcing of the conductive pattern

Abstract

Electrically conductive polymeric compositions adapted for use in forming electronic devices are disclosed. The compositions are thermally curable at temperatures less than about 250° C. Compositions are provided which may be solvent-free and so can be used in processing or manufacturing operations without solvent recovery concerns. Core-shell conductive particles provide the conductivity of the compositions and devices contemplated herein.

IPC Classes  ?

• C09D 5/24 - Electrically-conducting paints
• C09D 151/08 - Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCoating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
• C09D 175/16 - Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
• H01L 31/0376 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including amorphous semiconductors
• H01L 31/0224 - Electrodes
• H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• C08G 18/80 - Masked polyisocyanates
• C08G 18/67 - Unsaturated compounds having active hydrogen
• C08F 290/06 - Polymers provided for in subclass
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• C08K 9/10 - Encapsulated ingredients
• C08F 222/10 - Esters

Abstract

50 of at least about 5 μm and no more than about 8 μm, and an organic vehicle. The invention further provides an article comprising a glass substrate comprising a transparent conductive oxide coating and a conductive electrode formed by applying aforementioned conductive paste on said glass substrate, and a method of producing such an article.

IPC Classes  ?

• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

Electrically conductive polymeric compositions curable at temperatures below 250° C. are disclosed. The compositions are particularly well suited for forming electrodes used in association with certain solar cells.

IPC Classes  ?

• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01L 21/64 - Manufacture or treatment of solid-state devices other than semiconductor devices, or of parts thereof, not specially adapted for a single type of device provided for in subclasses , , or
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins

Abstract

The present invention relates to an electroconductive paste useful in the manufacture of silicon solar cells and solar cell modules, especially for the backside of the silicon wafer. The electroconductive paste comprises metallic particles, glass frit, organic vehicle, and an adhesion enhancer. The adhesion enhancer comprises a metal or a metal oxide, or any other metal compound that will convert to metal or metal oxide at firing temperature. The adhesion enhancer comprises at least one metal selected from the group consisting of tellurium, tungsten, molybdenum, vanadium, nickel, antimony, magnesium, zirconium, silver, cobalt, cerium, and zinc, or oxides thereof.

IPC Classes  ?

• H01B 1/00 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors

Abstract

Paste compositions, methods of making a paste composition, and methods of making a solar cell contact are disclosed. The paste composition can contain silver, a glass frit, a metal additive and an organic vehicle system. The metal additive is at least one selected from the group consisting of yttrium, an organo-vanadium compound, organo-antimony compound, organo-phosphorus compound, and an organo-yttrium compound. The paste can be used for making a solar cell contact.

IPC Classes  ?

• H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
• H01B 1/12 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances organic substances
• H01L 31/0224 - Electrodes
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

Paste compositions, methods of making a paste composition, and methods of making a solar cell contact are disclosed. The paste composition can contain a nickel intermetallic compound such as nickel silicide, nickel boride or nickel phosphide, a glass frit, a metal additive and an organic vehicle system. The paste can be used for making a solar cell contact.

IPC Classes  ?

• H01L 31/04 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices

Abstract

Silicon solar cells and contacts thereof are printed in at least a two stage printing process where the busbars and fingerlines may be printed separately. A reduction in silver content in busbars and fingerlines through use of the techniques of the invention have been realized, including the use of certain base metals, while maintaining low contact resistance similar to silver pastes.

IPC Classes  ?

• H01L 31/0216 - Coatings
• H01L 31/0224 - Electrodes
• H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Abstract

This disclosure relates to electroconductive paste formulations useful in solar panel technology. In one aspect, the disclosure relates to an inorganic reaction system for use in electroconductive paste compositions, wherein the inorganic reaction system comprises a lead containing matrix composition and a tellurium containing matrix composition. In another aspect, the disclosure relates to an electroconductive paste composition comprising a conductive metal component, an inorganic reaction system and an organic vehicle. Another aspect of the disclosure relates to a solar cell produced by applying an electroconductive paste composition of the invention to a silicon wafer. Yet another aspect relates to a solar cell module assembled using solar cells produced by applying an electroconductive paste composition to a silicon wafer, wherein the electroconductive paste composition comprises an conductive metal component, an inorganic reaction system and an organic vehicle.

IPC Classes  ?

• H01L 31/0224 - Electrodes
• H01L 31/0264 - Inorganic materials
• H01B 1/16 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
• C03C 3/12 - Silica-free oxide glass compositions
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

Paste compositions, methods of making paste compositions, contacts, and methods of making contacts are disclosed. The paste compositions include a solid portion and a vehicle system. The solid portion includes a conductive metal component and a glass binder. The vehicle system includes organometallic compound containing zinc. The organometallic compounds containing zinc can be dissolved in the vehicle system and the vehicle system does not include particles that contain zinc. The paste compositions can be used to form contacts in solar cells or other related components.

IPC Classes  ?

• H01B 1/16 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
• H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• C03C 3/066 - Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
• C03C 8/02 - Frit compositions, i.e. in a powdered or comminuted form
• C03C 8/04 - Frit compositions, i.e. in a powdered or comminuted form containing zinc

Abstract

This invention relates an aluminum (Al) conductor paste formulation and its method of application on rear side passivated locally laser fired contacts (LFC). Such Back Surface Passivated (BSP) Si-solar cells include aluminum conductor paste formulations and methods of application on rear side passivated locally opened vias; dot or line geometry or combination thereof employing laser ablation or chemical etching methods. Such Back Surface Passivated Si- solar cells include dielectric layers of A1203, SiNx, Si02, SiC, α-Si, Si02/SiNx, A1203/SiNx, SiO2A12/SiNx. The Al-conductor paste of this invention achieves; (i) non-degradation of passivation stack, (ii) defect free surfaces and void free vias, (iii) a strong and uniform Back Surface Field (BSF) layer within dot vias and line vias.

IPC Classes  ?

• H01L 31/0224 - Electrodes
• H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

Abstract

This invention relates an aluminum conductor paste formulation and its method of application on rear side passivated locally opened vias; dot or line geometry or combination thereof employing laser ablation or chemical etching methods. Such Back Surface Passivated Si-solar cells include dielectric layers of A1203, SiNx, Si02, SiC, a-Si, Si02/SiNx, A1203/SiNx, Si02/A1203/SiNx. The Al-conductor paste of this invention achieves; (i) non-degradation of passivation stack, (ii) defect free surfaces and void free vias, (iii) a strong and uniform Back Surface Field (BSF) layer within dot vias and line vias.

IPC Classes  ?

• H01B 1/16 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
• H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• C07F 3/06 - Zinc compounds

Abstract

Paste compositions, methods of making a paste composition, solar cells, and methods of making a solar cell contact are disclosed. The paste composition can include a conductive metal component, a glass component, and a vehicle. The glass component can include SiO2 at about 3 mole % or more and about 65 mole % or less of the glass component and one or more transition metal oxides at about 0.1 mole % or more and about 25 mole % or less of the glass component. The metal of the transition metal oxide is selected from the group consisting of Mn, Fe, Co, Ni, Cu, Ti, V, Cr, W, Nb, Ta, Hf, Mo, Zr, Rh, Ru, Pd, and Pt.

IPC Classes  ?

• H01L 23/15 - Ceramic or glass substrates
• H01L 31/0216 - Coatings
• H01L 31/0264 - Inorganic materials
• H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• C03C 8/00 - EnamelsGlazesFusion seal compositions being frit compositions having non-frit additions

Abstract

Electrically conductive polymeric compositions adapted for use in forming electronic devices are disclosed. The compositions are thermally curable at temperatures less than about 250°C. Compositions are provided which may be solvent- free and so can be used in processing or manufacturing operations without solvent recovery concerns. Core-shell conductive particles provide the conductivity of the compositions and devices contemplated herein.

IPC Classes  ?

• C08G 65/00 - Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule

Abstract

Electrically conductive polymeric compositions adapted for use in forming electronic devices are disclosed. The compositions are thermally curable at temperatures less than about 250°C. Compositions are provided which may be solvent-free and so can be used in processing or manufacturing operations without solvent recovery concerns. The compositions utilize (i) ethylenically unsaturated monomers or oligomers with hydroxyl groups, and (ii) blocked isocyanates with unblocking temperatures below 200°C. Also described are electronic assemblies such as solar cells using the various compositions and related methods.

IPC Classes  ?

• C08G 18/67 - Unsaturated compounds having active hydrogen
• C08G 18/70 - Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
• C08G 18/77 - Polyisocyanates or polyisothiocyanates having hetero atoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
• C08G 18/16 - Catalysts
• C08G 18/82 - Post-polymerisation treatment
• B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01L 31/0216 - Coatings

Abstract

Solar cell conductor formulations made are from two silver powders having different particle size distributions, an aluminum powder, and two frit glass compositions having softening points in the range of 250-700 °C and whose softening points differ by at least 10 °C.

IPC Classes  ?

• H01L 31/0224 - Electrodes

Abstract

Paste compositions, methods of making a paste composition, photovoltaic cells, and methods of making a photovoltaic cell contact are disclosed. The paste composition can include a conductive metal component such as aluminum, phosphate glass, phosphorus compounds such as alky! phosphate, and a vehicle. The contact can be formed on a passivation layer on a silicon wafer by applying the paste on the passivation layer and firing the paste. During firing, the metal component can fire through the passivation layer, thereby electrically contacting the silicon substrate.

IPC Classes  ?

• C07F 9/09 - Esters of phosphoric acids
• C07F 11/00 - Compounds containing elements of Groups 6 or 16 of the Periodic Table
• C07F 13/00 - Compounds containing elements of Groups 7 or 17 of the Periodic Table
• C07F 15/00 - Compounds containing elements of Groups 8, 9, 10 or 18 of the Periodic Table
• H01L 31/04 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof adapted as photovoltaic [PV] conversion devices
• C03C 4/04 - Compositions for glass with special properties for photosensitive glass
• B01F 3/12 - Mixing, e.g. dispersing, emulsifying, according to the phases to be mixed liquids with solids

Abstract

Electroconductive paste compositions, particularly for solar cells, contain electroconductive metal particles, glass particles, and an organic vehicle. The electroconductive metal particles are provided as a mixture of silver powder particles and at least one selected from nickel powder, tin (IV) oxide powder, and core-shell particles having a silver shell and a core of nickel and/or tin (IV) oxide. The pastes may be used in the manufacture of contacts or electrodes for the front side or back side of solar cells.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Abstract

2 within a range from 20 to 65 [mol %].

IPC Classes  ?

• H01B 1/16 - Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• H01L 31/0224 - Electrodes

Abstract

Formulations and methods of making solar cells are disclosed. In general, the invention presents a solar cell contact made from a mixture wherein the mixture comprises a solids portion and an organics portion, wherein the solids portion comprises from about 85 to about 99 wt % of a metal component, and from about 1 to about 15 wt % of a lead-free glass component. Both front contacts and back contacts arc disclosed.

IPC Classes  ?

• H01L 31/042 - PV modules or arrays of single PV cells
• H01L 31/0224 - Electrodes
• C03C 3/064 - Glass compositions containing silica with less than 40% silica by weight containing boron
• C03C 3/066 - Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
• C03C 8/18 - Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill additions containing free metals

Abstract

Paste compositions, methods of making a paste composition, and methods of making a solar cell contact are disclosed. The paste composition can contain silver, a glass frit, a metal additive and an organic vehicle system. The metal additive is at least one selected from the group consisting of yttrium, an organo- vanadium compound, organo-antimony compound, organo-phosphorus compound, and an organo-yttrium compound. The paste can be used for making a solar cell contact.

IPC Classes  ?

• H01L 31/02 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof - Details
• H01L 31/0224 - Electrodes

Abstract

An electroconductive paste composition, particularly for solar cells, contains silver particles, glass particles, an organic vehicle, and at least one additive. The additive may be tantalum pentoxide or fine, electrically conductive, metal particles, such as gold and/or platinum group metals. When used to form an electrical contact on a solar cell, such a paste provides for enhanced adhesion of the contact to the cell and improved electron transmission.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Goods & Services

Polymeric ink; polymeric ink for surface micromachining; sacrificial layer and sacrificial underlayer polymeric ink; etch layer and etch resistant polymeric ink; encapsultive or protective polymeric ink

Abstract

Formulations and methods of making solar cells are disclosed. In general, the invention presents a solar cell contact made from a mixture wherein the mixture comprises a solids portion and an organics portion, wherein the solids portion comprises from about 85 to about 99 wt % of a metal component, and from about 1 to about 15 wt % of a lead-free glass component. Both front contacts and back contacts are disclosed.

IPC Classes  ?

• H01L 31/042 - PV modules or arrays of single PV cells