01 - Chemical and biological materials for industrial, scientific and agricultural use
03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations
06 - Common metals and ores; objects made of metal
Goods & Services
Flux for use with aluminum solder; adhesives for use in
surface mount applications; adhesives for use in electronics
industry; soldering chemicals for use in solder joint
attachment applications in the electronics industry;
industrial adhesives used in the assembly, maintenance and
repair of electronics for use in electronics industry;
industrial chemicals used for cleaning electronic
applications. Cleaners for use in soldering; cleaning chemicals used in
cleaning of flux residues; cleaning agents for use in
electronic industry. Aluminum solder; aluminum preforms; aluminum paste;
soldering wire of aluminum; soldering metals.
42 - Scientific, technological and industrial services, research and design
Goods & Services
Material science consulting services to evaluate, research,
and report the functional and performance compatibility of
joining together different materials in the manufacture of
goods; technical consulting services to evaluate, research,
and report the functional and performance compatibility of
joining, protective coating or managing thermal heat via
different materials to create electronic products.
3.
SOLDER JOINT COMPRISING A TIN ALLOY AND AN ENCAPSULANT COMPRISING SILICA PARTICLES IN AN EPOXY RESIN, AND ELECTRONIC DEVICE
A solder joint at least partially encapsulated with an encapsulant, wherein the solder joint comprises a tin alloy; the encapsulant comprises silica particles dispersed in an epoxy resin; and the tin alloy comprises: from 2.8 to 4.5 wt.% silver, from 2.8 to 4 wt.% bismuth, from 1.0 to 6.5 wt.% antimony, from 0.3 to 1.2 wt.% copper, from 0.001 to 0.4 wt.% nickel, from 0.001 to 0.3 wt.% titanium, and the balance tin together with unavoidable impurities.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
4.
FORMABLE AND FLEXIBLE HAPTICS MATERIALS AND STRUCTURES
A composition comprising: a piezoelectric polymer, and a binder. The composition may be printed to form a haptic component during a method of forming an electronic device.
A method of manufacturing a bond pad for connecting a die to a copper ribbon or copper wire on a printed circuit board, the method comprising: providing a sheet of copper foil having a first major surface opposite a second major surface; providing a sinterable film of metal particles; forming a laminated sheet by laminating the first major surface with the sinterable film; and punching a bond pad from the laminated sheet.
H01L 23/00 - Details of semiconductor or other solid state devices
B22F 7/06 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools
42 - Scientific, technological and industrial services, research and design
Goods & Services
Material science consulting services to evaluate, research, and report the functional and performance compatibility of joining together different materials in the manufacture of goods; technical consulting services to evaluate, research, and report the functional and performance compatibility of joining, protective coating or managing thermal heat via different materials to create electronic products
7.
LOW TEMPERATURE SOLDERING SOLUTIONS FOR POLYMER SUBSTRATES, PRINTED CIRCUIT BOARDS AND OTHER JOINING APPLICATIONS
A solder paste comprising: a solder alloy, and a solder flux comprising an activator, wherein the activator comprises an organic acid activator and an organic amine activator, and wherein the molar ratio of organic acid activator to organic amine activator is from 0.8 to 2.5. A method of forming a solder joint comprising: (i) providing two or more work pieces to be joined; (ii) providing the solder paste of claim 1; and (iii) heating the solder paste in the vicinity of the work pieces to be joined.
A graphical user interface (GUI) to communication evidenced-based value propositions to a customer The tool is capable of presenting interactively compelling evidenced based value and enables engagement of various integrated solutions that can be tailored to specific customer needs. Thus, the tool of the present invention is desired to demonstrate an interface of various integrated solutions to provide evidence-based value propositions for evaluation and consideration by the customer.
A graphical user interface (GUI) to communication evidenced-based value propositions to a customer The tool is capable of presenting interactively compelling evidenced based value and enables engagement of various integrated solutions that can be tailored to specific customer needs. Thus, the tool of the present invention is desired to demonstrate an interface of various integrated solutions to provide evidence-based value propositions for evaluation and consideration by the customer.
B22F 3/00 - Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sinteringApparatus specially adapted therefor
G06F 3/0482 - Interaction with lists of selectable items, e.g. menus
C09D 173/00 - Coating compositions based on macromolecular compounds obtained by reactions forming a linkage containing oxygen or oxygen and carbon in the main chain, not provided for in groups Coating compositions based on derivatives of such polymers
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
G06T 11/20 - Drawing from basic elements, e.g. lines or circles
01 - Chemical and biological materials for industrial, scientific and agricultural use
03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations
06 - Common metals and ores; objects made of metal
Goods & Services
flux for use with aluminum solder; adhesives for use in surface mount applications; adhesives for use in electronics industry; solder joint attachment applications in the electronics industry; industrial adhesives used in the assembly, maintenance and repair of electronics for use in electronics industry; industrial chemicals used for cleaning electronic applications cleaners for use in soldering; cleaning chemicals used in cleaning of flux residues; cleaning agents for use in electronic industry aluminum solder; aluminum preforms; aluminum paste; soldering wire of aluminum; soldering metals
A method of manufacturing a solar module, the method comprising: connecting a metallic interconnector to two or more solar cells; and applying a transparent cover sheet to the two or more solar cells, wherein connecting the metallic interconnector to each solar cell of the two or more solar cells comprises: providing a solar cell having a bus bar on a surface thereof; providing a metallic interconnector having solder flux on a contact surface thereof; providing solder between the bus bar and the contact surface; and reflowing the solder to connect the metallic interconnector to the bus bar, wherein the solder flux comprises a reflective additive.
H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations
16 - Paper, cardboard and goods made from these materials
Goods & Services
Chemical cleaners directed to the circuit board industry for
cleaning of flux residues, light emitting diodes and organic
light emitting diodes and power driver and control systems
circuits (terms considered too vague by the International
Bureau - Rule 13 (2) (b) of the Regulations). Metal stencils used in printing processes with solder paste
for the production of printed circuit boards.
Methods for producing graphene-based products using graphene paste compositions. These methods include producing free-standing graphene foils, films, sheets, polymer supported graphene films, printed graphene structures, graphene features on polymer films, graphene substrates, and graphene metal foils. The methods impart functional characteristics, including corrosion protection and barrier properties to achieve selective enhancement of desired electrical, thermal, mechanical, barrier and other properties.
B29C 51/14 - Shaping by thermoforming, e.g. shaping sheets in matched moulds or by deep-drawingApparatus therefor using multilayered preforms or sheets
B29K 67/00 - Use of polyesters as moulding material
B29K 69/00 - Use of polycarbonates as moulding material
C09K 5/14 - Solid materials, e.g. powdery or granular
H01B 1/04 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of carbon-silicon compounds, carbon, or silicon
H01L 23/00 - Details of semiconductor or other solid state devices
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
B22F 1/102 - Metallic powder coated with organic material
B22F 1/107 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
B22F 7/04 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite layers with one or more layers not made from powder, e.g. made from solid metal
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
B23K 35/365 - Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
B23K 103/00 - Materials to be soldered, welded or cut
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
A method of synthesizing high quality graphene for producing graphene particles and flakes is presented. The engineered qualities of the graphene include size, aspect ratio, edge definition, surface functionalization and controlling the number of layers. Fewer defects are found in the end graphene product in comparison to previous methods. The inventive method of producing graphene is less aggressive, lower cost and more environmentally friendly than previous methods. This method is applicable to both laboratory scale and high volume manufacturing for producing high quality graphene flakes.
C25B 1/00 - Electrolytic production of inorganic compounds or non-metals
C25B 9/00 - Cells or assemblies of cellsConstructional parts of cellsAssemblies of constructional parts, e.g. electrode-diaphragm assembliesProcess-related cell features
17.
NANO COPPER PASTE AND FILM FOR SINTERED DIE ATTACH AND SIMILAR APPLICATIONS
A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.
H01L 23/00 - Details of semiconductor or other solid state devices
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
B22F 1/07 - Metallic powder characterised by particles having a nanoscale microstructure
B22F 1/102 - Metallic powder coated with organic material
B22F 5/00 - Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
B22F 9/24 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B82Y 40/00 - Manufacture or treatment of nanostructures
03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations
16 - Paper, cardboard and goods made from these materials
Goods & Services
(1) Chemical cleaners directed to the circuit board industry for cleaning of flux residues, light emitting diodes and organic light emitting diodes and power driver and control systems circuits (terms considered too vague by the International Bureau - Rule 13 (2) (b) of the Regulations).
(2) Metal stencils used in printing processes with solder paste for the production of printed circuit boards.
01 - Chemical and biological materials for industrial, scientific and agricultural use
06 - Common metals and ores; objects made of metal
Goods & Services
Industrial chemicals for cleaning circuit boards and surface
mount devices; chemical preparations for soldering, namely,
solder fluxes. Metal goods, namely bar solder, solder paste, solder
preforms, solder wire; pastes containing metal powder for
use in soldering, silver solder.
20.
SOLDERING METHOD, SOLDER PASTE, SOLDER FLUX AND SOLDER JOINT
A soldering method comprising: providing a solder paste between two or more work pieces to be joined, the solder paste comprising solder particles dispersed in a paste flux; and subjecting the solder paste to a temperature profile to reflow the solder particles and form a solder joint between the two or more work pieces, wherein, when the paste flux is subjected to thermogravimetric analysis according to ASTM E1131-20, weight loss occurring in the range of from the solidus temperature of the solder to the highest temperature in the temperature profile is no more than 25%.
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.
01 - Chemical and biological materials for industrial, scientific and agricultural use
06 - Common metals and ores; objects made of metal
Goods & Services
Industrial chemicals for cleaning circuit boards and surface mount devices; chemical preparations for soldering, namely, solder fluxes Metals goods, namely bar solder, solder paste, solder preforms, solder wire; Pastes containing metal powder for use in soldering, silver solder
23.
Stretchable interconnects for flexible electronic surfaces
A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
B22F 1/107 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
H05K 1/09 - Use of materials for the metallic pattern
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.
03 - Cosmetics and toiletries; cleaning, bleaching, polishing and abrasive preparations
16 - Paper, cardboard and goods made from these materials
Goods & Services
chemical cleaners directed to the circuit board industry for cleaning of flux residues, light emitting diodes and organic light emitting diodes and power driver and control systems circuits Metal stencils used in printing processes with solder paste for the production of printed circuit boards
26.
COMPOSITION FOR USE IN THE MANUFACTURE OF AN IN-MOULD ELECTRONIC (IME) COMPONENT
A composition for use in the manufacture of an in-mould electronic (IME) component, the composition containing a binder comprising: a cross-linking agent comprising melamine formaldehyde, a thermoplastic resin comprising a hydroxyl group, and a solvent.
C08L 61/28 - Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
C09D 11/103 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds of aldehydes, e.g. phenol-formaldehyde resins
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin.
A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony. The alloy may further comprise antimony, nickel, or both. The silver may be present in an amount from about 3.1% to 3.8% by weight of the solder. The copper may be present in an amount from about 0.5% to 0.8% by weight of the solder. The bismuth may be present in an amount from about 0.0% (or 1.5%) to about 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.03% to about 1.0% (or 0.05%) by weight of the solder. The titanium may be present in an amount from about 0.005% to about 0.02% by weight of the solder. The antimony may be present in an amount between about 1.0% to about 3.0% by weight of the solder. The balance of the solder is tin.
A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises from 3.5 to 4.5 wt.% of silver, 2.5 to 4 wt.% of bismuth, 0.3 to 0.8 wt.% of copper, 0.03 to 1 wt.% nickel, 0.005 to 1 wt.% germanium, and a balance of tin, together with any unavoidable impurities.
B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
B23K 1/08 - Soldering by means of dipping in molten solder
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
C22C 13/02 - Alloys based on tin with antimony or bismuth as the next major constituent
B23K 1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
B23K 1/002 - Soldering by means of induction heating
B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
A composition comprising: a piezoelectric polymer, and a binder. The composition may be printed to form a haptic component during a method of forming an electronic device.
H10N 30/074 - Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
A method of manufacturing a bond pad for connecting a die to a copper ribbon or copper wire on a printed circuit board, the method comprising: providing a sheet of copper foil having a first major surface opposite a second major surface; providing a sinterable film of metal particles; forming a laminated sheet by laminating the first major surface with the sinterable film; and punching a bond pad from the laminated sheet.
This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.
H01H 13/704 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by the layers, e.g. by their material or structure
33.
METHOD OF JOINING ELECTRICAL AND MECHANICAL COMPONENTS USING LAMINATED MODULAR PREFORMS
A method of applying a sinterable film to a substrate during a surface mount technology (SMT) process comprises: providing a substrate; providing a preform comprising a support film, the support film having a first surface and a second surface opposite the first surface, the support film being laminated with a sinterable film of metal particles (e.g., Ag, Ag alloy, Au, Au alloy, Cu, Cu alloy, Rd, Rd alloy, Ni, Ni alloy, Al, Al alloy, Ag-coated Cu, Cu-coated Ag) on the first surface but not on the second surface; providing a pick-and-place machine comprising a placement head; picking up the preform via the second surface using the placement head of the pick-and-place machine; placing the preform in contact with the substrate using the pick-and-place machine, wherein the contact is via the sinterable film; attaching the sinterable film to the substrate; and separating the support film from the sinterable film. The placement head may comprise a vacuum nozzle, wherein picking up the preform via the support film comprises applying a vacuum to the second surface using the vacuum nozzle. Separating the support film from the sinterable film may be carried out by moving the placement head of the pick-and-place machine away from the support film while maintaining the vacuum. The support film may be discarded from the pick-and-place machine by removing the vacuum. The support film may be used to manufacture a further preform. The preform may be placed in contact with a cavity or recess of the substrate. The preform may be picked up, using the placement head of the pick-and- place machine, from a holding carrier, preferably a holding carrier in the form of a waffle pack, a carrier tape or a spooled tape-and- reel station. The support film may comprise polymer or ta polymeric support film. The substrate may be selected from a Direct Bonded Copper (DBC) substrate, an Active Metal Brazed (AMB) substrate, a semiconductor surface in the form of a gate pad, a source pad, a drain pad, a collector pad, a silicon wafer substrate, a heat spreader, a metallic connector and a piezoelectric substrate. The preform may be in the shape of a square, a rectangle, a circle, and any polygonal shape that conforms to the general dimensions of the substrate. The metal particles have a longest dimension of from 1 to 1000 nm, preferably from 2 to 500 nm, more preferably from 5 to 100 nm, even more preferably from 10 to 60 nm. The metal particles may be capped with a capping agent, preferably selected from one or more of a fatty acid, a fatty amine and starch. The sinterable film may comprise non-metallic particles, which may be selected from one or more of carbon, silicon carbide, aluminum nitride, boron nitride and silicon dioxide, in coated or uncoated forms. The metal particles may comprise silver particles and the sinterable film may be substantially devoid of particles of copper, aluminum, glass, carbon and graphite. The sinterable film may be devoid of a silver foil layer. The sinterable film may comprise a binder, preferably having a softening point of from 50 tom 170 °C, more preferably from 70 to 120 °C. The binder may comprise a resin and/or a rosin, preferably a hydrogenated rosin. The sinterable film may comprise a solvent, preferably selected from one or more of terpineol, butyl carbitol and isopropanol. The attaching of the sinterable film to the substrate is carried out at a temperature of from 130 to 170 °C and/or a pressure of from 2 to 5 MPa and/or for a time of from 100 to 2000 ms, preferably from 100 to 800 ms. A stack of sinterable films may be formed on the substrate by applying a first sinterable film to a substrate using the above method and stacking sequentially one or more further sinterable films on the first sinterable film, each of the one or more further sinterable films being stacked by a similar method. The first sinterable film may be formed of the same material as the one or more further sinterable films or of a material having different mechanical and/ or thermal properties to those of at least one of the one or more further sinterable films, wherein two further sinterable films may be stacked on the first sinterable film to form a stack having an inner sinterable film and two outer sinterable films, the inner sinterable film being formed of material having different mechanical and/or thermal properties to those of the material forming the two outer sinterable films. Additive particles may be comprised between the first sinterable film and a further sinterable film and/or between further sinterable films, wherein the additive particles may comprise particles having a higher thermal conductivity than the material of the first sinterable film and one or more further sinterable films, e.g., comprising diamond, and/or wherein the additive particles comprise particles having a different Young's modulus than the material of the first sinterable film and one or more further sinterable films. A die may be attached to a substrate by a method comprising: applying a sinterable film to a substrate or forming a stack of sinterable films on a substrate using the above method; contacting a die with the sinterable film or stack of sinterable films; and sintering the sinterable film or stack of sinterable films to attach the die to the substrate. The width of the sinterable film may be smaller than the width of the die and the width of the substrate, wherein the die may comprise edge passivation and be contacted with the sinterable film so that the sinterable film does not contact the edge passivation. A method of attaching a clip, bond pad or top-side bridging structure to a die comprises: providing a die attached to a substrate; applying a sinterable film to the die; contacting the sinterable film with a clip, bond pad or top-side bridging structure; and sintering the sinterable film to attach the clip, bond pad or top-side bridging structure to the die, wherein: applying the sinterable film to the die is carried out by a method comprising: providing a preform comprising a support film, the support film having a first surface and a second surface opposite the first surface, the support film being laminated with a sinterable film of metal particles on the first surface but not on the second surface; providing a pick-and-place machine comprising a placement head; picking up the preform via the second surface using the placement head of the pick-and-place machine; placing the preform in contact with the die using the pick-and-place machine, wherein the contact is via the second surface; attaching the sinterable film to the die; and separating the support film from the sinterable film; wherein the sinterable film may comprise a stack of sinterable films. The bond pad may consist of a buffering layer between sensitive topside metals of the die and harsh interconnect methods such as copper wire or copper ribbon bonding which require high forces and ultrasonic energies. The top-side bridging structure may lead to a double¬ side cooled module, where the drain and source connections of the die are sintered to planar substrates to improve cooling potential and increase the volumetric density of a power module. A bridging contactor may also connect a die in a cavity of a substrate with a contact of the substrate.
H01L 21/603 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of pressure, e.g. thermo-compression bonding
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
H01L 23/49 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions wire-like
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
A method of manufacturing a solar module, the method comprising: connecting a metallic interconnector to two or more solar cells; and applying a transparent cover sheet to the two or more solar cells, wherein connecting the metallic interconnector to each solar cell of the two or more solar cells comprises: providing a solar cell having a bus bar on a surface thereof; providing a metallic interconnector having solder flux on a contact surface thereof; providing solder between the bus bar and the contact surface; and reflowing the solder to connect the metallic interconnector to the bus bar, wherein the solder flux comprises a reflective additive.
H01L 31/05 - Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.
A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt. % of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt. % of the metal of the metal complex, based on the total weight of the sintering composition.
B22F 7/04 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite layers with one or more layers not made from powder, e.g. made from solid metal
B22F 1/107 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
B22F 9/30 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
H05K 1/09 - Use of materials for the metallic pattern
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H01B 13/012 - Apparatus or processes specially adapted for manufacturing conductors or cables for manufacturing wire harnesses
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H01L 23/00 - Details of semiconductor or other solid state devices
H01B 1/02 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of metals or alloys
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.
A lead-free solder alloy comprising: from 2.5 to 5 wt. % silver; from 0.01 to 5 wt. % bismuth; from 1 to 7 wt. % antimony; from 0.01 to 2 wt. % copper; one or more of: up to 6 wt. % indium, up to 0.5 wt. % titanium, up to 0.5 wt. % germanium, up to 0.5 wt. % rare earths, up to 0.5 wt. % cobalt, up to 5.0 wt. % aluminium, up to 5.0 wt. % silicon, up to 0.5 wt. % manganese, up to 0.5 wt. % chromium, up to 0.5 wt. % iron, up to 0.5 wt. % phosphorus, up to 0.5 wt. % gold, up to 1 wt. % gallium, up to 0.5 wt. % tellurium, up to 0.5 wt. % selenium, up to 0.5 wt. % calcium, up to 0.5 wt. % vanadium, up to 0.5 wt. % molybdenum, up to 0.5 wt. % platinum, and up 0 to 0.5 wt. % magnesium; optionally up to 0.5 wt. % nickel; and the balance tin together with any unavoidable impurities.
A method of making a combined sinter-ready silver film and carrier comprises the steps of: a) creating a carrier comprising designed openings; b) casting a silver film layer into the designed openings, for example casting a silver paste; and c) drying the carrier and silver film layer to form the combined sinter-ready silver film and carrier. The carrier may comprise a plastic carrier, which may be created by permanently bonding two plastic films, using a plasma bonding process or using a temperature stable glue. The carrier may comprise a stencil layer and a backing layer. The stencil layer may define the designed openings. The backing layer may be configured for sealing a bottom of the designed openings, wherein at the start of step b), a top of the designed openings may be open for receiving the cast silver film layer.
B22D 21/00 - Casting non-ferrous metals or metallic compounds so far as their metallurgical properties are of importance for the casting procedureSelection of compositions therefor
B22D 21/06 - Casting non-ferrous metals with a high melting-point, e.g. metallic carbides
B22D 25/04 - Casting metal electric battery plates or the like
A method of fabricating a solar module by interconnection of a plurality of photovoltaic (PV) cells in which at least a first PV cell is interconnected to a second PV cell using an electrically-conductive adherent comprising or consisting of a solder paste. The solder paste comprises particles of solder alloy dispersed in a solder flux. The solder alloy comprises a Sn-containing solder alloy having a liquidus temperature of less than 225° C.
A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
C09C 3/08 - Treatment with low-molecular-weight organic compounds
B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites
B22F 1/05 - Metallic powder characterised by the size or surface area of the particles
B22F 1/16 - Metallic particles coated with a non-metal
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
B22F 1/102 - Metallic powder coated with organic material
01 - Chemical and biological materials for industrial, scientific and agricultural use
06 - Common metals and ores; objects made of metal
Goods & Services
solder cream; solder paste. solder wire; hard solder; soft solder; solder balls; soldering wire of metal; solder alloys; solder preforms; all of the foregoing for use in connection with power electronics applications, sintering applications, automotive applications, and inverters.
43.
COMPOSITION FOR USE IN THE MANUFACTURE OF AN IN-MOULD ELECTRONIC (IME) COMPONENT
A composition for use in the manufacture of an in-mould electronic (IME) component, the composition containing a binder comprising: a cross-linking agent comprising melamine formaldehyde, a thermoplastic resin comprising a hydroxyl group, and a solvent.
C08L 61/28 - Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with heterocyclic compounds with melamine
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin.
A lead-free solder alloy comprising: from 1 to 9 wt. % copper, at least one of: from greater than 0 to 1 wt. % nickel, from greater than 0 to 10 wt. % germanium, from greater than 0 to 10 wt. % manganese, from greater than 0 to 10 wt. % aluminium, from greater than 0 to 10 wt. % silicon, from greater than 0 to 9 wt. % bismuth, from greater than 0 to 5 wt. % indium, from greater than 0 to 1 wt. % titanium, from greater than 0 to 2 wt. % lanthanum, from greater than 0 to 2 wt. % neodymium, optionally one or more of: up to 1 wt. % for: chromium, gallium, cobalt, iron, phosphorous, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium; up to 5 wt. % silver, up to 1 wt. % zinc, up to 2 wt. % rare earth metals, excluding lanthanum and neodymium, and the balance tin together with any unavoidable impurities.
The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.
B41M 5/00 - Duplicating or marking methodsSheet materials for use therein
C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
C09D 11/101 - Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
C09D 11/107 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
B22F 1/107 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.
A solder alloy comprising: from 40 to 65 wt. % bismuth; from I to IO wt. % indium; at least one of: from 0.1 to 5 wt. % gallium, from 0.1 to 5 wt. % zinc, from 0.1 to 2 w. % copper, from 0.01 to 0.1 wt. % cobalt, from 0.1 to 2 wt. % silver, from 0.005 to 0.05 wt. % titanium, and from 0.01 to 1 wt. % nickel; optionally up to 1 wt. % of one or more of: vanadium, rare earth metals, neodymium, chromium, iron, aluminium, phosphorus, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium, silicon, and manganese; and the balance tin together with any unavoidable impurities.
H01L 23/00 - Details of semiconductor or other solid state devices
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
B22F 1/102 - Metallic powder coated with organic material
B22F 1/107 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
B22F 7/04 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite layers with one or more layers not made from powder, e.g. made from solid metal
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
B23K 35/365 - Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
B23K 103/00 - Materials to be soldered, welded or cut
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
A sintering powder, wherein a least a portion of the particles making up the sintering powder comprise:
a core comprising a first material; and
a shell at least partially coating the core, the shell comprising a second material having a lower oxidation potential than the first material.
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 1/02 - Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition comprising coating of the powder
B22F 9/24 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
54.
Nano copper paste and film for sintered die attach and similar applications
A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.
B22F 1/102 - Metallic powder coated with organic material
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
B22F 1/07 - Metallic powder characterised by particles having a nanoscale microstructure
B22F 5/00 - Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
B22F 9/24 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
H01L 23/00 - Details of semiconductor or other solid state devices
B82Y 40/00 - Manufacture or treatment of nanostructures
A solder material for use in electronic assembly, the solder material comprising: solder layers; and a core layer comprising a core material, the core layer being sandwiched between the solder layers, wherein: the thermal conductivity of the core material is greater than the thermal conductivity of the solder.
A sintering composition, consisting essentially of: a solvent; and a metal complex dissolved in the solvent, wherein: the sintering composition contains at least 60 wt.% of the metal complex, based on the total weight of the sintering composition; and the sintering composition contains at least 20 wt.% of the metal of the metal complex, based on the total weight of the sintering composition.
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 7/04 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite layers with one or more layers not made from powder, e.g. made from solid metal
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
B22F 9/30 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
A lead-free solder alloy comprising: from 2.5 to 5 wt.% silver; from 0.01 to 5 wt.% bismuth; from 1 to 7 wt.% antimony; from 0.01 to 2 wt.% copper; one or more of: up to 6 wt.% indium, up to 0.5 wt.% titanium, up to 0.5 wt.% germanium, up to 0.5 wt.% rare earths, up to 0.5 wt.% cobalt, up to 5.0 wt.% aluminium, up to 5.0 wt.% silicon, up to 0.5 wt.% manganese, up to 0.5 wt.% chromium, up to 0.5 wt.% iron, up to 0.5 wt.% phosphorus, up to 0.5 wt.% gold, up to 1 wt.% gallium, up to 0.5 wt.% tellurium, up to 0.5 wt.% selenium, up to 0.5 wt.% calcium, up to 0.5 wt.% vanadium, up to 0.5 wt.% molybdenum, up to 0.5 wt.% platinum, and up to 0.5 wt.% magnesium; optionally up to 0.5 wt.% nickel; and the balance tin together with any unavoidable impurities.
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
C22C 13/02 - Alloys based on tin with antimony or bismuth as the next major constituent
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
Methods for producing graphene-based products using graphene paste compositions. These methods include producing free-standing graphene foils, films, sheets, polymer supported graphene films, printed graphene structures, graphene features on polymer films, graphene substrates, and graphene metal foils. The methods impart functional characteristics, including corrosion protection and barrier properties to achieve selective enhancement of desired electrical, thermal, mechanical, barrier and other properties.
B29C 51/14 - Shaping by thermoforming, e.g. shaping sheets in matched moulds or by deep-drawingApparatus therefor using multilayered preforms or sheets
B29K 67/00 - Use of polyesters as moulding material
B29K 69/00 - Use of polycarbonates as moulding material
C09K 5/14 - Solid materials, e.g. powdery or granular
H01B 1/04 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of carbon-silicon compounds, carbon, or silicon
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Adhesives for use in electronics industry; non-conductive
adhesives for use in electronics industry; unprocessed epoxy
resins for use in electronics industry; industrial adhesives
used in the assembly, maintenance and repair of electronics
for use in electronics industry; fillers for use with
electronic components, namely, unprocessed epoxy resins for
use as underfill; unprocessed epoxy resins; industrial
adhesives, unprocessed artificial resins, unprocessed
synthetic resins, unprocessed epoxy resins for bonding,
wetproofing, coating, encapsulation, sealing, molding,
waterproofing, moisture proofing, heatproofing, solder joint
attachment applications in the electronics industry;
industrial adhesives, unprocessed artificial resins,
unprocessed synthetic resins, and unprocessed epoxy resins
for use in the electronics industry.
60.
SOLDER PASTE FOR MODULE FABRICATION OF SOLAR CELLS
A method of fabricating a solar module by interconnection of a plurality of photovoltaic (PV) cells in which at least a first PV cell is interconnected to a second PV cell using an electrically-conductive adherent comprising or consisting of a solder paste. The solder paste comprises particles of solder alloy dispersed in a solder flux. The solder alloy comprises a Sn-containing solder alloy having a liquidus temperature of less than 225 °C.
A method of making a combined sinter-ready silver film and carrier (1) comprises the steps of: a) creating a carrier (2) comprising designed openings (5); b) casting a silver film layer (7) into the designed openings (5), for example casting a silver paste; and c) drying the carrier (2) and silver film layer (7) to form the combined sinter-ready silver film and carrier (1). The carrier (2) may comprise a plastic carrier, which may be created by permanently bonding two plastic films, using a plasma bonding process or using a temperature stable glue. The carrier (2) may comprise a stencil layer (3) and a backing layer (4). The stencil layer (3) may define the designed openings (5). The backing layer (4) may be configured for sealing a bottom of the designed openings (5), wherein at the start of step b), a top of the designed openings (5) may be open for receiving the cast silver film layer (7). The combined sinter-ready silver film and carrier (1) may be rolled or cut into individual sheets to be ready for industrial use. A method of assembling a component (22) to a substrate (10) comprises the steps of: a) positioning on top of the substrate (10) a combined sinter- ready silver film and carrier (1) of the type comprising a carrier (2) comprising designed openings (5) and a silver film layer (7) cast into the designed openings (5), such that the silver film layer (7) is face down; b) transferring the silver film layer (7) onto the substrate (10) by lamination; c) removing the carrier (2) of the combined sinter-ready silver film and carrier (1); d) placing the component (22) onto the substrate (10) in contact with the transferred silver film layer (7) to form an assembly; and e) sintering the assembly to create a silver joint between the component (22) and the substrate (10). In step b) of the method of assembling a component (22) to a substrate (10), the lamination uses a lamination press (11 + 12) under pressure of 3-8 MPa, optionally 3-6 MPa, optionally 8 MPa, and temperature of 130-150°C, optionally 130°C. In step e) of this method, the sintering is at a pressure of 10 MPa and a temperature of 250°C.
H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 21/98 - Assembly of devices consisting of solid state components formed in or on a common substrateAssembly of integrated circuit devices
62.
Composite and multilayered silver films for joining electrical and mechanical components
A silver film for die attachment in the field of microelectronics, wherein the silver film is a multilayer structure comprising a reinforcing silver foil layer between two layers of sinterable particles. Each layer of sinterable particles comprises a mixture of sinterable silver particles and reinforcing particles. The reinforcing particles comprise glass and/or carbon and/or graphite particles. A method for die attachment using a silver film.
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
B22F 5/00 - Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
B22F 7/04 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite layers with one or more layers not made from powder, e.g. made from solid metal
C22C 32/00 - Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
C22C 49/00 - Alloys containing metallic or non-metallic fibres or filaments
H01L 23/00 - Details of semiconductor or other solid state devices
63.
Stretchable interconnects for flexible electronic surfaces
A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H05K 1/09 - Use of materials for the metallic pattern
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 1/02 - Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition comprising coating of the powder
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
A lead-free solder alloy comprising: from 1 to 9 wt.% copper, at least one of: from greater than 0 to 1 wt.% nickel, from greater than 0 to 10 wt.% germanium, from greater than 0 to 1 wt.% manganese, from greater than 0 to 10 wt.% aluminium, from greater than 0 to 10 wt.% silicon, from greater than 0 to 9 wt.% bismuth, from greater than 0 to 5 wt.% indium, from greater than 0 to 1 wt.% titanium, from greater than 0 to 2 wt.% lanthanum, from greater than 0 to 2 wt.% neodymium, optionally one or more of: up to 1 wt.% chromium, up to 1 wt.% gallium, up to 1 wt.% cobalt, up to 1 wt.% iron, up to 1 wt.% phosphorous, up to 1 wt.% gold, up to 1 wt.% tellurium, up to 1 wt.% selenium, up to 1 wt.% calcium, up to 1 wt.% vanadium, up to 1 wt.% molybdenum, up to 1 wt.% platinum, up to 1 wt.% magnesium, up to 5 wt.% silver, up to 1 wt.% zinc, up to 2 wt.% rare earth metals, excluding lanthanum and neodymium, and the balance tin together with any unavoidable impurities.
A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.
The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.
B41M 5/00 - Duplicating or marking methodsSheet materials for use therein
C09D 11/037 - Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
C09D 11/101 - Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
C09D 11/102 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
C09D 11/107 - Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
C09D 11/38 - Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
adhesives for use in electronics industry; non-conductive adhesives for use in electronics industry; unprocessed epoxy resins for use in electronics industry; industrial adhesives used in the assembly, maintenance and repair of electronics for use in electronics industry; fillers for use with electronic components, namely, unprocessed epoxy resins for use as underfill; unprocessed epoxy resins; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industry; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, and unprocessed epoxy resins for use in the electronics industry
68.
LOW TEMPERATURE SOLDERING SOLUTIONS FOR POLYMER SUBSTRATES, PRINTED CIRCUIT BOARDS AND OTHER JOINING APPLICATIONS
A solder alloy comprising: from 40 to 65 wt.% bismuth; from 1 to 10 wt.% indium; at least one of: from 0.1 to 5 wt.% gallium, from 0.1 to 5 wt.% zinc, from 0.1 to 2 w.% copper, from 0.01 to 0.1 wt.% cobalt, from 0.1 to 2 wt.% silver, from 0.005 to 0.05 wt.% titanium, and from 0.01 to 1 wt.% nickel; optionally one or more of: up to 1 wt.% vanadium, up to 1 wt.% rare earth metals, up to 1 wt.% neodymium, up to 1 wt.% chromium, up to 1 wt.% iron, up to 1 wt.% aluminium, up to 1 wt.% phosphorus, up to 1 wt.% gold, up to 1 wt.% tellurium, up to 1 wt.% selenium, up to 1 wt.% calcium, up to 1 wt.% vanadium, up to 1 wt.% molybdenum, up to 1 wt.% platinum, up to 1 wt.% magnesium, up to 1 wt.% silicon, and up to 1 wt.% manganese; and the balance tin together with any unavoidable impurities.
B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
This invention discloses formulations of mutually compatible sets of graphene, graphene-carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.
H01H 13/704 - Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch having a plurality of operating members associated with different sets of contacts, e.g. keyboard with contacts carried by or formed from layers in a multilayer structure, e.g. membrane switches characterised by the layers, e.g. by their material or structure
70.
NANO COPPER PASTE AND FILM FOR SINTERED DIE ATTACH AND SIMILAR APPLICATIONS
A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 9/24 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150° C., for example up to 175° C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn—Ag—Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.
Methods for producing graphene-based products using graphene paste compositions. These methods include producing free-standing graphene foils, films, sheets, polymer supported graphene films, printed graphene structures, graphene features on polymer films, graphene substrates, and graphene metal foils. The methods impart functional characteristics, including corrosion protection and barrier properties to achieve selective enhancement of desired electrical, thermal, mechanical, barrier and other properties.
C25B 1/00 - Electrolytic production of inorganic compounds or non-metals
C25B 9/00 - Cells or assemblies of cellsConstructional parts of cellsAssemblies of constructional parts, e.g. electrode-diaphragm assembliesProcess-related cell features
A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0 to 1 wt % Cu; from 0 to 0.5 wt % Co; from 0.0001 to 1.0% Sb; and the balance Sn, together with any unavoidable impurities.
A lead-free solder alloy comprising from 35 to 59 wt % Bi; from 0 to 1.0 wt % Ag; from 0.05 to 0.4 wt % Cu; from 0 to 0.5 wt % Co; and the balance Sn, together with any unavoidable impurities.
A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent. A sintering paste and sintering film comprising the sintering powder. A method for making a sintered joint by sintering the sintering powder, paste, or film in the vicinity of two or more workpieces.
C09K 5/14 - Solid materials, e.g. powdery or granular
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 1/02 - Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition comprising coating of the powder
Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.
the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/00 - Details of semiconductor or other solid state devices
A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin.
A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, titanium, and antimony. The alloy may further comprise antimony, nickel, or both. The silver may be present in an amount from about 3.1% to 3.8% by weight of the solder. The copper may be present in an amount from about 0.5% to 0.8% by weight of the solder. The bismuth may be present in an amount from about 0.0% (or 1.5%) to about 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.03% to about 1.0% (or 0.05%) by weight of the solder. The titanium may be present in an amount from about 0.005% to about 0.02% by weight of the solder. The antimony may be present in an amount between about 1.0% to about 3.0% by weight of the solder. The balance of the solder is tin.
A lead-free solder alloy may comprise tin, silver, copper, bismuth, cobalt, and antimony. The alloy may further comprise nickel. The silver may be present in an amount from about 2.0% to 2.8% by weight of the solder. The copper may be present in an amount from about 0.2% to 1.2% by weight of the solder. The bismuth may be present in an amount from about 0.0% to about 5.0% by weight of the solder. In some embodiments, the bismuth may be present in an amount from about 1.5% to 3.2% by weight of the solder. The cobalt may be present in an amount from about 0.001% to about 0.2% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.1% by weight of the solder. The balance of the solder is tin.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
Adhesives for use in electronics industry; non-conductive adhesives for use in electronics industry; unprocessed epoxy resins for use in electronics industry; adhesives used in the assembly, maintenance and repair of electronics; fillers for use with electronic components, namely, unprocessed epoxy resins for use as underfill; unprocessed epoxy resin; adhesives, resins, epoxy and unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industry; adhesives, resins, epoxy and unprocessed epoxy resins for use in the electronics industry.
01 - Chemical and biological materials for industrial, scientific and agricultural use
Goods & Services
adhesives for use in electronics industry; non-conductive adhesives for use in electronics industry; unprocessed epoxy resins for use in electronics industry; industrial adhesives used in the assembly, maintenance and repair of electronics for use in electronics industry; fillers for use with electronic components, namely, unprocessed epoxy resins for use as underfill; unprocessed epoxy resins; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, and unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industry; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, and unprocessed epoxy resins for use in the electronics industry
86.
GRAPHENE ENHANCED AND ENGINEERED MATERIALS FOR MEMBRANE TOUCH SWITCH AND OTHER FLEXIBLE ELECTRONIC STRUCTURES
This invention discloses formulations of mutually compatible sets of graphene, graphene- carbon, metal and dielectric inks for the fabrication of high performance membrane touch switches (MTS). The compositions of these inks are optimized to achieve higher degree of compatibility with highly engineered polymeric substrates, thereby offering a holistic solution for fabricating high-performance MTS. These sets of materials can also be used for fabrication of sensors, biosensors and RFIDs on flexible substrates, such as polymers and papers.
B05D 5/12 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
C09D 11/10 - Printing inks based on artificial resins
C09D 11/101 - Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuity and devices.
A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.
B23K 35/14 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape not specially designed for use as electrodes for soldering
B23K 35/24 - Selection of soldering or welding materials proper
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
C22C 28/00 - Alloys based on a metal not provided for in groups
A method of die and clip attachment includes providing a clip, a die and a substrate, laminating a sinterable silver film on the clip and the die, depositing a tack agent on the substrate, placing the die on the substrate, placing the clip on the die and the substrate to create a substrate, die and clip package, and sintering the substrate, die and clip package.
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
90.
ADVANCED SOLDER ALLOYS FOR ELECTRONIC ENTERCONNECTS
Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.
B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
A method of synthesizing high quality graphene for producing graphene particles and flakes is presented. The engineered qualities of the graphene include size, aspect ratio, edge definition, surface functionalization and controlling the number of layers. Fewer defects are found in the end graphene product in comparison to previous methods. The inventive method of producing graphene is less aggressive, lower cost and more environmentally friendly than previous methods. This method is applicable to both laboratory scale and high volume manufacturing for producing high quality graphene flakes.
A thermal managing electrical connection tape includes a carrier film and a composition including solder powder, with the composition being applied to the carrier film. The composition includes a soldering flux having the solder powder disposed therein. The composition contains between about 50 wt % and about 70 wt % soldering flux. The composition further contains between about 30 wt % and about 50 wt % solder powder. A method of fabricating a thermal managing electrical connection tape includes providing a composition including at least one of a soldering flux and epoxy and/or acrylic, adding a solder powder to the composition, casting the composition on a carrier film, drying the carrier film in a drying furnace to form a dried tape, and cutting the dried tape to a desired width to form a thermal managing electrical connection tape.
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
H01R 4/04 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/00 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
C09J 7/10 - Adhesives in the form of films or foils without carriers
Lead-free solder alloys are described that exhibit favorable high temperature mechanical reliability and thermal fatigue resistance, and are typically capable of withstanding operational temperatures of at least 150°C, for example up to 175°C. The alloys may exhibit improved high temperature mechanical properties compared to the conventional Sn-Ag-Cu and Pb5Sn2.5Ag. The solder may be in the form of a bar, a stick, a solid or flux cored wire, a foil or strip, a film, a preform, or a powder or paste (i.e., a powder plus flux blend), or solder spheres for use in ball grid array joints or chip scale packages, or other pre-formed solder pieces, or a reflowed or solidified solder joint, or pre-applied on any solderabie material such as a copper ribbon.
Stencil frames for tensioning stencils of an angular shape are provided. The stencil frame comprises corner elements (2), edge elements (1), fastening elements (13) and tensioning devices with a tensioning device being associated with each edge element (1). The corner elements (2) each have two, mutually perpendicular, guiding profiles (12) which joined at an intersection of their axes and the edge elements (1) each have a uniaxial reception profile (11). Each reception profile (11) is connectable to two guiding profiles (12) by loose fit. Each tensioning device has at least one elastic element (5) and connects between two neighbouring corner elements (2). A line of force exerted by each tensioning device is parallel to the axis of its corresponding reception profile (11).
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
A shield for shielding a portion of an electronic component from undesirable emissions from neighboring components. The shield comprises a metal body configured to be attached to a substrate, and solder selectively applied to a lower portion of the metal body in manner that allows for both location and volume of the solder to be controlled. A bond is created between the solder and the metal body. The bond may be a metallurgical bond created by proximity of the solder to the at least one leg and sufficient heat and time to bring the solder to a melting temperature of the solder; or a diffusion bond created by heat and pressure. A method of attaching the shield to the substrate is also described.
A jettable etchant composition includes 1 to 90 wt % active ingredient, and a remainder containing any combination of the following: 10 to 90 wt % solvent, 0 to 10 wt % reducing agents, <1 to 20 wt % pickling agent, 0 to 5 wt % surfactant, and 0 to 5 wt % antifoam agent. The composition can also include a soluble compound containing at least one element which when dissolved has a higher standard electrode potential than a metal to be etched or a soluble compound containing a group IA element, and a soluble platinum group metal. An ink composition can include a group VA compound or a group IIIA compound in a solvent system formulated to be jettable on a surface at a drop volume of about 5 to about 10 picoliters and to achieve a final sheet resistance of less than about 20 Ω/α of the surface upon activation.
A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
H05K 1/09 - Use of materials for the metallic pattern
B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
B22F 1/02 - Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition comprising coating of the powder
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
98.
Low temperature high reliability alloy for solder hierarchy
A lead-free, antimony-free solder alloy_suitable for use in electronic soldering applications. The solder alloy comprises (a) from 1 to 4 wt. % silver; (b) from 0.5 to 6 wt. % bismuth; (c) from 3.55 to 15 wt. % indium, (d) 3 wt. % or less of copper; (e) one or more optional elements and the balance tin, together with any unavoidable impurities.
B23K 31/02 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to soldering or welding
B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
B23K 35/00 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
Conductive patterns and methods of using and printing such conductive patterns are disclosed. In certain examples, the conductive patterns may be produced by disposing a conductive material between supports on a substrate. The supports may be removed to provide conductive patterns having a desired length and/or geometry.
H05K 1/09 - Use of materials for the metallic pattern
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
H05K 3/20 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
H05K 3/22 - Secondary treatment of printed circuits
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 21/44 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.
B22F 1/07 - Metallic powder characterised by particles having a nanoscale microstructure
H01L 23/00 - Details of semiconductor or other solid state devices
B22F 7/04 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite layers with one or more layers not made from powder, e.g. made from solid metal
B22F 3/22 - Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sinteringApparatus specially adapted therefor for producing castings from a slip
B22F 5/00 - Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B23K 1/00 - Soldering, e.g. brazing, or unsoldering
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
H01L 21/78 - Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
