Highcon Systems Ltd.

Israel

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2023 2
2022 3
2021 5
2020 2
Before 2020 28
IPC Class
B31F 1/10 - Creasing by rotary tools 8
B23K 26/38 - Removing material by boring or cutting 6
B31F 1/07 - Embossing 5
B31B 50/14 - Cutting, e.g. perforating, punching, slitting or trimming 4
B23K 103/00 - Materials to be soldered, welded or cut 3
See more
NICE Class
07 - Machines and machine tools 3
16 - Paper, cardboard and goods made from these materials 3
40 - Treatment of materials; recycling, air and water treatment, 3
09 - Scientific and electric apparatus and instruments 2
Status
Pending 2
Registered / In Force 38

1.

METHOD AND APPARATUS FOR CONDITIONING OF CARDBOARD

      
Application Number 18105271
Status Pending
Filing Date 2023-02-03
First Publication Date 2023-07-06
Owner Highcon Systems Ltd. (Israel)
Inventor
  • Amir, Nuriel
  • Karp, Michael
  • Ben-David, Or

Abstract

A method and apparatus are disclosed for conditioning a corrugated cardboard stack by causing air to flow through flutes of the stack from an air intake end to an air discharge end of the stack, air moved by an air moving device being confined to flow only, or at least predominantly, through the flutes.

IPC Classes  ?

  • D21H 25/04 - Physical treatment, e.g. heating or irradiating
  • A61L 9/015 - Disinfection, sterilisation or deodorisation of air using gaseous or vaporous substances, e.g. ozone

2.

Sheet conveying apparatus

      
Application Number 17785559
Grant Number 11858776
Status In Force
Filing Date 2021-10-21
First Publication Date 2023-01-12
Grant Date 2024-01-02
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor
  • Shmaiser, Aron
  • Amir, Nuriel

Abstract

A conveying apparatus for feeding sheets into a processing apparatus is discloses which comprises a plurality of nips within which sheets are gripped and driven along a conveying direction towards the processing apparatus, each nip being defined between a respective drive wheel and an opposing reaction surface. The drive wheels are omni-wheels configured to apply a frictional force to advance the sheets in the conveying direction while permitting free movement of the sheets in a direction transverse to the conveying direction, the reaction surfaces permitting free movement of the sheets in the transverse direction, and an elongate guide is arranged on one side of the conveying apparatus, to extend generally parallel to the conveying direction, the conveying apparatus being configured to urge conveyed sheets in the transverse direction into contact with the guide. A control system is provided to move the guide generally in the transverse direction in dependence upon sensed fiducials on the conveyed sheets, to ensure correct alignment of the sheets in the transverse direction with respect to the processing apparatus.

IPC Classes  ?

  • B65H 9/10 - Pusher or like movable registersPusher or gripper devices which move articles into registered position
  • B65H 5/02 - Feeding articles separated from pilesFeeding articles to machines by belts or chains
  • B65H 5/06 - Feeding articles separated from pilesFeeding articles to machines by rollers
  • B65H 5/36 - Article guides or smoothers, e.g. movable in operation
  • B65H 9/16 - Inclined tape, roller, or like article-forwarding side registers

3.

Method and system for creating co-layer surface adhesive rule

      
Application Number 17817999
Grant Number 12202972
Status In Force
Filing Date 2022-08-08
First Publication Date 2022-12-22
Grant Date 2025-01-21
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor
  • Zimmer, Michael
  • Idan, David
  • Ratzman, Aviv
  • Spiryagin, Konstantin
  • Dahan, Lior

Abstract

A co-layer surface-adhesive rule (SAR) that has a pre-defined cross-section profile. The co-layer surface-adhesive rule (SAR) has two or more layers, wherein at least one layer is made from flexible material and wherein at least two layers differ one from the other.

IPC Classes  ?

  • C08L 75/04 - Polyurethanes
  • C08L 23/02 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers not modified by chemical after-treatment
  • C08L 23/16 - Ethene-propene or ethene-propene-diene copolymers
  • C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chainCompositions of derivatives of such polymers

4.

SHEET CONVEYING APPARATUS

      
Application Number IL2021051251
Publication Number 2022/091079
Status In Force
Filing Date 2021-10-21
Publication Date 2022-05-05
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor
  • Shmaiser, Aron
  • Amir, Nuriel

Abstract

A conveying apparatus for feeding sheets into a processing apparatus is discloses which comprises a plurality of nips within which sheets are gripped and driven along a conveying direction towards the processing apparatus, each nip being defined between a respective drive wheel and an opposing reaction surface. The drive wheels are omni- wheels configured to apply a frictional force to advance the sheets in the conveying direction while permitting free movement of the sheets in a direction transverse to the conveying direction, the reaction surfaces permitting free movement of the sheets in the transverse direction, and an elongate guide is arranged on one side of the conveying apparatus, to extend generally parallel to the conveying direction, the conveying apparatus being configured to urge conveyed sheets in the transverse direction into contact with the guide. A control system is provided to move the guide generally in the transverse direction in dependence upon sensed fiducials on the conveyed sheets, to ensure correct alignment of the sheets in the transverse direction with respect to the processing apparatus.

IPC Classes  ?

  • B65H 9/00 - Registering, e.g. orientating, articlesDevices therefor
  • B65H 7/20 - Controlling associated apparatus
  • B65H 5/06 - Feeding articles separated from pilesFeeding articles to machines by rollers
  • B65H 9/16 - Inclined tape, roller, or like article-forwarding side registers

5.

METHOD AND APPARATUS FOR CONDITIONING OF CARDBOARD

      
Application Number IL2021050941
Publication Number 2022/029772
Status In Force
Filing Date 2021-08-03
Publication Date 2022-02-10
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor
  • Amir, Nuriel
  • Karp, Michael
  • Ben David, Or

Abstract

A method and apparatus are disclosed for conditioning a corrugated cardboard stack by causing air to flow through flutes of the stack from an air intake end to an air discharge end of the stack, air moved by an air moving device being confined to flow only, or at least predominantly, through the flutes.

IPC Classes  ?

  • F26B 25/00 - Details of general application not covered by group or
  • B23K 26/16 - Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
  • B31B 50/74 - Auxiliary operations
  • F26B 21/00 - Arrangements for supplying or controlling air or gases for drying solid materials or objects
  • F26B 21/06 - Controlling, e.g. regulating, parameters of gas supply
  • F26B 21/14 - Arrangements for supplying or controlling air or gases for drying solid materials or objects using gases or vapours other than air or steam

6.

HIGHCON

      
Serial Number 97180158
Status Registered
Filing Date 2021-12-20
Registration Date 2025-01-07
Owner HIGHCON SYSTEMS LTD (Israel)
NICE Classes  ?
  • 40 - Treatment of materials; recycling, air and water treatment,
  • 07 - Machines and machine tools
  • 16 - Paper, cardboard and goods made from these materials

Goods & Services

Custom manufacture services which involve cutting, shaping, and creating folding lines of sheets of paper and paper based material including cardboard, in order to create finished products for the printing and packaging industry and making three dimensional models by a material layering process; all of the aforesaid services are limited relating to to the customization of machines for cutting and creating folding lines of sheets of paper and paper based material including cardboard, in order to create finished products for the printing and packaging industry and making three dimensional models by a variable data cutting and layering process Industrial paper and cardboard cutting machines; paper and cardboard creasing machines; paper and cardboard creasing and embossing machines; machines for cutting and creating folding lines of sheets of paper and paper based material including cardboard, in order to create finished products for the printing and packaging industry and making three dimensional models by a material layering process; computerized paper cutting machines; Embedded computer software applications and industrial process control software and lasers sold as a component of computerized machines for cutting and creating folding lines of sheets of paper and paper based material including cardboard, in order to create finished products for the printing and packaging industry and making three dimensional models by a material layering process Boxes of cardboard or paper; cardboard; cardboard boxes; cardboard packaging boxes in collapsible form; collapsible boxes of paper; collapsible cardboard boxes; corrugated cardboard; corrugated cardboard boxes; corrugated containers; corrugated paper; honeycomb paper; paper; printed stationery; stationery paper and paper based material products, namely, cardboard, for the printing and packaging industry produced by making three dimensional models by a material layering process

7.

System and method for cleaning a laser cut substrate

      
Application Number 17285343
Grant Number 12194509
Status In Force
Filing Date 2019-11-04
First Publication Date 2021-12-02
Grant Date 2025-01-14
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor Karp, Michael

Abstract

A system for cleaning a surface of a substrate includes a cleaning element including a resilient compressible material. A liquid source provides liquid directly to the cleaning element, and a squeezing roller engages the cleaning element and applies pressure thereto, to squeeze out excess liquid from said resilient compressible material. A counter element opposes said cleaning element such that the substrate is disposed between the counter element and the cleaning element. The substrate moves between the counter element and the cleaning element such that a surface of the cleaning element, having a suitable amount of liquid absorbed therein, engages and cleans the surface of the substrate without damaging the substrate.

IPC Classes  ?

  • B08B 1/20 - Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
  • B08B 1/10 - Cleaning by methods involving the use of tools characterised by the type of cleaning tool
  • B08B 1/50 - Cleaning by methods involving the use of tools involving cleaning of the cleaning members
  • B08B 11/02 - Devices for holding articles during cleaning
  • B23K 26/38 - Removing material by boring or cutting

8.

METHOD AND SYSTEM FOR CARDBOARD PRETREATMENT

      
Application Number 17341566
Status Pending
Filing Date 2021-06-08
First Publication Date 2021-09-23
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor Zimmer, Michael

Abstract

A system and methods for operating a cardboard processing machine, the method comprising creating a pre-processing crease at a location on the cardboard where it is required to process the cardboard; and processing the cardboard along the pre-process crease.

IPC Classes  ?

  • B23K 26/364 - Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
  • B23K 26/00 - Working by laser beam, e.g. welding, cutting or boring
  • B31B 50/14 - Cutting, e.g. perforating, punching, slitting or trimming
  • B23K 26/08 - Devices involving relative movement between laser beam and workpiece

9.

Method and apparatus for substrate stripping

      
Application Number 17171552
Grant Number 11780108
Status In Force
Filing Date 2021-02-09
First Publication Date 2021-09-02
Grant Date 2023-10-10
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor
  • Ben-David, David
  • Ireni, Eli
  • Zimmer, Michael

Abstract

Methods and apparatus for stripping away portions of substrate are disclosed herein. In some embodiments, a flexible and/or soft impact-element(s) rotates around a rotation axis to drive a peripheral portion across a substrate plane of the substrate and/or to repeatedly collide with the substrate. At least some of the collisions are effective to partially dislodge or to strip away portion(s) of substrate.

IPC Classes  ?

  • B26D 7/18 - Means for removing cut-out material or waste
  • B26D 7/32 - Means for performing other operations combined with cutting for conveying or stacking cut product
  • B26D 5/28 - Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed wherein control means on the work feed means renders the cutting member operative the control means being responsive to presence or absence of work
  • B31B 50/83 - Cutting window openings
  • B31B 110/35 - Shape of rigid or semi-rigid containers having a polygonal cross section rectangular, e.g. square
  • B31B 100/00 - Rigid or semi-rigid containers made by folding single-piece sheets, blanks or webs
  • B31B 50/20 - Cutting sheets or blanks
  • B31B 50/14 - Cutting, e.g. perforating, punching, slitting or trimming

10.

HIGHCON

      
Application Number 018500467
Status Registered
Filing Date 2021-06-24
Registration Date 2021-12-14
Owner Highcon Systems Ltd (Israel)
NICE Classes  ?
  • 07 - Machines and machine tools
  • 09 - Scientific and electric apparatus and instruments
  • 16 - Paper, cardboard and goods made from these materials
  • 40 - Treatment of materials; recycling, air and water treatment,

Goods & Services

Printers; 3D printers; paper and cardboard cutting machines; paper and cardboard machines; paper and cardboard creasing and embossing machines; machines for cutting and creating folding lines of sheets of paper and paper based material including cardboard, in order to create finished products for the printing and packaging industry and making three dimensional models by a material layering process; computerized paper cutting machines. Computer hardware; computerized printers; computer software applications and industrial process control software and lasers for use with 3D printers and computerized machines for cutting and creating folding lines of sheets of paper and paper based material including cardboard, in order to create finished products for the printing and packaging industry and making three dimensional models by a material layering process. Boxes of cardboard or paper; cardboard; cardboard boxes; cardboard packaging boxes in collapsible form; collapsible boxes of paper; collapsible cardboard boxes; corrugated cardboard; corrugated cardboard boxes; corrugated containers; corrugated paper; honeycomb paper; paper; printed stationery; stationery paper and paper based material products namely cardboard, for the printing and packaging industry produced by making three dimensional models by a material layering process. Services relating to transformation of paper, cardboard and paper based substances; paper finishing; laminating; stripping finishes; services which involve cutting, shaping, and creating folding lines of sheets of paper and paper based material including cardboard, in order to create finished products for the printing and packaging industry and making three dimensional models by a material layering process; all services relating to the customization of machines for cutting and creating folding lines of sheets of paper and paper based material including cardboard, in order to create finished products for the printing and packaging industry and making three dimensional models by a material layering process.

11.

Polymeric rule die, and formulations therefor

      
Application Number 16737988
Grant Number 11130307
Status In Force
Filing Date 2020-01-09
First Publication Date 2020-10-22
Grant Date 2021-09-28
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor
  • Rottman, Claudio
  • Zlotnikov, Natalia

Abstract

Die and counter-die systems, polymeric rule dies for such systems, and polymeric formulations suitable for producing such rule dies using digital rule writing. There is provided a rule die for pressure-contacting of a cardboard workpiece surface, including: (a) a die body; and (b) at least one elongate polymeric rule, each rule having: (i) a first elongate base surface adhesively attached to a surface of the die body; and (ii) an elongate protrusion, distally protruding from the die body, the elongate protrusion having an elongate die surface, the elongate die surface including a polymeric material, the elongate die surface having a contact surface adapted to contact the workpiece surface; the contact surface having a length of at least 5 mm and a first width (W) within a range of 0.4 to 1.0 mm, the rule having a height (H) within a range of 1.0 to 4.5 mm; wherein, over a total length of the contact surface, the contact surface having at most 5 surface pocks/meter, the pocks having a diameter above 0.1 mm.

IPC Classes  ?

  • B29C 48/03 - Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired formApparatus therefor characterised by the shape of the extruded material at extrusion
  • B31F 1/10 - Creasing by rotary tools
  • B29C 31/00 - Handling, e.g. feeding of the material to be shaped
  • B29C 43/10 - Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies
  • B31B 50/25 - Surface scoring
  • B29L 31/00 - Other particular articles

12.

SYSTEM AND METHOD FOR CLEANING A LASER CUT SUBSTRATE

      
Application Number IB2019059432
Publication Number 2020/095167
Status In Force
Filing Date 2019-11-04
Publication Date 2020-05-14
Owner HIGHCON SYSTEMS LTD (Israel)
Inventor Karp, Michael

Abstract

A system for cleaning a surface of a substrate includes a cleaning element including a resilient compressible material. A liquid source provides liquid directly to the cleaning element, and a squeezing roller engages the cleaning element and applies pressure thereto, to squeeze out excess liquid from said resilient compressible material. A counter element opposes said cleaning element such that the substrate is disposed between the counter element and the cleaning element. The substrate moves between the counter element and the cleaning element such that a surface of the cleaning element, having a suitable amount of liquid absorbed therein, engages and cleans the surface of the substrate without damaging the substrate.

IPC Classes  ?

  • B08B 15/00 - Preventing escape of dirt or fumes from the area where they are producedCollecting or removing dirt or fumes from that area
  • B08B 11/02 - Devices for holding articles during cleaning
  • B08B 11/04 - Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto specially adapted for plate glass, e.g. prior to manufacture of windshields
  • B08B 3/04 - Cleaning involving contact with liquid
  • B23K 26/00 - Working by laser beam, e.g. welding, cutting or boring
  • B23K 103/00 - Materials to be soldered, welded or cut

13.

System for impressing a relief pattern on a substrate

      
Application Number 16304287
Grant Number 11135803
Status In Force
Filing Date 2017-05-25
First Publication Date 2019-03-28
Grant Date 2021-10-05
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor
  • Or, Ron
  • Karp, Michael
  • Rottman, Claudio

Abstract

A die and counter die system for impressing a relief pattern onto a substrate, including at least one male die including a contact surface and defining a relief pattern, a compressible counter film including a base layer, a contact layer disposed opposite the contact surface of the at least one male die and spaced therefrom, and a compressible layer disposed between the base layer and the contact layer and attached thereto. The contact layer is featureless in a region thereof opposing the relief pattern on the at least one male die. The compressible counter film has a compressibility, in a direction perpendicular to a broad face of the compressible counter film, in the range of 5-30% at 1.35 MPa. The system further includes a compression mechanism adapted to move the at least one male die and the compressible counter film towards one another in an operative mode.

IPC Classes  ?

  • B31F 1/07 - Embossing
  • B31F 1/10 - Creasing by rotary tools
  • B44B 5/00 - Machines or apparatus for embossing decorations or marks, e.g. embossing coins
  • B44B 5/02 - DiesAccessories
  • B31F 1/08 - Creasing
  • B29C 59/04 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing using rollers or endless belts

14.

System for creating a relief pattern on a substrate

      
Application Number 16304288
Grant Number 11667099
Status In Force
Filing Date 2017-05-25
First Publication Date 2019-03-21
Grant Date 2023-06-06
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor
  • Or, Ron
  • Karp, Michael
  • Rottman, Claudio

Abstract

A die and counter die system for impressing a relief pattern onto a substrate, including a male die film and at least one female die. The female die includes a female-die contact surface including at least one cavity defining the relief pattern. The male die film includes a flexible male-die contact surface which is featureless in a region thereof opposing the relief pattern on the at least one female die. The system further includes a compression mechanism adapted, when the substrate is disposed between the male die contact surface and the female die contact surface, to move the male die film and the at least one female die towards one another so as to impress the relief pattern on the substrate.

IPC Classes  ?

  • B31F 1/07 - Embossing
  • B31F 1/10 - Creasing by rotary tools
  • B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
  • B31F 1/08 - Creasing
  • B29C 59/04 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing using rollers or endless belts
  • B44B 5/00 - Machines or apparatus for embossing decorations or marks, e.g. embossing coins
  • B44B 5/02 - DiesAccessories

15.

Method and apparatus for building a 3D object from layers of pre-stripped substrate

      
Application Number 15751059
Grant Number 10556415
Status In Force
Filing Date 2015-08-26
First Publication Date 2018-10-18
Grant Date 2020-02-11
Owner HIGHCON SYSTEMS LTD (Israel)
Inventor
  • Ben-David, David
  • Ireni, Eli
  • Zimmer, Michael
  • Karp, Michael
  • Rottman, Claudio

Abstract

Embodiments of the present invention relate to a system and method for manufacturing a three-dimensional object from a stack of pre-stripped layers of substrate. Each object layer is formed by (i) providing substrate comprising waste portion(s) and substrate-retained portion(s) that are attached to each other and separated from one another by cut(s) within the substrate; (ii) subsequently, subjecting the subject of each layer to a stripping process which selectively strips away substrate-waste portion(s) from the substrate-retained portion(s). After stripping, the object layer is added to a stack of previously-stacked object layers to grow the stack. This process is repeated to further grow the stack. Object layers of the stack are bonded to each other to build the three-dimensional object therefrom. Apparatus and methods for stripping are also described—any teaching or combination of teaching(s) related to stripping substrate may be employed in any additive-manufacturing process described herein.

IPC Classes  ?

  • B32B 37/18 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
  • B26F 3/00 - Severing by means other than cuttingApparatus therefor
  • B26D 7/18 - Means for removing cut-out material or waste
  • B26D 3/08 - Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
  • B29C 64/393 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
  • B29C 64/245 - Platforms or substrates
  • B29C 64/147 - Processes of additive manufacturing using only solid materials using sheet material, e.g. laminated object manufacturing [LOM] or laminating sheet material precut to local cross sections of the 3D object
  • B29C 64/141 - Processes of additive manufacturing using only solid materials
  • B33Y 40/00 - Auxiliary operations or equipment, e.g. for material handling
  • B33Y 10/00 - Processes of additive manufacturing
  • B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
  • B32B 41/00 - Arrangements for controlling or monitoring lamination processesSafety arrangements
  • B32B 38/04 - Punching, slitting or perforating
  • B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
  • B32B 38/00 - Ancillary operations in connection with laminating processes

16.

MULTI-ORIFICE NOZZLE AND USES THEREOF

      
Application Number IB2018050792
Publication Number 2018/146620
Status In Force
Filing Date 2018-02-08
Publication Date 2018-08-16
Owner HIGHCON SYSTEMS LTD (Israel)
Inventor
  • Or, Ron
  • Karp, Michael
  • Rottman, Claudio
  • Cohen, Dana Mizrahi

Abstract

A multi-orifice nozzle suitable for drawing a plurality of line rules in parallel, line rules disposed in parallel drawn using the multi-nozzle orifice, and systems and methods for using such line rules for impressing a substrate with a plurality of line indentations disposed in parallel.

IPC Classes  ?

  • B29C 47/26 - Multiple annular extrusion nozzles
  • B05B 1/00 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
  • B31B 50/14 - Cutting, e.g. perforating, punching, slitting or trimming

17.

SYSTEM FOR CREATING A RELIEF PATTERN ON A SUBSTRATE

      
Application Number IB2017053089
Publication Number 2017/208118
Status In Force
Filing Date 2017-05-25
Publication Date 2017-12-07
Owner HIGHCON SYSTEMS LTD (Israel)
Inventor
  • Or, Ron
  • Karp, Michael
  • Rottman, Claudio

Abstract

A die and counter die system for impressing a relief pattern onto a substrate, including a male die film and at least one female die. The female die includes a female-die contact surface including at least one cavity defining the relief pattern. The male die film includes a flexible male-die contact surface which is featureless in a region thereof opposing the relief pattern on the at least one female die. The system further includes a compression mechanism adapted, when the substrate is disposed between the male die contact surface and the female die contact surface, to move the male die film and the at least one female die towards one another so as to impress the relief pattern on the substrate.

IPC Classes  ?

  • B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
  • B31F 1/07 - Embossing
  • B31F 1/10 - Creasing by rotary tools

18.

SYSTEM AND METHOD FOR FORMING A FOLD LINE IN A SUBSTRATE

      
Application Number IB2017053157
Publication Number 2017/208137
Status In Force
Filing Date 2017-05-30
Publication Date 2017-12-07
Owner HIGHCON SYSTEMS LTD (Israel)
Inventor
  • Or, Ron
  • Rottman, Claudio
  • Zimmer, Michael

Abstract

A system and a method for creating a fold line in a substrate, by impressing at least one crease line onto the substrate. The impressing is carried out by compressing the substrate between a die and a corresponding counter die of a creasing module. Following impression of the crease line, at least one cut is made in the substrate along the crease line thereby to form the fold line. The at least one cut has a depth less than the thickness of the substrate at the crease line.

IPC Classes  ?

  • B31B 50/00 - Making rigid or semi-rigid containers, e.g. boxes or cartons
  • B65D 5/00 - Rigid or semi-rigid containers of polygonal cross-section, e.g. boxes, cartons or trays, formed by folding or erecting one or more blanks made of paper
  • B26D 7/00 - Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting

19.

SYSTEM FOR IMPRESSING A RELIEF PATTERN ON A SUBSTRATE

      
Application Number IB2017053087
Publication Number 2017/203464
Status In Force
Filing Date 2017-05-25
Publication Date 2017-11-30
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor
  • Or, Ron
  • Karp, Michael
  • Rottman, Claudio

Abstract

A die and counter die system for impressing a relief pattern onto a substrate, including at least one male die including a contact surface and defining a relief pattern, a compressible counter film including a base layer, a contact layer disposed opposite the contact surface of the at least one male die and spaced therefrom, and a compressible layer disposed between the base layer and the contact layer and attached thereto. The contact layer is featureless in a region thereof opposing the relief pattern on the at least one male die. The compressible counter film has a compressibility, in a direction perpendicular to a broad face of the compressible counter film, in the range of 5-30% at 1.35MPa. The system further includes a compression mechanism adapted to move the at least one male die and the compressible counter film towards one another in an operative mode.

IPC Classes  ?

20.

Polymeric rule die, and formulations therefor

      
Application Number 15129421
Grant Number 10625485
Status In Force
Filing Date 2015-04-07
First Publication Date 2017-04-27
Grant Date 2020-04-21
Owner Highcon Systems Ltd. (Israel)
Inventor
  • Rottman, Claudio
  • Zlotnikov, Natalia

Abstract

Die and counter-die systems, polymeric rule dies for such systems, and polymeric formulations suitable for producing such rule dies using digital rule writing. There is provided a rule die for pressure-contacting of a cardboard workpiece surface, including: (a) a die body; and (b) at least one elongate polymeric rule, each rule having: (i) a first elongate base surface adhesively attached to a surface of the die body; and (ii) an elongate protrusion, distally protruding from the die body, the elongate protrusion having an elongate die surface, the elongate die surface including a polymeric material, the elongate die surface having a contact surface adapted to contact the workpiece surface; the contact surface having a length of at least 5 mm and a first width (W) within a range of 0.4 to 1.0 mm, the rule having a height (H) within a range of 1.0 to 4.5 mm; wherein, over a total length of the contact surface, the contact surface having at most 5 surface pocks/meter, the pocks having a diameter above 0.1 mm.

IPC Classes  ?

  • C08F 2/46 - Polymerisation initiated by wave energy or particle radiation
  • C08F 2/50 - Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
  • C08G 61/04 - Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
  • B31F 1/10 - Creasing by rotary tools
  • B29C 48/03 - Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired formApparatus therefor characterised by the shape of the extruded material at extrusion
  • B31B 50/25 - Surface scoring
  • B29L 31/00 - Other particular articles

21.

METHOD AND APPARATUS FOR BUILDING A 3D OJBECT FROM LAYERS OF PRE-STRIPPED SUBSTRATE

      
Application Number IB2015056481
Publication Number 2017/033046
Status In Force
Filing Date 2015-08-26
Publication Date 2017-03-02
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor
  • Ben-David, David
  • Ireni, Eli
  • Zimmer, Michael
  • Karp, Michael
  • Rottman, Claudio

Abstract

Embodiments of the present invention relate to a system and method for manufacturing a three-dimensional object from a stack of pre-stripped layers of substrate. Each object layer is formed by (i) providing substrate comprising waste portion(s) and substrate-retained portion(s) that are attached to each other and separated from one another by cut(s) within the substrate; (ii) subsequently, subjecting the subject of each layer to a stripping process which selectively strips away substrate- waste portion(s) from the substrate -retained portion(s). After stripping, the object layer is added to a stack of previously-stacked object layers to grow the stack. This process is repeated to further grow the stack. Object layers of the stack are bonded to each other to build the three-dimensional object therefrom. Apparatus and methods for stripping are also described - any teaching or combination of teaching(s) related to stripping substrate may be employed in any additive-manufacturing process described herein.

IPC Classes  ?

  • B29C 67/00 - Shaping techniques not covered by groups , or
  • B32B 38/00 - Ancillary operations in connection with laminating processes

22.

Cardboard-handling system and method

      
Application Number 15155017
Grant Number 10427248
Status In Force
Filing Date 2016-05-15
First Publication Date 2016-11-17
Grant Date 2019-10-01
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor Buschulte, Rainer

Abstract

There is provided a system for handling and creasing cardboard, as well as sub-systems of said system. Other embodiments are also disclosed.

IPC Classes  ?

  • B23K 26/38 - Removing material by boring or cutting
  • B23K 103/00 - Materials to be soldered, welded or cut
  • B31B 50/20 - Cutting sheets or blanks
  • B31B 50/14 - Cutting, e.g. perforating, punching, slitting or trimming

23.

Highcon

      
Application Number 015199318
Status Registered
Filing Date 2016-03-08
Registration Date 2016-07-19
Owner Highcon Systems Ltd (Israel)
NICE Classes  ?
  • 07 - Machines and machine tools
  • 09 - Scientific and electric apparatus and instruments
  • 16 - Paper, cardboard and goods made from these materials
  • 40 - Treatment of materials; recycling, air and water treatment,

Goods & Services

Printers; 3D printers; paper and cardboard cutting machines; paper and cardboard machines; paper and cardboard creasing and embossing machines; machines for cutting and creating folding lines of sheets of paper and paper based material including cardboard, in order to create finished products for the printing and packaging industry and making three dimensional models by a material layering process. Computer hardware; 3D printers, computerized printers and computerized paper cutting machines; computer software applications and industrial process control software and lasers for use with 3D printers and computerized machines for cutting and creating folding lines of sheets of paper and paper based material including cardboard, in order to create finished products for the printing and packaging industry and making three dimensional models by a material layering process. Paper goods; boxes of cardboard or paper; cardboard; cardboard boxes; cardboard packaging boxes in collapsible form; collapsible boxes of paper; collapsible cardboard boxes; corrugated cardboard; corrugated cardboard boxes; corrugated containers; corrugated paper; honeycomb paper; paper; printed stationery; stationery paper and paper based material products including cardboard, for the printing and packaging industry produced by making three dimensional models by a material layering process. Services relating to transformation of paper, cardboard and paper based substances; Paper finishing; laminating; Stripping finishes; Services which involve cutting, shaping, and creating folding lines of sheets of paper and paper based material including cardboard, in order to create finished products for the printing and packaging industry and making three dimensional models by a material layering process; All services relating to the operation, customization and maintenance of machines for cutting and creating folding lines of sheets of paper and paper based material including cardboard, in order to create finished products for the printing and packaging industry and making three dimensional models by a material layering process.

24.

METHOD AND APPARATUS FOR SUBSTRATE STRIPPING

      
Application Number IB2015056451
Publication Number 2016/030830
Status In Force
Filing Date 2015-08-26
Publication Date 2016-03-03
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor
  • Ben-David, David
  • Ireni, Eli
  • Zimmer, Michael

Abstract

Methods and apparatus for stripping away portions of substrate are disclosed herein. In some embodiments, a flexible and/or soft impact-element(s) rotates around a rotation axis to drive a peripheral portion across a substrate plane of the substrate and/or to repeatedly collide with the substrate. At least some of the collisions are effective to partially dislodge or to strip away portion(s) of substrate.

IPC Classes  ?

  • B26D 7/18 - Means for removing cut-out material or waste
  • B31B 41/00 - Machinery characterised by making envelopes or bags of other specific form or construction
  • B26D 7/00 - Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting

25.

POLYMERIC RULE DIE, AND FORMULATIONS THEREFOR

      
Application Number IB2015052513
Publication Number 2015/155685
Status In Force
Filing Date 2015-04-07
Publication Date 2015-10-15
Owner HIGHCON SYSTEMS LTD (Israel)
Inventor
  • Rottman, Claudio
  • Zlotnikov, Natalia

Abstract

Die and counter-die systems, polymeric rule dies for such systems, and polymeric formulations suitable for producing such rule dies using digital rule writing. There is provided a rule die for pressure-contacting of a cardboard workpiece surface, including: (a) a die body; and (b) at least one elongate polymeric rule, each rule having: (i) a first elongate base surface adhesively attached to a surface of the die body; and (ii) an elongate protrusion, distally protruding from the die body, the elongate protrusion having an elongate die surface, the elongate die surface including a polymeric material, the elongate die surface having a contact surface adapted to contact the workpiece surface; the contact surface having a length of at least 5 mm and a first width (W) within a range of 0.4 to 1.0 mm, the rule having a height (H) within a range of 1.0 to 4.5 mm; wherein, over a total length of the contact surface, the contact surface having at most 5 surface pocks/meter, the pocks having a diameter above 0,1 mm.

IPC Classes  ?

26.

Method and system for cardboard pretreatment

      
Application Number 14427022
Grant Number 11059253
Status In Force
Filing Date 2013-09-16
First Publication Date 2015-08-20
Grant Date 2021-07-13
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor Zimmer, Michael

Abstract

A system and methods for operating a cardboard processing machine, the method comprising creating a pre-processing crease at a location on the cardboard where it is required to process the cardboard; and processing the cardboard along the pre-process crease.

IPC Classes  ?

  • B31B 50/25 - Surface scoring
  • B26D 3/08 - Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
  • B26D 9/00 - Cutting apparatus combined with punching or perforating apparatus or with dissimilar cutting apparatus
  • B23K 26/38 - Removing material by boring or cutting
  • B23K 26/60 - Preliminary treatment
  • B31F 1/08 - Creasing
  • B23K 26/40 - Removing material taking account of the properties of the material involved
  • B26D 5/00 - Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
  • B26F 1/00 - PerforatingPunchingCutting-outStamping-outApparatus therefor
  • B31B 50/14 - Cutting, e.g. perforating, punching, slitting or trimming
  • B31B 50/00 - Making rigid or semi-rigid containers, e.g. boxes or cartons
  • B23K 103/00 - Materials to be soldered, welded or cut

27.

Method and system for automatic-adjustable stacker

      
Application Number 13915414
Grant Number 09045292
Status In Force
Filing Date 2013-06-11
First Publication Date 2015-06-02
Grant Date 2015-06-02
Owner Highcon Systems LTD (Israel)
Inventor
  • Ben-David, David
  • Stern, Yaki

Abstract

An automatic-adjustable stacker for controlling the movement of a media, such as cardboard, through a media handling system. The stacker includes a media receiver positioned proximate a feed of the media that receives a leading edge of the media and a controller that causes the media receiver to move from a first position for receiving the media, to a second position for depositing of the media at a desired location. The media receiver is configured to prevent the media from coming into contact with other media already located at the desired location until the media has arrived at the desired location, while creating a concave-like shape to the media while conveying it.

IPC Classes  ?

  • G06F 7/00 - Methods or arrangements for processing data by operating upon the order or content of the data handled
  • B65G 57/02 - Stacking of articles by adding to the top of the stack

28.

Systems and methods for treating and handling cardboard sheets

      
Application Number 14530813
Grant Number 09492984
Status In Force
Filing Date 2014-11-02
First Publication Date 2015-05-28
Grant Date 2016-11-15
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor
  • Ben-David, David
  • Stern, Yaki
  • Smirnov, Yaron
  • Harmon, Tal

Abstract

System and methods of treating or handling cardboard sheets.

IPC Classes  ?

  • G06F 7/00 - Methods or arrangements for processing data by operating upon the order or content of the data handled
  • B31B 1/74 - Auxiliary operations

29.

Method and system for a multiple-orifice nozzle

      
Application Number 14342118
Grant Number 09545638
Status In Force
Filing Date 2012-09-03
First Publication Date 2014-12-25
Grant Date 2017-01-17
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor
  • Spiryagin, Kostantin
  • Sirkis, Lior

Abstract

A multiple-orifice nozzle that is employed for creating surface-adhesive rules onto the surface of a surface-adhesive die. The multiple-orifice nozzle is fluidly in communication with a source of flexible material that is forced or pulled through a selected orifice profile. The orifice profile can be selected based on a variety of criteria and, in some embodiments the orifice profile can be dynamically adjusted or controlled by adjusting the relative position of the multiple-orifice nozzle and/or by adjusting the position of one or more tubes that define various orifices such that the orifice profile is modified.

IPC Classes  ?

  • B05B 3/00 - Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements
  • B05B 13/02 - Means for supporting workArrangement or mounting of spray headsAdaptation or arrangement of means for feeding work
  • B05B 1/14 - Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openingsNozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with strainers in or outside the outlet opening
  • B05C 5/02 - Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work from an outlet device in contact, or almost in contact, with the work
  • B05B 13/04 - Means for supporting workArrangement or mounting of spray headsAdaptation or arrangement of means for feeding work the spray heads being moved during operation
  • B26F 1/44 - Cutters thereforDies therefor

30.

METHOD AND SYSTEM FOR CARDBOARD PRETREATMENT

      
Application Number IL2013000071
Publication Number 2014/045271
Status In Force
Filing Date 2013-09-16
Publication Date 2014-03-27
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor Zimmer, Michael

Abstract

A system and methods for operating a cardboard processing machine, the method comprising creating a pre-processing crease at a location on the cardboard where it is required to process the cardboard; and processing the cardboard along the pre-process crease.

IPC Classes  ?

  • B23K 26/40 - Removing material taking account of the properties of the material involved
  • B26D 9/00 - Cutting apparatus combined with punching or perforating apparatus or with dissimilar cutting apparatus
  • B62D 9/00 - Steering deflectable wheels not otherwise provided for

31.

METHOD AND SYSTEM FOR A DYNAMIC MULTIPLE SCANNERS SYSTEM

      
Application Number IL2013000042
Publication Number 2013/164810
Status In Force
Filing Date 2013-05-01
Publication Date 2013-11-07
Owner HIGHCON SYSTEMS LTD (Israel)
Inventor
  • Smirnov, Yaron
  • Harmon, Tal

Abstract

A multiple laser-beam scanner system for applying pre-treatment to a cardboard item. While maintaining a substantially uniform velocity of conveying the cardboard item through the system, the cardboard item is logically divided into areas and one or more laser-beam scanners are assigned to the areas. As such, the complex areas of the cardboard can be made smaller and/or multiple laser-beam scanners can be assigned to the complex areas to help ensure that dwell time on the cardboard is not increased.

IPC Classes  ?

  • B23K 26/38 - Removing material by boring or cutting
  • B23K 26/08 - Devices involving relative movement between laser beam and workpiece
  • B65G 47/24 - Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles

32.

METHOD AND SYSTEM FOR STRIPPING AND BLANKING A CARDBOARD

      
Application Number IL2013000044
Publication Number 2013/164812
Status In Force
Filing Date 2013-05-01
Publication Date 2013-11-07
Owner HIGHCON SYSTEMS LTD (Israel)
Inventor
  • Ben-David, David
  • Stern, Yaki

Abstract

A pretreated-cardboard stripper system for stripping a plurality of sections (package layout) from a pretreated cardboard; blank a pretreated cardboard. The system can separate between the one or more sections themselves; sort between the stripped sections and the waste. Some embodiments may include a vacuum sorter having a vacuum chamber with openings along its surface (or on part of its surface) and a peeler. A pre-treated cardboard, after been pretreated, may lay on top and along part of the surface of the vacuum chamber. The peeler may then transfer part of the pre-treated cardboard away from the surface of the vacuum chamber. Another embodiment of a pretreated-cardboard stripper may include a selective mask sorter. Yet another embodiment of pretreated-cardboard stripper may include an electrostatic selective mechanism.

IPC Classes  ?

  • B31B 1/00 - Box, carton, envelope or bag making machinery characterised by performing specific operations

33.

METHOD AND SYSTEM FOR AUTOMATIC-ADJUSTABLE STACKER

      
Application Number IL2013000047
Publication Number 2013/164815
Status In Force
Filing Date 2013-05-01
Publication Date 2013-11-07
Owner HIGHCON SYSTEMS LTD (Israel)
Inventor
  • Ben-David, David
  • Stern, Yaki

Abstract

An automatic-adjustable stacker for controlling the movement of a media, such as cardboard, through a media handling system. The stacker includes a media receiver positioned proximate a feed of the media that receives a leading edge of the media and a controller that causes the media receiver to move from a first position for receiving the media, to a second position for depositing of the media at a desired location. The media receiver is configured to prevent the media from coming into contact with other media already located at the desired location until the media has arrived at the desired location, while creating a concave-like shape to the media while conveying it.

IPC Classes  ?

  • B65H 29/18 - Delivering or advancing articles from machinesAdvancing articles to or into piles by contact of one face only with moving tapes, bands, or chains and introducing into a pile

34.

Method and apparatus for laser cutting

      
Application Number 13865758
Grant Number 09436012
Status In Force
Filing Date 2013-04-18
First Publication Date 2013-10-24
Grant Date 2016-09-06
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor Dvorkin, Lev

Abstract

Method and system for laser cutting is disclosed. Using a novel dual-focus optical conversion unit. The dual-focus optical conversion unit may comprise a beam splitter and a convex mirror. The beam splitter may be insensitive to the polarization of an incident beam. The convex mirror may be placed beyond and parallel to the beam splitter, wherein the surface of the convex mirror may be coated with a reflective phase-retarder coating.

IPC Classes  ?

  • G02B 27/14 - Beam splitting or combining systems operating by reflection only
  • B23K 26/067 - Dividing the beam into multiple beams, e.g. multi-focusing
  • B23K 26/38 - Removing material by boring or cutting
  • G02B 26/10 - Scanning systems

35.

SYSTEM AND METHOD FOR CARDBOARD-HANDLING

      
Application Number IL2012000377
Publication Number 2013/076716
Status In Force
Filing Date 2012-11-21
Publication Date 2013-05-30
Owner HIGHCON SYSTEMS LTD (Israel)
Inventor Buschulte, Rainer

Abstract

A cardboard-handling system is disclosed. An example of the system can have a rule-die associated to a first drum and a counter die associated to a second drum for pre-treating cardboards. An alignmentor on a first side of the two drums aligns and conveys a cardboard together with a side-gripper conveyor toward the drums. The side-gripper conveyor transfers the cardboard through the drums for pre-treatment of the cardboard. Next, the side-gripper conveyor conveys the cardboard toward and through a laser-treatment module. The laser-treatment comprise a laser; a base with a plurality of protruding elements; and a coupling mechanism. The coupling mechanism couples one or more cardboards to the top surface of the one or more of the protruding elements while the laser's beam cuts the cardboard.

IPC Classes  ?

  • B23K 26/00 - Working by laser beam, e.g. welding, cutting or boring

36.

Cardboard-handling system and method

      
Application Number 13684196
Grant Number 09346129
Status In Force
Filing Date 2012-11-22
First Publication Date 2013-05-23
Grant Date 2016-05-24
Owner Highcon Systems Ltd. (Israel)
Inventor Buschulte, Rainer

Abstract

A cardboard-handling system with a rule-die associated to a first drum and a counter die associated to a second drum for pre-treating cardboards. A cardboard-alignmentor on a first side of the rule-die and counter-die aligns and conveys a cardboard together with one or more synchronized-cardboard transferors toward a side-gripper conveyor. The side-gripper conveyor transfers the cardboard toward and through the rule-die and counter-die drums for pre-treatment of the cardboard. Next the side-gripper conveyor conveys the cardboard toward and through a laser-treatment module to be further pre-treated. The side gripper conveyor movement is synchronized with a laser-treatment module for which a base with a plurality of protruding elements has moving capabilities and is synchronized with the side-gripper conveyor (via a timing belt for example).

IPC Classes  ?

  • B23K 26/38 - Removing material by boring or cutting
  • B65G 47/24 - Devices influencing the relative position or the attitude of articles during transit by conveyors orientating the articles
  • B23K 26/40 - Removing material taking account of the properties of the material involved
  • B26D 1/01 - Cutting through work characterised by the nature or movement of the cutting memberApparatus or machines thereforCutting members therefor involving a cutting member which does not travel with the work
  • B26D 5/20 - Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting with interrelated action between the cutting member and work feed
  • B26D 7/02 - Means for holding or positioning work with clamping means
  • B26D 7/06 - Arrangements for feeding or delivering work of other than sheet, web, or filamentary form
  • B65G 15/42 - Belts or like endless load-carriers made of rubber or plastics having ribs, ridges, or other surface projections

37.

METHOD AND SYSTEM FOR A MULTIPLE-ORIFICE NOZZLE

      
Application Number IL2012000329
Publication Number 2013/030828
Status In Force
Filing Date 2012-09-03
Publication Date 2013-03-07
Owner HIGHCON SYSTEMS LTD. (Israel)
Inventor
  • Spiryagin, Kostantin
  • Sirkis, Lior

Abstract

A multiple-orifice nozzle that is employed for creating surface-adhesive rules onto the surface of a surface-adhesive die. The multiple-orifice nozzle is fluidly in communication with a source of flexible material that is forced or pulled through a selected orifice profile. The orifice profile can be selected based on a variety of criteria and, in some embodiments the orifice profile can be dynamically adjusted or controlled by adjusting the relative position of the multiple-orifice nozzle and/or by adjusting the position of one or more tubes that define various orifices such that the orifice profile is modified.

IPC Classes  ?

  • B21K 5/20 - Making working faces of dies, either recessed or outstanding

38.

Method and system for creating co-layer surface adhesive rule

      
Application Number 13108450
Grant Number 08777828
Status In Force
Filing Date 2011-05-16
First Publication Date 2012-05-24
Grant Date 2014-07-15
Owner Highcon Systems Ltd. (Israel)
Inventor
  • Zimmer, Michael
  • Ratzman, Aviv
  • Idan, David
  • Dahan, Lior
  • Spiryagin, Kostantin

Abstract

A co-layer surface-adhesive rule (SAR) that has a pre-defined cross-section profile. The co-layer surface-adhesive rule (SAR) has two or more layers, wherein at least one layer is made from flexible material and wherein at least two layers differ one from the other.

IPC Classes  ?

  • B31B 1/14 - Cutting, e.g. perforating, punching, slitting, trimming
  • C08L 23/02 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers not modified by chemical after-treatment
  • C08L 75/04 - Polyurethanes
  • C08L 23/16 - Ethene-propene or ethene-propene-diene copolymers
  • B31B 1/20 - Cutting sheets or blanks
  • C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chainCompositions of derivatives of such polymers

39.

Method and system for surface adhesive rule technology

      
Application Number 13108389
Grant Number 09102818
Status In Force
Filing Date 2011-05-16
First Publication Date 2012-05-17
Grant Date 2015-08-11
Owner Highcon Systems Ltd. (Israel)
Inventor
  • Zimmer, Michael
  • Ratzman, Aviv
  • Idan, David
  • Dahan, Lior
  • Spiryagin, Kostantin

Abstract

A surface-adhesive-rule technology (SART) method and system for creating a surface-adhesive-rule die and counter die for pre-treating cardboard. Wherein the pre-treating comprises: creasing and/or cutting and/or embossing the cardboard. The SART system may comprise: a rule-drawer having one or more cartridges, one or more nozzles, and one or more pressure actuator; a leading mechanism that carries the rule-drawer; and a controller that controls the rule-drawer and the leading mechanism according to a layout of a surface-adhesive-rule die. Each cartridge may comprise flexible materiel and may be associated with one of the nozzles having an orifice with a profile. Further the leading mechanism moves the rule-drawer and the rule-drawer draws a plurality of surface-adhesive rules from the flexible material having an attribute to reserve the shape of the orifice profile through which it is deposited on the surface of a die's body according to commands obtained from the controller.

IPC Classes  ?

  • B05D 5/10 - Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an adhesive surface
  • C08L 23/02 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers not modified by chemical after-treatment
  • C08L 77/00 - Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chainCompositions of derivatives of such polymers
  • B26F 1/44 - Cutters thereforDies therefor
  • B31F 1/07 - Embossing
  • B31F 1/10 - Creasing by rotary tools
  • B29C 47/00 - Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor (extrusion blow-moulding B29C 49/04)
  • C08L 23/16 - Ethene-propene or ethene-propene-diene copolymers
  • C08L 83/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon onlyCompositions of derivatives of such polymers
  • B26F 1/38 - Cutting-outStamping-out
  • C08K 3/36 - Silica
  • C08K 5/5425 - Silicon-containing compounds containing oxygen containing at least one C=C bond

40.

Method and system for creating surface adhesive rule counter die

      
Application Number 13108526
Grant Number 08708881
Status In Force
Filing Date 2011-05-16
First Publication Date 2012-05-17
Grant Date 2014-04-29
Owner HighCon Systems Ltd (Israel)
Inventor
  • Zimmer, Michael
  • Ratzman, Aviv
  • Idan, David
  • Dahan, Lior
  • Spiryagin, Kostantin

Abstract

A Surface-adhesive-rule counter die that comprises a base associated to a flexible-counter film. Wherein the flexible-counter film may comprise one or more types of polymers and has resilience attribute. Wherein the SAR counter die acts as a counter die for pre-treating a plurality of cardboard.

IPC Classes  ?

  • B31B 1/14 - Cutting, e.g. perforating, punching, slitting, trimming
  • B31B 1/20 - Cutting sheets or blanks
  • C08L 23/02 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers not modified by chemical after-treatment
  • C08L 23/16 - Ethene-propene or ethene-propene-diene copolymers