Abstract

A rotary knob device includes a seat, an operation cover, an annular circuit board, a braking ring, a resistance component, and a plurality of elastic components, conductive trigger components, and reset conductive components. The operation cover is pivotally mounted on the seat. The annular circuit board is disposed in the seat. The braking ring is fixed on the annular circuit board and connected to the operation cover. The resistance component is fixed on the seat and abuts against the braking ring. The elastic components are disposed on the braking ring or the annular circuit board. The conductive trigger components are fixed on the operation cover. The reset conductive components are disposed on the braking ring. When the operation cover is pressed, the conductive trigger component compresses the elastic component. When the operation cover is released, the elastic component pushes the conductive trigger component away.

IPC Classes  ?

• H01H 19/14 - Operating parts, e.g. turn knob
• H01H 19/03 - Means for limiting the angle of rotation of the operating part
• H01H 19/08 - BasesStationary contacts mounted thereon
• H01H 19/52 - Switches operated by an operating part which is rotatable about a longitudinal axis thereof and which is acted upon directly by a solid body external to the switch, e.g. by a hand the operating part having four operative positions, e.g. off/two-in-series/one-only/two-in-parallel having only axial contact pressure

Abstract

A knob structure is configured to be installed on a touch function display panel, and includes a seat, at least one conductive pad, a conductive member, an operating cover, and a conductive film. The at least one conductive pad is disposed on the seat. When the at least one conductive pad is triggered, the at least one conductive pad is configured to send a signal to the touch function display panel. The conductive member has a first end portion and a second end portion opposite to the first end portion. The first end portion is abutted against the seat and is electrically coupled to the at least one conductive pad. The operating cover is disposed on the seat, and is configured for contact with a human body to receive a trigger charge.

IPC Classes  ?

• G06F 3/0362 - Pointing devices displaced or positioned by the userAccessories therefor with detection of 1D translations or rotations of an operating part of the device, e.g. scroll wheels, sliders, knobs, rollers or belts
• G06F 3/02 - Input arrangements using manually operated switches, e.g. using keyboards or dials
• G06F 3/039 - Accessories therefor, e.g. mouse pads

Abstract

A knob structure can be installed on a touch control function display and includes a seat, a substrate, a trigger element, and an operating cover. The substrate is disposed on the seat, and includes a carrier, a ring pad, and a plurality of inner pads and outside pads. The carrier has first, second, and third ring configuration regions that jointly define a center. The inner pads are disposed on the second ring configuration region. The inner pads are spaced apart and electrically coupled. The outside pads are disposed on the third ring configuration region. The outside pads are spaced apart and electrically coupled. The trigger element can be operated to electrically couple the ring pad, and at least one of the inner pads and the outside pads, and sends a first signal, a second signal, or a third signal to the touch control display panel.

IPC Classes  ?

• G06F 3/0362 - Pointing devices displaced or positioned by the userAccessories therefor with detection of 1D translations or rotations of an operating part of the device, e.g. scroll wheels, sliders, knobs, rollers or belts
• G06F 3/02 - Input arrangements using manually operated switches, e.g. using keyboards or dials
• G06F 3/039 - Accessories therefor, e.g. mouse pads

Abstract

A flexible circuit board includes a substrate and a circuit unit formed on the substrate. The substrate has two carrying segments and a connecting segment, and the two carrying segments are connected by the connecting segment. The circuit unit has a plurality of conductive lines and at least one connecting line, and each conductive line and the connecting line are separated from each other. The conductive lines are respectively formed on the two carrying segments, and the connecting line is formed on the connecting segment and the two carrying segments. Two opposite ends of each carrying segment are configured to connect with each other to form a tubular structure, and two opposite ends of the connecting line are configured to connect to two adjacent conductive lines respectively formed on the two tubular structures, thereby the circuit unit is formed as a coil.

IPC Classes  ?

• H01F 27/28 - CoilsWindingsConductive connections
• H01F 7/20 - ElectromagnetsActuators including electromagnets without armatures
• H05K 1/02 - Printed circuits Details
• H01F 7/06 - ElectromagnetsActuators including electromagnets

Abstract

A method of manufacturing a printed circuit board precursor includes the steps of providing a substrate. Then the surface of the substrate is catalyzed to form a catalytic layer by a catalyst. Subsequently, a conductive layer is formed and attached to the surface of the catalytic layer. Finally, a metal layer is electroplated on the conductive layer. A printed circuit board precursor includes a substrate having a surface. Specifically, the surface is catalytically treated to form a catalytic layer. The precursor also includes a conductive layer which is attached to and covers the catalytic layer and a metal layer which is disposed on the conductive layer.

IPC Classes  ?

• H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
• H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
• H05K 3/46 - Manufacturing multi-layer circuits
• C23C 28/00 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/42 - Plated through-holes
• C23C 28/02 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and only coatings of metallic material
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
• H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal

Abstract

A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).

IPC Classes  ?

• H05K 1/02 - Printed circuits Details
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/20 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
• H05K 3/22 - Secondary treatment of printed circuits
• H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal
• H05K 3/46 - Manufacturing multi-layer circuits
• H05K 1/03 - Use of materials for the substrate
• H05K 3/42 - Plated through-holes