InvenSense, Inc.

United States of America

Back to Profile

1-100 of 1,080 for InvenSense, Inc. and 5 subsidiaries Sort by
Query
Aggregations
IP Type
        Patent 1,037
        Trademark 43
Jurisdiction
        United States 801
        World 254
        Canada 17
        Europe 8
Owner / Subsidiary
[Owner] InvenSense, Inc. 1,038
Trusted Positioning Inc. 26
Analog Devices Technology 7
Movea (S.A.) 6
InvenSense International, Inc. 2
See more
Date
New (last 4 weeks) 8
2025 May (MTD) 3
2025 April 5
2025 March 5
2025 February 6
See more
IPC Class
B81B 7/00 - Microstructural systems 131
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate 128
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes 97
H04R 19/04 - Microphones 81
H04R 19/00 - Electrostatic transducers 80
See more
NICE Class
09 - Scientific and electric apparatus and instruments 43
42 - Scientific, technological and industrial services, research and design 8
10 - Medical apparatus and instruments 5
35 - Advertising and business services 3
41 - Education, entertainment, sporting and cultural services 3
See more
Status
Pending 67
Registered / In Force 1,013
  1     2     3     ...     11        Next Page

1.

PROXIMITY AND LIVENESS DETECTION USING AN ULTRASONIC TRANSCEIVER

      
Application Number 18940502
Status Pending
Filing Date 2024-11-07
First Publication Date 2025-05-08
Owner INVENSENSE, INC. (USA)
Inventor
  • Przybyla, Richard
  • Hall, Daniela
  • Kline, Mitchell

Abstract

Devices and methods are provided that facilitate proximity or liveness detection of a user of a wearable device or a user interacting with a device based on ultrasonic information. In various embodiments, machine learning classifier models can be employed to generate classification predictions of a donned or a doffed state of a wearable device. In various aspects, a gated-recurrent unit (GRU) recursive neural network (RNN) can be employed as a machine learning classifier model. In other aspects, a liveness detection classifier decision tree can be employed as a machine learning classifier model. Power states or operating modes for associated devices can be selected based on the proximity or liveness of the user of the wearable device, as an example.

IPC Classes  ?

  • G01S 15/12 - Systems for measuring distance only using transmission of interrupted, pulse-modulated waves wherein the pulse-recurrence frequency is varied to provide a desired time relationship between the transmission of a pulse and the receipt of the echo of a preceding pulse
  • G01S 7/52 - Details of systems according to groups , , of systems according to group
  • G01S 7/539 - Details of systems according to groups , , of systems according to group using analysis of echo signal for target characterisationTarget signatureTarget cross-section
  • G06F 1/3231 - Monitoring the presence, absence or movement of users
  • G06F 1/3234 - Power saving characterised by the action undertaken
  • G06N 3/0442 - Recurrent networks, e.g. Hopfield networks characterised by memory or gating, e.g. long short-term memory [LSTM] or gated recurrent units [GRU]
  • G06N 20/20 - Ensemble learning

2.

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

      
Application Number 19016875
Status Pending
Filing Date 2025-01-10
First Publication Date 2025-05-08
Owner InvenSense, Inc. (USA)
Inventor
  • Lee, Daesung
  • Cuthbertson, Alan

Abstract

A method includes forming a bumpstop from a first intermetal dielectric (IMD) layer and forming a via within the first IMD, wherein the first IMD is disposed over a first polysilicon layer, and wherein the first polysilicon layer is disposed over another IMD layer that is disposed over a substrate. The method further includes depositing a second polysilicon layer over the bumpstop and further over the via to connect to the first polysilicon layer. A standoff is formed over a first portion of the second polysilicon layer, and wherein a second portion of the second polysilicon layer is exposed. The method includes depositing a bond layer over the standoff.

IPC Classes  ?

  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • B81B 7/00 - Microstructural systems
  • B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]

3.

DRIVE AND SENSE BALANCED GYROSCOPE WITH ENHANCED VIBRATION REJECTION

      
Application Number 18680163
Status Pending
Filing Date 2024-05-31
First Publication Date 2025-05-08
Owner Invensense, Inc. (USA)
Inventor
  • Bertini, Lorenzo
  • Milani, Damiano
  • Gafforelli, Giacomo
  • Coronato, Luca

Abstract

A MEMS gyroscope may have first and second drive masses configured to be driven in anti-phase. The gyroscope also includes first and second out-of-plane proof masses coupled to the first and second drive masses, respectively. The first and second out-of-plane proof masses may be driven in anti-phase to each other. The first and second out-of-plane proof masses may each include a driven mass and a sense mass, and may be responsive to an angular velocity about an out-of-plane axis to cause a respective in-plane Coriolis forces perpendicular to their respective drive motions. The gyroscope also includes a coupling link between the sense masses of first and second out-of-plane proof masses, which results in rejection of undesired vibrations.

IPC Classes  ?

  • G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure

4.

GYROSCOPE QUADRATURE CANCELLATION

      
Application Number 18483661
Status Pending
Filing Date 2023-10-10
First Publication Date 2025-04-10
Owner InvenSense, Inc. (USA)
Inventor Tsinker, Vadim

Abstract

A microelectromechanical system (MEMS) gyroscope includes a MEMS structure that outputs a capacitive signal that includes both a Coriolis signal used to determine an angular velocity and a quadrature signal 90 degrees out-of-phase with the Coriolis signal. A capacitance to voltage (C2V) amplifier receives and amplifies the capacitive signal for further processing. Quadrature cancellation circuitry processes the output of the C2V amplifier to isolate the quadrature signal and generate a signal to control variable capacitors coupled to the C2V amplifier input in a manner that removes the quadrature signal from the C2V amplifier output.

IPC Classes  ?

  • H03F 1/26 - Modifications of amplifiers to reduce influence of noise generated by amplifying elements
  • G01C 19/58 - Turn-sensitive devices without moving masses

5.

PMUT with Plurality of Vent Holes

      
Application Number 18826877
Status Pending
Filing Date 2024-09-06
First Publication Date 2025-04-10
Owner InvenSense, Inc. (USA)
Inventor
  • Shelton, Stefon Eric
  • Eovino, Benjamin Eric
  • Goericke, Fabian Thomas

Abstract

A piezoelectric micromachined ultrasonic transducer (“PMUT”) sensor has a membrane that includes an active region that actively transmits and receives ultrasonic acoustic signals and an inactive region that contributes to the PMUT modeshape but does not actively transmit and receive ultrasonic acoustic signals. A plurality of vent holes are distributed throughout the membrane such as in the inactive region. The number and size of the vent holes are selected to provide a necessary dissipation of pressure bursts or transients while maintaining a transmission efficiency.

IPC Classes  ?

  • B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction

6.

Ultrasonic Sensor Package with Decoupled Acoustic Modes

      
Application Number 18902498
Status Pending
Filing Date 2024-09-30
First Publication Date 2025-04-10
Owner InvenSense, Inc. (USA)
Inventor
  • Eovino, Benjamin Eric
  • Shelton, Stefon Eric
  • Goericke, Fabian Thomas

Abstract

A piezoelectric micromachined ultrasound transducer (PMUT) sensor is implemented with a microelectromechanical sensor (MEMS) die including a membrane of the PMUT sensor that transmits and receives acoustic signals. A back volume within the MEMS sensor package has an acoustic resonance mode that is within an operating frequency range of the MEMS sensor. The MEMS die is located within the MEMS sensor package such that an acoustic pressure that is applied to the membrane is balanced over the membrane, such that the back volume acoustic resonance mode is decoupled from the membrane operating mode.

IPC Classes  ?

7.

PMUT WITH CONTROLLED RESIDUAL STRESS AND PATTERNING

      
Application Number 18811706
Status Pending
Filing Date 2024-08-21
First Publication Date 2025-04-10
Owner Invensense, Inc. (USA)
Inventor
  • Shelton, Stefon Eric
  • Eovino, Benjamin Eric
  • Goericke, Fabian Thomas

Abstract

A piezoelectric micromachined ultrasonic transducer (“PMUT”) sensor has a target residual stress at one or more layers of the PMUT and also has patterning where some of the layers of the PMUT are removed. The residual stress and the patterning result in a static deflection of the PMUT. The application of the residual stress and the patterning define a vibration modeshape with desired acoustic characteristics such as improved signal-to-noise ratio (“SNR”).

IPC Classes  ?

  • B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
  • G06F 30/17 - Mechanical parametric or variational design

8.

ULTRASONIC SENSOR PACKAGE WITH DECOUPLED ACOUSTIC MODES

      
Application Number US2024049693
Publication Number 2025/076155
Status In Force
Filing Date 2024-10-03
Publication Date 2025-04-10
Owner INVENSENSE, INC. (USA)
Inventor
  • Eovino, Benjamin Eric
  • Shelton, Stefon Eric
  • Goericke, Fabian Thomas

Abstract

A piezoelectric micromachined ultrasound transducer (PMUT) sensor is implemented with a microelectromechanical sensor (MEMS) die including a membrane of the PMUT sensor that transmits and receives acoustic signals. A back volume within the MEMS sensor package has an acoustic resonance mode that is within an operating frequency range of the MEMS sensor. The MEMS die is located within the MEMS sensor package such that an acoustic pressure that is applied to the membrane is balanced over the membrane, such that the back volume acoustic resonance mode is decoupled from the membrane operating mode.

IPC Classes  ?

  • B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction

9.

POSITIONSENSE

      
Serial Number 99108986
Status Pending
Filing Date 2025-03-28
Owner InvenSense, Inc. ()
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Sensors for navigation; sensors for determining position, heading, orientation, and absolute orientation; accelerometers; gyroscopes; magnetometers; hardware and software for sensor fusion and activity tracking

10.

ELECTRODES FOR MICROELECTROMECHANICAL SYSTEM MICROPHONES

      
Application Number 18971829
Status Pending
Filing Date 2024-12-06
First Publication Date 2025-03-27
Owner
  • INVENSENSE, INC. (USA)
  • TDK ELECTRONICS AG (Germany)
Inventor
  • Seeger, Joseph
  • Mortensen, Dennis

Abstract

The present invention relates to electrodes for microelectromechanical system (MEMS) microphones. In one embodiment, a MEMS sensor includes a membrane and a backplate situated parallel to the membrane and separated by a gap. The backplate includes a first region that includes a center point of the backplate and has first holes of a first hole pitch, a second region that is positioned outside the first region and has second holes of a second hole pitch that is smaller than the first hole pitch, and a transitional region that is positioned between the first region and the second region and has third holes of a third hole pitch that is between the first hole pitch and the second hole pitch. The first and second regions of the backplate and their respective holes can be of a shape (e.g., hexagonal) that differs from the shape of the backplate.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

11.

MICROELECTROMECHANICAL SYSTEM MICROPHONE ARRAY CAPSULE

      
Application Number 18973650
Status Pending
Filing Date 2024-12-09
First Publication Date 2025-03-27
Owner INVENSENSE, INC. (USA)
Inventor Parker, Jeremy

Abstract

The present invention relates to a microelectromechanical system (MEMS) microphone array capsule. In one embodiment, a MEMS microphone includes a MEMS microphone die; an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit.

IPC Classes  ?

12.

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE

      
Application Number 18949864
Status Pending
Filing Date 2024-11-15
First Publication Date 2025-03-06
Owner InvenSense, Inc. (USA)
Inventor
  • Lee, Daesung
  • Cuthbertson, Alan

Abstract

A device includes a substrate and an intermetal dielectric (IMD) layer disposed over the substrate. The device also includes a first plurality of polysilicon layers disposed over the IMD layer and over a bumpstop. The device also includes a second plurality of polysilicon layers disposed within the IMD layer. The device includes a patterned actuator layer with a first side and a second side, wherein the first side of the patterned actuator layer is lined with a polysilicon layer, and wherein the first side of the patterned actuator layer faces the bumpstop. The device further includes a standoff formed over the IMD layer, a via through the standoff making electrical contact with the polysilicon layer of the actuator and a portion of the second plurality of polysilicon layers and a bond material disposed on the second side of the patterned actuator layer.

IPC Classes  ?

  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • B81B 7/00 - Microstructural systems
  • B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]

13.

CONTINUOUS TIME PIPELINE ANALOG-TO-DIGITAL CONVERSION

      
Application Number 18240514
Status Pending
Filing Date 2023-08-31
First Publication Date 2025-03-06
Owner InvenSense, Inc. (USA)
Inventor Tsinker, Vadim

Abstract

A continuous time reconfigurable integrator is dynamically reconfigurable to facilitate real time high-resolution modification of the integrator output signal. An initial output of the integrator is evaluated to generate a coarse estimate which is then used to modify capacitive inputs to the integrator, which result in the output of a residue signal. The initial and residue outputs are individually processed by an analog-to-digital converter (ADC), such as a successive-approximation-register ADC, and digitally combined.

IPC Classes  ?

  • H03M 1/38 - Analogue value compared with reference values sequentially only, e.g. successive approximation type

14.

DYNAMIC CAPACITANCE-TO-VOLVAGE OFFSET CANCELLATION

      
Application Number 18237533
Status Pending
Filing Date 2023-08-24
First Publication Date 2025-02-27
Owner InvenSense, Inc. (USA)
Inventor
  • Mazzarella, Federico
  • Tsinker, Vadim

Abstract

In a microelectromechanical system (MEMS) sensor, movement of a component such as a proof mass due to a force of interest is sensed capacitively. A capacitance-to-voltage (C2V) converter receives a capacitance signal from the sensor and outputs a signal that includes an offset in addition to a signal of interest. The output signal is analyzed to identify the offset portion of the output signal and to modify values one or more variable capacitors coupled to the C2V input reduce the offset portion of the output signal.

IPC Classes  ?

  • H03F 3/45 - Differential amplifiers
  • H03M 1/44 - Sequential comparisons in series-connected stages with change in value of analogue signal

15.

Secure Software Life Duration Timer

      
Application Number 18238115
Status Pending
Filing Date 2023-08-25
First Publication Date 2025-02-27
Owner InvenSense, Inc. (USA)
Inventor
  • Fontaine, Aurelie
  • Buisson, Remi

Abstract

An example embodiment includes an example embodiment includes a method performed by a processor of a user device. The method including receiving, by the processor of the user device, instructions for installing application software on the user device, and installing the application software on the user device based on the instructions. The installation including installing library code of the application software in a section of a memory device of the user device and installing timer code in the section of the memory device along with the library code. The erasure of the timer code from the memory device causes erasure of the library code from the memory device. Decrementing, by the processor of the user device, the timer code when the processor executes the library code, the timer code limiting a life duration of the user device executing the application software.

IPC Classes  ?

  • G06F 21/12 - Protecting executable software
  • G06F 8/61 - Installation
  • G06F 21/10 - Protecting distributed programs or content, e.g. vending or licensing of copyrighted material

16.

PLURALITY OF MEMS FOR INCREASED BANDWIDTH

      
Application Number 18498198
Status Pending
Filing Date 2023-10-31
First Publication Date 2025-02-20
Owner InvenSense, Inc. (USA)
Inventor
  • Thompson, Matthew Julian
  • Seeger, Joseph
  • Ho, Gavin

Abstract

A MEMS device incorporates a first sensor and a second sensor to receive an external excitation and respectively output signals to processing circuitry. The processing circuitry combines the first and second signals to create a third signal, which includes an output from the first sensor when the external excitation is between a first and second frequency relatively close to DC and an output from the second sensor when the external excitation is between a third and fourth frequency at a higher frequency range.

IPC Classes  ?

  • G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values

17.

Gyroscope Drive Loop with Resonant Amplitude Sampling and PWM Drive

      
Application Number 18535271
Status Pending
Filing Date 2023-12-11
First Publication Date 2025-02-13
Owner InvenSense, Inc. (USA)
Inventor
  • Mazzarella, Federico
  • Petracca, Giacomo
  • Collamati, Luca
  • Di Ruzza, Andrea
  • Pinna, Carlo
  • Tsinker, Vadim
  • Mattaliano, Carlo

Abstract

A MEMS gyroscope includes a mixed analog and digital drive loop. A drive sense signal from a suspended spring-mass system is received by the drive loop, rectified, and compared to a reference signal. The result of the comparison is processed and converted into a digital signal that is processed by a digital filter and a digital pulse-width modulator of the drive loop. The output of the pulse width modulator controls a high-voltage drive of the drive loop that generates a drive signal having an amplitude based on the pulse width modulator output signal and supplies the drive signal to drive the suspended spring-mass system.

IPC Classes  ?

  • G01C 19/5776 - Signal processing not specific to any of the devices covered by groups

18.

PMUT With Partially Inactive Piezoelectric

      
Application Number 18403964
Status Pending
Filing Date 2024-01-04
First Publication Date 2025-02-06
Owner InvenSense, Inc. (USA)
Inventor
  • Eovino, Benjamin Eric
  • Shelton, Stefon Eric
  • Goericke, Fabian Thomas

Abstract

A piezoelectric micromachined ultrasound transducer (PMUT) device has different transduction efficiency at different portions of the PMUT device depending on design characteristics such as materials, material thicknesses, and shape. A metal layer of the PMUT device is patterned to render certain portions of the piezoelectric layer of the PMUT device inactive. Only the active portions of the piezoelectric layer are utilized for transmission and reception of ultrasonic signals, while overall PMUT device capacitance is reduced due to the lack of an active capacitor in the inactive region(s) of the PMUT device, resulting in a PMUT design with increased sensitivity. For differential PMUT devices, the patterning may be performed to match capacitances associated with the differential piezoelectric regions.

IPC Classes  ?

  • B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
  • H10N 39/00 - Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups

19.

PMUT WITH PARTIALLY INACTIVE PIEZOELECTRIC

      
Application Number US2024038263
Publication Number 2025/029478
Status In Force
Filing Date 2024-07-17
Publication Date 2025-02-06
Owner INVENSENSE, INC. (USA)
Inventor
  • Eovino, Benjamin Eric
  • Shelton, Stefon Eric
  • Goericke, Fabian Thomas

Abstract

A piezoelectric micromachined ultrasound transducer (PMUT) device has different transduction efficiency at different portions of the PMUT device depending on design characteristics such as materials, material thicknesses, and shape. A metal layer of the PMUT device is patterned to render certain portions of the piezoelectric layer of the PMUT device inactive. Only the active portions of the piezoelectric layer are utilized for transmission and reception of ultrasonic signals, while overall PMUT device capacitance is reduced due to the lack of an active capacitor in the inactive region(s) of the PMUT device, resulting in a PMUT design with increased sensitivity. For differential PMUT devices, the patterning may be performed to match capacitances associated with the differential piezoelectric regions.

IPC Classes  ?

  • B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
  • A61B 8/00 - Diagnosis using ultrasonic, sonic or infrasonic waves

20.

SELECTIVE HYDROPHOBIC LAYER REMOVAL USING UV IRRADIATION WITH NON-ALIGNED MASK

      
Application Number 18419301
Status Pending
Filing Date 2024-01-22
First Publication Date 2024-12-26
Owner InvenSense, Inc. (USA)
Inventor
  • Akiyama, Jotaro
  • Shibano, Yuki
  • Kaneko, Kento
  • Arimatsu, Daishi
  • Chase, Troy

Abstract

A sensing device is formed on a first side of a wafer device, forming a cavity between sensing device and the wafer device. An opening of the cavity faces away from the sensing device, positioned on a second side of the wafer device (positioned opposite to the first side). A hydrophobic layer is formed on the second side of the wafer device, on the cavity, on an interior and on an exterior of the sensing device. A mask is formed on the hydrophobic layer on the second side. The mask is perforated that maintains at least a portion of the hydrophobic layer covering the second side of the wafer device exposed. Light is applied to the second side of the wafer device that removes the at least the portion of the hydrophobic layer covering the second side of the wafer device that is exposed. The mask is removed.

IPC Classes  ?

  • H01L 31/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
  • H04R 1/08 - MouthpiecesAttachments therefor

21.

MEMS STRAIN SENSITIVITY CALIBRATION

      
Application Number 18214187
Status Pending
Filing Date 2023-06-26
First Publication Date 2024-12-26
Owner InvenSense, Inc. (USA)
Inventor
  • Thompson, Matthew Julian
  • Martini, Roberto

Abstract

A MEMS sensor may include multiple sense electrodes located relative to respective portions of one or more proof masses of a MEMS layer of the sensor. Individual sense electrodes are capable of individual calibration within the drive and/or sense path for the sense electrode. A distance between each individual sense electrode relative to a proof mass is determined for the at-rest state of the sensor. Calibration values are determined based on these distances, and individual drive and/or sense signals associated with each sense electrode are modified to adjust for changes in distance, such as are caused by shifting, tilting, or bending of the MEMS layer or substrate.

IPC Classes  ?

  • G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
  • G01P 21/00 - Testing or calibrating of apparatus or devices covered by the other groups of this subclass

22.

DEFORMATION MAPPING FOR OUT-OF-PLANE ACCELEROMETER OFFSET/SENSITIVITY SELF-CALIBRATION

      
Application Number 18214195
Status Pending
Filing Date 2023-06-26
First Publication Date 2024-12-26
Owner InvenSense, Inc. (USA)
Inventor
  • Martini, Roberto
  • Coronato, Luca
  • Thompson, Matthew Julian

Abstract

A microelectromechanical system (MEMS) accelerometer incorporates deformation sensing with a plurality of sense electrodes positioned to facilitate determining a deformation pattern (e.g., asymmetric or symmetric) of an underlying substrate layer relative to a MEMS layer. The deformation pattern of the substrate layer contributes to offset and/or sensitivity of the accelerometer, so the determination of the deformation pattern enables processing circuitry to compensate and improve offset and/or sensitivity stability. Tilt sense electrodes and/or comparison electrodes may be incorporated alongside the plurality of sense electrodes to monitor deformation of the substrate layer relative to a fixed portion of the MEMS layer.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
  • G01P 21/00 - Testing or calibrating of apparatus or devices covered by the other groups of this subclass

23.

Dynamic Adaptation of Ultrasonic Detection Parameters Based on Image Classification

      
Application Number 18619939
Status Pending
Filing Date 2024-03-28
First Publication Date 2024-11-21
Owner InvenSense, Inc. (USA)
Inventor Przybyla, Richard

Abstract

An object detection system includes an ultrasonic sensor and an image sensor. The ultrasonic sensor transmits an ultrasonic signal into an environment of interest and makes an initial determination regarding a potential object in the environment of interest based on received reflections of the ultrasonic signal. Based on that initial determination, the image sensor and associated processing circuitry wake up and capture one or more images of the object within the environment of interest. Those images are analyzed such as by a classifier to determine the object status, which is then compared to the object status as determined by the ultrasonic sensor. Detection parameters of the ultrasonic sensor are updated if the object status as determined ultrasonic sensor does not match the determination of the imaging system.

IPC Classes  ?

  • G01S 15/04 - Systems determining presence of a target
  • G01S 15/42 - Simultaneous measurement of distance and other coordinates
  • G06V 10/764 - Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects

24.

MULTI-LEVEL MEMS PROCESS

      
Application Number 18136556
Status Pending
Filing Date 2023-04-19
First Publication Date 2024-10-24
Owner InvenSense, Inc. (USA)
Inventor
  • Martini, Roberto
  • Thompson, Matthew Julian
  • Gafforelli, Giacomo
  • Coronato, Luca
  • Esposito, Luigi

Abstract

An actuator layer of a MEMS sensor is be fabricated to include multi-level features, such as additional sense electrodes, vertical bump stops, or weighted proof masses. A sacrificial layer is deposited on the actuator layer such that locations are provided for the multi-level features to extend vertically from the actuator layer. After the multi-layer features are fabricated on the actuator layer the sacrificial layer is removed. Additional processing such as patterning of the actuator layer may be performed to provide desired functionality and electrical signals to portions of the actuator layer, including to the multi-level features.

IPC Classes  ?

  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

25.

SENSING CIRCUIT OF A MICRO-ELECTROMECHANICAL SENSOR

      
Application Number 18753886
Status Pending
Filing Date 2024-06-25
First Publication Date 2024-10-17
Owner INVENSENSE, INC. (USA)
Inventor Seeger, Joseph

Abstract

Applying positive and negative feedback voltages to an electromechanical sensor of a microphone utilizing a voltage-to-voltage converter to facilitate an improvement in sensitivity and reduction in distortion of the microphone is presented herein. A microphone comprises an electromechanical sensor comprising a capacitive sense element comprising a first sense node and a second sense node; and a voltage-to-voltage converter comprising an input, a first output, and a second output. The voltage-to-voltage converter forms, via a first capacitive coupling to the second sense node, a negative feedback loop between the first output of the voltage-to-voltage converter and the input of the voltage-to-voltage converter. The first sense node is electrically coupled to the input of the voltage-to-voltage converter, and the voltage-to-voltage converter forms, via a second capacitive coupling to the first sense node, a positive feedback loop between the second output of the voltage-to-voltage converter and the input of the voltage-to-voltage converter.

IPC Classes  ?

  • G01P 1/00 - Details of instruments
  • G01P 15/00 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration
  • G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
  • H03F 3/45 - Differential amplifiers

26.

Multi-Variate Gyroscope Offset Temperature Coefficient Compensation

      
Application Number 18126337
Status Pending
Filing Date 2023-03-24
First Publication Date 2024-09-26
Owner InvenSense, Inc. (USA)
Inventor
  • Liu, Zhongzheng
  • Shin, Jongwoo
  • Wang, Ren

Abstract

A method for calibrating a micro-electro-mechanical system (MEMS) gyroscopes by determining a plurality of variates including quadrature and inphase values from output data of a first subset of the MEMS gyroscopes, determining offset temperature coefficients of the first subset of the MEMS gyroscopes over temperature variation, computing a linear regression using the quadrature and inphase values and the offset temperature coefficients to determine linear regression variate coefficients for predicting the offset temperature coefficient based on the quadrature and inphase values. The method also including determining a plurality of variates including quadrature and inphase values from output data of a second subset of the MEMS gyroscopes, determining a predicted offset temperature coefficient based on the quadrature and inphase values and the linear regression variate coefficients, and programing the second subset of the MEMS gyroscopes to use the predicted offset temperature coefficient to adjust the output data during operation.

IPC Classes  ?

  • G01C 25/00 - Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
  • G01C 19/5691 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially three-dimensional vibrators, e.g. wine glass-type vibrators
  • G01C 19/5776 - Signal processing not specific to any of the devices covered by groups

27.

METHOD AND SYSTEM FOR CROWDSOURCED CREATION OF MAGNETIC MAP

      
Application Number 18596233
Status Pending
Filing Date 2024-03-05
First Publication Date 2024-09-12
Owner INVENSENSE, INC (USA)
Inventor
  • Berkovich, Gennadii
  • Churikov, Dmitri
  • Goodall, Chris
  • Georgry, Jacques
  • Ali, Abdelrahman

Abstract

Systems and methods are disclosed for creating a magnetic map by obtaining magnetic field measurements from a plurality of platforms. A first set of poses for each platform is determined and information from the magnetic map is obtained for any existing magnetic field values for the first set. Magnetic constraints on poses of the platform are determined and used for determining a second set of poses for each platform. The magnetic field values of the magnetic map are then updated based at least in part on the second set of poses for each platform.

IPC Classes  ?

  • G01C 21/00 - NavigationNavigational instruments not provided for in groups

28.

METHOD AND SYSTEM FOR CROWDSOURCED CREATION OF MAGNETIC MAP

      
Application Number US2024018745
Publication Number 2024/186942
Status In Force
Filing Date 2024-03-06
Publication Date 2024-09-12
Owner INVENSENSE, INC. (USA)
Inventor
  • Berkovich, Gennadii
  • Churikov, Dmitri
  • Goodall, Chris
  • Georgy, Jacques
  • Ali, Abdelrahman

Abstract

Systems and methods are disclosed for creating a magnetic map by obtaining magnetic field measurements from a plurality of platforms. A first set of poses for each platform is determined and information from the magnetic map is obtained for any existing magnetic field values for the first set. Magnetic constraints on poses of the platform are determined and used for determining a second set of poses for each platform. The magnetic field values of the magnetic map are then updated based at least in part on the second set of poses for each platform.

IPC Classes  ?

  • G01C 21/16 - NavigationNavigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigatedDead reckoning by integrating acceleration or speed, i.e. inertial navigation
  • G01C 21/00 - NavigationNavigational instruments not provided for in groups
  • G01S 19/49 - Determining position by combining or switching between position solutions derived from the satellite radio beacon positioning system and position solutions derived from a further system whereby the further system is an inertial position system, e.g. loosely-coupled

29.

INVENSENSE

      
Application Number 1809832
Status Registered
Filing Date 2024-06-21
Registration Date 2024-06-21
Owner InvenSense, Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Measuring equipment sensors comprising an inertial measurement unit, magnetometer, pressure sensor, microphone, temperature sensor, ultrasonic sensor for measuring acceleration, angle of rotation, sound, and distance ranges, for use in sensor fusion, Internet of Things, industrial applications and software development systems, drone applications and software development systems, automotive applications and software development systems; measuring equipment comprising ultrasonic time-of-flight sensors for measuring distances, obstacles, sounds, ultrasonic signals, and ultrasonic range sensing; acoustic sensors; microphones; sensors for detecting sound; sensors for recognizing sound; sensors for analyzing sound; sensors for the determination of location, positions, movement, change in pressure, activity monitoring, and change in elevation, for use in computers, laptops, tablets, smartphones, portable electronic devices, drones, smart watches, electronic tracking devices, and wearable electronic devices; fingerprint sensors and scanners; ultrasonic sensors; biometric identification apparatus; touchscreen sensors for interpreting fingerprints, image enhancement, fingerprint matching, user identification and user authentication; optical sensors for interpreting fingerprints, image enhancement, fingerprint matching, user identification, and user authentication; sensor development kits for motion comprised primarily of electronic sensors and software for use in industrial applications; sensor development kits, namely, kits comprised primarily of computer hardware and downloadable software for use in developing and operating sensors and electronic devices for detecting, transmitting, recognizing, analyzing, and tracking motion, movement, positions, distances, obstacles, sounds, change in elevation, ultrasonic signals, and barometric pressure; downloadable and recorded software for use with sensors for monitoring position, movement, vibration, inclination, distances, environmental conditions, and Internet of Things applications; downloadable software for use with sensor devices and sensors for detecting sound, recognizing sound, analyzing sound, monitoring sound, and controlling sound; downloadable software for use with sensor-enabled microphones, headsets, wireless audio devices, smart speakers, mobile devices, wearable mobile technologies; downloadable software for interpreting fingerprints; hardware for interpreting fingerprints, image enhancement, fingerprint matching, user identification, and user authentication; software for use with sensor-enabled microphones, headphones, wireless audio devices, smart speakers, mobile devices, wearable mobile technologies, and Internet of Things devices for capturing and storing sensor data and analytics.

30.

DUAL AXIS ACCELEROMETER WITH COMPENSATION ELECTRODES

      
Application Number 18119492
Status Pending
Filing Date 2023-03-09
First Publication Date 2024-09-12
Owner InvenSense, Inc. (USA)
Inventor
  • Martini, Roberto
  • Coronato, Luca
  • Huang, Xian

Abstract

A dual axis accelerometer with a single proof mass measures in-plane acceleration (e.g., either along an x-axis or a y-axis), out-of-plane acceleration (e.g., normal to an x-y plane), and tilt of a fixed portion of a MEMS layer (e.g., normal to the x-y plane). In response to a tilt measurement, the dual-axis accelerometer compensates any offset (e.g., variability) of the out-of-plane accelerometer in order to maintain offset stability. In some embodiments, multiple dual axis accelerometers, perpendicularly configured, may be implemented via processing circuitry to offer three axis sensitivity capability.

IPC Classes  ?

  • G01P 15/18 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration in two or more dimensions
  • B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
  • G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up

31.

Clocking scheme for reduced noise in continuous-time sigma-delta adcs preliminary class

      
Application Number 18107219
Grant Number 12199629
Status In Force
Filing Date 2023-02-08
First Publication Date 2024-08-08
Grant Date 2025-01-14
Owner InvenSense, Inc. (USA)
Inventor
  • Oliaei, Omid
  • Pellegrini, Aurelio
  • Ottini, Daniele

Abstract

A circuit for a feedback system incorporates a gating mechanism to reduce flicker noise (e.g., a source for bias instability within a MEMS device) at a digital output. The gating mechanism generates a gating pulse with a delay period (e.g., a common, or fixed, delay including symmetrical rising and falling edge delays) that overrides internal delays (e.g., asymmetrical rising and falling edge delays) of a phase generator to prevent propagation delay (e.g., delay affected by jitter) from reaching subsequent feedback components (e.g., a digital-to-analog converter (DAC)) and contributing to the generation of flicker noise within the system.

IPC Classes  ?

  • H03M 1/10 - Calibration or testing
  • H03M 3/00 - Conversion of analogue values to or from differential modulation
  • H03K 19/20 - Logic circuits, i.e. having at least two inputs acting on one outputInverting circuits characterised by logic function, e.g. AND, OR, NOR, NOT circuits

32.

MICROELECTROMECHANICAL ACOUSTIC SENSOR WITH MEMBRANE ETCH RELEASE STRUCTURES AND METHOD OF FABRICATION

      
Application Number 18490312
Status Pending
Filing Date 2023-10-19
First Publication Date 2024-07-11
Owner
  • INVENSENSE, INC. (USA)
  • TDK Electronics AG (Germany)
Inventor
  • Rombach, Pirmin
  • Rasmussen, Kurt
  • Mortensen, Dennis
  • Ravnkilde, Jan
  • Liu, Cheng-Yen
  • Akiyama, Jotaro
  • Bharatan, Sushil
  • Chase, Troy

Abstract

Low-cost, robust, and high performance microelectromechanical systems (MEMS) acoustic sensors are described. Described MEMS acoustic sensors can comprise a set of etch release structures in the acoustic sensor membrane that facilitates rapid and/or uniform etch release of the acoustic sensor membrane. In addition, MEMS acoustic sensors can comprise a set of membrane position control structures of the acoustic sensor membrane that can reduce the bending stress of the acoustic sensor membrane. MEMS acoustic sensors can further comprise a three layer acoustic sensor membrane that provides increased robustness. Further design flexibility and improvements are described that provide increased robustness and/or cost savings, and a low cost fabrication process for MEMS acoustic sensors is provided.

IPC Classes  ?

  • G01H 11/06 - Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
  • H04R 7/10 - Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
  • H04R 7/12 - Non-planar diaphragms or cones
  • H04R 19/04 - Microphones
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor

33.

METHOD AND SYSTEM FOR MAP BUILDING USING RADAR AND MOTION SENSORS

      
Application Number US2023085643
Publication Number 2024/138110
Status In Force
Filing Date 2023-12-22
Publication Date 2024-06-27
Owner INVENSENSE, INC. (USA)
Inventor
  • Ali, Abdelrahman
  • Georgy, Jacques
  • Krupity, Dylan
  • Chan, Billy Cheuk Wai
  • Goodall, Christopher

Abstract

Techniques are disclosed to build a map for an area around at least a route traversed by a moving platform. An integrated navigation solution for a device within the moving platform is generated using motion sensor data obtained from a sensor assembly of the device and absolute navigational information for the platform. The integrated navigation solution is then used to project radar measurements obtained from at least one radar of the platform onto the area so that the map is built using the projected radar measurements.

IPC Classes  ?

  • G01C 21/00 - NavigationNavigational instruments not provided for in groups
  • G01C 21/16 - NavigationNavigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigatedDead reckoning by integrating acceleration or speed, i.e. inertial navigation
  • G01C 21/28 - NavigationNavigational instruments not provided for in groups specially adapted for navigation in a road network with correlation of data from several navigational instruments

34.

INVENSENSE

      
Application Number 234920300
Status Pending
Filing Date 2024-06-21
Owner InvenSense, Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

(1) Measuring equipment sensors comprising an inertial measurement unit, magnetometer, pressure sensor, microphone, temperature sensor, ultrasonic sensor for measuring acceleration, angle of rotation, sound, and distance ranges, for use in sensor fusion, Internet of Things, industrial applications and software development systems, drone applications and software development systems, automotive applications and software development systems; measuring equipment comprising ultrasonic time-of-flight sensors for measuring distances, obstacles, sounds, ultrasonic signals, and ultrasonic range sensing; acoustic sensors; microphones; sensors for detecting sound; sensors for recognizing sound; sensors for analyzing sound; sensors for the determination of location, positions, movement, change in pressure, activity monitoring, and change in elevation, for use in computers, laptops, tablets, smartphones, portable electronic devices, drones, smart watches, electronic tracking devices, and wearable electronic devices; fingerprint sensors and scanners; ultrasonic sensors; biometric identification apparatus; touchscreen sensors for interpreting fingerprints, image enhancement, fingerprint matching, user identification and user authentication; optical sensors for interpreting fingerprints, image enhancement, fingerprint matching, user identification, and user authentication; sensor development kits for motion comprised primarily of electronic sensors and software for use in industrial applications; sensor development kits, namely, kits comprised primarily of computer hardware and downloadable software for use in developing and operating sensors and electronic devices for detecting, transmitting, recognizing, analyzing, and tracking motion, movement, positions, distances, obstacles, sounds, change in elevation, ultrasonic signals, and barometric pressure; downloadable and recorded software for use with sensors for monitoring position, movement, vibration, inclination, distances, environmental conditions, and Internet of Things applications; downloadable software for use with sensor devices and sensors for detecting sound, recognizing sound, analyzing sound, monitoring sound, and controlling sound; downloadable software for use with sensor-enabled microphones, headsets, wireless audio devices, smart speakers, mobile devices, wearable mobile technologies; downloadable software for interpreting fingerprints; hardware for interpreting fingerprints, image enhancement, fingerprint matching, user identification, and user authentication; software for use with sensor-enabled microphones, headphones, wireless audio devices, smart speakers, mobile devices, wearable mobile technologies, and Internet of Things devices for capturing and storing sensor data and analytics.

35.

METHOD AND SYSTEM FOR FABRICATING A MEMS DEVICE CAP

      
Application Number 18380131
Status Pending
Filing Date 2023-10-13
First Publication Date 2024-06-20
Owner InvenSense, Inc. (USA)
Inventor Pilla, Camillo

Abstract

A device includes a first die and a second die. The first die and the second die are stacked and form a monolithic die. A first side of the first die faces a first side of the second die. The second die comprises an electrical connection within its periphery and on a side other than the first side of the second die. The electrical connection exposes the second die to an environment outside of the monolithic die. The electrical connection is configured to facilitate electrical connection between the second die of the monolithic die and an electronic component that is external to the monolithic die.

IPC Classes  ?

  • B81B 7/00 - Microstructural systems
  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate

36.

DUAL-SEALED ACCELEROMETER WITH CAVITY PRESSURE MONITORING

      
Application Number US2023081719
Publication Number 2024/123584
Status In Force
Filing Date 2023-11-30
Publication Date 2024-06-13
Owner INVENSENSE, INC. (USA)
Inventor
  • Giambastiani, Adolfo
  • Coronato, Luca
  • Belloni, Edoardo
  • Dellea, Stefano
  • Wang, Yaoching
  • Gafforelli, Giacomo

Abstract

A MEMS accelerometer package includes multiple cavities such that a change in pressure corresponding to a breach in one or more of the cavities is readily identified based on the output of a pressure-sensitive sensor such as a MEMS resonator. One or more mitigations may be initiated in response to the identification of the change in pressure.

IPC Classes  ?

  • G01P 21/00 - Testing or calibrating of apparatus or devices covered by the other groups of this subclass
  • G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
  • G01P 15/18 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration in two or more dimensions
  • G01L 19/00 - Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
  • B81B 7/00 - Microstructural systems

37.

DC RESTORE SCHEME FOR CAPACITIVE SENSING AMPLIFIERS WITH OPTIMAL NOISE FILTERING

      
Application Number 18070081
Status Pending
Filing Date 2022-11-28
First Publication Date 2024-06-06
Owner InvenSense, Inc. (USA)
Inventor
  • Collamati, Luca
  • Mazzarella, Federico

Abstract

A capacitive sensing charge amplifier, e.g., in a direct current (DC) feedback network, may incorporate a switching capacitor, including a first control switch and a second control switch, which receives a switching signal to charge and discharges the switching signal to a virtual ground of a sense amplifier. Noise incorporated into the output of the sense amplifier (e.g., a MEMS output signal) is filtered by a demodulation signal at a demodulator such that the period average noise at the demodulator output equals zero. The time varying nature of the switching capacitor resistance generally reshapes the system's post-demodulation noise to reduce its low frequency output noise.

IPC Classes  ?

  • H03F 3/70 - Charge amplifiers
  • G01D 5/24 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
  • G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
  • G01P 15/14 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of gyroscopes

38.

TRANSVERSAL ULTRASONIC SENSING FOR CARDIOVASCULAR MONITORING

      
Application Number US2023082188
Publication Number 2024/119150
Status In Force
Filing Date 2023-12-01
Publication Date 2024-06-06
Owner INVENSENSE, INC. (USA)
Inventor
  • Baldasarre, Leonardo
  • Travagliati, Marco
  • Confalonieri, Federica

Abstract

An ultrasonic sensing system including a plurality of ultrasonic transducers for placement on a human body proximate a blood vessel, a hardware controller for controlling operation of the plurality of ultrasonic transducers, and a digital processing module for processing the reflected ultrasonic signals. The plurality of ultrasonic transducers includes a first subset of ultrasonic transducers, wherein the ultrasonic transducers of the first subset are arranged linearly and a second subset of ultrasonic transducers, wherein the ultrasonic transducers of the second subset are arranged linearly, wherein the first subset of ultrasonic transducers is positioned parallel to the second subset of ultrasonic transducers at a fixed separation distance. The hardware controller configured to control transmission and receipt of reflected ultrasonic signals at the first subset of ultrasonic transducers and the second subset of ultrasonic transducers, wherein the reflected ultrasonic signals sense movement of a wall of the blood vessel.

IPC Classes  ?

  • A61B 8/06 - Measuring blood flow
  • A61B 8/08 - Clinical applications
  • A61B 8/00 - Diagnosis using ultrasonic, sonic or infrasonic waves
  • G01S 7/52 - Details of systems according to groups , , of systems according to group
  • G01S 15/89 - Sonar systems specially adapted for specific applications for mapping or imaging
  • A61B 8/04 - Measuring blood pressure

39.

DUAL-SEALED ACCELEROMETER WITH CAVITY PRESSURE MONITORING

      
Application Number 18495096
Status Pending
Filing Date 2023-10-26
First Publication Date 2024-06-06
Owner InvenSense, Inc. (USA)
Inventor
  • Giambastiani, Adolfo
  • Coronato, Luca
  • Belloni, Edoardo
  • Dellea, Stefano
  • Wang, Yaoching
  • Gafforelli, Giacomo

Abstract

A MEMS accelerometer package includes multiple cavities such that a change in pressure corresponding to a breach in one or more of the cavities is readily identified based on the output of a pressure-sensitive sensor such as a MEMS resonator. One or more mitigations may be initiated in response to the identification of the change in pressure.

IPC Classes  ?

  • G01P 15/12 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by alteration of electrical resistance
  • G01P 1/00 - Details of instruments
  • G01P 15/18 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration in two or more dimensions
  • G01P 21/00 - Testing or calibrating of apparatus or devices covered by the other groups of this subclass

40.

ELECTRODES FOR MICROELECTROMECHANICAL SYSTEM MICROPHONES

      
Application Number US2023036344
Publication Number 2024/112406
Status In Force
Filing Date 2023-10-31
Publication Date 2024-05-30
Owner
  • INVENSENSE, INC. (USA)
  • TDK ELECTRONICS AG (Germany)
Inventor
  • Seeger, Joseph
  • Mortensen, Dennis

Abstract

The present invention relates to split electrodes for microelectromechanical system (MEMS) microphones. In one embodiment, a MEMS sensor includes a membrane, a membrane electrode formed in a portion of the membrane, and a backplate situated parallel to the membrane and separated by a gap. The backplate includes a first region of the backplate, where the first region of the backplate has first perforations of a first density, a backplate electrode is formed in a portion of the first region of the backplate, and a portion of the membrane electrode overlaps a portion of the backplate electrode in a sensing region forming a sensing capacitor, the sensing capacitor being configured to sense motion of the membrane in response to acoustic pressure. The backplate also includes a second region of the backplate having second perforations of a second density, where the second density is greater than the first density.

IPC Classes  ?

41.

ELECTRODES FOR MICROELECTROMECHANICAL SYSTEM MICROPHONES

      
Application Number 18448601
Status Pending
Filing Date 2023-08-11
First Publication Date 2024-05-23
Owner
  • INVENSENSE, INC. (USA)
  • TDK ELECTRONICS AG (Germany)
Inventor
  • Seeger, Joseph
  • Mortensen, Dennis

Abstract

The present invention relates to split electrodes for microelectromechanical system (MEMS) microphones. In one embodiment, a MEMS sensor includes a membrane, a membrane electrode formed in a portion of the membrane, and a backplate situated parallel to the membrane and separated by a gap. The backplate includes a first region of the backplate, where the first region of the backplate has first perforations of a first density, a backplate electrode is formed in a portion of the first region of the backplate, and a portion of the membrane electrode overlaps a portion of the backplate electrode in a sensing region forming a sensing capacitor, the sensing capacitor being configured to sense motion of the membrane in response to acoustic pressure. The backplate also includes a second region of the backplate having second perforations of a second density, where the second density is greater than the first density.

IPC Classes  ?

42.

SENSOR DRIVER PROVIDING HIGH POWER SUPPLY REJECTION RATIO

      
Application Number 18461050
Status Pending
Filing Date 2023-09-05
First Publication Date 2024-05-23
Owner INVENSENSE, INC. (USA)
Inventor
  • Sarafianos, Athanasios
  • Piessens, Tim

Abstract

A sensor driver providing high power supply rejection ratio is provided herein. A circuit can include a charge pump that comprises an input terminal and an output terminal, wherein the input terminal is operatively connected to a voltage supply. The charge pump further comprises circuitry that decouples an input voltage from the voltage supply from an output voltage of the charge pump and mixes defined frequency disturbances back to baseband. The circuit also includes an error amplifier configured to provide high power supply rejection ratio at baseband, wherein the output terminal of the charge pump is operatively connected to an input node of the error amplifier. Further, the circuit includes a capacitive micro-electromechanical system sensor operatively connected to an output node of the error amplifier.

IPC Classes  ?

  • H03F 3/00 - Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
  • H03F 1/30 - Modifications of amplifiers to reduce influence of variations of temperature or supply voltage
  • H03F 3/45 - Differential amplifiers

43.

BACKPOWER-SAFE TEST SWITCH

      
Application Number 18511786
Status Pending
Filing Date 2023-11-16
First Publication Date 2024-05-23
Owner INVENSENSE, INC. (USA)
Inventor
  • Piessens, Tim
  • Croon, Robin
  • Sarafianos, Athanasios

Abstract

Disclosed embodiments provide backpower-safe test switches, devices, systems, and methods. By maintaining high impedance on an existing communications bus integrated circuit pin, disclosed embodiments prevent backpower of integrated circuits even when the integrated circuits are powered off. In a non-limiting aspect, disclosed embodiments facilitate increased final ASIC test coverage by facilitating multiplexing analog test bus on an existing ASIC pin.

IPC Classes  ?

  • H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
  • G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer

44.

TECHNIQUES FOR REDUCED NOISE CAPACITANCE-TO-VOLTAGE CONVERTER

      
Application Number 18500886
Status Pending
Filing Date 2023-11-02
First Publication Date 2024-05-23
Owner INVENSENSE, INC. (USA)
Inventor
  • Bracke, Wouter
  • Serneels, Bert
  • Sarafianos, Athanasios
  • Piessens, Tim

Abstract

A continuous time single drive capacitance-to-voltage (C2V) converter can be employed for single sensor, balanced single sensor, or differential sensor. First sensor and/or second sensor can be employed to sense a condition. A capacitive bridge can comprise a first capacitive digital-to-analog-converter (DAC) and second capacitive DAC as a differential node. First capacitive DAC can be associated with first sensor, and second capacitive DAC can be associated with a third capacitive DAC, in series with first sensor, if single sensor is implemented or the second sensor if balanced single sensor or differential sensor is implemented. Capacitive bridge can be connected to differential input of a capacitive feedback amplifier that can be a continuous time amplifier with no signal sampling and no noise folding. Capacitive feedback amplifier can comprise capacitively coupled input common mode feedback, which can remove noise from a sensor drive, and output common mode feedback.

IPC Classes  ?

  • H03M 1/08 - Continuously compensating for, or preventing, undesired influence of physical parameters of noise
  • G01D 5/24 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
  • G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
  • G01R 19/257 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof using digital measurement techniques using analogue/digital converters of the type with comparison of different reference values with the value of voltage or current, e.g. using step-by-step method

45.

Apparatus and system for tuning the resonant frequency of a piezoelectric micromachined ultrasonic transducer

      
Application Number 18423200
Grant Number 12226801
Status In Force
Filing Date 2024-01-25
First Publication Date 2024-05-16
Grant Date 2025-02-18
Owner InvenSense, Inc. (USA)
Inventor
  • Shelton, Stefon
  • Goericke, Fabian
  • Costello, Benedict

Abstract

The teachings of the present disclosure enable the manufacture of one or more piezoelectric micromachined ultrasonic transducers (PMUTs) having a resonant frequency of a specific target value and/or substantially matched resonant frequencies. In accordance with the present disclosure, a flexible membrane of a PMUT is modified to impart a desired parameter profile for stiffness and/or mass to tune its resonant frequency to a target value. The desired parameter profile is achieved by locally removing or adding material to regions of one or more layers of the flexible membrane to alter its geometric dimensions and/or density. In some embodiments, material is added or removed non-uniformly across the structural layer to realize a material distribution that more strongly affects membrane stiffness than mass. In some embodiments, material having a specific residual stress is added to, and/or removed from, the membrane to define a desired modal stiffness for the membrane.

IPC Classes  ?

  • B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
  • H10N 30/04 - Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning

46.

TERMINAL DEVICE, MAGNETIC ANCHOR SYSTEM, AND POSITION DETERMINATION METHOD

      
Application Number US2023035058
Publication Number 2024/086057
Status In Force
Filing Date 2023-10-12
Publication Date 2024-04-25
Owner
  • INVENSENSE, INC (USA)
  • TDK - JAPAN (Japan)
Inventor
  • Nakayama, Takashi
  • Berkovich, Gennadii
  • Ariake, Yusuke
  • Goodall, Chris
  • Higuma, Shinji

Abstract

A terminal device that can perform positioning with high accuracy and at a low cost is provided. [Solution] A terminal device that is held by a terminal holding object includes a magnetic detection unit configured to detect magnetic field produced by a magnetic anchor made of magnet; and a position information acquisition unit configured to acquire position information that corresponds to magnetic information detected by the magnetic detection unit by referring to correspondence between magnetic information and position information prepared in advance.

IPC Classes  ?

  • G01C 21/16 - NavigationNavigational instruments not provided for in groups by using measurement of speed or acceleration executed aboard the object being navigatedDead reckoning by integrating acceleration or speed, i.e. inertial navigation
  • G01C 21/04 - NavigationNavigational instruments not provided for in groups by terrestrial means

47.

ASSET MANAGEMENT SYSTEM AND ASSET MANAGEMENT METHOD

      
Application Number US2023035059
Publication Number 2024/086058
Status In Force
Filing Date 2023-10-12
Publication Date 2024-04-25
Owner
  • INVENSENSE, INC. (USA)
  • TDK - JAPAN (Japan)
Inventor
  • Nakayama, Takashi
  • Berkovich, Gennadi
  • Higuma, Shinji

Abstract

[Object] An asset management system that can perform asset management with high accuracy is provided. [Solution] An asset management system that manages an asset to which a tag capable of identifying individual information is attached includes a terminal unit that is held by a terminal holding object, in which the terminal unit includes a tag communication unit that communicates with the tag to read the individual information, and a position information acquisition unit that acquires position information, the position information acquisition unit starts to acquire the position information as information on the asset to which the tag is attached when a first condition is satisfied, and ends acquisition of the position information when a second condition is satisfied, the first condition is at least one of a condition that communication between the tag communication unit and the tag is established and the distance between the tag communication unit and the tag is equal to or less than a first threshold value, and the second condition is at least one of a condition that the wireless communication is not established and the distance between the tag communication unit and the tag is more than the second threshold value.

IPC Classes  ?

  • G06Q 10/00 - AdministrationManagement
  • G06Q 10/06 - Resources, workflows, human or project managementEnterprise or organisation planningEnterprise or organisation modelling
  • G06Q 10/08 - Logistics, e.g. warehousing, loading or distributionInventory or stock management
  • G06Q 10/087 - Inventory or stock management, e.g. order filling, procurement or balancing against orders
  • G06Q 50/28 - Logistics, e.g. warehousing, loading, distribution or shipping

48.

MICROELECTROMECHANICAL ACOUSTIC SENSOR WITH MEMBRANE ETCH RELEASE STRUCTURES AND METHOD OF FABRICATION

      
Application Number US2023035597
Publication Number 2024/086330
Status In Force
Filing Date 2023-10-20
Publication Date 2024-04-25
Owner
  • INVENSENSE, INC. (USA)
  • TDK ELECTRONICS AG (Germany)
Inventor
  • Rombach, Pirmin
  • Rasmussen, Kurt
  • Mortensen, Dennis
  • Ravnkilde, Jan
  • Liu, Cheng-Yen
  • Akiyama, Jotaro
  • Bharatan, Sushil
  • Chase, Troy

Abstract

Low-cost, robust, and high performance microelectromechanical systems (MEMS) acoustic sensors are described. Described MEMS acoustic sensors can comprise a set of etch release structures in the acoustic sensor membrane that facilitates rapid and/or uniform etch release of the acoustic sensor membrane. In addition, MEMS acoustic sensors can comprise a set of membrane position control structures of the acoustic sensor membrane that can reduce the bending stress of the acoustic sensor membrane. MEMS acoustic sensors can further comprise a three layer acoustic sensor membrane that provides increased robustness. Further design flexibility and improvements are described that provide increased robustness and/or cost savings, and a low cost fabrication process for MEMS acoustic sensors is provided.

IPC Classes  ?

  • H04R 19/00 - Electrostatic transducers
  • H04R 31/00 - Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
  • H04R 19/04 - Microphones

49.

TDK SMARTAUTOMOTIVE

      
Application Number 019006636
Status Registered
Filing Date 2024-03-29
Registration Date 2024-08-09
Owner InvenSense, Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Scientific, research, navigation, surveying, photographic, cinematographic, audiovisual, optical, weighing, measuring, signalling, detecting, testing, inspecting, life-saving and teaching apparatus and instruments; Apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling the distribution or use of electricity; Apparatus and instruments for recording, transmitting, reproducing or processing sound, images or data; Recorded and downloadable media, computer software, blank digital or analogue recording and storage media; Mechanisms for coin-operated apparatus; Cash registers, calculating devices; Computers and computer peripheral devices; Diving suits, divers' masks, ear plugs for divers, nose clips for divers and swimmers, gloves for divers, breathing apparatus for underwater swimming; Fire-extinguishing apparatus; Inertial measurement unit; motion sensors; accelerometers; gyroscopes; magnetometers; pressure sensors; temperature sensors; ultrasonic sensors for measuring acceleration, angle of rotation, pressure, temperature, and distance ranges, all for use in automotive systems, autonomous car systems, advanced driver assisted systems, internet of things applications, and internet of things software development systems; measuring equipment (sensors) comprising an inertial measurement unit, magnetometer, pressure sensor, temperature sensor, ultrasonic sensor, passive components, and high-precision algorithms, all for use in sensor fusion for automotive systems, autonomous car systems, advanced driver assisted systems, internet of things applications, and internet of things software development systems; sensor development kits, namely, kits comprised primarily of computer hardware and downloadable software for use in developing and operating sensors and electronic devices for detecting, transmitting, recognizing, analyzing, and tracking motion, movement, positions, distances, obstacles, ultrasonic signals, and ultrasonic range sensing; downloadable computer software for integrating drivers for multi-sensor modules for automotive systems, autonomous car systems, advanced driver assisted systems, internet of things software development systems, and internet of things applications..

50.

FIXED-FIXED MEMBRANE FOR MICROELECTROMECHANICAL SYSTEM MICROPHONE

      
Application Number US2022043704
Publication Number 2024/058783
Status In Force
Filing Date 2022-09-15
Publication Date 2024-03-21
Owner INVENSENSE, INC. (USA)
Inventor
  • Seeger, Joseph
  • Bharatan, Sushil
  • Randles, Andrew
  • Foster, Michael John

Abstract

The present invention relates to a fixed-fixed membrane for a microelectromechanical system (MEMS) microphone. In one embodiment, a MEMS acoustic sensor includes a substrate; a membrane situated parallel to the substrate; and at least one vent formed into the membrane, wherein the at least one vent is a curved opening in the membrane, and wherein the at least one vent is disposed substantially along a length of the membrane.

IPC Classes  ?

  • H04R 19/00 - Electrostatic transducers
  • H04R 19/04 - Microphones
  • H04R 7/22 - Clamping rim of diaphragm or cone against seating
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • H04R 7/10 - Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact

51.

Fixed-fixed membrane for microelectromechanical system microphone

      
Application Number 17931783
Grant Number 12170869
Status In Force
Filing Date 2022-09-13
First Publication Date 2024-03-14
Grant Date 2024-12-17
Owner INVENSENSE, INC. (USA)
Inventor
  • Seeger, Joseph
  • Bharatan, Sushil
  • Randles, Andrew
  • Foster, Michael John

Abstract

a MEMS acoustic sensor includes a substrate; a membrane situated parallel to the substrate; and at least one vent formed into the membrane, wherein the at least one vent is a curved opening in the membrane, and wherein the at least one vent is disposed substantially along a length of the membrane.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

52.

LOW STRESS OVERTRAVEL STOP

      
Application Number 18502444
Status Pending
Filing Date 2023-11-06
First Publication Date 2024-02-29
Owner INVENSENSE, INC. (USA)
Inventor
  • Thompson, Matthew Julian
  • Walmsley, Robert

Abstract

A microelectromechanical system device is described. The microelectromechanical system device can comprise: a proof mass coupled to an anchor via a spring, wherein the proof mass moves in response to an imposition of an external load to the proof mass, and an overtravel stop comprising a first portion and a second portion.

IPC Classes  ?

  • G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values

53.

Event activity detection signaling

      
Application Number 17821548
Grant Number 12245004
Status In Force
Filing Date 2022-08-23
First Publication Date 2024-02-29
Grant Date 2025-03-04
Owner INVENSENSE, INC. (USA)
Inventor
  • Svajda, Miro
  • Riva, Stefano

Abstract

Acoustic and other activity detection signaling is provided herein. Operations of a method can include determining a micro-electromechanical system (MEMS) device is no longer in an initialization state and receiving a first signal that instructs the MEMS device to perform event activity detection. The method can also include receiving one or more event signals and determining that an event signal of one or more event signals satisfies a defined event characteristic. The method can also include outputting a second signal that comprises information indicative of a detection of event activity at the MEMS device being more than the defined event characteristic.

IPC Classes  ?

  • H04R 3/00 - Circuits for transducers
  • G10L 25/18 - Speech or voice analysis techniques not restricted to a single one of groups characterised by the type of extracted parameters the extracted parameters being spectral information of each sub-band
  • G10L 25/51 - Speech or voice analysis techniques not restricted to a single one of groups specially adapted for particular use for comparison or discrimination
  • H04R 19/04 - Microphones

54.

EVENT ACTIVITY DETECTION SIGNALING

      
Application Number US2023028933
Publication Number 2024/044018
Status In Force
Filing Date 2023-07-28
Publication Date 2024-02-29
Owner INVENSENSE, INC. (USA)
Inventor
  • Svajda, Miro
  • Riva, Stefano

Abstract

Acoustic and other activity detection signaling is provided herein. Operations of a method can include determining a micro-electromechanical system (MEMS) device is no longer in an initialization state and receiving a first signal that instructs the MEMS device to perform event activity detection. The method can also include receiving one or more event signals and determining that an event signal of one or more event signals satisfies a defined event characteristic. The method can also include outputting a second signal that comprises information indicative of a detection of event activity at the MEMS device being more than the defined event characteristic.

IPC Classes  ?

55.

APPLYING A POSITIVE FEEDBACK VOLTAGE TO AN ELECTROMECHANICAL SENSOR UTILIZING A VOLTAGE-TO-VOLTAGE CONVERTER TO FACILITATE A REDUCTION OF CHARGE FLOW IN SUCH SENSOR REPRESENTING SPRING SOFTENING

      
Application Number 18500867
Status Pending
Filing Date 2023-11-02
First Publication Date 2024-02-22
Owner INVENSENSE, INC. (USA)
Inventor
  • Seeger, Joseph
  • Shettigar, Pradeep

Abstract

Reducing a spring softening effect on a capacitive sense element of an electromechanical sensor is presented herein. A system, such as a microphone or an accelerometer, comprises an electromechanical sensor and a voltage-to-voltage converter component. The electromechanical sensor comprises a capacitive sense element and a bias voltage component that applies a bias voltage to a sense electrode of the capacitive sense element. The voltage-to-voltage converter component couples a positive feedback voltage to the sense electrode to maintain a constant charge at the sense electrode to facilitate a reduction of charge flow in the electromechanical sensor representing a spring softening effect on the capacitive sense element. In an example, the spring softening effect on the sense element alters a resonant frequency of the sense element and a gain of the sense element. In another example, the charge flow corresponds to a parasitic capacitance that is electrically coupled to the sense electrode.

IPC Classes  ?

  • G01P 1/00 - Details of instruments
  • G01P 15/00 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration
  • H03F 3/45 - Differential amplifiers
  • G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up

56.

Photoacoustic gas sensors with improved signal-to-noise ratio

      
Application Number 17890016
Grant Number 12287280
Status In Force
Filing Date 2022-08-17
First Publication Date 2024-02-22
Grant Date 2025-04-29
Owner InvenSense, Inc. (USA)
Inventor
  • Parker, Jeremy
  • Goel, Nishit
  • Bart, Stephen

Abstract

A bi-directional photoacoustic gas sensor includes a first photoacoustic cell, where an electromagnetic radiation source emits radiation to interact with an external gas and generate pressure waves that are detected by a MEMS diaphragm. A second photoacoustic cell has an interior volume and acoustic compliance that corresponds to the interior volume and acoustic compliance of the first photoacoustic cell. Processing circuitry within a substrate uses a first acoustic signal, received by the first photoacoustic cell, and a second acoustic signal, received by the second photoacoustic cell, to determine a bi-directional response of the gas sensor to remove noise and improve the sensor's signal-to-noise ratio.

IPC Classes  ?

  • G01N 21/17 - Systems in which incident light is modified in accordance with the properties of the material investigated
  • B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]

57.

Piezoelectric micromachined transducer and device

      
Application Number 18387043
Grant Number 12161507
Status In Force
Filing Date 2023-11-05
First Publication Date 2024-02-22
Grant Date 2024-12-10
Owner InvenSense, Inc. (USA)
Inventor
  • Goericke, Fabian T.
  • Przybyla, Richard J.
  • Eovino, Benjamin E.

Abstract

An ultrasonic transducer device comprises a piezoelectric micromachined ultrasonic transducer (PMUT), a transmitter with first and second differential outputs, and a controller. The PMUT includes a membrane layer. A bottom electrode layer, comprising a first bottom electrode and a second bottom electrode, is disposed above the membrane layer. The piezoelectric layer is disposed above the bottom electrode layer. The top electrode layer is disposed above the piezoelectric layer and comprises a segmented center electrode disposed above a center of the membrane layer and a segmented outer electrode spaced apart from the segmented center electrode. The controller, responsive to the PMUT being placed in a transmit mode, is configured to couple the first and second segments of the bottom electrode layer with ground, couple the first output of the transmitter with the segments of the segmented center electrode, and couple the second output with the segments of the segmented outer electrode.

IPC Classes  ?

  • A61B 8/00 - Diagnosis using ultrasonic, sonic or infrasonic waves
  • B06B 1/06 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
  • G01N 29/24 - Probes
  • G01S 7/521 - Constructional features
  • H10N 30/87 - Electrodes or interconnections, e.g. leads or terminals

58.

IMPROVED SIGNAL-TO-NOISE RATIO FOR PHOTOACOUSTIC GAS SENSORS

      
Application Number US2023029675
Publication Number 2024/039541
Status In Force
Filing Date 2023-08-08
Publication Date 2024-02-22
Owner INVENSENSE, INC (USA)
Inventor
  • Parker, Jeremy
  • Goel, Nishit
  • Bart, Stephen

Abstract

A bi-directional photoacoustic gas sensor includes a first photoacoustic cell, where an electromagnetic radiation source emits radiation to interact with an external gas and generate pressure waves that are detected by a MEMS diaphragm. A second photoacoustic cell has an interior volume and acoustic compliance that corresponds to the interior volume and acoustic compliance of the first photoacoustic cell. Processing circuitry within a substrate uses a first acoustic signal, received by the first photoacoustic cell, and a second acoustic signal, received by the second photoacoustic cell, to determine a bi-directional response of the gas sensor to remove noise and improve the sensor's signal-to-noise ratio.

IPC Classes  ?

  • G01N 29/02 - Analysing fluids
  • G01N 29/22 - Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic wavesVisualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object Details
  • G01N 29/24 - Probes
  • G01N 29/30 - Arrangements for calibrating or comparing, e.g. with standard objects
  • G01N 29/32 - Arrangements for suppressing undesired influences, e.g. temperature or pressure variations

59.

Piezoelectric micromachined ultrasonic transducer with a patterned membrane structure

      
Application Number 18381104
Grant Number 12284920
Status In Force
Filing Date 2023-10-17
First Publication Date 2024-02-08
Grant Date 2025-04-22
Owner InvenSense, Inc. (USA)
Inventor
  • Guedes, Andre
  • Goericke, Fabian
  • Shelton, Stefon
  • Costello, Benedict
  • Horsley, David

Abstract

A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a substrate having an opening therethrough and a membrane attached to the substrate over the opening. An actuating structure layer on a surface of the membrane includes a piezoelectric layer sandwiched between the membrane and an upper electrode layer. The actuating structure layer is patterned to selectively remove portions of the actuating structure from portions of the membrane to form in a central portion proximate a center of the open cavity and three or more rib portions projecting radially outward from the central portion.

IPC Classes  ?

  • H10N 30/50 - Piezoelectric or electrostrictive devices having a stacked or multilayer structure
  • H04R 17/00 - Piezoelectric transducersElectrostrictive transducers
  • H10N 30/057 - Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by stacking bulk piezoelectric or electrostrictive bodies and electrodes
  • H10N 30/87 - Electrodes or interconnections, e.g. leads or terminals
  • H10N 30/88 - MountsSupportsEnclosuresCasings

60.

UTILIZATION OF MICROPHONE ULTRASONIC RESPONSE

      
Application Number 18360463
Status Pending
Filing Date 2023-07-27
First Publication Date 2024-02-08
Owner INVENSENSE, INC. (USA)
Inventor
  • Parker, Jeremy
  • Bart, Stephen

Abstract

Utilization of microphone ultrasonic response is described. A system, comprising: a microelectromechanical system (MEMS) microphone device configured to capture signal data representing an ultrasonic signal and an audio-band signal simultaneously, and a processing circuitry configured to adjust a configuration parameter associated with the MEMS microphone device based on the ultrasonic signal.

IPC Classes  ?

  • H04B 11/00 - Transmission systems employing ultrasonic, sonic or infrasonic waves

61.

UTILIZATION OF MICROPHONE ULTRASONIC RESPONSE

      
Application Number US2023028946
Publication Number 2024/026073
Status In Force
Filing Date 2023-07-28
Publication Date 2024-02-01
Owner INVENSENSE, INC. (USA)
Inventor
  • Parker, Jeremy
  • Bart, Stephen

Abstract

Utilization of microphone ultrasonic response is described. A system, comprising: a microelectromechanical system (MEMS) microphone device configured to capture signal data representing an ultrasonic signal and an audio-band signal simultaneously, and a processing circuitry configured to adjust a configuration parameter associated with the MEMS microphone device based on the ultrasonic signal.

IPC Classes  ?

  • H04S 7/00 - Indicating arrangementsControl arrangements, e.g. balance control
  • H04R 1/10 - EarpiecesAttachments therefor
  • H04R 19/04 - Microphones
  • H04R 19/00 - Electrostatic transducers
  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

62.

GLITCH-FREE ZERO-LATENCY AGC FOR SIGMA DELTA MODULATOR

      
Application Number 18343151
Status Pending
Filing Date 2023-06-28
First Publication Date 2024-01-18
Owner INVENSENSE, INC. (USA)
Inventor Ballini, Marco

Abstract

A system, comprising: a sigma-delta modulator using an integrator of a cascade-of-integrator feedback topology to perform operations is disclosed. The operations can comprise in response to receiving a gain value, applying the gain value to a group of feed-forward coefficients, determining a change in the gain value, and adjusting, during a clock cycle of a defined time period, a plurality of state variables of the sigma-delta modulator by multiplying each of the state variables by the scale factor that is a ratio of the gain value after determining the change in the gain value the gain value before determining the change in the gain value.

IPC Classes  ?

  • H03M 3/00 - Conversion of analogue values to or from differential modulation

63.

Accelerometer-Based Voice Activity Detection

      
Application Number 18218953
Status Pending
Filing Date 2023-07-06
First Publication Date 2024-01-18
Owner InvenSense, Inc. (USA)
Inventor Poncot, Remi Louis Clement

Abstract

An example embodiment includes a head worn electronic device comprising a transceiver for communicating with a host device, an accelerometer having a plurality of axes for detecting three-dimensional forces applied to the head worn electronic device, and a processor. The processor is configured to receive a three-dimensional vibration vector from the accelerometer caused by a voice of a user while the head worn electronic device is positioned in a user's ear, process the three-dimensional vibration vector to determine a voice activity detection axis that correlates with vibrations caused by the voice of the user, perform processing of data from the voice activity detection axis to detect voice activity of the user, and send an instruction to the host device via the transceiver to control the host device based on the voice activity detection.

IPC Classes  ?

  • G10L 25/78 - Detection of presence or absence of voice signals
  • H04R 1/10 - EarpiecesAttachments therefor
  • G10L 15/08 - Speech classification or search

64.

Reduced light reflection package

      
Application Number 18371488
Grant Number 12133049
Status In Force
Filing Date 2023-09-22
First Publication Date 2024-01-11
Grant Date 2024-10-29
Owner InvenSense, Inc. (USA)
Inventor
  • Brioschi, Roberto
  • Hayata, Kazunori
  • Yeh, Jr-Cheng
  • Solanki, Dinesh Kumar

Abstract

A MEMS sensor includes a through hole to allow communication with an external environment, such as to send or receive acoustic signals or to be exposed to the ambient environment. In addition to the information that is being measured, light energy may also enter the environment of the sensor via the through hole, causing short-term or long-term effects on measurements or system components. A light mitigating structure is formed on or attached to a lid of the MEMS die to absorb or selectively reflect the received light in a manner that limits effects on the measurements or interest and system components.

IPC Classes  ?

  • H04R 19/04 - Microphones
  • B81B 7/00 - Microstructural systems
  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
  • H04R 1/04 - Structural association of microphone with electric circuitry therefor
  • H04R 3/00 - Circuits for transducers

65.

TDK SMARTROBOTICS

      
Application Number 018971417
Status Registered
Filing Date 2024-01-07
Registration Date 2024-05-23
Owner InvenSense, Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Downloadable computer software for integrating drivers for multi-sensor modules for internet of things software development systems and internet of things applications; measuring equipment sensors comprising inertial measurement unit, magnetometer, pressure sensor, microphone, temperature sensor, ultrasonic sensor for measuring acceleration, angle of rotation, pressure, temperature, sound, and distance ranges for use in internet of things applications and internet of things software development systems; measuring equipment sensors comprising an inertial measurement unit, magnetometer, pressure sensor, temperature sensor, ultrasonic sensor, microphone, passive components, and high-precision algorithms for use in sensor fusion and internet of things applications, industrial, drone, and automotive applications, and internet of things software development systems..

66.

ULTRASONIC DEVICE COEXISTENCE

      
Application Number 18216203
Status Pending
Filing Date 2023-06-29
First Publication Date 2024-01-04
Owner InvenSense, Inc. (USA)
Inventor
  • Youssef, Joe
  • Kline, Mitchell
  • Przybyla, Richard J.

Abstract

A device comprises a processor communicatively coupled with an ultrasonic sensor which is configured to repeatedly emit ultrasonic pulses during transmit periods which are interspersed with receive periods. Returned ultrasonic signals corresponding to the emitted ultrasonic pulses are received by the ultrasonic sensor during the receive periods. The processor is configured to direct the ultrasonic sensor to listen, during a listening window, for a potentially interfering ultrasonic signal from a second ultrasonic sensor. The listening window is prior to a transmit period of the transmit periods. In response to detecting the potentially interfering ultrasonic signal during the listening window, the processor is configured to adjust operation of the ultrasonic sensor to avoid an ultrasonic collision with the second ultrasonic sensor to facilitate coexistence of the ultrasonic sensor and the second ultrasonic sensor in an operating environment shared by the ultrasonic sensor and the second ultrasonic sensor.

IPC Classes  ?

  • G01S 15/00 - Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
  • G01S 15/87 - Combinations of sonar systems
  • G01S 7/52 - Details of systems according to groups , , of systems according to group
  • G01S 15/10 - Systems for measuring distance only using transmission of interrupted, pulse-modulated waves

67.

COEXISTENCE OF ULTRASONIC TRANSDUCERS IN AN OPERATING ENVIRONMENT

      
Application Number US2023025374
Publication Number 2023/249869
Status In Force
Filing Date 2023-06-15
Publication Date 2023-12-28
Owner INVENSENSE, INC. (USA)
Inventor
  • Hall, Daniela
  • Kline, Mitchell
  • Youssef, Joe

Abstract

A device comprises a processor coupled with an ultrasonic transducer which is configured to repeatedly emit ultrasonic pulses during transmit periods which are interspersed with listening windows. Each sequential pair of the transmit periods is separated by a single listening window of the listening windows. During a fixed portion of a listening window of the listening windows the ultrasonic transducer is configured to receive returned signals corresponding to an emitted ultrasonic pulse of the ultrasonic pulses which was transmitted during a transmit period of the transmit periods that immediately preceded the listening window. The processor randomizes an overall length of each listening window of the listening windows. The processor directs filtering of returned signals received during a plurality of the randomized listening windows to achieve filtered returned signals. The processor detects, using the filtered returned signals, a moving object in a field of view of the ultrasonic transducer.

IPC Classes  ?

  • G01S 15/10 - Systems for measuring distance only using transmission of interrupted, pulse-modulated waves
  • G01S 7/527 - Extracting wanted echo signals
  • G01S 15/52 - Discriminating between fixed and moving objects or between objects moving at different speeds

68.

COEXISTENCE OF ULTRASONIC TRANSDUCERS IN AN OPERATING ENVIRONMENT

      
Application Number 18207762
Status Pending
Filing Date 2023-06-09
First Publication Date 2023-12-28
Owner InvenSense, Inc. (USA)
Inventor
  • Hall, Daniela
  • Kline, Mitchell
  • Youssef, Joe

Abstract

A device comprises a processor coupled with an ultrasonic transducer which is configured to repeatedly emit ultrasonic pulses during transmit periods which are interspersed with listening windows. Each sequential pair of the transmit periods is separated by a single listening window of the listening windows. During a fixed portion of a listening window of the listening windows the ultrasonic transducer is configured to receive returned signals corresponding to an emitted ultrasonic pulse of the ultrasonic pulses which was transmitted during a transmit period of the transmit periods that immediately preceded the listening window. The processor randomizes an overall length of each listening window of the listening windows. The processor directs filtering of returned signals received during a plurality of the randomized listening windows to achieve filtered returned signals. The processor detects, using the filtered returned signals, a moving object in a field of view of the ultrasonic transducer.

IPC Classes  ?

  • G01S 15/10 - Systems for measuring distance only using transmission of interrupted, pulse-modulated waves
  • G01S 15/04 - Systems determining presence of a target

69.

INVENSENSE

      
Serial Number 98328371
Status Pending
Filing Date 2023-12-22
Owner InvenSense, Inc. ()
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Sensors, not for medical use, being parts of measuring equipment and comprising an inertial measurement unit, magnetometer, pressure sensor, microphone, temperature sensor, ultrasonic sensor for measuring acceleration, angle of rotation, sound, and distance ranges, for use in sensor fusion, Internet of Things applications, industrial applications and related software development systems, drone applications and related software development systems, automotive applications and related software development systems; Ultrasonic time-of-flight sensors being parts of measuring equipment for measuring distances, determining the presence or absence of obstacles, measuring sound waves, detecting ultrasonic signals, and measuring ultrasonic range; surface acoustic wave sensors; microphones; electronic sensors for detecting sound; sensors for measuring sound waves; sensors for the determination of location, positions, movement, change in pressure, activity monitoring, and change in elevation of computers, laptops, tablets, smartphones, portable electronic devices, drones, smart watches, electronic tracking devices, and wearable electronic devices; fingerprint scanners; ultrasonic sensors; biometric identification apparatus; touchscreen sensors for interpreting fingerprints, image enhancement, fingerprint matching, user identification and user authentication; kits for making motion sensors comprised of downloadable software and electronic sensors for use in industrial applications; sensor development kits, namely, kits for making motion sensors comprised of computer hardware and downloadable software for developing and operating electronic devices for detecting, transmitting, recognizing, analyzing, and tracking motion, movement, positions, distances, the presence or absence of obstacles, sounds, change in elevation, ultrasonic signals, and barometric pressure; downloadable and recorded software for use with sensors for monitoring position, movement, vibration, and angle of incline, and for measuring distances, determining environmental conditions, all for use in Internet of Things applications; downloadable software for use with sensor devices and sensors for detecting sound, recognizing sound, analyzing sound, monitoring sound, and controlling sound; downloadable software for use with sensor enabled microphones, headsets, wireless audio devices, smart speakers, mobile devices, wearable mobile technologies for capturing and storing sensor data and analytics; downloadable software for interpreting fingerprints; hardware for interpreting fingerprints, image enhancement, fingerprint matching, user identification, and user authentication, namely, fingerprint scanners; downloadable software for use with sensor-enabled microphones, headphones, wireless audio devices, smart speakers, mobile devices, wearable mobile technologies, and Internet of Things devices for capturing and storing sensor data and analytics

70.

LOW NOISE READOUT INTERFACE FOR CAPACITIVE SENSORS WITH NEGATIVE CAPACITANCE

      
Application Number 18331323
Status Pending
Filing Date 2023-06-08
First Publication Date 2023-12-21
Owner INVENSENSE, INC. (USA)
Inventor
  • Valle, Stefano
  • Hanzlik, Tomasz E.

Abstract

Disclosed embodiments provide a self-contained topology that enables a significant noise reduction of capacitive sensor readout interfaces. For example, various embodiments can provide low noise capacitive sensor readout interfaces or analog front ends having a main buffer amplifier in a bootstrap configuration, wherein a bootstrap loop configuration comprises a negative capacitance coupled to an input of the main buffer amplifier with a negative impedance converter.

IPC Classes  ?

  • G01R 27/26 - Measuring inductance or capacitanceMeasuring quality factor, e.g. by using the resonance methodMeasuring loss factorMeasuring dielectric constants

71.

SMARTAUTOMOTIVE

      
Application Number 1767547
Status Registered
Filing Date 2023-11-07
Registration Date 2023-11-07
Owner InvenSense, Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Inertial measurement unit; motion sensors; accelerometers; gyroscopes; magnetometers; pressure sensors; temperature sensors; ultrasonic sensors for measuring acceleration, angle of rotation, pressure, temperature, and distance ranges, all for use in automotive systems, autonomous car systems, advanced driver assisted systems, internet of things applications, and internet of things software development systems; measuring equipment (sensors) comprising an inertial measurement unit, magnetometer, pressure sensor, temperature sensor, ultrasonic sensor, passive components, and high-precision algorithms, all for use in sensor fusion for automotive systems, autonomous car systems, advanced driver assisted systems, internet of things applications, and internet of things software development systems; sensor development kits, namely, kits comprised primarily of computer hardware and downloadable software for use in developing and operating sensors and electronic devices for detecting, transmitting, recognizing, analyzing, and tracking motion, movement, positions, distances, obstacles, ultrasonic signals, and ultrasonic range sensing; downloadable computer software for integrating drivers for multi-sensor modules for automotive systems, autonomous car systems, advanced driver assisted systems, internet of things software development systems, and internet of things applications.

72.

Parameterized Register Programming Protocol (RPP) To Save Layout Routing Area

      
Application Number 17843831
Status Pending
Filing Date 2022-06-17
First Publication Date 2023-12-21
Owner InvenSense, Inc. (USA)
Inventor
  • Wang, Hou-Yi
  • Datta, Biswajit
  • Shrivastava, Sarvesh

Abstract

A parameterized register interface of an integrated circuit and methods of register programming. An integrated circuit includes a digital controller, at least one client comprising at least one programmable register and a parameterized bus coupled to the digital controller and the client. The digital controller is configured to: transfer, via the parameterized bus, address data and/or register data between the digital controller and the client according to one or more interface signals conveyed over the parameterized bus; generate a transaction command comprising at least one transaction specific to the programmable register of the client, the transaction command generated according to a predetermined register programming protocol; and transfer, via the parameterized bus, the transaction command together with at least one predetermined combination of the interface signals to the client. The programmable register is configured to perform the transaction in accordance with the transaction command.

IPC Classes  ?

  • G11C 7/10 - Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
  • G11C 7/22 - Read-write [R-W] timing or clocking circuitsRead-write [R-W] control signal generators or management
  • G11C 7/24 - Memory cell safety or protection circuits, e.g. arrangements for preventing inadvertent reading or writingStatus cellsTest cells

73.

Incremental analog to digital converter incorporating noise shaping and residual error quantization

      
Application Number 17805761
Grant Number 11990917
Status In Force
Filing Date 2022-06-07
First Publication Date 2023-12-07
Grant Date 2024-05-21
Owner INVENSENSE, INC. (USA)
Inventor
  • Oliaei, Omid
  • Bart, Stephen

Abstract

The present invention relates to an incremental analog to digital converter incorporating noise shaping and residual error quantization. In one embodiment, a circuit includes an incremental analog to digital converter, comprising a loop filter that filters an analog input signal in response to receiving a reset signal, resulting in a filtered analog input signal, and a successive approximation register (SAR) quantizer, coupled with the filtered analog input signal, that converts the filtered analog input signal to an intermediate digitized output of a first resolution based on a reference voltage, wherein the SAR quantizer comprises a feedback loop that shapes quantization noise generated by the SAR quantizer as a result of converting the filtered analog input signal; and a digital filter, coupled with the intermediate digitized output, that generates a digitized output signal of a second resolution, greater than the first resolution, by digitally filtering the intermediate digitized output.

IPC Classes  ?

  • H03M 1/06 - Continuously compensating for, or preventing, undesired influence of physical parameters
  • H03M 1/00 - Analogue/digital conversionDigital/analogue conversion
  • H03M 1/12 - Analogue/digital converters
  • H03M 1/46 - Analogue value compared with reference values sequentially only, e.g. successive approximation type with digital/analogue converter for supplying reference values to converter

74.

ANCHOR DESIGN WITH REJECTION OF EXTERNAL SHEAR FORCE

      
Application Number 17740832
Status Pending
Filing Date 2022-05-10
First Publication Date 2023-11-16
Owner InvenSense, Inc. (USA)
Inventor
  • Sharma, Mrigank
  • Kumar, Varun Subramaniam
  • Coronato, Luca
  • Laghi, Giacomo
  • Thompson, Matthew Julian

Abstract

A MEMS sensor includes at least one anchor that extends into a MEMS layer and a proof mass suspended from the at least one anchor. Each anchor is coupled to the proof mass via two compliant springs that are oriented perpendicular to each other and attached to a respective anchor. The compliant springs absorb non-measured external forces such as shear forces that are applied to the sensor packaging, preventing these forces from modifying the relative location and operation of the proof mass.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes

75.

Acoustic activity detection

      
Application Number 18359242
Grant Number 12238481
Status In Force
Filing Date 2023-07-26
First Publication Date 2023-11-16
Grant Date 2025-02-25
Owner INVENSENSE, INC. (USA)
Inventor
  • Pitak, Tomas
  • Mucha, Igor
  • Dick, Robert
  • Tuttle, Michael

Abstract

Acoustic activity detection is provided herein. Operations of a method can include receiving an acoustic signal at a micro-electromechanical system (MEMS) microphone. Based on portions of the acoustic signal being determined to exceed a threshold signal level, output pulses are generated. Further, the method can include extracting information representative of a frequency of the acoustic signal based on respective spacing between rising edges of the output pulses.

IPC Classes  ?

76.

Drive and sense balanced, semi-coupled 3-axis gyroscope

      
Application Number 18333821
Grant Number 12228404
Status In Force
Filing Date 2023-06-13
First Publication Date 2023-10-12
Grant Date 2025-02-18
Owner INVENSENSE, INC. (USA)
Inventor
  • Senkal, Doruk
  • Hennessy, Robert
  • Johari-Galle, Houri
  • Seeger, Joseph

Abstract

A dynamically balanced 3-axis gyroscope architecture is provided. Various embodiments described herein can facilitate providing linear and angular momentum balanced 3-axis gyroscope architectures for better offset stability, vibration rejection, and lower part-to-part coupling.

IPC Classes  ?

  • G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
  • G01C 19/5747 - Structural details or topology the devices having two sensing masses in anti-phase motion each sensing mass being connected to a driving mass, e.g. driving frames
  • G01C 19/5762 - Structural details or topology the devices having a single sensing mass the sensing mass being connected to a driving mass, e.g. driving frames

77.

SMARTROBOTICS

      
Application Number 1752850
Status Registered
Filing Date 2023-08-25
Registration Date 2023-08-25
Owner InvenSense, Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Downloadable computer software for integrating drivers for multi-sensor modules for internet of things software development systems and internet of things applications; measuring equipment sensors comprising inertial measurement unit, magnetometer, pressure sensor, microphone, temperature sensor, ultrasonic sensor for measuring acceleration, angle of rotation, pressure, temperature, sound, and distance ranges for use in internet of things applications and internet of things software development systems; measuring equipment sensors comprising an inertial measurement unit, magnetometer, pressure sensor, temperature sensor, ultrasonic sensor, microphone, passive components, and high-precision algorithms for use in sensor fusion and internet of things applications, industrial, drone, and automotive applications, and internet of things software development systems.

78.

PRESSURE SENSOR AND MANUFACTURING METHOD FOR THE SAME

      
Application Number 18113541
Status Pending
Filing Date 2023-02-23
First Publication Date 2023-09-21
Owner INVENSENSE, INC. (USA)
Inventor
  • Sasaki, Yoshitaka
  • Akiyama, Jotaro
  • Akram, Sal
  • Wang, Yaoching
  • Su, Weng Shen
  • Tang, Tsung Lin
  • Liu, Ting-Yuan
  • Shibano, Yuki
  • Lin, Chung-Hsien

Abstract

A pressure sensor includes a first electrode, a plurality of cavities, and a second electrode. The second electrode is disposed opposite the first electrode through the plurality of cavities. The second electrode includes a flat structure spanning two adjacent cavities of the plurality of cavities.

IPC Classes  ?

  • G01L 9/12 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance
  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate

79.

TDK SMARTINDUSTRIAL

      
Application Number 018927680
Status Registered
Filing Date 2023-09-20
Registration Date 2024-01-31
Owner InvenSense, Inc. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Motion sensors; industrial sensors for improving efficiency and monitoring conditions in industrial applications; sensor evaluation kits for motion measurement comprised primarily of electronic sensors and software for use in industrial applications; sensors for determining position, movement, vibration, inclination, and distances; downloadable and recorded software for use with sensors and for monitoring position, movement, vibration, inclination, distances, environmental conditions, and for Internet of Things applications..

80.

MEMS design with shear force rejection for reduced offset

      
Application Number 17733495
Grant Number 11761977
Status In Force
Filing Date 2022-04-29
First Publication Date 2023-09-19
Grant Date 2023-09-19
Owner InvenSense, Inc. (USA)
Inventor
  • Kumar, Varun Subramaniam
  • Sharma, Mrigank
  • Laghi, Giacomo
  • Coronato, Luca
  • Thompson, Matthew Julian

Abstract

A MEMS sensor includes a central anchoring region that maintains the relative position of an attached proof mass relative to sense electrodes in the presence of undesired forces and stresses. The central anchoring region includes one or more first anchors that rigidly couple to a cover substrate and a base substrate. One or more second anchors are rigidly coupled to only the cover substrate and are connected to the one or more first anchors within the MEMS layer via an isolation spring. The proof mass in turn is connected to the one or more second anchors via one or more compliant springs.

IPC Classes  ?

  • G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
  • G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values

81.

Round robin sensor device for processing sensor data

      
Application Number 17680637
Grant Number 11913788
Status In Force
Filing Date 2022-02-25
First Publication Date 2023-08-31
Grant Date 2024-02-27
Owner INVENSENSE, INC. (USA)
Inventor
  • Tsinker, Vadim
  • Mazzarella, Frederico
  • Shirvani, Ali

Abstract

A round robin sensor device for processing sensor data is provided herein. The sensor device includes a multiplexer stage configured to sequentially select sensor outputs from one or more sensors continuously. Continuously and sequentially selecting sensor outputs results in a stream of selected sensor outputs. The sensor device also includes a charge-to-voltage converter operatively coupled to the multiplexer stage and configured to convert a charge from a first sensor of the one or more sensors to a voltage. Further, the sensor device includes a resettable integrator operatively coupled to the charge-to-voltage converter and configured to demodulate and integrate the voltage, resulting in an integrated voltage. Also included in the sensor device is an analog-to-digital converter operatively coupled to the resettable integrator and configured to digitize the integrated voltage to a digital code.

IPC Classes  ?

  • G01C 19/5776 - Signal processing not specific to any of the devices covered by groups
  • H03M 1/12 - Analogue/digital converters
  • G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
  • H03M 1/38 - Analogue value compared with reference values sequentially only, e.g. successive approximation type
  • G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
  • G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up

82.

SMARTPRESSURE

      
Application Number 1748152
Status Registered
Filing Date 2023-03-24
Registration Date 2023-03-24
Owner INVENSENSE, INC. (USA)
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Barometric pressure measurement sensors; sensors and waterproof sensors for the determination of location, positions, movement, change in pressure, activity monitoring, and change in elevation, for use in computers, laptops, tablets, smartphones, portable electronic devices, drone, smart watches, electronic tracking devices, wearable electronic devices, and wireless connected devices; software for use with computers, laptops, tablets, smartphones, portable electronic devices, smart watches, electronic tracking devices, wearable electronic devices, and wireless connected devices, and electronic devices embedded with sensors; software for use in tracking, locating, activity monitoring, measuring change in elevation; software for operating and managing mobile phones, computers, tablet computers, portable electronic devices, smart watches, fitness devices, electronic tracking devices, wireless connected devices, wearable activity trackers, drones, and in the Internet of Things (IoT); software for use with, but not limited to, sensor devices, development kit; sensor development kits, namely, kits comprised primarily of computer hardware and downloadable software for use in developing and operating sensors and electronic devices for detecting, transmitting, recognizing, analyzing, and tracking motion, change in elevation, movement, positions, and barometric pressure.

83.

Motion sensor with sigma-delta analog-to-digital converter having resistive continuous-time digital-to-analog converter feedback for improved bias instability

      
Application Number 17674788
Grant Number 11881874
Status In Force
Filing Date 2022-02-17
First Publication Date 2023-08-17
Grant Date 2024-01-23
Owner INVENSENSE, INC. (USA)
Inventor Pelli, Gabriele

Abstract

A motion sensor with sigma-delta analog-to-digital converter (ADC) having improved bias instability is presented herein. Differential outputs of a differential amplifier of the sigma-delta ADC are electrically coupled, via respective capacitances, to differential inputs of the differential amplifier. To minimize bias instability corresponding to flicker noise that has been injected into the differential inputs, the differential inputs are electrically coupled, via respective pairs of electronic switches, to feedback resistances based on a pair of switch control signals. In this regard, a first feedback resistance of the feedback resistances is electrically coupled to a first defined voltage, and a second feedback resistance of the feedback resistances is electrically coupled to a second defined reference voltage. The differential outputs are electrically coupled to differential inputs of a differential comparator of the sigma-delta ADC, and complementary outputs of the differential comparator comprise the pair of switch control signals.

IPC Classes  ?

  • H03M 3/00 - Conversion of analogue values to or from differential modulation
  • H03F 3/45 - Differential amplifiers
  • G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
  • G01P 1/00 - Details of instruments
  • G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
  • G01C 19/5776 - Signal processing not specific to any of the devices covered by groups
  • G01C 19/5649 - Signal processing

84.

A METHOD FOR IMPROVING DIE AREA AND POWER EFFICIENCY IN HIGH DYNAMIC RANGE DIGITAL MICROPHONES

      
Application Number 18298065
Status Pending
Filing Date 2023-04-10
First Publication Date 2023-08-03
Owner INVENSENSE, INC. (USA)
Inventor
  • Mucha, Igor
  • Perrott, Michael

Abstract

Exemplary multipath digital microphones described herein can comprise exemplary embodiments of automatic gain control and multipath digital audio signal digital signal processing chains, which allow low power and die size to be achieved as described herein, while still providing a high DR digital microphone systems. Further non-limiting embodiments can facilitate switching between multipath digital audio signal digital signal processing chains while minimizing audible artifacts associated with either the change in the gain automatic gain control amplifiers switching between multipath digital audio signal digital signal processing chains.

IPC Classes  ?

  • H03G 3/30 - Automatic control in amplifiers having semiconductor devices
  • H03F 3/68 - Combinations of amplifiers, e.g. multi-channel amplifiers for stereophonics
  • H04R 3/04 - Circuits for transducers for correcting frequency response
  • H04R 29/00 - Monitoring arrangementsTesting arrangements

85.

Low stress overtravel stop

      
Application Number 17647376
Grant Number 11846648
Status In Force
Filing Date 2022-01-07
First Publication Date 2023-07-13
Grant Date 2023-12-19
Owner INVENSENSE, INC. (USA)
Inventor
  • Thompson, Matthew Julian
  • Walmsley, Robert

Abstract

A microelectromechanical system device is described. The microelectromechanical system device can comprise: a proof mass coupled to an anchor via a spring, wherein the proof mass moves in response to an imposition of an external load to the proof mass, and an overtravel stop comprising a first portion and a second portion.

IPC Classes  ?

  • G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values

86.

ACTUATOR LAYER PATTERNING WITH TOPOGRAPHY

      
Application Number 18115178
Status Pending
Filing Date 2023-02-28
First Publication Date 2023-06-29
Owner InvenSense, Inc. (USA)
Inventor
  • Lee, Daesung
  • Cuthbertson, Alan

Abstract

A method including fusion bonding a handle wafer to a first side of a device wafer. The method further includes depositing a hardmask on a second side of the device wafer, wherein the second side is planar. An etch stop layer is deposited over the hardmask and an exposed portion of the second side of the device wafer. A dielectric layer is formed over the etch stop layer. A via is formed within the dielectric layer. The via is filled with conductive material. A eutectic bond layer is formed over the conductive material. Portions of the dielectric layer uncovered by the eutectic bond layer is etched to expose the etch stop layer. The exposed portions of the etch stop layer is etched. A micro-electro-mechanical system (MEMS) device pattern is etched into the device wafer.

IPC Classes  ?

  • B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
  • B81B 7/00 - Microstructural systems

87.

CONSTANT CHARGE OR CAPACITANCE FOR CAPACITIVE MICRO-ELECTRICAL-MECHANICAL SYSTEM SENSORS

      
Application Number US2022053420
Publication Number 2023/122044
Status In Force
Filing Date 2022-12-19
Publication Date 2023-06-29
Owner INVENSENSE, INC. (USA)
Inventor Seeger, Joseph

Abstract

Embodiments for constant charge or capacitance for capacitive micro-electro-mechanical system (MEMS) sensors are presented herein. A MEMS device comprises a sense element circuit comprising a bias resistance, a charge-pump, and a capacitive sense element comprising an electrode and a sense capacitance. The charge-pump generates, at a bias resistor electrically coupled to the electrode, a bias voltage that is inversely proportional to a capacitance value comprising a value of the sense capacitance to facilitate maintenance of a nominally constant charge on the electrode. A sensing circuit comprises an alternating current (AC) signal source that generates an AC signal at a defined frequency; and generates, based on the AC signal, an AC test voltage at a test capacitance that is electrically coupled to the electrode. The sense element circuit generates, based on the AC test voltage at the defined frequency, an output signal representing the value of the sense capacitance.

IPC Classes  ?

88.

Systems and methods for capturing stabilized images

      
Application Number 17992801
Grant Number 12289536
Status In Force
Filing Date 2022-11-22
First Publication Date 2023-06-22
Grant Date 2025-04-29
Owner INVENSENSE, INC. (USA)
Inventor
  • Riccardi, Sebastien
  • Grenet, Pierre
  • Lachaux, Jerome

Abstract

Systems and methods are disclosed for capturing stabilized images. Motion of the mobile device is determined so that the relative position of the lens and image sensor may be adjusted to compensate for unintended motion. The relative position of the lens and image sensor may be periodically reset in response to a synchronization signal in between capturing images.

IPC Classes  ?

  • H04N 23/80 - Camera processing pipelinesComponents thereof
  • H04N 23/68 - Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
  • H04N 23/81 - Camera processing pipelinesComponents thereof for suppressing or minimising disturbance in the image signal generation

89.

Multi-temperature gas sensing

      
Application Number 17559839
Grant Number 12044644
Status In Force
Filing Date 2021-12-22
First Publication Date 2023-06-22
Grant Date 2024-07-23
Owner InvenSense, Inc. (USA)
Inventor Gurin, Ilya

Abstract

2O).

IPC Classes  ?

  • G01N 27/18 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature caused by changes in the thermal conductivity of a surrounding material to be tested
  • G01K 7/22 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor
  • G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
  • H05B 3/20 - Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater

90.

SYSTEMS AND METHODS FOR CAPTURING STABILIZED IMAGES

      
Application Number US2022051110
Publication Number 2023/113991
Status In Force
Filing Date 2022-11-28
Publication Date 2023-06-22
Owner INVENSENSE, INC. (USA)
Inventor
  • Riccardi, Sebastien
  • Grenet, Pierre
  • Lachaux, Jerome

Abstract

Systems and methods are disclosed for capturing stabilized images. Motion of the mobile device is determined so that the relative position of the lens and image sensor may be adjusted to compensate for unintended motion. The relative position of the lens and image sensor may be periodically reset in response to a synchronization signal in between capturing images.

IPC Classes  ?

  • H04N 23/68 - Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations

91.

Constant charge or capacitance for capacitive micro-electrical-mechanical system sensors

      
Application Number 18066802
Grant Number 12286342
Status In Force
Filing Date 2022-12-15
First Publication Date 2023-06-22
Grant Date 2025-04-29
Owner INVENSENSE, INC. (USA)
Inventor Seeger, Joseph

Abstract

Embodiments for constant charge or capacitance for capacitive micro-electro-mechanical system (MEMS) sensors are presented herein. A MEMS device comprises a sense element circuit comprising a bias resistance, a charge-pump, and a capacitive sense element comprising an electrode and a sense capacitance. The charge-pump generates, at a bias resistor electrically coupled to the electrode, a bias voltage that is inversely proportional to a capacitance value comprising a value of the sense capacitance to facilitate maintenance of a nominally constant charge on the electrode. A sensing circuit comprises an alternating current (AC) signal source that generates an AC signal at a defined frequency; and generates, based on the AC signal, an AC test voltage at a test capacitance that is electrically coupled to the electrode. The sense element circuit generates, based on the AC test voltage at the defined frequency, an output signal representing the value of the sense capacitance.

IPC Classes  ?

  • B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
  • H02M 3/07 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode

92.

Microelectromechanical system microphone array capsule

      
Application Number 18063374
Grant Number 12192704
Status In Force
Filing Date 2022-12-08
First Publication Date 2023-06-15
Grant Date 2025-01-07
Owner INVENSENSE, INC. (USA)
Inventor Parker, Jeremy

Abstract

The present invention relates to a microelectromechanical system (MEMS) microphone array capsule. In one embodiment, a MEMS microphone includes a MEMS microphone die; an acoustic sensor array formed into the MEMS microphone die, the acoustic sensor array comprising a plurality of MEMS acoustic sensor elements, wherein respective ones of the plurality of MEMS acoustic sensor elements are tuned to different resonant frequencies; and an interconnect that electrically couples the acoustic sensor array to an impedance converter circuit.

IPC Classes  ?

93.

ROBUST INERTIAL SENSOR SELF-TEST

      
Application Number US2022046594
Publication Number 2023/107195
Status In Force
Filing Date 2022-10-13
Publication Date 2023-06-15
Owner INVENSENSE, INC. (USA)
Inventor Pellegrini, Aurelio

Abstract

An inertial sensor such as a MEMS accelerometer or gyroscope has a proof mass that is driven by a self-test signal, with the response of the proof mass to the self-test signal being used to determine whether the sensor is within specification. The self-test signal is provided as a non-periodic self-test pattern that does not correlate with noise such as environmental vibrations that are also experienced by the proof mass during the self-test procedure. The sense output signal corresponding to the proof mass is correlated with the non-periodic self-test signal, such that an output correlation value corresponds only to the proof mass response to the applied self-test signal.

IPC Classes  ?

  • G01C 19/5776 - Signal processing not specific to any of the devices covered by groups
  • G01C 25/00 - Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
  • G01P 21/00 - Testing or calibrating of apparatus or devices covered by the other groups of this subclass

94.

Robust inertial sensor self-test

      
Application Number 17546928
Grant Number 12227409
Status In Force
Filing Date 2021-12-09
First Publication Date 2023-06-15
Grant Date 2025-02-18
Owner InvenSense, Inc. (USA)
Inventor Pellegrini, Aurelio

Abstract

An inertial sensor such as a MEMS accelerometer or gyroscope has a proof mass that is driven by a self-test signal, with the response of the proof mass to the self-test signal being used to determine whether the sensor is within specification. The self-test signal is provided as a non-periodic self-test pattern that does not correlate with noise such as environmental vibrations that are also experienced by the proof mass during the self-test procedure. The sense output signal corresponding to the proof mass is correlated with the non-periodic self-test signal, such that an output correlation value corresponds only to the proof mass response to the applied self-test signal.

IPC Classes  ?

  • B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
  • G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values

95.

HW programmable signal path event-based DSP for sensor mixed signal devices

      
Application Number 17537305
Grant Number 11928507
Status In Force
Filing Date 2021-11-29
First Publication Date 2023-06-01
Grant Date 2024-03-12
Owner InvenSense, Inc. (USA)
Inventor
  • Scorrano, Matteo
  • Giorgetti, Daniele

Abstract

A hardware-programmable digital signal path component for processing events from sensor mixed signal devices. A system includes a mixed signal component and a reconfigurable signal path component. The mixed signal component includes a group of sensor devices and generates one or more events from among the group of sensor devices. The signal path component receives the event(s), and includes a control unit component and a digital signal processor (DSP) component. The control unit component includes a programmable function enable mechanism, and distributes the received event(s) in combination with one or more functions among a set of predefined functions enabled by the programmable function enable mechanism. The DSP component is configured to perform one or more operations associated with the distributed event(s) in accordance with the enabled function(s).

IPC Classes  ?

  • G06F 9/50 - Allocation of resources, e.g. of the central processing unit [CPU]
  • G06F 9/48 - Program initiatingProgram switching, e.g. by interrupt

96.

4-points phase and sensitivity estimation algorithm and related architecture

      
Application Number 17986598
Grant Number 12270652
Status In Force
Filing Date 2022-11-14
First Publication Date 2023-05-25
Grant Date 2025-04-08
Owner InvenSense, Inc. (USA)
Inventor
  • Avantaggiati, Vito
  • Pinna, Carlo
  • Mazzarella, Federico

Abstract

d). The in-phase and quadrature components are also compensated for phase and/or gain offset by system components.

IPC Classes  ?

  • G01C 19/5649 - Signal processing
  • G01C 19/5656 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams the devices involving a micromechanical structure
  • G01C 19/5776 - Signal processing not specific to any of the devices covered by groups
  • G01C 25/00 - Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass

97.

Ultrasonic cliff detection and depth estimation using tilted sensors

      
Application Number 17987304
Grant Number 12265186
Status In Force
Filing Date 2022-11-15
First Publication Date 2023-05-18
Grant Date 2025-04-01
Owner InvenSense, Inc. (USA)
Inventor
  • Hall, Daniela
  • Lei, Tony
  • Li, Zhongyang
  • Youssef, Joe

Abstract

A robotic cleaning appliance includes a housing to which is coupled a surface treatment item and a sensor assembly with first and second transducers and an acoustic interface. The first sonic transducer transmits sonic signals through an acoustic interface and out of a first acoustic opening toward a surface beneath the robotic cleaning appliance. The sonic signals reflect from the surface as corresponding returned signals received by the second sonic transducer via a second acoustic opening port of the acoustic interface. A first annular ring is defined around the first acoustic opening port and a second annular rings is defined around the second acoustic opening port. The annular ring attenuate direct path echoes between the acoustic opening ports. The first and second acoustic opening ports are coupled the first and sonic transducers, respectively, via first and second horns; and the horns are tilted from orthogonal with the surface.

IPC Classes  ?

  • G01S 7/521 - Constructional features
  • B06B 1/02 - Processes or apparatus for generating mechanical vibrations of infrasonic, sonic or ultrasonic frequency making use of electrical energy
  • G01S 15/931 - Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles

98.

ULTRASONIC DIRECT ECHO PATH REDUCTION

      
Application Number 17987151
Status Pending
Filing Date 2022-11-15
First Publication Date 2023-05-18
Owner InvenSense, Inc. (USA)
Inventor
  • Lei, Tony
  • Youssef, Joe
  • Hall, Daniela
  • Eovino, Ben
  • Shelton, Stefon

Abstract

A robotic cleaning appliance includes a housing to which is coupled a surface treatment item and a sensor assembly with first and second transducers and an acoustic interface. The first sonic transducer transmits sonic signals through an acoustic interface and out of a first acoustic opening toward a surface beneath the robotic cleaning appliance. The sonic signals reflect from the surface as corresponding returned signals received by the second sonic transducer via a second acoustic opening port of the acoustic interface. A first plurality of annular rings is defined in the external surface around the first acoustic opening port and a second plurality of annular rings is defined in the external surface around the second acoustic opening port. The pluralities of annular rings attenuate direct path echoes from a subset of the transmitted sonic signals which attempt to travel across the external surface to the second acoustic opening port.

IPC Classes  ?

  • G01S 7/521 - Constructional features
  • G05D 1/02 - Control of position or course in two dimensions
  • G01S 15/931 - Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles
  • G01S 15/08 - Systems for measuring distance only

99.

Inertial sensor sensing of vibration frequency

      
Application Number 17530125
Grant Number 11879906
Status In Force
Filing Date 2021-11-18
First Publication Date 2023-05-18
Grant Date 2024-01-23
Owner InvenSense, Inc. (USA)
Inventor Pellegrini, Aurelio

Abstract

A modified version of a MEMS self-test procedure is presented that can be used to detect the amplitude and frequency of an external vibration from an ambient environment. The method implements processing circuitry that correlates an output sense signal, s(t), with a plurality of periodic signal portions and a plurality of shifted periodic signal portions to generate a plurality of correlation values. A frequency associated with the external vibration is determined based on the plurality of correlation values.

IPC Classes  ?

  • G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
  • G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
  • G01P 1/00 - Details of instruments
  • G01D 1/08 - Measuring arrangements giving results other than momentary value of variable, of general application giving integrated values by intermittent summation over fixed periods of time
  • G01H 1/14 - Frequency
  • G01D 1/02 - Measuring arrangements giving results other than momentary value of variable, of general application giving mean values, e.g. root mean square values
  • G01D 1/16 - Measuring arrangements giving results other than momentary value of variable, of general application giving a value which is a function of two or more values, e.g. product or ratio

100.

SMARTAUTOMOTIVE

      
Serial Number 97932102
Status Registered
Filing Date 2023-05-11
Registration Date 2024-07-23
Owner InvenSense, Inc. ()
NICE Classes  ? 09 - Scientific and electric apparatus and instruments

Goods & Services

Inertial measurement unit; motion sensors; accelerometers; gyroscopes; magnetometers; pressure sensors; temperature sensors; ultrasonic sensors for measuring acceleration, angle of rotation, pressure, temperature, and distance ranges, all for use in automotive systems, autonomous car systems, advanced driver assisted systems, internet of things applications, and internet of things software development systems; measuring equipment sensors comprising an inertial measurement unit, and high-precision algorithms, all for use in sensor fusion for automotive systems, autonomous car systems, advanced driver assisted systems, internet of things applications, and internet of things software development systems; sensor development kits, namely, kits comprised primarily of computer hardware and downloadable software for use in developing and operating sensors and electronic devices for detecting, transmitting, recognizing, analyzing, and tracking motion, movement, positions, distances, and obstacles; downloadable computer software for integrating drivers for multi-sensor modules for automotive systems, autonomous car systems, advanced driver assisted systems, internet of things software development systems, and internet of things applications
  1     2     3     ...     11        Next Page