05 - Pharmaceutical, veterinary and sanitary products
Goods & Services
Odor neutralizing preparations for general use on various surfaces; Odor neutralizing preparations for use on shoes; Odor neutralizing sprays for shoes; Odor neutralizing wipes for shoes; Shoe deodorizers
2.
Gas leakage prevention cooling box for pipe flange connection and gas leakage sensing system
Disclosed is a gas leakage prevention cooling box for a pipe flange connection, which includes: a main body casing having an inner chamber in which connection flanges of a first pipe and a second pipe are located at a center portion of the main body casing, a pipe mounting hole in which the pipes connected around the flange are located on front and rear sides of the inner chamber, and a first half main body and a second half main body coupled to face to each other with the connection flanges of the first and second pipes therebetween and supported by the connection between the first pipe and the second pipe; and a cooling fan installed in the first half main body of the main body casing and configured to supply external air to the inner chamber.
Disclosed is a gas collection apparatus used in manufacturing a semiconductor. The apparatus includes: a housing having a chamber formed therein; a heating member installed in the housing to heat cobalt-carbon gas introduced into the chamber; a cobalt deposition member installed across the chamber of the housing to deposit cobalt composite; and a cooling member that induces carbon composite to be solidified and deposited while rapidly cooling the carbon composite.
B01D 53/00 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols
B01D 53/34 - Chemical or biological purification of waste gases
Disclosed is a by-product collection apparatus which collects a by-product generated during a manufacturing process of manufacturing a semiconductor or a semiconductor-like product. The apparatus includes: a by-product collection module connected to a pipeline in series and configured to collect a by-product from a by-product gas, wherein the by-product gas flows in the pipeline having an inlet pipe and an outlet pipe provided at upper and lower portions of a first casing; and a cooling water supply module including a cooling water tank and a cooling water pump in a second casing and configured to supply and recover cooling water to and from the by-product collection module through a cooling pipe.
B01D 53/22 - Separation of gases or vapoursRecovering vapours of volatile solvents from gasesChemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases or aerosols by diffusion
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
5.
BYPRODUCT COLLECTION DEVICE INTEGRATED WITH COOLING WATER CIRCULATION SYSTEM
The present invention relates to a byproduct collection device capable of collecting byproducts generated during a manufacturing process of manufacturing semiconductors or semiconductor-like products, and to a byproduct collection device comprising: a byproduct collection module serially connected, by means of an inflow pipe and an outflow pipe respectively provided at the top and bottom of a first casing, to a pipe in which a byproduct gas flows, so as to collect byproducts from the byproduct gas; and a cooling water supply module including, in a second casing, a cooling water tank and a cooling water pump so as to supply the cooling water to the byproduct collection module through a cooling pipe and recover same.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/205 - Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using reduction or decomposition of a gaseous compound yielding a solid condensate, i.e. chemical deposition
6.
Triple pipe heating device of easy installation for heating exhaust gas in semiconductor and LCD manufacturing process
The present invention relates to a triple pipe heating device for heating an exhaust gas in a semiconductor and LCD manufacturing process, which has a triple pipe structure capable of effectively heating an exhaust gas with only a small amount of heat without using nitrogen gas, is expandable and bendable so as to be easily installed, and is capable of quickly detecting exhaust gas leakage and overheating.
F16L 53/38 - Ohmic-resistance heating using elongate electric heating elements, e.g. wires or ribbons
F16L 9/18 - Double-walled pipesMulti-channel pipes or pipe assemblies
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
7.
TRIPLE PIPE HEATING DEVICE OF EASY INSTALLATION FOR HEATING EXHAUST GAS IN SEMICONDUCTOR AND LCD MANUFACTURING PROCESS
The present invention relates to a triple pipe heating device for heating an exhaust gas in a semiconductor and LCD manufacturing process, which has a triple pipe structure capable of effectively heating an exhaust gas with only a small amount of heat without using nitrogen gas, is expandable and bendable so as to be easily installed, and is capable of quickly detecting exhaust gas leakage and overheating.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
F16L 53/38 - Ohmic-resistance heating using elongate electric heating elements, e.g. wires or ribbons
8.
Energy-saving silencer assembly, a semiconductor manufacturing vacuum pump with same and method for heating nitrogen gas
The disclosure relates to an energy-saving silencer assembly, which includes: a silencer connected to a discharge side of a pump section, which pumps reaction by-product gas into a vacuum pump, so as to pass the pumped reaction by-product gas from a rear end portion to a front end portion; an outer pipe surrounding the outer peripheral surface of the silencer at an interval so as to provide a heating space between the silencer and the outer pipe; a nitrogen gas supply section for supplying nitrogen gas to the heating space; and a nitrogen gas injection section for injecting heated nitrogen gas to the inside of the silencer by the contact with the outer peripheral surface of the silencer in the heating space.
F04B 39/00 - Component parts, details, or accessories, of pumps or pumping systems specially adapted for elastic fluids, not otherwise provided for in, or of interest apart from, groups
F24H 3/12 - Air heaters with additional heating arrangements
F01N 5/02 - Exhaust or silencing apparatus combined or associated with devices profiting by exhaust energy the devices using heat
F28D 7/02 - Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being helically coiled
F04D 19/04 - Multi-stage pumps specially adapted to the production of a high vacuum, e.g. molecular pumps
F04D 29/66 - Combating cavitation, whirls, noise, vibration, or the likeBalancing
F28D 7/10 - Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being arranged one within the other, e.g. concentrically
An exhaust pressure measuring device including a connection pipe connected to a middle of an exhaust line for carrying byproduct gas, the connection pipe having an opening formed in a middle of a body thereof; a chamber provided at an outer side of the connection pipe and communicating with an inside of the connection pipe through the opening, the chamber having a nitrogen supply line connected thereto, the nitrogen supply line allowing nitrogen gas to be supplied from the outside; and a pressure sensor installed to the chamber to measure pressure in the chamber, whereby a change of exhaust pressure in the exhaust line is measured from the measured pressure in the chamber.
The present invention pertains to an energy-saving silencer assembly, a semiconductor manufacturing vacuum pump with the same and a method for heating nitrogen gas. Nitrogen gas is heated using the high temperature of the surface of a silencer and supplied to the inside of the silencer so as to resolve blockage problems due to the solidification of reaction by-products while saving energy costs due to the use of additional heat sources. The energy-saving silencer assembly in the present invention as above includes: a silencer connected to a discharge side of a pump section, which pumps reaction by-product gas into a vacuum pump, so as to pass the pumped reaction by-product gas from a rear end portion to a front end portion; an outer pipe surrounding the outer peripheral surface of the silencer at an interval so as to provide a heating space between the silencer and the outer pipe; a nitrogen gas supply section for supplying nitrogen gas to the heating space; and a nitrogen gas injection section for injecting heated nitrogen gas to the inside of the silencer by the contact with the outer peripheral surface of the silencer in the heating space.
