The invention relates to a method for producing a zonal optical coating (24) on a substrate (10), in particular an optical surface (10.1) of the substrate (10), the method comprising: - providing (110) a substrate (10) which is non-planar on at least one side and has an optical coating (20); - applying (120) a mask (30) to the optical coating (20) in order to obtain a masked substrate (11), wherein the mask (30) covers the optical coating (20) in a masked region (21) and does not cover it in an unmasked region (22); - etching (130) the masked substrate (11) in order to at least partially remove the optical coating (20) depending on the unmasked region (22), whereby a masked zonal coating (23) is produced; - removing (140) the mask from the masked zonal coating (23) in order to obtain a zonal optical coating (24).
G02B 7/04 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
G02B 27/64 - Imaging systems using optical elements for stabilisation of the lateral and angular position of the image
3.
SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A SEMICONDUCTOR MODULE
The invention relates to a semiconductor module (100) having the following features: - an integrated semiconductor circuit (105) which can be or is electrically contacted via at least one connection region (145, 145a); - a circuit board (120) having at least one electronic component (125) which can be or is electrically contacted via at least one circuit board connection region (140, 140a); and - a bridging element (110) having at least one electrical bridging line (115, 115a), wherein the bridging line (115, 115a) can be or is contacted with the connection region (145, 145a) of the integrated semiconductor circuit (105) by means of a first contact element (150, 150a) and can be or is contacted with the circuit board connection region (140, 140a) by means of a second contact element (155, 155a). The invention also relates to a production method.
The invention relates to a method (100) for producing a laser diode module, to a multilayer substrate (40) for use in a method (100) for producing a laser diode module (1), and to a laser composite (10) for use in a method (100) for producing a laser diode module (1).
The approach presented here develops a test arrangement (100) for testing at least one optical component (120), wherein the test arrangement (100) comprises a coupling module (105) for transmitting and/or receiving a light ray (110) and/or a light beam to/from the optical component (120) to be tested and the optical component (120) to be tested, the latter comprising a grating coupler (115) having an irregular grating structure (150).
The invention relates to a recording device (10) for generating a 3-D recording of a three-dimensional object (11), comprising a light source (13) for generating a light beam (14) in a pattern plane (15), a first beam splitter (16) for separating off an illumination beam (17) from the light beam (14) and for separating off a recording beam (18) from an observation beam (19) reflected back off the object (11), a chromatic element (24) for focusing the illumination beam (17) that was separated off by the first beam splitter (16) onto the multiple projection planes (12), a second beam splitter (25) for splitting the recording beam (18) into a first recording beam component (26) and a second recording beam component (27), a capturing unit (31) having a first matrix sensor (36) and a second matrix sensor (38), and a calculation unit (40) for generating a 3-D recording of the three-dimensional object (11).
G01B 11/25 - Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. moiré fringes, on the object
The invention relates to a multispectral light source (10) for producing an output radiation (12), said multispectral light source comprising: - a first light source (14), wherein a first light beam (16) having a first wavelength (λ1) can be emitted from the first light source (14), - a second light source (18), wherein a second light beam (20) having a second wavelength (λ2) can be emitted from the second light source (18), - a third light source (22), wherein a third light beam (24), which has a wavelength range of λ3min to λ3max, can be emitted from the third light source (22), wherein the first light source (14), the second light source (18), and the third light source (22) are arranged at a distance from one another, - at least one first dichroic mirror (32) for combining the first light beam (16) and the second light beam (20) into a fourth light beam (76), wherein the first dichroic mirror (32) is designed to reflect the second light beam (20) and transmit the first light beam (16), and wherein the first dichroic mirror (32) is arranged in such a way that the second light beam (20) can be reflected by the first dichroic mirror (32) and the first light beam (16) can be transmitted by the first dichroic mirror (32), and - a beam splitter (34) positioned downstream of the first dichroic mirror (32), wherein the beam splitter (34) is designed to divide the fourth light beam (76), formed from the first light beam (16) and the second light beam (20), into a first power component (36) and a second power component (37), and to divide the third light beam (24) into a third power component (38) and a fourth power component (39), wherein the first power component (36) can be superimposed on the fourth power component (39) by the beam splitter (34) in order to form the output radiation (12), and the second power component (37), together with the third power component (38), can be output as a residual radiation (86) or an additional output radiation (86).
F21K 9/64 - Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
8.
METHOD AND CARRIER SUBSTRATE FOR PRODUCING A COMPONENT COMPRISING ALUMINUM NITRIDE
The invention relates to a method (600) for producing a semiconductor component (100) with at least one exposed membrane portion, wherein the method (600) comprises the following steps: - providing (610) a semiconductor material (102) having a carrier substrate (104) provided with a passivation layer (108); - applying a membrane layer (110) to the passivation layer (108), the membrane layer (110) being formed from an aluminum nitride material in which a ratio of aluminum to nitrogen is within a range between 1.05 to 1.4; - applying a protective layer (114) to the membrane layer (110), the membrane layer (110), on a side opposite the passivation layer (108), being covered by the protective layer (114); - removing (620) a part of the carrier substrate (104) using a wet-chemical process, in order to obtain a region (130) of the passivation layer (108) that is devoid of the substrate; and - exposing (630) a section of the membrane layer (110) in the region (130) that is devoid of the substrate by means of a first dry etching step for etching the passivation layer and a second dry etching step for etching the protective layer, in order to obtain the exposed membrane section (140).
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
G03F 1/62 - Pellicles or pellicle assemblies, e.g. having membrane on support framePreparation thereof
H02N 2/18 - Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing electrical output from mechanical input, e.g. generators
A method for testing optoelectronic chips that are arranged on a wafer and comprise electric interfaces in the form of contact pads and optical interfaces, which are arranged in a fixed manner relative to the electric interfaces, in the form of optical deflecting elements, e.g. grating couplers, at a specified coupling angle. In the process, the wafer is adjusted in three adjustment steps in such a manner that one of the chips is positioned relative to a contacting module such that the electric interfaces of the chip and the contacting module are in contact with one another and the optical interfaces of the chip and the contacting module assume a maximum position of the optical coupling.
The invention relates to a separating-joining device (10) for separating and joining a carrier body (11) and for discharging (140) a carrier body section (20), comprising: a guide unit (13) for guiding the carrier body (11) and/or a carrier body section along a transport path (TP) between a first drivable conveying unit (14) and a second drivable conveying unit (15), at least one separating unit (16) arranged along the transport path (TP) for thermally separating the carrier body (11) into at least one first carrier body section (17) and a remaining carrier body section (18), wherein the remaining carrier body section (18) has a second carrier body section (20) and a third carrier body section (21) which can be separated from the second carrier body section (20), and a joining unit (23) for thermally joining (160) the first carrier body section (17) and the third carrier body section (21) at a joining interface (24), and at least one discharge unit (25) for discharging (140) the second carrier body section (20) of the remaining carrier body section (18) in a discharge outlet (26), wherein the discharge unit (25) has a diverter (27).
B21D 39/03 - Application of procedures in order to connect objects or parts, e.g. coating with sheet metal otherwise than by platingTube expanders of sheet metal otherwise than by folding
B21D 43/08 - Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work by rollers
B21D 43/12 - Advancing work in relation to the stroke of the die or tool by means in mechanical engagement with the work by chains or belts
B21D 43/16 - Advancing work in relation to the stroke of the die or tool by gravity, e.g. chutes
B21D 43/18 - Advancing work in relation to the stroke of the die or tool by means in pneumatic or magnetic engagement with the work
B21D 43/28 - Associations of cutting devices therewith
B65G 15/00 - Conveyors having endless load-conveying surfaces, i.e. belts and like continuous members, to which tractive effort is transmitted by means other than endless driving elements of similar configuration
11.
OPTICAL DEVICE AND METHOD FOR PRODUCING AN OPTICAL DEVICE
An optical module for modifying a light beam, wherein the optical module is made of a single-piece solid body material and has a passage surface for receiving the light beam. Furthermore, the optical module comprises a beam deflecting region lying opposite the passage surface for deflecting the light beam, wherein the beam deflecting region is designed as a curved region on the exterior of the optical module, in particular so as to have a hollow mirror function, a pass-through surface for outputting the light beam deflected by the beam deflecting region and a beam shaping region that is designed to shape the light beam and additionally or alternatively thereto the deflected light beam such that the light beam has a beam profile a with homogeneous intensity distribution over a specified range.
A method of integrally bonding a glass element to a support element, the method comprising a step of inserting at least one contact element into a contact recess in a surface of the support element. In addition, the method comprises a step of placing the glass element on a portion of the contact element which portion protrudes beyond the surface, and a step of locally heating the contact element in order to connect the glass element to the carrier element via the contact element. The method also comprises a step of coating at least a part of the contact recess with a separating layer prior to the step of insertion.
C03C 27/00 - Joining pieces of glass to pieces of other inorganic materialJoining glass to glass other than by fusing
G01B 11/03 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness by measuring coordinates of points
13.
ELECTROMECHANICAL SHUTTER DEVICE FOR A THERMAL IMAGING CAMERA WITH A ROCKER AS SHUTTER BLADE
The invention relates to an electromechanical shutter device for a thermal imaging camera, comprising a carrier (2) having an opening (21) with a fixed electric motor (3) having a motor shaft (31) and a shutter blade (51) assigned to the opening (21), which forms a rocker (5) with a shaft (52), wherein the rocker (5) is mounted on a first rotation axis (53) arranged parallel to the motor shaft (31) on the carrier (2), is pivotable about the first axis of rotation (53) over a pivot angle range by means of a crank with a pin (4), and has an elongated hole (521) in the shaft (52) located opposite the shutter blade (51), with which the pin (4) is engaged, wherein a first spur gear (6) is attached to the motor shaft (31), the crank is formed by a second spur gear (7), the second spur gear (7) is mounted on a second axis of rotation (8) arranged parallel to the motor shaft (31) in the carrier (2), is rotatable over a defined rotation angle range and meshes with the first spur gear (6).
G03B 9/26 - Blade or disc rotating or pivoting about axis normal to its plane incorporating cover blade or blades
G03B 9/10 - Blade or disc rotating or pivoting about axis normal to its plane
G02B 23/12 - Telescopes, e.g. binocularsPeriscopesInstruments for viewing the inside of hollow bodiesViewfindersOptical aiming or sighting devices with means for image conversion or intensification
H04N 23/23 - Cameras or camera modules comprising electronic image sensorsControl thereof for generating image signals from infrared radiation only from thermal infrared radiation
14.
METHOD OF PRODUCING AN ETCHING MASK, METHOD OF ETCHING A STRUCTURE INTO A SUBSTRATE, USE OF A TETREL LAYER AND STRUCTURE FOR PRODUCING A MASK
A method of producing an etching mask. A substrate is provided, a metal layer is applied, the metal layer comprises or is formed from at least one transition metal and/or aluminum. A masking layer is applied and the masking layer is structured. The metal layer is exposed in at least one processing region. The substrate is coated with a tetrel layer including at least partially a tetrel, wherein an interdiffusion zone between the transition metal or aluminum and the tetrel is formed in the processing region at an interface between the metal layer and the tetrel layer. The masking layer is removed and the metal layer s selectively etched. The substrate is exposed in at least one etching region other than the processing region, and the metal layer is at least partially maintained in the processing region.
A contacting module and to a method for assembling a contacting module. The contacting module includes: an optical module which contains an optical block made of glass, which optical block has an arrangement of optical interfaces (Sopt) in an optical interface plane (Eopt); and an electronic module, which has an arrangement of electrical interfaces (Sele) in an electrical interface plane (Eele). The optical module and the electronic module are arranged relative to each other such that the arrangement of optical interfaces (Sopt) and the arrangement of electrical interfaces (Sele) have a defined alignment position relative to each other. The optical module contains a mounting plate which is connected to the electronic module by means of a repeatedly releasable, reproducible connection.
A camera shutter device having a shutter blade which moves abruptly between a first position, in which it covers a transmission zone present between the carriers, and a second position, in which it opens up the transmission zone. On the shutter blade, there is provided a slide body which includes a displaceable permanent magnet and which is guided on a linear guide, the ends of which are assigned a respective rotatable permanent magnet. By oppositely changing the polarization direction of the rotatable permanent magnets through 180°, the displaceable permanent magnet is pulled into the first or second position.
The invention relates to a device (10) for at least partial reflection of electromagnetic radiation, comprising at least one base element (11), with a coating (13) being arranged in at least portions of at least one surface (12) of the base element (11), the coating (13) comprising at least one layer (H1) of a first highly refractive material and at least one layer (H2) of a second highly refractive material.
A lens mount (100) comprises an outer ring (105), an inner ring (110) and at least one connecting piece (115). The inner ring (110) is designed to accommodate a lens. The outer ring (105) and the inner ring (110) are connected to one another via the at least one connecting piece (115). The connecting piece (115) forms a first portion having a first length, a second portion having a second length and an intermediate portion having an intermediate length. The intermediate portion is arranged between the first portion and the second portion. The first portion is connected to the inner ring (110). The second portion is connected to the outer ring (105). In this case, a shape of a cross section of the intermediate portion in an intermediate sectional plane differs from a shape of a first cross section of the first portion in a first sectional plane and from a shape of a second cross section of the second portion in a second sectional plane.
An optical test device for testing flat test objects comprises a holder for the test object and two optical sensors for detecting the three-dimensional surface topography of the test object. According to the invention, the holder is formed at least in sections as a test standard and is disposed with respect to the sensors in such a way that the sensors scan the test object from opposite sides and also detect the holder as a test standard at least in sections during the detecting of the test object.
The approach presented here provides a method (200) for producing a component (105) comprising at least one membrane layer (145), the method (200) comprising a step of providing (210) a carrier material (115). Furthermore, the method (200) comprises a step of applying (220) a membrane layer (145) to the carrier material (115), the membrane layer (145) comprising an aluminum nitride material in which an aluminum to nitrogen ratio is in the range of greater than 1 to 1.4 in order to produce the component (105).
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
21.
CONDENSER UNIT FOR PROVIDING DIRECTED LIGHTING OF AN OBJECT TO BE MEASURED POSITIONED IN A MEASURED OBJECT POSITION, IMAGING DEVICE AND METHOD FOR RECORDING A SILHOUETTE CONTOUR OF AT LEAST ONE OBJECT TO BE MEASURED IN A MEASURING FIELD USING AN IMAGING DEVICE AND USE OF AN ATTENUATION ELEMENT
A condenser unit for providing directed lighting of an object to be measured positioned in a measured object position, wherein the condenser unit comprises a light source for emitting a light beam and an optical element having a positive refractive power. The condenser unit further comprises at least one attenuation element arranged in a common optical axis with the light source and the optical element, which attenuation element comprises a location-dependent light intensity attenuation effect for the light beam incident on the attenuation element, more particularly wherein the light intensity attenuation effect declines from the optical axis towards an edge of the attenuation element.
The invention relates to a method (600) for producing a semiconductor component (100) with at least one exposed membrane layer, wherein the method (600) comprises the following steps: Providing (610) a semiconductor material (102) having a carrier substrate (104) provided with a passivation layer (108), wherein a membrane layer (110) is arranged on the passivation layer (108), having a material or consisting of a material that can be changed in terms of its structure and/or composition by water, in particular hydrolysable, wherein the membrane layer (110) is covered by a protective layer (114) on a side opposite the passivation layer (108); removing (620) a part of the carrier substrate (104) using a wet-chemical process, in order to obtain an exposed region of the passivation layer (108) in a structured region (130) of the semiconductor material (102); and exposing (630) a section of the membrane layer (110) in the structured region (130) by means of a first dry etching step for etching the passivation layer and a second dry etching step for etching the protective layer, in order to obtain the exposed membrane section (140).
The invention relates to a separating-joining device (100). The separating-joining device (100) is designed to sort out a defective component (X) from components (1) arranged in a row on a support body (10), wherein the separating-joining device (100) comprises: - a thermal cutting unit (20) for thermally separating the support body (10), - at least one welding unit (40) for thermally joining the support body (10), - a cutting control unit (30), said cutting control unit (30) being designed to automatically control the thermal cutting unit (20) such that the support body (10) is thermally separated at at least two ascertainable cutting interfaces (14, 15) of the support body (10) by means of a beam (21) of the cutting unit (20), - at least one conveyor unit (70) for arranging the two cutting interfaces (14, 15) of the two remaining parts (11, 12) of the support body (10) next to each other in order to form a joining interface (16), and - a welding control unit (50), wherein the welding control unit (50) is designed to automatically control the welding unit (40) such that the two remaining parts (11, 12) of the support body (10) are joined at the joining interface (16) by means of a beam (41) of the welding unit (40).
B23K 26/38 - Removing material by boring or cutting
B23K 37/047 - Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work moving work to adjust its position between soldering, welding or cutting steps
24.
Semiconductor device and method for producing a substrate for a semiconductor component, and use of indium during production of same
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01L 29/04 - Semiconductor bodies characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
H01L 29/207 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds further characterised by the doping material
25.
ILLUMINATION FOR A MICROSCOPE, MICROSCOPE HAVING DARK-FIELD ILLUMINATION, USE FOR EXAMINING BLOOD, AND METHOD FOR ILLUMINATING A SAMPLE
The invention relates to: an illumination device for microscopic illumination, in particular for dark-field illumination; a microscope having this kind of illumination device; a use for examining blood; and a method for illuminating a sample. For this purpose, light emitting diodes arranged in a cone shape are provided which irradiate onto a condenser body.
A contacting module and a method for assembling a contacting module with an optical module, containing an optical block made of glass, and with an electronics module, the optical block being connected via an adhesive connection to the electronics module or the optical module having a mounting plate, which is mounted on the electronics module so as to be repeatedly releasable therefrom and is connected to the optical block via an adhesive connection. The adhesive connection is produced via at least three cylinder pins, which each have a first end face bearing against the optical block by an adhesive and are glued in through-bores in the carrier plate or the mounting plate.
A camera shutter device including an optical opening and an electromagnetic drive mounted fixedly relative to the opening, and having a linearly guided, movable part which is fixedly connected to a first shutter blade to form one unit. The unit is connected to a drive end of a two-armed lever which is rotatable about an axis of rotation. A counterweight is provided at an output end of the lever. A second weight force acting on the counterweight causes a second torque about the axis of rotation of the lever, which counteracts a first torque which is caused by a first weight force acting on the unit.
The invention relates to a method for producing an optical apparatus (200). The method comprises a step of providing a substrate (210) on whose first main surface (212) a plurality of emission devices (220) for emitting electromagnetic radiation (250, 255) are arranged. The substrate (210) is designed as a light-emitting diode wafer and/or formed from sapphire or gallium nitride and is transparent at least for one emission wavelength of the radiation (250, 255) emitted by the emission devices (220), The method also comprises a step of applying an absorption material (230) on the side of the first main surface (212) of the substrate (210). The absorption material (230) has a photostructurable resist that absorbs at least the emission wavelength. The method further comprises a step of processing the absorbing material (230) in order to lay bare at least one emission surface (227) of each emission device (220). In this case, a position determination of surfaces to be laid bare is carried out from a second main surface (214) of the substrate (210) opposite the first main surface (212). In addition, the method comprises a step of singulating the substrate (210) into a plurality of optical apparatuses (200) by means of a separating manufacturing process, wherein each optical apparatus (200) has at least one emission device (220).
H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
H01L 33/44 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
29.
METHOD FOR PRODUCING A DIODE LASER, AND DIODE LASER
The invention relates to a method for producing a diode laser having a laser bar (3), wherein a metallic layer (24) is used which has a nub structure with raised places (26) and which is located between the n-side (10) of the laser bar and the cover (15). The cavities (28) in the nub structure are subsequently filled, by means of at least one filler channel (17), with a filler (29) which is cured. The diode laser according to the invention can be reliably operated in pulsed mode.
A hybrid fixed focal length lens that includes five lens elements and a diaphragm for a LIDAR measurement system. Some of the lens elements have surfaces that are aspherical.
G02B 9/60 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having five components only
G01S 7/481 - Constructional features, e.g. arrangements of optical elements
G01S 7/4915 - Time delay measurement, e.g. operational details for pixel componentsPhase measurement
G02B 13/00 - Optical objectives specially designed for the purposes specified below
G02B 13/16 - Optical objectives specially designed for the purposes specified below for use in conjunction with image converters or intensifiers
G02B 9/34 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having four components only
G02B 13/22 - Telecentric objectives or lens systems
31.
METHOD AND DEVICE FOR GENERATING A CAMERA IMAGE OF A WELDING SEAM FOR AN IMAGE PROCESSING-SUPPORTED LASER TRANSMISSION WELDING METHOD
A method for generating a camera image from which a welding contour can be derived along which an assembly is to be welded in an image processing-supported laser transmission welding method. The transparent component of the assembly is illuminated from a side facing away from the camera. The invention also relates to a device which is suitable to carry out the method and wherein an illumination device has at least one light source, the light source being arranged in a workpiece holder in which the assembly to be welded is received in a receiving area and being directed into the receiving area.
B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
32.
Method for making a thermally stable connection between a glass element and a support element, method for producing an optical device, and optical device
The invention relates to a method for thermally stable joining of a glass element to a support element, wherein the glass element has a first coefficient of expansion and the support element has a second coefficient of expansion differing from the first coefficient of expansion. The method thus comprises a step of attaching an intermediate glass material to the support element, wherein the intermediate glass material has a third coefficient of expansion which substantially corresponds to the second coefficient of expansion. In addition, the method comprises a step of local heating of the intermediate glass material in order to join the glass element to the support element via the intermediate glass material.
The invention relates to a method for producing a semiconductor assembly, in particular connecting a semiconductor chip to a heat sink. A first metal layer consisting of Pb, Cd, In or Sn is made so thin that it is bonded by means of an opposing second metal layer consisting of another metal, for example gold, in a layer consisting of intermetallic phases. This can prevent migration of the soft metals. The brittle intermetallic layer is prevented from fracturing by a continuous pressing force.
The invention relates to an optical module (100) for modifying a light beam (110). The optical module (100) is made of a single-piece solid body material and has a passage surface (105) for receiving the light beam (110). The optical module (100) additionally comprises a beam deflecting region (115) lying opposite the passage surface (105) for deflecting the light beam (110), said beam deflecting region (115) being designed as a curved region on the exterior (120) of the optical module (100) in particular so as to have a hollow mirror function, a pass-through surface (140) for outputting the light beam (125) deflected by the beam deflecting region (115), and a beam shaping region (130) which is designed to shape the light beam (110) and additionally or alternatively thereto the deflected light beam (125) such that the light beam has a beam profile with a homogeneous intensity distribution over a specified range.
The invention relates to a method (100) for integrally bonding a glass element to a support element, the method (100) comprising a step (105) of inserting at least one contact element into a contact recess in a surface of the support element. In addition, the method (100) comprises a step (110) of placing the glass element on a portion of the contact element which portion protrudes beyond the surface, and a step (115) of locally heating the contact element in order to connect the glass element to the support element via the contact element. The method (100) also comprises a step (210) of coating at least part of the contact recess (310) with a separating layer (315) prior to the step (105) of insertion.
The invention relates to a method (100) of producing an etching mask, wherein the method (100) comprises a step (105) of providing a substrate, and a step (110) of applying a metal layer, wherein the metal layer comprises or is formed from at least one transition metal and/or aluminium, a step (115) of applying a masking layer, a step (120) of structuring the masking layer, wherein the metal layer is exposed in at least one processing region, a step (125) of coating the substrate with a tetrel layer including at least one tetrel, wherein an interdiffusion zone between the transition metal or aluminium and the tetrel is formed in the processing region at an interface between the metal layer and the tetrel layer, a step (130) of removing the masking layer, and a step (135) of selectively etching the metal layer, wherein the substrate is exposed in at least one etching region other than the processing region, and the metal layer is at least partly maintained in the processing region.
The invention relates to a method for testing optoelectronic chips (1) that are arranged on a wafer and comprise electric interfaces in the form of contact pads (1.1) and optical interfaces, which are arranged in a fixed manner relative to the electric interfaces, in the form of optical deflecting elements (1.2), e.g. grating couplers, at a specified coupling angle (α). In the process, the wafer is adjusted in three adjustment steps in such a manner that one of the chips (1) is positioned relative to a contacting module (2) such that the electric interfaces of the chip (1) and the contacting module (2) are in contact with one another and the optical interfaces of the chip (1) and the contacting module (2) assume a maximum position of the optical coupling.
The invention relates to a dome-shaped device (102) for orienting an upper element (104) relative to a lower element (106), having a connecting portion (110) for connecting the dome-shaped device (102) to a lifting arm (108) of a positioning device (100). An outer dome element (112) is connected to the connecting portion (110) and has a concave contact surface. A central dome element has a convex outer surface and a concave inner surface. The central dome element is movable relative to the outer dome element (112). A ram element movably connected to the connecting portion (110) is provided for pressing the central dome element onto the outer dome element (112). A receiving element (114) connected to the central dome element serves to receive the upper element (104). A magnet element (116) is located on the outer dome element (112) and is designed to provide a magnetic force for fixing the central dome element with respect to the outer dome element (112).
B25J 19/00 - Accessories fitted to manipulators, e.g. for monitoring, for viewingSafety devices combined with or specially adapted for use in connection with manipulators
F16M 11/14 - Means for attachment of apparatusMeans allowing adjustment of the apparatus relatively to the stand allowing pivoting in more than one direction with ball-joint
F16M 11/18 - Heads with mechanism for moving the apparatus relatively to the stand
F16M 11/20 - Undercarriages with or without wheels
F16M 11/24 - Undercarriages with or without wheels changeable in height or length of legs, also for transport only
F16C 11/06 - Ball-jointsOther joints having more than one degree of angular freedom, i.e. universal joints
The present invention relates to an apparatus (100) for capturing an optical property of a workpiece (105). The apparatus (100) has a mirror device (110), which focusses on the input side and is shaped to direct light (120) from a light source (125) to a holding area (130) for holding the workpiece (105). The apparatus (100) further has a mirror device (115), which focuses on the output side and is shaped to direct the light (120) from the holding area (130) to a capturing device (135).
The invention relates to a method for determining a time of a flank in a signal, wherein the method comprises a step of reading the signal and has a master clock rate for operating a digital evaluation unit for evaluating the time of the flank. The method also comprises a step of forming a data word representing the signal, using a deserializer of a SERDES cell, wherein the data word has a plurality of bits, and wherein a sampling clock rate is applied to the SERDES cell for sampling the signal, which sampling clock rate is higher than the master clock rate, wherein one flank or two flanks of the sampling clock rate are used for sampling the signal. Finally, the method comprises a step of determining the time of the flank in the signal using the data word and the master clock rate in the evaluation unit.
A method for the three-dimensional measurement of a setting from a great distance, and a laser scanning device suitable for this purpose. The field of view of a laser scanning device is divided into virtual receiver cells forming a row or a matrix which, in a scanning direction, are many times smaller than a measurement field within the field of view to which a laser pulse is applied. A receiver signal is formed from the portion of the laser pulse that is reflected from a measurement field and detected, and the receiver signal is digitized and allocated to each virtual receiver cell that lies in the measurement field in question. The virtual receiver cells are thus allocated multiple digitized receiver signals from which an accumulated receiver signal is formed.
G01B 11/22 - Measuring arrangements characterised by the use of optical techniques for measuring depth
43.
CONDENSER UNIT FOR PROVIDING DIRECTED LIGHTING OF AN OBJECT TO BE MEASURED POSITIONED IN A MEASURED OBJECT POSITION, IMAGING DEVICE AND METHOD FOR RECORDING A SILHOUETTE CONTOUR OF AT LEAST ONE OBJECT TO BE MEASURED IN A MEASURING FIELD USING AN IMAGING DEVICE AND USE OF AN ATTENUATION ELEMENT
The present invention relates to a condenser unit (100) for providing directed lighting of an object to be measured (110) positioned in a measured object position (001), wherein the condenser unit (100) comprises a light source (120) for emitting a light beam (105) and an optical element (125) having a positive refractive power. The condenser unit (100) further comprises at least one attenuation element (300) arranged in a common optical axis (130) with the light source (120) and the optical element (125), which attenuation element comprises a location-dependent light intensity attenuation effect for the light beam (105) incident on the attenuation element (300), more particularly wherein the light intensity attenuation effect declines from the optical axis (130) towards an edge of the attenuation element (300).
A radial force device for a contour measuring instrument for measuring a contour of a shaft-shaped workpiece which can be rotated about an axis of rotation. The radial force device has a clamping body, a force introduction roller, at least one counter-roller and a coupling device. The clamping body is shaped for fitting radially around a workpiece portion, received in the contour measuring instrument, of the workpiece. The force introduction roller is designed to apply a mechanical radial force to the workpiece in order to apply a load to the workpiece, wherein the force introduction roller is mounted in a radially movable manner on the clamping body. The counter-roller is mounted in the clamping body and designed to support the workpiece during the application of the force. The coupling device is shaped for coupling the clamping body to the contour measuring instrument.
x,yx,y (3)) of the sub-mirror (130) of the scanner (125) in order to obtain a structure marking (150) on the object (140) to be machined. The method (300) also has a step of detecting (330) at least one structure marking position (145) of a structure marking (150) on the object (140) to be machined positioned in the detection region (152) of the camera (110) of the laser-scanner device (100). During the detection step, the position of at least one sub-mirror (130) of the scanner (125) of the laser-scanner device (100) is aligned such that the structure marking (150) is imaged on a specified region (200) of the image capturing sensor (155) of the camera (110). The method (300) additionally has a step of comparing (340) the structure marking position (145) of the structure marking (150) with the reference marking position (167) and a step of calculating at least one correction value (182) for imaging the structure marking position (145) onto the reference marking position (167) if the structure marking position (145) deviates from the reference marking position (167) by more than a tolerance range (210). The correction value (182) represents a change in the aligned position of the at least one sub-mirror (130) of the scanner (125) by which the sub-mirror (130) of the scanner (125) is to be rotated in order to bring the structure marking position (145) into the tolerance range (210) about the reference marking position (167). Finally, the method (300) has a step of using (350) the at least one correction value (182) to align a light beam (120) of the laser light source (120) for structuring objects (170) to be machined in order to calibrate the laser-scanner device (100) for machining material.
The invention relates to a contacting module and a method for assembling a contacting module with an optical module (1), containing an optical block (1.1) made of glass, and with an electronics module (2), the optical block (1.2) being connected via an adhesive connection to the electronics module (2) or the optical module (1) having a mounting plate (1.2), which is mounted on the electronics module (2) so as to be repeatedly releasable therefrom and is connected to the optical block (1.1) via an adhesive connection. The adhesive connection is produced via at least three cylinder pins (5), which each bear with a first end face (5.1) against the optical block (1.1) by means of an adhesive (9) and are glued in through-bores (7) in the carrier plate (2.1) or the mounting plate (1.2).
optopteleeleopteleele) have a defined alignment position relative to each other. The optical module (1) contains a mounting plate (1.2), which is connected to the electronic module (2) by means of a repeatedly releasable, reproducible connection.
The invention relates to a method for producing an optical component consisting of at least two individual parts, which together enclose an open cavity, wherein the inner sides delimiting the cavity are coated or structured, and from which previously material has been removed in zones in the region of the free aperture, wherein said region is recoated and the individual parts are connected to one another by wringing. The wringing height is greater than the removal height plus the height of the coating. The invention also relates to optical components which are produced according to this method.
The invention relates to a method for producing an optical device (200). The method comprises a step of providing a substrate (210), on the first main surface (212) of which a plurality of emission apparatuses (220) for emitting electromagnetic radiation (250, 255) is disposed. The substrate (210) is in the form of a light-emitting diode wafer and/or is made of sapphire or gallium nitride and is transparent at least for an emission wavelength of the radiation (250, 255) emitted by the emission apparatuses (220). The method also comprises a step of applying an absorption material (230) on the side of the first main surface (212) of the substrate (210). The absorption material (230) comprises a photostructurable coating which is absorbent at least for the emission wavelength. The method also comprises a step of processing the absorption material (230) in order to expose at least one emission surface (227) of each emission apparatus (220). A determination of the position of surfaces to be exposed is carried out from a second main surface (214) of the substrate (210), which second main surface lies opposite the first main surface (212). The method also comprises a step of dividing the substrate (210) into a plurality of optical devices (200) by means of a severing production process, each optical device (200) having at least one emission apparatus (220).
H01L 33/00 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof
H01L 33/44 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
The invention relates to an athermalized device for generating laser radiation that is focused in a focal point, comprising a lens and a plastic housing and a passive adjustment system for adjusting the object distance S1. The passive adjustment device has an effective coefficient of thermal expansion (I)
.
The invention relates to a hybrid objective having a fixed focal length, which has five lenses. The objective is suitable for use in a LIDAR measurement system. Moreover, the use of a bi-aspherical plastic lens for correcting the curvature of the image field and/or astigmatism and/or distortion of an imaging objective is proposed.
G02B 9/34 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having four components only
G01S 7/481 - Constructional features, e.g. arrangements of optical elements
G02B 13/16 - Optical objectives specially designed for the purposes specified below for use in conjunction with image converters or intensifiers
G02B 13/18 - Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration
G02B 13/22 - Telecentric objectives or lens systems
A camera shutter device having a shutter blade (3.1) which moves abruptly between a first position, in which it covers a transmission zone (TZ) present between the carriers (1.1), and a second position, in which it opens up the transmission zone (TZ). On the shutter blade (3.1), there is provided a slide body (4) which comprises a displaceable permanent magnet (4.1) and which is guided on a linear guide (2.1), the ends (2.1.1) of which are assigned a respective rotatable permanent magnet (5). By oppositely changing the polarization direction (RP) of the rotatable permanent magnets (5) through 180°, the displaceable permanent magnet (4.1) is pulled into the first or second position.
G03B 11/04 - Hoods or caps for eliminating unwanted light from lenses, viewfinders, or focusing aids
56.
METHOD FOR MAKING A THERMALLY STABLE CONNECTION BETWEEN A GLASS ELEMENT AND A SUPPORT ELEMENT, METHOD FOR PRODUCING AN OPTICAL DEVICE, AND OPTICAL DEVICE
The invention relates to a method (400) for making thermally stable connection between a glass element and a support element, the glass element having a first coefficient of expansion and the support element having a second coefficient of expansion differing from the first coefficient of expansion. The method (400) comprises a step (405) of attaching an intermediate glass material on the support element, the intermediate glass material having a third coefficient of expansion which is substantially the same as the second coefficient of expansion. The method (400) also comprises a step (410) of locally heating the intermediate glass material in order to connect the glass element to the support element by means of the intermediate glass material.
C03C 27/04 - Joining glass to metal by means of an interlayer
C03C 27/00 - Joining pieces of glass to pieces of other inorganic materialJoining glass to glass other than by fusing
C04B 37/04 - Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass
C03B 23/20 - Uniting glass pieces by fusing without substantial reshaping
B32B 17/06 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance
57.
DEVICE AND METHOD FOR LUMINESCENCE ANALYSIS OF MULTIPLE SAMPLES
The invention relates to a method for generating a camera image that is used to derive a welding contour along which an assembly (1) is to be welded in an image processing-supported laser transmission welding method. The method is characterized in that the transparent component (2) of the assembly (1) is illuminated from a side facing away from the camera (5). The invention also relates to a device which is suitable for carrying out the method, an illuminating device thereof having at least one light source (6) that is arranged in a workpiece holder (4), in which the assembly (1) to be welded is received in a receiving region (4.1), and is oriented towards the receiving region (4.1).
B23K 31/12 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to investigating the properties, e.g. the weldability, of materials
59.
Method and device for coupling out a partial beam having a very small beam percentage from an optical beam
The invention relates to a device comprising a beam splitter and a method of using the device. The device comprises a beam emitting unit and a downstream beam splitter, which is formed by two adjacent planar plates of different materials. For a specified wavelength range of an optical beam from which a partial beam is to be coupled out by reflection, the material of the first planar plate has a minimum refractive index which is greater by a refractive index interval than the maximum ref ractive index of the material of the second planar plate. From the optical beam, which, collimated and linearly polarized parallel to a plane of incidence, impinges on the beam splitter at a certain angle of incidence, the partial beam having only a small summary percentage of the optical beam and a small spectral fluctuation range is coupled out.
The invention relates to a hybrid objective with fixed focal length, which has a total of four lenses. Two lenses consist of glass and two lenses consist of plastic. The objective is suitable for use in a LIDAR measurement system.
G02B 13/00 - Optical objectives specially designed for the purposes specified below
G02B 9/34 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having four components only
G01S 7/481 - Constructional features, e.g. arrangements of optical elements
G02B 13/14 - Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation
G02B 13/22 - Telecentric objectives or lens systems
The invention relates to a hybrid objective with fixed focal length, which has a total of four lenses. Two lenses consist of glass and two lenses consist of plastic. The objective lens is suitable for use in a LIDAR measurement system.
G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
G02B 13/18 - Optical objectives specially designed for the purposes specified below with lenses having one or more non-spherical faces, e.g. for reducing geometrical aberration
G02B 13/16 - Optical objectives specially designed for the purposes specified below for use in conjunction with image converters or intensifiers
G02B 13/14 - Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation
G02B 9/56 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having four components only arranged + –– + all components being simple lenses
The invention relates to a method for testing optoelectronic chips (1) that are arranged on a wafer and comprise electric interfaces in the form of contact pads (1.1) and optical interfaces in the form of optical deflection elements (1.2), e.g. grating couplers, which are arranged in a fixed manner relative to the electric interfaces and have a specific coupling angle (a). The wafer is adjusted in three adjustment steps in such a manner that one of the chips (1) is positioned relative to a contacting module (2) such that the electric interfaces of the chip (1) and the contacting module (2) are in contact with one another and the optical interfaces of the chip (1) and the contacting module (2) assume a maximum position of the optical coupling.
The invention relates to a method for producing a semiconductor assembly, in particular connecting a semiconductor chip to a heat sink. A first metal layer consisting of Pb, Cd, In or Sn is made so thin that it is bonded by means of an opposing second metal layer consisting of another metal, for example gold, in a layer consisting of intermetallic phases. This can prevent migration of the soft metals. The brittle intermetallic layer is prevented from fracturing by a continuous pressing force.
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
Scientific, research, optical, measuring and testing
instruments and systems (contained in this class);
opto-electronical measuring instruments and systems and
components thereof; optical sensing devices; sensor cards,
sensing devices and parts and components thereof; measuring
stations for testing and examination of integrated ciruits
and semiconductor elements and for needle tests; sensor
cards for use in connection with testing of integrated
circuits and semiconductor devices; optical waveguide
sensors or electronic components for use in wafer testing of
circuits; positioning fixture for testing of integrated
circuits and semiconductor devices; optical inspection
apparatus for semiconductor elements and integrated
circuits; testing, inspection and examination instruments
for electrical and electro-optical reliability testing of
integrated circuits and semiconductor elements;
opto-electronical testing, measuring and examination
equipment, especially for micro-opto-electrical-mechanical
systems (MOEMS), micro-electro-mechanical systems (MEMS),
wafer, optical and electronical elements and systems,
electronic chips, computer-chip sets, electronic chip cards,
chips with integrated circuits; photonic-integrated circuits
(PICs); software for control of afore-mentioned instruments,
apparatus and systems; computer programs for electronical,
optical and opto-electronical instruments, apparatus and
systems. Scientific and technological services as well as research
activities and designing services relating thereto; services
of engineers; industrial analysis; industrial research;
design and planning of opto-electronical apparatus and
instruments; design of optical and micro-optical elements
and systems; development, programming and implementing
software, especially for electronical, optical and
opto-electronical instruments, apparatus, measuring and
testing systems.
The invention relates to a laser assembly (1) comprising a diode laser bar (2), a heat sink (4) and at least one cover (7). The laser bar is located between the heat sink and the cover. The heat sink and/or the cover is/are coated with nanowires (16) or nanotubes via which the contact between the laser bar and the heat sink and/or the cover is established.
The invention relates to an LED illumination apparatus having a group of at least three LED dice that are electrically connected in series. Here, the upper-side second connection (11.b) of the first LED die (8. a) is electrically connected to the upper-side third connection (11.c) of the second LED die (8.b) by way of a bond wire (6). In addition, the lower-side fourth connection (11.d) of the second LED die (8.b) is electrically connected to the lower-side fifth connection (11.e) of the third LED die (8.c) by way of a conductor track (5) located on the carrier (3). In this case, the second upper-side connection (11.b), the fourth lower-side connection (11.d) and the sixth upper-side connection (11.f) are either all embodied as cathode connections or are all embodied as anode connections.
H01L 25/075 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 33/62 - Arrangements for conducting electric current to or from the semiconductor body, e.g. leadframe, wire-bond or solder balls
67.
PRINTING METHOD FOR PRODUCING A MULTI-LAYER COMPONENT WITH ONLINE PROCESS CONTROL AND A DEVICE SUITABLE FOR THIS PURPOSE
The invention relates to a printing method for producing a multi-layer component, in which processing radiation is applied to material layers, layer by layer, along processing sites, during which radiation coming from the processing sites is received, the received radiation is split into a spectrum associated with the respective processing site and the spectra are analysed. The analysis is carried out, in particular, on the basis of reference spectra which are stored or which are learned during the printing method. The invention also relates to a device suitable for this purpose.
B22F 3/105 - Sintering only by using electric current, laser radiation or plasma
B29C 64/153 - Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
B29C 64/268 - Arrangements for irradiation using laser beamsArrangements for irradiation using electron beams [EB]
B29C 64/393 - Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
The invention relates to a method (700) for determining a time of a flank (200) in a signal (132), wherein the method (700) comprises a step of reading (710) the signal (132) and has a master clock (210) for operating a digital evaluation unit (125) for evaluating the time of the flank (200). The method (700) also comprises a step of forming (720) a data word (220) representing the signal (132), using a deserializer (310) of a SERDES cell (300), wherein the data word (220) has a plurality of bits, and wherein a sampling clock (205) is applied to the the SERDES cell (300) for sampling the signal (132), which sampling clock is higher than the master clock (210), wherein one flank or two flanks of the sampling clock (205) are used for sampling the signal (132). Finally, the method (700) comprises a step of determining (730) the time of the flank (200) in the signal (132) using the data word (220) and the master clock (210) in the evaluation unit (125).
A transmitting device, preferably containing at least two laser diodes and a scanning mirror, which is deflectable about its center (MP) and is arranged in a housing with a transparent cover element. The cover element is formed, at least in a coupling-out region, by a section of a monocentric hemispherical shell (HK) with a center of curvature (K) and is arranged to cover the scanning mirror in such a way that the center of curvature (K) of the hemispherical shell (HK) and the center (MP) of the scanning mirror coincide, and is formed in a coupling-in region by an optical block, comprising a toroidal entrance surface, in the special form of a cylindrical surface, at least one toroidal exit surface and at least two first mirror surfaces arranged between them, for deflecting and pre-collimating the laser beams.
H04B 10/00 - Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
G01S 7/481 - Constructional features, e.g. arrangements of optical elements
G01S 17/42 - Simultaneous measurement of distance and other coordinates
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
The invention relates to an optical unit (125), in particular a beam expander, having a first optical element (130), which is disposed in an optical path (120) and which has a first structure (210) on a first surface (200) disposed in the optical path (120), the first structure (210) having recesses (220) in the first surface (200) of the first optical element (130), which recesses have a decreasing cross-section as their depth increases in the direction of the first optical element (130). The optical unit (125) also comprises a second optical element (135), which is disposed in the optical path (120) and which has a second structure (275) on a second surface (270) disposed in the optical path (120), the second structure (275) containing recesses in the second surface (270) of the second optical element (135), which recesses have a decreasing cross-section as their depth increases in the direction of the second optical element (135).
G02B 27/09 - Beam shaping, e.g. changing the cross-sectioned area, not otherwise provided for
G02B 1/118 - Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
72.
Transmitting device for a LIDAR scanner having a scanning mirror covered by a cover element
A transmitting device, containing an emitting device (1) and a scanning mirror (2), which is deflectable about its center (MP) and is arranged in a housing (3) with a transparent cover element (4). The cover element (4) is formed, at least in a coupling-out region (4.2), by a section of a monocentric hemispherical shell (HK) with a center of curvature (K) and is arranged to cover the scanning mirror (2) in such a way that the center of curvature (K) of the hemispherical shell (HK) and the center (MP) of the scanning mirror (2) coincide.
G01S 7/481 - Constructional features, e.g. arrangements of optical elements
G01S 17/42 - Simultaneous measurement of distance and other coordinates
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
Surface measuring apparatus for measuring a surface of a workpiece has a probe for contacting the surface of workpiece, a feed apparatus for moving probe relative to surface of the workpiece along a feed axis for sampling surface of workpiece. The probe outputs a probe output signal during sampling of the workpiece. An evaluation apparatus is in data transmission connection with probe and is designed and programmed to reconstruct the profile of the surface of workpiece based on the probe output signal. Evaluation apparatus is designed and programmed to determine an apparatus frequency signature representing characteristic natural frequencies of the surface measuring apparatus, and an analyzer is provided which detects and analyzes the temporal course of the apparatus frequency signature, such that the functional state of the surface measuring apparatus is assessed based on the temporal course of the apparatus frequency signature.
The present invention relates to an optical unit (100) having a refraction element (105), which is designed to refract a beam (122) of electromagnetic radiation emitted by a radiation source (125) onto an object (135). The optical unit (100) further comprises a sensor element (140), which is designed to contactlessly detect a temperature on at least one partial region (148) of the refraction element (105) and, in response to the temperature, to output a temperature signal (142).
G02B 7/00 - Mountings, adjusting means, or light-tight connections, for optical elements
G02B 7/02 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
G02B 7/18 - Mountings, adjusting means, or light-tight connections, for optical elements for prismsMountings, adjusting means, or light-tight connections, for optical elements for mirrors
The invention relates to an adjustment mount (0) for the radial adjustment of an optical unit having an optical axis, containing a support (1) and an auxiliary mount (2) which is radially adjustable with respect thereto via adjusting devices (3). The adjusting devices (3) each contain a set screw (3.1) of which the ends are arranged in cylindrical elements (3.2, 3.3) which are rotatably mounted in the support (1) and in the auxiliary mount (2). This allows the set screws (3.1) to perform compensating movements during the adjustment, which allows a force-free radial adjustment in one adjustment plane. To fix an adjustment position, the auxiliary mount (2) is held clamped between two cover elements (4) which are fastened to the support (1) and braced together such that, during and after fixing, only moments or forces acting perpendicularly on the adjustment plane are effective. The invention also relates to an apparatus having at least two adjustment mounts (0). The supports (1) of the adjustment mounts (0) can advantageously be different components of a common frame.
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
Scientific, research, optical, measuring and testing instruments and systems comprised of computer hardware, cameras, and probe cards for wafer probers; opto-electronical measuring instruments and systems, namely, probe cards for wafer probers and structural components thereof; optical sensors; sensor cards, and sensors for testing of photonic integrated circuits and parts and components thereof; measuring stations for testing and examination of integrated circuits and semiconductor elements, namely, probe cards for wafer level testing of photonic integrated circuits; sensor cards for use in connection with testing of integrated circuits and semiconductor devices; optical waveguide sensors or electronic components for computers for use in wafer testing of circuits; positioning fixture for testing of integrated circuits and semiconductor devices; optical inspection apparatus for semiconductor elements and integrated circuits; testing, inspection and examination instruments for electrical and electro-optical reliability testing of integrated circuits and semiconductor elements; opto-electronical testing, and measuring equipment for micro-opto-electrical-mechanical systems (MOEMS), micro-electro-mechanical systems (MEMS), semi-conductor wafer, optical and electrical elements and integrated circuit systems, blank electronic chip cards, blank computer-chip sets, encoded electronic chip cards and blank electronic chips with integrated circuits; photonic-integrated circuits (PICs); downloadable, recorded software for control of afore-mentioned instruments, apparatus and systems; downloadable, recorded computer programs for operating electronic, optical and opto-electronical instruments, apparatus and systems Scientific and technological services, namely, testing of photonic integrated circuits and designing testing equipment therefor as well as technical research activities and designing services relating thereto; engineering; industrial research in the field of testing of photonic integrated circuits; design and planning of opto-electronical apparatus and instruments; design of optical and micro-optical integrated circuit and semi-conductor elements and systems; development, programming and implementing software for operation of electronic, optical and opto-electronic instruments, apparatus, measuring and testing systems
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
(1) Opto-electronical measuring instruments and systems, namely, probe cards for wafer probers and structural components thereof; optical sensors; measuring stations for testing and examination of integrated circuits and semiconductor elements, namely, probe cards for wafer level testing of photonic integrated circuits; positioning fixtures namely probes for testing integrated circuits and semiconductors; testing, inspection and examination instruments, namely probe cards for use in wafer probers, for electrical and electro-optical reliability testing of integrated circuits and semiconductor elements; photonic-integrated circuits (PICs); software for controlling and operating testing, inspection and examination instruments, namely probe cards, for electrical and electro-optical reliability testing of integrated circuits and semiconductor elements. (1) Scientific and technological services, namely, testing of photonic integrated circuits and designing testing equipment therefor as well as technical research activities and designing services relating thereto.
78.
LASER SCANNING DEVICE AND METHOD FOR THE THREE-DIMENSIONAL MEASUREMENT OF A SETTING FROM A GREAT DISTANCE
The invention relates to a method for the three-dimensional measurement of a setting from a great distance, and a laser scanning device suitable for this purpose. The field of view (FOV) of a laser scanning device is divided into virtual receiver cells (VE) forming a row or a matrix which, in a scanning direction (Rs), are many times smaller than a measurement field (M) within the field of view (FOV) to which a laser pulse (LP) is applied. A receiver signal is formed from the portion (LP) of the laser pulse (LP) that is reflected from a measurement field (M) and detected, and said receiver signal is digitalised and allocated to each virtual receiver cell (VE) that lies in the measurement field (M) in question. The virtual receiver cells (VE) are thus allocated multiple digitalised receiver signals from which an accumulated receiver signal is formed.
The invention relates to a method for soldering a component onto a substrate (8). According to this method, the solder is provided in the form of solder wire (20) or strip solder (20) and is applied to a mounting surface or fastening surface by an ultrasonic bonder. The component is then placed on the solder and the solder is melted. The solder solidifies while forming a solder joint between the component and the substrate (8).
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 23/49 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions wire-like
B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
B23K 35/40 - Making wire or rods for soldering or welding
The invention relates to a method for measuring the surface of workpieces, which are machined on a machine tool, such as a lathe, milling machine or grinding machine, by means of a machining tool, wherein the surface of the workpiece is scanned using a measurement sensor in order to obtain measurement data representing the surface shape of the workpiece, the measurement data being evaluated in an evaluation device which is connected or can be connected to the measurement sensor for data transmission. According to the invention, a state of wear of the machining tool is determined by the evaluation device on the basis of tool wear-dependent tool traces represented in the measurement data.
B23Q 17/09 - Arrangements for indicating or measuring on machine tools for indicating or measuring cutting pressure or cutting-tool condition, e.g. cutting ability, load on tool
B23Q 17/20 - Arrangements for indicating or measuring on machine tools for indicating or measuring workpiece characteristics, e.g. contour, dimension, hardness
G01B 5/28 - Measuring arrangements characterised by the use of mechanical techniques for measuring roughness or irregularity of surfaces
G05B 19/4065 - Monitoring tool breakage, life or condition
A monocentric reception arrangement comprising an optical system (1), in the spherical focal plane (BF) of which the imaged overall image of an object field is subdivided into partial images by field lenses (3.1) of a field lens array (3) arranged here and the partial beams in each case involved in a partial image are collimated by way of a downstream collimator lens (6.1) in each case onto in each case one receiver (5.1) of an optoelectronic receiver array (5). An aperture stop is arranged in a plane of each receiver surface of one of the receivers (5.1), the image of said aperture stop being the entrance pupil, in the center of which lies the common center of curvature (MP) of the spherical entrance surface (2) and the curvature of the field lens array (3). Each partial beam illuminates one of the receiver surfaces with the same beam diameter.
G02B 9/64 - Optical objectives characterised both by the number of the components and their arrangements according to their sign, i.e. + or – having more than six components
09 - Scientific and electric apparatus and instruments
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Machines and machine tools for processing of materials and
manufacturing, in particular laser material processing
machines for melting, sintering, build-up welding,
stripping, working of surfaces and/or remelting using
lasers; parts and fittings of the preceding machines and
machine tools included in this class. Optical instruments and equipment, in particular optical
and/or optoelectronic components and systems consisting
thereof for integration in laser production installations
for micro material processing; software and computer
hardware for monitoring, controlling and execution of
proceedings in the physical world, in particular for laser
material processing; artificial intelligence software and
machine learning software; scientific research and
laboratory apparatus, educational apparatus and simulators;
optical and/or optoelectronic components and systems
consisting thereof for machine tools and handling apparatus. Treatment of materials, namely laser material processing for
engraving, inscribing, labelling, for welding and cutting
operations and micro material processing. Scientific and technological services and research relating
thereto in the field of technology, particular in laser
material processing; industrial analysis and research
services, in particular in connection with optical and/or
optoelectronic components and systems for laser material
processing; technical consultancy for laser material
processing, in particular for creating prototypes;
engineering; technical project planning; design and
development of computer software, in particular in
connection with optical and/or optoelectronic components and
systems for laser material processing.
84.
APPARATUS AND METHOD FOR FOCUS ADJUSTMENT FOR A MATERIAL PROCESSING DEVICE, AND DEVICE FOR LASER MATERIAL PROCESSING
The invention relates to an apparatus (112) for focus adjustment for device (100) for laser material processing having a movably arranged first lens unit (124) comprising a first lens (108), and a movably arranged second lens unit (126) comprising a second lens (110). Said apparatus has an adjustment device (114) designed to move the first lens unit (124) into a first direction (116) and the second lens unit (126) into a second direction (118) that is opposite the first direction (118) in order to adjust a distance between the first lens (108) and the second lens (110) for the focus adjustment.
G02B 7/08 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted to co-operate with a remote control mechanism
B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
G02B 15/14 - Optical objectives with means for varying the magnification by axial movement of one or more lenses or groups of lenses relative to the image plane for continuously varying the equivalent focal length of the objective
09 - Scientific and electric apparatus and instruments
Goods & Services
Thermal cameras; observation devices; parts and components
for all the foregoing goods, in particular IR modules for
providing digital IR image data streams, in particular
containing a thermal IR image sensor.
The invention relates to the production of an optical or optoelectronic assembly (1, 2) comprising an active component (5) and a cooler (3). The cooler (3) is produced by means of a 3D printing method on a composite plate (6).
B33Y 70/00 - Materials specially adapted for additive manufacturing
B22F 3/105 - Sintering only by using electric current, laser radiation or plasma
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
09 - Scientific and electric apparatus and instruments
Goods & Services
Image capture devices; cameras; thermal cameras; night
vision cameras; daylight cameras, in particular low-light
cameras; target detection devices; optical observation
devices, comprising a night vision camera and a daylight
camera, in particular comprising a night vision camera and a
low-light camera.
89.
BEAM EXPANDER AND METHOD FOR OPERATING A BEAM EXPANDER
The invention relates to a beam expander (100) comprising a receiving tube (105) with a light inlet opening (107) and a light outlet opening (109). The beam expander (100) additionally comprises at least one optical unit (112), which is movably arranged in a beam path between the light inlet opening (107) and the light outlet opening (109) of the receiving tube (105) in a movement direction (117), for changing the diameter of a beam bundle (110) coupled in via the light inlet opening (107). The beam expander (100) also comprises a guide unit (120), which is coupled to the optical unit (112), for guiding the optical unit (112) in the receiving tube (105) and a linear drive coupling unit (125), which is mechanically coupled to the guide unit (120), in order to couple and/or convert a movement or rotation of a drive element (127) into a movement of the guide unit (120).
G02B 7/10 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification by relative axial movement of several lenses, e.g. of varifocal objective lens
G02B 27/09 - Beam shaping, e.g. changing the cross-sectioned area, not otherwise provided for
B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
90.
METHOD AND DEVICE FOR PRODUCING A MULTI-LAYER COMPONENT
The present invention relates to a method (300) for producing a multi-layer component (105), wherein the method (300) has a step (310) of forming a layer (110) of the multi-layer component (105) by subjecting a layer-forming material (150) to a layer-forming beam (115). The method (300) further comprises a step (320) of analysing the formed layer (110) by means of an analysing beam (115) and a step (330) of generating at least one further layer (160) of the multi-layer component (105) by subjecting the layer-forming material (150) to a further layer-forming beam (115) in order to produce the multi-layer component (105).
The invention relates to EPI lighting which allows transmitted light-bright field- or transmitted light-dark field-imaging or phase contrast imaging of a microscopic sample. For this purpose, a flat reflector is used which is located opposite the observer side and which brings about a deflection of the illumination beam of light. The flat reflector has a plane normal and an effective perpendicular which differs from the plane normal, or it is in the form of a retroreflector.
09 - Scientific and electric apparatus and instruments
Goods & Services
Thermal cameras; observation devices in the nature of infrared cameras and infrared sensors capable of providing night vision image data; parts and components for all the foregoing goods, namely infrared (IR) modules for providing digital infrared (IR) image data streams, in particular containing a thermal infrared (IR) image sensor
09 - Scientific and electric apparatus and instruments
40 - Treatment of materials; recycling, air and water treatment,
42 - Scientific, technological and industrial services, research and design
Goods & Services
Machines and machine tools for processing of materials and manufacturing, in particular laser material processing machines and machine tools for metal or plastic melting, sintering, build-up welding, stripping, working of surfaces in the nature of laser engraving, laser marking, laser ablation of coatings and remelting using lasers; parts and fittings of the preceding machines and machine tools in the nature of laser material processing machines for processing of metals or plastics Optical instruments and equipment, in particular optical and/or optoelectronic components in the nature of optical lenses, scanners, optical sensors, cameras for machine vision and systems consisting of optical instruments and equipment for integration in laser production installations for micro material processing; downloadable or recorded artificial intelligence software for use in machine learning and speech recognition, downloadable or recorded machine learning software; scientific research and laboratory apparatus, namely, optical instruments and equipment for use in laser material processing machines, educational apparatus and simulators, namely, optical instruments and equipment in the nature of cameras and optical lenses for use in laser material processing machines; optical and/or optoelectronic components in the nature of optical lenses, scanners, optical sensors, cameras for machine vision and systems consisting of optical instruments and equipment for laser material processing apparatus and for machine tools and handling apparatus Treatment of materials, namely laser material processing for engraving, inscribing, labelling, for welding and cutting of metals or plastics and micro material processing, namely laser micro-material processing Scientific and technological services, namely, in relation to laser material processing research in the field of technology, particular in laser material processing; industrial materials and product failure analysis utilizing beam expanders, lenses, scanners, sensors, cameras for machine vision and product research services in connection with optical and/or optoelectronic components and systems for laser material processing; technical consultancy in the field of research and design of laser material processing technology, in particular for creating prototypes; engineering; technical project planning, namely technological planning in the field of laser material processing and computer software and hardware systems for use in the field of laser material processing machines in this field of use; design and development of computer software, in particular in connection with optical and/or optoelectronic components and systems for laser material processing
94.
OBJECTIVE LENS, USE THEREOF FOR LIGHT TRAVEL TIME DETECTION AND MEASURING SYSTEM
The invention relates to a hybrid objective lens with fixed focal length, which has a total of three or four lenses. At least one of the lenses is a spherical glass lens. At least one other lens is made of plastic. The objective lens is suitable for use in a LIDAR measurement system.
The invention relates to a method for processing a composite material (102) having a first layer (118) and a second layer (120) by means of a laser beam (108), wherein material of the composite material (102) is removed when the laser beam (108) impinges on a processing region of the composite material (102). The method comprises a step of determining a change, in particular a frequency change and/or an intensity change, using a sensor signal (128) which represents a detection radiation emitted from the processing region (122), a step of illuminating the processing region with illumination radiation differing from the laser beam in order to identify the defined spectrum of the layer or a boundary surface, a step of comparing the change with a predetermined change which is expected during a transition of the processing region from the first layer (118) into a further layer (120), and a step of outputting at least one control signal (134, 138, 140) for controlling the processing as a function of a result of the comparison of the change with the predetermined change.
An adjustable mirror assembly comprising a mirror, a support, a leaf spring element biased between the support and a planar reverse side of the mirror, said leaf spring element generating a spring force, as well as at least two adjusting units mounted in the support and acting on the mirror in opposition to the spring force. The leaf spring element is mounted to the reverse side of the mirror via at least one mirror mounting point by a substance-to-substance bond and to the support via at least one support mounting point. The spring force is directed toward the support.
G02B 7/182 - Mountings, adjusting means, or light-tight connections, for optical elements for prismsMountings, adjusting means, or light-tight connections, for optical elements for mirrors for mirrors
97.
Measuring apparatus for surface or contour measurement
Measuring apparatus for surface or contour measurement on a workpiece has a probe for contacting the surface of workpiece to be measured. Probe has a holding part to which a probe arm is detachably connectable or connected. Measuring apparatus also has a feed apparatus for moving probe relative to workpiece to be measured, and a control apparatus for controlling feed apparatus. A position sensor associated with probe arm and connected to control apparatus is provided, and which detects changes in the position of the probe arm, relative to holding part, from a measuring position into an interference position of probe arm, and generates a position change signal. Control apparatus is designed and programmed in such a way that, as a response to a position change signal, it generates a control signal for controlling feed apparatus in such a way that feed movement of probe is influenced.
rr) which is reduced compared to the thickness (d) of the mount body (1) or each of the two cover rings (6) has a recess by means of which the connection structures are freed.
The invention relates to a mirror assembly comprising a plane mirror (1), a carrier (2) and a supporting structure arranged between the two. Said supporting structure consists of longitudinal strips (5) and transverse connections (6), wherein at least the longitudinal strips (5) are formed by supporting elements (3). Each of the supporting elements (3) is formed by two interconnected leaf springs (3.1) of the same design, wherein at least some of said supporting elements (3) comprise an actuator element (4) disposed between the leaf springs (3.1) thereof, and actuation of such an element results in said leaf springs (3.1) being bent symmetrically to one another such that the plane mirror (1) is deformed by the supporting element (3) in question.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
The invention relates to a device for capturing microscopic images or video sequences. The main idea of the invention consists in a modular imaging platform in which an imaging module is connected to a support via a releasable connection, and provides for wireless transmission of energy from the support to the imaging module.
