The invention relates to a semiconductor module (100) having the following features: - an integrated semiconductor circuit (105) which can be or is electrically contacted via at least one connection region (145, 145a); - a circuit board (120) having at least one electronic component (125) which can be or is electrically contacted via at least one circuit board connection region (140, 140a); and - a bridging element (110) having at least one electrical bridging line (115, 115a), wherein the bridging line (115, 115a) can be or is contacted with the connection region (145, 145a) of the integrated semiconductor circuit (105) by means of a first contact element (150, 150a) and can be or is contacted with the circuit board connection region (140, 140a) by means of a second contact element (155, 155a). The invention also relates to a production method.
The invention relates to a method (100) for producing a laser diode module, to a multilayer substrate (40) for use in a method (100) for producing a laser diode module (1), and to a laser composite (10) for use in a method (100) for producing a laser diode module (1).
H01S 5/02326 - Dispositions pour le positionnement relatif des diodes laser et des composants optiques, p. ex. rainures dans le support pour fixer des fibres optiques ou des lentilles
The approach presented here develops a test arrangement (100) for testing at least one optical component (120), wherein the test arrangement (100) comprises a coupling module (105) for transmitting and/or receiving a light ray (110) and/or a light beam to/from the optical component (120) to be tested and the optical component (120) to be tested, the latter comprising a grating coupler (115) having an irregular grating structure (150).
The invention relates to a recording device (10) for generating a 3-D recording of a three-dimensional object (11), comprising a light source (13) for generating a light beam (14) in a pattern plane (15), a first beam splitter (16) for separating off an illumination beam (17) from the light beam (14) and for separating off a recording beam (18) from an observation beam (19) reflected back off the object (11), a chromatic element (24) for focusing the illumination beam (17) that was separated off by the first beam splitter (16) onto the multiple projection planes (12), a second beam splitter (25) for splitting the recording beam (18) into a first recording beam component (26) and a second recording beam component (27), a capturing unit (31) having a first matrix sensor (36) and a second matrix sensor (38), and a calculation unit (40) for generating a 3-D recording of the three-dimensional object (11).
G01B 11/25 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes en projetant un motif, p. ex. des franges de moiré, sur l'objet
The invention relates to a multispectral light source (10) for producing an output radiation (12), said multispectral light source comprising: - a first light source (14), wherein a first light beam (16) having a first wavelength (λ1) can be emitted from the first light source (14), - a second light source (18), wherein a second light beam (20) having a second wavelength (λ2) can be emitted from the second light source (18), - a third light source (22), wherein a third light beam (24), which has a wavelength range of λ3min to λ3max, can be emitted from the third light source (22), wherein the first light source (14), the second light source (18), and the third light source (22) are arranged at a distance from one another, - at least one first dichroic mirror (32) for combining the first light beam (16) and the second light beam (20) into a fourth light beam (76), wherein the first dichroic mirror (32) is designed to reflect the second light beam (20) and transmit the first light beam (16), and wherein the first dichroic mirror (32) is arranged in such a way that the second light beam (20) can be reflected by the first dichroic mirror (32) and the first light beam (16) can be transmitted by the first dichroic mirror (32), and - a beam splitter (34) positioned downstream of the first dichroic mirror (32), wherein the beam splitter (34) is designed to divide the fourth light beam (76), formed from the first light beam (16) and the second light beam (20), into a first power component (36) and a second power component (37), and to divide the third light beam (24) into a third power component (38) and a fourth power component (39), wherein the first power component (36) can be superimposed on the fourth power component (39) by the beam splitter (34) in order to form the output radiation (12), and the second power component (37), together with the third power component (38), can be output as a residual radiation (86) or an additional output radiation (86).
F21K 9/64 - Agencements optiques intégrés dans la source lumineuse, p. ex. pour améliorer l’indice de rendu des couleurs ou l’extraction de lumière en utilisant des moyens de conversion de longueur d’onde distincts ou espacés de l’élément générateur de lumière, p. ex. une couche de phosphore éloignée
6.
METHOD AND CARRIER SUBSTRATE FOR PRODUCING A COMPONENT COMPRISING ALUMINUM NITRIDE
The invention relates to a method (600) for producing a semiconductor component (100) with at least one exposed membrane portion, wherein the method (600) comprises the following steps: - providing (610) a semiconductor material (102) having a carrier substrate (104) provided with a passivation layer (108); - applying a membrane layer (110) to the passivation layer (108), the membrane layer (110) being formed from an aluminum nitride material in which a ratio of aluminum to nitrogen is within a range between 1.05 to 1.4; - applying a protective layer (114) to the membrane layer (110), the membrane layer (110), on a side opposite the passivation layer (108), being covered by the protective layer (114); - removing (620) a part of the carrier substrate (104) using a wet-chemical process, in order to obtain a region (130) of the passivation layer (108) that is devoid of the substrate; and - exposing (630) a section of the membrane layer (110) in the region (130) that is devoid of the substrate by means of a first dry etching step for etching the passivation layer and a second dry etching step for etching the protective layer, in order to obtain the exposed membrane section (140).
B81C 1/00 - Fabrication ou traitement de dispositifs ou de systèmes dans ou sur un substrat
G03F 1/62 - Pellicules, p. ex. assemblage de pellicules ayant une membrane sur un cadre de supportLeur préparation
H02N 2/18 - Machines électriques en général utilisant l'effet piézo-électrique, l'électrostriction ou la magnétostriction fournissant une sortie électrique à partir d'une entrée mécanique, p. ex. générateurs
A method for testing optoelectronic chips that are arranged on a wafer and comprise electric interfaces in the form of contact pads and optical interfaces, which are arranged in a fixed manner relative to the electric interfaces, in the form of optical deflecting elements, e.g. grating couplers, at a specified coupling angle. In the process, the wafer is adjusted in three adjustment steps in such a manner that one of the chips is positioned relative to a contacting module such that the electric interfaces of the chip and the contacting module are in contact with one another and the optical interfaces of the chip and the contacting module assume a maximum position of the optical coupling.
The invention relates to a separating-joining device (10) for separating and joining a carrier body (11) and for discharging (140) a carrier body section (20), comprising: a guide unit (13) for guiding the carrier body (11) and/or a carrier body section along a transport path (TP) between a first drivable conveying unit (14) and a second drivable conveying unit (15), at least one separating unit (16) arranged along the transport path (TP) for thermally separating the carrier body (11) into at least one first carrier body section (17) and a remaining carrier body section (18), wherein the remaining carrier body section (18) has a second carrier body section (20) and a third carrier body section (21) which can be separated from the second carrier body section (20), and a joining unit (23) for thermally joining (160) the first carrier body section (17) and the third carrier body section (21) at a joining interface (24), and at least one discharge unit (25) for discharging (140) the second carrier body section (20) of the remaining carrier body section (18) in a discharge outlet (26), wherein the discharge unit (25) has a diverter (27).
B21D 39/03 - Utilisation de procédés permettant d'assembler des objets ou des parties d'objets, p. ex. revêtement par des tôles, autrement que par placageDispositifs de mandrinage des tubes des tôles autrement que par pliage
B21D 43/08 - Avancement du matériau en fonction du mouvement de la matrice ou de l'outil au moyen d'un élément mécanique coopérant avec le matériau au moyen de rouleaux
B21D 43/12 - Avancement du matériau en fonction du mouvement de la matrice ou de l'outil au moyen d'un élément mécanique coopérant avec le matériau au moyen de chaînes ou de courroies
B21D 43/16 - Avancement du matériau en fonction du mouvement de la matrice ou de l'outil par pesanteur, p. ex. par des goulottes
B21D 43/18 - Avancement du matériau en fonction du mouvement de la matrice ou de l'outil au moyen de dispositifs en liaison pneumatique ou magnétique avec le matériau
B21D 43/28 - Association de dispositifs de coupe avec des dispositifs d'alimentation, d'alignement ou de stockage
B65G 15/00 - Transporteurs comportant des surfaces porteuses de charges sans fin, c.-à-d. des tapis roulants ou autres systèmes équivalents, auxquelles l'effort de traction est transmis par des moyens différents des éléments d'entraînement sans fin de même configuration
9.
OPTICAL DEVICE AND METHOD FOR PRODUCING AN OPTICAL DEVICE
An optical module for modifying a light beam, wherein the optical module is made of a single-piece solid body material and has a passage surface for receiving the light beam. Furthermore, the optical module comprises a beam deflecting region lying opposite the passage surface for deflecting the light beam, wherein the beam deflecting region is designed as a curved region on the exterior of the optical module, in particular so as to have a hollow mirror function, a pass-through surface for outputting the light beam deflected by the beam deflecting region and a beam shaping region that is designed to shape the light beam and additionally or alternatively thereto the deflected light beam such that the light beam has a beam profile a with homogeneous intensity distribution over a specified range.
A method of integrally bonding a glass element to a support element, the method comprising a step of inserting at least one contact element into a contact recess in a surface of the support element. In addition, the method comprises a step of placing the glass element on a portion of the contact element which portion protrudes beyond the surface, and a step of locally heating the contact element in order to connect the glass element to the carrier element via the contact element. The method also comprises a step of coating at least a part of the contact recess with a separating layer prior to the step of insertion.
C04B 37/04 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles de verre
C03B 23/20 - Réunion de pièces de verre par fusion sans refaçonnage important
C03C 3/14 - Compositions pour la fabrication du verre contenant un oxyde mais pas de silice contenant du bore
C03C 27/00 - Liaison de pièces de verre à des pièces en d'autres matériaux inorganiquesLiaison verre-verre par des procédés autres que la fusion
G01B 11/03 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur en mesurant les coordonnées de points
11.
ELECTROMECHANICAL SHUTTER DEVICE FOR A THERMAL IMAGING CAMERA WITH A ROCKER AS SHUTTER BLADE
The invention relates to an electromechanical shutter device for a thermal imaging camera, comprising a carrier (2) having an opening (21) with a fixed electric motor (3) having a motor shaft (31) and a shutter blade (51) assigned to the opening (21), which forms a rocker (5) with a shaft (52), wherein the rocker (5) is mounted on a first rotation axis (53) arranged parallel to the motor shaft (31) on the carrier (2), is pivotable about the first axis of rotation (53) over a pivot angle range by means of a crank with a pin (4), and has an elongated hole (521) in the shaft (52) located opposite the shutter blade (51), with which the pin (4) is engaged, wherein a first spur gear (6) is attached to the motor shaft (31), the crank is formed by a second spur gear (7), the second spur gear (7) is mounted on a second axis of rotation (8) arranged parallel to the motor shaft (31) in the carrier (2), is rotatable over a defined rotation angle range and meshes with the first spur gear (6).
G03B 9/26 - Obturateurs à lame ou disque tournant ou pivotant autour de la perpendiculaire à son plan comportant une seule ou plusieurs lames d'obturation
G03B 9/10 - Obturateurs à lame ou disque tournant ou pivotant autour de la perpendiculaire à son plan
G02B 23/12 - Télescopes ou lunettes d'approche, p. ex. jumellesPériscopesInstruments pour voir à l'intérieur de corps creuxViseursPointage optique ou appareils de visée avec des moyens pour renverser ou intensifier l'image
H04N 23/23 - Caméras ou modules de caméras comprenant des capteurs d'images électroniquesLeur commande pour générer des signaux d'image uniquement à partir d'un rayonnement infrarouge à partir du rayonnement infrarouge thermique
12.
METHOD OF PRODUCING AN ETCHING MASK, METHOD OF ETCHING A STRUCTURE INTO A SUBSTRATE, USE OF A TETREL LAYER AND STRUCTURE FOR PRODUCING A MASK
A method of producing an etching mask. A substrate is provided, a metal layer is applied, the metal layer comprises or is formed from at least one transition metal and/or aluminum. A masking layer is applied and the masking layer is structured. The metal layer is exposed in at least one processing region. The substrate is coated with a tetrel layer including at least partially a tetrel, wherein an interdiffusion zone between the transition metal or aluminum and the tetrel is formed in the processing region at an interface between the metal layer and the tetrel layer. The masking layer is removed and the metal layer s selectively etched. The substrate is exposed in at least one etching region other than the processing region, and the metal layer is at least partially maintained in the processing region.
H01L 21/033 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou comportant des couches inorganiques
H01L 21/027 - Fabrication de masques sur des corps semi-conducteurs pour traitement photolithographique ultérieur, non prévue dans le groupe ou
H01L 21/3065 - Gravure par plasmaGravure au moyen d'ions réactifs
H01L 21/308 - Traitement chimique ou électrique, p. ex. gravure électrolytique en utilisant des masques
13.
CONTACTING MODULE HAVING A MOUNTING PLATE FOR CONTACTING OPTOELECTRONIC CHIPS
A contacting module and to a method for assembling a contacting module. The contacting module includes: an optical module which contains an optical block made of glass, which optical block has an arrangement of optical interfaces (Sopt) in an optical interface plane (Eopt); and an electronic module, which has an arrangement of electrical interfaces (Sele) in an electrical interface plane (Eele). The optical module and the electronic module are arranged relative to each other such that the arrangement of optical interfaces (Sopt) and the arrangement of electrical interfaces (Sele) have a defined alignment position relative to each other. The optical module contains a mounting plate which is connected to the electronic module by means of a repeatedly releasable, reproducible connection.
A camera shutter device having a shutter blade which moves abruptly between a first position, in which it covers a transmission zone present between the carriers, and a second position, in which it opens up the transmission zone. On the shutter blade, there is provided a slide body which includes a displaceable permanent magnet and which is guided on a linear guide, the ends of which are assigned a respective rotatable permanent magnet. By oppositely changing the polarization direction of the rotatable permanent magnets through 180°, the displaceable permanent magnet is pulled into the first or second position.
The invention relates to a device (10) for at least partial reflection of electromagnetic radiation, comprising at least one base element (11), with a coating (13) being arranged in at least portions of at least one surface (12) of the base element (11), the coating (13) comprising at least one layer (H1) of a first highly refractive material and at least one layer (H2) of a second highly refractive material.
A lens mount (100) comprises an outer ring (105), an inner ring (110) and at least one connecting piece (115). The inner ring (110) is designed to accommodate a lens. The outer ring (105) and the inner ring (110) are connected to one another via the at least one connecting piece (115). The connecting piece (115) forms a first portion having a first length, a second portion having a second length and an intermediate portion having an intermediate length. The intermediate portion is arranged between the first portion and the second portion. The first portion is connected to the inner ring (110). The second portion is connected to the outer ring (105). In this case, a shape of a cross section of the intermediate portion in an intermediate sectional plane differs from a shape of a first cross section of the first portion in a first sectional plane and from a shape of a second cross section of the second portion in a second sectional plane.
An optical test device for testing flat test objects comprises a holder for the test object and two optical sensors for detecting the three-dimensional surface topography of the test object. According to the invention, the holder is formed at least in sections as a test standard and is disposed with respect to the sensors in such a way that the sensors scan the test object from opposite sides and also detect the holder as a test standard at least in sections during the detecting of the test object.
G01B 11/30 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la rugosité ou l'irrégularité des surfaces
18.
METHOD AND DEVICE FOR PRODUCING A COMPONENT COMPRISING AT LEAST ONE MEMBRANE PORTION, AND COMPONENT AND USE OF A COMPONENT
The approach presented here provides a method (200) for producing a component (105) comprising at least one membrane layer (145), the method (200) comprising a step of providing (210) a carrier material (115). Furthermore, the method (200) comprises a step of applying (220) a membrane layer (145) to the carrier material (115), the membrane layer (145) comprising an aluminum nitride material in which an aluminum to nitrogen ratio is in the range of greater than 1 to 1.4 in order to produce the component (105).
B81B 3/00 - Dispositifs comportant des éléments flexibles ou déformables, p. ex. comportant des membranes ou des lamelles élastiques
19.
CONDENSER UNIT FOR PROVIDING DIRECTED LIGHTING OF AN OBJECT TO BE MEASURED POSITIONED IN A MEASURED OBJECT POSITION, IMAGING DEVICE AND METHOD FOR RECORDING A SILHOUETTE CONTOUR OF AT LEAST ONE OBJECT TO BE MEASURED IN A MEASURING FIELD USING AN IMAGING DEVICE AND USE OF AN ATTENUATION ELEMENT
A condenser unit for providing directed lighting of an object to be measured positioned in a measured object position, wherein the condenser unit comprises a light source for emitting a light beam and an optical element having a positive refractive power. The condenser unit further comprises at least one attenuation element arranged in a common optical axis with the light source and the optical element, which attenuation element comprises a location-dependent light intensity attenuation effect for the light beam incident on the attenuation element, more particularly wherein the light intensity attenuation effect declines from the optical axis towards an edge of the attenuation element.
The invention relates to a method (600) for producing a semiconductor component (100) with at least one exposed membrane layer, wherein the method (600) comprises the following steps: Providing (610) a semiconductor material (102) having a carrier substrate (104) provided with a passivation layer (108), wherein a membrane layer (110) is arranged on the passivation layer (108), having a material or consisting of a material that can be changed in terms of its structure and/or composition by water, in particular hydrolysable, wherein the membrane layer (110) is covered by a protective layer (114) on a side opposite the passivation layer (108); removing (620) a part of the carrier substrate (104) using a wet-chemical process, in order to obtain an exposed region of the passivation layer (108) in a structured region (130) of the semiconductor material (102); and exposing (630) a section of the membrane layer (110) in the structured region (130) by means of a first dry etching step for etching the passivation layer and a second dry etching step for etching the protective layer, in order to obtain the exposed membrane section (140).
The invention relates to a separating-joining device (100). The separating-joining device (100) is designed to sort out a defective component (X) from components (1) arranged in a row on a support body (10), wherein the separating-joining device (100) comprises: - a thermal cutting unit (20) for thermally separating the support body (10), - at least one welding unit (40) for thermally joining the support body (10), - a cutting control unit (30), said cutting control unit (30) being designed to automatically control the thermal cutting unit (20) such that the support body (10) is thermally separated at at least two ascertainable cutting interfaces (14, 15) of the support body (10) by means of a beam (21) of the cutting unit (20), - at least one conveyor unit (70) for arranging the two cutting interfaces (14, 15) of the two remaining parts (11, 12) of the support body (10) next to each other in order to form a joining interface (16), and - a welding control unit (50), wherein the welding control unit (50) is designed to automatically control the welding unit (40) such that the two remaining parts (11, 12) of the support body (10) are joined at the joining interface (16) by means of a beam (41) of the welding unit (40).
H01L 21/00 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 29/04 - Corps semi-conducteurs caractérisés par leur structure cristalline, p.ex. polycristalline, cubique ou à orientation particulière des plans cristallins
H01L 29/207 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, à part les matériaux de dopage ou autres impuretés, uniquement des composés AIIIBV caractérisés en outre par le matériau de dopage
23.
ILLUMINATION FOR A MICROSCOPE, MICROSCOPE HAVING DARK-FIELD ILLUMINATION, USE FOR EXAMINING BLOOD, AND METHOD FOR ILLUMINATING A SAMPLE
The invention relates to: an illumination device for microscopic illumination, in particular for dark-field illumination; a microscope having this kind of illumination device; a use for examining blood; and a method for illuminating a sample. For this purpose, light emitting diodes arranged in a cone shape are provided which irradiate onto a condenser body.
A contacting module and a method for assembling a contacting module with an optical module, containing an optical block made of glass, and with an electronics module, the optical block being connected via an adhesive connection to the electronics module or the optical module having a mounting plate, which is mounted on the electronics module so as to be repeatedly releasable therefrom and is connected to the optical block via an adhesive connection. The adhesive connection is produced via at least three cylinder pins, which each have a first end face bearing against the optical block by an adhesive and are glued in through-bores in the carrier plate or the mounting plate.
A camera shutter device including an optical opening and an electromagnetic drive mounted fixedly relative to the opening, and having a linearly guided, movable part which is fixedly connected to a first shutter blade to form one unit. The unit is connected to a drive end of a two-armed lever which is rotatable about an axis of rotation. A counterweight is provided at an output end of the lever. A second weight force acting on the counterweight causes a second torque about the axis of rotation of the lever, which counteracts a first torque which is caused by a first weight force acting on the unit.
The invention relates to a method for producing an optical apparatus (200). The method comprises a step of providing a substrate (210) on whose first main surface (212) a plurality of emission devices (220) for emitting electromagnetic radiation (250, 255) are arranged. The substrate (210) is designed as a light-emitting diode wafer and/or formed from sapphire or gallium nitride and is transparent at least for one emission wavelength of the radiation (250, 255) emitted by the emission devices (220), The method also comprises a step of applying an absorption material (230) on the side of the first main surface (212) of the substrate (210). The absorption material (230) has a photostructurable resist that absorbs at least the emission wavelength. The method further comprises a step of processing the absorbing material (230) in order to lay bare at least one emission surface (227) of each emission device (220). In this case, a position determination of surfaces to be laid bare is carried out from a second main surface (214) of the substrate (210) opposite the first main surface (212). In addition, the method comprises a step of singulating the substrate (210) into a plurality of optical apparatuses (200) by means of a separating manufacturing process, wherein each optical apparatus (200) has at least one emission device (220).
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
H01L 33/44 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les revêtements, p.ex. couche de passivation ou revêtement antireflet
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
27.
METHOD FOR PRODUCING A DIODE LASER, AND DIODE LASER
The invention relates to a method for producing a diode laser having a laser bar (3), wherein a metallic layer (24) is used which has a nub structure with raised places (26) and which is located between the n-side (10) of the laser bar and the cover (15). The cavities (28) in the nub structure are subsequently filled, by means of at least one filler channel (17), with a filler (29) which is cured. The diode laser according to the invention can be reliably operated in pulsed mode.
A hybrid fixed focal length lens that includes five lens elements and a diaphragm for a LIDAR measurement system. Some of the lens elements have surfaces that are aspherical.
G01C 3/08 - Utilisation de détecteurs électriques de radiations
G02B 9/60 - Objectifs optiques caractérisés à la fois par le nombre de leurs composants et la façon dont ceux-ci sont disposés selon leur signe, c.-à-d. + ou — ayant uniquement cinq composants
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
G01S 7/4915 - Mesure du temps de retard, p. ex. détails opérationnels pour les composants de pixelsMesure de la phase
G02B 13/00 - Objectifs optiques spécialement conçus pour les emplois spécifiés ci-dessous
G02B 13/16 - Objectifs optiques spécialement conçus pour les emplois spécifiés ci-dessous à utiliser en combinaison avec des convertisseurs ou des amplificateurs d'image
G02B 9/34 - Objectifs optiques caractérisés à la fois par le nombre de leurs composants et la façon dont ceux-ci sont disposés selon leur signe, c.-à-d. + ou — ayant uniquement quatre composants
G02B 13/22 - Objectifs ou systèmes de lentilles télécentriques
29.
METHOD AND DEVICE FOR GENERATING A CAMERA IMAGE OF A WELDING SEAM FOR AN IMAGE PROCESSING-SUPPORTED LASER TRANSMISSION WELDING METHOD
A method for generating a camera image from which a welding contour can be derived along which an assembly is to be welded in an image processing-supported laser transmission welding method. The transparent component of the assembly is illuminated from a side facing away from the camera. The invention also relates to a device which is suitable to carry out the method and wherein an illumination device has at least one light source, the light source being arranged in a workpiece holder in which the assembly to be welded is received in a receiving area and being directed into the receiving area.
B23K 31/12 - Procédés relevant de la présente sous-classe, spécialement adaptés à des objets ou des buts particuliers, mais non couverts par un seul des groupes principaux relatifs à la recherche des propriétés, p. ex. de soudabilité, des matériaux
30.
Method for making a thermally stable connection between a glass element and a support element, method for producing an optical device, and optical device
The invention relates to a method for thermally stable joining of a glass element to a support element, wherein the glass element has a first coefficient of expansion and the support element has a second coefficient of expansion differing from the first coefficient of expansion. The method thus comprises a step of attaching an intermediate glass material to the support element, wherein the intermediate glass material has a third coefficient of expansion which substantially corresponds to the second coefficient of expansion. In addition, the method comprises a step of local heating of the intermediate glass material in order to join the glass element to the support element via the intermediate glass material.
B23K 26/324 - Assemblage tenant compte des propriétés du matériau concerné faisant intervenir des parties non métalliques
B23K 26/0622 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples par commande directe du faisceau laser par impulsions de mise en forme
The invention relates to a method for producing a semiconductor assembly, in particular connecting a semiconductor chip to a heat sink. A first metal layer consisting of Pb, Cd, In or Sn is made so thin that it is bonded by means of an opposing second metal layer consisting of another metal, for example gold, in a layer consisting of intermetallic phases. This can prevent migration of the soft metals. The brittle intermetallic layer is prevented from fracturing by a continuous pressing force.
The invention relates to an optical module (100) for modifying a light beam (110). The optical module (100) is made of a single-piece solid body material and has a passage surface (105) for receiving the light beam (110). The optical module (100) additionally comprises a beam deflecting region (115) lying opposite the passage surface (105) for deflecting the light beam (110), said beam deflecting region (115) being designed as a curved region on the exterior (120) of the optical module (100) in particular so as to have a hollow mirror function, a pass-through surface (140) for outputting the light beam (125) deflected by the beam deflecting region (115), and a beam shaping region (130) which is designed to shape the light beam (110) and additionally or alternatively thereto the deflected light beam (125) such that the light beam has a beam profile with a homogeneous intensity distribution over a specified range.
The invention relates to a method (100) for integrally bonding a glass element to a support element, the method (100) comprising a step (105) of inserting at least one contact element into a contact recess in a surface of the support element. In addition, the method (100) comprises a step (110) of placing the glass element on a portion of the contact element which portion protrudes beyond the surface, and a step (115) of locally heating the contact element in order to connect the glass element to the support element via the contact element. The method (100) also comprises a step (210) of coating at least part of the contact recess (310) with a separating layer (315) prior to the step (105) of insertion.
The invention relates to a method (100) of producing an etching mask, wherein the method (100) comprises a step (105) of providing a substrate, and a step (110) of applying a metal layer, wherein the metal layer comprises or is formed from at least one transition metal and/or aluminium, a step (115) of applying a masking layer, a step (120) of structuring the masking layer, wherein the metal layer is exposed in at least one processing region, a step (125) of coating the substrate with a tetrel layer including at least one tetrel, wherein an interdiffusion zone between the transition metal or aluminium and the tetrel is formed in the processing region at an interface between the metal layer and the tetrel layer, a step (130) of removing the masking layer, and a step (135) of selectively etching the metal layer, wherein the substrate is exposed in at least one etching region other than the processing region, and the metal layer is at least partly maintained in the processing region.
H01L 21/3213 - Gravure physique ou chimique des couches, p. ex. pour produire une couche avec une configuration donnée à partir d'une couche étendue déposée au préalable
H01L 21/768 - Fixation d'interconnexions servant à conduire le courant entre des composants distincts à l'intérieur du dispositif
The invention relates to a method for testing optoelectronic chips (1) that are arranged on a wafer and comprise electric interfaces in the form of contact pads (1.1) and optical interfaces, which are arranged in a fixed manner relative to the electric interfaces, in the form of optical deflecting elements (1.2), e.g. grating couplers, at a specified coupling angle (α). In the process, the wafer is adjusted in three adjustment steps in such a manner that one of the chips (1) is positioned relative to a contacting module (2) such that the electric interfaces of the chip (1) and the contacting module (2) are in contact with one another and the optical interfaces of the chip (1) and the contacting module (2) assume a maximum position of the optical coupling.
The invention relates to a dome-shaped device (102) for orienting an upper element (104) relative to a lower element (106), having a connecting portion (110) for connecting the dome-shaped device (102) to a lifting arm (108) of a positioning device (100). An outer dome element (112) is connected to the connecting portion (110) and has a concave contact surface. A central dome element has a convex outer surface and a concave inner surface. The central dome element is movable relative to the outer dome element (112). A ram element movably connected to the connecting portion (110) is provided for pressing the central dome element onto the outer dome element (112). A receiving element (114) connected to the central dome element serves to receive the upper element (104). A magnet element (116) is located on the outer dome element (112) and is designed to provide a magnetic force for fixing the central dome element with respect to the outer dome element (112).
B25J 19/00 - Accessoires adaptés aux manipulateurs, p. ex. pour contrôler, pour observerDispositifs de sécurité combinés avec les manipulateurs ou spécialement conçus pour être utilisés en association avec ces manipulateurs
F16M 11/14 - Moyens pour la fixation des appareilsMoyens permettant le réglage des appareils par rapport au banc permettant la rotation dans plus d'une direction avec articulation à rotule
F16M 11/18 - Têtes des supports avec mécanisme déplaçant les appareils par rapport au banc
The present invention relates to an apparatus (100) for capturing an optical property of a workpiece (105). The apparatus (100) has a mirror device (110), which focusses on the input side and is shaped to direct light (120) from a light source (125) to a holding area (130) for holding the workpiece (105). The apparatus (100) further has a mirror device (115), which focuses on the output side and is shaped to direct the light (120) from the holding area (130) to a capturing device (135).
G01B 11/06 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur pour mesurer l'épaisseur
C23C 14/54 - Commande ou régulation du processus de revêtement
G01N 21/17 - Systèmes dans lesquels la lumière incidente est modifiée suivant les propriétés du matériau examiné
38.
Method and evaluation unit for determining a time of a flank in a signal
The invention relates to a method for determining a time of a flank in a signal, wherein the method comprises a step of reading the signal and has a master clock rate for operating a digital evaluation unit for evaluating the time of the flank. The method also comprises a step of forming a data word representing the signal, using a deserializer of a SERDES cell, wherein the data word has a plurality of bits, and wherein a sampling clock rate is applied to the SERDES cell for sampling the signal, which sampling clock rate is higher than the master clock rate, wherein one flank or two flanks of the sampling clock rate are used for sampling the signal. Finally, the method comprises a step of determining the time of the flank in the signal using the data word and the master clock rate in the evaluation unit.
A method for the three-dimensional measurement of a setting from a great distance, and a laser scanning device suitable for this purpose. The field of view of a laser scanning device is divided into virtual receiver cells forming a row or a matrix which, in a scanning direction, are many times smaller than a measurement field within the field of view to which a laser pulse is applied. A receiver signal is formed from the portion of the laser pulse that is reflected from a measurement field and detected, and the receiver signal is digitized and allocated to each virtual receiver cell that lies in the measurement field in question. The virtual receiver cells are thus allocated multiple digitized receiver signals from which an accumulated receiver signal is formed.
G01B 11/22 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la profondeur
41.
CONDENSER UNIT FOR PROVIDING DIRECTED LIGHTING OF AN OBJECT TO BE MEASURED POSITIONED IN A MEASURED OBJECT POSITION, IMAGING DEVICE AND METHOD FOR RECORDING A SILHOUETTE CONTOUR OF AT LEAST ONE OBJECT TO BE MEASURED IN A MEASURING FIELD USING AN IMAGING DEVICE AND USE OF AN ATTENUATION ELEMENT
The present invention relates to a condenser unit (100) for providing directed lighting of an object to be measured (110) positioned in a measured object position (001), wherein the condenser unit (100) comprises a light source (120) for emitting a light beam (105) and an optical element (125) having a positive refractive power. The condenser unit (100) further comprises at least one attenuation element (300) arranged in a common optical axis (130) with the light source (120) and the optical element (125), which attenuation element comprises a location-dependent light intensity attenuation effect for the light beam (105) incident on the attenuation element (300), more particularly wherein the light intensity attenuation effect declines from the optical axis (130) towards an edge of the attenuation element (300).
A radial force device for a contour measuring instrument for measuring a contour of a shaft-shaped workpiece which can be rotated about an axis of rotation. The radial force device has a clamping body, a force introduction roller, at least one counter-roller and a coupling device. The clamping body is shaped for fitting radially around a workpiece portion, received in the contour measuring instrument, of the workpiece. The force introduction roller is designed to apply a mechanical radial force to the workpiece in order to apply a load to the workpiece, wherein the force introduction roller is mounted in a radially movable manner on the clamping body. The counter-roller is mounted in the clamping body and designed to support the workpiece during the application of the force. The coupling device is shaped for coupling the clamping body to the contour measuring instrument.
x,yx,y (3)) of the sub-mirror (130) of the scanner (125) in order to obtain a structure marking (150) on the object (140) to be machined. The method (300) also has a step of detecting (330) at least one structure marking position (145) of a structure marking (150) on the object (140) to be machined positioned in the detection region (152) of the camera (110) of the laser-scanner device (100). During the detection step, the position of at least one sub-mirror (130) of the scanner (125) of the laser-scanner device (100) is aligned such that the structure marking (150) is imaged on a specified region (200) of the image capturing sensor (155) of the camera (110). The method (300) additionally has a step of comparing (340) the structure marking position (145) of the structure marking (150) with the reference marking position (167) and a step of calculating at least one correction value (182) for imaging the structure marking position (145) onto the reference marking position (167) if the structure marking position (145) deviates from the reference marking position (167) by more than a tolerance range (210). The correction value (182) represents a change in the aligned position of the at least one sub-mirror (130) of the scanner (125) by which the sub-mirror (130) of the scanner (125) is to be rotated in order to bring the structure marking position (145) into the tolerance range (210) about the reference marking position (167). Finally, the method (300) has a step of using (350) the at least one correction value (182) to align a light beam (120) of the laser light source (120) for structuring objects (170) to be machined in order to calibrate the laser-scanner device (100) for machining material.
The invention relates to a contacting module and a method for assembling a contacting module with an optical module (1), containing an optical block (1.1) made of glass, and with an electronics module (2), the optical block (1.2) being connected via an adhesive connection to the electronics module (2) or the optical module (1) having a mounting plate (1.2), which is mounted on the electronics module (2) so as to be repeatedly releasable therefrom and is connected to the optical block (1.1) via an adhesive connection. The adhesive connection is produced via at least three cylinder pins (5), which each bear with a first end face (5.1) against the optical block (1.1) by means of an adhesive (9) and are glued in through-bores (7) in the carrier plate (2.1) or the mounting plate (1.2).
optopteleeleopteleele) have a defined alignment position relative to each other. The optical module (1) contains a mounting plate (1.2), which is connected to the electronic module (2) by means of a repeatedly releasable, reproducible connection.
The invention relates to a method for producing an optical component consisting of at least two individual parts, which together enclose an open cavity, wherein the inner sides delimiting the cavity are coated or structured, and from which previously material has been removed in zones in the region of the free aperture, wherein said region is recoated and the individual parts are connected to one another by wringing. The wringing height is greater than the removal height plus the height of the coating. The invention also relates to optical components which are produced according to this method.
The invention relates to a method for producing an optical device (200). The method comprises a step of providing a substrate (210), on the first main surface (212) of which a plurality of emission apparatuses (220) for emitting electromagnetic radiation (250, 255) is disposed. The substrate (210) is in the form of a light-emitting diode wafer and/or is made of sapphire or gallium nitride and is transparent at least for an emission wavelength of the radiation (250, 255) emitted by the emission apparatuses (220). The method also comprises a step of applying an absorption material (230) on the side of the first main surface (212) of the substrate (210). The absorption material (230) comprises a photostructurable coating which is absorbent at least for the emission wavelength. The method also comprises a step of processing the absorption material (230) in order to expose at least one emission surface (227) of each emission apparatus (220). A determination of the position of surfaces to be exposed is carried out from a second main surface (214) of the substrate (210), which second main surface lies opposite the first main surface (212). The method also comprises a step of dividing the substrate (210) into a plurality of optical devices (200) by means of a severing production process, each optical device (200) having at least one emission apparatus (220).
H01L 33/00 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails
H01L 33/44 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les revêtements, p.ex. couche de passivation ou revêtement antireflet
H01L 23/544 - Marques appliquées sur le dispositif semi-conducteur, p. ex. marques de repérage, schémas de test
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
H01L 33/38 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les électrodes ayant une forme particulière
The invention relates to an athermalized device for generating laser radiation that is focused in a focal point, comprising a lens and a plastic housing and a passive adjustment system for adjusting the object distance S1. The passive adjustment device has an effective coefficient of thermal expansion (I)
.
H01S 5/02253 - Découplage de lumière utilisant des lentilles
H01S 3/04 - Dispositions pour la gestion thermique
G02B 7/02 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles
G02B 3/04 - Lentilles simples ou composées à surfaces non sphériques à surfaces continues engendrées par une rotation autour d'un axe, mais s'écartant d'une véritable sphère
The invention relates to a hybrid objective having a fixed focal length, which has five lenses. The objective is suitable for use in a LIDAR measurement system. Moreover, the use of a bi-aspherical plastic lens for correcting the curvature of the image field and/or astigmatism and/or distortion of an imaging objective is proposed.
G02B 9/34 - Objectifs optiques caractérisés à la fois par le nombre de leurs composants et la façon dont ceux-ci sont disposés selon leur signe, c.-à-d. + ou — ayant uniquement quatre composants
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
G02B 13/06 - Objectifs panoramiquesLentilles dites "de ciel"
G02B 13/16 - Objectifs optiques spécialement conçus pour les emplois spécifiés ci-dessous à utiliser en combinaison avec des convertisseurs ou des amplificateurs d'image
G02B 13/18 - Objectifs optiques spécialement conçus pour les emplois spécifiés ci-dessous avec des lentilles ayant une ou plusieurs surfaces non sphériques, p. ex. pour réduire l'aberration géométrique
G02B 13/22 - Objectifs ou systèmes de lentilles télécentriques
A camera shutter device having a shutter blade (3.1) which moves abruptly between a first position, in which it covers a transmission zone (TZ) present between the carriers (1.1), and a second position, in which it opens up the transmission zone (TZ). On the shutter blade (3.1), there is provided a slide body (4) which comprises a displaceable permanent magnet (4.1) and which is guided on a linear guide (2.1), the ends (2.1.1) of which are assigned a respective rotatable permanent magnet (5). By oppositely changing the polarization direction (RP) of the rotatable permanent magnets (5) through 180°, the displaceable permanent magnet (4.1) is pulled into the first or second position.
G03B 11/04 - Parasoleils ou couvercles pour évincer la lumière indésirable sur les objectifs, viseurs ou auxiliaires de mise au point
54.
METHOD FOR MAKING A THERMALLY STABLE CONNECTION BETWEEN A GLASS ELEMENT AND A SUPPORT ELEMENT, METHOD FOR PRODUCING AN OPTICAL DEVICE, AND OPTICAL DEVICE
The invention relates to a method (400) for making thermally stable connection between a glass element and a support element, the glass element having a first coefficient of expansion and the support element having a second coefficient of expansion differing from the first coefficient of expansion. The method (400) comprises a step (405) of attaching an intermediate glass material on the support element, the intermediate glass material having a third coefficient of expansion which is substantially the same as the second coefficient of expansion. The method (400) also comprises a step (410) of locally heating the intermediate glass material in order to connect the glass element to the support element by means of the intermediate glass material.
C03C 27/04 - Liaison verre-métal au moyen d'une couche intermédiaire
C03C 27/00 - Liaison de pièces de verre à des pièces en d'autres matériaux inorganiquesLiaison verre-verre par des procédés autres que la fusion
C04B 37/04 - Liaison des articles céramiques cuits avec d'autres articles céramiques cuits ou d'autres articles, par chauffage avec des articles de verre
C03B 23/20 - Réunion de pièces de verre par fusion sans refaçonnage important
B32B 17/06 - Produits stratifiés composés essentiellement d'une feuille de verre ou de fibres de verre, de scorie ou d'une substance similaire comprenant du verre comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique
55.
DEVICE AND METHOD FOR LUMINESCENCE ANALYSIS OF MULTIPLE SAMPLES
The invention relates to a method for generating a camera image that is used to derive a welding contour along which an assembly (1) is to be welded in an image processing-supported laser transmission welding method. The method is characterized in that the transparent component (2) of the assembly (1) is illuminated from a side facing away from the camera (5). The invention also relates to a device which is suitable for carrying out the method, an illuminating device thereof having at least one light source (6) that is arranged in a workpiece holder (4), in which the assembly (1) to be welded is received in a receiving region (4.1), and is oriented towards the receiving region (4.1).
B23K 31/12 - Procédés relevant de la présente sous-classe, spécialement adaptés à des objets ou des buts particuliers, mais non couverts par un seul des groupes principaux relatifs à la recherche des propriétés, p. ex. de soudabilité, des matériaux
57.
Method and device for coupling out a partial beam having a very small beam percentage from an optical beam
The invention relates to a device comprising a beam splitter and a method of using the device. The device comprises a beam emitting unit and a downstream beam splitter, which is formed by two adjacent planar plates of different materials. For a specified wavelength range of an optical beam from which a partial beam is to be coupled out by reflection, the material of the first planar plate has a minimum refractive index which is greater by a refractive index interval than the maximum ref ractive index of the material of the second planar plate. From the optical beam, which, collimated and linearly polarized parallel to a plane of incidence, impinges on the beam splitter at a certain angle of incidence, the partial beam having only a small summary percentage of the optical beam and a small spectral fluctuation range is coupled out.
The invention relates to a hybrid objective with fixed focal length, which has a total of four lenses. Two lenses consist of glass and two lenses consist of plastic. The objective is suitable for use in a LIDAR measurement system.
G02B 13/00 - Objectifs optiques spécialement conçus pour les emplois spécifiés ci-dessous
G02B 9/34 - Objectifs optiques caractérisés à la fois par le nombre de leurs composants et la façon dont ceux-ci sont disposés selon leur signe, c.-à-d. + ou — ayant uniquement quatre composants
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
G02B 13/14 - Objectifs optiques spécialement conçus pour les emplois spécifiés ci-dessous à utiliser avec des radiations infrarouges ou ultraviolettes
G02B 13/22 - Objectifs ou systèmes de lentilles télécentriques
The invention relates to a hybrid objective with fixed focal length, which has a total of four lenses. Two lenses consist of glass and two lenses consist of plastic. The objective lens is suitable for use in a LIDAR measurement system.
G02B 27/00 - Systèmes ou appareils optiques non prévus dans aucun des groupes ,
G02B 13/18 - Objectifs optiques spécialement conçus pour les emplois spécifiés ci-dessous avec des lentilles ayant une ou plusieurs surfaces non sphériques, p. ex. pour réduire l'aberration géométrique
G02B 13/16 - Objectifs optiques spécialement conçus pour les emplois spécifiés ci-dessous à utiliser en combinaison avec des convertisseurs ou des amplificateurs d'image
G02B 13/14 - Objectifs optiques spécialement conçus pour les emplois spécifiés ci-dessous à utiliser avec des radiations infrarouges ou ultraviolettes
G02B 9/56 - Objectifs optiques caractérisés à la fois par le nombre de leurs composants et la façon dont ceux-ci sont disposés selon leur signe, c.-à-d. + ou — ayant uniquement quatre composants disposés + —— + tous les composants étant des lentilles simples
The invention relates to a method for testing optoelectronic chips (1) that are arranged on a wafer and comprise electric interfaces in the form of contact pads (1.1) and optical interfaces in the form of optical deflection elements (1.2), e.g. grating couplers, which are arranged in a fixed manner relative to the electric interfaces and have a specific coupling angle (a). The wafer is adjusted in three adjustment steps in such a manner that one of the chips (1) is positioned relative to a contacting module (2) such that the electric interfaces of the chip (1) and the contacting module (2) are in contact with one another and the optical interfaces of the chip (1) and the contacting module (2) assume a maximum position of the optical coupling.
The invention relates to a method for producing a semiconductor assembly, in particular connecting a semiconductor chip to a heat sink. A first metal layer consisting of Pb, Cd, In or Sn is made so thin that it is bonded by means of an opposing second metal layer consisting of another metal, for example gold, in a layer consisting of intermetallic phases. This can prevent migration of the soft metals. The brittle intermetallic layer is prevented from fracturing by a continuous pressing force.
09 - Appareils et instruments scientifiques et électriques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Scientific, research, optical, measuring and testing
instruments and systems (contained in this class);
opto-electronical measuring instruments and systems and
components thereof; optical sensing devices; sensor cards,
sensing devices and parts and components thereof; measuring
stations for testing and examination of integrated ciruits
and semiconductor elements and for needle tests; sensor
cards for use in connection with testing of integrated
circuits and semiconductor devices; optical waveguide
sensors or electronic components for use in wafer testing of
circuits; positioning fixture for testing of integrated
circuits and semiconductor devices; optical inspection
apparatus for semiconductor elements and integrated
circuits; testing, inspection and examination instruments
for electrical and electro-optical reliability testing of
integrated circuits and semiconductor elements;
opto-electronical testing, measuring and examination
equipment, especially for micro-opto-electrical-mechanical
systems (MOEMS), micro-electro-mechanical systems (MEMS),
wafer, optical and electronical elements and systems,
electronic chips, computer-chip sets, electronic chip cards,
chips with integrated circuits; photonic-integrated circuits
(PICs); software for control of afore-mentioned instruments,
apparatus and systems; computer programs for electronical,
optical and opto-electronical instruments, apparatus and
systems. Scientific and technological services as well as research
activities and designing services relating thereto; services
of engineers; industrial analysis; industrial research;
design and planning of opto-electronical apparatus and
instruments; design of optical and micro-optical elements
and systems; development, programming and implementing
software, especially for electronical, optical and
opto-electronical instruments, apparatus, measuring and
testing systems.
The invention relates to a laser assembly (1) comprising a diode laser bar (2), a heat sink (4) and at least one cover (7). The laser bar is located between the heat sink and the cover. The heat sink and/or the cover is/are coated with nanowires (16) or nanotubes via which the contact between the laser bar and the heat sink and/or the cover is established.
The invention relates to an LED illumination apparatus having a group of at least three LED dice that are electrically connected in series. Here, the upper-side second connection (11.b) of the first LED die (8. a) is electrically connected to the upper-side third connection (11.c) of the second LED die (8.b) by way of a bond wire (6). In addition, the lower-side fourth connection (11.d) of the second LED die (8.b) is electrically connected to the lower-side fifth connection (11.e) of the third LED die (8.c) by way of a conductor track (5) located on the carrier (3). In this case, the second upper-side connection (11.b), the fourth lower-side connection (11.d) and the sixth upper-side connection (11.f) are either all embodied as cathode connections or are all embodied as anode connections.
H01L 25/075 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
65.
PRINTING METHOD FOR PRODUCING A MULTI-LAYER COMPONENT WITH ONLINE PROCESS CONTROL AND A DEVICE SUITABLE FOR THIS PURPOSE
The invention relates to a printing method for producing a multi-layer component, in which processing radiation is applied to material layers, layer by layer, along processing sites, during which radiation coming from the processing sites is received, the received radiation is split into a spectrum associated with the respective processing site and the spectra are analysed. The analysis is carried out, in particular, on the basis of reference spectra which are stored or which are learned during the printing method. The invention also relates to a device suitable for this purpose.
B22F 3/105 - Frittage seul en utilisant un courant électrique, un rayonnement laser ou un plasma
B29C 64/153 - Procédés de fabrication additive n’utilisant que des matériaux solides utilisant des couches de poudre avec jonction sélective, p. ex. par frittage ou fusion laser sélectif
B29C 64/268 - Agencements pour irradiation par faisceaux laserAgencements pour irradiation par faisceaux d’électrons [FE]
B29C 64/393 - Acquisition ou traitement de données pour la fabrication additive pour la commande ou la régulation de procédés de fabrication additive
The invention relates to a method (700) for determining a time of a flank (200) in a signal (132), wherein the method (700) comprises a step of reading (710) the signal (132) and has a master clock (210) for operating a digital evaluation unit (125) for evaluating the time of the flank (200). The method (700) also comprises a step of forming (720) a data word (220) representing the signal (132), using a deserializer (310) of a SERDES cell (300), wherein the data word (220) has a plurality of bits, and wherein a sampling clock (205) is applied to the the SERDES cell (300) for sampling the signal (132), which sampling clock is higher than the master clock (210), wherein one flank or two flanks of the sampling clock (205) are used for sampling the signal (132). Finally, the method (700) comprises a step of determining (730) the time of the flank (200) in the signal (132) using the data word (220) and the master clock (210) in the evaluation unit (125).
G01R 13/02 - Dispositions pour la présentation de variables électriques ou de formes d'ondes pour la présentation sous forme numérique des variables électriques mesurées
H03K 5/1534 - Détecteurs de transition ou de front
H03M 9/00 - Conversion parallèle/série ou vice versa
68.
Transmitting device with a scanning mirror covered by a collimating cover element
A transmitting device, preferably containing at least two laser diodes and a scanning mirror, which is deflectable about its center (MP) and is arranged in a housing with a transparent cover element. The cover element is formed, at least in a coupling-out region, by a section of a monocentric hemispherical shell (HK) with a center of curvature (K) and is arranged to cover the scanning mirror in such a way that the center of curvature (K) of the hemispherical shell (HK) and the center (MP) of the scanning mirror coincide, and is formed in a coupling-in region by an optical block, comprising a toroidal entrance surface, in the special form of a cylindrical surface, at least one toroidal exit surface and at least two first mirror surfaces arranged between them, for deflecting and pre-collimating the laser beams.
H04B 10/00 - Systèmes de transmission utilisant des ondes électromagnétiques autres que les ondes hertziennes, p. ex. les infrarouges, la lumière visible ou ultraviolette, ou utilisant des radiations corpusculaires, p. ex. les communications quantiques
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
G01S 17/42 - Mesure simultanée de la distance et d'autres coordonnées
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
The invention relates to an optical unit (125), in particular a beam expander, having a first optical element (130), which is disposed in an optical path (120) and which has a first structure (210) on a first surface (200) disposed in the optical path (120), the first structure (210) having recesses (220) in the first surface (200) of the first optical element (130), which recesses have a decreasing cross-section as their depth increases in the direction of the first optical element (130). The optical unit (125) also comprises a second optical element (135), which is disposed in the optical path (120) and which has a second structure (275) on a second surface (270) disposed in the optical path (120), the second structure (275) containing recesses in the second surface (270) of the second optical element (135), which recesses have a decreasing cross-section as their depth increases in the direction of the second optical element (135).
G02B 27/09 - Mise en forme du faisceau, p. ex. changement de la section transversale, non prévue ailleurs
G02B 1/118 - Revêtements antiréfléchissants ayant des structures de surface de longueur d’onde sous-optique conçues pour améliorer la transmission, p. ex. structures du type œil de mite
70.
Transmitting device for a LIDAR scanner having a scanning mirror covered by a cover element
A transmitting device, containing an emitting device (1) and a scanning mirror (2), which is deflectable about its center (MP) and is arranged in a housing (3) with a transparent cover element (4). The cover element (4) is formed, at least in a coupling-out region (4.2), by a section of a monocentric hemispherical shell (HK) with a center of curvature (K) and is arranged to cover the scanning mirror (2) in such a way that the center of curvature (K) of the hemispherical shell (HK) and the center (MP) of the scanning mirror (2) coincide.
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
G01S 17/42 - Mesure simultanée de la distance et d'autres coordonnées
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
Surface measuring apparatus for measuring a surface of a workpiece has a probe for contacting the surface of workpiece, a feed apparatus for moving probe relative to surface of the workpiece along a feed axis for sampling surface of workpiece. The probe outputs a probe output signal during sampling of the workpiece. An evaluation apparatus is in data transmission connection with probe and is designed and programmed to reconstruct the profile of the surface of workpiece based on the probe output signal. Evaluation apparatus is designed and programmed to determine an apparatus frequency signature representing characteristic natural frequencies of the surface measuring apparatus, and an analyzer is provided which detects and analyzes the temporal course of the apparatus frequency signature, such that the functional state of the surface measuring apparatus is assessed based on the temporal course of the apparatus frequency signature.
G01B 5/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer la rugosité ou l'irrégularité des surfaces
72.
OPTICAL UNIT AND METHOD FOR OPERATING AN OPTICAL UNIT
The present invention relates to an optical unit (100) having a refraction element (105), which is designed to refract a beam (122) of electromagnetic radiation emitted by a radiation source (125) onto an object (135). The optical unit (100) further comprises a sensor element (140), which is designed to contactlessly detect a temperature on at least one partial region (148) of the refraction element (105) and, in response to the temperature, to output a temperature signal (142).
G02B 7/00 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques
G02B 7/02 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles
G02B 7/08 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles avec mécanisme de mise au point ou pour faire varier le grossissement adaptés pour fonctionner en combinaison avec un mécanisme de télécommande
G02B 7/18 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour prismesMontures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour miroirs
The invention relates to an adjustment mount (0) for the radial adjustment of an optical unit having an optical axis, containing a support (1) and an auxiliary mount (2) which is radially adjustable with respect thereto via adjusting devices (3). The adjusting devices (3) each contain a set screw (3.1) of which the ends are arranged in cylindrical elements (3.2, 3.3) which are rotatably mounted in the support (1) and in the auxiliary mount (2). This allows the set screws (3.1) to perform compensating movements during the adjustment, which allows a force-free radial adjustment in one adjustment plane. To fix an adjustment position, the auxiliary mount (2) is held clamped between two cover elements (4) which are fastened to the support (1) and braced together such that, during and after fixing, only moments or forces acting perpendicularly on the adjustment plane are effective. The invention also relates to an apparatus having at least two adjustment mounts (0). The supports (1) of the adjustment mounts (0) can advantageously be different components of a common frame.
09 - Appareils et instruments scientifiques et électriques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Scientific, research, optical, measuring and testing instruments and systems comprised of computer hardware, cameras, and probe cards for wafer probers; opto-electronical measuring instruments and systems, namely, probe cards for wafer probers and structural components thereof; optical sensors; sensor cards, and sensors for testing of photonic integrated circuits and parts and components thereof; measuring stations for testing and examination of integrated circuits and semiconductor elements, namely, probe cards for wafer level testing of photonic integrated circuits; sensor cards for use in connection with testing of integrated circuits and semiconductor devices; optical waveguide sensors or electronic components for computers for use in wafer testing of circuits; positioning fixture for testing of integrated circuits and semiconductor devices; optical inspection apparatus for semiconductor elements and integrated circuits; testing, inspection and examination instruments for electrical and electro-optical reliability testing of integrated circuits and semiconductor elements; opto-electronical testing, and measuring equipment for micro-opto-electrical-mechanical systems (MOEMS), micro-electro-mechanical systems (MEMS), semi-conductor wafer, optical and electrical elements and integrated circuit systems, blank electronic chip cards, blank computer-chip sets, encoded electronic chip cards and blank electronic chips with integrated circuits; photonic-integrated circuits (PICs); downloadable, recorded software for control of afore-mentioned instruments, apparatus and systems; downloadable, recorded computer programs for operating electronic, optical and opto-electronical instruments, apparatus and systems Scientific and technological services, namely, testing of photonic integrated circuits and designing testing equipment therefor as well as technical research activities and designing services relating thereto; engineering; industrial research in the field of testing of photonic integrated circuits; design and planning of opto-electronical apparatus and instruments; design of optical and micro-optical integrated circuit and semi-conductor elements and systems; development, programming and implementing software for operation of electronic, optical and opto-electronic instruments, apparatus, measuring and testing systems
09 - Appareils et instruments scientifiques et électriques
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
(1) Opto-electronical measuring instruments and systems, namely, probe cards for wafer probers and structural components thereof; optical sensors; measuring stations for testing and examination of integrated circuits and semiconductor elements, namely, probe cards for wafer level testing of photonic integrated circuits; positioning fixtures namely probes for testing integrated circuits and semiconductors; testing, inspection and examination instruments, namely probe cards for use in wafer probers, for electrical and electro-optical reliability testing of integrated circuits and semiconductor elements; photonic-integrated circuits (PICs); software for controlling and operating testing, inspection and examination instruments, namely probe cards, for electrical and electro-optical reliability testing of integrated circuits and semiconductor elements. (1) Scientific and technological services, namely, testing of photonic integrated circuits and designing testing equipment therefor as well as technical research activities and designing services relating thereto.
76.
LASER SCANNING DEVICE AND METHOD FOR THE THREE-DIMENSIONAL MEASUREMENT OF A SETTING FROM A GREAT DISTANCE
The invention relates to a method for the three-dimensional measurement of a setting from a great distance, and a laser scanning device suitable for this purpose. The field of view (FOV) of a laser scanning device is divided into virtual receiver cells (VE) forming a row or a matrix which, in a scanning direction (Rs), are many times smaller than a measurement field (M) within the field of view (FOV) to which a laser pulse (LP) is applied. A receiver signal is formed from the portion (LP) of the laser pulse (LP) that is reflected from a measurement field (M) and detected, and said receiver signal is digitalised and allocated to each virtual receiver cell (VE) that lies in the measurement field (M) in question. The virtual receiver cells (VE) are thus allocated multiple digitalised receiver signals from which an accumulated receiver signal is formed.
The invention relates to a method for soldering a component onto a substrate (8). According to this method, the solder is provided in the form of solder wire (20) or strip solder (20) and is applied to a mounting surface or fastening surface by an ultrasonic bonder. The component is then placed on the solder and the solder is melted. The solder solidifies while forming a solder joint between the component and the substrate (8).
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
H01L 23/49 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes formées de structures soudées du type fils de connexion
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/40 - Fabrication de fils ou de barres pour le brasage ou le soudage
H01L 33/62 - Dispositions pour conduire le courant électrique vers le corps semi-conducteur ou depuis celui-ci, p.ex. grille de connexion, fil de connexion ou billes de soudure
H01S 5/024 - Dispositions pour la gestion thermique
H01S 5/40 - Agencement de plusieurs lasers à semi-conducteurs, non prévu dans les groupes
H01L 23/373 - Refroidissement facilité par l'emploi de matériaux particuliers pour le dispositif
H01L 23/427 - Refroidissement par changement d'état, p. ex. caloducs
The invention relates to a method for measuring the surface of workpieces, which are machined on a machine tool, such as a lathe, milling machine or grinding machine, by means of a machining tool, wherein the surface of the workpiece is scanned using a measurement sensor in order to obtain measurement data representing the surface shape of the workpiece, the measurement data being evaluated in an evaluation device which is connected or can be connected to the measurement sensor for data transmission. According to the invention, a state of wear of the machining tool is determined by the evaluation device on the basis of tool wear-dependent tool traces represented in the measurement data.
B23Q 17/09 - Agencements sur les machines-outils pour indiquer ou mesurer pour indiquer ou mesurer la pression de coupe ou l'état de l'outil de coupe, p. ex. aptitude à la coupe, charge sur l'outil
B23Q 17/20 - Agencements sur les machines-outils pour indiquer ou mesurer pour indiquer ou mesurer les caractéristiques de la pièce, p. ex. contour, dimensions, dureté
G01B 5/28 - Dispositions pour la mesure caractérisées par l'utilisation de techniques mécaniques pour mesurer la rugosité ou l'irrégularité des surfaces
G05B 19/4065 - Contrôle du bris, de la vie ou de l'état d'un outil
A monocentric reception arrangement comprising an optical system (1), in the spherical focal plane (BF) of which the imaged overall image of an object field is subdivided into partial images by field lenses (3.1) of a field lens array (3) arranged here and the partial beams in each case involved in a partial image are collimated by way of a downstream collimator lens (6.1) in each case onto in each case one receiver (5.1) of an optoelectronic receiver array (5). An aperture stop is arranged in a plane of each receiver surface of one of the receivers (5.1), the image of said aperture stop being the entrance pupil, in the center of which lies the common center of curvature (MP) of the spherical entrance surface (2) and the curvature of the field lens array (3). Each partial beam illuminates one of the receiver surfaces with the same beam diameter.
G02B 9/64 - Objectifs optiques caractérisés à la fois par le nombre de leurs composants et la façon dont ceux-ci sont disposés selon leur signe, c.-à-d. + ou — ayant plus de six composants
09 - Appareils et instruments scientifiques et électriques
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Machines and machine tools for processing of materials and
manufacturing, in particular laser material processing
machines for melting, sintering, build-up welding,
stripping, working of surfaces and/or remelting using
lasers; parts and fittings of the preceding machines and
machine tools included in this class. Optical instruments and equipment, in particular optical
and/or optoelectronic components and systems consisting
thereof for integration in laser production installations
for micro material processing; software and computer
hardware for monitoring, controlling and execution of
proceedings in the physical world, in particular for laser
material processing; artificial intelligence software and
machine learning software; scientific research and
laboratory apparatus, educational apparatus and simulators;
optical and/or optoelectronic components and systems
consisting thereof for machine tools and handling apparatus. Treatment of materials, namely laser material processing for
engraving, inscribing, labelling, for welding and cutting
operations and micro material processing. Scientific and technological services and research relating
thereto in the field of technology, particular in laser
material processing; industrial analysis and research
services, in particular in connection with optical and/or
optoelectronic components and systems for laser material
processing; technical consultancy for laser material
processing, in particular for creating prototypes;
engineering; technical project planning; design and
development of computer software, in particular in
connection with optical and/or optoelectronic components and
systems for laser material processing.
82.
APPARATUS AND METHOD FOR FOCUS ADJUSTMENT FOR A MATERIAL PROCESSING DEVICE, AND DEVICE FOR LASER MATERIAL PROCESSING
The invention relates to an apparatus (112) for focus adjustment for device (100) for laser material processing having a movably arranged first lens unit (124) comprising a first lens (108), and a movably arranged second lens unit (126) comprising a second lens (110). Said apparatus has an adjustment device (114) designed to move the first lens unit (124) into a first direction (116) and the second lens unit (126) into a second direction (118) that is opposite the first direction (118) in order to adjust a distance between the first lens (108) and the second lens (110) for the focus adjustment.
G02B 7/08 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles avec mécanisme de mise au point ou pour faire varier le grossissement adaptés pour fonctionner en combinaison avec un mécanisme de télécommande
B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
G02B 15/14 - Objectifs optiques avec moyens de faire varier le grossissement par déplacement axial d'au moins une lentille ou de groupes de lentilles relativement au plan de l'image afin de faire varier de façon continue la distance focale équivalente de l'objectif
09 - Appareils et instruments scientifiques et électriques
Produits et services
Thermal cameras; observation devices; parts and components
for all the foregoing goods, in particular IR modules for
providing digital IR image data streams, in particular
containing a thermal IR image sensor.
The invention relates to the production of an optical or optoelectronic assembly (1, 2) comprising an active component (5) and a cooler (3). The cooler (3) is produced by means of a 3D printing method on a composite plate (6).
H01S 5/024 - Dispositions pour la gestion thermique
B33Y 80/00 - Produits obtenus par fabrication additive
H01L 33/64 - DISPOSITIFS À SEMI-CONDUCTEURS NON COUVERTS PAR LA CLASSE - Détails caractérisés par les éléments du boîtier des corps semi-conducteurs Éléments d'extraction de la chaleur ou de refroidissement
H01S 5/40 - Agencement de plusieurs lasers à semi-conducteurs, non prévu dans les groupes
B33Y 70/00 - Matériaux spécialement adaptés à la fabrication additive
B22F 3/105 - Frittage seul en utilisant un courant électrique, un rayonnement laser ou un plasma
H01L 21/48 - Fabrication ou traitement de parties, p. ex. de conteneurs, avant l'assemblage des dispositifs, en utilisant des procédés non couverts par l'un uniquement des groupes ou
09 - Appareils et instruments scientifiques et électriques
Produits et services
Image capture devices; cameras; thermal cameras; night
vision cameras; daylight cameras, in particular low-light
cameras; target detection devices; optical observation
devices, comprising a night vision camera and a daylight
camera, in particular comprising a night vision camera and a
low-light camera.
87.
BEAM EXPANDER AND METHOD FOR OPERATING A BEAM EXPANDER
The invention relates to a beam expander (100) comprising a receiving tube (105) with a light inlet opening (107) and a light outlet opening (109). The beam expander (100) additionally comprises at least one optical unit (112), which is movably arranged in a beam path between the light inlet opening (107) and the light outlet opening (109) of the receiving tube (105) in a movement direction (117), for changing the diameter of a beam bundle (110) coupled in via the light inlet opening (107). The beam expander (100) also comprises a guide unit (120), which is coupled to the optical unit (112), for guiding the optical unit (112) in the receiving tube (105) and a linear drive coupling unit (125), which is mechanically coupled to the guide unit (120), in order to couple and/or convert a movement or rotation of a drive element (127) into a movement of the guide unit (120).
G02B 7/10 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles avec mécanisme de mise au point ou pour faire varier le grossissement par déplacement axial relatif de plusieurs lentilles, p. ex. lentilles d'objectif à distance focale variable
G02B 27/09 - Mise en forme du faisceau, p. ex. changement de la section transversale, non prévue ailleurs
B23K 26/06 - Mise en forme du faisceau laser, p. ex. à l’aide de masques ou de foyers multiples
88.
METHOD AND DEVICE FOR PRODUCING A MULTI-LAYER COMPONENT
The present invention relates to a method (300) for producing a multi-layer component (105), wherein the method (300) has a step (310) of forming a layer (110) of the multi-layer component (105) by subjecting a layer-forming material (150) to a layer-forming beam (115). The method (300) further comprises a step (320) of analysing the formed layer (110) by means of an analysing beam (115) and a step (330) of generating at least one further layer (160) of the multi-layer component (105) by subjecting the layer-forming material (150) to a further layer-forming beam (115) in order to produce the multi-layer component (105).
The invention relates to EPI lighting which allows transmitted light-bright field- or transmitted light-dark field-imaging or phase contrast imaging of a microscopic sample. For this purpose, a flat reflector is used which is located opposite the observer side and which brings about a deflection of the illumination beam of light. The flat reflector has a plane normal and an effective perpendicular which differs from the plane normal, or it is in the form of a retroreflector.
09 - Appareils et instruments scientifiques et électriques
Produits et services
Thermal cameras; observation devices in the nature of infrared cameras and infrared sensors capable of providing night vision image data; parts and components for all the foregoing goods, namely infrared (IR) modules for providing digital infrared (IR) image data streams, in particular containing a thermal infrared (IR) image sensor
09 - Appareils et instruments scientifiques et électriques
40 - Traitement de matériaux; recyclage, purification de l'air et traitement de l'eau
42 - Services scientifiques, technologiques et industriels, recherche et conception
Produits et services
Machines and machine tools for processing of materials and manufacturing, in particular laser material processing machines and machine tools for metal or plastic melting, sintering, build-up welding, stripping, working of surfaces in the nature of laser engraving, laser marking, laser ablation of coatings and remelting using lasers; parts and fittings of the preceding machines and machine tools in the nature of laser material processing machines for processing of metals or plastics Optical instruments and equipment, in particular optical and/or optoelectronic components in the nature of optical lenses, scanners, optical sensors, cameras for machine vision and systems consisting of optical instruments and equipment for integration in laser production installations for micro material processing; downloadable or recorded artificial intelligence software for use in machine learning and speech recognition, downloadable or recorded machine learning software; scientific research and laboratory apparatus, namely, optical instruments and equipment for use in laser material processing machines, educational apparatus and simulators, namely, optical instruments and equipment in the nature of cameras and optical lenses for use in laser material processing machines; optical and/or optoelectronic components in the nature of optical lenses, scanners, optical sensors, cameras for machine vision and systems consisting of optical instruments and equipment for laser material processing apparatus and for machine tools and handling apparatus Treatment of materials, namely laser material processing for engraving, inscribing, labelling, for welding and cutting of metals or plastics and micro material processing, namely laser micro-material processing Scientific and technological services, namely, in relation to laser material processing research in the field of technology, particular in laser material processing; industrial materials and product failure analysis utilizing beam expanders, lenses, scanners, sensors, cameras for machine vision and product research services in connection with optical and/or optoelectronic components and systems for laser material processing; technical consultancy in the field of research and design of laser material processing technology, in particular for creating prototypes; engineering; technical project planning, namely technological planning in the field of laser material processing and computer software and hardware systems for use in the field of laser material processing machines in this field of use; design and development of computer software, in particular in connection with optical and/or optoelectronic components and systems for laser material processing
92.
OBJECTIVE LENS, USE THEREOF FOR LIGHT TRAVEL TIME DETECTION AND MEASURING SYSTEM
The invention relates to a hybrid objective lens with fixed focal length, which has a total of three or four lenses. At least one of the lenses is a spherical glass lens. At least one other lens is made of plastic. The objective lens is suitable for use in a LIDAR measurement system.
G02B 13/00 - Objectifs optiques spécialement conçus pour les emplois spécifiés ci-dessous
G01S 17/10 - Systèmes déterminant les données relatives à la position d'une cible pour mesurer la distance uniquement utilisant la transmission d'ondes à modulation d'impulsion interrompues
G01S 17/93 - Systèmes lidar, spécialement adaptés pour des applications spécifiques pour prévenir les collisions
93.
METHOD AND DEVICE FOR PROCESSING A COMPOSITE MATERIAL BY MEANS OF A LASER, AND COMPOSITE MATERIAL
The invention relates to a method for processing a composite material (102) having a first layer (118) and a second layer (120) by means of a laser beam (108), wherein material of the composite material (102) is removed when the laser beam (108) impinges on a processing region of the composite material (102). The method comprises a step of determining a change, in particular a frequency change and/or an intensity change, using a sensor signal (128) which represents a detection radiation emitted from the processing region (122), a step of illuminating the processing region with illumination radiation differing from the laser beam in order to identify the defined spectrum of the layer or a boundary surface, a step of comparing the change with a predetermined change which is expected during a transition of the processing region from the first layer (118) into a further layer (120), and a step of outputting at least one control signal (134, 138, 140) for controlling the processing as a function of a result of the comparison of the change with the predetermined change.
An adjustable mirror assembly comprising a mirror, a support, a leaf spring element biased between the support and a planar reverse side of the mirror, said leaf spring element generating a spring force, as well as at least two adjusting units mounted in the support and acting on the mirror in opposition to the spring force. The leaf spring element is mounted to the reverse side of the mirror via at least one mirror mounting point by a substance-to-substance bond and to the support via at least one support mounting point. The spring force is directed toward the support.
G02B 7/182 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour prismesMontures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour miroirs pour miroirs
95.
Measuring apparatus for surface or contour measurement
Measuring apparatus for surface or contour measurement on a workpiece has a probe for contacting the surface of workpiece to be measured. Probe has a holding part to which a probe arm is detachably connectable or connected. Measuring apparatus also has a feed apparatus for moving probe relative to workpiece to be measured, and a control apparatus for controlling feed apparatus. A position sensor associated with probe arm and connected to control apparatus is provided, and which detects changes in the position of the probe arm, relative to holding part, from a measuring position into an interference position of probe arm, and generates a position change signal. Control apparatus is designed and programmed in such a way that, as a response to a position change signal, it generates a control signal for controlling feed apparatus in such a way that feed movement of probe is influenced.
rr) which is reduced compared to the thickness (d) of the mount body (1) or each of the two cover rings (6) has a recess by means of which the connection structures are freed.
The invention relates to a mirror assembly comprising a plane mirror (1), a carrier (2) and a supporting structure arranged between the two. Said supporting structure consists of longitudinal strips (5) and transverse connections (6), wherein at least the longitudinal strips (5) are formed by supporting elements (3). Each of the supporting elements (3) is formed by two interconnected leaf springs (3.1) of the same design, wherein at least some of said supporting elements (3) comprise an actuator element (4) disposed between the leaf springs (3.1) thereof, and actuation of such an element results in said leaf springs (3.1) being bent symmetrically to one another such that the plane mirror (1) is deformed by the supporting element (3) in question.
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
The invention relates to a device for capturing microscopic images or video sequences. The main idea of the invention consists in a modular imaging platform in which an imaging module is connected to a support via a releasable connection, and provides for wireless transmission of energy from the support to the imaging module.
The invention relates to a device (102) for optical beam expansion of an optical system having a guide tube (220), a first guide cylinder (222) having a first lens (226), wherein the first guide cylinder (202) is arranged within the guide tube (220) so as to be displaceable along the longitudinal axis of the guide tube (220), and a second guide cylinder (224) having a second lens (228), wherein the second guide cylinder (224) is arranged within the guide tube (220) so as to be displaceable along the longitudinal axis of the guide tube (220). A first displacement device is provided to displace the first guide cylinder (222) along the longitudinal axis (340) of the guide tube (220), and a second displacement device is provided to displace the second guide cylinder (224) along the longitudinal axis of the guide tube (220).
G02B 27/09 - Mise en forme du faisceau, p. ex. changement de la section transversale, non prévue ailleurs
G02B 7/10 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles avec mécanisme de mise au point ou pour faire varier le grossissement par déplacement axial relatif de plusieurs lentilles, p. ex. lentilles d'objectif à distance focale variable
G02B 7/02 - Montures, moyens de réglage ou raccords étanches à la lumière pour éléments optiques pour lentilles
An optical beam shaping unit for shaping a beam bundle. The optical beam shaping unit has at least one ball lens for shaping the beam bundle, wherein the ball lens allows a large portion of the light incident on the ball lens to pass through, and wherein the optical beam shaping unit has at least one optical unit which has a positive effective focal length and which is arranged in a beam path with the ball lens.
G02B 27/09 - Mise en forme du faisceau, p. ex. changement de la section transversale, non prévue ailleurs
G02B 27/20 - Systèmes ou appareils optiques non prévus dans aucun des groupes , pour projection optique, p. ex. combinaison de miroir, de condensateur et d'objectif pour donner une image d'objets minuscules, p. ex. indicateur lumineux
G01S 17/08 - Systèmes déterminant les données relatives à la position d'une cible pour mesurer la distance uniquement
G01S 7/481 - Caractéristiques de structure, p. ex. agencements d'éléments optiques
G01B 11/02 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la longueur, la largeur ou l'épaisseur
