A cold insulation module for the storage and transportation of cryogenic liquefied gas and a preparation method therefor. The cold insulation module is formed by laminating a stainless steel corrugated plate, high-density reinforced polyurethane foam, a glass fiber aluminum foil composite material, and low-density reinforced polyurethane foam in sequence from top to bottom. The preparation method comprises the following steps: (1) preparing an upper structure of a cold insulation module; (2) preparing a lower structure of the cold insulation module; and (3) laminating the upper structure of the cold insulation module and the lower structure of the cold insulation module. The present cold insulation module for the storage and transportation of cryogenic liquefied gas has excellent impact resistance and tensile strength, and can effectively prevent cryogenic liquefied gas from leaking and causing cryogenic damage to a storage container shell, thereby ensuring safety during the storage and transportation of the cryogenic liquefied gas.
F17C 11/00 - Use of gas-solvents or gas-sorbents in vessels
F17C 13/00 - Details of vessels or of the filling or discharging of vessels
B29C 69/00 - Combinations of shaping techniques not provided for in a single one of main groups , e.g. associations of moulding and joining techniquesApparatus therefor
2.
RIGID POLYURETHANE FOAM MATERIAL AND PREPARATION METHOD THEREFOR
Disclosed in the present invention is a rigid polyurethane foam material, comprising: 30-50 parts of a polyfunctional polyether polyol, 30-50 parts of a polyfunctional polyester polyol, 50-80 parts of toluene diisocyanate, 50-80 parts of polymethylene polyphenyl polyisocyanate, 15-30 parts of a foaming aid additive composition, and 5-20 parts of fiberglass continuous mat. Further disclosed in the present invention is a preparation method for the rigid polyurethane foam material, comprising: (1) weighing raw materials; (2) mixing the raw materials except a fiberglass continuous mat; (3) pouring the mixture on the fiberglass continuous mat laid flat, foaming and forming; and (4) curing, cutting and segmenting, and curing again to obtain the rigid polyurethane foam material. The density of the rigid polyurethane foam material of the present invention is 70-210 kg/m3, while ensuring the low-temperature mechanical strength and the thermal insulation performance of the material, the surface flatness is controlled within 5 mm, and the core material utilization rate is increased to 85% or above; the present invention can be widely applied to the field of cryogenic thermal insulation.
B27D 1/06 - Manufacture of central layersForm of central layers
B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure
C08G 18/10 - Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Insulating materials; stuffing of rubber or plastics;
padding materials of rubber or plastics; foils of metal for
insulating; fibreglass for insulation.
4.
Structure of phosphorous-containing functionalized poly(arylene ether), composition containing the same, and copper clad laminate
A structure of phosphorous-containing functionalized poly(arylene ether), a preparation method thereof, and a composition prepared therefrom are provided. The curable (cross-linkable) composition includes an unsaturated monomer and a phosphorous-containing functionalized poly(arylene ether) having a polymerizable group and a molecular weight between 500 and 20,000. The composition provides excellent fluidity and fast curing rate. After curing, the composition exhibits excellent low dielectric coefficient and dielectric loss, high heat resistance and flame retardancy. It is suitable for prepregs, laminated sheets for printed circuits or the like.
C08K 5/5435 - Silicon-containing compounds containing oxygen containing oxygen in a ring
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 5/22 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
A phosphorus-containing polyester composite and method of manufacturing the same is related to the field of compound formulation. The composite is prepared by condensation under certain conditions of (A) a poly-functional phosphorus-containing aromatic hydroxy compound; (B) a difunctional aromatic acryl chloride compound and (C) a monofunctional aromatic phenol compound used as a blocking agent. The composite is used as a curing agent for epoxy. The phosphorus-containing polyester composite is reacted with the epoxy group of the epoxy to obtain non-halogen and flame-retardant cured composite being environment friendly and having low dielectric, low dielectric loss factor and high heat resistance. It can be used in an integrated circuit board and used as a semiconductor packaging material.
C08G 59/00 - Polycondensates containing more than one epoxy group per moleculeMacromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compoundsMacromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
C08G 63/692 - Polyesters containing atoms other than carbon, hydrogen, and oxygen containing phosphorus
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
A composite, a high-frequency circuit substrate using the same and method thereof are discussed. The composite includes the following solid components: a DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide) derivative compound of 10-70 wt %, a curing agent of 10-50 wt %, one or more epoxy of 10-90 wt % and an inorganic filling material of 10-40 wt %. The non-halogen low dielectric epoxy composite uses a high-purity DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide) derivative as tiny particles dispersing in the composite. The crosslinking yield of the composite is not reduced, while the heat resistance and flame retardancy are increased. The prepreg and copper foil covered laminate for use in printed circuit board, made from the epoxy composite, has great dielectric property and high glass transition temperature (GTT), satisfying the need of high frequency in electronic signal transmission and high speed in data processing of the industry of copper covered printed circuit board.
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 5/22 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous
7.
Structure of phosphorous-containing functionalized poly(arylene ether) and compositions prepared therefrom
A structure of phosphorous-containing functionalized poly(arylene ether), a preparation method thereof, and a composition prepared therefrom are provided. The curable (cross-linkable) composition includes an unsaturated monomer and a phosphorous-containing functionalized poly(arylene ether) having a polymerizable group and a molecular weight between 500 and 20,000. The composition provides excellent fluidity and fast curing rate. After curing, the composition exhibits excellent low dielectric coefficient and dielectric loss, high heat resistance and flame retardancy. It is suitable for prepregs, laminated sheets for printed circuits or the like.
C08K 5/5435 - Silicon-containing compounds containing oxygen containing oxygen in a ring
B23B 5/26 - Turning-machines or devices specially adapted for particular workAccessories specially adapted therefor for simultaneously turning internal and external surfaces of a body
B32B 5/02 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by structural features of a layer comprising fibres or filaments
B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
B32B 5/22 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous
B32B 15/14 - Layered products essentially comprising metal next to a fibrous or filamentary layer
B32B 5/26 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer another layer also being fibrous or filamentary
8.
Low-dielectric phosphorus-containing polyester composite and method of manufacturing the same
A phosphorus-containing polyester composite and method of manufacturing the same is related to the field of compound formulation. The composite is prepared by condensation under certain conditions of (A) a poly-functional phosphorus-containing aromatic hydroxy compound; (B) a difunctional aromatic acryl chloride compound and (C) a monofunctional aromatic phenol compound used as a blocking agent. The composite is used as a curing agent for epoxy. The phosphorus-containing polyester composite is reacted with the epoxy group of the epoxy to obtain non-halogen and flame-retardant cured composite being environment friendly and having low dielectric, low dielectric loss factor and high heat resistance. It can be used in an integrated circuit board and used as a semiconductor packaging material.
C08G 63/00 - Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
C08G 65/38 - Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
C08L 67/02 - Polyesters derived from dicarboxylic acids and dihydroxy compounds
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
C08G 63/692 - Polyesters containing atoms other than carbon, hydrogen, and oxygen containing phosphorus
C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins
C08G 59/32 - Epoxy compounds containing three or more epoxy groups
The present disclosure provides a phosphor-containing phenol formaldehyde resin compound having a general formula (I):
The compound is formed of a phenol formaldehyde resin and an aromatic phosphate compound by performing a condensation reaction, which may be used as a curing agent of an epoxy resin. The phenol formaldehyde resin is formed of a phenolic compound, a bisphenol compound and formaldehyde. The present disclosure further provides a phosphor-containing phenol formaldehyde resin cured material which is formed of the phosphor-containing phenol formaldehyde resin compound and an epoxy resin under a high temperature. The phosphor-containing phenol formaldehyde resin compound is added separately or mixed with an epoxy resin curing agent.
C08G 8/10 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
C08K 5/5313 - Phosphinic compounds, e.g. R2=P(:O)OR'
The introduction of environmentally-friendly organic phosphorus group can not only maintain the original excellent properties of epoxy resins, but also meet the high flame-retarding requirements, and have the ability to improve the vitrification temperature (Tg), heat resistance and other characteristics of the material so that the curing system can be successfully applied to the electronic materials field which are light, thin, small and precise, the present disclosure provides a flame-retarding phosphor-containing phenol-formaldehyde novolac and the preparation method thereof, the use of the compound to react with the epoxy group of an epoxy resin to obtain an environmentally-friendly and high performing halogen-free cured flame retarding epoxy resin, and the compound can also be used for curing epoxy resins and gives a high flame-retarding effect.
C08G 59/40 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the curing agents used
C08G 8/24 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with mixtures of two or more phenols which are not covered by only one of the groups
C08G 8/00 - Condensation polymers of aldehydes or ketones with phenols only
C08G 14/00 - Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups
C08G 16/00 - Condensation polymers of aldehydes or ketones with monomers not provided for in the groups
