A compliant probe contact assembly for a testing system for testing integrated circuit devices is provided. The contact assembly includes an upper plunger including a first shoulder separating an upper shaft from a lower shaft, and a retainer proximate an end of the lower shaft. The contact assembly also includes a first receiver and a second receiver configured to engage with the upper plunger, each of the first and second receivers including a second shoulder having a shoulder stop. The contact assembly further includes a biasing member. When the contact assembly is assembled, the biasing member is captured between a bottom of the first shoulder and the shoulder stops of the first and second receivers. The upper plunger separates sides of upper portions of the first and second receivers. Sides of lower portions of the first and second receivers contact with each other.
A compliant probe contact assembly for a testing system for testing integrated circuit devices is provided. The contact assembly includes an upper plunger including a first shoulder separating an upper shaft from a lower shaft, and a retainer proximate an end of the lower shaft. The contact assembly also includes a first receiver and a second receiver configured to engage with the upper plunger, each of the first and second receivers including a second shoulder having a shoulder stop. The contact assembly further includes a biasing member. When the contact assembly is assembled, the biasing member is captured between a bottom of the first shoulder and the shoulder stops of the first and second receivers. The upper plunger separates sides of upper portions of the first and second receivers. Sides of lower portions of the first and second receivers contact with each other.
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
Test fixtures in the nature of testing apparatus for testing printed integrated circuits, and structural parts therefor; contact test pins for testing printed integrated circuit boards, and structural parts therefor; electric sockets for use with integrated circuit testing, and structural parts therefor; housings for printed circuit boards containing electric contacts; semiconductor testing apparatus Engineering services related to test pins for testing circuit boards and integrated circuit chips; technical advice, information and consultancy in relation to testing integrated circuit chips; design and development of test pins for testing integrated circuit chips
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
Test fixtures in the nature of testing apparatus for testing printed integrated circuits, and structural parts therefor; contact test pins for testing printed integrated circuit boards, and structural parts therefor; electric sockets for use with integrated circuit testing, and structural parts therefor; housings for printed circuit boards containing electric contacts; semiconductor testing apparatus Engineering services related to test pins for testing circuit boards and integrated circuit chips; technical advice, information and consultancy in relation to testing integrated circuit chips; design and development of test pins for testing integrated circuit chips
09 - Scientific and electric apparatus and instruments
Goods & Services
Test fixtures in the nature of testing apparatus for testing printed integrated circuits, and structural parts therefor; contact test pins for testing printed integrated circuit boards, and structural parts therefor; electric sockets for use with integrated circuit testing, and structural parts therefor; housings for printed circuit boards containing electric contacts; semiconductor testing apparatus
A contact assembly for a testing system for testing integrated circuit devices is disclosed. The contact assembly includes a first blade, a second blade, and an elastomer configured to retain the first blade and the second blade. The first blade and the second blade are electrically conductive. The first blade and the second blade are arranged in a cross configuration so that the first blade and the second blade form a substantially X-shape when assembled. The elastomer is at least columnar in part and non-conductive.
A test apparatus for testing device under test (DUT) having an antenna located on the DUT is disclosed. The test apparatus includes: a housing, a socket configured to electrically connect the DUT to a load board, a gripper assembly configured to hold the DUT in place, a retractor configured to release the DUT from the gripper assembly, and an alignment plate configured to align the DUT with the socket. The gripper assembly includes a base and an extender, the base is attached to the housing, and the extender is configured to hold the DUT in place. When the retractor is disengaged from the extender, the extender is configured to hold the DUT in place. When the retractor is engaged with the extender, the extender is configured to release the DUT on the alignment plate.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A contact assembly for a Kelvin testing system for testing integrated circuit devices is disclosed. The contact assembly includes at least one grouping of blades including a first force blade, a second force blade, a first sense blade, and a second sense blade; an electrical insulation layer disposed between the first force blade and the first sense blade and between the second force blade and the second sense blade; and an elongated elastomer. The elastomer is configured to be retained by the first force blade, the second force blade, the first sense blade, and the second sense blade. Each of the first force blade, the second force blade, the first sense blade, and the second sense blade includes a recess having an opening and sized to receive and retain at least a portion of the elastomer.
A spring probe assembly for a Kelvin testing system for testing integrated circuit devices is disclosed. The assembly includes a force spring probe and a sense spring probe. Each of the force spring probe and the sense spring probe includes a head; a body containing at least one resilient element; and a bottom. The body has a cylindrical shape, and the head and the body have a same diameter in an end view. The head includes a base and a top integrated with the base. The base has a cylindrical shape. The head includes a shoulder between the base and the top. The top includes an apex. The force spring probe and the sense spring probe are disposed so that the apexes of the force spring probe and the sense spring probe are adjacent to each other.
A spring probe assembly for a Kelvin testing system for testing integrated circuit devices is disclosed. The assembly includes a force spring probe and a sense spring probe. Each of the force spring probe and the sense spring probe includes a head; a body containing at least one resilient element; and a bottom. The body has a cylindrical shape, and the head and the body have a same diameter in an end view. The head includes a base and a top integrated with the base. The base has a cylindrical shape. The head includes a shoulder between the base and the top. The top includes an apex. The force spring probe and the sense spring probe are disposed so that the apexes of the force spring probe and the sense spring probe are adjacent to each other.
A contactor assembly for a testing system for testing integrated circuit devices includes a contact, and a housing having a contact slot. The contact is receivable in the contact slot. The contact includes a tip, a body, and a tail; and is configured to be in a free state, a preload state, and an actuated state. The housing includes a housing backstop. When the contact is in the preload state, a contact backstop of the contact is biased against the housing backstop.
A contactor assembly for a testing system for testing integrated circuit devices includes a contact, and a housing having a contact slot. The contact is receivable in the contact slot. The contact includes a tip, a body, and a tail; and is configured to be in a free state, a preload state, and an actuated state. The housing includes a housing backstop. When the contact is in the preload state, a contact backstop of the contact is biased against the housing backstop.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 1/00 - Details of instruments or arrangements of the types covered by groups or
H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
H01R 9/00 - Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocksTerminals or binding posts mounted upon a base or in a caseBases therefor
42 - Scientific, technological and industrial services, research and design
Goods & Services
Engineering services related to test pins for testing
circuit boards and integrated circuit chips; technical
advice, information and consultancy in relation to testing
integrated circuit chips; design and development of test
pins for testing integrated circuit chips.
42 - Scientific, technological and industrial services, research and design
Goods & Services
Engineering services related to test pins for testing
circuit boards and integrated circuit chips; technical
advice, information and consultancy in relation to testing
integrated circuit chips; design and development of test
pins for testing integrated circuit chips.
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
Test fixtures in the nature of apparatus for testing
integrated circuits, contact test pins for integrated
circuit testers, and integrated circuit test sockets, and
components thereof; housings for test contacts in an
integrated circuit tester, semiconductor testing apparatus. Engineering services related to testing on a probe array for
testing integrated circuit chips; technical advice,
information and consultancy in relation to testing on a
probe array for testing integrated circuit chips design and
development of probe arrays for testing integrated circuit
chips.
42 - Scientific, technological and industrial services, research and design
Goods & Services
(1) Engineering services related to test pins for testing circuit boards and integrated circuit chips; technical advice, information and consultancy in relation to testing integrated circuit chips; design and development of test pins for testing integrated circuit chips.
42 - Scientific, technological and industrial services, research and design
Goods & Services
(1) Engineering services related to test pins for testing circuit boards and integrated circuit chips; technical advice, information and consultancy in relation to testing integrated circuit chips; design and development of test pins for testing integrated circuit chips.
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
Test fixtures in the nature of apparatus for testing
integrated circuits, contact test pins for integrated
circuit testers, and integrated circuit test sockets, and
components thereof; housings for test contacts in an
integrated circuit tester, semiconductor testing apparatus. Engineering services related to testing on a probe array for
testing integrated circuit chips; technical advice,
information and consultancy in relation to testing on a
probe array for testing integrated circuit chips design and
development of probe arrays for testing integrated circuit
chips.
28.
INTEGRATED CIRCUIT TESTING FOR INTEGRATED CIRCUITS WITH ANTENNAS
A testing system and method for testing integrated circuits with radio frequency (RF) antennas is disclosed. The system includes an alignment plate for receiving a device under test (DUT) having an RF transmitting antenna, an enclosure surrounding but separated from the transmitting antenna, a receiving antenna in a telescopic enclosure, and a conversion circuit connected to the receiving antenna. The conversion circuit is configured to convert an RF output from the DUT to a direct current (DC) voltage. The DC voltage is used as a proxy for the RF output to test the DUT. When testing chips with RF ports, the chip or ports are surrounded by the enclosure which is non-radio reflective and includes antennas for receiving RF outputs disbursed around the enclosure, or a single antenna. If multiple receiving antennas are used, sequential testing can also detect directional transmission patterns to confirm that the direction is correctly calibrated.
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
(1) Test fixtures in the nature of apparatus for testing integrated circuits, contact test pins for integrated circuit testers, and integrated circuit test sockets, and components thereof; housings for test contacts in an integrated circuit tester, probes for testing semiconductors. (1) Engineering services related to testing on a probe array for testing integrated circuit chips; technical advice, information and consultancy in relation to testing on a probe array for testing integrated circuit chips design and development of probe arrays for testing integrated circuit chips.
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
(1) Test fixtures in the nature of apparatus for testing integrated circuits, contact test pins for integrated circuit testers, and integrated circuit test sockets, and components thereof; housings for test contacts in an integrated circuit tester, probes for testing semiconductors. (1) Engineering services related to testing on a probe array for testing integrated circuit chips; technical advice, information and consultancy in relation to testing on a probe array for testing integrated circuit chips design and development of probe arrays for testing integrated circuit chips.
31.
Compliant ground block and testing system having compliant ground block
A compliant ground block for a testing system for testing integrated circuit devices is disclosed. The compliant ground block includes a plurality of electrically conductive blade pairs in a side by side generally parallel relationship. Blades in the plurality of blade pairs are configured to be longitudinally slidable with respect to each other. The block also includes at least one elastomer configured to retain the plurality of blade pairs. Each blade pair of the plurality of blade pairs includes a first blade (or a first blade assembly) and a second blade. The first blade (or the first blade assembly) and the second blade are configured to generate scrubbing motions when the device under test is being pressed down on the compliant ground block or is being released from the compliant ground block.
A structure and method for providing a housing which includes a high frequency (HF) connection between a device under test (DUT) having a wave port 20 and a load board via a waveguide structure. The waveguide includes a wave insert 42, a waveguide adapter 24 and a conductive compliant member 40 which maintains bias between the adapter 24 and the DUT HF port 20 while also maintaining an RF shield despite the variable height of the DUT wave port. The adapter may also include a projection 64 which is received in a recess in the waveguide so that the shielding between the waveguide and adapter has full integrity.
42 - Scientific, technological and industrial services, research and design
Goods & Services
Engineering services related to testing on a probe array for testing integrated circuit chips; technical advice, information and consultancy in relation to testing on a probe array for testing integrated circuit chips design and development of probe arrays for testing integrated circuit chips
A structure and method for providing a housing which includes a high frequency (HF or RF) connection between a device under test (DUT) having a waveguide 22. The waveguide includes a wave insert 22, and a conductive compliant member 40 which maintains bias between the adapter/insert 22 and the DUT HF port 20 while also maintaining an RF shield despite the variable height of the DUT waveport. A passage 50 provides an RF connection between the RF port 62 on the DUT and a RF wave guide horn 54. A plurality of transmitting horns 54 can be arranged to transmit to a single receiving horn 154 so that fewer receivers are required to test multiple DUTs in sequence.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
G01N 21/35 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light
G01R 1/04 - HousingsSupporting membersArrangements of terminals
35.
COMPLIANT GROUND BLOCK AND TESTING SYSTEM HAVING COMPLIANT GROUND BLOCK
A compliant ground block for a testing system for testing integrated circuit devices is disclosed. The compliant ground block includes a plurality of electrically conductive blades in a side by side generally parallel relationship. The blades are configured to be longitudinally slidable with respect to each other. The block also includes an elastomer configured to retain the plurality of blades. Each blade of the plurality of blades includes a first end and a second end opposite to the first end in the longitudinal direction. The plurality of blades is arranged so that the first end of each blade of the plurality of blades is opposite to the first end of an adjacent blade in the longitudinal direction so that the first end of one blade is adjacent the second end of the adjacent blade. The elastomer is at least tubular (e.g., hollow or solid cylindrical) in part and non-conductive.
42 - Scientific, technological and industrial services, research and design
Goods & Services
Engineering services related to test pins for testing circuit boards and integrated circuit chips; technical advice, information and consultancy in relation to testing integrated circuit chips; design and development of test pins for testing integrated circuit chips
42 - Scientific, technological and industrial services, research and design
Goods & Services
Engineering services related to test pins for testing circuit boards and integrated circuit chips; technical advice, information and consultancy in relation to testing integrated circuit chips; design and development of test pins for testing integrated circuit chips
A contactor assembly for a testing system is disclosed. The assembly includes a contact having a contact tail and a housing having a top surface and a bottom surface. A slot extends through the housing from the top surface to the bottom surface and defines a first inner side wall of the housing and a first inner end wall. The contact is receivable in the slot. The contact tail includes a sloped terminus. A retainer is disposed on the first inner side wall. When the sloped terminus is engaged with the first inner end wall, at least a portion of the retainer overlaps with the contact forming at an overlapping area in a cross-sectional view, thereby preventing removal of the contact from the top side of the housing.
A compliant ground block for a testing system for testing integrated circuit devices is disclosed. The compliant ground block includes a plurality of electrically conductive blades in a side by side generally parallel relationship. The blades are configured to be longitudinally slidable with respect to each other. The block also includes an elastomer configured to retain the plurality of blades. Each blade of the plurality of blades includes a first end and a second end opposite to the first end in the longitudinal direction. The plurality of blades is arranged so that the first end of each blade of the plurality of blades is opposite to the first end of an adjacent blade in the longitudinal direction so that the first end of one blade is adjacent the second end of the adjacent blade. The elastomer is at least tubular (e.g., hollow or solid cylindrical) in part and non-conductive.
A contactor assembly for a testing system is disclosed. The assembly includes a contact having a contact tail and a housing having a top surface and a bottom surface. A slot extends through the housing from the top surface to the bottom surface and defines a first inner side wall of the housing and a first inner end wall. The contact is receivable in the slot. The contact tail includes a sloped terminus. A retainer is disposed on the first inner side wall. When the sloped terminus is engaged with the first inner end wall, at least a portion of the retainer overlaps with the contact forming at an overlapping area in a cross-sectional view, thereby preventing removal of the contact from the top side of the housing.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 31/02 - Testing of electric apparatus, lines, or components for short-circuits, discontinuities, leakage, or incorrect line connection
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
Test fixtures in the nature of apparatus for testing
integrated circuits, contact test pins for integrated
circuit testers, and integrated circuit test sockets, and
components thereof; housings for test contacts in an
integrated circuit tester, semiconductor testing apparatus. Engineering services related to testing on a probe array for
testing integrated circuit chips; technical advice,
information and consultancy in relation to testing on a
probe array for testing integrated circuit chips design and
development of probe arrays for testing integrated circuit
chips.
09 - Scientific and electric apparatus and instruments
Goods & Services
Test fixtures in the nature of apparatus for testing
integrated circuits, contact test pins for integrated
circuit testers; semiconductor testing apparatus.
42 - Scientific, technological and industrial services, research and design
Goods & Services
Engineering services related to testing on a probe array for testing integrated circuit chips; technical advice, information and consultancy in relation to testing on a probe array for testing integrated circuit chips design and development of probe arrays for testing integrated circuit chips
42 - Scientific, technological and industrial services, research and design
Goods & Services
Engineering services related to testing on a probe array for testing integrated circuit chips; technical advice, information and consultancy in relation to testing on a probe array for testing integrated circuit chips; design and development of probe arrays for testing integrated circuit chips
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
(1) Test fixtures in the nature of apparatus for testing integrated circuits, contact test pins for integrated circuit testers, and integrated circuit test sockets, and components thereof; housings for test contacts in an integrated circuit tester, probes for testing semiconductors. (1) Engineering services related to testing on a probe array for testing integrated circuit chips; technical advice, information and consultancy in relation to testing on a probe array for testing integrated circuit chips design and development of probe arrays for testing integrated circuit chips.
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Test fixtures in the nature of apparatus for testing integrated circuits, contact test pins for integrated circuit testers; probes for testing semiconductors.
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Probes for testing semiconductors; contacts for testing semiconductor devices; probes and test pins for testing integrated circuits and circuit boards.
50.
Integrated circuit testing for integrated circuits with antennas
A testing system and method for testing integrated circuits with radio frequency (RF) antennas is disclosed. The system includes an alignment plate for receiving a device under test (DUT) having an RF transmitting antenna, an enclosure surrounding but separated from the transmitting antenna, a receiving antenna in a telescopic enclosure, and a conversion circuit connected to the receiving antenna. The conversion circuit is configured to convert an RF output from the DUT to a direct current (DC) voltage. The DC voltage is used as a proxy for the RF output to test the DUT. When testing chips with RF ports, the chip or ports are surrounded by the enclosure which is non-radio reflective and includes antennas for receiving RF outputs disbursed around the enclosure, or a single antenna. If multiple receiving antennas are used, sequential testing can also detect directional transmission patterns to confirm that the direction is correctly calibrated.
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
Test fixtures in the nature of apparatus for testing
integrated circuits, contact test pins for integrated
circuit testers, and integrated circuit test sockets, and
components thereof; housings for test contacts in an
integrated circuit tester; semiconductor testing apparatus. Engineering services related to testing on a probe array for
testing integrated circuit chips; technical advice,
information and consultancy in relation to testing on a
probe array for testing integrated circuit chips design and
development of probe arrays for testing integrated circuit
chips.
A test apparatus for testing device under test (DUT) having an antenna located on the DUT is disclosed. The test apparatus includes: a housing, a socket configured to electrically connect the DUT to a load board, a gripper assembly configured to hold the DUT in place, a retractor configured to release the DUT from the gripper assembly, and an alignment plate configured to align the DUT with the socket. The gripper assembly includes a base and an extender, the base is attached to the housing, and the extender is configured to hold the DUT in place. When the retractor is disengaged from the extender, the extender is configured to hold the DUT in place. When the retractor is engaged with the extender, the extender is configured to release the DUT on the alignment plate.
G01R 1/04 - HousingsSupporting membersArrangements of terminals
G01R 31/01 - Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass productionTesting objects at points as they pass through a testing station
G01R 31/26 - Testing of individual semiconductor devices
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
(1) Test fixtures in the nature of apparatus for testing integrated circuits, contact test pins for integrated circuit testers, and integrated circuit test sockets, and components thereof; housings for test contacts in an integrated circuit tester; probes for testing semiconductors. (1) Engineering services related to testing on a probe array for testing integrated circuit chips; technical advice, information and consultancy in relation to testing on a probe array for testing integrated circuit chips design and development of probe arrays for testing integrated circuit chips.
09 - Scientific and electric apparatus and instruments
Goods & Services
test fixtures in the nature of apparatus for testing integrated circuits, contact test pins for integrated circuit testers; semiconductor testing apparatus
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
Test fixtures in the nature of apparatus for testing integrated circuits, contact test pins for integrated circuit testers, and integrated circuit test sockets, and components thereof; housings for test contacts in an integrated circuit tester, semiconductor testing apparatus Engineering services related to testing on a probe array for testing integrated circuit chips; technical advice, information and consultancy in relation to testing on a probe array for testing integrated circuit chips design and development of probe arrays for testing integrated circuit chips
56.
Selectively geometric shaped contact pin for electronic component testing and method of fabrication
This disclosure relates to a method of fabrication contact pins 24 used in testing circuit components, typically integrated circuits and the contact pins themselves. It is desirable to selectively radius certain portions of each pin to achieve desired performance of the entire pin. The portion to be radiused is cut to the desire shaped from a blank material. The portion which is not to be radiused is not cut to its final shape from the blank but to a larger shape which includes the material for the final shape. The entire cut portion is then treated to shape tor round all exposed edges. Then the remaining portion of the pin is cut out from the larger blank area which was previously retained, leaving those portions with non-radiused edged.
H01R 4/58 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
H01R 43/16 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
Test fixtures in the nature of apparatus for testing integrated circuits, contact test pins for integrated circuit testers, and integrated circuit test sockets, and components thereof; housings for test contacts in an integrated circuit tester; semiconductor testing apparatus Engineering services related to testing on a probe array for testing integrated circuit chips; technical advice, information and consultancy in relation to testing on a probe array for testing integrated circuit chips design and development of probe arrays for testing integrated circuit chips
58.
High isolation housing for testing integrated circuits
a, 48, 47 of electrically conductive strips or rings at the top and bottom of the housing adjacent the slot with connecting vias thereby creating an isolation cage against RF cross talk transmission and further lowering inductance and capacitance.
09 - Scientific and electric apparatus and instruments
Goods & Services
semiconductor testing apparatus; contactor housing and alignment plate used for testing semiconductor devices; test fixtures in the nature of apparatus for testing integrated circuits.
A test socket for a device under test (DUT) is disclosed in several embodiments. One embodiment shows a test socket base (16) with apertures (30) for insertion of test pin insert blocks (28). The blocks are inserted top—in or bottom—in and are provided with registration bosses 80 and teeth 92 or other means for maintaining registration. Blocks are provided with dielectric constants to achieve different frequency response relative to other pins. To achieve great EMI and cross talk isolation, the socket may be made of aluminum with hard anodize coating to insulate test pins (32) from the housing.
A high density thin walled test device testing chips/ICs is disclosed. A housing includes a slot for a contact pin and a pair of elastomers. The pin has an arcuate recess to receive part of the elastomer. Likewise the housing includes a channel to receive part of the elastomer. The recess and channel together partially surround the elastomer but not completely to allow shear forces and expansion space for the elastomer as it is compressed by the channel and recess. In addition, a front channel extends from the top surface of the housing toward the bottom surface but leaving a floor to support the elastomer so that it does not warp the housing when compressed. Further, the channel or the recess may include retainers which prevent the elastomer from moving out of position when the pin is in an uncompressed state.
The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are protected against damage from balls on a DUT by a protective ball guide which includes recesses for receiving part of the ball but prevents the ball from driving the pins beyond a limited range. The ball guide provides fine alignment horizontally and vertically enabling stable electrical performance.
A test socket for a device under test (DUT) is disclosed in several embodiments. One embodiment shows a test socket base (16) with apertures (30) for insertion of test pin insert blocks (28). The blocks are inserted top—in or bottom—in and are provided with registration bosses 80 and teeth 92 or other means for maintaining registration. Blocks are provided with dielectric constants to achieve different frequency response relative to other pins. To achieve great EMI and cross talk isolation, the socket may be made of aluminum with hard anodize coating to insulate test pins (32) from the housing.
A test socket (14) for a testing an integrated circuit (12) with controlled impedance while maintaining the structural integrity of the test pins (20). The pin (20) can have a sidewall with a thick portion 32 and a thinner portion (30) along the length of the pin. The pin can have projections (42) which provide a standoff from the slot (40). The sidewalls themselves can have projections or lands (60, 61) which extend into the slot and provide stability for the pin (20).
09 - Scientific and electric apparatus and instruments
Goods & Services
semiconductor testing apparatus; contactor housing and alignment plate material used for testing semiconductor devices; test fixtures in the nature of apparatus for testing integrated circuits
71.
Self flattening test socket with anti-bowing and elastomer retention
A high density thin walled test device testing chips/ICs is disclosed. A housing includes a slot for a contact pin and a pair of elastomers. The pin has an arcuate recess to receive part of the elastomer. Likewise the housing includes a channel to receive part of the elastomer. The recess and channel together partially surround the elastomer but not completely to allow shear forces and expansion space for the elastomer as it is compressed by the channel and recess. In addition, a front channel extends from the top surface of the housing toward the bottom surface but leaving a floor to support the elastomer so that it does not warp the housing when compressed. Further, the channel or the recess may include retainers which prevent the elastomer from moving out of position when the pin is in an uncompressed state.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are protected against damage from balls on a DUT by a protective ball guide which includes recesses for receiving part of the ball but prevents the ball from driving the pins beyond a limited range. The ball guide provides fine alignment horizontally and vertically enabling stable electrical performance.
A structure and method for providing a housing which includes a high frequency (HF) connection between a device under test (DUT) having a wave port 20 and a load board via a waveguide structure. The waveguide includes a wave insert 42, a waveguide adapter 24 and a conductive compliant member 40 which maintains bias between the adapter 24 and the DUT HF port 20 while also maintaining an RF shield despite the variable height of the DUT wave port. The adapter may also include a projection 64 which is received in a recess in the waveguide so that the shielding between the waveguide and adapter has full integrity.
A structure and method of constructing a tip for a contact pin used in IC test housing for testing integrated circuits. As the pin is deflected when the device under test (DUT) pad engaged the tip of the pin, the tip pressure normally increases as the elastomers biasing the pin are engaged. This causes the elastomer supporting the tip to increase pressure. By widening the tip as it rolls, the pressure is maintained more constant. Also, as the top wears, the pressure on the DUT will be reduced. By making the contact area of the tip to DUT smaller as it wears, the pressure can be made more constant.
A structure and method for providing a housing which includes a high frequency (HF) connection between a device under test (DUT) having a wave port 20 and a load board via a waveguide structure. The waveguide includes a wave insert 42, a waveguide adapter 24 and a conductive compliant member 40 which maintains bias between the adapter 24 and the DUT HF port 20 while also maintaining an RF shield despite the variable height of the DUT wave port. The adapter may also include a projection 64 which is received in a recess in the waveguide so that the shielding between the waveguide and adapter has full integrity.
A test socket (14) for a testing an integrated circuit (12) with controlled impedance while maintaining the structural integrity of the test pins (20). The pin (20) can have a sidewall with a thick portion 32 and a thinner portion (30) along the length of the pin. The pin can have projections (42) which provide a standoff from the slot (40). The sidewalls themselves can have projections or lands (60, 61) which extend into the slot and provide stability for the pin (20).
A test socket for a testing an integrated circuit with controlled impedance while maintaining the structural integrity of the test pins. The pin can have a sidewall with a thick portion and a thinner portion along the length of the pin. The pin can have projections which provide a stand-off from the slot. The sidewalls themselves can have projections or lands which extend into the slot and provide stability for the pin.
A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). To prevent rotation of the pins in the pin guide, a walled recess in the bottom of the pin guide engages flanges on the pins. In another embodiment, the pin guide maintains rotational alignment by being fitted around the pin profile or having projections abutting the pin. The pin guide (12) is maintained in alignment with the retainer 14 by establishing a registration corner (506) and driving the guide into the corner by elastomers in at least one diagonally opposite corner.
The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections.
The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.
This disclosure relates to a method of fabrication contact pins 24 used in testing circuit components, typically integrated circuits and the contact pins themselves. It is desirable to selectively radius certain portions of each pin to achieve desired performance of the entire pin. The portion to be radiused is cut to the desire shaped from a blank material. The portion which is not to be radiused is not cut to its final shape from the blank but to a larger shape which includes the material for the final shape. The entire cut portion is then treated to shape or round all exposed edges. Then the remaining portion of the pin is cut out from the larger blank area which was previously retained, leaving those portions with non-radiused edged.
H01R 43/16 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
H01R 4/58 - Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one anotherMeans for effecting or maintaining such contactElectrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
84.
Constant stress pin tip for testing integrated circuit chips
A structure and method of constructing a tip for a contact pin used in IC test housing for testing integrated circuits. As the pin is deflected when the device under test (DUT) pad engaged the tip of the pin, the tip pressure normally increases as the elastomers biasing the pin are engaged. This causes uneven pressure on the tip and will create debris and reduce tip life. By making the surface of the tip wider in the X or Y direction the surface pressure is reduced during the pin contact cycle. It is also possible to reduce tip pressure by having the top surface change in the Z axis so that recedes downwardly along its travel path, the pressure is reduced.
A contact for use in a test set which can be mounted to a load board of a tester apparatus. The contact, which serves to electrically connect at least one lead of a device being tested with a corresponding metallic trace on the load board, has a first end defining multiple contact points. As the test pin is rotated about an axis generally perpendicular to a plane defined by the contact, successive contact points are sequentially engaged by a lead of the device being tested. The test pin has a hard stop edge which engages a hard stop wall which limits its rotation movement. The bottom of the pin has a shallow convex curvature preferably with a flat region and the tip of the test pin has a chisel edge.
The terminals of a device under test are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane that includes a top contact plate facing the device under test, a bottom contact plate facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The top and bottom pins contact each other at an interface that is inclined with respect to the membrane surface normal. When compressed longitudinally, the pins translate toward each other by sliding along the interface. The sliding is largely longitudinal, with a small and desirable lateral component determined by the inclination of the interface.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01R 43/16 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
G01R 1/04 - HousingsSupporting membersArrangements of terminals
The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.
09 - Scientific and electric apparatus and instruments
Goods & Services
Probe arrays and electrical contact pins for testing
integrated circuit chips; integrated circuit electrical
testers; electric test housings and test sockets and
components thereof for integrated circuits.
89.
Electrically conductive pins for load boards lacking Kelvin capability for microcircuit testing
A device under test (DUT) has terminals connected to electrically conductive contacts which are in turn connect to a load board and to a test signal source. A second set of kelvin terminals are likewise connected to the DUT, but by pass the load board for connection to a test signal source. The kelvin terminals extend distally away from the DUT and are bonded to a flex circuit at their distal ends so that they make electrical and mechanical contact with the flex circuit. An intermediary terminal block receives the flex circuit and a ribbon cable or other wire connects to a test signal source. The entire circuit then circumvents the use of the load board.
A testing device for wafer level testing of IC circuits is disclosed. An upper and lower pin (22, 62) are configured to slide relatively to each other and are held in electrically biased contact by an elastomer (80). To prevent rotation of the pins in the pin guide, a walled recess in the bottom of the pin guide engages flanges on the pins. In another embodiment, the pin guide maintains rotational alignment by being fitted around the pin profile or having projections abutting the pin. The pin guide (12) is maintained in alignment with the retainer 14 by establishing a registration corner (506) and driving the guide into the corner by elastomers in at least one diagonally opposite corner.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
The test system provides an array of test probes. The probes pass through a first or upper probe guide retainer which has a plurality of slot sized to receive the probes in a way that they cannot rotate. A plurality of flex circuits at the different heights engage bottom probe ends at their respective height levels and flex circuits continue the electrical connection from the probes to a load board. The test probes are bonded to the flex circuits by ring shaped flowable conductive material. The flex circuits are biased against a load board by an elastomeric pad of spaced part conical projections.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
Terminals (2, 502) of a device under test (DUT) are connected to corresponding contact pads or leads by a series of electrically conductive contacts. Each terminal testing connects with both a “force” contact and a “sense” contact. In one embodiment, the sense contact (770) partially or completely laterally surrounds the force contact (700). In order to increase the contact surface, the force contact, in a spring pin (700) configuration contacts the device under test terminal at that portion of the lead which is curved or angled, rather than orthogonal to the pin.
The IC test system provides a system and method for thermal management of test pins. A test pin array (22) in a pin guide (24) is mounted in a retainer (20) which is located between an IC wafer (12) which contains IC devices to be tested (DUT) and a load board (40) which provides pathways to test signals to the DUT. On the other side of the load board is a contact plate (50) which together with the retainer straddles the load board. Leg extensions (36) pass through the load board apertures (42) and provide a thermal circuit from the contact plate to the retainer and to the pin array. On the upper side of the contact plate is a cooling/heating system with a thermal electric peltier device (62) and a further heat exchanger (64) as needed. Holes (44) are provided in the legs (36) to provide a supply of dry air to the wafer and pin array to minimize condensation as a result of cooling effects.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 1/04 - HousingsSupporting membersArrangements of terminals
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
96.
Electrically conductive pins for microcircuit tester
The terminals of a device under test (DUT) are temporarily electrically connected to corresponding contact pads on a load board by a series of electrically conductive pin pairs. The pin pairs are held in place by an interposer membrane with a top facing the device under test, a bottom facing the load board, and a vertically resilient, non-conductive member between the top and bottom contact plates. Each pin pair includes a top and bottom pin, which extend beyond the top and bottom contact plates, respectively, toward the device under test and the load board, respectively. The bottom pins has a lower contact surface which includes an arcuate portion or ridge which increases contact pressure and ablates oxides by the rocking action of ridge when the DUT in inserted.
b) against an up-stop surface 90 of plate 20, thereby insuring coplanarity of the crowns. The pin guide (12) is maintained in alignment with the retainer 14 by establishing a registration corner (506) and driving the guide into the corner by elastomers in at least one diagonally opposite corner.
A structure and method for providing a contact pin between a device under test (DUT) and a load board which provides upper and lower contact point which are axial aligned is disclosed. The pin has an upper (30) and lower (32) section and a hinge (44/46) in between which allow flex of both upper and lower contact (24/26) which, but the axial alignment can provide a direct replacement for POGO pins but with greater reliability.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
