An electronic component that can secure a creepage distance between electrode terminals has a structure in which an upper portion having a rectangular shape in plan view and a predetermined thickness, a housing portion formed at the center on an undersurface side of the upper portion to house a resistance element, and first, second, and third protruding portions, each of which extends in a vertical direction from the undersurface side of the upper portion to serve as a leg portion, are formed. A concave portion having a predetermined depth is formed between the first and third protruding portions and between the second and third protruding portions on the undersurface side of the upper portion, such that the concave portion extends from one side in a widthwise direction on the undersurface side to the other side through the housing portion to secure a long creepage distance between electrode terminals.
A metal plate resistor that is a built-in chip resistor for substrate has a plate shape including a resistance body, a first electrode bonded to a first end of the resistance body with a first clad portion, and a second electrode bonded to a second end of the resistance body with a second clad portion.
H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
H01C 17/245 - Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by mechanical means, e.g. sand-blasting, cutting, ultrasonic treatment
3.
METAL PLATE RESISTOR AND METHOD FOR MANUFACTURING METAL PLATE RESISTOR
The present invention relates to a metal plate resistor and a method for manufacturing a metal plate resistor. A metal plate resistor (1) is provided with a plate-shaped resistive element (6) formed from a metal material. The resistive element (6) includes a first slit (10A (10B)), a second slit (10B (10A)), and a through hole (11).
09 - Scientific and electric apparatus and instruments
Goods & Services
Temperature sensors; inclinometers; pressure sensors;
pressure gauges; manometers; gas sensors; anemometers;
flowmeters; sensors (measurement apparatus), other than for
medical use; detectors; measuring devices, electric;
electric current control devices; rotary converters; phase
modifiers; electric resistances; fuses; electronic
inductors; electrical inductors; electrical cells and
batteries; ammeters; voltmeters; electric conductors;
electric resistors for telecommunication apparatus; electric
coils; fuses for telecommunication apparatus;
telecommunication machines and apparatus; LED monitors;
thermistors; electronic circuits; integrated circuits;
electronic components; resistance wires; electrodes;
magnetic cores.
Provided is a temperature sensor which can enhance strength more easily. The temperature sensor comprises a resin film and a titanium metal foil laminated on the resin film. The titanium metal foil constitutes a conductive pattern. In an example, the titanium metal foil is subjected to a surface modification on a surface facing the resin film. In an example, a thickness of the titanium metal foil is within a range of 3-10 μm. In an example, the resin film contains a thermoplastic resin, and a thickness of the resin film is within a range of 20-80 μm.
G01K 7/18 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
H01C 7/22 - Elongated resistive element being bent or curved, e.g. sinusoidal, helical
The objective of the present invention is to provide a wind velocity measuring system having improved usability. A wind velocity measuring system according to the present invention is connected to a terminal device provided with a display panel, and displays a wind velocity measured in a measurement region on the display panel, wherein: the wind velocity is measured by sensor units disposed in the measurement region, and the wind velocity measuring system is provided with either a display function for displaying display portions corresponding to the sensor units on the display panel, and enabling each display portion to be moved arbitrarily on the display panel in accordance with the arrangement of the corresponding sensor unit, or a display function for displaying display portions corresponding to the sensor units on the display panel, and enabling a color display of each display portion to be changed in accordance with a light emission state of the corresponding sensor unit.
G01P 13/00 - Indicating or recording presence or absence of movementIndicating or recording of direction of movement
G01D 7/10 - Indicating value of two or more variables simultaneously using a common indicating element for two or more variables giving indication in co-ordinate form
09 - Scientific and electric apparatus and instruments
Goods & Services
Temperature sensors; inclinometers; pressure sensors;
pressure gauges; manometers; gas sensors; anemometers;
flowmeters; sensors (measurement apparatus), other than for
medical use; detectors; measuring devices, electric;
electric current control devices; rotary converters; phase
modifiers; electric resistances; fuses; electronic
inductors; electrical inductors; electrical cells and
batteries; ammeters; voltmeters; electric conductors;
electric resistors for telecommunication apparatus; electric
coils; fuses for telecommunication apparatus;
telecommunication machines and apparatus; LED monitors;
thermistors; electronic circuits; integrated circuits;
electronic components; resistance wires; electrodes;
magnetic cores.
09 - Scientific and electric apparatus and instruments
Goods & Services
Temperature sensors; inclinometers; pressure sensors;
pressure gauges; manometers; gas sensors; anemometers;
flowmeters; sensors (measurement apparatus), other than for
medical use; detectors; measuring devices, electric;
electric current control devices; rotary converters; phase
modifiers; electric resistances; fuses; electronic
inductors; electrical inductors; electrical cells and
batteries; ammeters; voltmeters; electric conductors;
electric resistors for telecommunication apparatus; electric
coils; fuses for telecommunication apparatus;
telecommunication machines and apparatus; LED monitors;
thermistors; electronic circuits; integrated circuits;
electronic components; resistance wires; electrodes;
magnetic cores.
The objective of the present invention is to provide a flow rate sensor in which it is possible to automate a resistance adjustment function of a bridge circuit. A flow rate sensor according to the present invention includes a flow rate detection resistance element serving as a temperature-sensitive element in a bridge circuit, and uses a flow rate signal from the bridge circuit to calculate a flow rate in a micro-controller, the flow rate sensor being characterized in that the bridge circuit includes a variable-resistance element that comprises a plurality of fixed resistors having different resistance values and a switch circuit for switching connections of the fixed resistors, a resistance value of the variable-resistance element being varied by switching the fixed resistors that are connected, thereby enabling the microcomputer to automatically adjust the resistance value of the variable resistance element.
Provided is a chip resistor with excellent anti-corrosiveness by reliably preventing sulfidation corrosion of front electrodes. A chip resistor 1 of the present invention comprises: a rectangular insulation substrate 2; a pair of front electrodes 4 provided at both ends of the main surface of the insulation substrate 2; a resistor 3 which connects the pair of front electrodes 4; a pair of back electrodes 6 provided at both ends of a back surface of the insulation substrate 2; a pair of protection electrodes 5 composed of a highly sulfur-resistant material provided to overlap with at least ends of the inner sides of the pair of front electrodes 4; a first insulation layer 7 composed of an inorganic material which covers the resistor 3 and the ends of the inner sides of the pair of protection electrodes 5; a second insulation layer 8 composed of an organic material provided on the first insulation layer 7; a pair of end surface electrodes 9 that extend to both end surfaces of the insulation substrate 2 and electrically conducts the front electrodes 3 and the back electrodes 6; and an external plating layer 10 which covers the pair of end surface electrodes 9, wherein the end surface electrodes 10 are provided in a range from the top surface of the protection electrodes 5 to an end of the second insulation layer 8.
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
The purpose of the present invention is to provide an optimal sensor system for measuring a three-dimensional space. A sensor system (1) includes: hosts (2); and sensors (3) that are connected to the hosts and that acquire data, the sensor system being characterized in that a plurality of the hosts are daisy-chained together, and a plurality of the sensors are daisy-chained to each of the hosts. It is preferable that the hosts and the sensors each include a higher-level communication control unit that performs communication with a higher-level device and a lower-level communication control unit that performs communication with a lower-level device.
H04L 12/28 - Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
G01P 5/10 - Measuring speed of fluids, e.g. of air streamMeasuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables
G08C 15/00 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path
The chip-type current fuse is configured to include a fuse element 5 formed between a first front electrode 3 and a second front electrode 4. The fuse element 5 includes: a first linear portion 5a that has an end connected to the first front electrode 3 and extends in a direction toward the second front electrode 4; a second linear portion 5b that has an end connected to the second front electrode 4 and extends in parallel to the first linear portion 5a in a direction toward the first front electrode 3; and an inclined linear portion 5c that links the first linear portion 5a and the second linear portion 5b to each other. The inclined linear portion 5c is connected at an acute angle to each of the first linear portion 5a and the second linear portion 5b.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
The objective of the present invention is to provide multi-linked devices that can be synchronized easily and accurately without the need for complex software correction processing. The multi-linked devices according to the present invention comprise a plurality of devices, including an upper device, a lower device, and one or more intermediate devices located between the upper device and the lower device, the devices being connected in series by means of a communication line to enable data transmission and reception between the devices. The multi-linked devices are characterized in that: a data acquisition request command for controlling the timing at which prescribed data are acquired is associated with each device; the data acquisition request commands for each device are transmitted earlier the farther the corresponding device is from the upper device; and all the data acquisition request commands for the intermediate devices are transmitted sequentially before the data acquisition request command reaches the lower device.
H04L 12/28 - Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
G08C 15/06 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path successively, i.e. using time division
H04Q 9/00 - Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
09 - Scientific and electric apparatus and instruments
Goods & Services
Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers; gas sensors; anemometers; flowmeters; sensors (measurement apparatus), other than for medical use; detectors; measuring devices, electric; electric current control devices; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; voltmeters; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; telecommunication machines and apparatus; LED monitors; thermistors; electronic circuits; integrated circuits; electronic components; resistance wires; electrodes; magnetic cores.
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers; gas sensors; anemometers; flowmeters; sensors (measurement apparatus), other than for medical use; detectors; measuring devices, electric; electric current control devices; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; voltmeters; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; telecommunication machines and apparatus; LED monitors; thermistors; electronic circuits; integrated circuits; electronic components; resistance wires; electrodes; magnetic cores.
16.
OXYGEN SENSOR ELEMENT AND METHOD FOR MANUFACTURING SAME
An oxygen sensor element that can achieve electric power saving without losing sensor characteristics has a structure in which an outer surface of a ceramic sintered body as a sensing layer made of a composition LnBa2Cu3O7−δ (Ln denotes rare earth element) is covered with heat insulating layers. A heat insulating material having a composition Ln2BaCuO5 is used for the heat insulating layers, and that composition Ln2BaCuO5 is added with 20 mol % of LnBa2Cu3O7−δ. This allows a sintering behavior of the heat insulating layers to come close to a sintering behavior of the sensing layer, and can thus prevent the occurrence of separation of the layers and cracks. The oxygen sensor element has a sandwich structure where the sensing layer is sandwiched between the heat insulating layers, thereby reducing the amount of heat dissipated from the sensing layer, and making it possible to achieve electric power saving.
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
17.
OXYGEN GAS DETECTING ELEMENTAL DEVICE AND METHOD FOR USING OXYGEN GAS DETECTING ELEMENTAL DEVICE
1+x2-x3δδ (where RE represents a rare-earth element, δ represents the oxygen nonstoichiometry amount, and a substitution amount x satisfies 0≤x≤2) and which is partially substituted with an element selected from group 2 elements in the periodic table and/or an element selected from lanthanoid elements.
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
Provided is an oxygen sensor element that enables reduced power consumption while maintaining sensor sensitivity. To achieve this purpose, there is provided an oxygen sensor element that utilizes a hotspot phenomenon in which a voltage is applied to a sensor element in which a constricted part 7 is formed in the longitudinal center of a ceramic sintered compact 5 which is a sensing layer, and the constricted part 7 becomes red hot, wherein the amount of heat radiation from the sensing layer is reduced and power consumption can be reduced by setting the difference ∆L1 between L1 and Lh such that 0.33 mm ≤ ∆L1 ≤ 1.0 mm, for example, where L1 is the length of the constricted part 7 in the longitudinal direction, and Lh is the length, in the longitudinal direction, of a region that includes the constricted part 7 and in which the temperature difference relative to the hot spot is 90% or less.
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
09 - Scientific and electric apparatus and instruments
Goods & Services
Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers; gas sensors; anemometers; flowmeters; sensors (measurement apparatus), other than for medical use; detectors; measuring devices, electric; electric current control devices; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; voltmeters; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; telecommunication machines and apparatus; LED monitors; thermistors; electronic circuits; integrated circuits; electronic components; resistance wires; electrodes; magnetic cores.
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers; gas sensors; anemometers; flowmeters; sensors (measurement apparatus), other than for medical use; detectors; measuring devices, electric; electric current control devices; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; voltmeters; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; telecommunication machines and apparatus; LED monitors; thermistors; electronic circuits; integrated circuits; electronic components; resistance wires; electrodes; magnetic cores.
09 - Scientific and electric apparatus and instruments
Goods & Services
(1) Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers; gas sensors; anemometers; flowmeters; sensors (measurement apparatus), other than for medical use; detectors; measuring devices, electric; electric current control devices; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; voltmeters; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; telecommunication machines and apparatus; LED monitors; thermistors; electronic circuits; integrated circuits; electronic components; resistance wires; electrodes; magnetic cores.
09 - Scientific and electric apparatus and instruments
Goods & Services
Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers; gas sensors; anemometers; flowmeters; sensors (measurement apparatus), other than for medical use; detectors; measuring devices, electric; electric current control devices; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; voltmeters; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; telecommunication machines and apparatus; LED monitors; thermistors; electronic circuits; integrated circuits; electronic components; resistance wires; electrodes; magnetic cores.
National University Corporation Tokai National Higher Education and Research System (Japan)
KOA CORPORATION (Japan)
Inventor
Yonezawa, Yu
Yamamoto, Masayoshi
Hasenuma, Atsushi
Shigesawa, Koji
Nakamura, Keishi
Toyoda, Susumu
Abstract
A current detection circuit, including: an output circuit to output a signal indicating a voltage drop between a pair of detection terminals; an amplifier circuit to amplify the signal from the output circuit; an AD conversion circuit to generate a digital signal by sampling, at a predetermined cycle, an amplified signal amplified by the amplifier circuit; a filter circuit configured to extract, from the amplified signal amplified by the amplifier circuit, a noise component having a frequency higher than a sampling frequency of the AD conversion circuit; a comparing unit to output a comparison signal indicating a noise detection timing at which an output signal of the filter circuit exceeds a predetermined reference value for detecting the noise component; and an arithmetic circuit to delay a timing at which the amplified signal is sampled by the AD conversion circuit for a predetermined time based on the comparison signal.
H02M 7/5387 - Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
The present invention relates to a current detection device, in particular a current detection device using a shunt resistor. The current detection device (30) includes a resistive element (5) and a pair of electrodes (6, 7). The electrodes (6, 7) have detection areas (24a, 25a) demarcated by first slits (16, 17), second slits (26, 27), and contact surfaces (6a, 7a) that at least partially contacts the resistive element (5). The electrodes (6, 7) further have voltage detection portions (20, 21) arranged in the detection areas (24a, 25a).
G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
Provided is a sensor element capable of obtaining a wide sensing region, suppressing unevenness of a temperature distribution in the sensing region, and obtaining substantially constant sensor sensitivity. A sensor element according to the present invention includes: a base; a temperature-sensitive film formed on an entire surface of the base and having an electric resistance value that changes due to a change in temperature; and wiring members connected to both ends of the temperature-sensitive film. The temperature-sensitive film includes connection regions connected to the wiring members and a pattern extending from each of the connection regions toward a center of the base, and a cross-sectional area of the pattern is smaller on the connection region sides than at the center of the base.
In a resistive oxygen gas sensor, an oxygen gas detection member for detecting oxygen gas contains, as a main component, a semiconductor material having a composition formula represented by RE(Ba2-x, REx)Cu3O, (wherein, RE is a rare earth element, x is 0≤x≤ 1.2, and y is 6.0≤y≤7.5).
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
A copper alloy material having a low volume resistivity, a low TCR and a small thermal electromotive force with respect to copper and a shunt resistor comprising a resistive body formed by the copper alloy material are provided. The copper-manganese-based copper alloy material includes 4.5-5.5 mass % of manganese, 0.1-0.3 mass % of iron, 0.1-0.5 mass % of tin, and a balance being copper. A volume resistivity is 15-25 μΩ·cm. An absolute value of TCR is 150×10−6/K or less. A thermal electromotive force with respect to copper is 1 μV/K or less. A resistance value change is −0.3% to 0% in a heat resistance test of 175° C. for 3000 hours.
C22C 9/05 - Alloys based on copper with manganese as the next major constituent
G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
Provided is a resistor provided with a resistance body and electrodes provided on the resistance body, and the resistance body has an oxide film on a surface.
The present invention relates to a shunt resistor. This shunt resistor (1) comprises at least two elements (150) that are attached to an electrode member (10). The at least two elements (150) are provided with resistors (5) that have different specific resistances.
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
A chip component 10 comprises: an insulating substrate 1 on which a resistor 3 serving as a functional element is formed; a pair of internal electrodes (front electrodes 2, end surface electrodes 6, and back electrodes 5) that is formed to cover both end portions of the insulating substrate 1 and connected to the resistor 3; a barrier layer 8 that is formed on a surface of each of the internal electrodes and mainly composed of nickel; and an external connection layer 9 that is formed on a surface of the barrier layer 8 and mainly composed of tin, and the barrier layer 8 is composed of alloy plating (Ni—P) including nickel and phosphorus, which is formed by electrolytic plating, and a content rate of phosphorus in the alloy plating of an inner region is made different from that of an outer region so that at least the inner region of the barrier layer 8 has magnetic properties.
H01C 1/032 - HousingEnclosingEmbeddingFilling the housing or enclosure plural layers surrounding the resistive element
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
H01C 17/242 - Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
31.
SHUNT RESISTOR AND SHUNT RESISTOR MANUFACTURING METHOD
The present invention relates to a shunt resistor and a shunt resistor manufacturing method. A shunt resistor (1) comprises a pair of electrodes (6, 7) connected to both ends of a resistor element (5). The pair of electrodes (6, 7) has a pair of voltage detection units (20, 21), and a hole (70) is provided in the resistor element (5) between the pair of voltage detection units (20, 21).
H01C 1/144 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered
H01C 17/232 - Adjusting the temperature coefficientAdjusting value of resistance by adjusting temperature coefficient
H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
The present invention provides: a temperature sensor which enables further simplification of a step for connecting a terminal; and a current detection device. This temperature sensor for measuring the temperature of a shunt resistor is provided with: a resin film which has a first surface and a second surface; a first conductive pattern which is provided on the first surface side of the resin film and serves as a temperature sensing part; and a pair of second conductive patterns which are provided on the first surface side or the second surface side of the resin film for the purpose of detecting the voltage of the shunt resistor.
A resistor 10, which is an electronic component that provides suppression of thermal effects on a circuit board, has a structure in which an exterior member 5 encloses, inter alia: a resistor body 7 formed in a central area 6 of a first surface of an insulating substrate 2 and internal electrodes 8a to 8d that are formed in opposing edge areas 9a, 9b that sandwich the central area 6, wherein, at an upper surface portion of the exterior member 5, a second surface of the insulating substrate 2 is close-contactably exposed to an outer metal member 14. In addition, within a lower surface portion of the exterior member 5, protrusions 5a, 5b, which distance the resistor 10 from a circuit substrate 12, are formed at locations that contain a lead-out section of a lead terminal 3a to 3d and a corresponding region in the thickness direction of the exterior member.
The present invention relates to a resistor, particularly to a surface-mount resistor. A resistor (1) comprises protrusions (10, 10) that are formed on side surfaces (3c, 3c) of a pair of cap-like electrodes (3, 3).
H01C 1/148 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
An electronic component according to an embodiment of the present invention includes: a chip; a die pad to which the chip is secured; a suspension terminal extending from the die pad; a lead terminal electrically connected to the chip; and a dummy terminal, in which the suspension terminal is disposed closer to the dummy terminal than the lead terminal.
Provided is a mounting structure for a chip component having high thermal shock resistance. In amounting structure for a chip resistor 1 according to the present invention, a separation distance L1 between a pair of back surface electrodes 3 formed on an insulating substrate 2 of a chip resistor 20 is set to be shorter than a separation distance L2 between a pair of lands 31 provided on a circuit board 30. Each of the back surface electrodes 3 is formed with a thick portion (first electrode portion 3a), and an external electrode 9 deposited on the back surface electrode 3 is connected on the corresponding land 31 via solder 32 with a top portion of the thick portion made positioned directly above an inner end of the land 31.
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape
An object is to provide a sensor device capable of highly accurately detecting a flow rate at 360 degrees in a radial direction with respect to a first sensor element including a resistive element for flow rate detection. A sensor device according to the present invention includes a substrate, a first sensor element including a resistive element for flow rate detection, and a second sensor element including a resistive element for temperature compensation. Each of the first sensor element and the second sensor element is supported to be separated from a surface of the substrate via a pair of lead wires, and the first sensor element is disposed at a higher position than the second sensor element.
G01F 1/69 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
G01F 1/696 - Circuits therefor, e.g. constant-current flow meters
38.
ALL-SOLID-STATE POTASSIUM ION SELECTIVE ELECTRODE, AND METHOD FOR PRODUCING SAME
x6y22O, at least a portion of the Prussian blue analog particles has a monoclinic crystal structure, x is a number of 1.5-2, y is a number greater than 0 and less than or equal to 1, and n is a number greater than or equal to 0.
09 - Scientific and electric apparatus and instruments
Goods & Services
Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers; gas sensors; anemometers; flowmeters; sensors [measurement apparatus], other than for medical use; detectors; measuring devices, electric; electric current control devices; power distribution or control machines and apparatus; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; electric current sensors; voltmeters; electric or magnetic meters and testers; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; parts and accessories for telecommunication machines and apparatus; telecommunication machines and apparatus; LED monitors; thermistors; semi-conductor elements; electronic circuits; integrated circuits; electronic components; resistance wires; electrodes; magnetic cores.
09 - Scientific and electric apparatus and instruments
Goods & Services
Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers being pressure gauges; gas sensors for measuring gas concentration; anemometers; flowmeters; electronic devices for measuring electric current; electric current control devices; electric power distribution machines; rotary converters; phase modifiers; electric resistances; electrical fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; sensors for detecting electric current; voltmeters; electric meters; electric conductors; electric resistors for telecommunication apparatus; electric coils; electrical fuses for telecommunication apparatus; electric resistors for telecommunication apparatus; LED monitors; thermistors; semiconductor power elements; electronic circuits; integrated circuits; electronic components for computers; resistance wires; electrodes; magnetic cores
A chip resistor according to the present invention includes an insulating substrate, a pair of back surface electrodes, a pair of top surface electrodes, a resistor, and a pair of end face electrodes. The back surface electrode includes the first electrode portion located inwardly and away from the end face of the insulating substrate, and the two second electrode portions arranged on two portions, respectively, in the short direction of the insulating substrate with the cutout portion, which is positioned between the end face of the insulating substrate and the first electrode portion, being interposed therebetween, and the maximum height of the first electrode portion is set to be more than the maximum height of the second electrode portions.
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
A sensor device according to the present invention includes a substrate including a heat generation portion, a casing including an accommodation portion accommodating the substrate, and a sensor element including a temperature-sensitive resistor and being supported by the substrate, in which the accommodation portion is divided into a plurality of accommodation spaces on a side closer to the sensor element. The accommodation portion is divided into a first accommodation space and a second accommodation space via division plates, and the first accommodation space is formed on a side closer to the sensor element than the second accommodation space, and widely as compared with the second accommodation space.
The present invention relates a shunt resistor and a shunt resistance device. The shunt resistor (1) includes an electrode member (10). The electrode member (10) includes a contact portion (10a) contacting a resistance element (5), and a slit (20) formed on the contact portion (10a).
H01C 1/144 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
G01R 15/14 - Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
The present invention provides a chip resistor which has excellent corrosion resistance. A chip resistor 1 according to the present invention is provided with: a rectangular parallelopiped insulating substrate 2; a pair of front electrodes 3 that are formed on opposite ends of the front surface of the insulating substrate 2; a pair of back electrodes 4 that are formed on opposite ends of the back surface of the insulating substrate 2; a resistor 5 that bridges the pair of front electrodes 3; a second insulating layer (protective film) 7 that is formed from a resin material and covers the resistor 5; a third insulating layer (auxiliary film) 8 that is formed from a resin material and is superposed on the second insulating layer 7; a pair of auxiliary electrode layers 9 that are formed from a resin material containing conductive particles and are superposed on the front electrodes 3; a pair of end-face electrodes 10 that extend on opposite end faces of the insulating substrate 2 and enable electrical conduction between the auxiliary electrode layers 9 and the back electrodes 4; and a pair of outer plated layers 11 that are arranged so as to cover the surfaces of the auxiliary electrode layers 9 and the end-face electrodes 10. The auxiliary electrode layers 9 are formed to positions at which end surfaces of the third insulating layer 8 are covered; and the second insulating layer 7 contains a larger amount of an inorganic filler than the third insulating layer 8.
H01C 1/032 - HousingEnclosingEmbeddingFilling the housing or enclosure plural layers surrounding the resistive element
H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
A sensor element (12) has a cross-sectional area that continuously only increases from a positive (+) electrode side toward a negative (−) electrode side, thereby leading a hot spot, which attempts to move to the negative electrode side, to a lower resistance side. A position that is at nearly equal distances from paired electrodes (13 and 15) formed on either end of the sensor element (12) is set as a hot spot generating position, so as to avoid damage to the electrodes due to heat emitted by the hot spot.
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
B28B 1/30 - Producing shaped articles from the material by applying the material on to a core, or other moulding surface to form a layer thereon
B28B 1/48 - Producing shaped articles from the material by removing material from solid section preforms for forming hollow articles, e.g. by punching or boring
G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups
48.
HETEROJUNCTION PHOTOCATALYST, PHOTOCATALYST COMPOSITE, METHOD FOR PRODUCING HETEROJUNCTION PHOTOCATALYST, AND METHOD FOR PRODUCING HYDROGEN
The present invention provides a heterojunction photocatalyst having higher photocatalytic activity than that of a conventional heterojunction photocatalyst. Further, the present invention provides a photocatalyst composite having the heterojunction photocatalyst on a substrate, a method for producing the heterojunction photocatalyst, and a method for producing hydrogen using the heterojunction photocatalyst or the photocatalyst composite The het junction photocatalyst of the present invention has a solid mediator between a hydrogen-evolution photocatalyst and an oxygen-evolution photocatalyst, and the solid mediator is selectively joined to an electrons collecting surface of the oxygen-evolution photocatalyst.
C01B 3/04 - Production of hydrogen or of gaseous mixtures containing hydrogen by decomposition of inorganic compounds, e.g. ammonia
C01B 3/26 - Production of hydrogen or of gaseous mixtures containing hydrogen by decomposition of gaseous or liquid organic compounds of hydrocarbons using catalysts
B01J 23/00 - Catalysts comprising metals or metal oxides or hydroxides, not provided for in group
49.
JUMPER ELEMENT, SHUNT RESISTOR APPARATUS, AND METHOD OF ADJUSTING CHARACTERISTIC OF SHUNT RESISTOR APPARATUS FOR CURRENT DETECTION
The present invention relates to a jumper element, a shunt resistor apparatus, and a method of adjusting characteristic of a shunt resistor apparatus for current detection. The jumper element (10) for constituting the shunt resistor apparatus for current detection is made of conductive metal material. The jumper element (10) includes: a body structure (11) that can be coupled to a resistance element (5) constituting a part of the shunt resistor apparatus; and a protrusion (12) formed on a side portion of the body structure (11), wherein the protrusion (12) is located so as not to overlap the resistor element (5).
G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
G01R 15/14 - Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
A chip resistor 10 comprises: a insulating substrate 1; a pair of upper surface electrodes 2; a resistor 3; a pair of lower surface electrodes 5; a pair of resin electrode layers 6 made of synthetic resin materials containing conductive particles and laminated on the pair of lower surface electrodes 5; a pair of end face electrodes 7; and a pair of external electrodes 8, wherein the pair of the lower surface electrodes 5 is made of metal thin film layers formed as thin films on a mounting surface of the insulating substrate 1, respectively, and includes exposed portions 5a exposed from the resin electrode layers 6, respectively, and the pair of external electrodes 8 is in contact with the exposed portions 5a of the lower surface electrodes 5 and entire surfaces of the resin electrode layers 6, respectively. [Selected drawing] FIG. 1
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
The present invention pertains to a shunt resistor and a shunt resistance device. A shunt resistor (1) comprises at least two stacked elements (50) which are each attached to an electrode member (10) and have a resistor (5). The electrode member (10) has at least two contact parts (10a) that come in contact with the at least two stacked elements (50).
G01R 15/00 - Details of measuring arrangements of the types provided for in groups , or
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
52.
RESISTANCE ALLOY FOR USE IN SHUNT RESISTOR, USE OF RESISTANCE ALLOY IN SHUNT RESISTOR, AND SHUNT RESISTOR USING RESISTANCE ALLOY
Provided is a current detection resistor, such as a shunt resistor, wherein a. low specific resistance and a small thermal electromotive force with respect to copper are achieved, while maintaining a low TCR. A resistance alloy for use in a current detection shunt resistor includes 4.5 to 5.5 mass % of manganese, 0.05 to 0.30 mass % of silicon, 0.10 to 0.30 mass % of iron, and a balance being copper, and has a specific resistance of 15 to 25 μΩ·m.
H01C 7/13 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current-responsive
C22C 9/05 - Alloys based on copper with manganese as the next major constituent
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
C22F 1/02 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
The present invention relates to a shunt resistor and a current detection device. A current detection unit (2) includes voltage detection terminals (8A, 8B) provided at first characteristic positions on electrodes (6, 7) where the temperature coefficient of resistance of a shunt resistor (1) is a first coefficient, and voltage detection terminals (8C, 8D) provided at second characteristic positions on the electrodes (6, 7) where the temperature coefficient of resistance of the shunt resistor (1) is a second coefficient. The first coefficient and the second coefficient are different numerical values.
This load sensor element comprises: a substrate; an inorganic layer which is a first layer that is provided on a surface, which is one surface of the substrate, and that covers a section of the substrate; and a thin film resistor that is provided on the surface. The thin film resistor includes: a body section that is sandwiched between the substrate and the inorganic layer; and a first end section and a second end section that are mounted at an exposed section of the substrate that is not covered by the inorganic layer. The load sensor element also comprises a reinforcing layer which is a second layer that is provided on an underside surface, which is the other surface of the substrate, so as to sandwich the substrate together with the inorganic layer. In the load sensor element, the inorganic layer and the reinforcing layer are disposed so that one edge of the inorganic layer which contacts the surface and one edge of the reinforcing layer which contacts the underside surface are aligned in the thickness direction of the substrate.
G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
G01L 1/26 - Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload
This load sensor element comprises a substrate, and an inorganic layer which has an accepting surface for accepting a load and which is provided so as to cover a portion of a top surface, which is one surface of the substrate. The load sensor element is provided with a thin-film resistor configured from a resistor having a resistance value that varies in accordance with the load accepted by the inorganic layer. The thin-film resistor includes a main body portion sandwiched between the substrate and the inorganic layer, and one end portion and an other end portion, which are two end portions placed on exposed portions of the substrate that are not covered by the inorganic layer. The load sensor element is provided with a first temperature compensation resistor which is independent of the thin-film resistor and which is disposed on an exposed portion 28 of the top surface, which is said one surface of the substrate. The load sensor element is provided with a second temperature compensation resistor which is disposed on a rear surface, being another surface of the substrate, and which exhibits the same behavior as the first temperature compensation resistor.
G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
G01L 1/26 - Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload
An object is to provide a flow sensor element is non-directional and has an excellent sensor sensitivity. A flow sensor element includes a base body having a spherical shape, and a temperature-sensitive film pattern that is disposed over the entirety of a surface of the base body, and changes in an electrical resistance value due to a change in temperature. It is preferable that the temperature-sensitive film pattern be formed by trimming a temperature-sensitive film that has been formed on the surface of the base body. In the flow sensor element, the temperature-sensitive film pattern can be disposed over the entirety of the surface of the base body having a spherical shape. This enables a constant sensor sensitivity to be obtained regardless of a direction of a fluid, and the accuracy of detection of a flow rate can be improved.
Provided is a resistance alloy enabling a decrease in the TCR of a shunt resistor for use in a current detection device capable of detecting large currents. A copper-manganese based resistance alloy for use in a shunt resistor further comprises tin and nickel and has a TCR less than or equal to −36×10−6/K at 100° C. with reference to 25° C.
C22C 9/05 - Alloys based on copper with manganese as the next major constituent
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
Provided is a chip resistor that is capable of ensuring low TCR while increasing electric power even with low resistance. This chip resistor 1 comprises an insulation substrate 2, a pair of obverse electrodes 3 provided to the two obverse-surface end parts of the insulation substrate 2, a resistor body 5 connecting the two obverse electrodes 3, a glass body 6 provided on the resistor body 5, a low-resistance-value-adjusting trimming groove 5a formed in the resistor body 5 through the glass body 6; a first protection layer 7 formed so as to cover the trimming groove 5a in a region that is further inward than the pair of obverse electrodes 3, a second protection layer 8 formed so as to cover the first protection layer 7, a pair of end-surface electrodes 9 that extend to the two end surfaces of the insulation substrate 2 and are connected to the obverse electrodes 3, and a pair of external plating layers 10 that cover the end-surface electrodes 9. The first protection layer 7 comprises a resin material containing a heat-dissipating filler, and the second protection layer 8 comprises a resin material.
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C 1/032 - HousingEnclosingEmbeddingFilling the housing or enclosure plural layers surrounding the resistive element
This gas sensor is provided with a base material, a first electrode and a second electrode both arranged on the base material, and a gas detection unit connected to the first electrode and the second electrode, in which the gas detection unit is composed of a semiconductor oxide containing calcium ferrite and zirconium as essential components and also containing at least one metal element selected from aluminum, silver and tin.
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
60.
CURRENT DETECTING DEVICE, AND METHOD FOR MANUFACTURING SAME
The present invention relates to a current detecting device and a method for manufacturing the same, and more particularly relates to a current detecting device provided with a shunt resistor, and a method for manufacturing the current detecting device. A current detecting unit (2) comprises: a plurality of pairs of voltage detection contacts (8A to 8H) electrically connected to a pair of electrodes (6, 7) of a shunt resistor (1); a plurality of pairs of voltage signal lines (9A to 9H) connected respectively to the plurality of voltage detection contacts (8A to 8H); a plurality of pairs of conductor element connection terminals (15A to 15H) connected respectively to the plurality of pairs of voltage signal lines (9A to 9H); and a pair of conductor elements (20, 21) attached to any one pair of conductor element connection terminals among the plurality of pairs of conductor element connection terminals (15A to 15H). The pair of conductor element connection terminals is selected in advance on the basis of an actual measurement result of a temperature coefficient of resistance of the shunt resistor (1).
A shunt resistor (1) includes: a resistance element (3); a first electrode (5A) and a second electrode (5B) coupled to both sides of the resistance element (3); a first fusion material (6A) and a second fusion material (6B) electrically coupled to the first electrode (5A) and the second electrode (5B), respectively, the first fusion material (5A) and the second fusion material (5B) haying electric conductivity; and at least one board (10) coupled to the first electrode (5A) and the second electrode 15B) by the first fusion material (6A) and the second fusion material (6B). The first fusion material (6A) is arranged in a first through-hole (7A) formed in the first electrode (5A) or the board (10), and the second fusion material (6B) is arranged it as second through-hole (7B) formed in the second electrode (5B) or the board (10).
G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
H01C 1/144 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered
H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
The present invention relates to a shunt resistor and a current detection device. A shunt resistor (1) comprises a first protrusion (11) and a second protrusion (12). The first protrusion (11) includes a part of a resistive body (5) and a part of a pair of electrodes (6, 7). The second protrusion (12) includes a part of the resistive body (5) and a part of the pair of electrodes (6, 7).
H01C 1/144 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered
H01C 3/00 - Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven, or formed as grids
Provided is a shunt resistor with an enhanced strength and reduced electrical resistance between a resistive element and terminals of the shunt resistor. This shunt resistor includes a first terminal and a second terminal each made of an electrically conductive metal material; and a resistive element disposed between the first terminal and the second terminal. The first terminal and the second terminal each have a through-hole, and the resistive element is embedded in the through-holes of the first terminal and the second terminal in a depth direction thereof. Regions connecting the resistive element to the first terminal and the second terminal each have an alloy portion formed along an inner peripheral surface of the through-hole.
H01C 7/13 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current-responsive
H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
H01C 1/148 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
H01C 1/144 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered
A shunt resistor capable of reducing an absolute value of a temperature coefficient of resistance is disclosed. The shunt resistor includes: a base structure including a resistance element and a pair of electrodes; a bridge structure configured to bridge the pair of electrodes and made of a conductor; and connections configured to couple the pair of electrodes to the bridge structure. The bridge structure has a higher resistance than a resistance of the base structure at the connections.
H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
H01C 1/014 - MountingSupporting the resistor being suspended between, and being supported by, two supporting sections
[Problem] To provide an electronic component capable of maintaining the creepage distance between electrode terminals. [Solution] The present invention has a structure obtained forming an upper surface section having a prescribed thickness and having a rectangular shape when seen from a plan view, a resistor element housing section which is formed in the center on the bottom surface side of the upper surface section, and a first projection 3, a second projection 4 and a third projection 5 which function as legs and project in the vertical direction from the bottom surface of the upper surface section. The present invention maintains a long creepage distance between the electrode terminals formed on projections 3 and 4 via recesses of a prescribed depth which are formed on the bottom surface side so as to extend from one side in the short direction thereof across said housing section to the other side in said short direction between the first and third projections and also between the second and third projections on the bottom surface of the upper surface section.
H01C 1/028 - HousingEnclosingEmbeddingFilling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
The present invention provides a resistive material and a method for producing the same wherein a high-temperature pressing step is not required. Provided is a method for producing a resistive material, the resistive material containing insulating powder and a three-dimensional network metal body surrounding the insulating powder, the production method comprising: a step for coating the insulating powder with a metal film to prepare metal-coated powder; a step for mixing the metal-coated powder with an electrically conductive metal powder to obtain a mixed powder; and a step for sintering the mixed powder at a temperature lower than the melting point of the metal film and the melting point of the metal powder.
H01C 17/30 - Apparatus or processes specially adapted for manufacturing resistors adapted for baking
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
The present invention relates to a shunt resistor and a method for manufacturing the shunt resistor. The present invention relates to a current detection device including a shunt resistor. The shunt resistor (1) comprises a resistance element (5) and a pair of electrodes (6, 7) connected to both ends (5a, 5b) of the resistance element (5) in a first direction. The shunt resistor (1) has a projecting portion (11) formed on a side surface (1a), which is parallel to the first direction, of the shunt resistor (1), and a recessed portion (12) formed in a side surface (1b), which is an opposite side of the side surface (1a), of the shunt resistor (1), and extending in the same direction as the projection (11). The projecting portion (11) has a portion of the resistance element (5) and portions of the pair of electrodes (6, 7), and the recessed portion (12) has a side surface (5d) of the resistance element (5) parallel to the first direction.
H01C 7/06 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
G01R 15/14 - Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
The present invention relates to a shunt resistor for current detection. The shunt resistor (1) includes: a resistance element (5) having a plate shape; and electrodes (6, 7) connected to both end surfaces (5a, 5b) of the resistance element (5), wherein the electrodes (6, 7) have cut portions (11, 12), respectively, the cut portions (11, 12) extending parallel to joint portions (8, 9) of the resistance element (5) and the electrodes (6, 7), and each of the cut portions (11, 12) is located at a position where a relationship Y≤0.80X-1.36 holds, where Y is a distance from each joint portion (6, 7) to each cut portion (11, 12), and X is a length of the joint portions (6, 7) in a width direction of the electrodes (6, 7).
H01C 1/144 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered
G01R 15/14 - Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
H01C 7/06 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
A manufacturing method of a resistor contains: a step of forming a resistor base material by stacking an electrode material, a resistive material, and an electrode material in this order and by bonding the electrode material, the resistive material, and the electrode material by applying pressure in the stacked direction; a step of passing the resistor base material through a die, the die being formed with an opening portion having a dimension smaller than an outer dimension of the resistor base material; and a step of obtaining an individual resistor from the resistor base material passed through the die.
A chip resistor comprises an insulating substrate (component body) on which a resistor is formed, a connection terminal (front electrodes, end face electrodes, and back electrodes) formed at both end portions of the insulating substrate, an under layer formed by electrolytic plating to cover the connection terminal, a barrier layer formed by electrolytic plating to cover the under layer, and an external connection layer which is mainly composed of tin and formed on a surface of the barrier layer, wherein the barrier layer is made of alloy plating mainly composed of nickel and containing 3% to 15% of phosphorus, and the under layer is formed of a copper plated layer that is at least either more malleable or more ductile than the barrier layer.
The mounting area for an electronic component and a resistor for current detection is reduced. A current detection resistor for detecting current includes a plate-like resistive body, and a first electrode and an opposite second electrode which are stacked in a thickness direction of the resistive body and are disposed so as to sandwich the resistive body. The first electrode has a groove portion.
G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
73.
ALLOY FOR RESISTOR AND USE OF RESISTOR ALLOY IN RESISTOR
Provided is a copper-manganese-nickel based alloy having characteristics (in particular, specific resistance) close to those of a nickel-chromium based alloy. It is also an objective to provide an alloy having high processability compared to a nickel-chromium based alloy. An alloy for a resistive body includes copper, manganese, and nickel, wherein the manganese is 33 to 38% by mass, and the nickel is 8 to 15% by mass.
A chip resistor includes: an insulating substrate; a pair of front electrodes; a resistor connecting between both the front electrodes; an undercoat layer provided on the resistor; an overcoat layer provided on the undercoat layer, an auxiliary film provided so as to be over a connecting portion between the front electrode and the resistor at a position away from an end face of the insulating substrate; a pair of end face electrodes; and a pair of external plating layers covering the end face electrodes, the front electrodes, and the auxiliary film, wherein the auxiliary film is formed of a resin material containing metal particles, and a portion of the auxiliary film is sandwiched between the undercoat layer and the overcoat layer.
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
A circuit protection element (10) is provided with: a pair of electrode parts (12, 14); an element part (16) provided between the electrode parts (12, 14); a plate body (18) that is disposed along the element part (16) and that comprises an insulation body; and an exterior member (20) that covers the element part (16) and the plate body (18). In this configuration, transmission of heat when melting and cutting the element part (16) because of overcurrent is blocked by the plate body (18). Accordingly, since transmission of heat to the exterior member (20) at the time of being melted and cut is suppressed, deformation of the exterior member (20) caused by heat at the time of being melted and cut can be suppressed. Therefore, a change in the external shape of the circuit protection element (10) can be suppressed.
H01H 85/045 - General constructions or structure of low voltage fuses, i.e. below 1,000 V, or of fuses where the applicable voltage is not specified cartridge type
H01H 85/06 - Fusible members characterised by the fusible material
H01H 85/10 - Fusible members characterised by the shape or form of the fusible member with constriction for localised fusing
A current sensing device including: an insulating resin substrate; a current sensing element arranged in the resin substrate; a current wire provided via an insulating layer with respect to the current sensing element to flow a current through the current sensing element; a plurality of current vias connecting the current sensing element and the current wire through the insulating layer; and a voltage sensing via connected to the current sensing element to measure a voltage drop.
G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
In the present invention, a shunt resistor 10 comprises a resistor 14, and electrodes 16, 18 joined to the resistor 14 and formed using aluminum as a main component. The shunt resistor 10 also comprises a plated section 30 that covers at least junctions 20, 22 of the resistor 14 and the electrodes 16, 18, and that is formed of a plating of higher specific resistance than the resistor 14.
x6y22O, where x is a number greater than 0 but less than or equal to 2, y is a number greater than 0 but less than or equal to 1, and n is a number greater than or equal to 0.
A resistor is provided with a resistance body and a pair of electrodes connected to the resistance body (a first electrode body, a second electrode body), the resistance body being arranged so as to be at least separated away from a substrate board (a circuit board) when mounted on the substrate board (the circuit board), wherein the resistor has the oxide film on at least one of the resistance body and each of the electrodes (the first electrode body, the second electrode body) at a boundary portion (a bonded portion, a bonded portion) between the resistance body and each of the electrodes (the first electrode body, the second electrode body) on the mounting surface of the resistor.
H01C 17/242 - Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
H01C 1/034 - HousingEnclosingEmbeddingFilling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
H01C 1/144 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered
H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
A resistor contains a resistance body and a pair of electrodes (a first electrode body and a second electrode body), wherein end surfaces of the resistance body are respectively abutted to and bonded to end surfaces of the electrodes (a first electrode body and a second electrode body), the electrodes (a first electrode body and a second electrode body) each includes a main body portion and a leg portion, the leg portion protruding from the main body portion in the mounting surface of the resister, and a length dimension of the resistor is equal to or shorter than 3.2 mm.
The present invention relates to a resistor for high voltages for use in a circuit such as a power supply circuit, and to a method for manufacturing a resistor. A resistor (1) comprises electrodes (3, 4) and a resistive element (10). The resistive element (10) includes a first meandering resistive section (11) and a second meandering resistive section (12), and a trimming resistive section (13) having a trimming groove (20) for adjusting the resistance value.
H01C 17/24 - Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C 7/22 - Elongated resistive element being bent or curved, e.g. sinusoidal, helical
82.
CHIP-TYPE RESISTOR FOR INTEGRATION IN SUBSTRATE, MODULE HAVING INTEGRATED RESISTOR, METHOD FOR PRODUCING MODULE HAVING INTEGRATED RESISTOR, AND TRIMMING METHOD
This metal plate resistor, which is a chip-type resistor for integration in a substrate, is in plate form and comprises a resistive element, a first electrode which is joined to one end of the resistive element by a first cladding joining part, and a second electrode which is joined to the other end of the resistive element by a second cladding joining part.
G01R 15/00 - Details of measuring arrangements of the types provided for in groups , or
H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
An object is to provide a shunt resistor module that is reduced in size, can handle a large current, and can accurately detect current. A shunt resistor module of the present invention includes: a shunt resistor that includes a plurality of resistor bodies having a columnar shape, and electrodes that are located at both ends of each of the plurality of resistor bodies; and a circuit board that includes a plurality of through-holes that can house the plurality of resistor bodies, and a plurality of voltage detection terminals that detects a voltage between the electrodes of the shunt resistor that has been inserted into the plurality of through-holes, and each of the plurality of voltage detection terminals is collected near a center of gravity of the shunt resistor.
H02H 3/087 - Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition, with or without subsequent reconnection responsive to excess current for DC applications
G01R 15/14 - Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
The present invention provides a temperature sensor which has more easily enhanced strength. This temperature sensor is provided with a resin film, and a titanium metal foil that is bonded to the resin film. The titanium metal foil constitutes a conductive pattern. With respect to one embodiment of the present invention, a surface of the titanium metal foil, the surface facing the resin film, has been subjected to a surface modification treatment. With respect to one embodiment of the present invention, the thickness of the titanium metal foil is within the range of 3 to 10 µm. With respect to one embodiment of the present invention, the resin film contains a thermoplastic resin, and the thickness of the resin film is within the range of 20 to 80 µm.
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
G01K 7/16 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements
A sulfidation detection sensor includes a rectangular parallelepiped insulating substrate, a resistor formed to adhere closely to a surface of the insulating substrate, a sulfidation detection conductor formed to adhere closely to a surface of the resistor, a protective layer that is impermeable to sulfide gas and formed to cover a portion of the sulfidation detection conductor, and a pair of electrode portions formed at both ends of the insulating substrate and connected to the resistor and the sulfidation detection conductor. The sulfidation detection conductor is made of metal having a resistance value less than that of the resistor, and includes an exposed portion exposed to the outside without being covered with the protective layer.
237-δ25237-δ7-δ is added to said composition. As a result, interlayer peeling and cracking can be prevented from occurring due to the sinter behavior of the heat insulation layer approaching the sinter behavior of the sensing layer, and by adopting a sandwiched structure in which the sensing layer is interposed between heat insulation layers, the conservation of electric power is made possible by reducing the amount of heat dissipated from the sensing layer.
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
87.
RESISTANCE TYPE OXYGEN GAS SENSOR AND OXYGEN SENSOR DEVICE
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
A chip resistor including: a rectangular parallelepiped insulating substrate; a strip-shaped resistor; a pair of front electrodes formed on a front surface of the resistor at both ends in the longitudinal direction; an insulating protective layer; and a pair of end face electrodes formed at both ends of the insulating substrate in the longitudinal direction, each of which is connected to each end face of the resistor, corresponding one of the front electrodes, and protective film; and a pair of external electrodes, wherein a cross-sectional shape of each of the front electrodes is almost a triangle in which a side of the end face has a maximum height, and a shape of an end face of each of the end face electrodes is almost a square.
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
89.
Chip resistor and method for manufacturing chip resistor
Resistive elements are formed in belt shape in regions sandwiched between secondary division prediction lines set onto a large substrate and extending in a direction orthogonal to primary division prediction lines, a plurality of front electrodes disposed facing each other at predetermined intervals on the resistive elements are formed so as to be across the primary division prediction lines, a glass coat layer covering each of the resistive elements and extending in the direction orthogonal to the secondary division prediction lines is formed, a resin coat layer covering an entire surface of the large substrate from a top of the glass coat layer is formed, and after that, the large substrate is diced along the primary division prediction lines and the secondary division prediction lines to obtain individual chip base bodies.
H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
A chip component comprises: an insulating substrate on which a resistor serving as a functional element is formed; a pair of internal electrodes (front electrodes, end surface electrodes, and back electrodes) that is formed to cover both end portions of the insulating substrate and connected to the resistor; a barrier layer that is formed on a surface of each of the internal electrodes and mainly composed of nickel; and an external connection layer that is formed on a surface of the barrier layer and mainly composed of tin, and the barrier layer is composed of alloy plating (Ni—P) including nickel and phosphorus, which is formed by electrolytic plating, and a content ratio of phosphorus relative to nickel is set in a range of 0.5% to 5% so that the barrier layer has magnetism.
The resistor 5 is a print-formed body including a meandering shaped first region 8 connected to the first front electrode 3 and a second region 9 connected to the first region 8 via a linking portion 10 and connected to the second front electrode 4. The first region 8 is provided with an I-cut shaped first trimming groove 11 and the second region 9 is provided with an L-cut shaped second trimming groove 12, and the side of the second region 9 positioned in the direction toward which a turn portion 12b of the second trimming groove 12 extends is an oblique side 9a that inclines to approach the second front electrode 4 as it approaches the connecting portion 7.
The present invention relates to a current detection device, particularly to a current detection device using a shunt resistor. A current detection device (30) is provided with a resistive body (5) and a pair of electrodes (6, 7). The electrodes (6, 7) have detecting regions (24a, 25a) defined by first slits (16, 17), second slits (26, 27), and contact surfaces (6a, 7a) at least partly contacting the resistive body (5). The electrodes (6, 7) further include voltage detecting portions (20, 21) disposed in the detecting regions (24a, 25a).
The objective of the present invention is to provide a sensor element with which it is possible to obtain a wide sensing area, and with which it is possible to obtain a substantially constant sensor sensitivity by suppressing an uneven temperature distribution in the sensing area. A sensor element (1) according to the present invention includes a base body (2), a temperature-sensitive film (3) which is formed over the entire surface of the base body and of which an electrical resistance value changes in accordance with a change in temperature, and wiring members (4, 5) connected to both ends of the temperature-sensitive film, characterized in that: the temperature-sensitive film includes areas of contact with the wiring members, and a pattern extending from the areas of contact toward the center of the base body; and the cross-sectional area of the pattern is formed to be smaller on the area of contact side than at the center of the base body.
G01P 5/12 - Measuring speed of fluids, e.g. of air streamMeasuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables using variation of resistance of a heated conductor
94.
Resistive material, method of manufacturing resistive material, and resistor for detecting electric current
H01C 7/13 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current-responsive
H01C 17/02 - Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
H01C 17/065 - Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick-film techniques, e.g. serigraphy
95.
Chip resistor and method of manufacturing chip resistor
A chip resistor includes an insulated substrate having a rectangular parallelepiped shape, a first front electrode and a second front electrode created on both longitudinal ends of the insulated substrate, and a resistive element making a connection between the first and second front electrodes. The resistive element is formed in a meandering shape with a first region and a second region continuing in series via a jointing section between a pair of connecting portions. Moreover, in the first region, a first trimming groove for rough adjustment is formed to elongate a current path of the resistive element. In the second region, a second trimming groove is formed for fine adjustment extending in a direction angled with respect to a straight line along a direction in which the first trimming groove extends.
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
H01C 17/22 - Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
The chip-type current fuse is configured to include a fuse element 5 formed between a first front electrode 3 and a second front electrode 4. The fuse element 5 includes: a first linear portion 5a that has an end connected to the first front electrode 3 and extends in a direction toward the second front electrode 4; a second linear portion 5b that has an end connected to the second front electrode 4 and extends in parallel to the first linear portion 5a in a direction toward the first front electrode 3; and an inclined linear portion 5c that links the first linear portion 5a and the second linear portion 5b to each other. The inclined linear portion 5c is connected at an acute angle to each of the first linear portion 5a and the second linear portion 5b.
H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
A sensor device according to the present invention includes: a sensor element including a temperature-sensitive resistor; and a protective cover that protects the sensor element, wherein the sensor element has a shape extending long along one direction, and the protective cover surrounds a periphery of the sensor element with a plurality of support pillars extending obliquely with respect to a longitudinal direction of the sensor element. It is preferable that the plurality of support pillars intersect in a lattice-like manner.
G01K 7/24 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit
A resistor comprising a resistor body and electrodes provided on the resistor body, wherein the resistor body has an oxide film on the front surface thereof.
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C 17/02 - Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
99.
GAS SENSOR AND METHOD FOR PRODUCING ALKALINE EARTH FERRITE
The gas sensor is provided with: a base material; a first electrode and a second electrode arranged on the base material; and a gas detection member connected to the first electrode and the second electrode, wherein the gas detection member contains flaky particles of alkaline earth ferrite.
G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
Provided is a mounting structure for a chip component having high heat-shock resistance. In the mounting structure for a chip resistor 1 according to the present invention, the separation distance L1 between a pair of rear-surface electrodes 3 formed on an insulation substrate 2 of a chip resistor 20 is set lower than the separation distance L2 between a pair of lands 31 provided to a circuit substrate 30. Thick-walled sections (first electrode sections 3a) are formed in the rear-surface electrodes 3. External electrodes 9 bonded to the rear-surface electrodes 3 are connected to the corresponding lands 31 via solder 32 in a state in which the tops of the thick-walled sections are positioned directly above inner-side ends of the lands 31.
H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
H01C 1/148 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
