Abstract

The present invention relates to a zinc oxide varistor and a method for producing a zinc oxide varistor. This zinc oxide varistor comprises a varistor element and multiple electrodes. The varistor element contains zinc oxide as the main component and is formed of a mixture obtained by adding an oxide and lithium fluoride to zinc oxide.

IPC Classes  ?

• H01C 7/112 - ZnO type

Abstract

Provided is a layered resistor that has a low profile but still suppresses short circuiting caused by solder wetting.　A layered resistor according to the present invention includes a resistance element that has a thin plate shape and has a first flat surface and a second flat surface in the thickness direction, a first electrode that is formed on the first flat surface, and a second electrode that is formed on the second flat surface. The resistance element includes a nickel/chromium or iron/chromium metal material, the second electrode is opposite a circuit pattern when the layered resistor is mounted on a circuit board, and the thickness of the resistance element is 3–8 times the thickness of the second electrode.

IPC Classes  ?

• H01C 13/00 - Resistors not provided for elsewhere
• H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Abstract

This resistor comprises a die pad and a circuit body disposed on the die pad, wherein the circuit body includes an insulating substrate, a first circuit element and a second circuit element disposed on the insulating substrate, and an insulating portion disposed between the first circuit element and the second circuit element to insulate the first circuit element and the second circuit element, and the die pad and the circuit body are covered with an insulating resin.

IPC Classes  ?

• H01C 1/034 - HousingEnclosingEmbeddingFilling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
• G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
• H01C 1/148 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
• H01C 13/02 - Structural combinations of resistors
• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• H10D 89/00 - Aspects of integrated devices not covered by groups

Abstract

A circuit protection device includes a pair of electrode portions, an element portion provided between both of the electrode portions and a plate body arranged so as to extend along the element portion. The plate body is made of an insulator, and the circuit protection device further includes an exterior member configured to cover the element portion and the plate body.

IPC Classes  ?

• H01H 85/055 - Fusible members
• H01H 85/143 - Electrical contactsFastening fusible members to such contacts
• H01H 85/165 - Casings

Abstract

A load sensor element include: a substrate; an inorganic layer that is a first layer provided on a front surface that is a first surface of the substrate, the inorganic layer being configured to cover a part of the substrate; and a thin-film resistance body provided on the front surface. The thin-film resistance body has: a main body portion that is sandwiched between the substrate and the inorganic layer; and a first end portion and a second end portion that are mounted on an exposed portion of the substrate that is not covered by the inorganic layer. The load sensor element includes a reinforcing layer that is a second layer provided on a back surface that is a second surface of the substrate so as to sandwich the substrate together with the inorganic layer. In the load sensor element, the inorganic layer and the reinforcing layer are arranged such that an inorganic-layer first end edge of the inorganic layer that is in contact with the front surface and a reinforcing-layer first end edge of the reinforcing layer that is in contact with the back surface are aligned with each other in the thickness direction of the substrate.

IPC Classes  ?

• G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges

Abstract

The present invention relates to a shunt resistor and a current detection apparatus. A current detector (2) includes voltage detection terminals (8A, 8B) provided at first characteristic positions of the electrodes (6, 7) where a temperature coefficient of resistance of a shunt resistor (1) has a first coefficient, and voltage detection terminals (8C, 8D) provided at second characteristic positions of the electrodes (6, 7) where a temperature coefficient of resistance of the shunt resistor (1) has a second coefficient. The first coefficient and the second coefficient have different numerical values.

IPC Classes  ?

• G01R 15/14 - Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
• G01K 7/00 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat

Abstract

A load sensor element includes a substrate and an inorganic layer having a pressure receiving surface configured to receive a load, the inorganic layer being provided so as to cover a part of a front surface that is a first surface of the substrate. The load sensor element includes a thin-film resistance body formed by a resistance body whose resistance value is changed in response to the load received by the inorganic layer. The thin-film resistance body has: a main body portion sandwiched between the substrate and the inorganic layer, and a first end portion and a second end portion that are both end portions mounted on an exposed portion of the substrate that is not covered by the inorganic layer. The load sensor element includes a first temperature-compensation resistance body independent from the thin-film resistance body, the first temperature-compensation resistance body being arranged on the exposed portion of the front surface that is the first surface of the substrate. The load sensor element includes a second temperature-compensation resistance body arranged on a back surface that is a second surface of the substrate, the second temperature-compensation resistance body being configured to exhibit the same behavior as the first temperature-compensation resistance body.

IPC Classes  ?

• G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges

Abstract

The present invention provides a sulfurization detection sensor capable of accurately detecting a degree of sulfurization.　A sulfurization detection sensor 1 comprises: a rectangular parallelepiped insulating substrate 2; a pair of front electrodes 3 formed at both ends in the longitudinal direction of a surface of the insulating substrate 2; a sulfurization detection conductor 4 connected to the pair of front electrodes 3 via a resistor 5; first insulating resin 6 having sulfide gas permeability and covering the entire sulfurization detection conductor 4; and second insulating resin 7 having sulfide gas impermeability and covering an upper surface of the first insulating resin 6. The first insulating resin 6 has an exposed part 6a that is not covered with the second insulating resin 7.

IPC Classes  ?

• G01N 27/04 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
• G01N 27/00 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
• G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid

Abstract

The present invention relates to a method for manufacturing a resistor. The method for manufacturing a resistor includes: a step for preparing a plate-like clad material; and a step for forming a pair of connection surfaces by forming a slit that reaches a resistance material from one side in the height direction of the clad material.

IPC Classes  ?

• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
• G01R 15/00 - Details of measuring arrangements of the types provided for in groups , or
• H01C 13/00 - Resistors not provided for elsewhere

Abstract

The shunt resistor includes: the resistance body; and the electrode joined to the resistance body and made of aluminum as a main component. In addition, the shunt resistor includes the plated portion configured to cover at least the joined portions between the resistance body and the electrode the plated portion being configured of a plating having higher specific resistance than the resistance body.

IPC Classes  ?

• H01C 13/00 - Resistors not provided for elsewhere
• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors

Abstract

The present invention relates to an all-solid-state ion-selective electrode having an insertion material, and a method of manufacturing such an all-solid-state ion-selective electrode. The all-solid-state potassium ion-selective electrode (1) includes: a conductor (2); an insertion material (10) formed on a surface of the conductor (2); and a potassium ion-sensitive membrane (20) covering the insertion material (10). The insertion material (10) includes at least a Prussian blue analog represented by a structural formula KxFe[Fe(CN)6]y·nH2O, where x is a numerical number larger than 0 and less than or equal to 2, y is a numerical number larger than 0 and less than or equal to 1, and n is a numerical number larger than or equal to 0.

IPC Classes  ?

• G01N 27/333 - Ion-selective electrodes or membranes

Abstract

A chip resistor 1, which is excellent in the surge characteristics and also suitable for miniaturization, is formed by printing into a crank shape, and a first area S1 surrounded by a parallelogram is a portion where a large amount of current flows while two second areas S2a, S2b located outside the first area S1 are portions with small current distributions. A trimming groove 12 for adjustment of a resistance value is formed into an L-cut shape as a whole such that it has a coarse adjustment portion 12a formed to pass through the second area S2a and extend into the first area S1 and a fine adjustment portion 12b formed to pass through the first area S1 from the distal end of the coarse adjustment portion 12a and extend to a position reaching the second area S2a again.

IPC Classes  ?

• H01C 7/18 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
• H01C 1/01 - MountingSupporting
• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors

Abstract

Disclosed is a stacked resistor which includes: a resistor that is in the form of a plate and has a first flat surface and a second flat surface in the thickness direction; a first electrode that is formed on the first flat surface; and a second electrode that is formed on the second flat surface. The resistor is composed of: a metal body that is formed of a conductive metal material; and insulating particles that are formed of an insulating material. The insulating particles include first insulating particles that have a particle diameter of 5 μm or more. This stacked resistor is configured such that an end surface of the resistor is exposed and the second electrode is connected via a solder when mounted to a printed board.

IPC Classes  ?

• H01C 13/00 - Resistors not provided for elsewhere
• H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors

Abstract

This multilayer resistor is configured as a multilayer structure comprising: a resistor of a plate-form shape, the resistor having a first flat surface and a second flat surface in the thickness direction thereof; a first electrode that is formed on the first flat surface; and a second electrode that is formed on the second flat surface. The multilayer resistor comprises a base electrode layer that is disposed on the first flat surface, the first electrode is formed on the base electrode layer, the resistor is configured from a metal body that is composed of an electroconductive metal material and insulating particles that are composed of an insulating material, and the insulating particles include first insulating particles that have a particle diameter of 5 μm or greater.

IPC Classes  ?

• H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
• H01C 13/00 - Resistors not provided for elsewhere
• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors

Abstract

A chip resistor includes an insulating substrate, a pair of front electrodes provided on the insulating substrate, a resistor provided to connect between the pair of front electrodes, a glass body provided on the resistor, a trimming groove formed in the resistor through the glass body, a first protective film formed to cover the trimming groove, a second protective film formed to cover the first protective film, a pair of end face electrodes formed to be connected to the front electrodes, and a pair of external plating layers formed to cover the end face electrodes, respectively, wherein the first protective film is made of a resin material containing a heat dissipating filler, and the second protective film is made of a resin material.

IPC Classes  ?

• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
• H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
• H01C 17/242 - Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
• H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

Provided is a chip resistor excellent in surge characteristics and suitable for miniaturization.　In a chip resistor 1 according to the present invention, a first trimming groove 12 and a second trimming groove 13 are formed as starting positions having point symmetry at an upper side and a lower side of a first resistor part 7a, on a crank-shaped resistor 7 having the first resistor part 7a, a second resistor part 7b, and a third resistor part 7c. The terminal positions of the first trimming groove 12 and the second trimming groove 13 are set so as not to cross over a first straight line A extending in an X-axis direction through the center (O point) of the first resistor part 7a and so as not to overlap on the same Y-axis.

IPC Classes  ?

• H01C 17/24 - Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Abstract

This current detecting device comprises a resistor which has a stacked structure stacked in a thickness direction and which has a plate-shaped first electrode, a plate-shaped second electrode, and a plate-shaped resistive body disposed between the first electrode and the second electrode, and a plate-shaped first conductor connected to the resistor, and the current detecting device is connected to a power module, wherein: the power module comprises a plate-shaped second conductor connected to the resistor, and a first voltage detecting terminal and a second voltage detecting terminal; an upper surface of the first electrode and a lower surface of the first conductor on an end portion side thereof are connected to one another; a lower surface of the second electrode and an upper surface of the second conductor are connected to one another; the resistor is disposed so as to be stacked between the first conductor and the second conductor; the second voltage detecting terminal is connected to the second conductor or the second electrode; the first conductor comprises a thin plate portion having a thickness in the stacking direction that is less than a first thickness, in a region overlapping the first electrode when viewed from the stacking direction; and an upper surface of the thin plate portion and the first voltage detecting terminal are connected to one another by a wire.

IPC Classes  ?

• G01R 15/00 - Details of measuring arrangements of the types provided for in groups , or
• H01C 3/00 - Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven, or formed as grids
• H01C 13/00 - Resistors not provided for elsewhere

Abstract

This current detection device is provided with: a lamination-structure resistor having plate-like first electrode and second electrode, and a plate-like resistor disposed between the first electrode and the second electrode; and a voltage detection substrate having plate-like first conductor and second conductor which are connected to the resistor, plate-like first voltage terminal and second voltage terminal which detect a voltage, and a first voltage detection pattern and a second voltage detection pattern. The first conductor is connected to the first electrode via a flat portion of the first voltage terminal, and the second conductor is connected to the second electrode via a flat portion of the second voltage terminal. The resistor is laminated between the flat portion of the first voltage terminal and the flat portion of the second voltage terminal and between the first conductor and the second conductor. A connection portion of the first voltage terminal is connected to one end of the first voltage detection pattern, a connection portion of the second voltage terminal is connected to one end of the second voltage detection pattern, and the voltage detection substrate is interposed between the connection portion of the first voltage terminal and the connection portion of the second voltage terminal.

IPC Classes  ?

• G01R 15/00 - Details of measuring arrangements of the types provided for in groups , or
• H01C 3/00 - Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven, or formed as grids
• H01C 13/00 - Resistors not provided for elsewhere

Abstract

The present invention provides a configuration for more precisely detecting current when a shunt resistor is sandwiched and connected by plate-like wiring such as a bus bar or lead frame. A current detection device according to the present invention is provided with: a resistor with a laminated structure having a plate-like first electrode and second electrode, and a plate-like resistor disposed between the first electrode and the second electrode; and a plate-like first conductor and second conductor, through which a current to be measured flows and which are connected to the resistor. The first conductor is connected to the first electrode, the second conductor is connected to the second electrode, the resistor is laminated and disposed between the first conductor and the second conductor, and a first insulating layer and a first voltage detection pattern disposed via the first insulating layer for transmitting a voltage signal, are provided on one surface of the first conductor.

IPC Classes  ?

• G01R 15/00 - Details of measuring arrangements of the types provided for in groups , or
• G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof

Abstract

An electronic component that can secure a creepage distance between electrode terminals has a structure in which an upper portion having a rectangular shape in plan view and a predetermined thickness, a housing portion formed at the center on an undersurface side of the upper portion to house a resistance element, and first, second, and third protruding portions, each of which extends in a vertical direction from the undersurface side of the upper portion to serve as a leg portion, are formed. A concave portion having a predetermined depth is formed between the first and third protruding portions and between the second and third protruding portions on the undersurface side of the upper portion, such that the concave portion extends from one side in a widthwise direction on the undersurface side to the other side through the housing portion to secure a long creepage distance between electrode terminals.

IPC Classes  ?

• H01C 1/028 - HousingEnclosingEmbeddingFilling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors

Abstract

A metal plate resistor that is a built-in chip resistor for substrate has a plate shape including a resistance body, a first electrode bonded to a first end of the resistance body with a first clad portion, and a second electrode bonded to a second end of the resistance body with a second clad portion.

IPC Classes  ?

• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
• H01C 17/245 - Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by mechanical means, e.g. sand-blasting, cutting, ultrasonic treatment

Abstract

The present invention relates to a metal plate resistor and a method for manufacturing a metal plate resistor. A metal plate resistor (1) is provided with a plate-shaped resistive element (6) formed from a metal material. The resistive element (6) includes a first slit (10A (10B)), a second slit (10B (10A)), and a through hole (11).

IPC Classes  ?

• H01C 3/00 - Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven, or formed as grids
• H01C 13/00 - Resistors not provided for elsewhere
• H01C 17/02 - Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing

Goods & Services

Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers; gas sensors; anemometers; flowmeters; sensors (measurement apparatus), other than for medical use; detectors; measuring devices, electric; electric current control devices; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; voltmeters; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; telecommunication machines and apparatus; LED monitors; thermistors; electronic circuits; integrated circuits; electronic components; resistance wires; electrodes; magnetic cores.

Abstract

Provided is a temperature sensor which can enhance strength more easily. The temperature sensor comprises a resin film and a titanium metal foil laminated on the resin film. The titanium metal foil constitutes a conductive pattern. In an example, the titanium metal foil is subjected to a surface modification on a surface facing the resin film. In an example, a thickness of the titanium metal foil is within a range of 3-10 μm. In an example, the resin film contains a thermoplastic resin, and a thickness of the resin film is within a range of 20-80 μm.

IPC Classes  ?

• G01K 7/18 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer
• H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
• H01C 7/22 - Elongated resistive element being bent or curved, e.g. sinusoidal, helical

Abstract

The objective of the present invention is to provide a wind velocity measuring system having improved usability. A wind velocity measuring system according to the present invention is connected to a terminal device provided with a display panel, and displays a wind velocity measured in a measurement region on the display panel, wherein: the wind velocity is measured by sensor units disposed in the measurement region, and the wind velocity measuring system is provided with either a display function for displaying display portions corresponding to the sensor units on the display panel, and enabling each display portion to be moved arbitrarily on the display panel in accordance with the arrangement of the corresponding sensor unit, or a display function for displaying display portions corresponding to the sensor units on the display panel, and enabling a color display of each display portion to be changed in accordance with a light emission state of the corresponding sensor unit.

IPC Classes  ?

• G01P 13/00 - Indicating or recording presence or absence of movementIndicating or recording of direction of movement
• G01D 7/10 - Indicating value of two or more variables simultaneously using a common indicating element for two or more variables giving indication in co-ordinate form

Goods & Services

Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers; gas sensors; anemometers; flowmeters; sensors (measurement apparatus), other than for medical use; detectors; measuring devices, electric; electric current control devices; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; voltmeters; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; telecommunication machines and apparatus; LED monitors; thermistors; electronic circuits; integrated circuits; electronic components; resistance wires; electrodes; magnetic cores.

Goods & Services

Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers; gas sensors; anemometers; flowmeters; sensors (measurement apparatus), other than for medical use; detectors; measuring devices, electric; electric current control devices; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; voltmeters; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; telecommunication machines and apparatus; LED monitors; thermistors; electronic circuits; integrated circuits; electronic components; resistance wires; electrodes; magnetic cores.

Abstract

The objective of the present invention is to provide a flow rate sensor in which it is possible to automate a resistance adjustment function of a bridge circuit. A flow rate sensor according to the present invention includes a flow rate detection resistance element serving as a temperature-sensitive element in a bridge circuit, and uses a flow rate signal from the bridge circuit to calculate a flow rate in a micro-controller, the flow rate sensor being characterized in that the bridge circuit includes a variable-resistance element that comprises a plurality of fixed resistors having different resistance values and a switch circuit for switching connections of the fixed resistors, a resistance value of the variable-resistance element being varied by switching the fixed resistors that are connected, thereby enabling the microcomputer to automatically adjust the resistance value of the variable resistance element.

IPC Classes  ?

• G01F 1/696 - Circuits therefor, e.g. constant-current flow meters

Abstract

Provided is a chip resistor with excellent anti-corrosiveness by reliably preventing sulfidation corrosion of front electrodes.　A chip resistor 1 of the present invention comprises: a rectangular insulation substrate 2; a pair of front electrodes 4 provided at both ends of the main surface of the insulation substrate 2; a resistor 3 which connects the pair of front electrodes 4; a pair of back electrodes 6 provided at both ends of a back surface of the insulation substrate 2; a pair of protection electrodes 5 composed of a highly sulfur-resistant material provided to overlap with at least ends of the inner sides of the pair of front electrodes 4; a first insulation layer 7 composed of an inorganic material which covers the resistor 3 and the ends of the inner sides of the pair of protection electrodes 5; a second insulation layer 8 composed of an organic material provided on the first insulation layer 7; a pair of end surface electrodes 9 that extend to both end surfaces of the insulation substrate 2 and electrically conducts the front electrodes 3 and the back electrodes 6; and an external plating layer 10 which covers the pair of end surface electrodes 9, wherein the end surface electrodes 10 are provided in a range from the top surface of the protection electrodes 5 to an end of the second insulation layer 8.

IPC Classes  ?

• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors

Abstract

The purpose of the present invention is to provide an optimal sensor system for measuring a three-dimensional space. A sensor system (1) includes: hosts (2); and sensors (3) that are connected to the hosts and that acquire data, the sensor system being characterized in that a plurality of the hosts are daisy-chained together, and a plurality of the sensors are daisy-chained to each of the hosts. It is preferable that the hosts and the sensors each include a higher-level communication control unit that performs communication with a higher-level device and a lower-level communication control unit that performs communication with a lower-level device.

IPC Classes  ?

• H04L 12/28 - Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
• G01P 5/10 - Measuring speed of fluids, e.g. of air streamMeasuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables
• G08C 15/00 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path

Abstract

The chip-type current fuse is configured to include a fuse element 5 formed between a first front electrode 3 and a second front electrode 4. The fuse element 5 includes: a first linear portion 5a that has an end connected to the first front electrode 3 and extends in a direction toward the second front electrode 4; a second linear portion 5b that has an end connected to the second front electrode 4 and extends in parallel to the first linear portion 5a in a direction toward the first front electrode 3; and an inclined linear portion 5c that links the first linear portion 5a and the second linear portion 5b to each other. The inclined linear portion 5c is connected at an acute angle to each of the first linear portion 5a and the second linear portion 5b.

IPC Classes  ?

• H01H 37/76 - Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material

Abstract

The objective of the present invention is to provide multi-linked devices that can be synchronized easily and accurately without the need for complex software correction processing. The multi-linked devices according to the present invention comprise a plurality of devices, including an upper device, a lower device, and one or more intermediate devices located between the upper device and the lower device, the devices being connected in series by means of a communication line to enable data transmission and reception between the devices. The multi-linked devices are characterized in that: a data acquisition request command for controlling the timing at which prescribed data are acquired is associated with each device; the data acquisition request commands for each device are transmitted earlier the farther the corresponding device is from the upper device; and all the data acquisition request commands for the intermediate devices are transmitted sequentially before the data acquisition request command reaches the lower device.

IPC Classes  ?

• H04L 12/28 - Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
• G08C 15/06 - Arrangements characterised by the use of multiplexing for the transmission of a plurality of signals over a common path successively, i.e. using time division
• H04Q 9/00 - Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom

Goods & Services

Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers, namely, high-pressure manometers and manometers being pressure gauges; gas sensors, namely, gas sensors for measuring gas concentration; anemometers; flowmeters; measuring devices, electric, namely, electronic devices for measuring electric current; electric current control devices; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; voltmeters; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; LED monitors; thermistors; electronic circuits; integrated circuits; electronic components, namely, piezoelectric switches; resistance wires; electrodes; magnetic cores

Goods & Services

(1) Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers; gas sensors; anemometers; flowmeters; sensors (measurement apparatus), other than for medical use; detectors; measuring devices, electric; electric current control devices; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; voltmeters; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; telecommunication machines and apparatus; LED monitors; thermistors; electronic circuits; integrated circuits; electronic components; resistance wires; electrodes; magnetic cores.

Abstract

An oxygen sensor element that can achieve electric power saving without losing sensor characteristics has a structure in which an outer surface of a ceramic sintered body as a sensing layer made of a composition LnBa2Cu3O7−δ (Ln denotes rare earth element) is covered with heat insulating layers. A heat insulating material having a composition Ln2BaCuO5 is used for the heat insulating layers, and that composition Ln2BaCuO5 is added with 20 mol % of LnBa2Cu3O7−δ. This allows a sintering behavior of the heat insulating layers to come close to a sintering behavior of the sensing layer, and can thus prevent the occurrence of separation of the layers and cracks. The oxygen sensor element has a sandwich structure where the sensing layer is sandwiched between the heat insulating layers, thereby reducing the amount of heat dissipated from the sensing layer, and making it possible to achieve electric power saving.

IPC Classes  ?

• G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
• G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups

Abstract

1+x2-x3δδ (where RE represents a rare-earth element, δ represents the oxygen nonstoichiometry amount, and a substitution amount x satisfies 0≤x≤2) and which is partially substituted with an element selected from group 2 elements in the periodic table and/or an element selected from lanthanoid elements.

IPC Classes  ?

• G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid

Abstract

Provided is an oxygen sensor element that enables reduced power consumption while maintaining sensor sensitivity. To achieve this purpose, there is provided an oxygen sensor element that utilizes a hotspot phenomenon in which a voltage is applied to a sensor element in which a constricted part 7 is formed in the longitudinal center of a ceramic sintered compact 5 which is a sensing layer, and the constricted part 7 becomes red hot, wherein the amount of heat radiation from the sensing layer is reduced and power consumption can be reduced by setting the difference ∆L1 between L1 and Lh such that 0.33 mm ≤ ∆L1 ≤ 1.0 mm, for example, where L1 is the length of the constricted part 7 in the longitudinal direction, and Lh is the length, in the longitudinal direction, of a region that includes the constricted part 7 and in which the temperature difference relative to the hot spot is 90% or less.

IPC Classes  ?

• G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid

Goods & Services

Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers, namely, high-pressure manometers and manometers being pressure gauges; gas sensors, namely, gas sensors for measuring gas concentration; anemometers; flowmeters; measuring devices, electric, namely, electronic devices for measuring electric current; electric current control devices; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; voltmeters; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; LED monitors; thermistors; electronic circuits; integrated circuits; electronic components, namely, piezoelectric switches; resistance wires; electrodes; magnetic cores

Goods & Services

(1) Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers; gas sensors; anemometers; flowmeters; sensors (measurement apparatus), other than for medical use; detectors; measuring devices, electric; electric current control devices; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; voltmeters; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; telecommunication machines and apparatus; LED monitors; thermistors; electronic circuits; integrated circuits; electronic components; resistance wires; electrodes; magnetic cores.

Goods & Services

(1) Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers; gas sensors; anemometers; flowmeters; sensors (measurement apparatus), other than for medical use; detectors; measuring devices, electric; electric current control devices; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; voltmeters; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; telecommunication machines and apparatus; LED monitors; thermistors; electronic circuits; integrated circuits; electronic components; resistance wires; electrodes; magnetic cores.

Goods & Services

Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers, namely, high-pressure manometers and manometers being pressure gauges; gas sensors, namely, gas sensors for measuring gas concentration; anemometers; flowmeters; measuring devices, electric, namely, electronic devices for measuring electric current; electric current control devices; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; voltmeters; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; LED monitors; thermistors; electronic circuits; integrated circuits; electronic components, namely, piezoelectric switches; resistance wires; electrodes; magnetic cores

Abstract

A current detection circuit, including: an output circuit to output a signal indicating a voltage drop between a pair of detection terminals; an amplifier circuit to amplify the signal from the output circuit; an AD conversion circuit to generate a digital signal by sampling, at a predetermined cycle, an amplified signal amplified by the amplifier circuit; a filter circuit configured to extract, from the amplified signal amplified by the amplifier circuit, a noise component having a frequency higher than a sampling frequency of the AD conversion circuit; a comparing unit to output a comparison signal indicating a noise detection timing at which an output signal of the filter circuit exceeds a predetermined reference value for detecting the noise component; and an arithmetic circuit to delay a timing at which the amplified signal is sampled by the AD conversion circuit for a predetermined time based on the comparison signal.

IPC Classes  ?

• H02M 1/00 - Details of apparatus for conversion
• H02M 7/5387 - Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only, e.g. single switched pulse inverters in a bridge configuration
• H03F 3/45 - Differential amplifiers

Abstract

The present invention relates to a current detection device, in particular a current detection device using a shunt resistor. The current detection device (30) includes a resistive element (5) and a pair of electrodes (6, 7). The electrodes (6, 7) have detection areas (24a, 25a) demarcated by first slits (16, 17), second slits (26, 27), and contact surfaces (6a, 7a) that at least partially contacts the resistive element (5). The electrodes (6, 7) further have voltage detection portions (20, 21) arranged in the detection areas (24a, 25a).

IPC Classes  ?

• G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
• G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof

Abstract

Provided is a sensor element capable of obtaining a wide sensing region, suppressing unevenness of a temperature distribution in the sensing region, and obtaining substantially constant sensor sensitivity. A sensor element according to the present invention includes: a base; a temperature-sensitive film formed on an entire surface of the base and having an electric resistance value that changes due to a change in temperature; and wiring members connected to both ends of the temperature-sensitive film. The temperature-sensitive film includes connection regions connected to the wiring members and a pattern extending from each of the connection regions toward a center of the base, and a cross-sectional area of the pattern is smaller on the connection region sides than at the center of the base.

IPC Classes  ?

• G01F 1/692 - Thin-film arrangements

Abstract

In a resistive oxygen gas sensor, an oxygen gas detection member for detecting oxygen gas contains, as a main component, a semiconductor material having a composition formula represented by RE(Ba2-x, REx)Cu3O, (wherein, RE is a rare earth element, x is 0≤x≤ 1.2, and y is 6.0≤y≤7.5).

IPC Classes  ?

• G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid

Abstract

A copper alloy material having a low volume resistivity, a low TCR and a small thermal electromotive force with respect to copper and a shunt resistor comprising a resistive body formed by the copper alloy material are provided. The copper-manganese-based copper alloy material includes 4.5-5.5 mass % of manganese, 0.1-0.3 mass % of iron, 0.1-0.5 mass % of tin, and a balance being copper. A volume resistivity is 15-25 μΩ·cm. An absolute value of TCR is 150×10−6/K or less. A thermal electromotive force with respect to copper is 1 μV/K or less. A resistance value change is −0.3% to 0% in a heat resistance test of 175° C. for 3000 hours.

IPC Classes  ?

• C22C 9/05 - Alloys based on copper with manganese as the next major constituent
• G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments

Abstract

Provided is a resistor provided with a resistance body and electrodes provided on the resistance body, and the resistance body has an oxide film on a surface.

IPC Classes  ?

• H01C 1/032 - HousingEnclosingEmbeddingFilling the housing or enclosure plural layers surrounding the resistive element
• H01C 17/02 - Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
• H01C 17/26 - Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by converting resistive material

Abstract

The present invention relates to a shunt resistor. This shunt resistor (1) comprises at least two elements (150) that are attached to an electrode member (10). The at least two elements (150) are provided with resistors (5) that have different specific resistances.

IPC Classes  ?

• H01C 13/02 - Structural combinations of resistors
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H01C 13/00 - Resistors not provided for elsewhere

Abstract

A chip component 10 comprises: an insulating substrate 1 on which a resistor 3 serving as a functional element is formed; a pair of internal electrodes (front electrodes 2, end surface electrodes 6, and back electrodes 5) that is formed to cover both end portions of the insulating substrate 1 and connected to the resistor 3; a barrier layer 8 that is formed on a surface of each of the internal electrodes and mainly composed of nickel; and an external connection layer 9 that is formed on a surface of the barrier layer 8 and mainly composed of tin, and the barrier layer 8 is composed of alloy plating (Ni—P) including nickel and phosphorus, which is formed by electrolytic plating, and a content rate of phosphorus in the alloy plating of an inner region is made different from that of an outer region so that at least the inner region of the barrier layer 8 has magnetic properties.

IPC Classes  ?

• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
• C25D 3/56 - ElectroplatingBaths therefor from solutions of alloys
• C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
• C25D 7/06 - WiresStripsFoils
• C25D 21/12 - Process control or regulation
• H01C 1/032 - HousingEnclosingEmbeddingFilling the housing or enclosure plural layers surrounding the resistive element
• H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
• H01C 17/242 - Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser

Abstract

The present invention relates to a shunt resistor and a shunt resistor manufacturing method. A shunt resistor (1) comprises a pair of electrodes (6, 7) connected to both ends of a resistor element (5). The pair of electrodes (6, 7) has a pair of voltage detection units (20, 21), and a hole (70) is provided in the resistor element (5) between the pair of voltage detection units (20, 21).

IPC Classes  ?

• H01C 13/00 - Resistors not provided for elsewhere
• H01C 1/144 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered
• H01C 17/232 - Adjusting the temperature coefficientAdjusting value of resistance by adjusting temperature coefficient
• H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals

Abstract

The present invention provides: a temperature sensor which enables further simplification of a step for connecting a terminal; and a current detection device.　This temperature sensor for measuring the temperature of a shunt resistor is provided with: a resin film which has a first surface and a second surface; a first conductive pattern which is provided on the first surface side of the resin film and serves as a temperature sensing part; and a pair of second conductive patterns which are provided on the first surface side or the second surface side of the resin film for the purpose of detecting the voltage of the shunt resistor.

IPC Classes  ?

• G01K 7/16 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements
• G01K 1/14 - SupportsFastening devicesArrangements for mounting thermometers in particular locations
• G01R 15/00 - Details of measuring arrangements of the types provided for in groups , or
• G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
• G01R 19/32 - Compensating for temperature change

Abstract

A resistor 10, which is an electronic component that provides suppression of thermal effects on a circuit board, has a structure in which an exterior member 5 encloses, inter alia: a resistor body 7 formed in a central area 6 of a first surface of an insulating substrate 2 and internal electrodes 8a to 8d that are formed in opposing edge areas 9a, 9b that sandwich the central area 6, wherein, at an upper surface portion of the exterior member 5, a second surface of the insulating substrate 2 is close-contactably exposed to an outer metal member 14. In addition, within a lower surface portion of the exterior member 5, protrusions 5a, 5b, which distance the resistor 10 from a circuit substrate 12, are formed at locations that contain a lead-out section of a lead terminal 3a to 3d and a corresponding region in the thickness direction of the exterior member.

IPC Classes  ?

• H01C 1/084 - Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
• H01C 1/028 - HousingEnclosingEmbeddingFilling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
• H01C 1/034 - HousingEnclosingEmbeddingFilling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath

Abstract

The present invention relates to a resistor, particularly to a surface-mount resistor. A resistor (1) comprises protrusions (10, 10) that are formed on side surfaces (3c, 3c) of a pair of cap-like electrodes (3, 3).

IPC Classes  ?

• H01C 1/148 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Abstract

An electronic component according to an embodiment of the present invention includes: a chip; a die pad to which the chip is secured; a suspension terminal extending from the die pad; a lead terminal electrically connected to the chip; and a dummy terminal, in which the suspension terminal is disposed closer to the dummy terminal than the lead terminal.

IPC Classes  ?

• H01L 23/495 - Lead-frames
• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

Provided is a mounting structure for a chip component having high thermal shock resistance. In amounting structure for a chip resistor 1 according to the present invention, a separation distance L1 between a pair of back surface electrodes 3 formed on an insulating substrate 2 of a chip resistor 20 is set to be shorter than a separation distance L2 between a pair of lands 31 provided on a circuit board 30. Each of the back surface electrodes 3 is formed with a thick portion (first electrode portion 3a), and an external electrode 9 deposited on the back surface electrode 3 is connected on the corresponding land 31 via solder 32 with a top portion of the thick portion made positioned directly above an inner end of the land 31.

IPC Classes  ?

• H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H01L 23/13 - Mountings, e.g. non-detachable insulating substrates characterised by the shape

Abstract

An object is to provide a sensor device capable of highly accurately detecting a flow rate at 360 degrees in a radial direction with respect to a first sensor element including a resistive element for flow rate detection. A sensor device according to the present invention includes a substrate, a first sensor element including a resistive element for flow rate detection, and a second sensor element including a resistive element for temperature compensation. Each of the first sensor element and the second sensor element is supported to be separated from a surface of the substrate via a pair of lead wires, and the first sensor element is disposed at a higher position than the second sensor element.

IPC Classes  ?

• G01F 1/69 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
• G01F 1/696 - Circuits therefor, e.g. constant-current flow meters

Abstract

x6y22O, at least a portion of the Prussian blue analog particles has a monoclinic crystal structure, x is a number of 1.5-2, y is a number greater than 0 and less than or equal to 1, and n is a number greater than or equal to 0.

IPC Classes  ?

• G01N 27/333 - Ion-selective electrodes or membranes
• G01N 27/416 - Systems

Abstract

xxFeFe, wherein x represents a number that is more than 0 but not more than 2.

IPC Classes  ?

• G01N 27/333 - Ion-selective electrodes or membranes
• G01N 27/416 - Systems

Goods & Services

Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers; gas sensors; anemometers; flowmeters; sensors [measurement apparatus], other than for medical use; detectors; measuring devices, electric; electric current control devices; power distribution or control machines and apparatus; rotary converters; phase modifiers; electric resistances; fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; electric current sensors; voltmeters; electric or magnetic meters and testers; electric conductors; electric resistors for telecommunication apparatus; electric coils; fuses for telecommunication apparatus; parts and accessories for telecommunication machines and apparatus; telecommunication machines and apparatus; LED monitors; thermistors; semi-conductor elements; electronic circuits; integrated circuits; electronic components; resistance wires; electrodes; magnetic cores.

Goods & Services

Temperature sensors; inclinometers; pressure sensors; pressure gauges; manometers being pressure gauges; gas sensors for measuring gas concentration; anemometers; flowmeters; electronic devices for measuring electric current; electric current control devices; electric power distribution machines; rotary converters; phase modifiers; electric resistances; electrical fuses; electronic inductors; electrical inductors; electrical cells and batteries; ammeters; sensors for detecting electric current; voltmeters; electric meters; electric conductors; electric resistors for telecommunication apparatus; electric coils; electrical fuses for telecommunication apparatus; electric resistors for telecommunication apparatus; LED monitors; thermistors; semiconductor power elements; electronic circuits; integrated circuits; electronic components for computers; resistance wires; electrodes; magnetic cores

Abstract

A chip resistor according to the present invention includes an insulating substrate, a pair of back surface electrodes, a pair of top surface electrodes, a resistor, and a pair of end face electrodes. The back surface electrode includes the first electrode portion located inwardly and away from the end face of the insulating substrate, and the two second electrode portions arranged on two portions, respectively, in the short direction of the insulating substrate with the cutout portion, which is positioned between the end face of the insulating substrate and the first electrode portion, being interposed therebetween, and the maximum height of the first electrode portion is set to be more than the maximum height of the second electrode portions.

IPC Classes  ?

• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
• H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors

Abstract

A sensor device according to the present invention includes a substrate including a heat generation portion, a casing including an accommodation portion accommodating the substrate, and a sensor element including a temperature-sensitive resistor and being supported by the substrate, in which the accommodation portion is divided into a plurality of accommodation spaces on a side closer to the sensor element. The accommodation portion is divided into a first accommodation space and a second accommodation space via division plates, and the first accommodation space is formed on a side closer to the sensor element than the second accommodation space, and widely as compared with the second accommodation space.

IPC Classes  ?

• G01F 1/69 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
• G01F 1/692 - Thin-film arrangements
• G01F 1/698 - Feedback or rebalancing circuits, e.g. self heated constant temperature flowmeters
• G01F 15/14 - Casings, e.g. of special material

Abstract

The present invention relates a shunt resistor and a shunt resistance device. The shunt resistor (1) includes an electrode member (10). The electrode member (10) includes a contact portion (10a) contacting a resistance element (5), and a slit (20) formed on the contact portion (10a).

IPC Classes  ?

• H01C 1/144 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• G01R 15/14 - Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks

Abstract

The present invention provides a chip resistor which has excellent corrosion resistance.　A chip resistor 1 according to the present invention is provided with: a rectangular parallelopiped insulating substrate 2; a pair of front electrodes 3 that are formed on opposite ends of the front surface of the insulating substrate 2; a pair of back electrodes 4 that are formed on opposite ends of the back surface of the insulating substrate 2; a resistor 5 that bridges the pair of front electrodes 3; a second insulating layer (protective film) 7 that is formed from a resin material and covers the resistor 5; a third insulating layer (auxiliary film) 8 that is formed from a resin material and is superposed on the second insulating layer 7; a pair of auxiliary electrode layers 9 that are formed from a resin material containing conductive particles and are superposed on the front electrodes 3; a pair of end-face electrodes 10 that extend on opposite end faces of the insulating substrate 2 and enable electrical conduction between the auxiliary electrode layers 9 and the back electrodes 4; and a pair of outer plated layers 11 that are arranged so as to cover the surfaces of the auxiliary electrode layers 9 and the end-face electrodes 10. The auxiliary electrode layers 9 are formed to positions at which end surfaces of the third insulating layer 8 are covered; and the second insulating layer 7 contains a larger amount of an inorganic filler than the third insulating layer 8.

IPC Classes  ?

• H01C 1/032 - HousingEnclosingEmbeddingFilling the housing or enclosure plural layers surrounding the resistive element
• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Abstract

A sensor element (12) has a cross-sectional area that continuously only increases from a positive (+) electrode side toward a negative (−) electrode side, thereby leading a hot spot, which attempts to move to the negative electrode side, to a lower resistance side. A position that is at nearly equal distances from paired electrodes (13 and 15) formed on either end of the sensor element (12) is set as a hot spot generating position, so as to avoid damage to the electrodes due to heat emitted by the hot spot.

IPC Classes  ?

• G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid
• B28B 1/30 - Producing shaped articles from the material by applying the material on to a core, or other moulding surface to form a layer thereon
• B28B 1/48 - Producing shaped articles from the material by removing material from solid section preforms for forming hollow articles, e.g. by punching or boring
• G01N 33/00 - Investigating or analysing materials by specific methods not covered by groups

Abstract

The present invention provides a heterojunction photocatalyst having higher photocatalytic activity than that of a conventional heterojunction photocatalyst. Further, the present invention provides a photocatalyst composite having the heterojunction photocatalyst on a substrate, a method for producing the heterojunction photocatalyst, and a method for producing hydrogen using the heterojunction photocatalyst or the photocatalyst composite The het junction photocatalyst of the present invention has a solid mediator between a hydrogen-evolution photocatalyst and an oxygen-evolution photocatalyst, and the solid mediator is selectively joined to an electrons collecting surface of the oxygen-evolution photocatalyst.

IPC Classes  ?

• B01J 35/00 - Catalysts, in general, characterised by their form or physical properties
• B01J 21/06 - Silicon, titanium, zirconium or hafniumOxides or hydroxides thereof
• B01J 23/68 - Silver or gold with arsenic, antimony, bismuth, vanadium, niobium, tantalum, polonium, chromium, molybdenum, tungsten, manganese, technetium or rhenium
• B01J 35/02 - Solids
• B01J 37/03 - PrecipitationCo-precipitation
• B01J 37/34 - Irradiation by, or application of, electric, magnetic or wave energy, e.g. ultrasonic waves
• B01J 37/36 - Biochemical methods
• C01B 3/04 - Production of hydrogen or of gaseous mixtures containing hydrogen by decomposition of inorganic compounds, e.g. ammonia
• C01B 3/26 - Production of hydrogen or of gaseous mixtures containing hydrogen by decomposition of gaseous or liquid organic compounds of hydrocarbons using catalysts
• B01J 23/00 - Catalysts comprising metals or metal oxides or hydroxides, not provided for in group

Abstract

The present invention relates to a jumper element, a shunt resistor apparatus, and a method of adjusting characteristic of a shunt resistor apparatus for current detection. The jumper element (10) for constituting the shunt resistor apparatus for current detection is made of conductive metal material. The jumper element (10) includes: a body structure (11) that can be coupled to a resistance element (5) constituting a part of the shunt resistor apparatus; and a protrusion (12) formed on a side portion of the body structure (11), wherein the protrusion (12) is located so as not to overlap the resistor element (5).

IPC Classes  ?

• G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
• G01R 15/14 - Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks

Abstract

a of the lower surface electrodes 5 and entire surfaces of the resin electrode layers 6, respectively.

IPC Classes  ?

• H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element

Abstract

The present invention pertains to a shunt resistor and a shunt resistance device. A shunt resistor (1) comprises at least two stacked elements (50) which are each attached to an electrode member (10) and have a resistor (5). The electrode member (10) has at least two contact parts (10a) that come in contact with the at least two stacked elements (50).

IPC Classes  ?

• H01C 13/00 - Resistors not provided for elsewhere
• G01R 15/00 - Details of measuring arrangements of the types provided for in groups , or
• H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element

Abstract

Provided is a current detection resistor, such as a shunt resistor, wherein a. low specific resistance and a small thermal electromotive force with respect to copper are achieved, while maintaining a low TCR. A resistance alloy for use in a current detection shunt resistor includes 4.5 to 5.5 mass % of manganese, 0.05 to 0.30 mass % of silicon, 0.10 to 0.30 mass % of iron, and a balance being copper, and has a specific resistance of 15 to 25 μΩ·m.

IPC Classes  ?

• H01C 1/00 - RESISTORS Details
• C22C 9/05 - Alloys based on copper with manganese as the next major constituent
• C22F 1/02 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
• C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
• H01C 7/13 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current-responsive

Abstract

The present invention relates to a shunt resistor and a current detection device. A current detection unit (2) includes voltage detection terminals (8A, 8B) provided at first characteristic positions on electrodes (6, 7) where the temperature coefficient of resistance of a shunt resistor (1) is a first coefficient, and voltage detection terminals (8C, 8D) provided at second characteristic positions on the electrodes (6, 7) where the temperature coefficient of resistance of the shunt resistor (1) is a second coefficient. The first coefficient and the second coefficient are different numerical values.

IPC Classes  ?

• G01R 15/00 - Details of measuring arrangements of the types provided for in groups , or
• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
• H01C 13/00 - Resistors not provided for elsewhere

Abstract

This load sensor element comprises: a substrate; an inorganic layer which is a first layer that is provided on a surface, which is one surface of the substrate, and that covers a section of the substrate; and a thin film resistor that is provided on the surface. The thin film resistor includes: a body section that is sandwiched between the substrate and the inorganic layer; and a first end section and a second end section that are mounted at an exposed section of the substrate that is not covered by the inorganic layer. The load sensor element also comprises a reinforcing layer which is a second layer that is provided on an underside surface, which is the other surface of the substrate, so as to sandwich the substrate together with the inorganic layer. In the load sensor element, the inorganic layer and the reinforcing layer are disposed so that one edge of the inorganic layer which contacts the surface and one edge of the reinforcing layer which contacts the underside surface are aligned in the thickness direction of the substrate.

IPC Classes  ?

• G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
• G01L 1/26 - Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload

Abstract

This load sensor element comprises a substrate, and an inorganic layer which has an accepting surface for accepting a load and which is provided so as to cover a portion of a top surface, which is one surface of the substrate. The load sensor element is provided with a thin-film resistor configured from a resistor having a resistance value that varies in accordance with the load accepted by the inorganic layer. The thin-film resistor includes a main body portion sandwiched between the substrate and the inorganic layer, and one end portion and an other end portion, which are two end portions placed on exposed portions of the substrate that are not covered by the inorganic layer. The load sensor element is provided with a first temperature compensation resistor which is independent of the thin-film resistor and which is disposed on an exposed portion 28 of the top surface, which is said one surface of the substrate. The load sensor element is provided with a second temperature compensation resistor which is disposed on a rear surface, being another surface of the substrate, and which exhibits the same behavior as the first temperature compensation resistor.

IPC Classes  ?

• G01L 1/22 - Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluidsMeasuring force or stress, in general by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
• G01L 1/26 - Auxiliary measures taken, or devices used, in connection with the measurement of force, e.g. for preventing influence of transverse components of force, for preventing overload

Abstract

An object is to provide a flow sensor element is non-directional and has an excellent sensor sensitivity. A flow sensor element includes a base body having a spherical shape, and a temperature-sensitive film pattern that is disposed over the entirety of a surface of the base body, and changes in an electrical resistance value due to a change in temperature. It is preferable that the temperature-sensitive film pattern be formed by trimming a temperature-sensitive film that has been formed on the surface of the base body. In the flow sensor element, the temperature-sensitive film pattern can be disposed over the entirety of the surface of the base body having a spherical shape. This enables a constant sensor sensitivity to be obtained regardless of a direction of a fluid, and the accuracy of detection of a flow rate can be improved.

IPC Classes  ?

• G01F 1/692 - Thin-film arrangements
• G01F 1/684 - Structural arrangementsMounting of elements, e.g. in relation to fluid flow
• G01F 1/696 - Circuits therefor, e.g. constant-current flow meters
• G01K 7/16 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements
• G01K 13/02 - Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
• G01P 5/12 - Measuring speed of fluids, e.g. of air streamMeasuring speed of bodies relative to fluids, e.g. of ship, of aircraft by measuring thermal variables using variation of resistance of a heated conductor
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H01C 7/22 - Elongated resistive element being bent or curved, e.g. sinusoidal, helical
• G01K 7/20 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using resistive elements the element being a linear resistance, e.g. platinum resistance thermometer in a specially-adapted circuit, e.g. bridge circuit

Abstract

−6/K at 100° C. with reference to 25° C.

IPC Classes  ?

• C22C 9/05 - Alloys based on copper with manganese as the next major constituent
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Abstract

Provided is a chip resistor that is capable of ensuring low TCR while increasing electric power even with low resistance.　This chip resistor 1 comprises an insulation substrate 2, a pair of obverse electrodes 3 provided to the two obverse-surface end parts of the insulation substrate 2, a resistor body 5 connecting the two obverse electrodes 3, a glass body 6 provided on the resistor body 5, a low-resistance-value-adjusting trimming groove 5a formed in the resistor body 5 through the glass body 6; a first protection layer 7 formed so as to cover the trimming groove 5a in a region that is further inward than the pair of obverse electrodes 3, a second protection layer 8 formed so as to cover the first protection layer 7, a pair of end-surface electrodes 9 that extend to the two end surfaces of the insulation substrate 2 and are connected to the obverse electrodes 3, and a pair of external plating layers 10 that cover the end-surface electrodes 9. The first protection layer 7 comprises a resin material containing a heat-dissipating filler, and the second protection layer 8 comprises a resin material.

IPC Classes  ?

• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H01C 1/032 - HousingEnclosingEmbeddingFilling the housing or enclosure plural layers surrounding the resistive element

Abstract

This gas sensor is provided with a base material, a first electrode and a second electrode both arranged on the base material, and a gas detection unit connected to the first electrode and the second electrode, in which the gas detection unit is composed of a semiconductor oxide containing calcium ferrite and zirconium as essential components and also containing at least one metal element selected from aluminum, silver and tin.

IPC Classes  ?

• G01N 27/12 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluidInvestigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon reaction with a fluid

Abstract

The present invention relates to a current detecting device and a method for manufacturing the same, and more particularly relates to a current detecting device provided with a shunt resistor, and a method for manufacturing the current detecting device. A current detecting unit (2) comprises: a plurality of pairs of voltage detection contacts (8A to 8H) electrically connected to a pair of electrodes (6, 7) of a shunt resistor (1); a plurality of pairs of voltage signal lines (9A to 9H) connected respectively to the plurality of voltage detection contacts (8A to 8H); a plurality of pairs of conductor element connection terminals (15A to 15H) connected respectively to the plurality of pairs of voltage signal lines (9A to 9H); and a pair of conductor elements (20, 21) attached to any one pair of conductor element connection terminals among the plurality of pairs of conductor element connection terminals (15A to 15H). The pair of conductor element connection terminals is selected in advance on the basis of an actual measurement result of a temperature coefficient of resistance of the shunt resistor (1).

IPC Classes  ?

• G01R 15/00 - Details of measuring arrangements of the types provided for in groups , or
• H01C 13/00 - Resistors not provided for elsewhere

Abstract

A shunt resistor (1) includes: a resistance element (3); a first electrode (5A) and a second electrode (5B) coupled to both sides of the resistance element (3); a first fusion material (6A) and a second fusion material (6B) electrically coupled to the first electrode (5A) and the second electrode (5B), respectively, the first fusion material (5A) and the second fusion material (5B) haying electric conductivity; and at least one board (10) coupled to the first electrode (5A) and the second electrode 15B) by the first fusion material (6A) and the second fusion material (6B). The first fusion material (6A) is arranged in a first through-hole (7A) formed in the first electrode (5A) or the board (10), and the second fusion material (6B) is arranged it as second through-hole (7B) formed in the second electrode (5B) or the board (10).

IPC Classes  ?

• G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
• H01C 1/144 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered
• H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals

Abstract

The present invention relates to a shunt resistor and a current detection device. A shunt resistor (1) comprises a first protrusion (11) and a second protrusion (12). The first protrusion (11) includes a part of a resistive body (5) and a part of a pair of electrodes (6, 7). The second protrusion (12) includes a part of the resistive body (5) and a part of the pair of electrodes (6, 7).

IPC Classes  ?

• H01C 1/144 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered
• H01C 3/00 - Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven, or formed as grids
• H01C 13/00 - Resistors not provided for elsewhere
• G01R 15/00 - Details of measuring arrangements of the types provided for in groups , or

Abstract

Provided is a shunt resistor with an enhanced strength and reduced electrical resistance between a resistive element and terminals of the shunt resistor. This shunt resistor includes a first terminal and a second terminal each made of an electrically conductive metal material; and a resistive element disposed between the first terminal and the second terminal. The first terminal and the second terminal each have a through-hole, and the resistive element is embedded in the through-holes of the first terminal and the second terminal in a depth direction thereof. Regions connecting the resistive element to the first terminal and the second terminal each have an alloy portion formed along an inner peripheral surface of the through-hole.

IPC Classes  ?

• H01C 7/13 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material current-responsive
• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors
• H01C 1/148 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals embracing or surrounding the resistive element
• H01C 1/144 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered

Abstract

A shunt resistor capable of reducing an absolute value of a temperature coefficient of resistance is disclosed. The shunt resistor includes: a base structure including a resistance element and a pair of electrodes; a bridge structure configured to bridge the pair of electrodes and made of a conductor; and connections configured to couple the pair of electrodes to the bridge structure. The bridge structure has a higher resistance than a resistance of the base structure at the connections.

IPC Classes  ?

• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
• G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
• G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
• H01C 1/014 - MountingSupporting the resistor being suspended between, and being supported by, two supporting sections

Abstract

[Problem] To provide an electronic component capable of maintaining the creepage distance between electrode terminals. [Solution] The present invention has a structure obtained forming an upper surface section having a prescribed thickness and having a rectangular shape when seen from a plan view, a resistor element housing section which is formed in the center on the bottom surface side of the upper surface section, and a first projection 3, a second projection 4 and a third projection 5 which function as legs and project in the vertical direction from the bottom surface of the upper surface section. The present invention maintains a long creepage distance between the electrode terminals formed on projections 3 and 4 via recesses of a prescribed depth which are formed on the bottom surface side so as to extend from one side in the short direction thereof across said housing section to the other side in said short direction between the first and third projections and also between the second and third projections on the bottom surface of the upper surface section.

IPC Classes  ?

• H01C 1/028 - HousingEnclosingEmbeddingFilling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Abstract

The present invention provides a resistive material and a method for producing the same wherein a high-temperature pressing step is not required.　Provided is a method for producing a resistive material, the resistive material containing insulating powder and a three-dimensional network metal body surrounding the insulating powder, the production method comprising: a step for coating the insulating powder with a metal film to prepare metal-coated powder; a step for mixing the metal-coated powder with an electrically conductive metal powder to obtain a mixed powder; and a step for sintering the mixed powder at a temperature lower than the melting point of the metal film and the melting point of the metal powder.

IPC Classes  ?

• H01C 17/30 - Apparatus or processes specially adapted for manufacturing resistors adapted for baking
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H01C 13/00 - Resistors not provided for elsewhere
• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors

Abstract

d) of the resistance element (5) parallel to the first direction.

IPC Classes  ?

• G01R 15/14 - Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
• H01C 7/06 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors

Abstract

b) of the resistance element (5), wherein the electrodes (6, 7) have cut portions (11, 12), respectively, the cut portions (11, 12) extending parallel to joint portions (8, 9) of the resistance element (5) and the electrodes (6, 7), and each of the cut portions (11, 12) is located at a position where a relationship Y≤0.80X-1.36 holds, where Y is a distance from each joint portion (6, 7) to each cut portion (11, 12), and X is a length of the joint portions (6, 7) in a width direction of the electrodes (6, 7).

IPC Classes  ?

• H01C 1/144 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered
• H01C 13/00 - Resistors not provided for elsewhere

Abstract

c).

IPC Classes  ?

• G01R 15/14 - Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
• H01C 7/06 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material including means to minimise changes in resistance with changes in temperature
• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors

Abstract

A chip resistor comprises an insulating substrate (component body) on which a resistor is formed, a connection terminal (front electrodes, end face electrodes, and back electrodes) formed at both end portions of the insulating substrate, an under layer formed by electrolytic plating to cover the connection terminal, a barrier layer formed by electrolytic plating to cover the under layer, and an external connection layer which is mainly composed of tin and formed on a surface of the barrier layer, wherein the barrier layer is made of alloy plating mainly composed of nickel and containing 3% to 15% of phosphorus, and the under layer is formed of a copper plated layer that is at least either more malleable or more ductile than the barrier layer.

IPC Classes  ?

• H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
• H01L 23/498 - Leads on insulating substrates

Abstract

The mounting area for an electronic component and a resistor for current detection is reduced. A current detection resistor for detecting current includes a plate-like resistive body, and a first electrode and an opposite second electrode which are stacked in a thickness direction of the resistive body and are disposed so as to sandwich the resistive body. The first electrode has a groove portion.

IPC Classes  ?

• G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
• H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors

Abstract

A manufacturing method of a resistor contains: a step of forming a resistor base material by stacking an electrode material, a resistive material, and an electrode material in this order and by bonding the electrode material, the resistive material, and the electrode material by applying pressure in the stacked direction; a step of passing the resistor base material through a die, the die being formed with an opening portion having a dimension smaller than an outer dimension of the resistor base material; and a step of obtaining an individual resistor from the resistor base material passed through the die.

IPC Classes  ?

• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors
• H01C 17/00 - Apparatus or processes specially adapted for manufacturing resistors

Abstract

Provided is a copper-manganese-nickel based alloy having characteristics (in particular, specific resistance) close to those of a nickel-chromium based alloy. It is also an objective to provide an alloy having high processability compared to a nickel-chromium based alloy. An alloy for a resistive body includes copper, manganese, and nickel, wherein the manganese is 33 to 38% by mass, and the nickel is 8 to 15% by mass.

IPC Classes  ?

• C22C 9/05 - Alloys based on copper with manganese as the next major constituent
• C22C 1/04 - Making non-ferrous alloys by powder metallurgy
• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors

Abstract

A chip resistor includes: an insulating substrate; a pair of front electrodes; a resistor connecting between both the front electrodes; an undercoat layer provided on the resistor; an overcoat layer provided on the undercoat layer, an auxiliary film provided so as to be over a connecting portion between the front electrode and the resistor at a position away from an end face of the insulating substrate; a pair of end face electrodes; and a pair of external plating layers covering the end face electrodes, the front electrodes, and the auxiliary film, wherein the auxiliary film is formed of a resin material containing metal particles, and a portion of the auxiliary film is sandwiched between the undercoat layer and the overcoat layer.

IPC Classes  ?

• H01C 1/142 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being coated on the resistive element
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Abstract

A circuit protection element (10) is provided with: a pair of electrode parts (12, 14); an element part (16) provided between the electrode parts (12, 14); a plate body (18) that is disposed along the element part (16) and that comprises an insulation body; and an exterior member (20) that covers the element part (16) and the plate body (18).　In this configuration, transmission of heat when melting and cutting the element part (16) because of overcurrent is blocked by the plate body (18). Accordingly, since transmission of heat to the exterior member (20) at the time of being melted and cut is suppressed, deformation of the exterior member (20) caused by heat at the time of being melted and cut can be suppressed. Therefore, a change in the external shape of the circuit protection element (10) can be suppressed.

IPC Classes  ?

• H01H 85/045 - General constructions or structure of low voltage fuses, i.e. below 1,000 V, or of fuses where the applicable voltage is not specified cartridge type
• H01H 85/06 - Fusible members characterised by the fusible material
• H01H 85/10 - Fusible members characterised by the shape or form of the fusible member with constriction for localised fusing

Abstract

A current sensing device including: an insulating resin substrate; a current sensing element arranged in the resin substrate; a current wire provided via an insulating layer with respect to the current sensing element to flow a current through the current sensing element; a plurality of current vias connecting the current sensing element and the current wire through the insulating layer; and a voltage sensing via connected to the current sensing element to measure a voltage drop.

IPC Classes  ?

• G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
• G01R 19/00 - Arrangements for measuring currents or voltages or for indicating presence or sign thereof
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 1/16 - Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

In the present invention, a shunt resistor 10 comprises a resistor 14, and electrodes 16, 18 joined to the resistor 14 and formed using aluminum as a main component. The shunt resistor 10 also comprises a plated section 30 that covers at least junctions 20, 22 of the resistor 14 and the electrodes 16, 18, and that is formed of a plating of higher specific resistance than the resistor 14.

IPC Classes  ?

• H01C 13/00 - Resistors not provided for elsewhere

Abstract

x6y22O, where x is a number greater than 0 but less than or equal to 2, y is a number greater than 0 but less than or equal to 1, and n is a number greater than or equal to 0.

IPC Classes  ?

• G01N 27/333 - Ion-selective electrodes or membranes
• G01N 27/416 - Systems

Abstract

A resistor is provided with a resistance body and a pair of electrodes connected to the resistance body (a first electrode body, a second electrode body), the resistance body being arranged so as to be at least separated away from a substrate board (a circuit board) when mounted on the substrate board (the circuit board), wherein the resistor has the oxide film on at least one of the resistance body and each of the electrodes (the first electrode body, the second electrode body) at a boundary portion (a bonded portion, a bonded portion) between the resistance body and each of the electrodes (the first electrode body, the second electrode body) on the mounting surface of the resistor.

IPC Classes  ?

• H01C 17/242 - Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
• H01C 1/034 - HousingEnclosingEmbeddingFilling the housing or enclosure the housing or enclosure being formed as coating or mould without outer sheath
• H01C 1/144 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors the terminals or tapping points being welded or soldered
• H01C 17/28 - Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals

Abstract

A resistor contains a resistance body and a pair of electrodes (a first electrode body and a second electrode body), wherein end surfaces of the resistance body are respectively abutted to and bonded to end surfaces of the electrodes (a first electrode body and a second electrode body), the electrodes (a first electrode body and a second electrode body) each includes a main body portion and a leg portion, the leg portion protruding from the main body portion in the mounting surface of the resister, and a length dimension of the resistor is equal to or shorter than 3.2 mm.

IPC Classes  ?

• H01C 1/14 - Terminals or tapping points specially adapted for resistorsArrangements of terminals or tapping points on resistors

Abstract

The present invention relates to a resistor for high voltages for use in a circuit such as a power supply circuit, and to a method for manufacturing a resistor. A resistor (1) comprises electrodes (3, 4) and a resistive element (10). The resistive element (10) includes a first meandering resistive section (11) and a second meandering resistive section (12), and a trimming resistive section (13) having a trimming groove (20) for adjusting the resistance value.

IPC Classes  ?

• H01C 17/24 - Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
• H01C 7/00 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
• H01C 7/22 - Elongated resistive element being bent or curved, e.g. sinusoidal, helical