A structure that includes: one or more substrates having flexibility; and one or more films in contact with the one or more substrates. The one or more films contain two-dimensional particles including one or plural layers, and a polymer. The one or plural layers include a layer body represented by: MmXn, wherein M is at least one metal of Groups 3-7, X is a carbon atom, a nitrogen atom, or a combination therefor, n is 1 to 4, and m is more than n and 5 or less. A modifier or terminal T exists on a surface of the layer body. A proportion of the two-dimensional particles in the one or more films is 5 to 75 vol % based on 100 vol % of a total of the two-dimensional particles and the polymer, and the two-dimensional particles have a number average particle size of 0.001 μm to 0.8 μm.
A radio frequency circuit includes: a first filter having a passband that includes a transmission band of a first band to which power classes are applicable; a second filter having a passband that includes the transmission band of the first band; a first combiner that includes a first input terminal, a second input terminal, and an output terminal; and a first switch that includes a first terminal, a second terminal, a third terminal, a fourth terminal, and a fifth terminal. The output terminal of the first combiner is connected to an antenna connection terminal.
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
An acoustic wave filter includes input and output terminals and, one or more series arm resonators in a series arm path connecting the input and output terminals, parallel arm resonators connected between the series arm path and a ground, and an inductor connected to the input and output terminal and provided in series in the series arm path. A resonant frequency and an anti-resonant frequency of a parallel arm resonator connected closest to the inductor among the parallel arm resonators are outside a frequency range of the first band.
An electronic circuit module is an electronic circuit module mounted on a motherboard having a power supply source. The electronic circuit module includes a photoelectric conversion unit which performs conversion between an optical signal and an electric signal, a processor unit which performs computational processing by using an electric signal, a power conversion unit which converts power from the power supply source and which supplies power to the photoelectric conversion unit and the processor unit, and a package substrate on which the photoelectric conversion unit, the processor unit, and the power conversion unit are mounted. The photoelectric conversion unit, the processor unit, and the power conversion unit are connected only through a conductor pattern formed on/in the package substrate.
H01L 25/16 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different subclasses of , , , , or , e.g. forming hybrid circuits
A pen-type electronic apparatus is provided that includes a cylindrical housing having a grip portion configured to be gripped by a user; a pen shaft housed inside the housing; a sheet-like pressure sensor wound around a position that overlaps the grip portion on an outer surface of the pen shaft or an inner surface of the housing; and a cushion material either between the pen shaft and the pressure sensor or between the pressure sensor and the housing. The pressure sensor has a low-sensitivity region in a central portion of the grip portion along a long axis direction of the pen shaft. The low-sensitivity region has a lower sensitivity for detecting pressure from the user than other regions of the pressure sensor.
G06F 3/0354 - Pointing devices displaced or positioned by the userAccessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
G01L 1/16 - Measuring force or stress, in general using properties of piezoelectric devices
A capacitor that includes: a substrate; fiber-shaped conductive members on the substrate; a dielectric layer covering the fiber-shaped conductive members; and a conductor layer covering the dielectric layer, wherein the fiber-shaped conductive members, the dielectric layer, the conductor layer, a space among the fiber-shaped conductive members, and the conductor layer constitute a composite bulk member, in one section in the thickness direction of the substrate: each of the fiber-shaped conductive member has a maximum height Hmax, the composite bulk member has outer peripheral regions that each occupy a region up to twice the maximum height Hmax from an outer edge of the composite bulk member, and a central region between the outer peripheral regions, and at least one of the outer peripheral regions includes a part where a first total area occupancy proportion is higher than a second total area occupancy proportion in the central region.
H01G 11/24 - Electrodes characterised by structural features of the materials making up or comprised in the electrodes, e.g. form, surface area or porosityElectrodes characterised by the structural features of powders or particles used therefor
H01G 11/36 - Nanostructures, e.g. nanofibres, nanotubes or fullerenes
An acoustic wave device includes a high acoustic velocity material layer, a piezoelectric layer including lithium tantalate, and an IDT on the piezoelectric layer and including electrode finger portions each including at least one electrode finger portion layer. An acoustic velocity of a bulk wave propagating in the high acoustic velocity material layer is higher than that in the piezoelectric layer. TR=(1/3.15)× (Tm/TIDT)×100 [%] is satisfied, where TR is a value obtained by dividing a thickness ratio of an Al-equivalent normalized thickness Tm of a mass addition film relative to an Al-equivalent normalized thickness TIDT of the electrode finger portion by about 3.15. A wavelength ratio width and a thickness ratio have values within a range on an ellipse and inside of the ellipse on an xy plane expressed by:
An acoustic wave device includes a high acoustic velocity material layer, a piezoelectric layer including lithium tantalate, and an IDT on the piezoelectric layer and including electrode finger portions each including at least one electrode finger portion layer. An acoustic velocity of a bulk wave propagating in the high acoustic velocity material layer is higher than that in the piezoelectric layer. TR=(1/3.15)× (Tm/TIDT)×100 [%] is satisfied, where TR is a value obtained by dividing a thickness ratio of an Al-equivalent normalized thickness Tm of a mass addition film relative to an Al-equivalent normalized thickness TIDT of the electrode finger portion by about 3.15. A wavelength ratio width and a thickness ratio have values within a range on an ellipse and inside of the ellipse on an xy plane expressed by:
x=0.19×cos(−5.5°)×cos θ−
An acoustic wave device includes a high acoustic velocity material layer, a piezoelectric layer including lithium tantalate, and an IDT on the piezoelectric layer and including electrode finger portions each including at least one electrode finger portion layer. An acoustic velocity of a bulk wave propagating in the high acoustic velocity material layer is higher than that in the piezoelectric layer. TR=(1/3.15)× (Tm/TIDT)×100 [%] is satisfied, where TR is a value obtained by dividing a thickness ratio of an Al-equivalent normalized thickness Tm of a mass addition film relative to an Al-equivalent normalized thickness TIDT of the electrode finger portion by about 3.15. A wavelength ratio width and a thickness ratio have values within a range on an ellipse and inside of the ellipse on an xy plane expressed by:
x=0.19×cos(−5.5°)×cos θ−
0.021×sin(−5.5°)×sin θ+0.0146×TIDT2−0.229×TIDT+1.5611+0.4×(d−0.55),
An acoustic wave device includes a high acoustic velocity material layer, a piezoelectric layer including lithium tantalate, and an IDT on the piezoelectric layer and including electrode finger portions each including at least one electrode finger portion layer. An acoustic velocity of a bulk wave propagating in the high acoustic velocity material layer is higher than that in the piezoelectric layer. TR=(1/3.15)× (Tm/TIDT)×100 [%] is satisfied, where TR is a value obtained by dividing a thickness ratio of an Al-equivalent normalized thickness Tm of a mass addition film relative to an Al-equivalent normalized thickness TIDT of the electrode finger portion by about 3.15. A wavelength ratio width and a thickness ratio have values within a range on an ellipse and inside of the ellipse on an xy plane expressed by:
x=0.19×cos(−5.5°)×cos θ−
0.021×sin(−5.5°)×sin θ+0.0146×TIDT2−0.229×TIDT+1.5611+0.4×(d−0.55),
and
An acoustic wave device includes a high acoustic velocity material layer, a piezoelectric layer including lithium tantalate, and an IDT on the piezoelectric layer and including electrode finger portions each including at least one electrode finger portion layer. An acoustic velocity of a bulk wave propagating in the high acoustic velocity material layer is higher than that in the piezoelectric layer. TR=(1/3.15)× (Tm/TIDT)×100 [%] is satisfied, where TR is a value obtained by dividing a thickness ratio of an Al-equivalent normalized thickness Tm of a mass addition film relative to an Al-equivalent normalized thickness TIDT of the electrode finger portion by about 3.15. A wavelength ratio width and a thickness ratio have values within a range on an ellipse and inside of the ellipse on an xy plane expressed by:
x=0.19×cos(−5.5°)×cos θ−
0.021×sin(−5.5°)×sin θ+0.0146×TIDT2−0.229×TIDT+1.5611+0.4×(d−0.55),
and
y=0.19×sin(−5.5°)×cos θ+0.021×cos(−5.5°)×sin θ+10.15.
An integrated passive component has upper and lower surfaces facing in mutually opposite directions. The integrated passive component includes an insulating film having a first surface facing in the same direction as the upper surface and a second surface facing in the same direction as the lower surface; a capacitor in the insulating film; and a multilayer wiring structure on the first surface. The multilayer wiring structure includes resin layers and wiring layers, the resin and wiring layers being alternately stacked, each of the wiring layers includes wiring lines, and at least a portion of the wiring lines constitutes an inductor. The insulating film includes an inorganic material layer made of an inorganic insulating material, and a thickness of the inorganic material layer is smaller than a sum of a thickness of each of the resin layers. The second surface of the insulating film constitutes the lower surface.
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
According to some exemplary aspects, a tracker circuit includes at least a terminal configured to receive a first regulating voltage from a first converter circuit that is configured to convert an input voltage to the first regulating voltage. The tracker circuit also includes a second converter circuit configured to generate a plurality of discrete voltages based on the first regulating voltage and a first supply modulator configured to selectively output at least one of the plurality of discrete voltages to a first power amplifier. The first regulating voltage is provided to a second power amplifier without passing through the second converter circuit.
A radio frequency module includes a mounting board, a first component, and a shielding member. The mounting board has a first main surface and a second main surface. The first component is disposed on the first main surface of the mounting board. The shielding member is disposed on the first main surface of the mounting board. The first component is in contact with the shielding member.
A stretchable device that includes: a first substrate having stretchability; a first wiring on a first main surface of the first substrate; a second substrate facing the first substrate in a first direction that is a thickness direction of the first substrate and connected to the first substrate; a second wiring on a first main surface of the second substrate, facing the first wiring in the first direction, and electrically connected to the first wiring; and a first protective layer on the first main surface of the first substrate so as to cover a part of the first wiring, wherein the first substrate and the first protective layer overlap each other in a first overlapping region, the first wiring and the second wiring are electrically connected in a wiring region, and the first overlapping region is separated from the wiring region when viewed from the first direction.
Provided is a coil component of an integrated core, the coil component making it easy to bring a wire closer to one end side in an axial direction of a winding core part, when starting to wind the wire around the winding core part and winding the wire, even if members disposed at a predetermined interval with respect to the winding core part exist in the integrated core. In a core (2), a gap (11) for dividing a part of a loop of magnetic flux passing through a winding core part (3), a first flange part (5), a second flange part (6), and a top plate part (7) is provided at a position offset toward the second flange part (6) side in the top plate part (7). At least a part of the peripheral surface of the winding core part (3), for example, a top surface (13), is provided with a sloped surface (19) that is inclined with respect to the axial direction, so that the length in the circumferential direction of the winding core part (3) becomes shorter with decreasing distance toward the first flange part (5).
abb (wherein M represents at least one element selected from the group consisting of elements in groups 3, 4, 5, 6, and 7, Q represents at least one element selected from the group consisting of elements in groups 12, 13, 14, 15, and 16 (excluding O), a represents a number of 0 to 2 inclusive, and b represents a number of more than 0 but not more than 2).
mnn (in the formula, M is at least one metal of Group 3, 4, 5, 6, or 7 and includes Ti, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 to 4, and m is greater than n and equal to or less than 5), and a modification or termination T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) present on the surface of the layer body.
H01B 1/20 - Conductive material dispersed in non-conductive organic material
A61B 5/268 - Bioelectric electrodes therefor characterised by the electrode materials containing conductive polymers, e.g. PEDOT:PSS polymers
H01B 1/12 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors mainly consisting of other non-metallic substances organic substances
H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
The objective of the present invention is to reduce AC resistance. In an AC signal line (2) of a multilayer substrate (100), a plurality of signal lines (21-23) are electrically connected by a plurality of connection conductors that penetrate one of a plurality of insulating layers (11-13) in the thickness direction (D1) of a laminated substrate (1). The plurality of signal lines (21-23) include: the first signal line (21), which is closest to a first main surface (101) of the laminated substrate (1) in the thickness direction (D1) of the laminated substrate (1); the second signal line (23), which is closest to a second main surface (102) of the laminated substrate (1) in the thickness direction (D1) of the laminated substrate (1); and the third signal line (22), which is positioned between the first signal line (21) and the second signal line (23) in the thickness direction (D1) of the laminated substrate (1). In the thickness direction (D1) of the laminated substrate (1), at least one of a thickness (T21) of the first signal line (21) and a thickness (T23) of the second signal line (23) is larger than a thickness (T22) of the third signal line (22).
An antenna module (100) comprises a flat plate–shaped radiation element (121), a ground electrode (GND) that is provided opposite the radiation element (121), power supply wiring (141, 142), and stubs (ST1, ST2) that function as band-stop filters. The power supply wiring (141) transmits a high-frequency signal in a first frequency band to a power supply point (SP1) on the radiation element. The power supply wiring (142) transmits a high-frequency signal in a second frequency band that is higher than the first frequency band to a power supply point (SP2) on the radiation element. The stub (ST1) is connected to the power supply wiring (141) and is configured to prevent passage of the high-frequency signal in the second frequency band. The stub (ST2) is connected to the power supply wiring (142) and is configured to prevent passage of the high-frequency signal in the first frequency band.
H01Q 13/08 - Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
H01Q 5/35 - Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using two or more simultaneously fed points
H01Q 23/00 - Antennas with active circuits or circuit elements integrated within them or attached to them
A tracker circuit is provided that includes a switched-capacitor circuit configured to generate a plurality of discrete voltages based on a first input voltage; a supply modulator configured to selectively output at least one of the plurality of discrete voltages to a power amplifier; a bypass path configured to bypass the switched-capacitor circuit and the supply modulator to output the first input voltage to the power amplifier; and a switch configured to switch between a connection and a disconnection of the bypass path.
A secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. The electrolytic solution includes a thiazole-type compound. The thiazole-type compound includes a compound represented by Formula (1), a compound represented by Formula (2), or both.
A tracker module is provided that includes a module laminate separate from a substrate on which a switch is disposed that is included in a pre-regulator circuit configured to convert an input voltage into a regulated voltage; a switched-capacitor circuit configured to generate a plurality of discrete voltages based on the regulated voltage; and a supply modulator configured to selectively output at least one of the plurality of discrete voltages to an amplifier. A switch and a capacitor included in the switched-capacitor circuit and a switch included in the supply modulator are disposed on the module laminate.
Circuits and methods that solve the light-load problem of a multi-level converter by generating a ripple signal in the control loop of the multi-level converter that causes a large output current ripple during light load conditions. This added current ripple does not change the average output current but does create a temporary positive and negative current that can be used to balance and charge/discharge the fly capacitors of the multi-level converter. An alternative approach is to add extra switching cycles for the fly capacitors when the output ripple current crosses zero.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
A power supply module including a first substrate, first electronic components on a principal surface of the first substrate, second electronic components above the first electronic components, and a heat sink located above the first electronic components. The first electronic components and the second electronic components are thermally connected, and the first electronic components and the heat sink are thermally connected. From a top view of the power supply module, at least a portion of one first electronic component of the first electronic components overlaps with at least a portion of one second electronic component of the second electronic components and at least a portion of the one first electronic component overlaps with a portion of the heat sink. From a side view of the power supply module, the second electronic components do not overlap any portion of the heat sink.
H01L 23/367 - Cooling facilitated by shape of device
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
A capacitor that includes: a substrate with conductivity; a plurality of fiber-shaped conductive members on the substrate and electrically connected to the substrate; a dielectric layer covering a surface of the plurality of fiber-shaped conductive members; and a conductor layer covering a surface of the dielectric layer, wherein the plurality of fiber-shaped conductive members, the dielectric layer, the conductor layer, and a space among the plurality of fiber-shaped conductive members covered with the dielectric layer and the conductor layer constitute a composite bulk member, and in a section in the thickness direction of the substrate, the composite bulk member has a width W1 on a side thereof opposite to the substrate and a width W2 on a side thereof proximal to the substrate, with an in-plane direction of the substrate as a width direction, and the width W1 is smaller than the width W2.
A secondary battery includes a positive electrode, a negative electrode, and an electrolytic solution. The negative electrode includes a negative electrode active material. The electrolytic solution includes a thiazole-type compound. The negative electrode active material includes a center part into which an electrode reactant is to be inserted and from which the electrode reactant is to be extracted, and a covering part covering a surface of the center part. The covering part includes at least one of nickel, iron, or copper as a constituent element. The thiazole-type compound includes at least one of a compound represented by Formula (1), a compound represented by Formula (2), a compound represented by Formula (3), or a compound represented by Formula (4).
The present disclosure provides an optical device that can be miniaturized and a manufacturing cost of which can be reduced, and an imaging unit provided with the optical device. The optical device includes: an outermost layer lens (light transmitting body) which transmits light having a predetermined wavelength; a housing which holds the outermost layer lens; a vibrating body which is in contact with the outermost layer lens held by the housing; and a piezoelectric element which is provided on the vibrating body and vibrates the vibrating body. The vibrating body is a tubular body and has a shape which has a plurality of groove portions in a supporting portion (third portion), the supporting portion connecting a connecting portion (first portion) which is in contact with the outermost layer lens and a vibrating portion (second portion) on which the piezoelectric element is provided.
G02B 27/00 - Optical systems or apparatus not provided for by any of the groups ,
H04N 23/52 - Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
A capacitor embedded substrate that includes: a wiring substrate; and a capacitor element embedded in the wiring substrate. The capacitor element includes a capacitor portion and a sealing layer covering the capacitor portion. At least one first capacitor through-hole and at least one second capacitor through-hole extend through the capacitor element. A capacitor through anode conductor is inside the first capacitor through-hole and connected to an anode plate of the capacitor portion. A first substrate through-hole is in the first capacitor through-hole and a second substrate through-hole is in the second capacitor through-hole, the first substrate through-hole and the second substrate through-hole extends through the wiring substrate and the capacitor element. A substrate through anode conductor is in the first substrate through-hole and electrically connected to the anode plate. A substrate through cathode conductor is in the second substrate through-hole and electrically connected to the cathode layer.
A cavity resonance power transmission device 100 comprises: a structure 10 which is entirely surrounded by an electromagnetic wave shielding member having conductivity; a power transmitter 20 which wirelessly supplies power to a product 31 via a power receiver 30 disposed in the internal space of the structure 10; and a partition body 40 which separates the power receiver 30 and the power transmitter 20. The structure 10 has a bottom portion 11, a top portion 12 facing the bottom portion 11, and a side portion 13 connecting the outer edges of the bottom portion 11 and the top portion 12. The power transmitter 20 is provided in contact with an inner surface of the bottom portion 11.
A communication device (1) comprises: a pre-regulator circuit (30) that converts an input voltage into an adjustment voltage; a high-frequency module (10) that outputs a signal having a first radio frequency; and a high-frequency module (20) that outputs a signal having a second radio frequency. The high-frequency module (10) has: an RFIC (71) including a power amplifier (13); a switched capacitor circuit (11) that generates a plurality of first discrete voltages on the basis of the adjustment voltage; and a power source modulation circuit (12) that selectively outputs at least one of the plurality of first discrete voltages to the power amplifier (13). The high-frequency module (20) has: an RFIC (72) including a power amplifier (23); a switched capacitor circuit (21) that generates a plurality of second discrete voltages on the basis of the adjustment voltage; and a power source modulation circuit (22) that selectively outputs at least one of the plurality of second discrete voltages to the power amplifier (23).
Provided is a multilayer ceramic capacitor in which the insulation properties of the entire dielectric layer are increased and for which the reliability of the multilayer ceramic capacitor can be improved.This multilayer ceramic capacitor comprises: a laminate that includes a plurality of laminated dielectric layers and that has a first main surface and a second main surface which face each other in the lamination direction of the plurality of dielectric layers, a first lateral surface and a second lateral surface which face each other in the width direction orthogonal to the lamination direction, and a first end surface and a second end surface which face each other in the length direction orthogonal to the lamination direction and the width direction; a first external electrode that has a first internal electrode layer disposed above the plurality of dielectric layers and exposed to the first end surface, a second internal electrode layer disposed above the plurality of dielectric layers and exposed to the second end surface, a substrate electrode layer disposed above the first end surface, and a plating layer disposed above the substrate electrode layer; and a second external electrode that has a substrate electrode layer disposed above the second end surface, and a plating layer disposed above the substrate electrode layer. Dielectric particles are disposed in the dielectric layers. The dielectric particles include Mn and Zr, and in the dielectric particles, the atomic ratio (Mn/Zr) of Mn to Zr is 0.60 to 0.80.
The present invention provides a highly reliable multilayer ceramic electronic component in which it is possible to suppress the occurrence of a crack in a laminate of the multilayer ceramic electronic component. This multilayer ceramic capacitor 1 includes an external electrode 40 which has, from the lower side, a first external electrode 40A that comprises a first base electrode layer 50A, a first organic layer 70A, and a first plating layer 60A, and a second external electrode 40B that comprises a second base electrode layer 50B, a second organic layer 70B, and a second plating layer 60B. In the length direction, the first dimension EL1 of the first base electrode layer is larger than the second dimension EL2 of the second base electrode layer, a part of the first base electrode layer 50A is exposed on the surface of the first organic layer 70A, a part of the second base electrode layer 50B is exposed on the surface of the second organic layer 70B, and the first atomic percentage MR1 of the main component metal of the first base electrode layer 50A on the surface of the first organic layer 70A is larger than the second atomic percentage MR2 of the main component metal of the second base electrode layer 50B on the surface of the second organic layer 70B.
H01C 7/02 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
H01C 7/04 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
H01C 7/10 - Non-adjustable resistors formed as one or more layers or coatingsNon-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
abb (wherein M is at least one element selected from the group consisting of elements belonging to Groups 3, 4, 5, 6, and 7, Q is at least one element (excluding O) selected from the group consisting of elements belonging to Groups 12, 13, 14, 15, and 16, a is 0-2, and b is larger than 0 but not larger than 2); and a resin having a negative zeta potential.
abb (wherein M is at least one element selected from the group consisting of elements belonging to Groups 3, 4, 5, 6, and 7, Q is at least one element (excluding O) selected from the group consisting of elements belonging to Groups 12, 13, 14, 15, and 16, a is 0-2, and b is larger than 0 but not larger than 2).
The purpose of the present invention is to provide an elastic wave device capable of suppressing deterioration of electrical characteristics. An elastic wave device 10 according to the present invention includes: a support substrate 3; an intermediate layer 5 provided on the support substrate 3; a piezoelectric layer 6 provided on the intermediate layer 5; and an IDT electrode 7 provided on the piezoelectric layer 6 and having a plurality of electrode fingers. When the thickness of the portion of the piezoelectric layer 6 where the IDT electrode 7 is provided is d, and the distance between the centers of the adjacent electrode fingers is p, d/p is 0.5 or less. A cavity part 2a is provided between the piezoelectric layer 6 and the support substrate 3. The cavity part 2a overlaps the IDT electrode 7 in a plan view. The elastic wave device 10 further includes any one film of a silicon nitride film 4, an amorphous silicon film, and a polycrystalline silicon film, at least a part of which is provided between the support substrate 3 and the intermediate layer 5, and which faces the piezoelectric layer 6 across at least one of the cavity part 2a and the intermediate layer 5.
The present invention reduces AC resistance. In a multilayer substrate (100), a ground electrode (4) overlaps an AC signal line (2) in a thickness direction (D1) of a laminated substrate (1). The AC signal line (2) has a plurality of signal lines (21-23) that are separated from each other in the thickness direction (D1) of the laminated substrate (1), and the plurality of signal lines (21-23) are electrically connected by a plurality of connection conductors that penetrate one of a plurality of insulating layers (11-13) in the thickness direction (D1) of the laminated substrate (1). The plurality of signal lines (21-23) include a first signal line (21) adjacent to the ground electrode (4) in the thickness direction (D1) of the laminated substrate (1), and a second signal line (22) adjacent to the first signal line (21) in the thickness direction (D1) of the laminated substrate (1). In the thickness direction (D1) of the laminated substrate (1), a thickness (T21) of the first signal line (21) is greater than a thickness (T22) of the second signal line (22).
Provided is a multilayer ceramic capacitor of which the specifications or the like can be identified on the basis of a lamination direction view. A multilayer ceramic capacitor 10 according to the present invention is characterized by comprising: a laminate having a first main face and a second main face opposite each other in the lamination direction, a first lateral face and a second lateral face opposite each other in a first direction orthogonal to the lamination direction, and a first end face and a second end face opposite each other in a second direction orthogonal to the lamination direction and the first direction; a first external electrode disposed on the first end face and the first main face; a second external electrode disposed on the second end face and the first main face; a third external electrode disposed on the first end face and the first main face; and a fourth external electrode disposed on the second end face and the first main face, wherein provided that flatness D1 is the maximum distance among the distances in the lamination direction x (vertical) between the first main face surface and a point where the first main face intersects with the first end face or the second end face and flatness D2 is the maximum distance among the distances in the lamination direction x (vertical) between the first main face surface and a point where the second main face intersects with the first end face or the second end face at the halfway position of the width connecting the first lateral face and the second lateral face of the laminate, then flatness D1 ≥ flatness D2.
This capacitor module 1 comprises: a busbar member 10 having a first busbar 11a and a second busbar 11b arranged in a planar shape as a whole and having a first main surface 10a and a second main surface 10b opposite each other in a first direction D1; a first capacitor 20a provided on the first main surface 10a of the busbar member 10; a second capacitor 20b provided on the first main surface 10a of the busbar member 10 so as to be adjacent to the first capacitor 20a, with a gap G therebetween, in a second direction D2 perpendicular to the first direction D1; and a separator 30 provided in the gap B between the first capacitor 20a and the second capacitor 20b. The first capacitor 20a and the second capacitor 20b each have a capacitor element 40, an exterior film 50, a first lead terminal 60a, and a second lead terminal 60b. The capacitor element 40 has an element 41, a first external electrode 42a provided on the surface of the element 41, and a second external electrode 42b provided on the surface of the element 41 at a distance from the first external electrode 42a. The exterior film 50 encapsulates the capacitor element 40. One end-portion side of the first lead terminal 60a is electrically connected to the first external electrode 42a, and the other end-portion side of the first lead terminal 60a is electrically connected to the first busbar 11a while being led out from the exterior film 50 toward the first main surface 10a side of the busbar member 10. One end-portion side of the second lead terminal 60b is electrically connected to the second external electrode 42b, and the other end-portion side of the second lead terminal 60b is electrically connected to the second busbar 11b while being led out from the exterior film 50 toward the first main surface 10a side of the busbar member 10. In the busbar member 10, a space S exists that communicates, in the first direction D1, with the gap G between the first capacitor 20a and the second capacitor 20b, and the separator 30 is passed in the first direction D1 through the space S of the busbar member 10 in addition to the gap G between the first capacitor 20a and the second capacitor 20b.
H01G 4/38 - Multiple capacitors, i.e. structural combinations of fixed capacitors
H01G 11/18 - Arrangements or processes for adjusting or protecting hybrid or EDL capacitors against thermal overloads, e.g. heating, cooling or ventilating
A pump device (20) comprises a first pump (P1) and a second pump (P2). The pump device (20) also comprises a drive device (50) and a control device (70). The first pump (P1) and the second pump (P2) are connected in parallel with each other on an electric power supply path from the drive device (50). The control device (70) acquires an impedance value of the first pump (P1) and an impedance value of the second pump (P2), and can identify the pump having the minimum impedance value between the first pump (P1) and the second pump (P2) as the specific pump. The control device (70) can control the drive device (50) so that a drive current supplied to the first pump (P1) and the second pump (P2) has a value equal to or less than a specified current value.
mnn (where M represents at least one metal in groups 3, 4, 5, 6, and 7, including Ti, X represents a carbon atom, a nitrogen atom, or a combination thereof, n represents a number of 1 or greater and not greater than 4, and m represents a number that is greater than n and not greater than 5), and a modification or terminal T (T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) that is present on the surface of the layer main body.
A secondary battery is provided and includes a positive electrode including a positive electrode active material layer, a negative electrode, and an electrolytic solution. The positive electrode active material layer contains a plurality of positive electrode active material particles, and each of the plurality of positive electrode active material particles includes a central part containing an olivine-type phosphate compound and a covering part provided on a surface of the central part. The olivine-type phosphate compound contains manganese and iron as constituent elements, and when a sum of a content of the manganese in the olivine-type phosphate compound and a content of the iron in the olivine-type phosphate compound is 100 parts by mole, the content of the manganese in the olivine-type phosphate compound is 50 parts by mole or more and 90 parts by mole or less. The central part is a secondary particle formed by granulating a plurality of primary particles, a first median diameter relating to the plurality of primary particles is 0.01 μm or more and 0.5 μm or less, and a second median diameter relating to the plurality of secondary particles is 1 μm or more and 20 μm or less. The covering part contains a nitrile group. The positive electrode active material layer has a porosity of 20% or more and 40% or less.
H01M 4/58 - Selection of substances as active materials, active masses, active liquids of inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFySelection of substances as active materials, active masses, active liquids of polyanionic structures, e.g. phosphates, silicates or borates
H01M 4/02 - Electrodes composed of, or comprising, active material
An amplifier circuit includes a first FET having a gate, a second FET and a third FET that are connected between a power supply and a reference potential along with the first FET, a substrate on which the first, second, and third FETs are formed, the first, second, and third FETs being vertically stacked and connected, respective gates of the first, second, and third FETs being disposed side by side in cross-sectional view of the substrate along a direction in which the first, second, and third FETs are vertically stacked and connected, an element isolation portion configured to isolate from each other two FETs adjacent to each other of the first, second, and third FETs, and a connection portion configured to connect a drain of one of the two FETs and a source of another one of the two FETs.
A filter circuit includes an LC circuit having one end connected to a signal path connecting an input terminal and an output terminal and the other end connected to a reference potential. A filter circuit according to a first embodiment includes a substrate and a plurality of electrodes provided on a main surface of the substrate or inside the substrate. The LC circuit includes a first capacitor, a first inductor connected in parallel, and a second capacitor connected in series. The electrodes overlap with each other at least partially when viewed in a thickness direction of the substrate. Portions of the electrodes overlapping with each other are electrodes of the first capacitor or the second capacitor.
A radio-frequency module includes a first external connection terminal connected to a first external power supply, a second external connection terminal connected to a second external power supply, a first switch connected to the first external connection terminal and a first connection point, a second switch connected to the second external connection terminal and the first connection point, a third external connection terminal connected to the first connection point, and a third switch connected to a second connection point between the second switch and the third external connection terminal. Another end of the third switch is connected to a first capacitor. The second connection point is connected a second capacitor. Another end of the first capacitor and another end of the second capacitor are connected to an inductor. Another end of the inductor is connected to a reference potential.
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
A solid-state battery module including: a first substrate with a wiring; a solid-state battery on the first substrate; and a second substrate on an opposite side of the solid-state battery relative to the first substrate and internally including a coil part that is electrically connectable to the first substrate, where a main surface of the second substrate defines a module top surface or is inside the module top surface.
H01M 50/298 - MountingsSecondary casings or framesRacks, modules or packsSuspension devicesShock absorbersTransport or carrying devicesHolders characterised by the wiring of battery packs
A matching system, an inviter device, and a method to match an inviter and an applicant who applies for an invitation. A computing device that communicates with the inviter device and a first applicant device. The computing device is able to access a database, where the inviter device transmits asset information and disclosure information to the computing device, and can register the asset information and disclosure information transmitted from an inviter device into the database. The computing device can determine, asset information permitted to be disclosed to the first applicant among asset information registered in the database based on corresponding disclosure information. The computing device can provide the first applicant device with the asset information permitted to be disclosed to the first applicant.
G06Q 50/00 - Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
A chip electronic component includes a multilayer ceramic capacitor and spacers. The multilayer ceramic capacitor includes a multilayer body including inner electrode layers and dielectric layers that are alternately arranged, and outer electrodes. The multilayer body includes capacitor principal surfaces opposite to each other in a lamination direction, capacitor side surfaces opposite to each other in a width direction, and capacitor end surfaces opposite to each other in a length direction. Outer electrodes are provided on respective ones of capacitor end surfaces. The spacers are provided at both ends of one of the capacitor principal surfaces adjacent to a mounting board for the multilayer ceramic capacitor. Each spacer includes spacer principal surfaces opposite to each other in the lamination direction. At least one recess is provided in a surface of one of the spacer principal surfaces adjacent to the mounting board.
A short circuit between a positive electrode and a negative electrode when a separator is damaged by an external force is suppressed. A battery includes an electrode assembly having a positive electrode, a negative electrode, and a film-shaped separator, the electrode assembly has a flat shape, and when a shortest direction of the electrode assembly is defined as a first direction, the separator has a thickness in at least the first direction, and is provided between the positive electrode and the negative electrode at least in the first direction. When a direction in which a distance between sides of the separator facing each other is minimized in plan view in the first direction is defined as a second direction, and a direction perpendicular to the first direction and the second direction is defined as a third direction, an angle formed between the direction in which the tensile strength of the separator is minimized and the second direction is larger than an angle formed between the direction in which the tensile strength of the separator is minimized and the third direction in plan view in the first direction. In plan view in the first direction, a ratio of a length of the separator in the third direction to a length of the separator in the second direction is 2.0 or more.
In a multilayer ceramic capacitor, in a dielectric in a side surface outer layer portion, a content ratio Ba/(Ti+Zr) is about 0.995 or more and about 1.003 or less, and a content of Mg is about 0.5 to about 5.0 parts by mol larger than that in a dielectric at a center portion, or a content of Mn is about 0.4 to about 2.0 parts by mol larger than that in the dielectric at the center portion, and in a dielectric in an end surface outer layer portion, a content ratio Ba/(Ti+Zr) is about 0.995 or more and about 1.003 or less, and a content of Mg is about 0.25 to about 2.5 parts by mol larger than that in the dielectric at the center portion, or a content of Mn is about 0.2 to about 1.0 parts by mol larger than that in the dielectric at the center portion.
A coil component includes a core, and flange portions of a core include mounting surfaces, top surfaces, inner end faces, outer end faces, first side surfaces, and second side surfaces, respectively. The metal terminals include mounting surface facing portions ‘that face mounting surfaces, outer end face facing portions that face the outer end faces, and side surface facing portions that face at least one of the first side surfaces and the second side surfaces. The mounting surface facing portions include mounting connected portions and wire connected portions, and the mounting connected portions and the wire connected portions are isolated from each other. The mounting connected portions are connected from one of the outer end face facing portions and the side surface facing portions, and the wire connected portions are connected from the other of the outer end face facing portions and the side surface facing portions.
A radio-frequency module includes a power amplifier configured to amplify a signal of a first band, a low-noise amplifier configured to amplify a signal of a second band, and an intermodulation distortion (IMD) suppression circuit coupled to the power amplifier, a power amplifier configured to amplify a signal of a third band, and the low-noise amplifier and configured to generate an IMD suppression signal that includes a frequency component of intermodulation distortion between the first band and the third band. The signal of the first band, the signal of the second band, and the signal of the third band are to be simultaneously transferred. The second band includes a frequency of the intermodulation distortion.
H04L 5/14 - Two-way operation using the same type of signal, i.e. duplex
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
A multilayer ceramic electronic component includes a first outer electrode extending from a first end surface to a portion of a second main surface and a second outer electrode extending from a second end surface to a portion of the second main surface. Each of the first and second outer electrodes includes a thin film layer and a plating layer on the thin film layer. The thin film layers include main surface thin film layers on the second main surface, end surface thin film layers on the first and second end surfaces, and continuous thin film layers continuing in a height direction from the end surface thin film layers, respectively. A thickness of each of the continuous thin film layers in a length direction is smaller than a thickness of each of the end surface thin film layers in the length direction.
This electronic module comprises: a circuit board; a terminal electrode connected to a first main surface of the circuit board and having a second main surface on the opposite side to the first main surface; and an insulator covering the first main surface and at least a portion of the terminal electrode. The second main surface is exposed from the insulator and has a first step portion at least in a part thereof.
H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
The present invention provides a circuit module 1 comprising: a substrate 11 having a first main surface 11a and a second main surface 11b; a resin layer 31 provided on the first main surface 11a of the substrate 11; and a connection terminal 41 penetrating through the resin layer 31 in the thickness direction, wherein the connection terminal 41 has a first base surface 41a located on the substrate 11 side, a second base surface 41b opposite from the first base surface 41a, and a lateral surface 41c, the second base surface 41b is exposed from the resin layer 31, a recess 33 indented toward the first main surface 11a of the substrate 11 is formed in an area of the surface of the resin layer 31 that surrounds the second base surface 41b of the connection terminal 41, a portion of the lateral surface 41c of the connection terminal 41 is exposed in the recess 33, and a solder wetting enhancement layer 42 is provided on the second base surface 41b of the connection terminal 41 and on a portion 41c1 of the lateral surface 41c of the connection terminal 41, said portion being exposed from the recess 33.
H01L 25/04 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
52.
POWER CONVERSION CIRCUIT AND PROGRAM FOR POWER CONVERSION CIRCUIT
A power conversion circuit (30) comprises a plurality of bidirectional switches (TSW) and a control unit (33). The control unit (33) can control each bidirectional switch (TSW) according to a first switch sequence or a second switch sequence. The control unit (33) switches from the control according to the first switch sequence to the control according to the second switch sequence when the on/off state of the bidirectional switch (TSW) through which current flows in the control according to the first switch sequence matches the on/off state of the bidirectional switch (TSW) through which current flows in the control according to the second switch sequence after the switching.
H02M 5/257 - Conversion of AC power input into AC power output, e.g. for change of voltage, for change of frequency, for change of number of phases without intermediate conversion into DC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only
A capacitor 1 comprises a capacitor element 10 that includes an element body 11 and an external electrode (first external electrode 12a) that is provided on the surface of the element body 11, a busbar (first busbar 20a) that is electrically connected to the external electrode (first external electrode 12a), a bottomed cylindrical exterior case 30 that has an opening 31 and accommodates the capacitor element 10 such that the busbar (first busbar 20a) protrudes from the opening 31 toward the outside, and a filler resin 40 that fills the exterior case 30 so as to bury the capacitor element 10. A through hole (first through hole 21aa) is provided in the busbar (first busbar 20a) at a portion that is between the capacitor element 10 and the opening 31. The through hole (first through hole 21aa) extends in a through direction DHaa that forms an angle of less than 45° with the opening plane 31s of the opening 31, and the entirety of the through hole (first through hole 21aa) is buried in the filler resin 40.
A high-frequency signal transmission line (102) is provided with: a resin laminate part in which first resin layers (11, 12, 13) and second resin layers (21, 22) are laminated; a signal conductor pattern (4) formed on the first resin layer (11); and ground conductor layers (51, 52) that face the signal conductor pattern across the resin laminate part. Opening portions are formed in the first resin layers (11, 12) at a position along the signal conductor pattern (4) in the resin laminate part so that a hollow portion (HP) is provided in the resin laminate part at the opening portions. The second resin layers (22) in contact with the first resin layers (11, 12) having the opening portions are provided with a maximum thickness and a minimum thickness that are different in the opening portions formed in the first resin layers so that the second resin layers in contact with the first resin layers are adhered to a part of end surfaces of the first resin layers (11, 12) at the opening portions.
A high-frequency signal transmission line (101) comprises: a resin laminate part (3) in which first resin layers (11, 12, 13) and second resin layers (21, 22) are laminated; a signal conductor pattern (4) formed on the first resin layer (11); and a ground conductor layer (5) that faces the signal conductor pattern (4) across part or all of the resin laminate part (3). The Young's modulus of the second resin layers (21, 22) is lower than the Young's modulus of the first resin layers (11, 12, 13). In the resin laminate part (3), an opening is formed at least in the first resin layer (12) at a position along the signal conductor pattern (4), so that a hollow part (HP) is provided in the resin laminate part (3) at said opening.
A circuit module (1) comprises: substrate (10) having one principal surface (10a) and another principal surface (10b); and a connection terminal (30) disposed on the one principal surface (10a) side of the substrate (10). The circuit module (1) is characterized in that: a first electrode (11) is provided to the one principal surface (10a) of the substrate (10); on the one principal surface (10a) side of the substrate (10), the connection terminal (30) has one end bonded to the first electrode (11); a portion of the first electrode (11) bonded to the connection terminal (30), when the first electrode is viewed from the thickness direction, is a first portion (11a), a portion surrounding the outer periphery of the first portion (11a) is a second portion (11b), and a portion surrounding the outer periphery of the second portion (11b) is a third portion (11c); a plating film (23) is provided to the surface of the second portion (11b); and a ceramic protective film (70) made of a ceramic material is provided to the surface of the third portion (11c).
Provided is a circuit module (1) which comprises a substrate (10) that has one main surface (10a) and another main surface (10b) and a connection terminal (30) that is disposed on the one main surface (10a)-side of the substrate (10), said circuit module (1) being characterized in that: a first electrode (11) is provided on the one main surface (10a) of the substrate (10); on the one main surface (10a)-side of the substrate (10), an edge face of the connection terminal (30) partially joins to a portion of a surface of the first electrode (11); when the first electrode is seen from the thickness direction, a first portion (11a) is defined as a portion of the surface of the first electrode (11) which joins to the connection terminal (30) and a second portion (11b) is defined as a portion of the first electrode (11) which surrounds the outer periphery of the first portion (11a) and which does not join to the connection terminal (30); and a ceramic protective film (70) made of a ceramic material is provided between the surface of the second portion (11b) and a portion of the edge face of the connection terminal (30) that does not join to the first portion (11a).
Acoustic resonators, filters, and methods. An exemplary filter includes a piezoelectric layer plate supported by a substrate; and three or more diaphragms of the piezoelectric layer spanning a respective cavity. A conductor pattern on the layer has interdigital transducers (IDTs) of three or more acoustic resonators. Each IDT has two sets of interleaved fingers extending from two busbars, respectively. Overlapping portions of the fingers define an aperture of each acoustic resonator. One or more of the resonators can have two dielectric strips that overlap the IDT fingers in first and second margins of the aperture and that extend into first and second gaps between the first and second margins and the busbars. Moreover, the first and second dielectric strips can be on a surface of the layer, have a first portion under the IDT fingers and have a second portion extending into a gap between the margins and the busbars.
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
A vibration device that includes: a vibrator; a piezoelectric element located at a first end of the vibrator in a first direction; a light-transmitting element located at a second end of the vibrator in the first direction; a holding portion that holds the second end of the vibrator and the light-transmitting element in the first direction; a first member between the light-transmitting element and the holding portion and connected to the light-transmitting element and the holding portion; and a second member between the light-transmitting element and the vibrator and connected to the light-transmitting element and the vibrator, wherein a thickness of the first member is equal to or more than a thickness of the second member.
An optical device is provided that fully removes foreign matter adhering to a surface of a light-transparent body. The optical device includes an outermost-layer lens, a housing, a vibrator, and a piezoelectric device. The outermost-layer lens transmits light of a predetermined wavelength. The housing holds the outermost-layer lens. The vibrator is a tubular body including that contacts the outermost-layer lens and a second end at which the piezoelectric device is disposed. In a heating mode, the vibrator vibrates the outermost-layer lens at a vibration acceleration within a range of more than or equal to 3.0×106 m/s2 to less than and or equal to 3.0×108 m/s2 at a natural vibration frequency of the outermost-layer lens.
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (France)
Inventor
Voiron, Frédéric
El Sabahy, Julien
Fourneaud, Ludovic
Abstract
An electronic product having a silicon-on-insulator substrate, a porous layer of anodic oxide or anodic hydroxide over the silicon layer of the silicon-on-insulator substrate, and a metal layer over the porous layer and that defines at least one electrical transmission line. The velocity of the electrical signal in the at least one electrical transmission line may be controlled by appropriate configuration of the porosity ratio of the porous layer.
H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
G02F 1/21 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour by interference
G02F 1/225 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour by interference in an optical waveguide structure
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/528 - Layout of the interconnection structure
H10D 86/00 - Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
A winding coil component including a core, a wire wound around the core, and a structure where metal terminals attached to flange portions of the core are less easily removable from the flange portions. Each flange portion of a core has a mount surface that is to face a mount board when the coil component is to be mounted on the mount board, a top surface facing in an opposite direction to the mount surface, an inner end surface coupling the mount surface and the top surface to each other, facing the winding core, and at which a corresponding one of the end portions of the winding core in an axial direction is located, an outer end surface facing in an opposite direction to the inner end surface, and first and second side surfaces coupling the inner and outer end surfaces to each other and facing in opposite directions.
An electronic component includes a base body and a first external electrode to cover a part of an outer surface of the base body. The first external electrode includes no silver component. The first external electrode includes a first underlying electrode to cover an outer surface of the base body. The first underlying electrode includes copper particles and a silicone as a synthetic resin. When the first underlying electrode is bisected into a first part located on the base body side and a second part located on the opposite side to the base body, the average value of the particle sizes of the copper particles in the second part is larger than the average value of the particle sizes of the copper particles in the first part.
A coil component includes a core including a winding core portion and a pair of flange portions provided at both ends of the winding core portion, electrode portions provided in the flange portions, a wire wound around the winding core portion, and a magnetic plate fixed to the flange portions. The magnetic plate includes an annular first planar portion, a second planar portion that is located inside the inner circumference of the first planar portion and has a step between the first and the second planar portions, and a connection surface portion connecting the inner circumference of the first planar portion to the outer circumference of the second planar portion. The connection surface portion is configured by annularly disposing at least three slopes inclined with respect to the direction orthogonal to the first planar portion and has chamfered portions each being disposed between adjacent slopes.
Circuits and methods for providing a “bootstrap” power supply for level-shifter/driver (LS/D) circuits in a FET-based power converter. In a first embodiment, linear regulators and a bootstrap capacitor provide a bootstrap power supply for level-shifter/driver circuits in each tier of a multi-level FET-based power converter. In a second embodiment, floating charge circuits and bootstrap capacitors provide an improved bootstrap power supply for level-shifter and driver circuits in each tier of a multi-level FET-based power converter. More particularly, a floating charge circuit configured to be coupled to an associated bootstrap capacitor includes a first sub-circuit configured to pre-charge the associated bootstrap capacitor when coupled and a second sub-circuit configured to transfer charge between the bootstrap capacitor and a bootstrap capacitor coupled to an adjacent floating charge circuit.
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
H02M 1/08 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
H02M 3/07 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using resistors or capacitors, e.g. potential divider using capacitors charged and discharged alternately by semiconductor devices with control electrode
An electronic device and a method for manufacturing an electronic device. The electronic device includes: a board equipped with a pair of differential transmission lines, each line of the pair having an opening extending between two line terminals; and a capacitor module that includes: a base; and two 3D capacitors supported by the base, each 3D capacitor comprising two capacitor terminals respectively connected to the two line terminals of one line of the pair of transmission lines.
H01G 4/40 - Structural combinations of fixed capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
Provided is a multilayer ceramic capacitor capable of ensuring high moisture resistance reliability even in a case where moisture intrudes into the multilayer ceramic capacitor. In a multilayer ceramic capacitor 1, a laminate 2 includes: an inner layer part 60 in which first internal electrodes 30 and second internal electrodes 31 are alternately laminated with a dielectric layer 20 interposed therebetween; outer layer parts 61 which are arranged so as to sandwich the inner layer part 60 in a lamination direction 102 and which are composed of a ceramic material; and side gap parts which are arranged so as to sandwich the inner layer part 60 and the outer layer parts 61 in a width direction 101. A glass region 80 in which glass is segregated is present in at least either the side gap parts or the outer layer parts 61.
A composite sensor (1) comprises: a first substrate (50); a second substrate (30) that faces the first substrate (50) across a gap; a first sealing frame (43) that seals a first space (48) between the first substrate (50) and the second substrate (30); and a second sealing frame (44) that seals a second space (49) between the first substrate (50) and the second substrate (30). One of the first space (48) and the second space (49) is provided with an acceleration sensor (11), and the other is provided with an angular velocity sensor (12). The degree of vacuum of the first space (48) is different from that of the second space (49). The first sealing frame (43) and the second sealing frame (44) are each made of an eutectic alloy.
G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
G01C 19/5783 - Mountings or housings not specific to any of the devices covered by groups
G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
69.
MENOPAUSE PROGRESS ESTIMATION SYSTEM, MENOPAUSE PROGRESS ESTIMATION DEVICE, MENOPAUSE PROGRESS ESTIMATION METHOD, AND MENOPAUSE PROGRESS ESTIMATION PROGRAM
This menopause progress estimation system comprises a control unit and a storage device. The storage device stores a plurality of menstrual cycles of a measured subject and a plurality of basal body temperatures of the measured subject. The control unit estimates the degree of progress of menopause of the measured subject on the basis of the plurality of menstrual cycles and the plurality of basal body temperatures.
A61B 10/00 - Instruments for taking body samples for diagnostic purposesOther methods or instruments for diagnosis, e.g. for vaccination diagnosis, sex determination or ovulation-period determinationThroat striking implements
Provided is an electronic component mounting structure with improved crack resistance. A mounting structure 100 for an electronic component 1 comprises: an electronic component 1 including a laminate 2 and external electrodes 3 that are formed on end surfaces of the laminate 2 and have mounting surface-side bent parts 351 extending to a mounting-side main surface AB; and a mounting substrate 101 including a land part 102 to which the external electrodes 3 are joined via solder 103. When the distance between the two mounting surface-side bent parts 351 is the inter-external electrode distance g1 and the distance between lands disposed on the mounting substrate is the inter-land distance g2, the inter-external electrode distance g1 and the inter-land distance g2 are approximately equal.
Provided is a control method for a high frequency circuit capable of reducing damage to a power amplifier by a reflected wave of a sounding reference signal (SRS) in a switch. The method for controlling the high-frequency circuit has a control step (ST2). The control step (ST2) includes a first transmission control step (ST21), a connection step (ST22), a disconnection step (ST24), and a second transmission control step (ST25). In the connection step (ST22), after the first transmission control step (ST21), a second common terminal (7b) and a first selection terminal (7c) are connected in a state in which the first common terminal (7a) and the first selection terminal (7c) are connected. In the disconnection step (ST24), after the connection step (ST22), the connection between the first common terminal (7a) and the first selection terminal (7c) is cut off in a state in which the second common terminal (7b) and the first selection terminal (7c) are connected. In the second transmission control step (ST25), after the cutting step (ST24), the SRS from the power amplifier (12) is transmitted from a second antenna (3B).
A high-frequency signal transmission line (101) comprises: a resin laminate part in which a first resin layer and a second resin layer are laminated; a signal conductor pattern formed on the first resin layer; and a ground conductor layer formed on the first resin layer. In the resin laminate part, a first opening portion is formed in the first resin layer at a position along the signal conductor pattern, and a second opening portion overlapping the first opening portion is formed in the second resin layer. Thus, a hollow portion is formed in the resin laminate part at the first opening portion or the second opening portion. The opening width of the second opening portion is smaller than the opening width of the first opening portion. The second opening portion has a part where the opening width thereof is larger than the line width of the signal conductor pattern. The second resin layer has a lower dielectric constant or a lower dielectric loss tangent than the first resin layer.
The present invention is provided with: an upper lid (30); a device layer (10) that is disposed facing the upper lid (30) and that includes movable parts (12, 13); and a joining part (60) that joins the upper lid (30) and the device layer (10) with the space therebetween in a hermetically sealed state. The joining part (60) includes an eutectic metal layer (61), and a height adjustment layer (62) that is laminated on the eutectic metal layer (61) and adjusts the interval between the upper lid (30) and the device layer (10). The height adjustment layer (62) is made of a material having gas permeability, and includes an inner surface (62A) facing the space between the upper lid (30) and the device layer (10), and an outer surface (62B) serving as a surface opposite to the inner surface (62A). The eutectic metal layer (61) is configured to cover at least one of the inner surface (62A) and the outer surface (62B) of the height adjustment layer (62).
B81B 3/00 - Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
B81C 1/00 - Manufacture or treatment of devices or systems in or on a substrate
G01P 15/08 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values
G01P 15/125 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by capacitive pick-up
A rotating electrical machine (10) is mounted on an electric cutting tool with a cutter. The rotating electrical machine (10) is provided with a motor body (20) that transmits rotational force to the cutter, and a control unit (30) that controls an input current to the motor body (20). The control unit (30) controls the input current so that the motor body (20) operates at a maximum rotation speed during no-load operation in a startup state. When the cutter starts cutting a cutting object so that a load is applied to the motor body (20) and the rotational speed reaches an initial stable state, the control unit (30) controls the input current to the motor body (20) so as to maintain the rotational speed. The control unit (30) increases the input current when the rotational speed decreases after the initial stable state in a region where the input current does not reach an upper limit value, and decreases the input current when the rotational speed continues for a switching threshold time or longer.
B23Q 15/12 - Adaptive control, i.e. adjusting itself to have a performance which is optimum according to a preassigned criterion
B23D 47/12 - Sawing machines or sawing devices working with circular saw blades, characterised only by constructional features of particular parts of drives for circular saw blades
B23Q 17/10 - Arrangements for indicating or measuring on machine tools for indicating or measuring cutting speed or number of revolutions
B25F 5/00 - Details or components of portable power-driven tools not particularly related to the operations performed and not otherwise provided for
G05B 19/4155 - Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
H02P 6/08 - Arrangements for controlling the speed or torque of a single motor
A valve (1) is provided with a housing (10) and a valve film (30). The housing (10) is provided with a first housing member (11) and a second housing member (12). The first housing member (11) comprises: a first end member (111) provided with a first surface (F1111) and a second surface (F1112); and a circular first lateral wall member (112) that is directly or indirectly connected to the first end member (111) and that includes a third surface (F1122) on the side of the first lateral wall member which is opposite to the side connected to a section of the second surface (F1112). The second housing member (12) comprises: a second end member (121) that is provided with a fourth surface (F2111) and a fifth surface (F2112) that faces a section of the second surface (F1112); and a circular second lateral wall member (122) that is directly or indirectly connected to the second end member (121) and that is provided with a sixth surface (F2121) that faces or joins a section of the fifth surface (F2112), and a seventh surface (F2122) that faces or joins a section of the third surface (F1122) of the first lateral wall member (112). The first end member (111) is provided with: a plurality of first ventilation holes (21) that communicate the first surface (F1111) and the second surface (F1112); and a first valve seat (19) that is connected to the second surface (F1112) and that is disposed, in plan view of the second surface (F1112), within the ring of the first lateral wall member (112). The first valve seat (19) comprises a first top surface (F19). The first top surface (F19) is positioned closer to the fifth surface (F2122) side than the second surface (F1112) in the thickness direction of the first housing member (11). The second end member (121) is provided with a second ventilation hole (22) that communicates the fourth surface (F2111) and the fifth surface (F2112). The second lateral wall member (122) comprises: an exhaust hole (23) that communicates with the sixth surface (F2122); and a second valve seat (29) that, in a front view of the fourth surface (F2111), is disposed between an inner surface (F220) of the ring of the second lateral wall member (122) and the exhaust hole (23), and that includes a second top surface (F29) on the seventh surface (F2122) side. The valve film (30) is disposed so as to span the inside of the ring of the first side wall member (112) and the inside of the ring of the second side wall member (122), and when viewed in the height direction in which the first housing member (11) and the second housing member (12) are arranged, the valve film comprises: a first portion (31) which overlaps the first valve seat (19); a second portion (32) which overlaps the second valve seat (29); and an outer end portion (330) which is positioned closer to the outer circumferential side than the second portion (29). The valve film (30) is configured so that, in a state in which the outer end portion (330) is sandwiched between the first housing member (11) and the second housing member (12), the second portion (32) is located closer to the first surface (F1111) side than the first portion (31) is, when viewed from a lateral direction orthogonal to the height direction. The thickness of the first portion (31) and the thickness of the second portion (32) are greater than the thickness of the outer end portion (330).
F16K 7/17 - Diaphragm cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat the diaphragm being actuated by fluid pressure
F16K 15/14 - Check valves with flexible valve members
F16K 31/126 - Operating meansReleasing devices actuated by fluid the fluid acting on a diaphragm, bellows, or the like
A valve (1) is provided with a housing (10) and a valve membrane (30). The housing (10) is provided with a first housing member (11) and a second housing member (12). The first housing member (11) is provided with: a first end member (111) comprising a first surface (F1111) and a second surface (F1112); and a ring-shaped first side wall member (112) that directly or indirectly connects to the first end member (111) and comprises a third surface (F1122) on the side opposite to the side connected to a portion of the second surface (F1112). The second housing member (12) is provided with: a second end member (121) comprising a fourth surface (F2111) and a fifth surface (F2112) that faces a portion of the second surface (F1112); and a ring-shaped second side wall member (122) that directly or indirectly connects to the second end member (121) and comprises a sixth surface (F2121), which faces or joins to a portion of the fifth surface (F2112), and a seventh surface (F2122), which faces or joins to a portion of the third surface (F1122) of the first side wall member (112). The first end member (111) is provided with: a plurality of first ventilation holes (21) that cause the first surface (F1111) and the second surface (F1112) to communicate; and a first valve seat (19) that connects to the second surface (F1112) and is disposed inside the ring of the first side wall member (112) in a plan view of the second surface (F1112). The first valve seat (19) is provided with a first top surface (F19). The first top surface (F19) is positioned closer to the fifth surface (F2112) side than the second surface (F1112) in the thickness direction of the first housing member (11). The second end member (121) is provided with a second ventilation hole (22) that causes the fourth surface (F2111) and the fifth surface (F2112) to communicate. The second side wall member (122) is provided with: a third ventilation hole (23) that communicates with the seventh surface (F2122); and a second valve seat (29) that is disposed between the third ventilation hole (23) and an inner surface (F220) of the ring of the second side wall member (122) in a front view of the fourth surface (F2111), and is provided with a second top surface (F29) on the seventh surface (F2122) side. The valve membrane (30) is fixed to the housing (10) in a state in which at least a portion thereof is deformable inside the ring of the first side wall member (112) or inside the ring of the second side wall member (122), and is provided with a first portion (31) overlapping the first valve seat (19) and a second portion (32) overlapping the second valve seat (29) when viewed in the height direction in which the first housing member (11) and the second housing member (12) are aligned. The valve membrane (30) and the first valve seat (19) constitute a check valve, and the valve membrane (30) and the second valve seat (29) constitute an exhaust valve. When viewed in the height direction, the exhaust valve is disposed at a position surrounding the check valve.
F16K 7/17 - Diaphragm cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage with flat, dished, or bowl-shaped diaphragm arranged to be deformed against a flat seat the diaphragm being actuated by fluid pressure
F16K 15/14 - Check valves with flexible valve members
F16K 31/126 - Operating meansReleasing devices actuated by fluid the fluid acting on a diaphragm, bellows, or the like
78.
Power Converter with Adaptative Stages and Gate Driver
A switching power converter architecture that is efficient across its entire power range, regardless of load level, by partitioning the power devices into segments for optimal gate drive and providing a local variable-voltage driver for each power device segment. Power device segments may be selectively enabled or disabled based on the level of power to be delivered to a load. In addition, an adaptive gate drive scheme enables dynamic control of the RON and QG values for each power converter device so that the power devices may operate at the lowest RON value at or near maximum power levels for reduced conduction losses, at the lowest RON×QG product value at mid-level loads for peak efficiency, and at the lowest QG value at light loads for reduced switching losses.
H02M 1/088 - Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters for the simultaneous control of series or parallel connected semiconductor devices
H02M 3/158 - Conversion of DC power input into DC power output without intermediate conversion into AC by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only with automatic control of output voltage or current, e.g. switching regulators including plural semiconductor devices as final control devices for a single load
Provided is a battery further superior in safety. A battery that is a cylindrical battery including a cylindrical exterior body that houses a battery element, and safety valves disposed at both end portions of the exterior body, wherein each of the safety valves includes: a first metal member; a support portion that is provided to support the first metal member at a peripheral edge portion of the first metal member and has an opening; and a first insulating member that connects the first metal member and the support portion and contains a thermoplastic resin.
H01M 50/107 - Primary casingsJackets or wrappings characterised by their shape or physical structure having curved cross-section, e.g. round or elliptic
H01M 50/581 - Devices or arrangements for the interruption of current in response to temperature
A radio frequency module includes a first semiconductor device that includes a circuit for a signal in a first frequency band, a second semiconductor device that includes a circuit for a signal in a second frequency band, a first external connection terminal that receives a transmit signal in the first frequency band, a second external connection terminal that receives a transmit signal in the second frequency band, a first switch that is electrically connected to the first external connection terminal or the second external connection terminal, a power amplifier that receives a signal outputted from the first switch, a third external connection terminal that receives a selectively-transported output signal from the power amplifier and that is electrically connected to an external first antenna, and a fourth external connection terminal that receives a selectively-transported output signal from the power amplifier and that is electrically connected to an external second antenna.
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
H03F 3/24 - Power amplifiers, e.g. Class B amplifiers, Class C amplifiers of transmitter output stages
A method for manufacturing a laminated inductor capable of reducing the number of laminated layers in manufacturing the laminated inductor. A method for manufacturing a laminated inductor includes preparing a plurality of first sheets A each including a conductor portion and a magnetic portion formed on a lower side of a magnetic sheet, and a first via portion penetrating the magnetic sheet on an upper side of the conductor portion; and laminating the plurality of first sheets A to form a first coil layer including a first coil to which the conductor portion is electrically connected with the first via portion interposed therebetween.
A first circuit that inputs/outputs a first frequency band and a second circuit that inputs/outputs a second frequency band are included. A first receiving unit in the first circuit is connected to a first external connection terminal or a second external connection terminal with a band pass filter and a first switch in a high-frequency switch. A first transmitting unit or a second receiving unit in the first circuit is connected with a second switch in the high-frequency switch. The second switch is connected to a diplexer connected to a third external connection terminal. A second transmitting unit in the second circuit is connected to the diplexer or a fourth external connection terminal with a third switch in the high-frequency switch. A third receiving unit or a fourth receiving unit in the second circuit is connected to the fourth external connection terminal with the third switch.
H04B 1/00 - Details of transmission systems, not covered by a single one of groups Details of transmission systems not characterised by the medium used for transmission
H03H 11/34 - Networks for connecting several sources or loads working on different frequencies or frequency bands, to a common load or source
A microelectromechanical component is provided with a metal standoff and a method of manufacturing the same. The metal standoff provides an accurate control of the MEMS gap height during the eutectic bonding of the component as well as mechanical stress reduction of the electrical contact.
A biological information detection system includes a biosensor and a case that is capable of housing the biosensor. The biosensor includes a first storage unit and a first communication unit. The case includes a second communication unit, a third communication unit, and a case controller. The case controller is capable of performing an information reception process and an output process. The information reception process is a process of receiving biological information and sensor identification information by using the second communication unit. The output process is a process of transmitting, from the third communication unit to an external device, the biological information and the sensor identification information, which are received in the information reception process, in association with each other.
A secondary battery is provided and includes an exterior member having flexibility, and a positive electrode, a negative electrode, and an electrolytic solution that are housed in the exterior member. The electrolytic solution contains a solvent and an electrolyte salt, and the solvent contains propyl acetate and propyl propionate. The ratio of the content of propyl acetate in the solvent to the sum of the content of propyl acetate in the solvent and the content of propyl propionate in the solvent is 0.1 or more and 0.5 or less.
A control unit includes a CPU as an execution unit and a storage. The storage stores vibration mode data indicating multiple vibration modes used for rehabilitation. The storage stores model data which determines a learning model. A body condition variable indicating body information of a user is input into the learning model and a mode variable is output from the learning model. The mode variable indicates a pattern of a vibration mode that represents a tactile/force sense to output from a haptic device. The model data is learned data obtained by machine learning. In obtaining processing, the CPU obtains multiple body condition variables of the user. In mode selection processing, the CPU selects a specific mode, based on mode variables output by using the multiple body condition variables obtained in the mode obtaining processing as input variables. In driving processing, the CPU drives a vibrator by using the specific mode.
G05B 13/02 - Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
87.
CONTROL UNIT FOR VIBRATOR OF HAPTIC DEVICE AND HAPTIC DEVICE
A control unit controls a vibrator of a haptic device. The control unit includes a CPU as an execution unit and a storage. The storage stores correlation data created by correlating multiple vibration modes and specifying information to each other. The vibration modes are used for presenting a tactile/force sense in accordance with a rehabilitation pattern. The specifying information is used for specifying a rehabilitation pattern. The CPU executes obtaining processing, mode selection processing, and driving processing. In the obtaining processing, based on the correlation data, the CPU selects a vibration mode in accordance with specifying information obtained in the obtaining processing. In the mode selection processing, based on the correlation data, the CPU selects a vibration mode in accordance with specifying information obtained in the obtaining processing. In the driving processing, the CPU drives the vibrator by using the vibration mode selected in the mode selection processing.
A module includes: a substrate having a first surface; a first component mounted on the first surface; a first sealing resin layer disposed to cover a side surface of the first component and the first surface; and a redistribution layer covering a surface of the first sealing resin layer on a side far from the substrate. The redistribution layer includes: a first metal film disposed to correspond to a projection area of the first component; a first insulating film covering a surface of the first metal film on a side far from the substrate; and a first group of conductor vias passing through the first insulating film and protruding from the first metal film in a direction away from the substrate.
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
H01L 25/11 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass
A piezoelectric vibration element that includes: a piezoelectric substrate; a first excitation electrode on a first main surface of the piezoelectric substrate; a second excitation electrode on a second main surface of the piezoelectric substrate; and a mass-adding film at least a part of which overlaps with the first excitation electrode, the mass-adding film including a first part and a second part which do not overlap a central portion of the first excitation electrode, the first part extends along a first outer edge portion of the first excitation electrode and the second part extends along a second outer edge portion of the first excitation electrode so as to define a high acoustic velocity region, a first low acoustic velocity region, and a second low acoustic velocity region in a plan view.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
H10N 30/20 - Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
H10N 30/87 - Electrodes or interconnections, e.g. leads or terminals
90.
LOAD SENSOR AND METHOD FOR MANUFACTURING LOAD SENSOR
A load sensor that includes: an upper housing having an upper face portion, and a lateral face portion that extends in the thickness direction from an outer periphery of the upper face portion; a lower housing having a lower face portion that faces the upper face portion in the thickness direction, the lower housing being less elastically deformable than the upper housing; and a piezoelectric resonator in a space between the upper housing and the lower housing, wherein an end portion of the upper housing and an end portion of the lower housing are fixed to each other with a crimp such that the upper housing is elastically deformed and causes a preload to be applied by the upper housing to the piezoelectric resonator in the thickness direction.
G01L 1/16 - Measuring force or stress, in general using properties of piezoelectric devices
H03H 3/02 - Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
91.
SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING SOLID ELECTROLYTIC CAPACITOR
A solid electrolytic capacitor including: a plurality of capacitor elements, each capacitor element having: a flat film-shaped main body including a valve metal, a dielectric layer on the main body, and a solid electrolyte layer on at least a part of the dielectric layer so as to define a cathode formation region having the solid electrolyte layer and an anode terminal region that does not include the solid electrolyte layer; a sealing body sealing the plurality of capacitor elements, the sealing body having a first end surface at which an end portion of an anode terminal region is exposed; a first base electrode on the first end surface and including a first element; and a second base electrode covering the first base electrode and including the first element and a second element, wherein the second base electrode is an intermetallic compound of the first element and the second element.
An acoustic wave device includes a piezoelectric layer, first and second comb-shaped electrodes, and a third electrode. The first comb-shaped electrode is on the piezoelectric layer, connected to an input potential, and including a first busbar, and first electrode fingers. The second comb-shaped electrode is on the piezoelectric layer, connected to an output potential, and including a second busbar, and second electrode fingers. The third electrode is connected to a potential different from the first and second comb-shaped electrodes, and includes third electrode fingers, and a connection electrode. The connection electrode interconnects adjacent third electrode fingers. The first electrode finger, the third electrode finger, the second electrode finger, and the third electrode finger are arranged in this order. A ratio d/p is greater than or equal to about 0.05.
An acoustic wave device includes a piezoelectric layer, first and second comb-shaped electrodes respectively including first and second electrode fingers, and a third electrode including third electrode fingers. The first comb-shaped electrode is connected to an input potential. The second comb-shaped electrode is connected to an output potential. The third electrode is connected to a potential different from the first and second comb-shaped electrodes. Each of the third electrode fingers is arranged alongside the first and second electrode fingers. A third busbar interconnects adjacent third electrode fingers. A third electrode finger is between first and second electrode fingers closest to each other. At least one set of electrode fingers selected from the first, second, and third electrode fingers, includes two or more consecutive electrode fingers in the orthogonal-to-electrode-finger direction.
A piezoelectric vibration element according to an exemplary aspect of the present disclosure includes a piezoelectric piece having a first main surface and a second main surface. The first main surface and the second main surface face each other in a facing direction. The piezoelectric vibration element also includes a first excitation electrode on the first main surface and a second excitation electrode on the second main surface. In a plan view in the facing direction, a first area of the first excitation electrode is smaller than a second area of the second excitation electrode, and a part of the second excitation electrode overlaps an entirety of the first excitation electrode, and a first thickness of the first excitation electrode along the facing direction is smaller than a second thickness of the second excitation electrode along the facing direction.
H03H 9/19 - Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
In a circuit module, a lower circuit board, when viewed in an up-down direction, overlaps with a portion of an upper circuit board. The upper circuit board, the lower circuit board, and a sealing member configure a main body portion including an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface. A shield member covers the upper surface and the side surface. When viewed in the up-down direction, the first component is located outside an outer end of the lower circuit board. A lower end of the first component is located below a second upper principal surface. When viewed in the up-down direction, a component mounted on the first lower principal surface or a connection member mounted on the first lower principal surface is absent between the side surface located closest to the first component and the first component.
A coil component includes a core including a winding core portion and a first flange portion, a first wire and a second wire that are wound around the winding core portion in the same direction, and a first terminal electrode that is disposed on the first flange portion and that is connected to a first end portion of the first wire. The shape of an outer edge of the first terminal electrode includes a convex curve.
H01F 41/04 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets for manufacturing coils
97.
METHOD FOR SEPARATING AND RECOVERING RARE EARTH CONSTITUENT AND METAL CONSTITUENT FROM UNSINTERED WASTE BEFORE MANUFACTURING DEGREASING OR FROM UNSINTERED WASTE AFTER MANUFACTURING DEGREASING
Provided is a method for separating and recovering a rare earth constituent and a metal constituent from unsintered waste. This separation and recovery method comprises: (A) a step in which unsintered waste before manufacturing degreasing is prepared, said waste including a magnetic metal powder, a ceramic powder, a rare earth powder, and a resin constituent, and the metal powder and the ceramic powder adhering at least partially to one another; (B) a step in which the unsintered waste before manufacturing degreasing and a solvent are mixed and refined within a resulting slurry; (C) a step in which, after the step (B), a substance that contains the metal powder and a substance that contains the rare earth powder are separated and recovered using a magnet; (D) a step in which, by dissolving the substance containing the rare earth powder in a mineral acid, the ceramic powder is made to precipitate, and a solution containing a rare earth constituent, in which the rare earth powder is dissolved, is produced; and (H) a step in which, by dissolving the substance containing the metal powder in a mineral acid, the ceramic powder is made to precipitate, and a solution containing a metal constituent, in which the metal powder is dissolved, is produced.
METHOD FOR SEPARATING AND RECOVERING RARE EARTH COMPONENT AND METAL COMPONENT FROM UNFIRED WASTE BEFORE PRODUCTION DEGREASING OR UNFIRED WASTE AFTER PRODUCTION DEGREASING
The present invention provides a method for separating and recovering a rare earth component and a metal component from an unfired waste. This method for separating and recovering comprises: (A) a step for preparing an unfired waste before production degreasing, which contains a magnetic metal powder, a ceramic powder, a rare earth powder, and a resin component, and in which the metal powder and the ceramic powder are at least partially adhered to each other; (B) a step for refining the unfired waste before production degreasing by pulverization; (C) a step for separating and recovering a metal powder-containing material and a rare earth powder-containing material by means of a magnet after the step (B); (D) a step for producing a rare earth component-containing solution, in which the rare earth powder is dissolved by dissolving the rare earth powder-containing material into a mineral acid; (H) a step for producing a metal component-containing solution, in which the metal powder is dissolved, by dissolving the metal powder-containing material into a mineral acid; and (E) a step for recycle degreasing the resin component from the unfired waste before production degreasing between the step (A) and the step (D) and between the step (A) and the step (H).
The present invention provides a method for separating and recovering a rare earth component and a metal component from a post-calcination waste. This separation and recovery method includes: (A) a step for preparing a post-calcination waste of a multilayer ceramic capacitor in which a ceramic layer, an internal electrode layer containing a first metal component that has magnetic properties, and a baked electrode layer containing a second metal component that does not have magnetic properties are sintered; (B) a step for refining the post-calcination waste; (C) a step for separating and recovering, with use of a magnet, a first separated material that contains a refined ceramic and a refined first metal, and a second separated material that contains a refined ceramic, a rare earth-containing material, and a refined second metal; (D) a step for dissolving the second separated material into a mineral acid that has no oxidizing power, and precipitating the refined ceramic and the refined second metal, thereby generating a rare earth component-containing solution in which the rare earth component in the rare earth-containing material is dissolved; and (E) a step for dissolving the precipitate in the second separated material into ammonia water, thereby generating a second metal solution in which the second metal component in the refined second metal is dissolved.
C22B 3/06 - Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic acid solutions
C22B 3/14 - Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic alkaline solutions containing ammonia or ammonium salts
This invention provides a multilayer ceramic capacitor with which a sufficient strength can be obtained. A multilayer ceramic capacitor (1) is provided with: a stack (2) including six surfaces from a first surface (11) to a sixth surface (16); a first external electrode (21); and a second external electrode (22). The stack (2) is provided with an inner layer part (53) and two outer layer parts (50) arranged so as to sandwich the inner layer part (53) in the stacking direction (100). The outer layer part (50) is provided with an outer layer dielectric layer (41), and contains fibers (60) in the outer layer dielectric layer (41).
