Provided is a light source device that makes it possible to suppress vibration at the surface of a molten metal and uniformize the intensity distribution of illumination light. This light source device (1) comprises: a vessel (10) that has a rotational axis R, the vessel (10) including a cylindrical side wall (15) that rotates around the rotational axis R; a molten metal (20) that contacts at least a portion of an inner surface (30) of the side wall (15); and a processed part (40) that has protrusions (41) and/or recesses (42) formed at a portion thereof. Upon irradiation with laser light LR, the molten metal (20) generates light that includes EUV light LE.
A light source apparatus capable of reducing deformation of a target holding portion is provided. A light source apparatus according to the present disclosure includes a target holding portion including a cylindrical portion in a cylindrical shape, and a holding surface that holds a target member, the target holding portion holding the target member on the holding surface that rotates around a rotational axis, and a temperature adjusting unit configured to adjust a temperature of the cylindrical portion, the temperature adjusting unit includes an upstanding wall portion arranged to face an outer peripheral surface of the cylindrical portion, and the upstanding wall portion faces at least part of the outer peripheral surface of the cylindrical portion.
An image processing apparatus and an image processing method capable of evaluating a defect candidate found on a pattern surface in consideration of an influence when the pattern surface is transferred to a wafer with a simple configuration are provided. An image processing apparatus according to this embodiment includes: a first acquisition unit configured to acquire an evaluation image which is based on a result of imaging a pattern surface on which a pattern of an evaluation target mask is formed, a second acquisition unit configured to acquire a conversion parameter which is based on a relation between a captured image of the pattern surface and a transfer image when the pattern surface is transferred to a wafer in an exposure apparatus, and a third acquisition unit configured to acquire a converted evaluation image by applying the conversion parameter to the evaluation image.
A defect inspection apparatus according to the present embodiment includes: an irradiation optical system configured to irradiate a sample including a SiC substrate, a buffer layer formed on the SiC substrate, and a drift layer formed on the buffer layer with excitation light; a filter unit configured to control a wavelength band to transmit photoluminescence light generated from the sample; a detection optical system configured to detect the photoluminescence light transmitted through the filter unit; and an image processing unit configured to form an image from the detected photoluminescence light and to discriminate a defect captured in the formed image, and the image processing unit discriminates the defect based on whether a length of the defect is L1=(D1+D2)/tan θ or L2=D2/tan θ.
G01N 21/88 - Investigating the presence of flaws, defects or contamination
G01N 21/359 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using near infrared light
An information processing apparatus includes a learning unit configured to train a model, a captured image acquisition unit configured to acquire a captured image, a reference image generation unit configured to generate a reference image, and an evaluation unit configured to evaluate an object based on a comparison between the reference image and the captured image, in which the learning unit includes a structural representation data acquisition unit configured to acquire a plurality of pieces of structural representation data, a classification unit configured to classify the plurality of pieces of structural representation data into one of a plurality of classes, a representative position acquisition unit configured to select representative data to be representative from among the pieces of structural representation data belonging to the same class and acquire a representative position corresponding to the class, and a training unit configured to train the model.
G06T 7/73 - Determining position or orientation of objects or cameras using feature-based methods
G06V 10/44 - Local feature extraction by analysis of parts of the pattern, e.g. by detecting edges, contours, loops, corners, strokes or intersectionsConnectivity analysis, e.g. of connected components
G06V 10/764 - Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
G06V 10/774 - Generating sets of training patternsBootstrap methods, e.g. bagging or boosting
6.
IMAGE PROCESSING DEVICE, OPTICAL APPARATUS, IMAGE PROCESSING METHOD, AND METHOD OF USING OPTICAL APPARATUS
An image processing device according to the present embodiment includes: a setting unit configured to set a first parameter for a first pattern extending in a first direction on a reference image plane, based on a first sample image area that is an area including the first pattern, and set a second parameter for a second pattern extending in a second direction orthogonal to the first direction, based on a second sample image area that is an area including the second pattern; an obtaining unit configured to obtain a specimen image that is a captured image taken through a predetermined image capturing optical system by capturing an image of a specimen that has a third pattern extending in the first direction and a fourth pattern extending in the second direction; and a processing unit configured to perform predetermined information processing for the specimen image.
The information processing apparatus according to the present embodiment includes: a learning unit configured to train a model; a captured image acquisition unit configured to acquire a captured image; a reference image generation unit configured to generate a reference image; and an evaluation unit configured to evaluate the object based on a comparison between the reference image and the captured image, the learning unit includes a residual calculation unit configured to calculate a residual by comparing a generated image output from the model in a training course with a training image including the captured image, and a determination unit configured to determine that training of the model is completed when the residual satisfies a predetermined condition, and the residual calculation unit calculates a residual based on the differential image.
G06V 10/75 - Organisation of the matching processes, e.g. simultaneous or sequential comparisons of image or video featuresCoarse-fine approaches, e.g. multi-scale approachesImage or video pattern matchingProximity measures in feature spaces using context analysisSelection of dictionaries
G06V 10/764 - Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
G06V 10/774 - Generating sets of training patternsBootstrap methods, e.g. bagging or boosting
An image processing method includes: a process of acquiring an inspection image, which is an image captured by illuminating, by critical illumination, an inspection target area of an object to be inspected; a process of acquiring illumination profile information indicating an illumination profile at the time of image capturing; a process of generating a reference image based on design information of the object to be inspected; and a process of inspecting the inspection target area by comparing the inspection image with the reference image, in which, in the process of generating the reference image, by using the illumination profile information, different reference images are generated for areas that show a common structure in the design information.
An image processing method includes: a process of acquiring an inspection image, which is an image obtained by imaging an inspection target area of an object to be inspected, the inspection image being included in an image obtained by imaging, by a detector having a predetermined imaging range, the object to be inspected; a process of acquiring positional data indicating an imaging position, which is a position of the inspection image, in the predetermined imaging range; a process of generating a reference image based on design information of the object to be inspected; and a process of inspecting the inspection target area by comparing the inspection image with the reference image, in which in the process of generating the reference image, different reference images are generated, by using the positional data, for areas that show a common structure in the design information.
To provide a control apparatus and a control method that enable inspection accuracy of a mask with a pellicle to be improved. A control apparatus of an optical apparatus equipped with light detecting means for detecting light from a pattern surface of a photomask illuminated by illumination light, the control apparatus including: acquiring means for acquiring pellicle information indicating whether or not a pellicle is mounted on a photomask; and setting means for setting a charge accumulation time in the light detecting means when illuminating a pattern surface of the photomask on which the pellicle is mounted by the optical apparatus to be longer than a charge accumulation time in the light detecting means when illuminating a pattern surface of the photomask on which the pellicle is not mounted by the optical apparatus.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
11.
DEFECT CLASSIFICATION METHOD, ANALYSIS METHOD, AND INSPECTION APPARATUS
A defect classification method includes: projecting an illumination beam toward the silicon carbide substrate and scanning a position at which the silicon carbide substrate is illuminated with the illumination beam; detecting reflected light and photoluminescence light including light in a visible region, emitted from the silicon carbide substrate; and classifying the defects based on a result of the detection of the reflected light and a result of the detection of the photoluminescence light including the light in the visible region, in which the classifying the defects includes classifying the defect as a 3C-SF (Stacking Fault) based on detection of a first defect image by the reflected light and classifying the defect as an SSF (Shockley-type Stacking Fault) based on detection of a second defect image by the photoluminescence light including the light in the visible region.
An inspection device according to the present embodiment comprises: an illumination optical system (100) for illuminating an object (400) with illumination light (L10); an imaging optical system (220a) that includes a condensing member (210) for condensing light (L20) from the object (400) illuminated with the illumination light (L10), and images the light (L20) condensed by the condensing member (210) onto a light detection unit (230); and a processing unit (300) that inspects the object (400) on the basis of the image imaged on the light detection unit (230). When an object plane (410) is set between the object (400) and the condensing member (210), the object plane (410) has: a condensing region (520) including a first condensing region and a second condensing region; and an illumination light region (510) surrounded by the second condensing region. The first condensing region is associated with regular reflection light (L21), and the second condensing region is associated with high-order diffraction light (L22). The first condensing region is surrounded by the second condensing region.
An optical apparatus or the like including a gain changing unit that changes a predetermined gain is provided. An optical apparatus according to the present disclosure includes: a first detection unit configured to detect light coming from an object illuminated by light emitted from a light source and output signals in association with a plurality of positions; a second detection unit configured to detect a part of the light emitted from the light source and output signals in association with a plurality of positions; a signal correction unit configured to correct the signals from the first detection unit based on predetermined gain values determined in advance for the respective positions; and a gain changing unit configured to change the predetermined gain values based on the signals from the second detection unit.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A light source apparatus according to an embodiment includes: a target material capable of generating EUV light when being irradiated with laser light; a collector mirror configured to reflect the EUV light; an exhaust case including an outer cover disposed between the target material and the collector mirror, and an exhaust port communicating with an exhaust space formed on a target material side of the outer cover; a cylindrical optical-path cover a diameter of an opening another end being larger than that of an opening at one end; and a filter that is disposed at the other end of the optical-path cover or inside thereof, and configured to let the EUV light pass therethrough.
An optical system irradiates an object with illumination light and guides a secondary ray generated when the object is irradiated with the illumination light to a detector. Optical path length adjustment mechanism adjusts an optical path length between the object and the detector. one or more processors execute a program stored in a memory to: generate an image of the object based on detection results of the secondary ray by the detector, control the optical path length adjustment mechanism to change the optical path length between the object and the detector, acquire multiple images of the object while changing the optical path length between the object and the detector, and generate the image of the object based on a cumulative result of the acquired multiple images.
A light source emits illumination light. An objective lens focuses the illumination light on a sample. A first detector detects reflected light at a location anterior to the focal plane of the sample. A second detector detects the reflected light at a location posterior to the focal plane of the sample. A third light detector detects the incident reflected light. A beam splitter splits the reflected light into the first and second light detectors and the third light detector. A focus adjustment mechanism adjusts a focus position of the objective lens, based on a detection result from the first and second light detectors. A optical path length adjustment mechanism is provided between the beam splitter and the first and second light detectors, and adjusts an optical distance between the beam splitter and the first and second light detectors to a value corresponding to a magnification of the objective lens.
An image reading unit reads image data obtained by imaging a sample in which a plurality of regions is disposed including a pattern formed based on identical design information. An evaluation value acquisition unit acquires, from among sampling images at a plurality of sampling points set for each of the plurality of regions, an evaluation value based on luminance of pixels for a plurality of sampling images at the same sampling point of the plurality of regions. A reference evaluation value acquisition unit acquires a reference evaluation value relative to the evaluation value for a plurality of sampling images at the same sampling point in the plurality of regions. An equalized evaluation value acquisition unit acquires an equalized evaluation value indicating a degree of deviation of the evaluation value from the reference evaluation value, for each of the sampling images of the plurality of regions.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A light source apparatus according to the present embodiment includes: an optical path tube configured to connect a space on a side at which a mirror is disposed and a space on a side at which a plasma forming area is disposed, the mirror being configured to extract light produced by plasma; and a filter disposed so as to cover the optical path tube and configured to transmit the light produced by the plasma. The optical path tube is provided with a gas intake part configured to take gas into the optical path tube, the gas intake part being provided on the side at which the plasma forming area is disposed relative to the filter. The optical path tube includes a first outlet and a second outlet configured to guide the gas outside of the optical path tube.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A control apparatus for an optical apparatus including a light source apparatus according to the present disclosure is configured to determine a mode to be executed from among a plurality of modes and control the optical apparatus accordingly. The plurality of modes include a first mode in which the light source apparatus irradiates laser light onto a molten target material to generate illumination light, and the optical apparatus illuminates an object using the illumination light, and a second mode in which the light source apparatus irradiates laser light onto at least one of a holding unit of the target material or the target material in a solid state to change the target material from the solid state to a molten state.
H05G 2/00 - Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
The present disclosure provides an optical device that, in addition to being capable of stably illuminating an object regardless of a change in state of a component of the optical device, is also capable of stably observing the result of illuminating the object irrespective of the change in state of the optical device component. The optical device according to the present disclosure comprises: a detection unit that detects light generated by illumination light being projected onto an object; and an optical system in which, in response to a change in the state of a component which occurs when the illumination of the object is performed, the illumination distribution of the illumination light in an inspection visual field of the detection unit fluctuates in a prescribed direction associated with the state change. The illumination distribution has a shape such that the length in a prescribed direction is longer than the length in a direction perpendicular to the prescribed direction.
A light source apparatus according to the present disclosure includes: a target holding unit having a holding surface for holding a target material for generating light; and an acquisition unit configured to acquire state information of the holding surface, in which the holding surface includes a first region and a second region, a depth of the first region from a predetermined surface is greater than that of the second region, the target material is held in the first region when the amount of the target material is a first amount, the target material is held in the first region and the second region when the amount of the target material is a second amount greater than the first amount, and the acquisition unit acquires the amount of the target material based on a region in which the target material occupies the holding surface in the acquired state information.
H05G 2/00 - Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
A light source apparatus according to the present disclosure includes a target holding unit configured to hold a target material on an inner wall surface with a centrifugal force caused by rotation around a rotation axis, a laser configured to excite the target material with a ray that is based on amplified light amplified by an amplifier, and a switch provided between the amplifier and the target material or an element group exhibiting a nonlinear optical effect provided between the amplifier and the target material. The light switch or the element group suppresses a power component in the amplified light which is equal to or smaller than a predetermined threshold, and the target material generates plasma with a ray in which the power component is suppressed.
H01S 3/10 - Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
A light source apparatus according to the present disclosure includes: a target holding unit that has a holding surface for transporting a target material for generating plasma, to at least one plasma formation position; and a drive unit that drives the target holding unit, and moves the holding surface, wherein the holding surface moves with respect to a treatment surface in a space along the holding surface, the treatment surface includes: at least one plasma formation position; at least one supply position at which the target material is supplied to the holding surface; and at least one observation position at which state information on the target material held on the holding surface, the plasma formation position, the supply position, and the observation position are disposed along the treatment surface, and the treatment surface includes the supply position disposed after the plasma formation position.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
H01J 65/04 - Lamps in which a gas filling is excited to luminesce by an external electromagnetic field or by external corpuscular radiation, e.g. for indicating
24.
OPTICAL APPARATUS AND CONTROL METHOD OF OPTICAL APPARATUS
An inspection apparatus according to the present embodiment includes an optical system configured to illuminate an object with critical illumination using plasma as a bright point, detecting means for detecting secondary light from the object illuminated by the critical illumination, and plasma forming means for forming at least a first bright point and a second bright point as the bright point, in which the optical system is configured to: illuminate a first region of the object with first critical illumination by first illuminating light generated from the first bright point, and illuminate a second region of the object with second critical illumination by second illuminating light generated from the second bright point.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
25.
WAVELENGTH CONVERSION APPARATUS AND WAVELENGTH CONVERSION METHOD
A wavelength conversion apparatus according to the present disclosure includes storage means storing a conversion efficiency map in which wavelength conversion efficiency for each of a plurality of input positions of input light on a reference plane of a nonlinear optical crystal that converts a wavelength of output light from a wavelength of the input light is stored in association with the input position, the conversion efficiency map being for each of a plurality of temperature conditions of the nonlinear optical crystal, incident position determining means for determining, based on the conversion efficiency maps under two or more of the temperature conditions selected from the storage means, an incident position where the input light is made incident on the nonlinear optical crystal, and control means for controlling moving means for moving relative positions of the nonlinear optical crystal and the input light.
This image processing device (2) according to the present disclosure comprises: a support unit (40) that rotatably supports an object around a rotation axis (C1); an objective lens (21) that condenses a reflected light (R1) reflected by the object; drive units (12, 22) that can change a Z position, which is the relative position of the objective lens (21) with respect to the object, in an optical axis (C2) direction of the objective lens (21); an acquisition unit (31) that acquires a captured image of the object via the objective lens (21); a control unit (35) that causes the acquisition unit (31) to acquire a plurality of captured images; a specification unit (32) that specifies, in a plurality of captured images having different Z positions and different rotation angles (theta) of the object, a pixel position that is the position of a pixel having a luminance greater than or equal to a prescribed luminance; a storage unit (33) that stores the specified pixel position (P) as high-luminance time information together with the Z position and the rotation angle (theta) in each captured image; and a generation unit (34) that generates image information of the object on the basis of the high-luminance time information.
An inspection apparatus according to the present disclosure includes a first optical system that illuminates a film with first light transmitted through the film and receives first observation light from a first surface side of the film, a second optical system that illuminates the film from the first surface side with second light reflected from the first surface of the film and receives second observation light from the first surface side, and a determination unit that determines whether a position of a defect of the film is a defect above the first surface of the film or a defect below the first surface based on a combination of an observation result of bright-field observation in the first optical system and an observation result of dark-field observation in the second optical system.
An image processing apparatus according to the present embodiment includes an evaluation parameter acquisition unit configured to acquire an evaluation parameter for evaluating the information about each pixel of the plurality of pixels included in an evaluation image, based on comparison between a reference image and the evaluation image, the comparison being based on information about each pixel of a plurality of pixels included in the reference image and information about each pixel of a plurality of pixels included in the evaluation image corresponding to the reference image; a statistical value acquisition unit configured to acquire a statistical value of the evaluation parameters for a plurality of predetermined specific pixels in the evaluation image; and a standardized evaluation parameter acquisition unit configured to acquire a standardized evaluation parameter for evaluating the information about each pixel of the plurality of pixels included in the evaluation image.
A light source apparatus according to the present embodiment includes: a target holding unit including a holding region configured to hold a target material that generates light by excitation light being provided; a rotary shaft configured to support the target holding unit; and an axial rotation drive unit that is connected to the rotary shaft and configured to rotate, the target holding unit around a central axis of the rotary shaft, wherein the target holding unit is rotated by a predetermined target rotational angular velocity, and the target holding unit has a mass such that a critical angular velocity during rotation is equal to or lower than 85% of the target rotational angular velocity.
An optical apparatus according to the present embodiment is an optical apparatus that illuminates an object with illumination light, the optical apparatus including: a first mirror unit configured to reflect a first portion of generated light including the illumination light generated from a light-emitting point; a second mirror unit configured to reflect a second portion of the generated light; an optical element configured to reflect the generated light; a first detection unit configured to detect the first portion reflected by the first mirror unit; and a second detection unit configured to detect the second portion reflected by the second mirror unit, in which the generated light includes the first portion, the second portion, and a main portion, and at least a part of the main portion reflected by the optical element is the illumination light that illuminates the object.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
An image processing apparatus according to this embodiment includes: a specifying unit configured to specify, when parameter values of illumination parameters at a plurality of points corresponding to pixels of a photographed image obtained by photographing an object at a predetermined sampling time are compared with each other, a plurality of peak points each of which is a peak with respect to surrounding parameter values; a generation unit configured to generate, based on respective peak values of the parameter values at the specified plurality of peak points, the parameter values at a plurality of points between the peak points, and thereby generate a distribution of the parameter values; and a correction unit configured to correct the photographed image obtained at the predetermined sampling time by correcting the parameter values of at least one pixel of the photographed image.
A light source apparatus according to the present disclosure includes an input optical system including a first optical member configured to irradiate a target material with excitation light, an output optical system including a second optical member configured to extract light generated by irradiating the target material with the excitation light, a target holding unit configured to hold the target material, an acquiring unit configured to acquire displacement of a surface position of the target material, a driving unit configured to cause relative positions of an optical member and the target holding unit to vary, the optical member including at least one of the first optical member and the second optical member, and a control unit configured to drive the driving unit based on the displacement.
A light source apparatus according to the present disclosure includes an input optical system including a first optical member configured to irradiate a target material with excitation light, an output optical system including a second optical member configured to extract light generated by irradiating the target material with the excitation light, a target holding unit configured to hold the target material, an acquiring unit configured to acquire a surface position of the target material, a driving unit configured to cause a position of a focusing point of at least one of the first optical member and the second optical member to vary, and a control unit configured to drive the driving unit based on the surface position.
An inspection apparatus according to an embodiment includes pulsed light generation means for generating pulsed light having a wavelength longer than a wavelength of light corresponding to a bandgap of a sample, the pulsed light subjecting the sample to multiphoton excitation, light focusing means including an objective lens, for focusing the pulsed light on the sample through the objective lens, and for passing, through the objective lens, light including photoluminescence light and Raman scattered light produced from the sample by irradiation with the pulsed light, first detection means for detecting the photoluminescence light passed through the objective lens, and second detection means for detecting the Raman scattered light passed through the objective lens.
Resolution is improved in a required direction while maintaining contrast in inspection of an anamorphic mask. A photodetector detects light from a mask with a reduction rate at the time of exposure in a longitudinal direction different from a reduction rate at the time of exposure in a lateral direction. The photodetector includes a rectangular pixel, a ratio of a dimension of the rectangular pixel in the longitudinal direction to a dimension of the rectangular pixel in the lateral direction being equal to an inverse ratio of the reduction rate in the longitudinal direction to the reduction rate in the lateral direction.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
To provide an optical apparatus and a method of preventing contamination of the optical apparatus that can more effectively prevent contamination. An optical apparatus according to an embodiment includes a light source configured to generate irradiation light including EUV light, an optical system chamber in which a target object to be irradiated with the irradiation light is disposed, a drop-in mirror provided in the optical system chamber in order to guide the irradiation light, an introducing unit configured to introduce argon into the optical system chamber, a power supply configured to apply a negative voltage to the drop-in mirror in the optical system chamber, an ammeter configured to measure an ion current flowing to the drop-in mirror, and a control unit configured to control an introduction amount of the argon according to a measurement result of the ammeter.
A light source device (1) according to the present embodiment comprises: a target material (11) that generates EUV light (15) by irradiation with laser light (13); a collector mirror (30) that reflects the EUV light (15); an exhaust case (40) that has an outer cover (41) disposed between the target material (11) and the collector mirror (30), and an exhaust port (42) leading to an exhaust space (43) formed closer to the target material (11) side than the outer cover (41); a cylindrical optical path cover (50) that has a larger opening diameter at the other end (52) than at one end (51); and a filter (60) that is disposed at the other end (52) of or inside the optical path cover (50) and transmits the EUV light (15). Purge gas (44) introduced from an introduction port (53) formed in the optical path cover (50) is jetted from the one end (51) of the optical path cover (50) toward the target material (11), and discharged from the exhaust port (42) through the exhaust space (43).
A defect inspection apparatus according to the present embodiment includes: an irradiation optical system configured to irradiate a sample including a SiC substrate, a buffer layer formed on the SiC substrate, and a drift layer formed on the buffer layer with excitation light; a filter unit configured to control a wavelength band to transmit photoluminescence light generated from the sample; a detection optical system configured to detect the photoluminescence light transmitted through the filter unit; and an image processing unit configured to form an image from the detected photoluminescence light and to discriminate a defect captured in the formed image, and the image processing unit discriminates the defect based on whether a length of the defect is L1=(D1+D2)/tan θ or L2=D2/tan θ.
G01N 21/88 - Investigating the presence of flaws, defects or contamination
G01N 21/359 - Investigating relative effect of material at wavelengths characteristic of specific elements or molecules, e.g. atomic absorption spectrometry using infrared light using near infrared light
Provided are an illumination apparatus and an illumination method capable of uniformly illuminating a visual field region detected by a detector. The present disclosure provides an illumination apparatus including: a drive unit configured to drive an optical member such that illumination light scans, in one direction, a visual field region that is a region extending in the one direction on a sample; and a control unit configured to control the drive unit to cause the illumination light to scan in synchronization with a transfer of a sensor that receives light from the visual field region illuminated by the illumination light.
G02B 27/09 - Beam shaping, e.g. changing the cross-sectioned area, not otherwise provided for
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
A position detection apparatus according to the present disclosure includes a first optical system configured to focus, among light including first light and second light generated along with EUV light from plasma generated by causing a condenser lens to focus laser light on a target, the first light by the condenser lens, a first position detector configured to detect the first light focused by the first optical system, a second optical system configured to focus the second light, a second position detector configured to detect the second light focused by the second optical system, and a position detection processing unit configured to detect change of a position of the plasma from change of a spot of the first light and change of the spot of the second light.
G01B 15/00 - Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons
An optical apparatus according to the present embodiment includes a detector for detecting detection light of illumination light reflected by a sample, an optical system for illuminating the sample with the illumination light and guiding the detection light reflected by the sample to the detector, a displacement measurement unit for measuring a displacement drift indicating the amount of drift in the position of an optical element included in the optical system, a storage unit for storing the correlation between the displacement drift and a focus drift indicating the amount of drift in the distance between the sample and the optical system when the detection light detected by the detector is brought into focus, and a prediction unit for predicting a focus drift from the measured displacement drift by using the correlation.
Provided is a light source device that makes it possible to suppress vibration at the surface of a molten metal and uniformize the intensity distribution of illumination light. This light source device (1) comprises: a vessel (10) that has a rotational axis R, the vessel (10) including a cylindrical side wall (15) that rotates around the rotational axis R; a molten metal (20) that contacts at least a portion of an inner surface (30) of the side wall (15); and a processed part (40) that has protrusions (41) and/or recesses (42) formed at a portion thereof. Upon irradiation with laser light LR, the molten metal (20) generates light that includes EUV light LE.
An optical apparatus and an examination apparatus that are capable of improving thermal stability are provided. An optical apparatus according to the present disclosure includes a housing that includes an optical member and on which light is incident, and a control unit configured to control, in a case in which power of incident light incident on the housing changes, the incident light after the change so that energy calculated by integrating the power after the change over a predetermined time becomes equal to energy calculated by integrating the power before the change over the predetermined time. The case in which the power of the incident light changes may include stop and resumption of incidence of the incident light.
09 - Scientific and electric apparatus and instruments
Goods & Services
Measuring apparatus; inspection apparatus for semi-conductor
materials and elements; semiconductor photomask phase-shift
measuring apparatus; semiconductor photomask transmittance
measuring apparatus; apparatus and instruments for measuring
semiconductor photomask phase shifting amount;
semi-conductor testing machines and instruments; electron
microscopes; detectors; material testing instruments and
machines; testing apparatus not for medical purposes;
precision measuring apparatus.
45.
POSITION DETECTION APPARATUS, POSITION DETECTION METHOD AND NON-TRANSITORY COMPUTER-READABLE MEDIUM
Provided are a position detection apparatus and a position detection method capable of detecting a position of plasma on a target. The position detection apparatus according to the present disclosure includes: a visible light optical system configured to condense visible light generated together with EUV light from plasma generated by condensing laser light onto a target with a condensing lens; a position detection sensor configured to detect the visible light condensed by the visible light optical system; and a position detection processing unit configured to detect a change in a position of the plasma on the target, from a change in a spot of the visible light detected by the position detection sensor.
H05G 2/00 - Apparatus or processes specially adapted for producing X-rays, not involving X-ray tubes, e.g. involving generation of a plasma
G01B 11/14 - Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
A light-source apparatus, an inspection apparatus, and an adjustment method capable of facilitating the adjustment of the temperature of a BBO crystal are provided. A light-source apparatus according to the present disclosure includes a first light source configured to generate visible light, a first external resonator including a plurality of optical mirrors, a BBO crystal disposed in the first external resonator, capable of generating UV light in a wavelength range of 233 nm to 236 nm, the UV light being a second harmonic of the visible light, a one- or two-dimensional semiconductor sensor disposed near a far-field image plane formed through an optical element provided on an optical path of the UV light, and a calculation unit configured to calculate a representative position of a light intensity distribution detected by the semiconductor sensor.
A calculation method according to the present disclosure is a calculation method of calculating a shear amount produced by a predetermined optical element which is arranged on an optical path of an image-capturing optical system. The calculation method includes a step of capturing a plurality of interference contrast images of a quadric surface included in an object surface by the image-capturing optical system while changing a phase difference between two rays of divided light, a step of obtaining a phase distribution from the plurality of interference contrast images by a phase shift method, a step of measuring a fringe interval of interference fringes due to the quadric surface based on the phase distribution, and a step of calculating the shear amount of the optical element based on a constant in a formula expressing the quadric surface and the fringe interval.
A calculation method, an image-capturing method, and an image-capturing apparatus are provided which can easily calculate a shear amount produced by an optical element arranged on an optical path of an interference optical system. A calculation method according to the present disclosure is a calculation method of calculating a shear amount produced by a predetermined optical element which is arranged on an optical path of an image-capturing optical system. The calculation method includes a step of capturing an interference contrast image of a quadric surface included in an object surface by the image-capturing optical system, a step of measuring a fringe interval of interference fringes included in the interference contrast image, and a step of calculating the shear amount based on a constant in a formula expressing the quadric surface and the fringe interval.
An image processing apparatus according to the present disclosure includes: a photographing control unit configured to take a photographed image of a sample including a plurality of regions having different reflectances a plurality of times while a photographing condition that affects luminance of the photographed image is changed; a generation unit configured to generate a photographing condition map indicating a photographing condition under which luminance of a pixel in the photographed image exceeds a threshold; a determination unit configured to determine a photographing condition that is suitable for photographing of each of the regions based on the photographing condition map; and a composition unit configured to generate a composite image in which region images of the respective regions are combined by using the photographed image corresponding to the determined photographing condition.
09 - Scientific and electric apparatus and instruments
Goods & Services
Optical apparatus and instruments; measuring apparatus;
inspection apparatus for semi-conductor materials and
elements; semiconductor photomask inspection apparatus;
imaging apparatus for inspection of semiconductor
photomasks; semiconductor photomask blanks inspection
apparatus; imaging apparatus for inspection of semiconductor
photomask blanks; semiconductor wafer inspection apparatus;
imaging apparatus for inspection of semiconductor wafers;
semi-conductor testing machines and instruments; detectors;
material testing instruments and machines; testing apparatus
not for medical purposes; precision measuring apparatus.
09 - Scientific and electric apparatus and instruments
Goods & Services
Measuring apparatus; inspection apparatus for semi-conductor
materials and elements; inspecting apparatus and instruments
of photomask blanks for manufacturing flat panel displays;
semi-conductor testing machines and instruments; detectors;
material testing instruments and machines; testing apparatus
not for medical purposes; precision measuring apparatus.
09 - Scientific and electric apparatus and instruments
Goods & Services
Measuring apparatus; inspection apparatus for semi-conductor
materials and elements; semiconductor wafer inspection
apparatus; imaging apparatus for inspection of semiconductor
wafer; semi-conductor testing machines and instruments;
electron microscopes; detectors; material testing
instruments and machines; testing apparatus not for medical
purposes; precision measuring apparatus.
09 - Scientific and electric apparatus and instruments
Goods & Services
Optical apparatus and instruments; measuring apparatus;
inspection apparatus for semi-conductor materials and
elements; confocal microscopes; systems for in-situ
visualizing of electro-chemical reactions; semi-conductor
testing machines and instruments; electron microscopes;
detectors; material testing instruments and machines;
testing apparatus not for medical purposes; precision
measuring apparatus; data sets, recorded or downloadable;
computer software, recorded; computer software applications,
downloadable; computer hardware; computer programs,
downloadable.
09 - Scientific and electric apparatus and instruments
Goods & Services
Optical apparatus and instruments; measuring apparatus;
inspection apparatus for semi-conductor materials and
elements; semiconductor wafer inspection apparatus;
semiconductor wafer imaging apparatus; semi-conductor
testing machines and instruments; electron microscopes;
detectors; material testing instruments and machines;
testing apparatus not for medical purposes; precision
measuring apparatus; data sets, recorded or downloadable;
computer software, recorded; computer software applications,
downloadable; computer hardware; computer programs,
downloadable.
09 - Scientific and electric apparatus and instruments
Goods & Services
Optical apparatus and instruments; measuring apparatus;
inspection apparatus for semi-conductor materials and
elements; confocal microscopes; laser microscopes;
semi-conductor testing machines and instruments; electron
microscopes; detectors; material testing instruments and
machines; testing apparatus not for medical purposes;
precision measuring apparatus; data sets, recorded or
downloadable; computer software, recorded; computer software
applications, downloadable; computer hardware; computer
programs, downloadable.
A decrease of an output of a wavelength converted light converted by a nonlinear optical crystal is suppressed. A light source apparatus according to the present disclosure includes a fundamental wave light source configured to generate a fundamental wave which is a continuous oscillation laser beam, an external cavity including a plurality of optical mirrors, a nonlinear optical crystal installed inside the external cavity and configured to generate a light with a wavelength shorter than that of the fundamental wave. The light source apparatus includes at least one phase modulator disposed between the fundamental wave light source and the external cavity and configured to modulate the fundamental wave by a modulation frequency of an integer multiple of a resonance frequency interval of the external cavity.
G02F 1/355 - Non-linear optics characterised by the materials used
H01S 3/081 - Construction or shape of optical resonators or components thereof comprising three or more reflectors
H01S 3/10 - Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
H01S 3/108 - Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating by controlling devices placed within the cavity using non-linear optical devices, e.g. exhibiting Brillouin or Raman scattering
H01S 3/109 - Frequency multiplication, e.g. harmonic generation
09 - Scientific and electric apparatus and instruments
Goods & Services
Defect repairing machines for photomasks for semiconductors; defect repairing machines for reticles for semiconductors; defect repairing machines for wafers for semiconductors; defect repairing machines for photomasks for flat panel displays; defect repairing machines for photomask blanks for flat panel displays Semiconductor photomask optical inspection apparatus; analyzing apparatus, namely, optical inspection apparatus for defect of photomasks for semiconductors; semiconductor photomask pattern optical inspection apparatus; semiconductor photomask pattern measuring apparatus, namely, optical measurement system comprised of optical inspection apparatus for detection, measurement and cleaning of foreign matter and defects on semiconductor photomask pattern; semiconductor photomask imaging apparatus, namely, optical imaging apparatus for inspection of semiconductor photomask; semiconductor photomask phase-shift measuring apparatus, namely, optical measurement system comprised of optical inspection apparatus for measurement of semiconductor photomask phase-shift; semiconductor photomask transmittance measuring apparatus, namely, optical measurement system comprised of optical inspection apparatus for measurement of semiconductor photomask transmittance; apparatus and instruments for measuring semiconductor photomask phase shifting amount, namely, optical measurement system comprised of optical inspection apparatus for measurement of semiconductor photomask phase shifting amount; semiconductor reticle optical inspection apparatus; analyzing apparatus, namely, optical inspection apparatus for defect of semiconductor reticles; semiconductor reticle pattern optical inspection apparatus; semiconductor reticle pattern measuring apparatus, namely, optical measurement system comprised of optical inspection apparatus for detection, measurement and cleaning of foreign matter and defects on semiconductor reticle pattern; semiconductor reticle imaging apparatus, namely, optical imaging apparatus for inspection of semiconductor reticle; semiconductor wafer optical inspection apparatus; semiconductor wafer measuring apparatus, namely, optical measurement system comprised of optical inspection apparatus for detection, measurement and cleaning of foreign matter and defects on semiconductor wafer; semiconductor wafer imaging apparatus, namely, optical imaging apparatus for inspection of semiconductor wafer; semiconductor wafer edge optical inspection apparatus; analyzing apparatus, namely, optical inspection apparatus for defect of wafers for semiconductors; semiconductor photomask blanks optical inspection apparatus; semiconductor photomask blanks imaging apparatus, namely, optical imaging apparatus for inspection of semiconductor photomask blanks; optical inspection apparatus for defect of flat panel display photomasks; optical inspection apparatus for defect of flat panel display photomask pattern; flat panel display photomask pattern measuring apparatus, namely, optical measurement system comprised of optical inspection apparatus for detection, measurement and cleaning of foreign matter and defects on flat panel display photomask pattern; optical inspection apparatus for defect of flat panel display photomask blanks; pellicle optical inspection apparatus for photomasks for flat panel displays; pellicle mounting apparatus, namely, optical inspection apparatus with the capability of mounting pellicles on photomasks for flat panel displays; confocal microscopes; laser microscopes; computer peripheral devices; optical inspection systems for in-suit visualizing of electro-chemical reactions comprising optical inspection apparatus for semi-conductor materials and elements; semi-conductor testing machines and instruments; electron microscopes; semiconductor defect detectors; testing apparatus not for medical purposes, namely, semiconductor testing apparatus; precision crystallographic measuring apparatus; data sets, downloadable, in the field of semiconductors; computer software, recorded, for operating semiconductor photomask, reticle or pellicle optical inspection apparatus; computer software applications, downloadable, for operating semiconductor photomask, reticle or pellicle optical inspection apparatus; computer hardware; computer programs, downloadable, for operating semiconductor photomask, reticle or pellicle optical inspection apparatus
09 - Scientific and electric apparatus and instruments
Goods & Services
Defect repairing machines for photomasks for semiconductors; defect repairing machines for reticles for semiconductors; defect repairing machines for wafers for semiconductors; defect repairing machines for photomasks for flat panel displays; defect repairing machines for photomask blanks for flat panel displays Semiconductor photomask optical inspection apparatus; analyzing apparatus, namely, optical inspection apparatus for defect of photomasks for semiconductors; semiconductor photomask pattern optical inspection apparatus; semiconductor photomask pattern measuring apparatus, namely, optical measurement system comprised of optical inspection apparatus for detection, measurement and cleaning of foreign matter and defects on semiconductor photomask pattern; semiconductor photomask imaging apparatus, namely, optical imaging apparatus for inspection of semiconductor photomask; semiconductor photomask phase-shift measuring apparatus, namely, optical measurement system comprised of optical inspection apparatus for measurement of semiconductor photomask phase-shift; semiconductor photomask transmittance measuring apparatus, namely, optical measurement system comprised of optical inspection apparatus for measurement of semiconductor photomask transmittance; apparatus and instruments for measuring semiconductor photomask phase shifting amount, namely, optical measurement system comprised of optical inspection apparatus for measurement of semiconductor photomask phase shifting amount; semiconductor reticle optical inspection apparatus; analyzing apparatus, namely, optical inspection apparatus for defect of semiconductor reticles; semiconductor reticle pattern optical inspection apparatus; semiconductor reticle pattern measuring apparatus, namely, optical measurement system comprised of optical inspection apparatus for detection, measurement and cleaning of foreign matter and defects on semiconductor reticle pattern; semiconductor reticle imaging apparatus, namely, optical imaging apparatus for inspection of semiconductor reticle; semiconductor wafer optical inspection apparatus; semiconductor wafer measuring apparatus, namely, optical measurement system comprised of optical inspection apparatus for detection, measurement and cleaning of foreign matter and defects on semiconductor wafer; semiconductor wafer imaging apparatus, namely, optical imaging apparatus for inspection of semiconductor wafer; semiconductor wafer edge optical inspection apparatus; analyzing apparatus, namely, optical inspection apparatus for defect of wafers for semiconductors; semiconductor photomask blanks optical inspection apparatus; semiconductor photomask blanks imaging apparatus, namely, optical imaging apparatus for inspection of semiconductor photomask blanks; optical inspection apparatus for defect of flat panel display photomasks; optical inspection apparatus for defect of flat panel display photomask pattern; flat panel display photomask pattern measuring apparatus, namely, optical measurement system comprised of optical inspection apparatus for detection, measurement and cleaning of foreign matter and defects on flat panel display photomask pattern; optical inspection apparatus for defect of flat panel display photomask blanks; pellicle optical inspection apparatus for photomasks for flat panel displays; pellicle mounting apparatus, namely, optical inspection apparatus with the capability of mounting pellicles on photomasks for flat panel displays; confocal microscopes; laser microscopes; computer peripheral devices; optical inspection systems for in-suit visualizing of electro-chemical reactions comprising optical inspection apparatus for semi-conductor materials and elements; semi-conductor testing machines and instruments; electron microscopes; semiconductor defect detectors; testing apparatus not for medical purposes, namely, semiconductor testing apparatus; precision crystallographic measuring apparatus; data sets, downloadable, in the field of semiconductors; computer software, recorded, for operating semiconductor photomask, reticle or pellicle optical inspection apparatus; computer software applications, downloadable, for operating semiconductor photomask, reticle or pellicle optical inspection apparatus; computer hardware; computer programs, downloadable, for operating semiconductor photomask, reticle or pellicle optical inspection apparatus
09 - Scientific and electric apparatus and instruments
Goods & Services
Semiconductor photomask inspection apparatus; imaging
apparatus for inspection of semiconductor photomasks;
semiconductor reticle inspection apparatus; imaging
apparatus for inspection of semiconductor reticles;
semiconductor pellicle inspection apparatus; imaging
apparatus for inspection of semiconductor pellicles;
measuring apparatus; inspection apparatus for semi-conductor
materials and elements; detectors; material testing
instruments and machines; testing apparatus not for medical
purposes; precision measuring apparatus; data sets, recorded
or downloadable; computer software, recorded; computer
software applications, downloadable; computer programs,
downloadable.
09 - Scientific and electric apparatus and instruments
Goods & Services
Optical inspection apparatus for semi-conductor materials and elements; confocal microscopes; semi-conductor testing machines and instruments; electron microscopes; differential interferometry detectors; testing apparatus not for medical purposes, namely, semiconductor testing apparatus; precision differential Interferometric measuring apparatus; data sets, downloadable, in the field of semiconductors; computer software, recorded, for controlling confocal microscopes; computer software applications, downloadable, for operating confocal microscopes; computer hardware; computer programs, downloadable, for recording images from confocal microscopes
09 - Scientific and electric apparatus and instruments
Goods & Services
Semiconductor photomask blanks inspection apparatus; imaging
apparatus for inspection of semiconductor photomask blanks;
measuring apparatus; inspection apparatus for semi-conductor
materials and elements; detectors; material testing
instruments and machines; testing apparatus not for medical
purposes; precision measuring apparatus.
09 - Scientific and electric apparatus and instruments
Goods & Services
Flat panel display photomask inspection apparatus; imaging
apparatus for inspection of flat panel display photomasks;
pellicle inspection apparatus for photomasks for flat panel
displays; imaging apparatus for inspection of pellicle for
flat panel display photomasks; inspection apparatus for
semi-conductor materials and elements.
09 - Scientific and electric apparatus and instruments
Goods & Services
Defect repair machines for photomasks for semiconductors; defect repair machines for reticles for semiconductors; foreign matter removal machines for photomasks for semiconductors; foreign matter removal machines for reticles for semiconductors Semiconductor photomask optical inspection apparatus; semiconductor photomask pattern measuring apparatus, namely, optical measurement system comprised of optical inspection apparatus for detection, measurement and cleaning of foreign matter and defects on semiconductor photomask pattern; semiconductor reticle optical inspection apparatus; semiconductor reticle pattern measuring apparatus, namely, optical measurement system comprised of optical inspection apparatus for detection, measurement and cleaning of foreign matter and defects on semiconductor reticle pattern
09 - Scientific and electric apparatus and instruments
Goods & Services
Semiconductor photomask optical inspection apparatus; imaging apparatus, namely, optical imaging apparatus for inspection of semiconductor photomasks; semiconductor reticle optical inspection apparatus; imaging apparatus, namely, optical imaging apparatus for inspection of semiconductor reticles; semiconductor pellicle optical inspection apparatus; imaging apparatus, namely, optical imaging apparatus for inspection of semiconductor pellicles; optical inspection apparatus for semi-conductor materials and elements; semiconductor defect detectors; testing apparatus not for medical purposes, namely, semiconductor testing apparatus; precision measuring apparatus for defects of photomasks, reticles or pellicles; data sets, downloadable, in the field of semiconductors; computer software, recorded, for operating semiconductor photomasks, reticles or pellicles inspection apparatus; computer software applications, downloadable, for operating semiconductor photomasks, reticles or pellicles inspection apparatus; computer programs, downloadable, for operating semiconductor photomasks, reticles or pellicles inspection apparatus
80.
EUV mask inspection device, EUV mask inspection method, non-transitory computer-readable medium storing EUV mask inspection program, and EUV mask inspection system including a gray image based on design data of a pattern
An inspection device according to one aspect of the present disclosure includes an image capturing unit configured to capture an image of an EUV mask provided with a pattern, a storage unit configured to store a database intermediate file including a gray image obtained by pixelating a binarized image rasterized from design data of the pattern, and a processing unit configured to inspect the EUV mask on the basis of a captured image obtained by the image capturing unit capturing an image of the EUV mask. The processing unit includes a conversion model generated by a learning machine configured to perform learning by deep learning, a reference image generation unit configured to generate a reference image from the gray image by using the conversion model, and a comparison unit configured to compare the reference image with the captured image.
Resolution is improved in a required direction while maintaining contrast in inspection of an anamorphic mask. A method for inspecting a mask with a reduction rate at the time of exposure in a longitudinal direction different from a reduction rate at the time of exposure in a lateral direction according to the present disclosure includes capturing an image of the mask using a photodetector including a rectangular pixel, a ratio of a dimension of the rectangular pixel in the longitudinal direction to a dimension of the rectangular pixel in the lateral direction being equal to an inverse ratio of the reduction rate in the longitudinal direction to the reduction rate in the lateral direction.
Provided are an optical device capable of effectively preventing contamination and a method for preventing contamination of the same. An optical device according to an embodiment includes a light source that generates light containing EUV (Extreme UltraViolet) light or VUV (Vacuum UltraViolet) light, a chamber in which an object to be irradiated with the light is placed, an optical element placed inside the chamber to guide the light, an introduction unit that introduces hydrogen or helium into the chamber, a power supply that applies a negative voltage to the optical element in the chamber, an ammeter that measures an ion current flowing through the optical element, and a control unit that adjusts the amount of the hydrogen or the helium introduced according to a measurement result of the ammeter.
An image pickup apparatus includes a stage configured to support a sample at a plurality of support points, a bending data acquisition unit configured to acquire bending data corresponding to a bending of the sample supported on the stage, a height information detection unit configured to detect a height of the sample supported on the stage, a difference value calculation unit configured to calculate a difference value between a height indicated by height information and a height indicated by the bending data at each of a plurality of points on the sample, a correction data calculation unit configured to calculate correction data based on the difference value, and an estimation unit configured to calculate estimation data for estimating the height of the sample by correcting the bending data using the correction data.
A confocal microscope includes a data acquisition unit configured to acquire a rough-shape data indicating a rough shape of a sample, an illumination light source configured to generate illumination light for illuminating the sample, an objective lens configured to concentrate the illumination light on the sample, an optical scanner configured to scan an illuminated place on the sample in a field of view of the objective lens, a stage configured to scan the illuminated place along the rough shape of the sample by changing a position of the objective lens relative to the sample, and an optical detector configured to detect reflected light through a confocal optical system, the reflected light being light that has been reflected on the sample and has passed through the objective lens.
A mask inspection apparatus according to the present disclosure includes: a field stop unit capable of switching between a field stop for an optical mask configured to emit an incident illumination light while maintaining the polarization state thereof and a field stop for an EUV mask configured to change the polarization state of a part of the incident illumination light and to cause an illumination light including an S-polarized light and a P-polarized light; a beam splitter unit capable of switching between a PBS for an optical mask and a non-polarized BS; an objective lens configured to collect an illumination light reflected in the beam splitter unit in a mask to be inspected and collect a reflected light obtained by reflecting an illumination light in the mask to be inspected; and a λ/4 plate that can be provided in an optical path of an illumination light and a reflected light.
A wavelength conversion apparatus and a wavelength conversion method that can stably output wavelength converted light for a long time are provided. A wavelength conversion apparatus 100 according to an aspect of the present disclosure includes a casing 10, a wavelength conversion element 25 disposed inside the casing 10 and configured to convert a wavelength of incident light and output light with the converted wavelength, a first port 11 that introduces a first gas containing 99.9% or more of a nitrogen gas inside the casing 10, and a second port 12 that introduces a second gas containing 1% or more of an oxygen gas.
A measurement apparatus and a measurement method capable of speedily and accurately measuring an edge shape are provided. A measurement apparatus according to an aspect of the present disclosure includes an objective lens positioned so that its focal plane cuts across an edge part of a substrate, a detector including a plurality of pixels and configured to detect a reflected light from the edge part of the substrate through a confocal optical system, an optical head in which the objective lens and the detector are disposed, a moving mechanism configured to change a relative position of the optical head with respect to the substrate so that an inclination of the focal plane with respect to the substrate is changed, and a processing unit configured to measure a shape of the edge part.
G01B 11/02 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness
G01B 11/24 - Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
G01B 11/06 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness for measuring thickness
G01N 21/84 - Systems specially adapted for particular applications
H01L 21/64 - Manufacture or treatment of solid-state devices other than semiconductor devices, or of parts thereof, not specially adapted for a single type of device provided for in subclasses , , or
G01B 11/30 - Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
88.
INSPECTING DEVICE, INSPECTING METHOD, LEARNING METHOD, AND PROGRAM
An inspecting device (1) according to one embodiment of the present invention is provided with an illuminating light source (11) which generates illuminating light for illuminating a specimen (21), a detector (16) for capturing an image of the specimen (21) illuminated by the illuminating light from the illuminating light source (11), and a processing device (30) for inspecting the specimen (21) on the basis of the captured image. The processing device (30) performs the inspection by comparing the captured image of the specimen (21) with a reference image. The processing device (30) is provided with: a learned model in which a captured image for learning, obtained by capturing an image of a learning sample, is associated with a database image corresponding to the captured image for learning, and which has learned by deep learning; a reference image generating unit (35) which generates the reference image from the database image of an inspection target, on the basis of a learning result obtained by the learned model; and a comparing unit (33) which compares the reference image with the captured image.
An inspection device according to the present disclosure includes a detector for inspection that includes a plurality of pixels arranged on a light receiving surface and acquires image data by transferring charge produced by light received by the plurality of pixels in a transfer direction at a specified transfer timing, a light source that emits illumination light including pulsed light, a pulse enable circuit that controls emission timing for the light source to emit the illumination light based on the transfer timing, an illumination optical system that illuminates an object to be inspected with the illumination light, a condensing optical system that condenses, on the detector for inspection, light from the object to be inspected illuminated with the illumination light, and a processing unit that inspects the object to be inspected by using the image data of the object to be inspected.
A detection method, an inspection method, a detection apparatus, and an inspection apparatus capable of preventing an error in a luminance unevenness correction and thereby accurately inspecting an object to be inspected are provided. A detection method according to the present disclosure includes illuminating an object to be inspected by using illumination light including pulsed light, acquiring image data of the object to be inspected by concentrating light from the object to be inspected illuminated by the illumination light and detecting the concentrated light by an inspection detector, acquiring image data of a luminance distribution of the illumination light, the luminance distribution being detected by illuminating a correction detector by using part of the illumination light, and detecting inspection image data by correcting the image data of the object to be inspected based on the image data of the luminance distribution.
A correction method according to an embodiment includes illuminating an object to be inspected by using critical illumination by illumination light L11 generated by a light source 11, concentrating light from the object to be inspected illuminated by the illumination light L11 and acquiring image data of the object to be inspected by detecting the concentrated light by a first detector 23, concentrating part of the illumination light L11, and acquiring image data of a brightness distribution of the illumination light L11 by detecting the concentrated illumination light L11 by a second detector 33, and correcting the image data of the object to be inspected based on the image data of the brightness distribution.
An optical apparatus and its vibration removing method capable of stabilizing a place where light is applied are provided. An optical apparatus according to an aspect of the present disclosure includes a light source chamber, an EUV light source, an optical system chamber, an optical system configured to guide light entering the optical system chamber to an object through a bellows, an optical sensor configured to detect EUV light L2 emitted from the EUV light source, a position sensor disposed to detect a relative position of the optical system chamber with respect to the light source chamber, and a second vibration removal unit configured to remove vibrations from the light source chamber based on detection results of the optical sensor and the position sensor.
A measurement apparatus 1 according to the present invention includes a table 10 that has an axis of rotation 14 and supports a disc-shaped object 40, a first driving unit that rotates the table 10 around the axis of rotation 14, a light source 50 that produces illumination light with which an end portion 45 of the disc-shaped object 40 is illuminated, an objective lens 60 that collects the illumination light reflected from the end portion 45, a second driving unit that moves the objective lens 60 along an optical axis 64, an imaging unit 70 that captures an image of the end portion 45 by detecting the reflected light collected by the objective lens 60, and an autofocus optical system 80 that determines a position of the objective lens 60 where the image of the end portion 45 is brought into focus in the imaging unit 70.
An inspection apparatus according to an aspect of the present invention includes an EUV light source 11, an illumination optical system 10 provided to apply the EUV light to an EUV mask 60, a concave mirror and a convex mirror 22 configured to reflect the EUV light reflected on the EUV mask 60, a camera 32 configured to detect EUV light reflected on the convex mirror 22 and thereby take an image of the EUV mask 60, an AF light source 16 configured to generate AF light having a wavelength of 450 nm to 650 nm, first and second detectors 27 and 30 configured to detect the AF light reflected on the EUV mask 60 through the concave mirror with the hole 21 and the convex mirror 22, and an processing device 31 configured to adjust a focus point of the EUV light on the EUV mask 60.
Provided are a mask inspection apparatus and a mask inspection method that can prevent a reduction in a reflectance of a drop-in mirror, which is caused by carbon contaminants. A mask inspection apparatus according to the present invention includes a drop-in mirror including multi-layer film and a reflective surface. The drop-in mirror is configured to reflect illumination light incident on the reflective surface and illuminate the mask. An area of the reflective surface is configured to be greater than an area of an illuminated spot irradiated with the illumination light on the reflective surface. The drop-in mirror is configured to be movable. A position of the illuminated spot on the reflective surface is configured to be moved when the drop-in mirror is moved.
G02B 7/182 - Mountings, adjusting means, or light-tight connections, for optical elements for prismsMountings, adjusting means, or light-tight connections, for optical elements for mirrors for mirrors
Provided are a light source apparatus and an inspection apparatus that can stably output a wavelength converted light beam. A light source apparatus includes a laser light source that generates a first fundamental light beam, at least one nonlinear optical crystal that generates a wavelength converted light beam using the fundamental light beam or a harmonic laser beam of the fundamental light beam as an incident light beam, a detector that detects the wavelength converted light beam, an acousto-optic modulator that is disposed in an optical path of the incident light beam in such a way that a zero-order light beam enters the nonlinear optical crystal, and a controller that controls an output intensity of the wavelength converted light beam according to a detection signal from the detector.
G02F 1/11 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on acousto-optical elements, e.g. using variable diffraction by sound or like mechanical waves
G01N 21/17 - Systems in which incident light is modified in accordance with the properties of the material investigated
G01N 21/63 - Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
In an inspection apparatus according to one aspect of the present invention, a processing apparatus includes: a profile data generation unit that divides each of a plurality of images according to a circumferential position to generate profile data in which a radial direction position and luminance data are associated with each other; a deconvolution operation unit that carries out a deconvolution operation using a one-dimensional point spread function to generate deconvolution operation data based on the profile data; an estimation unit that estimates estimation data of the deconvolution operation data in a desired focus position in the optical axis direction using the deconvolution operation data; and a synthesis unit that synthesizes the estimation data estimated by the estimation unit for each radial direction position to generate the image in the desired focus position.
09 - Scientific and electric apparatus and instruments
Goods & Services
Confocal scanning microscopes; optical inspection apparatus for industrial use for inspection of semiconductor materials, namely, photomasks and reticles silicon wafers and mask blanks in the nature of blank optical plate; phase-shift mask measurement system for photomask comprising optical measurement unit in the nature of optical measuring sensors, mask stages in the nature of optical stages for reflection and transmission measurements of flat substrates, electronic controller and computer; wafer inspection system comprised of optical inspection apparatus, wafer stages in the nature of stages for semiconductor wafers, electronic controller, and computer; wafer measurement system comprised of optical measurement apparatus, wafer stages in the nature of stages for semiconductor wafers, electronic controller and computer; substrate inspection system comprised of optical inspection apparatus, substrate stage in the nature of optical stages for reflection measurement of flat substrates, electronic controller, and computer; PV cell measurement system comprised of solar simulator, measurement unit in the nature of electronic sensors for measuring solar radiation, cell stages in the nature of stages for measurement of flat substrates, electronic controller and computer; coating thickness scanning system for lithium ion batteries comprised of coating thickness measuring gauge ; pellicle inspection apparatus in the nature of an optical inspection apparatus that inspects a pellicle film of a mask provided with a pellicle and used in EUV lithography
Provided is a phase shift amount measuring apparatus and method capable of measuring a phase shift amount and a transmittance of a phase shift mask in one measurement step by using a miniaturized monitor pattern. The phase shift amount and transmittance of the monitor pattern are simultaneously measured using a shearing interferometer. The phase shift amount is obtained from a phase difference of interference light between light passing through the monitor pattern and light passing through a non-pattern area. The transmittance of the monitor pattern is obtained using an amplitude of interference light between light passing through the monitor pattern and light passing through the non-pattern area and an amplitude of interference light between light beams passing through the non-pattern area. The use of common interference images in measuring the phase shift amount and transmittance enables measurement of both the phase shift amount and the transmittance in one measurement operation.
H04N 9/31 - Projection devices for colour picture display
G01J 9/02 - Measuring optical phase differenceDetermining degree of coherenceMeasuring optical wavelength by interferometric methods
G03F 1/00 - Originals for photomechanical production of textured or patterned surfaces, e.g. masks, photo-masks or reticlesMask blanks or pellicles thereforContainers specially adapted thereforPreparation thereof
G01M 11/00 - Testing of optical apparatusTesting structures by optical methods not otherwise provided for
Provided with a pellicle inspection apparatus that inspects a pellicle film of a mask provided with a pellicle and used in EUV lithography. The pellicle inspection apparatus includes: an illumination optical system that projects a converging illuminating beam toward the pellicle film;
a light collection optical system including an object lens having an optical axis substantially orthogonal to the pellicle film and that collects scattering light outgoing from a foreign substance present on the pellicle film; and a detection system that detects the scattering light collected by the light collection optical system, wherein an incident angle θ2 of the illuminating beam with respect to the pellicle film satisfies Expression θ2−θ0>θ1+23°, where θ0 is a collecting angle (half angle) of the illuminating beam, and θ1 is a maximum light-receiving angle (half angle) of the object lens.
