An electromagnetic waveguide component includes multiple planar layers and one or more layers are shaped to accommodate incoming electromagnetic waves. Each layer includes two more alignment features, and corresponding pins, the two or more alignment features in each of the layers providing precise stacking registration among the plurality of layers, and the planar layers, when assembled into a stack, are configured to provide a desired radio frequency (RF) response.
Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.
A magnet array holder configured to retain magnet pieces and/or non-magnet pieces to form a magnet array, the magnet array configured to manipulate one or more electron beams in a vacuum electronic device when assembled, the magnet array holder comprising a set of slots configured to receive magnet and/or non-magnet pieces; a set of pockets to receive magnet and/or non-magnet pieces; and one or more attachment interfaces configured to couple the magnet array holder to a vacuum electronic device.
H01F 41/00 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
4.
MULTI-LAYER VACUUM ELECTRON DEVICE AND METHOD OF MANUFACTURE
Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.
H01J 29/70 - Arrangements for deflecting ray or beam
5.
RADIO FREQUENCY (RF) POWER MODULE HAVING A HIGH FREQUENCY SWITCHING ELECTRONIC POWER CONDITIONER COMBINED WITH A MILLIMETER WAVE TO TERAHERTZ VACUUM ELECTRONIC DEVICE
A power module comprises a high frequency switching electronic power conditioner including stacked rectifier/filters, the stacked rectifier/filters generating stacked DC output voltages; and a vacuum electronic device coupled to the high frequency switching electronic power conditioner, the vacuum electronic device including components, each component receiving a respective DC output voltage of the stacked DC output voltages.
A cathode heater assembly for use in a vacuum electronic device comprises a refractive cup having a bottom portion and side walls forming a container; a cathode secured in the container of the refractive cup; and a heater wire coupled to the refractive cup. The cathode heater assembly may be manufactured by providing a refractive cup having a bottom portion and side walls forming a container; inserting a cathode pellet in the container of the refractive cup; impregnating the cathode pellet with electron emissive materials while the cathode pellet is in the container of the refractive cup; and attaching a heater wire to the refractive cup.
H01J 9/04 - Manufacture of electrodes or electrode systems of thermionic cathodes
7.
GEOMETRIC FEATURES FOR LAYER AND FEATURE ALIGNMENT AND INSPECTION FOR USE IN LAYERED ADDITIVE MANUFACTURING OF PASSIVE AND ACTIVE RADIO FREQUENCY (RF) ELECTRONICS
A method of manufacturing a radio frequency (RF) or electron beam structure, comprises forming each layer of multiple layers to be assembled and bonded together with positional alignment, the forming each layer including forming a first via segment of a first particular shape and dimension in the layer at a first location in the layer, such that when the first via segments of the multiple layers are assembled with positional alignment the multiple first via segments align to form a first via; and inserting a first analogous pin into the first via, the first analogous pin being formed based on the first particular shape and dimension of each of the first via segments, such that inserting the first analogous pin into the first via assists in causing the multiple layers to be assembled with positional alignment.
RADIO FREQUENCY (RF) POWER MODULE HAVING A HIGH FREQUENCY SWITCHING ELECTRONIC POWER CONDITIONER COMBINED WITH A MILLIMETER WAVE TO TERAHERTZ VACUUM ELECTRONIC DEVICE
A power module comprises a high frequency switching electronic power conditioner including stacked rectifier/filters, the stacked rectifier/filters generating stacked DC output voltages; and a vacuum electronic device coupled to the high frequency switching electronic power conditioner, the vacuum electronic device including components, each component receiving a respective DC output voltage of the stacked DC output voltages.
H01J 23/54 - Filtering devices preventing unwanted frequencies or modes to be coupled to, or out of, the interaction circuitPrevention of high frequency leakage in the environment
H01J 25/02 - Tubes with electron stream modulated in velocity or density in a modulator zone and thereafter giving-up energy in an inducing zone, the zones being associated with one or more resonators
H01J 25/04 - Tubes having one or more resonators, without reflection of the electron stream, and in which the modulation produced in the modulator zone is mainly density modulation, e.g. Haeff tube
H01J 25/10 - Klystrons, i.e. tubes having two or more resonators, without reflection of the electron stream, and in which the stream is modulated mainly by velocity in the zone of the input resonator
9.
GEOMETRIC TRANSFORMATIONS FOR RADIO FREQUENCY (RF) PERFORMANCE IN LAYERED ADDITIVE MANUFACTURING OF PASSIVE AND ACTIVE RF ELECTRONICS
A circuit device fabricated in device layers, comprises a filter-type circuit fabricated in the device layers; a transmission line fabricated in the device layers and connected to the filter-type circuit; and a corrective mismatch disposed within the transmission line, fabricated in at least one of the device layers, and designed with a corrective impedance to improve matching performance therebetween. A waveguide device fabricated in device layers, comprises a first waveguide fabricated in the device layers and having a first dimension aligned with a first layer; a second waveguide fabricated in the device layers and having a second dimension aligned with a second layer; and a waveguide transformer fabricated in the device layers and having a transformer dimension aligned with a third layer.
A radio-frequency (RF) window comprises a first flange assembly including a first flange having a first flange thickness between a first surface and a second surface, and a first waveguide channel; and a first window element having a first window thickness and disposed in the first waveguide channel at a first location; and a second flange assembly stacked against the first flange assembly, the second flange assembly including a second flange having a second flange thickness between a third surface and a fourth surface, and a second waveguide channel; and a second window element having a second window thickness and disposed in the second waveguide channel at a second location, such that when the first flange assembly is stacked against the second flange assembly the second window element has a predetermined distance to the first window element, the predetermined distance selected based on a desired frequency band of operations.
A circuit device fabricated in device layers, comprises a filter-type circuit fabricated in the device layers; a transmission line fabricated in the device layers and connected to the filter-type circuit; and a corrective mismatch disposed within the transmission line, fabricated in at least one of the device layers, and designed with a corrective impedance to improve matching performance therebetween. A waveguide device fabricated in device layers, comprises a first waveguide fabricated in the device layers and having a first dimension aligned with a first layer; a second waveguide fabricated in the device layers and having a second dimension aligned with a second layer; and a waveguide transformer fabricated in the device layers and having a transformer dimension aligned with a third layer.
H01P 1/20 - Frequency-selective devices, e.g. filters
H01P 3/00 - WaveguidesTransmission lines of the waveguide type
12.
GEOMETRIC FEATURES FOR LAYER AND FEATURE ALIGNMENT AND INSPECTION FOR USE IN LAYERED ADDITIVE MANUFACTURING OF PASSIVE AND ACTIVE RADIO FREQUENCY (RF) ELECTRONICS
A method of manufacturing a radio frequency (RF) or electron beam structure, comprises forming each layer of multiple layers to be assembled and bonded together with positional alignment, the forming each layer including forming a first via segment of a first particular shape and dimension in the layer at a first location in the layer, such that when the first via segments of the multiple layers are assembled with positional alignment the multiple first via segments align to form a first via; and inserting a first analogous pin into the first via, the first analogous pin being formed based on the first particular shape and dimension of each of the first via segments, such that inserting the first analogous pin into the first via assists in causing the multiple layers to be assembled with positional alignment.
H01J 9/00 - Apparatus or processes specially adapted for the manufacture of electric discharge tubes, discharge lamps, or parts thereofRecovery of material from discharge tubes or lamps
B33Y 80/00 - Products made by additive manufacturing
H01J 25/34 - Travelling-wave tubesTubes in which a travelling wave is simulated at spaced gaps
13.
WIDE-BANDWIDTH RADIO-FREQUENCY (RF) WINDOWS AND METHOD
A radio-frequency (RF) window comprises a first flange assembly including a first flange having a first flange thickness between a first surface and a second surface, and a first waveguide channel; and a first window element having a first window thickness and disposed in the first waveguide channel at a first location; and a second flange assembly stacked against the first flange assembly, the second flange assembly including a second flange having a second flange thickness between a third surface and a fourth surface, and a second waveguide channel; and a second window element having a second window thickness and disposed in the second waveguide channel at a second location, such that when the first flange assembly is stacked against the second flange assembly the second window element has a predetermined distance to the first window element, the predetermined distance selected based on a desired frequency band of operations.
A depressed collector, comprises an insulator body; a plurality of serial electrodes, each serial electrode having a serial electrode receptor portion inside the insulator body and having a serial electrode thermal fin portion passing through and extending outside the insulator body; and a terminal electrode having a terminal electrode receptor portion inside the insulator body and having a terminal electrode thermal fin portion passing through and extending outside the insulator body.
H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
15.
Radio frequency (RF) power module having a high frequency switching electronic power conditioner combined with a millimeter wave to terahertz vacuum electronic device
A power module comprises a high frequency switching electronic power conditioner including stacked rectifier/filters, the stacked rectifier/filters generating stacked DC output voltages; and a vacuum electronic device coupled to the high frequency switching electronic power conditioner, the vacuum electronic device including components, each component receiving a respective DC output voltage of the stacked DC output voltages.
Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.
Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.
An electromagnetic waveguide component includes multiple planar layers and one or more layers are shaped to accommodate incoming electromagnetic waves. Each layer includes two more alignment features, and corresponding pins, the two or more alignment features in each of the layers providing precise stacking registration among the plurality of layers, and the planar layers, when assembled into a stack, are configured to provide a desired radio frequency (RF) response.
A cathode heater assembly for use in a vacuum electronic device includes a refractive cup having a bottom portion and side walls forming a container; a cathode secured in the container of the refractive cup; and a heater wire coupled to the refractive cup. The cathode heater assembly may be manufactured by providing a refractive cup having a bottom portion and side walls forming a container; inserting a cathode pellet in the container of the refractive cup; impregnating the cathode pellet with electron emissive materials while the cathode pellet is in the container of the refractive cup; and attaching a heater wire to the refractive cup.
An electromagnetic waveguide component includes multiple planar layers and one or more layers are shaped to accommodate incoming electromagnetic waves. Each layer includes two more alignment features, and corresponding pins, the two or more alignment features in each of the layers providing precise stacking registration among the plurality of layers, and the planar layers, when assembled into a stack, are configured to provide a desired radio frequency (RF) response.
A cathode heater assembly for use in a vacuum electronic device comprises a refractive cup having a bottom portion and side walls forming a container: a cathode secured in the container of the refractive cup; and a heater wire coupled to the refractive cup. The cathode heater assembly may be manufactured by providing a refractive cup having a bottom portion and side walls forming a container; inserting a cathode pellet in the container of the refractive cup; impregnating the cathode pellet with electron emissive materials while the cathode pellet is in the container of the refractive cup; and attaching a heater wire to the refractive cup.
A magnet array holder configured to retain magnet pieces and/or non-magnet pieces to form a magnet array, the magnet array configured to manipulate one or more electron beams in a vacuum electronic device when assembled, the magnet array holder comprising a set of slots configured to receive magnet and/or non-magnet pieces; a set of pockets to receive magnet and/or non-magnet pieces; and one or more attachment interfaces configured to couple the magnet array holder to a vacuum electronic device.
A magnet array holder configured to retain magnet pieces and/or non-magnet pieces to form a magnet array, the magnet array configured to manipulate one or more electron beams in a vacuum electronic device when assembled, the magnet array holder comprising a set of slots configured to receive magnet and/or non-magnet pieces; a set of pockets to receive magnet and/or non-magnet pieces; and one or more attachment interfaces configured to couple the magnet array holder to a vacuum electronic device.
H01F 41/00 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
24.
Multi-layer vacuum electron device and method of manufacture
Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.
Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.
H01M 4/02 - Electrodes composed of, or comprising, active material
H01J 37/04 - Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
H01J 37/28 - Electron or ion microscopesElectron- or ion-diffraction tubes with scanning beams
26.
MAGNETO-ELECTROSTATIC SENSING, FOCUSING, AND STEERING OF ELECTRON BEAMS IN VACUUM ELECTRON DEVICES
Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.
Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.
09 - Scientific and electric apparatus and instruments
Goods & Services
Amplifiers; Electron tubes; Amplifiers for wireless communications; Broadband wireless equipment, namely, telecommunications base station equipment for cellular and fixed networking and communications applications; Power amplifiers
42 - Scientific, technological and industrial services, research and design
Goods & Services
Development of technologies for the fabrication of circuits for wireless communication, electronic data processing, consumer electronic, automotive electronics
