Abrégé

An electromagnetic waveguide component includes multiple planar layers and one or more layers are shaped to accommodate incoming electromagnetic waves. Each layer includes two more alignment features, and corresponding pins, the two or more alignment features in each of the layers providing precise stacking registration among the plurality of layers, and the planar layers, when assembled into a stack, are configured to provide a desired radio frequency (RF) response.

Classes IPC  ?

• H01P 3/12 - Guides d'ondes creux
• H01P 1/18 - Déphaseurs
• H01P 1/20 - Sélecteurs de fréquence, p. ex. filtres
• H01P 1/38 - Circulateurs
• H01P 5/00 - Dispositifs de couplage du type guide d'ondes

Abrégé

Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.

Classes IPC  ?

• H01J 23/083 - Dispositifs de focalisation électrostatique
• H01J 9/18 - Assemblage des parties constitutives des systèmes d'électrodes
• H01J 23/06 - Canons à électrons ou à ions
• H01J 23/16 - Éléments de circuits à capacité et inductance réparties en interaction avec la décharge et structurellement associés au tube
• H01J 25/34 - Tubes à ondes progressivesTubes dans lesquels une onde progressive est simulée à des intervalles échelonnés
• H01J 29/62 - Lentilles électrostatiques
• H01J 29/70 - Dispositions pour la déviation du rayon ou du faisceau

Abrégé

A magnet array holder configured to retain magnet pieces and/or non-magnet pieces to form a magnet array, the magnet array configured to manipulate one or more electron beams in a vacuum electronic device when assembled, the magnet array holder comprising a set of slots configured to receive magnet and/or non-magnet pieces; a set of pockets to receive magnet and/or non-magnet pieces; and one or more attachment interfaces configured to couple the magnet array holder to a vacuum electronic device.

Classes IPC  ?

• H01F 7/02 - Aimants permanents
• H01F 41/00 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques

Abrégé

Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.

Classes IPC  ?

• H01J 23/083 - Dispositifs de focalisation électrostatique
• H01J 9/18 - Assemblage des parties constitutives des systèmes d'électrodes
• H01J 23/06 - Canons à électrons ou à ions
• H01J 23/16 - Éléments de circuits à capacité et inductance réparties en interaction avec la décharge et structurellement associés au tube
• H01J 25/34 - Tubes à ondes progressivesTubes dans lesquels une onde progressive est simulée à des intervalles échelonnés
• H01J 29/62 - Lentilles électrostatiques
• H01J 29/70 - Dispositions pour la déviation du rayon ou du faisceau

Abrégé

A power module comprises a high frequency switching electronic power conditioner including stacked rectifier/filters, the stacked rectifier/filters generating stacked DC output voltages; and a vacuum electronic device coupled to the high frequency switching electronic power conditioner, the vacuum electronic device including components, each component receiving a respective DC output voltage of the stacked DC output voltages.

Classes IPC  ?

• H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie

Abrégé

A cathode heater assembly for use in a vacuum electronic device comprises a refractive cup having a bottom portion and side walls forming a container; a cathode secured in the container of the refractive cup; and a heater wire coupled to the refractive cup. The cathode heater assembly may be manufactured by providing a refractive cup having a bottom portion and side walls forming a container; inserting a cathode pellet in the container of the refractive cup; impregnating the cathode pellet with electron emissive materials while the cathode pellet is in the container of the refractive cup; and attaching a heater wire to the refractive cup.

Classes IPC  ?

• H01J 23/04 - Cathodes
• H01J 9/04 - Fabrication des électrodes ou des systèmes d'électrodes des cathodes thermo-ioniques

Abrégé

A method of manufacturing a radio frequency (RF) or electron beam structure, comprises forming each layer of multiple layers to be assembled and bonded together with positional alignment, the forming each layer including forming a first via segment of a first particular shape and dimension in the layer at a first location in the layer, such that when the first via segments of the multiple layers are assembled with positional alignment the multiple first via segments align to form a first via; and inserting a first analogous pin into the first via, the first analogous pin being formed based on the first particular shape and dimension of each of the first via segments, such that inserting the first analogous pin into the first via assists in causing the multiple layers to be assembled with positional alignment.

Classes IPC  ?

• H01J 9/02 - Fabrication des électrodes ou des systèmes d'électrodes
• H01J 9/18 - Assemblage des parties constitutives des systèmes d'électrodes
• H01J 23/06 - Canons à électrons ou à ions

Abrégé

A power module comprises a high frequency switching electronic power conditioner including stacked rectifier/filters, the stacked rectifier/filters generating stacked DC output voltages; and a vacuum electronic device coupled to the high frequency switching electronic power conditioner, the vacuum electronic device including components, each component receiving a respective DC output voltage of the stacked DC output voltages.

Classes IPC  ?

• H01J 23/027 - Collecteurs
• H01J 23/04 - Cathodes
• H01J 23/075 - Canons à injection pour magnétron
• H01J 23/20 - Cavités résonnantesRéglage ou accord de celles-ci
• H01J 23/06 - Canons à électrons ou à ions
• H01J 23/54 - Dispositifs de filtrage empêchant les fréquences ou les modes indésirables d'être couplés dans ou hors du circuit d'interactionMesures pour empêcher la déperdition haute fréquence dans l'environnement
• H01J 25/02 - Tubes à faisceau électronique modulé en vitesse ou en densité dans une zone modulatrice et cédant ensuite de l'énergie dans une zone inductrice, les zones étant associées à un ou plusieurs résonateurs
• H01J 25/04 - Tubes à un ou plusieurs résonateurs, sans réflexion du faisceau électronique, et dont la modulation produite dans la zone modulatrice est principalement une modulation en densité, p. ex. tube de Haeff
• H01J 25/10 - Klystrons, c.-à-d. tubes à au moins deux résonateurs, sans réflexion du faisceau électronique, et dont le faisceau est modulé principalement dans sa vitesse dans la zone du résonateur d'entrée

Abrégé

A circuit device fabricated in device layers, comprises a filter-type circuit fabricated in the device layers; a transmission line fabricated in the device layers and connected to the filter-type circuit; and a corrective mismatch disposed within the transmission line, fabricated in at least one of the device layers, and designed with a corrective impedance to improve matching performance therebetween. A waveguide device fabricated in device layers, comprises a first waveguide fabricated in the device layers and having a first dimension aligned with a first layer; a second waveguide fabricated in the device layers and having a second dimension aligned with a second layer; and a waveguide transformer fabricated in the device layers and having a transformer dimension aligned with a third layer.

Classes IPC  ?

• H01P 3/12 - Guides d'ondes creux
• H01P 1/201 - Filtres à ondes électromagnétiques transversales
• H01P 11/00 - Appareils ou procédés spécialement adaptés à la fabrication de guides d'ondes, résonateurs, lignes ou autres dispositifs du type guide d'ondes

Abrégé

A radio-frequency (RF) window comprises a first flange assembly including a first flange having a first flange thickness between a first surface and a second surface, and a first waveguide channel; and a first window element having a first window thickness and disposed in the first waveguide channel at a first location; and a second flange assembly stacked against the first flange assembly, the second flange assembly including a second flange having a second flange thickness between a third surface and a fourth surface, and a second waveguide channel; and a second window element having a second window thickness and disposed in the second waveguide channel at a second location, such that when the first flange assembly is stacked against the second flange assembly the second window element has a predetermined distance to the first window element, the predetermined distance selected based on a desired frequency band of operations.

Classes IPC  ?

• H01P 5/02 - Dispositifs de couplage du type guide d'ondes à coefficient de couplage invariable
• H01P 1/04 - Joints fixes
• H01P 1/08 - Fenêtres diélectriques
• H01P 5/08 - Dispositifs de couplage du type guide d'ondes destinés au couplage de lignes ou de dispositifs de différentes sortes

Abrégé

A circuit device fabricated in device layers, comprises a filter-type circuit fabricated in the device layers; a transmission line fabricated in the device layers and connected to the filter-type circuit; and a corrective mismatch disposed within the transmission line, fabricated in at least one of the device layers, and designed with a corrective impedance to improve matching performance therebetween. A waveguide device fabricated in device layers, comprises a first waveguide fabricated in the device layers and having a first dimension aligned with a first layer; a second waveguide fabricated in the device layers and having a second dimension aligned with a second layer; and a waveguide transformer fabricated in the device layers and having a transformer dimension aligned with a third layer.

Classes IPC  ?

• H01P 1/20 - Sélecteurs de fréquence, p. ex. filtres
• H01P 3/00 - Guides d'ondesLignes de transmission du type guide d'ondes

Abrégé

A method of manufacturing a radio frequency (RF) or electron beam structure, comprises forming each layer of multiple layers to be assembled and bonded together with positional alignment, the forming each layer including forming a first via segment of a first particular shape and dimension in the layer at a first location in the layer, such that when the first via segments of the multiple layers are assembled with positional alignment the multiple first via segments align to form a first via; and inserting a first analogous pin into the first via, the first analogous pin being formed based on the first particular shape and dimension of each of the first via segments, such that inserting the first analogous pin into the first via assists in causing the multiple layers to be assembled with positional alignment.

Classes IPC  ?

• H01J 9/00 - Appareils ou procédés spécialement adaptés à la fabrication de tubes à décharge électrique, de lampes à décharge électrique ou de leurs composantsRécupération de matériaux à partir de tubes ou de lampes à décharge
• B33Y 80/00 - Produits obtenus par fabrication additive
• H01J 25/34 - Tubes à ondes progressivesTubes dans lesquels une onde progressive est simulée à des intervalles échelonnés

Abrégé

A radio-frequency (RF) window comprises a first flange assembly including a first flange having a first flange thickness between a first surface and a second surface, and a first waveguide channel; and a first window element having a first window thickness and disposed in the first waveguide channel at a first location; and a second flange assembly stacked against the first flange assembly, the second flange assembly including a second flange having a second flange thickness between a third surface and a fourth surface, and a second waveguide channel; and a second window element having a second window thickness and disposed in the second waveguide channel at a second location, such that when the first flange assembly is stacked against the second flange assembly the second window element has a predetermined distance to the first window element, the predetermined distance selected based on a desired frequency band of operations.

Classes IPC  ?

• H01P 1/08 - Fenêtres diélectriques
• H01P 3/127 - Guides d'ondes creux présentant une section circulaire, elliptique ou parabolique

Abrégé

A depressed collector, comprises an insulator body; a plurality of serial electrodes, each serial electrode having a serial electrode receptor portion inside the insulator body and having a serial electrode thermal fin portion passing through and extending outside the insulator body; and a terminal electrode having a terminal electrode receptor portion inside the insulator body and having a terminal electrode thermal fin portion passing through and extending outside the insulator body.

Classes IPC  ?

• H01J 23/033 - Dispositifs de réfrigération de collecteurs
• H01J 23/027 - Collecteurs
• H05K 7/20 - Modifications en vue de faciliter la réfrigération, l'aération ou le chauffage

Abrégé

A power module comprises a high frequency switching electronic power conditioner including stacked rectifier/filters, the stacked rectifier/filters generating stacked DC output voltages; and a vacuum electronic device coupled to the high frequency switching electronic power conditioner, the vacuum electronic device including components, each component receiving a respective DC output voltage of the stacked DC output voltages.

Classes IPC  ?

• H03F 1/00 - Détails des amplificateurs comportant comme éléments d'amplification uniquement des tubes à décharge, uniquement des dispositifs à semi-conducteurs ou uniquement des composants non spécifiés
• H03F 3/24 - Amplificateurs de puissance, p. ex. amplificateurs de classe B, amplificateur de classe C d'étages transmetteurs de sortie

Abrégé

Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.

Classes IPC  ?

• H01J 23/083 - Dispositifs de focalisation électrostatique
• H01J 9/18 - Assemblage des parties constitutives des systèmes d'électrodes
• H01J 23/06 - Canons à électrons ou à ions
• H01J 23/16 - Éléments de circuits à capacité et inductance réparties en interaction avec la décharge et structurellement associés au tube
• H01J 25/34 - Tubes à ondes progressivesTubes dans lesquels une onde progressive est simulée à des intervalles échelonnés
• H01J 29/62 - Lentilles électrostatiques
• H01J 29/70 - Dispositions pour la déviation du rayon ou du faisceau

Abrégé

Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.

Classes IPC  ?

• H01J 23/083 - Dispositifs de focalisation électrostatique
• H01J 9/18 - Assemblage des parties constitutives des systèmes d'électrodes
• H01J 23/06 - Canons à électrons ou à ions
• H01J 23/16 - Éléments de circuits à capacité et inductance réparties en interaction avec la décharge et structurellement associés au tube
• H01J 29/62 - Lentilles électrostatiques
• H01J 29/70 - Dispositions pour la déviation du rayon ou du faisceau
• H01J 25/34 - Tubes à ondes progressivesTubes dans lesquels une onde progressive est simulée à des intervalles échelonnés

Abrégé

An electromagnetic waveguide component includes multiple planar layers and one or more layers are shaped to accommodate incoming electromagnetic waves. Each layer includes two more alignment features, and corresponding pins, the two or more alignment features in each of the layers providing precise stacking registration among the plurality of layers, and the planar layers, when assembled into a stack, are configured to provide a desired radio frequency (RF) response.

Classes IPC  ?

• G02B 6/42 - Couplage de guides de lumière avec des éléments opto-électroniques
• H01P 3/12 - Guides d'ondes creux
• H01P 11/00 - Appareils ou procédés spécialement adaptés à la fabrication de guides d'ondes, résonateurs, lignes ou autres dispositifs du type guide d'ondes

Abrégé

A cathode heater assembly for use in a vacuum electronic device includes a refractive cup having a bottom portion and side walls forming a container; a cathode secured in the container of the refractive cup; and a heater wire coupled to the refractive cup. The cathode heater assembly may be manufactured by providing a refractive cup having a bottom portion and side walls forming a container; inserting a cathode pellet in the container of the refractive cup; impregnating the cathode pellet with electron emissive materials while the cathode pellet is in the container of the refractive cup; and attaching a heater wire to the refractive cup.

Classes IPC  ?

• H01J 23/04 - Cathodes
• H01J 9/04 - Fabrication des électrodes ou des systèmes d'électrodes des cathodes thermo-ioniques

Abrégé

An electromagnetic waveguide component includes multiple planar layers and one or more layers are shaped to accommodate incoming electromagnetic waves. Each layer includes two more alignment features, and corresponding pins, the two or more alignment features in each of the layers providing precise stacking registration among the plurality of layers, and the planar layers, when assembled into a stack, are configured to provide a desired radio frequency (RF) response.

Classes IPC  ?

• H01P 3/12 - Guides d'ondes creux
• H01P 1/18 - Déphaseurs
• H01P 1/20 - Sélecteurs de fréquence, p. ex. filtres
• H01P 1/38 - Circulateurs
• H01P 5/00 - Dispositifs de couplage du type guide d'ondes

Abrégé

A cathode heater assembly for use in a vacuum electronic device comprises a refractive cup having a bottom portion and side walls forming a container: a cathode secured in the container of the refractive cup; and a heater wire coupled to the refractive cup. The cathode heater assembly may be manufactured by providing a refractive cup having a bottom portion and side walls forming a container; inserting a cathode pellet in the container of the refractive cup; impregnating the cathode pellet with electron emissive materials while the cathode pellet is in the container of the refractive cup; and attaching a heater wire to the refractive cup.

Classes IPC  ?

• H01J 19/14 - Cathodes à chauffage indirect par courant électriqueCathodes à chauffage par bombardement électronique ou ionique
• H01J 19/20 - Supports du matériau émissif
• H01J 1/20 - Cathodes à chauffage indirect par courant électrique Cathodes à chauffage par bombardement électronique ou ionique
• H01J 1/26 - Supports du matériau émissif
• H01J 37/075 - Canons à électrons utilisant l'émission thermo-ionique de cathodes chauffées par bombardement de particules ou par irradiation, p. ex. par laser
• H01J 37/315 - Tubes à faisceau électronique ou ionique destinés aux traitements localisés d'objets pour souder

Abrégé

A magnet array holder configured to retain magnet pieces and/or non-magnet pieces to form a magnet array, the magnet array configured to manipulate one or more electron beams in a vacuum electronic device when assembled, the magnet array holder comprising a set of slots configured to receive magnet and/or non-magnet pieces; a set of pockets to receive magnet and/or non-magnet pieces; and one or more attachment interfaces configured to couple the magnet array holder to a vacuum electronic device.

Classes IPC  ?

• H01J 29/70 - Dispositions pour la déviation du rayon ou du faisceau
• H01J 9/18 - Assemblage des parties constitutives des systèmes d'électrodes

Abrégé

A magnet array holder configured to retain magnet pieces and/or non-magnet pieces to form a magnet array, the magnet array configured to manipulate one or more electron beams in a vacuum electronic device when assembled, the magnet array holder comprising a set of slots configured to receive magnet and/or non-magnet pieces; a set of pockets to receive magnet and/or non-magnet pieces; and one or more attachment interfaces configured to couple the magnet array holder to a vacuum electronic device.

Classes IPC  ?

• H01F 7/02 - Aimants permanents
• H01F 41/00 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques

Abrégé

Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.

Classes IPC  ?

• H01J 23/083 - Dispositifs de focalisation électrostatique
• H01J 23/06 - Canons à électrons ou à ions
• H01J 9/18 - Assemblage des parties constitutives des systèmes d'électrodes
• H01J 29/62 - Lentilles électrostatiques
• H01J 29/70 - Dispositions pour la déviation du rayon ou du faisceau
• H01J 23/16 - Éléments de circuits à capacité et inductance réparties en interaction avec la décharge et structurellement associés au tube
• H01J 25/34 - Tubes à ondes progressivesTubes dans lesquels une onde progressive est simulée à des intervalles échelonnés

Abrégé

Vacuum electron devices (VEDs) having a plurality of two-dimensional layers of various materials are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together into a sandwich-like structure. The manufacturing process enables incorporation of metallic, magnetic, ceramic materials, and other materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability.

Classes IPC  ?

• H01M 4/02 - Électrodes composées d'un ou comprenant un matériau actif
• H01J 37/04 - Dispositions des électrodes et organes associés en vue de produire ou de commander la décharge, p. ex. dispositif électronoptique, dispositif ionoptique
• H01J 37/28 - Microscopes électroniques ou ioniquesTubes à diffraction d'électrons ou d'ions avec faisceaux de balayage

Abrégé

Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.

Classes IPC  ?

• H01J 23/083 - Dispositifs de focalisation électrostatique
• H01J 23/087 - Dispositifs de focalisation magnétique
• H01J 23/10 - Systèmes d'aimants pour diriger ou dévier la décharge suivant une trajectoire désirée, p. ex. une trajectoire spirale ou hélicoïdale
• H01J 23/09 - Systèmes électriques destinés à diriger ou dévier la décharge suivant une trajectoire désirée, p. ex. type E

Abrégé

Vacuum electron devices (VEDs) are produced having a plurality of two-dimensional layers of various materials that are bonded together to form one or more VEDs simultaneously. The two-dimensional material layers are machined to include features needed for device operation so that when assembled and bonded into a three-dimensional structure, three-dimensional features are formed. The two-dimensional layers are bonded together using brazing, diffusion bonding, assisted diffusion bonding, solid state bonding, cold welding, ultrasonic welding, and the like. The manufacturing process enables incorporation of metallic, magnetic, and ceramic materials required for VED fabrication while maintaining required positional accuracy and multiple devices per batch capability. The VEDs so produced include a combination of magnetic and electrostatic lenses for electron beam control.

Classes IPC  ?

• H01J 23/083 - Dispositifs de focalisation électrostatique
• H01J 9/18 - Assemblage des parties constitutives des systèmes d'électrodes
• H01J 23/06 - Canons à électrons ou à ions
• H01J 23/16 - Éléments de circuits à capacité et inductance réparties en interaction avec la décharge et structurellement associés au tube
• H01J 25/34 - Tubes à ondes progressivesTubes dans lesquels une onde progressive est simulée à des intervalles échelonnés
• H01J 29/62 - Lentilles électrostatiques
• H01J 29/70 - Dispositions pour la déviation du rayon ou du faisceau

Produits et services

Amplifiers; Electron tubes; Amplifiers for wireless communications; Broadband wireless equipment, namely, telecommunications base station equipment for cellular and fixed networking and communications applications; Power amplifiers

Produits et services

Development of technologies for the fabrication of circuits for wireless communication, electronic data processing, consumer electronic, automotive electronics