A NAND device comprises a memory array, the memory array including a plurality of blocks of NAND cells and circuitry to perform a touchup program on a portion of programmed NAND cells in a block of NAND cells after all word lines in the block have been programmed. The gap width in a threshold voltage (Vt) distribution for a 3D NAND Flash cell is improved by performing touchup program on a selected portion of the word lines in a block after all of the word lines in the block have been programmed.
Modulation of the source voltage in a NAND-flash array read waveform can enable improved read-disturb mitigation. For example, increasing the source line voltage to a voltage with a magnitude greater than the non-idle source voltage during the read operation when the array is idle (e.g., not during sensing) enables a reduction in read disturb without the complexity arising from the consideration of multiple read types. Additional improvement in FN disturb may also be obtained on the sub-blocks in the selected SGS by increasing the source line voltage during the selected wordline ramp when the array is idle.
Vertical wordline driver structures and methods. The vertical wordline driver comprises a transistor that is used to drive a wordline in a three-dimensional 3D memory structure. A vertical transistor structure is formed in a semiconductor substrate comprising a gate all around (GAA) structure or a double-gate structure including a gate oxide, an amorphous IGZO (Indium Gallium Zinc Oxide) channel, adjacent to the gate oxide, and a liner adjacent to the amorphous IGZO channel. The GAA structure may comprise a conical frustrum shape or a cylindrical shape with straight walls. The double-gate structure may have straight or angled walls. An outer wall of the gate oxide is in contact with a polysilicon gate layer. An upper and lower contact is electrically coupled to the amorphous IGZO channel.
H10B 43/40 - EEPROM devices comprising charge-trapping gate insulators characterised by the peripheral circuit region
H10B 41/41 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region of a memory region comprising a cell select transistor, e.g. NAND
G11C 16/08 - Address circuitsDecodersWord-line control circuits
4.
EARLY READ OPERATION FOR STORAGE DEVICES WITH INDEPENDENT PLANES AND PLANE GROUPS
A storage device includes a storage array with multiple planes organized as plane groups, where the planes of a plane group receive and process commands in parallel. The storage device includes a storage controller that receives a command from a host controller. In response to receipt of the command the storage controller provides ready information for all planes to the host controller. The multiple planes can optionally have independent multiplane read operation (IMPRO). Each plane group can have a first plane and a second plane, and the storage controller can optionally read data from the first plane of a plane group in response to a virtual ready signal for the first plane, before the second plane of the plane group is ready.
For a nonvolatile (NV) storage media such as NAND (not AND) media that is written by a program and program verify operation, the system can apply a smart prologue operation. A smart prologue operation can selectively apply a standard program prologue, to compute program parameters for a target subblock. The smart prologue operation can selectively apply an accelerated program prologue, applying a previously-computed program parameter for a subsequent subblock of a same block of the NV storage media. Application of a prior program parameter can reduce the need to compute program parameters for the other subblocks.
The size of page map memory in a NAND flash device used to store page related information is decreased by embedding page type in a row address. The row address is received by the NAND flash device from the host on the data bus in a six-cycle sequence. The received row address is used to decode a physical page address received during the row address cycle to obtain a word line and a block segment number for a block segment in the word line in the NAND flash array. A same block segment number is used for each page type in the block segment.
A ring oscillator (RO) circuit for capturing one or more characteristics relating to aging of CMOS circuitry in a CMOS device has been described. The RO circuit includes a plurality of stages coupled via an RO feedback signal line and forming an inverter chain. The plurality of stages include, for each stage, a respective CMOS inverter comprising a pair of pMOS and nMOS transistors followed by a pass gate, wherein an output of a pass gate for a stage is coupled to an input for the respective CMOS inverter of a next stage. The plurality of stages include an enable stage to enable the inverter chain to be put into a free oscillating mode or another mode in which the RO circuit does not freely oscillate. The plurality of stages include a Device Under Test (DUT) stage preceded by a pre-stage where respective supply rails of the DUT stage and pre-stage are isolated from one another.
Systems, apparatuses, and methods may provide for technology for an aging protection scheme for memory structures. For example, such technology determines a completion of a burst cycle operation. Such technology alternates between a first park status applied to even node devices and a second park status applied to odd node devices in response to the determined completion of the burst cycle operation.
A test system for memory can be calibrated based on an indirect determination of the channel loss. A characteristic receive eye parameter can be computed for a memory die on a first test platform, and then used to indirectly determine the channel loss for a different test platform. The different test platform can adjust the transmit data eye based on the calculation of its channel loss.
Program verify can be performed simultaneously on multiple subblocks in a storage device. The program verify occurs after a program operation of the storage cells. The program verify can include application of a verify read pulse to multiple subblocks simultaneously and then a count a number of bitlines of the multiple subblocks that do not discharge in response to the verify read pulse. The program verify passes if the count is within an expected range, instead of requiring all storage cells to pass program verify before moving on. If the number of bitlines not discharging is outside the expected range, the system can perform a second program pass.
A method is described. The method includes performing the following on a flash memory chip: measuring a temperature of the flash memory chip; and, changing a program step size voltage of the flash memory chip because the temperature of the flash memory chip has changed.
A storage device charges bitlines in preparation for a program pulse. To charge the bitlines, the storage device connects the bitlines to an external regulator instead of an internal regulator to prepare them for the program pulse. The system can charge all bitlines to the external regulator high voltage reference before changing to the internal regulator for bitline stabilization before the program pulse.
Methods and apparatus for a diagnostic in situ ring oscillator (RO) circuit for DC and transient characterization. The RO circuit includes a plurality of symmetrical stages coupled via an RO feedback signal line and forming an inverter chain, where each stage includes a CMOS inverter comprising a pair of pMOS and nMOS transistors coupled between power-gating transistors respectively coupled to a positive voltage source and ground, wherein an output of a CMOS inverter for the stage is coupled to an input for the CMOS inverter of a next stage. The first stage is a configurable enable stage to enable the inverter chain to be set into a defined logic state, followed by multiple pre-stage-DUT stages. The output of the last stage is feed back to the input of the enable stage to form an RO feedback signal. The RO circuit can operate in multiple modes including an AC mode, a DC mode, and a hybrid mode.
G01R 31/319 - Tester hardware, i.e. output processing circuits
H03K 17/687 - Electronic switching or gating, i.e. not by contact-making and -breaking characterised by the use of specified components by the use, as active elements, of semiconductor devices the devices being field-effect transistors
H03K 19/0185 - Coupling arrangementsInterface arrangements using field-effect transistors only
A storage device includes a storage array having multiple decks of NAND cells in a three dimensional (3D) stack. There can be any number of decks that have multiple wordlines in vertical stacks. The decks include a first deck and a second deck. Bias circuitry can apply different voltages to different decks of the storage array. The bias circuitry can apply a low bias to the first deck, with a first voltage low enough to not turn on the NAND cells of the first deck, and simultaneously apply a high bias to the second deck, with a second voltage high enough to turn on the NAND cells of the second deck.
ALD versus PVD IGZO Channel and AlOx channel passivation in a vertical wordline driver. A pillar is formed in a stacked layer semiconductor structure including a source layer, wherein forming the pillar exposes layers in the semiconductor structure and exposes a portion of the source layer at the bottom of the pillar. A gate oxide film is formed over exposed layers in the semiconductor structure and over the exposed portion of the source layer. A sacrificial silicon liner is formed over the gate oxide, and subsequently both the gate oxide and the sacrificial silicon liner are removed from the pillar bottom in an anisotropic dry etch (“punch”) process that exposes the source layer. The sacrificial silicon liner is stripped from the gate oxide wall, and a film of IGZO is formed over the gate oxide film and a portion of the source layer, and a high-κ channel passivation deposition process follows to form a film of a high-κ material over the film of IGZO to form a hermetically sealed IGZO channel contained within a vertical wordline driver supporting a drive voltage of at least 10 volts.
H10B 43/40 - EEPROM devices comprising charge-trapping gate insulators characterised by the peripheral circuit region
H10B 41/41 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region of a memory region comprising a cell select transistor, e.g. NAND
16.
FAST AND EFFICIENT VERIFY RECOVERY AND ARRAY DISCHARGE FOR 3D NAND MEMORY ARRAYS
Methods and apparatus for fast and efficient verify recovery and array discharge for 3D NAND memory arrays and other 3D storage devices. The 3D storage device includes storage arrays including strings of memory cells stacked on top of one another and sharing a channel in a pillar for the string. The memory cells for a string occupy respective tiers in a 3D structure with each tier having an associated wordline. A controller is used to program charge levels in the memory cells. Programming is followed by a fast verify recovery where a voltage is applied to the wordlines to perform a program verify, followed by discharging wordlines. Erased wordlines are identified and discharged first, followed by programmed wordlines, which may employ staggered discharge sequences. Dummy wordlines are then discharged, with an optional timer delay. For multi-deck devices, wordlines in the deck with an active wordline are discharged before wordlines in one or more other decks.
NAND performance is increased by reducing the time to perform program operations. An operation to program a portion of NAND cells in a NAND memory array includes multiple stages. NAND performance is increased by reducing the time in a first stage of the multiple stages to compute parameters that are used in a second stage to perform program operation(s) and verify operation(s). The time in the first stage is reduced by enabling dynamic prologue selection to dynamically select one of multiple sets of first stage operations to be performed in the first stage for a program operation based on the Word Line (WL), WL-Group, and block information for a current program operation and a previous program operation.
Integration methods for prevention of floating gate 3D-NAND cell residual using a hybrid plug process in a super-deck structure and associated apparatus. A first desk layered structure comprising alternating isolation and conductor layers having a top isolation layer is formed over a substrate. A Silicon Nitride (SiN) layer is formed over the top isolation layer. An array of pillar holes vertically passing through the SiN layer and layers in the first deck layered structure are formed. The pillar holes are filled with a sacrificial film and an upper portion of the pillar holes are filled with a hybrid plug comprising first and second oxides. A second layered structure comprising alternating isolation and conductor layers having a bottom isolation layer is formed over the SiN layer, and an array of pillar holes are formed in the second deck layered structure. The hybrid plugs and sacrificial film is then removed using etching.
G11C 16/04 - Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
H10B 41/27 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H10B 41/35 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
H10B 43/27 - EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H10B 43/35 - EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
19.
FLOATING GATE NAND CELL – METHODS AND APPROACHES FOR FABRICATION
Methods and approaches for fabricating floating gate NAND cells and associated memory devices. A stacked layer structure comprising alternating layers of polysilicon and silicon nitride is fabricated, and an array of memory hole passing vertically through the alternating layers of polysilicon and silicon nitride are formed. Multiple films of materials, such as silicon oxide, silicon nitrides, and polysilicon are sequentially formed over sidewalls of the memory holes during in-memory hole processing. The back-side processing begins with removal of silicon nitride layers (dielectric spacers between wordlines) using an etchant introduced through replacement holes which enables inter-wordline airgaps between FG memory cells in adjacent polysilicon layers. Etching processes selective to silicon oxide and silicon nitride are performed to form the gate, inter-poly dielectric (IPD) layers, and the storage node of the FG memory cells. The films formed during the in-memory hole processing that are not etched comprise the channels.
H10B 41/35 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
H10B 41/27 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H10B 43/27 - EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H10B 43/35 - EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
20.
LARGE GRAIN AND HALOGEN-FREE SILICON CELL CHANNEL FOR 3D NAND STRING
An example of an apparatus may include an array of linear cell channels and a string of NAND memory cells arranged along a cell channel of the array of linear cell channels, where a polysilicon cell channel layer comprises material with less than E17 halogen atoms per cubic centimeter, where a thickness of the polysilicon cell channel layer is less than or equal to 25 nanometers, and where an area-weighted grain height mean of the polysilicon cell channel layer is greater than 30 nanometers. Other examples are disclosed and claimed.
H10B 43/27 - EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H10B 41/27 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
21.
INTEGRATED WORD LINE CONTACT STRUCTURES IN THREE-DIMENSIONAL (3D) MEMORY ARRAY
A memory array including integrated word line (WL) contact structures are disclosed. The memory array comprises a plurality of WLs that includes at least a first WL and a second WL. An integrated WL contact structure includes a first WL contact and a second WL contact for the first WL and the second WL, respectively. The second WL contact extends through the first WL contact. For example, the second WL contact is nested within the first WL contact. An intervening isolation material isolates the second WL contact from the first WL contact. In an example, the second WL contact extends through a hole in the first WL to reach the second WL. The isolation material isolates the second WL contact from sidewalls of the hole in the first WL.
H01L 23/535 - Arrangements for conducting electric current within the device in operation from one component to another including internal interconnections, e.g. cross-under constructions
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
H01L 23/528 - Layout of the interconnection structure
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H10B 41/27 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H10B 43/27 - EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
22.
MEMORY DEVICES WITH GRADIENT-DOPED CONTROL GATE MATERIAL
Disclosed herein are memory devices with gradient-doped control gate material, as well as related methods and devices. In some embodiments, a memory device may include a first isolation material, a second isolation material, and a control gate material between the first isolation material and the second isolation material along an axis. The control gate material may include a dopant having a non-uniform concentration along the axis.
H01L 29/788 - Field-effect transistors with field effect produced by an insulated gate with floating gate
H10B 41/27 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
23.
ENHANCED IO INTERFACE FOR PLC PROGRAM AND PROGRAM-SUSPEND-RESUME OPERATIONS
Methods and apparatus for Enhanced IO Interface for PLC program and program-suspend-resume operations. A NAND memory device includes blocks of single-level cell (SLC) memory and multi-level cell (MLC) memory storing n-bits per cell such as quad-level cell (QLC) or penta-level cell (PLC) memory. The NAND memory device further includes a plurality of page buffer latches and logic to copy data from a set of n SLC pages in a block of SLC memory into n respective page buffer latches and copy data from the respective page buffer latches to an MLC page (e.g., QLC or PLC page) in a block of MLC memory. These operations can be extended for NAND memory devices having multiple planes with blocks of SLC and QLC/PLC memory. QLC/PLC program and program-resume operations are supported with optional ECC correction operations.
In one example, reads in a NAND memory device are tracked for sub-groups. When the number of reads to a sub-group meets a threshold, the data at the wordline on which the threshold was met is moved along with the data at neighboring wordlines to an SLC block without moving the entire block. The performance impact and write amplification impact of read disturb mitigation can be significantly reduced while maintaining some data continuity.
G11C 11/00 - Digital stores characterised by the use of particular electric or magnetic storage elementsStorage elements therefor
G06F 3/06 - Digital input from, or digital output to, record carriers
G11C 11/56 - Digital stores characterised by the use of particular electric or magnetic storage elementsStorage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
G11C 16/04 - Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
G11C 16/08 - Address circuitsDecodersWord-line control circuits
G11C 16/26 - Sensing or reading circuitsData output circuits
G11C 16/34 - Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
An example of a memory device may comprise NAND media with a plurality of decks, and circuitry coupled to the NAND media to control access to a superblock of memory cells aligned along a pillar of the NAND media, wherein the superblock includes at least a first block that corresponds to memory cells aligned along the pillar in a first deck of the plurality of decks and a second block that corresponds to memory cells aligned along the pillar in a second deck of the plurality of decks, configure the NAND media in a first program mode for the first block of the superblock, and configure the NAND media in a second program mode for the second block of the superblock. Other examples are disclosed and claimed.
Systems, apparatuses and methods may provide for technology that issues a program pulse to a selected subblock of a NAND memory array, conducts a pulse recovery phase after the program pulse, and shuts down unselected subblocks in the NAND memory array during the pulse recovery phase.
Methods and apparatus for low-cost punch through flows. Pillar recesses are formed in a semiconductor structure comprising a stack of layers. A negative photoresist coating is applied over regions containing the plurality of pillar recesses. Using a mask, the negative photoresist is in regions in which dummy pillars are to be formed to causing the negative photoresist to polymerize and become insoluble to a developer. A developer is then applied to the semiconductor structure to dissolve the negative photoresist in the pillar recesses that are not exposed. A punch through operation is then performed using an etchant to punch through the bottoms of the pillar recesses that are not covered by the polymerized photoresist, while the bottoms of the pillar recesses that are covered are not punched through. The semiconductor process flow may be used in memory device, such as but not limited to 3D NAND devices.
H01L 23/528 - Layout of the interconnection structure
H10B 80/00 - Assemblies of multiple devices comprising at least one memory device covered by this subclass
H10B 43/27 - EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H10B 41/35 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
H10B 43/35 - EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
H10B 41/27 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
28.
CONSOLIDATION OF STAIRCASE AREA ETCH AND CMOS CONTACT AREA ETCH IN 3D NAND
Systems, apparatuses, and methods may provide for technology that simultaneously forms staircase areas and CMOS (complementary metal-oxide-semiconductor) contact areas in three‐dimensional (3D) NAND memory. A 3D NAND memory includes a first CMOS contact area and a first staircase area. The first CMOS contact area is formed through a plurality of sequential chops. The first staircase area is formed through a plurality of sequential staircase chops. The first CMOS contact area is formed through the plurality of sequential chops being performed simultaneous to the plurality of sequential staircase chops.
H01L 27/24 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including solid state components for rectifying, amplifying, or switching without a potential-jump barrier or surface barrier
29.
METHOD FOR PILLAR BENDING IMPROVEMENT BY CUT TIERS PATTERN IMPLEMENTATION
Methods and apparatus for pillar bending improvement by cut tiers pattern implementation. The method uses a cut tier pattern in a staircase region of a 3D memory structure to reduce pillar bending in a pillar array region. The pillar array region includes a plurality of memory tiers comprising wordline layers interposed between isolation layers, where a memory tier comprises a two-dimensional (2D) array of memory cells. A plurality of vertical structures comprising pillars pass through memory cells in the wordline layers and pass through the isolation layers. The staircase structure is disposed adjacent to the pillar array region and includes vertical wordline drivers coupled to the wordline layers. A cut tier pattern comprising vertical trenches is formed in the staircase structure toward a side of the staircase structure adjacent to the pillar array region. The cut tier pattern includes one or more breaks used for routing circuitry in the wordlines.
H10B 41/10 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the top-view layout
H10B 41/27 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H10B 43/27 - EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H10B 43/10 - EEPROM devices comprising charge-trapping gate insulators characterised by the top-view layout
30.
APPARATUS AND METHOD TO IMPROVE READ WINDOW BUDGET IN A THREE DIMENSIONAL NAND MEMORY
The gap width in a threshold voltage (Vt) distribution for a 3D NAND Flash cell is improved by performing touchup program on a selected portion of the word lines in a block after all of the word lines in the block have been programmed.
An embodiment of an apparatus may include NAND memory organized as two or more memory planes and a controller communicatively coupled to the NAND memory, the controller including circuitry to provide synchronous independent plane read operations for the two or more memory planes of the NAND memory. Other embodiments are disclosed and claimed.
G11C 11/4074 - Power supply or voltage generation circuits, e.g. bias voltage generators, substrate voltage generators, back-up power, power control circuits
Dynamic program caching reduces latency of a program operation on multi-level cell (MLC) memory having at least three pages and programmable with multiple threshold voltage levels, such as a Triple Level Cell (TLC) NAND. A controller determines that the program operation can be initiated without loading all pages into the memory. In response, the NAND loads a first page and then executes portions of the program operation in parallel, at least in part, with loading subsequent pages. The NAND behavior is modified to monitor data loading completion times, to copy pages from a cache register to a data register as needed, and to resume program operation if a shutdown occurs. The portions of the program operation include a program prologue operation and a pulse verify loop for the first voltage level (L1) of the MLC memory.
Dynamic program caching reduces latency of a program operation on multi-level cell (MLC) memory having at least three pages and programmable with multiple threshold voltage levels, such as a Triple Level Cell (TLC) NAND. A controller determines that the program operation can be initiated without loading all pages into the memory. In response, the NAND loads a first page and then executes portions of the program operation in parallel, at least in part, with loading subsequent pages. The NAND behavior is modified to monitor data loading completion times, to copy pages from a cache register to a data register as needed, and to resume program operation if a shutdown occurs. The portions of the program operation include a program prologue operation and a pulse verify loop for the first voltage level (LI) of the MLC memory.
G11C 11/56 - Digital stores characterised by the use of particular electric or magnetic storage elementsStorage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
An embodiment of an apparatus may include a memory package with one or more memory die on an internal input/output (IO) path of the memory package, and an interface module communicatively coupled to the one or more memory die through the internal IO path, the interface module including circuitry to perform IO external to the memory package at a first IO width and a first IO speed, and perform IO internal to the memory package at a second IO width and a second IO speed, wherein one or more of the second IO width is different from the first IO width and the second IO speed is different from the first IO speed. Other embodiments are disclosed and claimed.
Methods and apparatus of engineered dielectric profile for high aspect-ratio (AR) 3D NAND structures. The 3D NAND structures comprise a semiconductor structure having multiple stacked memory tiers comprising 2D arrays of memory cells that are charged using vertical structures formed in the semiconductor structure. The memory tiers comprise wordline layers interposed between isolation layers. The vertical structures, such as memory holes or trenches, have a dielectric (e.g., a tunnel dielectric) formed along sidewalls of holes or trenches having a cross-section profile where a thickness of the dielectric at a bottom wordline layer is thicker than the dielectric thickness for at least a portion of wordline layers above the bottom wordline layer. In one example, formation of the tunnel dielectric employs a sandwich design of engineered profile method in which a selective deposition of dielectric is deposited at the bottom sections of the vertical structures while the rest of the structure is un-altered.
H01L 23/528 - Layout of the interconnection structure
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H10B 80/00 - Assemblies of multiple devices comprising at least one memory device covered by this subclass
H10B 41/27 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H10B 41/35 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
H10B 43/27 - EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H10B 43/35 - EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
An embodiment of a memory device may comprise a super-pillar formed through a plurality of sub-decks, a string of memory cells formed along the super-pillar, and respective regions of transition material disposed between respective sub-decks of the plurality of sub-decks, wherein the super-pillar comprises at least a first pillar formed through a first sub-deck of the plurality of sub-decks substantially aligned with a second pillar formed through a second sub-deck of the plurality of sub-decks. Other embodiments are disclosed and claimed.
H01L 27/11556 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
37.
METHOD AND APPARATUS TO SELECT A PLANE IN A NAND FLASH DIE TO STORE A READ-ONLY RESERVED BLOCK
Manufacturing yield loss of NAND Flash dies is reduced by selecting a plane to store a read-only reserved block and another plane to store a backup read-only reserved block based on the Number of Valid Blocks (NVB) blocks in each plane in the NAND Flash array.
Manufacturing yield loss of NAND Flash dies is reduced by selecting a plane to store a read-only reserved block and another plane to store a backup read-only reserved block based on the Number of Valid Blocks (NVB) blocks in each plane in the NAND Flash array.
For NAND devices having a zero voltage program state as a result of a preconditioning operation, detecting the status of the zero voltage program state is important for customers to quickly validate their component and SSD flows to improve NAND retention and reliability after assembly and die level re-work. A zero voltage program state detection operation quickly determines the validity of the zero voltage program state of a NAND page of a NAND device. The detection operation includes reading a NAND page with reference voltages that delimit a predetermined acceptable range of voltage levels below and above a zero threshold voltage. If NAND memory cells having threshold voltage levels that fall below or above the acceptable voltage levels exceed a predetermined failed bytes limit for the NAND page, the zero voltage program state is invalid.
A storage device includes a storage array with multiple planes organized as plane groups, where the planes of a plane group receive and process commands in parallel. The storage device includes a storage controller that receives a command from a host controller. In response to receipt of the command the storage controller provides ready information for all planes to the host controller. The multiple planes can optionally have independent multiplane read operation (IMPRO). Each plane group can have a first plane and a second plane, and the storage controller can optionally read data from the first plane of a plane group in response to a virtual ready signal for the first plane, before the second plane of the plane group is ready.
Vertical wordline driver structures and methods. The vertical wordline driver comprises a transistor that is used to drive a wordline in a three-dimensional 3D memory structure. A vertical transistor structure is formed in a semiconductor substrate comprising a gate all around (GAA) structure or a double-gate structure including a gate oxide, an amorphous IGZO (Indium Gallium Zinc Oxide) channel, adjacent to the gate oxide, and a liner adjacent to the amorphous IGZO channel. The GAA structure may comprise a conical frustrum shape or a cylindrical shape with straight walls. The double-gate structure may have straight or angled walls. An outer wall of the gate oxide is in contact with a polysilicon gate layer. An upper and lower contact is electrically coupled to the amorphous IGZO channel.
H10B 43/40 - EEPROM devices comprising charge-trapping gate insulators characterised by the peripheral circuit region
H10B 41/41 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region of a memory region comprising a cell select transistor, e.g. NAND
42.
METHOD AND APPARATUS TO MITIGATE WORD LINE STAIRCASE ETCH STOP LAYER THICKNESS VARIATIONS IN 3D NAND DEVICES
An apparatus, a method and a system. The apparatus comprises a memory array including word lines defining a staircase structure, and a staircase etch stop layer including: a sandwich etch stop layer disposed on a top region the staircase and including a first etch stop layer and a third etch stop layer of a first material, and a second etch stop layer sandwiched between the first etch stop layer and the third etch stop layer and made of a second material having etch properties different from the first material; a precut etch stop layer disposed at a region of the staircase structure below the top region and including the second etch stop layer and the third etch stop layer and not the first etch stop layer; and contact structures extending through a dielectric layer and the staircase etch stop layer and landing on the word lines at the staircase structure.
H10B 43/27 - EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
G11C 16/04 - Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
H10B 43/35 - EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/528 - Layout of the interconnection structure
H10B 41/35 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
H10B 41/27 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
43.
EXPRESS STATUS OPERATION FOR STORAGE DEVICES WITH INDEPENDENT PLANES AND PLANE GROUPS
A storage device includes a storage array with multiple planes organized as plane groups, where the planes of a plane group receive and process commands in parallel. The storage device includes a storage controller that receives a command from a host controller. In response to receipt of the command the storage controller provides ready information for all planes to the host controller. The multiple planes can optionally have independent multiplane read operation (IMPRO). Each plane group can have a first plane and a second plane, and the storage controller can optionally read data from the first plane of a plane group in response to a virtual ready signal for the first plane, before the second plane of the plane group is ready.
Power consumption of sensing circuitry in a NAND Flash device is reduced by reducing the voltage supply to a portion of logic circuits in sensing circuitry. A first power domain provides power to a first portion of the logic circuits in the sensing circuity and a second power domain provides power to a second portion of the logic circuits in the sensing circuitry. The first power domain has a higher voltage than the second power domain.
Technology to provide a multi-phase clocking scheme for a memory device includes generating, based on a first clock signal having a first frequency, multi-phase clock signals for a memory device having a second frequency, where the second frequency is a fraction of the first frequency, generating local clock signals for data channels of the memory device based on the multi-phase clock signals, where the local clock signals are synchronous with respective rising edges of the multi-phase clock signals, and providing output data for the data channels of the memory device in an output data sequence based on the local clock signals. In some embodiments, the second frequency is one-half of the first frequency, and the multi-phase clock signals are four-phase clock signals. In some embodiments, the output data is clocked out at an effective rate equal to the first frequency based on the local clock signals.
Systems, apparatuses, and methods may provide for technology for forming a pre-offset platform on top of a substrate. A memory block is formed, where the memory block includes a staircase area and a memory array area located adjacent the staircase area. The memory array area includes a plurality of memory pillars extending into the memory block. The staircase area has a first height, the memory array area has a second height, and a tier expansion height is defined as a difference between the second height and the first height. The pre-offset platform is located between the substrate and the staircase area of the memory block. The pre-offset platform is oriented and arranged to offset the tier expansion height so that an upper surface of the staircase area and an upper surface of the memory array area are located in a same plane.
H10B 41/40 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the peripheral circuit region
H10B 41/20 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels
H10B 41/35 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
H10B 41/50 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the boundary region between the core region and the peripheral circuit region
H10B 43/40 - EEPROM devices comprising charge-trapping gate insulators characterised by the peripheral circuit region
H10B 43/50 - EEPROM devices comprising charge-trapping gate insulators characterised by the boundary region between the core and peripheral circuit regions
G11C 5/02 - Disposition of storage elements, e.g. in the form of a matrix array
H10B 41/27 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H10B 43/27 - EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
Systems, apparatuses, and methods may provide for technology that arranges stair wells for memory devices. The memory device includes a memory array and a memory block coupled to the memory array. The memory block includes a first through array via area and a first staircase area coupled to a plurality of decks. The first staircase area includes a first stair well and a second stair well located contiguous to the first stair well.
H01L 27/11578 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by three-dimensional arrangements, e.g. with cells on different height levels
H01L 27/11551 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by three-dimensional arrangements, e.g. with cells on different height levels
H01L 23/48 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
H01L 27/11519 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by the top-view layout
H01L 27/11524 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by the memory core region with cell select transistors, e.g. NAND
H01L 27/1157 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by the memory core region with cell select transistors, e.g. NAND
H01L 27/11565 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by the top-view layout
G11C 16/04 - Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
G11C 8/14 - Word line organisationWord line lay-out
48.
METHOD AND APPARATUS TO REDUCE MEMORY IN A NAND FLASH DEVICE TO STORE PAGE RELATED INFORMATION
The size of page map memory in a NAND flash device used to store page related information is decreased by embedding page type in a row address. The row address is received by the NAND flash device from the host on the data bus in a six-cycle sequence. The received row address is used to decode a physical page address received during the row address cycle to obtain a word line and a block segment number for a block segment in the word line in the NAND flash array. A same block segment number is used for each page type in the block segment.
Systems, apparatuses and methods may provide for technology that includes a charge pump and applies a program voltage from the charge pump to selected wordlines in the NAND memory. The technology may also conduct a discharge of the program voltage from the charge pump and maintain a connection between the selected wordlines and a pass voltage of the charge pump while the program voltage is being discharged. In one example, the connection between the selected wordlines and the pass voltage prevents the selected wordlines from floating.
An embodiment of an apparatus may include a substrate, a memory array of vertical 3D NAND strings formed in the substrate, a staircase region formed in the substrate, a polysilicon wordline extended horizontally on a step of the staircase region, a wordline contact extended vertically through the staircase region to make electrical contact with the polysilicon wordline, and an etch stop material formed around the wordline contact and on the polysilicon wordline, where the etch stop material extends to an outside corner of the step, the etch stop material is absent from a sidewall of the step, and the etch stop material is undercut at the outside corner of the step. Other embodiments are disclosed and claimed.
H01L 27/11556 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H01L 27/11582 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
G11C 5/02 - Disposition of storage elements, e.g. in the form of a matrix array
H01L 23/538 - Arrangements for conducting electric current within the device in operation from one component to another the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
An embodiment of an apparatus may include a substrate with alternated layers of conductor material and insulator material, a vertical channel through at least four of the alternated layers of the substrate, where an edge of the layers of insulator material abuts an edge of the vertical channel, and a memory cell on the vertical channel disposed in a layer of conductor material between two layers of the insulator material, where the memory cell comprises a control gate disposed in a recess of the layer of conductor material between the two layers of the insulator material, a trap base disposed in the recess between the control gate and the edge of the vertical channel, and tunnel oxide material that covers the trap base and extends into the vertical channel outside of the recess and beyond the edge of the two layers of insulator material. Other embodiments are disclosed and claimed.
H01L 27/11556 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H01L 29/423 - Electrodes characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
G11C 5/02 - Disposition of storage elements, e.g. in the form of a matrix array
H01L 29/788 - Field-effect transistors with field effect produced by an insulated gate with floating gate
G11C 5/06 - Arrangements for interconnecting storage elements electrically, e.g. by wiring
Skip program verify for dynamic start voltage (DSV) sampling reduces latency of a program operation on multi-level cell (MLC) memory having at least two pages and programmable with multiple threshold voltage levels, such as a Triple Level Cell (TLC) NAND device. The NAND device skips program verifies corresponding to higher levels of voltage thresholds during DSV sampling. As a result, the NAND device can reduce a total program time (tPROG) to program the MLC memory, and determine the dynamic start program voltage more quickly. The NAND device can improve an effective TLC NAND tPROG by as much as 2% without impacting the placement of the first sub-block being programmed. The skipped program verifies corresponding to the higher levels of voltage thresholds are resumed as soon as DSV sampling is complete.
Embodiments of the present disclosure are directed to organic spacers for integrated circuits. Among other things, the organic spacers of the embodiments of the present disclosure help provide a cost-efficient and effective solution to address issues such as coefficient of thermal expansion (CTE) mismatches, dynamic warpage, and solder joint reliability (SJR). Other embodiments may be described and claimed.
H01L 23/373 - Cooling facilitated by selection of materials for the device
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 21/48 - Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups or
An embodiment of an apparatus may include a chuck body, and a surface formed on the chuck body to hold a wafer, where the surface has a non-flat shape. Other embodiments are disclosed and claimed.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
55.
ADDITIONAL SILICIDE LAYER ON TOP OF STAIRCASE FOR 3D NAND WL CONTACT CONNECTION
An embodiment of an apparatus may include a substrate, a memory array of vertical 3D NAND strings formed in the substrate, a staircase region formed in the substrate, a polysilicon wordline extended horizontally into the staircase region, a wordline contact extended vertically through the staircase region to make electrical contact with the polysilicon wordline, and a punch stop layer disposed between the wordline contact and the polysilicon wordline. Other embodiments are disclosed and claimed.
G11C 16/04 - Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
G11C 8/14 - Word line organisationWord line lay-out
H01L 27/11524 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by the memory core region with cell select transistors, e.g. NAND
H01L 27/11556 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H01L 27/1157 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by the memory core region with cell select transistors, e.g. NAND
H01L 27/11582 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
56.
DYNAMIC NEGATIVE CHARGE PUMP FOR NON-VOLATILE MEMORY
An example of an apparatus may include NAND memory and circuitry coupled to the NAND memory to monitor a sense voltage for an operation associated with a wordline of the NAND memory, and adjust a negative charge pump for the wordline prior to completion of the operation based on the monitored sense voltage. Other examples are disclosed and claimed.
An apparatus is described. The apparatus includes a flash memory chip having a self-aligned dielectric fill between pillars. The self-aligned dielectric fill extends through a polysilicon layer. The pillars have respective access transistors formed with the polysilicon layer. The self-aligned dielectric fill to electrically isolate the pillars.
A semiconductor circuit includes multiple decks of semiconductor devices, each deck having multiple three-dimensional (3D) stacks. The semiconductor circuit has a nitride layer between the first deck and the second deck. The nitride layer has a self-aligned pillar through the nitride layer to electrically connect the first deck to the second deck. The nitride layer can have multiple sublayers, with a mirrored gradient doping, with lower doping toward the middle of the nitride layer and higher doping toward the outsides of the nitride layer that interfaces with the decks.
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
H01L 23/535 - Arrangements for conducting electric current within the device in operation from one component to another including internal interconnections, e.g. cross-under constructions
59.
STATIC VOLTAGE REGULATOR WITH TIME-INTERLEAVED CHARGE PUMP
An example of an apparatus may include NAND memory and circuitry coupled to the NAND memory to control access to the NAND memory as two or more groups of memory cells, provide independent operations for the two or more groups of memory cells, share a voltage regulator among at least two of the two or more groups of memory cells, and provide a target constant voltage from the shared voltage regulator to a target group of the two or more groups of memory cells in an independent operation for the target group. Other examples are disclosed and claimed.
G11C 11/4074 - Power supply or voltage generation circuits, e.g. bias voltage generators, substrate voltage generators, back-up power, power control circuits
An example of an apparatus may include NAND memory and circuitry coupled to the NAND memory to provide duty cycle correction (DCC) for one or more write paths of the NAND memory. Other examples are disclosed and claimed.
Systems, apparatuses, and methods provide for technology that stores a sampled dynamic start voltage value based on a fast to program plane. A current multi-plane program operation is received corresponding to a current cell block and wordline pair associated with a current enabled plane of a plurality of enabled planes. A block list is scanned based on the current cell block and wordline pair. The block list includes a plurality of entries including a reference start voltage corresponding to a reference cell block and wordline pair associated with a reference enabled plane. Additionally, the reference start voltage is reused as a dynamic start voltage in response to finding a match between the current cell block and wordline pair as compared to the reference cell block and wordline pair. Such a match is performed only for a least enabled plane of the plurality of enabled planes.
Technology herein provides a performance-enhanced memory device including a memory array including a local word line circuit and a plurality of local word lines coupled to the local word line circuit, a word line (WL) sense circuit coupled to an access node in the local word line circuit, the WL sense circuit to sense a voltage level in the local word line circuit while bypassing a disturbance to operation of the local word lines and to provide an output signal that indicates when the voltage level has reached a high voltage threshold value to enable a read operation. The technology also provides read logic coupled to the WL sense circuit, the read logic to receive the output signal from the WL sense circuit, and trigger a read operation for one or more cells in the memory array when the output signal indicates that the voltage level has reached the high voltage threshold value.
Systems, apparatuses, and methods may provide for technology that groups a plurality of wordline drivers together and supports these grouped wordline drivers via a shared multiplexer, a shared level shifter, and/or one or more shared multi-well level shifters. In one example, such technology includes a shared multiplexer and a first and second grouped global wordline driver coupled to the shared multiplexer. The shared multiplexer is to access data state information from a plurality of memory cells. The first grouped global wordline driver is to output a first plurality of wordlines associated with a first plane. The second grouped global wordline driver is to output a second plurality of wordlines associated with a second plane, where the second plane is different than the first plane.
An embodiment of a memory device may include a substrate, a first memory array of three-dimensional (3D) NAND cells disposed on the substrate, an isolation trench disposed on the substrate adjacent to the first memory array, and an input/output (IO) contact positioned within the isolation trench. Other embodiments are disclosed and claimed.
H01L 27/11575 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by the boundary region between the core and peripheral circuit regions
H01L 27/11548 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by the boundary region between the core and peripheral circuit regions
H01L 27/11556 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H01L 27/11582 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
65.
LEAN COMMAND SEQUENCE FOR MULTI-PLANE READ OPERATIONS
Systems, apparatuses and methods may provide for technology that generates address information for a plurality of planes in NAND memory, excludes column information from the address information, and sends a read command sequence to the NAND memory, wherein the read command sequence includes the address information. In one example, the technology also excludes plane confirm commands and busy cycles from the read command sequence.
Systems, apparatuses, and methods may provide for technology for forming extended air gaps for bitline contacts. For example, such technology patterns and etches a dielectric layer and a bitline layer to create bitline contacts in a memory die. An air gap dielectric layer is deposited to form an air gap between adjacent bitline contacts, and wherein the air gap has a height dimension that extends past a height dimension of the bitline contacts.
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
H01L 23/535 - Arrangements for conducting electric current within the device in operation from one component to another including internal interconnections, e.g. cross-under constructions
H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
67.
PAGE MAP RENUMBERING TO REDUCE ERROR CORRECTION FAILURES AND IMPROVE PROGRAM TIME UNIFORMITY
Systems, apparatuses and methods may provide for technology that detects a request to program a NAND memory containing a plurality of dies and programs the NAND memory on a stripe-by-stripe basis, wherein each stripe spans the plurality of dies and includes multiple types of pages. The multiple types of pages may reduce program time variability across the stripes and reduce the error susceptibility of the NAND memory.
A memory array including a varying width channel is disclosed. The array includes a plurality of WLs, which are above a layer, where the layer can be, for example, a Select Gate Source (SGS) of the memory array, or an isolation layer to isolate a first deck of the array from a second deck of the array. The channel extends through the plurality of word lines and at least partially through the layer. In an example, the channel comprises a first region and a second region. The first region of the channel has a first width that is at least 1 nm different from a second width of the second region of the channel. In an example, the first region extends through the plurality of word lines, and the second region extends through at least a part of the layer underneath the plurality of word lines. In one case, the first width is at least 1 nm less than a second width of the second region of the channel.
H01L 27/11556 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H01L 27/11582 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H01L 27/11524 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by the memory core region with cell select transistors, e.g. NAND
H01L 27/1157 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by the memory core region with cell select transistors, e.g. NAND
G11C 8/14 - Word line organisationWord line lay-out
69.
Block-to-block isolation and deep contact using pillars in a memory array
An integrated circuit memory includes a first memory block and an adjacent second memory block. The first memory block comprises a first memory pillar around which a first memory cell is formed. The second memory block comprises a second memory pillar around which a second memory cell is formed. An isolation or slit area between the first and second memory blocks electrically isolates the first and second memory blocks. In an example, the slit area comprising a slit pillar around which no memory cells are formed. The slit pillar is a dummy pillar, and insulator material electrically isolates the slit pillar from a Word Line (WL) through which it passes. The isolation layer electrically can also isolate a (WL) of the first memory block from a corresponding WL of the second memory block. In an example, the slit pillar and the memory pillars have at least in part similar structures.
G11C 16/08 - Address circuitsDecodersWord-line control circuits
G11C 16/04 - Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
H10B 43/27 - EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H10B 43/50 - EEPROM devices comprising charge-trapping gate insulators characterised by the boundary region between the core and peripheral circuit regions
Systems, apparatuses and methods may provide for technology that sends a first command to a NAND die, sends first address information to the NAND die, and sends a second command to the NAND die, wherein the first command and the second command define a first command sequence and wherein the first address information signal a beginning of a first asynchronous read request from a first plurality of planes. In one example, the technology also sends a second command sequence and second address information to the NAND die wherein the second command sequence signals an end of the first asynchronous read request.
Systems, apparatuses and methods may provide for memory cell technology comprising a control gate, a conductive channel, and a charge storage structure coupled to the control gate and the conductive channel, wherein the charge storage structure includes a polysilicon layer and a metal layer. In one example, the metal layer includes titanium nitride or other high effective work function metal.
H01L 27/1157 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by the memory core region with cell select transistors, e.g. NAND
H01L 21/28 - Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups
H01L 29/423 - Electrodes characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
H01L 29/792 - Field-effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistor
72.
DUMMY WORDLINE CONTACTS TO IMPROVE ETCH MARGIN OF SEMI-ISOLATED WORDLINES IN STAIRCASE STRUCTURES
A memory device with a three-dimensional (3D) staircase memory stack includes dummy connectors proximate semi-isolated connectors. The memory device includes multiple wordlines stacked in a 3D staircase stack, which includes a wordline at an edge of a region of the staircase. The memory device includes vertical connectors through an isolation layer on the 3D staircase stack to connect the wordlines with conductive lines in an access layer. A wordline at the edge of the region of the staircase has a vertical connector that will be adjacent a connector on one side and not on the other side. The memory device includes at least one dummy vertical connector on the edge side of the vertical connector of the wordline on the edge, wherein the dummy vertical connector does not electrically connect a wordline of the 3D staircase stack to a conductive line in the access layer.
G11C 8/14 - Word line organisationWord line lay-out
H01L 27/11519 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by the top-view layout
H01L 27/11556 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H01L 27/11524 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by the memory core region with cell select transistors, e.g. NAND
An embodiment of a memory device may comprise a vertical channel, a first memory cell formed on the vertical channel, a first wordline coupled to the first memory cell, a second memory cell formed on the vertical channel immediately above the first memory cell, a second wordline coupled to the second memory cell, and an airgap disposed between the first wordline and the second wordline. Other embodiments are disclosed and claimed.
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
H01L 27/11556 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H01L 27/11529 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by the peripheral circuit region of memory regions comprising cell select transistors, e.g. NAND
H01L 27/11582 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H01L 27/11573 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by the peripheral circuit region
An embodiment of a memory device may include a full block memory array of a lower tile of 3D NAND string memory cells, a full block memory array of an upper tile of 3D NAND string memory cells, a first portion of a string driver circuit coupled to the full block memory array of the lower tile, a second portion of the string driver circuit coupled to the full block memory array of the upper tile, a first split block memory array of the lower tile coupled to the first portion of the string driver circuit, and a second split block memory array of the upper tile coupled to the second portion of the string driver circuit. Other embodiments are disclosed and claimed.
Systems, apparatuses, and methods may provide for technology that gap-fills stairwells for memory devices. The memory device is manufactured by forming a liner film on a trench of a stairwell layer of the memory device; depositing a doped silicon dioxide film on the liner film, wherein doping of the doped silicon dioxide film is performed during the deposition; and performing a pressurized and steamed anneal on the doped silicon dioxide film deposited on the liner film to form a reflowed doped silicon dioxide film.
H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
H01L 23/535 - Arrangements for conducting electric current within the device in operation from one component to another including internal interconnections, e.g. cross-under constructions
H01L 27/11556 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H01L 27/11582 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
Systems, apparatuses, and methods may provide for technology for forming a gate polysilicon for 3D-NAND complementary metal-oxide semiconductor under array (CuA) on a substrate with a barrier and spacer structure. For example, the technology includes forming a titanium nitride (TiN) barrier adjacent the gate polysilicon and forming a silicon nitride (SiN) spacer around the polysilicon gate and the titanium nitride barrier.
H01L 27/1157 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by the memory core region with cell select transistors, e.g. NAND
H01L 27/11524 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by the memory core region with cell select transistors, e.g. NAND
H01L 27/11556 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H01L 27/11582 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
77.
STAGGERED READ RECOVERY FOR IMPROVED READ WINDOW BUDGET IN A THREE DIMENSIONAL (3D) NAND MEMORY ARRAY
After reading a 3D (three dimensional) NAND array, the wordlines of the 3D NAND array can be transitioned to ground in a staggered manner. The 3D NAND array includes a 3D stack with multiple wordlines vertically stacked, including a bottom-most wordline, a top-most wordline, and middle wordlines between the bottom-most wordline and the top-most wordline. A controller that controls the reading can set the multiple wordlines to a read voltage for reading operations and then transition a selected wordline of the multiple wordlines from the read voltage to ground prior to transitioning the other wordlines to ground. Thus, the controller will transition the other wordlines from the read voltage to ground after a delay.
G11C 11/4074 - Power supply or voltage generation circuits, e.g. bias voltage generators, substrate voltage generators, back-up power, power control circuits
G11C 7/04 - Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects
78.
PROGRAM VERIFY PROCESS HAVING PLACEMENT AWARE PRE-PROGRAM VERIFY (PPV) BUCKET SIZE MODULATION
An apparatus is described. An apparatus includes controller logic circuitry to perform a program-verify programming process to a flash memory chip. The program-verify programming process is to reduce a size of a pre-program verify (PPV) bucket in response to a number of cells being fully programmed to a same digital state. The number of cells are less than a total number of cells to be programmed to the same digital state.
Three-dimensional (3D) NAND components formed with control circuitry split across two wafers can provide for more area for control circuitry for an array, enabling improved 3D NAND system performance. In one example, a 3D NAND component includes a first die including a three-dimensional (3D) NAND array and first complementary metal oxide semiconductor (CMOS) control circuitry to access the 3D NAND array, and a second die vertically stacked and bonded with the first die, the second die including second CMOS control circuitry to access the 3D NAND array of the first die.
H01L 23/00 - Details of semiconductor or other solid state devices
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H01L 25/00 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices
Systems, apparatuses and methods may provide for technology that applies a first set of control signals to even bitlines in NAND memory and senses voltage levels of the even bitlines during an even sensing time period. The technology may also apply a second set of control signals to odd bitlines in the NAND memory, and sense voltage levels of the odd bitlines during an odd sensing time period, wherein the second set of control signals are applied after expiration of a stagger time period between the even sensing time period and the odd sensing time period.
Systems, apparatuses and methods may provide for technology that boosts strings of a plurality of NAND sub-blocks to a pass voltage, deboosts a first subset of the boosted strings based on data associated with the plurality of NAND sub-blocks, and simultaneously programs the first subset while a second subset of the boosted strings remain at the pass voltage. In one example, to boost the strings of the NAND sub-blocks, the technology applies the pass voltage to selected and unselected wordlines that are connected to the NAND sub-blocks while selected and unselected strings are disconnected from a bitline that receives the data associated with the NAND sub-blocks.
Systems, apparatuses and methods may provide for technology that biases a word line of a block in NAND memory to a first voltage level, biases a source-side select gate and a drain-side select gate of the block to a second voltage level, and issues a discharge erase pulse to bitlines and a source of the block, wherein the discharge erase pulse is issued at a third voltage level, wherein the third voltage level is greater than the first voltage level and the second voltage level, and wherein the third voltage level is less than a fourth voltage level of a standard erase pulse. In one example, the discharge erase pulse injects holes into pillars of the block and bypasses an erase of cells in the pillars of the block.
G11C 16/08 - Address circuitsDecodersWord-line control circuits
G11C 7/04 - Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects
G11C 16/16 - Circuits for erasing electrically, e.g. erase voltage switching circuits for erasing blocks, e.g. arrays, words, groups
Sensing circuits and techniques for NAND memory that can enable improved read disturb on the selected SGS are described herein. In one example, a reverse sensing circuit includes circuitry coupled with a bitline of the string of NAND memory cells to perform a sensing operation. The circuitry charges the bitline of the string of NAND memory cells to a target bitline voltage and applies a voltage to the source line that is higher than the bitline voltage. The sense current flows through the string from the source line to the bitline. The voltage at a sensing node that is indicative of a threshold voltage of a memory cell can then be detected.
Modulation of the source voltage in a NAND-flash array read waveform can enable improved read-disturb mitigation. For example, increasing the source line voltage to a voltage with a magnitude greater than the non-idle source voltage during the read operation when the array is idle (e.g., not during sensing) enables a reduction in read disturb without the complexity arising from the consideration of multiple read types. Additional improvement in FN disturb may also be obtained on the sub-blocks in the selected SGS by increasing the source line voltage during the selected wordline ramp when the array is idle.
An apparatus, a method, and a system. The method includes implementing an erase operation on a deck of a superblock, block or subblock of a three-dimensional (3D) non-volatile memory device to obtain an erased deck; applying a dummy read pulse to one or more wordlines (WLs) of a to-be-read deck of the superblock, block or subblock; and implementing, after application of the dummy read pulse, a read operation on one or more memory cells corresponding to the one or more WLs to read data from the one or more memory cells.
Systems, apparatuses, and methods provide for technology for distinguishing an erased state, a first pass programmed state, and a second pass programmed state of a memory page. A threshold voltage state verify sense is performed. A memory page status is determined based on the threshold voltage state verify sense. The memory page status is one of erased, programmed with first pass data, and programmed with second pass data based on the threshold voltage state verify sense. A program continuation is performed after a program interruption based on the memory page status.
G11C 11/56 - Digital stores characterised by the use of particular electric or magnetic storage elementsStorage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
G11C 16/04 - Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
For a nonvolatile (NV) storage media such as NAND media that is written by a program and program verify operation, the system can determine an expected number of SSPC (selective slow programming convergence) cells for a page of cells for specific conditions of the page. The system can perform program verify with a first wordline (WL) select voltage for SSPC cell detection for a first write of the page to detect the expected number of SSPC cells. Based on the determined expected number of SSPC cells, the system can set a boost voltage to capture an expected number of SSPC cells during the program verify operation. The system performs program verify for subsequent writes to the page with a higher WL select voltage, to perform program verify for standard cells and then SSPC program verify with the boost voltage determined from the first write.
Embodiments of the present disclosure are directed towards a memory device including a top wordline contact located in a region that is protected from erosion during a planarization process, e.g., chemical mechanical polish (CMP). In embodiments, a plurality of wordlines are formed in a stack of multiple layers and a plurality of wordline contacts are formed to intersect with the plurality of wordlines. In embodiments, the stack forms a staircase and each of the plurality of wordline contacts lands on a corresponding each of the wordlines proximate to an edge of the staircase such that a top wordline contact lands in a region on a top wordline previously covered by a sacrificial layer. In some embodiments, the region is proximate to a raised notch at an edge of the staircase. Other embodiments may be described and claimed.
H01L 27/11524 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by the memory core region with cell select transistors, e.g. NAND
H10B 41/20 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by three-dimensional arrangements, e.g. with cells on different height levels
H10B 41/35 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region with a cell select transistor, e.g. NAND
H10B 43/20 - EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels
H10B 43/35 - EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region with cell select transistors, e.g. NAND
89.
VERTICAL CHANNEL WITH CONDUCTIVE STRUCTURES TO IMPROVE STRING CURRENT
A vertical channel of a three-dimensional (3D) NAND has a recessed and filled drain/source pocket region for each memory cell to reduce resistance in a region that traditionally has high resistance. The vertical channel conducts current whose resistivity is controlled through a series of memory cells. The vertical channel can have a polysilicon material to conduct current past the memory cell gates and drain/sources region between the memory elements. The recess can extend the polysilicon away from a center of the vertical channel and closer to the control gates. The recess includes a structure to reduce resistance in the drain/source region along the vertical channel between memory cell gates.
H01L 27/11582 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H01L 27/11556 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
H01L 27/1157 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by the memory core region with cell select transistors, e.g. NAND
H01L 27/11524 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with floating gate characterised by the memory core region with cell select transistors, e.g. NAND
90.
MEMORY CELL SENSING CIRCUIT WITH ADJUSTED BIAS FROM PRE-BOOST OPERATION
A sense circuit performs a multistage boost, including a boost during precharge operation and a boost during the standard boost operation. The sense circuit includes an output transistor to drive a sense output based on current through a sense node which drives a gate of the output transistor. The sense circuit includes a precharge circuit to precharge the sense node and the gate of the output transistor and a boost circuit to boost the sense node. The boost circuit can be boosted during precharge by a first boost voltage, resulting in a lower boost applied to the sense node after precharge. The boost circuit boosts up the sense node by a second boost voltage lower than the first boost voltage. The boost circuit boosts the sense node down by the full boost voltage of the first boost voltage plus the second boost voltage after sensing.
Etch stops are disclosed for integrated circuit applications that have a set contacts of varying height, wherein there is a large height differential between the shortest and tallest contacts. In one example, an etch stop is provisioned over a 3D NAND memory staircase structure. The structure is then planarized with an insulator material that can be selectively etched with respect to the etch stop. Contact holes that land on corresponding wordlines of the staircase are etched. Due to the nature of the staircase, the holes vary in depth depending on which step of the staircase they land. The etch stop under the shallowest hole remains intact while the deepest hole is etched to completion. Once all holes have landed on the etch stop, a further etch selective to the insulator material is carried out to punch through the etch stop and expose underlying wordlines. Contacts are deposited into the holes.
H10B 43/50 - EEPROM devices comprising charge-trapping gate insulators characterised by the boundary region between the core and peripheral circuit regions
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
H01L 23/528 - Layout of the interconnection structure
H01L 23/535 - Arrangements for conducting electric current within the device in operation from one component to another including internal interconnections, e.g. cross-under constructions
H10B 41/50 - Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the boundary region between the core region and the peripheral circuit region
H10B 43/27 - EEPROM devices comprising charge-trapping gate insulators characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels the channels comprising vertical portions, e.g. U-shaped channels
92.
Asymmetric junctions of high voltage transistor in NAND flash memory
The total silicon area used by a plurality of high voltage transistors in an array of NAND cells is reduced by modifying the silicon area layout such that the size of the source and drain of each of the plurality of high voltage transistors is dependent on the maximum voltage to be applied to each of the source and drain for the respective one of the plurality of high voltage transistors.
H01L 27/11 - Static random access memory structures
H01L 27/1158 - Electrically programmable read-only memories; Multistep manufacturing processes therefor with charge-trapping gate insulators, e.g. MNOS or NROM characterised by three-dimensional arrangements, e.g. with cells on different height levels with source and drain on different levels, e.g. with sloping channels
H01L 29/10 - Semiconductor bodies characterised by the shapes, relative sizes, or dispositions of the semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified, or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
G11C 16/04 - Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
93.
String current reduction during multistrobe sensing to reduce read disturb
A memory device comprising a memory array; and controller circuitry to apply a first pass voltage to a first plurality of unselected wordlines of the memory array during a string current sensing phase; and reduce the first pass voltage applied to the first plurality of unselected wordlines during a multistrobe sensing phase that follows the string current sensing phase.
G11C 11/34 - Digital stores characterised by the use of particular electric or magnetic storage elementsStorage elements therefor using electric elements using semiconductor devices
G11C 16/34 - Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
G11C 11/56 - Digital stores characterised by the use of particular electric or magnetic storage elementsStorage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
G11C 16/26 - Sensing or reading circuitsData output circuits
G11C 16/04 - Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
Systems, apparatuses and methods may provide for technology that resumes a program operation with respect to NAND memory during a first tier in response to a suspension counter reaching a first threshold and resumes the program operation with respect to the NAND memory during a second tier in response to the suspension counter reaching a second threshold. The technology may also resume the program operation with respect to the NAND memory during a third tier in response to the suspension counter reaching a third threshold. Additionally, the technology may service one or more read operations with respect to the NAND memory until the suspension counter reaches the first threshold during the first tier, until the suspension counter reaches the second threshold during the second tier, and until the suspension counter reaches the third threshold during the third tier.
A method is described. The method includes programming a column of flash storage cells in a direction along the column in which a parasitic transistor that resides between a cell being programmed and an immediately next cell to be programmed has lower resistivity as compared to a corresponding parasitic transistor that exists if the programming were to be performed in an opposite direction along the column.
An apparatus comprises a plurality of memory cells; a plurality of sense circuits, a sense circuit comprising a sense node selectively coupled to a bitline coupled to a first cell of the plurality of memory cells; and a controller to transpose a value indicative of a voltage of the first cell to the sense node; isolate the sense node from the bitline; and calibrate a parameter for the sense circuit based on outputs of the sense circuit for each of a plurality of different applied values of the parameter.
G06F 3/06 - Digital input from, or digital output to, record carriers
G11C 11/56 - Digital stores characterised by the use of particular electric or magnetic storage elementsStorage elements therefor using storage elements with more than two stable states represented by steps, e.g. of voltage, current, phase, frequency
G11C 16/26 - Sensing or reading circuitsData output circuits
G11C 16/04 - Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
97.
Method and apparatus to mitigate hot electron read disturbs in 3D NAND devices
An apparatus, a method, and a system. The method includes implementing an erase operation on a deck of a superblock, block or subblock of a three-dimensional (3D) non-volatile memory device to obtain an erased deck; applying a dummy read pulse to one or more wordlines (WLs) of a to-be-read deck of the superblock, block or subblock; and implementing, after application of the dummy read pulse, a read operation on one or more memory cells corresponding to the one or more WLs to read data from the one or more memory cells.
For a nonvolatile (NV) storage media such as NAND (not AND) media that is written by a program and program verify operation, the system can apply a smart prologue operation. A smart prologue operation can selectively apply a standard program prologue, to compute program parameters for a target subblock. The smart prologue operation can selectively apply an accelerated program prologue, applying a previously-computed program parameter for a subsequent subblock of a same block of the NV storage media. Application of a prior program parameter can reduce the need to compute program parameters for the other subblocks.
A method is described. The method includes performing the following on a flash memory chip: measuring a temperature of the flash memory chip; and, changing a program step size voltage of the flash memory chip because the temperature of the flash memory chip has changed.
An apparatus is described. The apparatus includes a non volatile memory chip. The non volatile memory chip includes an interface to receive access commands, a three dimensional array of non volatile storage cells, and, a controller to orchestrate removal of charge in a column of stacked ones of the non volatile storage cells after a verification process that determined whether or not a particular cell along the column was programmed with a correct charge amount. The removal of the charge pushes the charge out of the column by changing respective word line potentials along a particular direction along the column. Cells that are coupled to the column are programmed in the particular direction. Disturbance of neighboring cells during programming is less along the particular direction than a direction opposite that of the particular direction.
patents
