According to an example of the present disclosure, there is provided an apparatus comprising a first waveguide; at least one second waveguide including a coupler waveguide arranged to couple light to and from the first waveguide; a micro-electro-mechanical (MEMS) structure from which extends either the first waveguide and the coupler waveguide, or a first interaction portion of the apparatus and a second interaction portion of the apparatus; and an anchoring portion; wherein the MEMS structure is connected to the anchoring portion via a resiliently deformable element configured such that MEMS structure is movable, upon application of a force or perturbation, in a first direction to reduce or increase a first distance between the first waveguide and the first interaction portion; and wherein, upon movement of the MEMS structure: an optical characteristic of the first waveguide and/or an amount of light in the first waveguide is changed based on a first interaction between the first waveguide and the first interaction portion according to the first distance, and an amount of light in an interaction waveguide, among the at least one second waveguide, is changed according to a second interaction between the interaction waveguide and the second interaction portion.
G01B 11/14 - Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
G01P 15/093 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by photoelectric pick-up
G02B 6/35 - Optical coupling means having switching means
G02B 27/56 - Optics using evanescent waves, i.e. inhomogeneous waves
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
The disclosure provides an inertial sensor comprising, a fixed support structure, one or more test mass-sensing microresonators and one or more datum sensing microresonators supported on the fixed support structure, each microresonator supporting a corresponding optical resonance. The inertial sensor also comprises a micro-electromechanical structure including: a suspension structure anchored to the fixed support structure at an anchor point; one or more flexures coupled to the suspension structure; a test mass suspended from the suspension structure by the one or more flexures to be deflectable under the application of an inertial force on the micro-electromechanical structure, the test mass suspended to have respective deflection sense portions each facing and non-contiguous with one of the one or more test mass-sensing microresonators; the suspension structure comprising one or more rigid protrusions extending to locations proximate to the deflection sense portions of the test mass to provide datum sense portions each facing and non-contiguous with one of the one or more datum sensing microresonators, the datum sense portions being fixed relative to the anchor point and the test mass being deflectable relative to the datum sense portions. A change in a spacing between the deflection sense portions and the test mass-sensing microresonators due to an inertial force acting on the test mass causes a change in the optical resonance characteristics of the test mass-sensing microresonators, detectable to generate a sensing signal indicative of the inertial force on the test mass. A change in a spacing between the datum sense portions and the datum sensing microresonators due to undesired relative structural movements causes a change in the optical resonance characteristics of the datum sensing microresonators, detectable to generate an error signal usable to correct the measurement of the inertial force by the test mass-sensing microresonators.
G01C 19/5776 - Signal processing not specific to any of the devices covered by groups
G01C 19/5783 - Mountings or housings not specific to any of the devices covered by groups
G01P 15/093 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by photoelectric pick-up
G01P 15/097 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by vibratory elements
A micromechanical vibratory angular rate sensor comprising: a substrate; a micromechanical structure anchored to the substrate and comprising a pair of Coriolis masses and a linkage coupling the pair of Coriolis masses to allow the pair of Coriolis masses to oscillate towards and away from each other in antiphase along a drive axis; an actuator configured to, in use, drive oscillatory motion of the linked pair of Coriolis masses in the drive axis such that angular rotation of the pair of Coriolis masses around an axis orthogonal to the drive axis causes the pair of Coriolis masses to vibrate in a direction along a sense axis orthogonal to the drive axis and rotation axis; and an optical sensor arranged to sense the magnitude of the vibration of the pair of Coriolis masses in a direction along the sense axis, the sensed magnitude being indicative of the rate of rotation around the rotation axis. The pair of Coriolis masses comprises a first Coriolis mass and a second Coriolis mass shaped to have an extent in directions along the drive axis to overlap alongside each other in the drive axis.
Examples of the present disclosure provide a structure comprising: a photonic integrated circuit (PIC) layer, wherein at least one first gap is formed in the PIC layer to define at least one first portion, and the PIC layer comprises one or more optical structures each having a corresponding optical field and being located on an opposite side of one of the at least one first gap to one of the at least one first portion of the PIC layer; a micro-electro-mechanical system (MEMS) structural layer comprising a MEMS structure suspended adjacent to the at least one first portion of the PIC layer and defined by at least one second gap in the MEMS structural layer, the MEMS structure deflectable under the application of a force or a perturbation; and a sacrificial layer arranged to separate at least a first part of the PIC layer from at least a first part of the MEMS structural layer, wherein a first part of the sacrificial layer is absent such that the at least one first gap is open to the at least one second gap; wherein the at least one first portion of the PIC layer is mechanically coupled to the MEMS structure so as to move according to a deflection of the MEMS structure; and wherein a change in a spacing between the at least one first portion and an optical structure of the one or more optical structures causes a change in an optical field characteristic of that optical structure. The structure further comprises at least one coupling element, which provides mechanical coupling between the at least one first portion of the PIC layer and the MEMS structure. The at least one coupling element includes at least one first coupling element formed in a via through a part of the at least one first portion to a part of the MEMS structure. Examples of the present disclosure also provide a method of manufacturing the structure.
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
B81B 7/02 - Microstructural systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
G02B 6/293 - Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
G01C 19/5712 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
G01P 15/093 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by photoelectric pick-up
5.
CHIP-SCALE INERTIAL SENSOR AND INERTIAL MEASUREMENT UNIT
Inertial Sensors and Inertial Measurement Units are provided. In one example, the chip-scale inertial sensor (CSIS) is for detecting a rate of rotation of the CSIS about an axis. The CSIS comprises an optical vibratory gyroscope (OVG) for detecting a first rate of rotation of the CSIS about the axis. The OVG is configured to output a main signal corresponding to the first rate of rotation. The CSIS further comprises an optical Sagnac gyroscope (OSG) for concurrently detecting a second rate of rotation of the CSIS about the axis. The OSG is configured to output a supplementary signal corresponding to the second rate of rotation. The CSIS further comprises a microcontroller configured to receive one or more inputs based on the main signal and supplementary signal, and to determine, based on the one or more inputs, a corrected first rate of rotation of the CSIS about the axis.
G01C 19/64 - Gyrometers using the Sagnac effect, i.e. rotation-induced shifts between counter-rotating electromagnetic beams
G01C 19/5684 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially two-dimensional vibrators, e.g. ring-shaped vibrators the devices involving a micromechanical structure
G01C 25/00 - Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
G01P 15/14 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of gyroscopes
Inertial Sensors and Inertial Measurement Units are provided. In one example, the inertial sensor comprises one or more microresonators, each microresonator supporting a corresponding optical resonance. The inertial sensor further comprises a micro-electro-mechanical inertial test mass suspended adjacent to and non-contiguous with the one or more microresonators, the test mass deflectable under the application of an inertial force. The inertial sensor further comprises one or more electrodes for counteracting a deflection of the test mass with an electrostatic force. The inertial sensor further comprises one or more optical couplers for coupling light into and out of a corresponding microresonator. The inertial sensor further comprises one or more detectors for detecting light received from the one or more microresonators by the one or more optical couplers. A change in a spacing between the test mass and at least one microresonator causes a change in the optical resonance characteristics of that microresonator.
G01P 15/093 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by photoelectric pick-up
G01P 3/36 - Devices characterised by the use of optical means, e.g. using infrared, visible, or ultraviolet light
G01P 15/18 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration in two or more dimensions
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
Silicon chips; Semiconductor chips; Electronic chips; Computer chips; Multiprocessor chips; Integrated circuit chips; Downloadable software for use in calculating and communicating the response of mechanical structures to input forces. Software as a Service (SaaS); Software engineering; Software creation; Software design, development and maintenance; all of the aforesaid software being for use in calculating and communicating the response of mechanical structures to input forces.
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
Silicon chips; Semiconductor chips; Blank Electronic chips; Computer chips; Multiprocessor chips; Integrated circuit chips; Downloadable software for use in calculating and communicating the response of mechanical structures to input forces Software as a Service (SaaS); Software engineering; Software creation; Software design, development and maintenance; all of the aforesaid software being for use in calculating and communicating the response of mechanical structures to input forces
9.
CHIP-SCALE INERTIAL SENSOR AND INERTIAL MEASUREMENT UNIT
Inertial Sensors and Inertial Measurement Units are provided. In one example, the chip-scale inertial sensor is for detecting a rate of rotation of the inertial sensor about an axis. The inertial sensor comprises an optical vibratory gyroscope for detecting a first rate of rotation of the inertial sensor about the axis. The optical vibratory gyroscope is configured to output a main signal corresponding to the first rate of rotation. The inertial sensor further comprises an optical Sagnac gyroscope for concurrently detecting a second rate of rotation of the inertial sensor about the axis. The optical Sagnac gyroscope is configured to output a supplementary signal corresponding to the second rate of rotation. The inertial sensor further comprises a microcontroller configured to receive one or more inputs based on the main signal and supplementary signal. The microcontroller is further configured to determine, based on the one or more inputs, a corrected first rate of rotation of the inertial sensor about the axis.
G01C 19/64 - Gyrometers using the Sagnac effect, i.e. rotation-induced shifts between counter-rotating electromagnetic beams
G01C 19/56 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
G01C 19/5684 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using the phase shift of a vibration node or antinode of essentially two-dimensional vibrators, e.g. ring-shaped vibrators the devices involving a micromechanical structure
G01C 25/00 - Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
Inertial Sensors and Inertial Measurement Units are provided. In one example, the inertial sensor comprises oonnee or more microresonators, each microresonator supporting a corresponding optical resonance. The inertial sensor further comprises a micro-electro- mechanical inertial test mass suspended adjacent to and non-contiguous with the one or more microresonators, the test mass deflectable under the application of an inertial force. The inertial sensor further comprises one or more electrodes for counteracting a deflection of the test mass with an electrostatic force. The inertial sensor further comprises one or more optical couplers for coupling light into and out of a corresponding microresonator. The inertial sensor further comprises one or more detectors for detecting light received from the one or more microresonators by the one or more optical couplers. A change in a spacing between the test mass and at least one microresonator causes a change in the optical resonance characteristics of that microresonator.
G01P 15/093 - Measuring accelerationMeasuring decelerationMeasuring shock, i.e. sudden change of acceleration by making use of inertia forces with conversion into electric or magnetic values by photoelectric pick-up
G01C 19/5642 - Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams
G01V 1/18 - Receiving elements, e.g. seismometer, geophone
