Abrégé

According to an example of the present disclosure, there is provided an apparatus comprising a first waveguide; at least one second waveguide including a coupler waveguide arranged to couple light to and from the first waveguide; a micro-electro-mechanical (MEMS) structure from which extends either the first waveguide and the coupler waveguide, or a first interaction portion of the apparatus and a second interaction portion of the apparatus; and an anchoring portion; wherein the MEMS structure is connected to the anchoring portion via a resiliently deformable element configured such that MEMS structure is movable, upon application of a force or perturbation, in a first direction to reduce or increase a first distance between the first waveguide and the first interaction portion; and wherein, upon movement of the MEMS structure: an optical characteristic of the first waveguide and/or an amount of light in the first waveguide is changed based on a first interaction between the first waveguide and the first interaction portion according to the first distance, and an amount of light in an interaction waveguide, among the at least one second waveguide, is changed according to a second interaction between the interaction waveguide and the second interaction portion.

Classes IPC  ?

• G01B 11/14 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la distance ou la marge entre des objets ou des ouvertures espacés
• G01P 15/093 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs photo-électriques
• G02B 6/35 - Moyens de couplage optique comportant des moyens de commutation
• G02B 27/56 - Optique utilisant des ondes évanescentes, c.-à-d. ondes non homogènes
• G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré

Abrégé

The disclosure provides an inertial sensor comprising, a fixed support structure, one or more test mass-sensing microresonators and one or more datum sensing microresonators supported on the fixed support structure, each microresonator supporting a corresponding optical resonance. The inertial sensor also comprises a micro-electromechanical structure including: a suspension structure anchored to the fixed support structure at an anchor point; one or more flexures coupled to the suspension structure; a test mass suspended from the suspension structure by the one or more flexures to be deflectable under the application of an inertial force on the micro-electromechanical structure, the test mass suspended to have respective deflection sense portions each facing and non-contiguous with one of the one or more test mass-sensing microresonators; the suspension structure comprising one or more rigid protrusions extending to locations proximate to the deflection sense portions of the test mass to provide datum sense portions each facing and non-contiguous with one of the one or more datum sensing microresonators, the datum sense portions being fixed relative to the anchor point and the test mass being deflectable relative to the datum sense portions. A change in a spacing between the deflection sense portions and the test mass-sensing microresonators due to an inertial force acting on the test mass causes a change in the optical resonance characteristics of the test mass-sensing microresonators, detectable to generate a sensing signal indicative of the inertial force on the test mass. A change in a spacing between the datum sense portions and the datum sensing microresonators due to undesired relative structural movements causes a change in the optical resonance characteristics of the datum sensing microresonators, detectable to generate an error signal usable to correct the measurement of the inertial force by the test mass-sensing microresonators.

Classes IPC  ?

• G01C 19/5776 - Traitement de signal non spécifique à l'un des dispositifs couverts par les groupes
• G01C 19/5783 - Montages ou boîtiers non spécifiques à l'un des dispositifs couverts par les groupes
• G01P 15/093 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs photo-électriques
• G01P 15/097 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen d'éléments vibrants

Abrégé

A micromechanical vibratory angular rate sensor comprising: a substrate; a micromechanical structure anchored to the substrate and comprising a pair of Coriolis masses and a linkage coupling the pair of Coriolis masses to allow the pair of Coriolis masses to oscillate towards and away from each other in antiphase along a drive axis; an actuator configured to, in use, drive oscillatory motion of the linked pair of Coriolis masses in the drive axis such that angular rotation of the pair of Coriolis masses around an axis orthogonal to the drive axis causes the pair of Coriolis masses to vibrate in a direction along a sense axis orthogonal to the drive axis and rotation axis; and an optical sensor arranged to sense the magnitude of the vibration of the pair of Coriolis masses in a direction along the sense axis, the sensed magnitude being indicative of the rate of rotation around the rotation axis. The pair of Coriolis masses comprises a first Coriolis mass and a second Coriolis mass shaped to have an extent in directions along the drive axis to overlap alongside each other in the drive axis.

Classes IPC  ?

• G01C 19/574 - Details de structure ou topologie les dispositifs ayant deux masses de détection en mouvement en opposition de phase
• G01C 19/5726 - Traitement du signal

Abrégé

Examples of the present disclosure provide a structure comprising: a photonic integrated circuit (PIC) layer, wherein at least one first gap is formed in the PIC layer to define at least one first portion, and the PIC layer comprises one or more optical structures each having a corresponding optical field and being located on an opposite side of one of the at least one first gap to one of the at least one first portion of the PIC layer; a micro-electro-mechanical system (MEMS) structural layer comprising a MEMS structure suspended adjacent to the at least one first portion of the PIC layer and defined by at least one second gap in the MEMS structural layer, the MEMS structure deflectable under the application of a force or a perturbation; and a sacrificial layer arranged to separate at least a first part of the PIC layer from at least a first part of the MEMS structural layer, wherein a first part of the sacrificial layer is absent such that the at least one first gap is open to the at least one second gap; wherein the at least one first portion of the PIC layer is mechanically coupled to the MEMS structure so as to move according to a deflection of the MEMS structure; and wherein a change in a spacing between the at least one first portion and an optical structure of the one or more optical structures causes a change in an optical field characteristic of that optical structure. The structure further comprises at least one coupling element, which provides mechanical coupling between the at least one first portion of the PIC layer and the MEMS structure. The at least one coupling element includes at least one first coupling element formed in a via through a part of the at least one first portion to a part of the MEMS structure. Examples of the present disclosure also provide a method of manufacturing the structure.

Classes IPC  ?

• G02B 6/12 - Guides de lumièreDétails de structure de dispositions comprenant des guides de lumière et d'autres éléments optiques, p. ex. des moyens de couplage du type guide d'ondes optiques du genre à circuit intégré
• B81B 7/02 - Systèmes à microstructure comportant des dispositifs électriques ou optiques distincts dont la fonction a une importance particulière, p. ex. systèmes micro-électromécaniques [SMEM, MEMS]
• G02B 6/293 - Moyens de couplage optique ayant des bus de données, c.-à-d. plusieurs guides d'ondes interconnectés et assurant un système bidirectionnel par nature en mélangeant et divisant les signaux avec des moyens de sélection de la longueur d'onde
• G01C 19/5712 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p. ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant des masses entraînées dans un mouvement de rotation alternatif autour d'un axe les dispositifs comportant une structure micromécanique
• G01P 15/093 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs photo-électriques

Abrégé

Inertial Sensors and Inertial Measurement Units are provided. In one example, the chip-scale inertial sensor (CSIS) is for detecting a rate of rotation of the CSIS about an axis. The CSIS comprises an optical vibratory gyroscope (OVG) for detecting a first rate of rotation of the CSIS about the axis. The OVG is configured to output a main signal corresponding to the first rate of rotation. The CSIS further comprises an optical Sagnac gyroscope (OSG) for concurrently detecting a second rate of rotation of the CSIS about the axis. The OSG is configured to output a supplementary signal corresponding to the second rate of rotation. The CSIS further comprises a microcontroller configured to receive one or more inputs based on the main signal and supplementary signal, and to determine, based on the one or more inputs, a corrected first rate of rotation of the CSIS about the axis.

Classes IPC  ?

• G01C 19/64 - Gyromètres utilisant l'effet Sagnac, c.-à-d. des décalages induits par rotation de faisceaux électromagnétiques dans des directions opposées
• G01C 19/5684 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p. ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant le décalage de phase d'un nœud ou d'un anti-nœud de vibration de vibrateurs essentiellement à deux dimensions, p. ex. vibrateurs en forme d'anneau les dispositifs comportant une structure micromécanique
• G01C 25/00 - Fabrication, étalonnage, nettoyage ou réparation des instruments ou des dispositifs mentionnés dans les autres groupes de la présente sous-classe
• G01P 15/14 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en utilisant un gyroscope

Abrégé

Inertial Sensors and Inertial Measurement Units are provided. In one example, the inertial sensor comprises one or more microresonators, each microresonator supporting a corresponding optical resonance. The inertial sensor further comprises a micro-electro-mechanical inertial test mass suspended adjacent to and non-contiguous with the one or more microresonators, the test mass deflectable under the application of an inertial force. The inertial sensor further comprises one or more electrodes for counteracting a deflection of the test mass with an electrostatic force. The inertial sensor further comprises one or more optical couplers for coupling light into and out of a corresponding microresonator. The inertial sensor further comprises one or more detectors for detecting light received from the one or more microresonators by the one or more optical couplers. A change in a spacing between the test mass and at least one microresonator causes a change in the optical resonance characteristics of that microresonator.

Classes IPC  ?

• G01P 15/093 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs photo-électriques
• G01P 3/36 - Dispositifs caractérisés par l'emploi de moyens optiques, p. ex. en utilisant la lumière infrarouge, visible ou ultraviolette
• G01P 15/18 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération dans plusieurs dimensions

Produits et services

Silicon chips; Semiconductor chips; Electronic chips; Computer chips; Multiprocessor chips; Integrated circuit chips; Downloadable software for use in calculating and communicating the response of mechanical structures to input forces. Software as a Service (SaaS); Software engineering; Software creation; Software design, development and maintenance; all of the aforesaid software being for use in calculating and communicating the response of mechanical structures to input forces.

Produits et services

Silicon chips; Semiconductor chips; Blank Electronic chips; Computer chips; Multiprocessor chips; Integrated circuit chips; Downloadable software for use in calculating and communicating the response of mechanical structures to input forces Software as a Service (SaaS); Software engineering; Software creation; Software design, development and maintenance; all of the aforesaid software being for use in calculating and communicating the response of mechanical structures to input forces

Abrégé

Inertial Sensors and Inertial Measurement Units are provided. In one example, the chip-scale inertial sensor is for detecting a rate of rotation of the inertial sensor about an axis. The inertial sensor comprises an optical vibratory gyroscope for detecting a first rate of rotation of the inertial sensor about the axis. The optical vibratory gyroscope is configured to output a main signal corresponding to the first rate of rotation. The inertial sensor further comprises an optical Sagnac gyroscope for concurrently detecting a second rate of rotation of the inertial sensor about the axis. The optical Sagnac gyroscope is configured to output a supplementary signal corresponding to the second rate of rotation. The inertial sensor further comprises a microcontroller configured to receive one or more inputs based on the main signal and supplementary signal. The microcontroller is further configured to determine, based on the one or more inputs, a corrected first rate of rotation of the inertial sensor about the axis.

Classes IPC  ?

• G01C 19/64 - Gyromètres utilisant l'effet Sagnac, c.-à-d. des décalages induits par rotation de faisceaux électromagnétiques dans des directions opposées
• G01C 19/56 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p. ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis
• G01C 19/5684 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p. ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant le décalage de phase d'un nœud ou d'un anti-nœud de vibration de vibrateurs essentiellement à deux dimensions, p. ex. vibrateurs en forme d'anneau les dispositifs comportant une structure micromécanique
• G01C 25/00 - Fabrication, étalonnage, nettoyage ou réparation des instruments ou des dispositifs mentionnés dans les autres groupes de la présente sous-classe

Abrégé

Inertial Sensors and Inertial Measurement Units are provided. In one example, the inertial sensor comprises oonnee or more microresonators, each microresonator supporting a corresponding optical resonance. The inertial sensor further comprises a micro-electro- mechanical inertial test mass suspended adjacent to and non-contiguous with the one or more microresonators, the test mass deflectable under the application of an inertial force. The inertial sensor further comprises one or more electrodes for counteracting a deflection of the test mass with an electrostatic force. The inertial sensor further comprises one or more optical couplers for coupling light into and out of a corresponding microresonator. The inertial sensor further comprises one or more detectors for detecting light received from the one or more microresonators by the one or more optical couplers. A change in a spacing between the test mass and at least one microresonator causes a change in the optical resonance characteristics of that microresonator.

Classes IPC  ?

• G01P 15/093 - Mesure de l'accélérationMesure de la décélérationMesure des chocs, c.-à-d. d'une variation brusque de l'accélération en ayant recours aux forces d'inertie avec conversion en valeurs électriques ou magnétiques au moyen de capteurs photo-électriques
• G01C 19/5642 - Dispositifs sensibles à la rotation utilisant des masses vibrantes, p. ex. capteurs vibratoires de vitesse angulaire basés sur les forces de Coriolis utilisant des barres ou des poutres vibrantes
• G01V 1/18 - Éléments récepteurs, p. ex. sismomètre, géophone