Abstract

The document relates to a method of producing a product comprising a substrate with at least one 2D-patterned layer from a multilayer material (1), wherein the multilayer material (1) is passed through at least one nip (6, 6a, 5 6b), provided by a milling cutter (51, 51a, 51b) cooperating with a patterned cliche cylinder (52, 52a, 52b), to selectively remove predetermined portions of material from at least a first layer (10) of the multilayer material (1) in accordance with a pattern of the patterned cliché cylinder (52, 52a, 52b), whereby the 2D-patterned layer is formed from the first layer (10). The method comprises: providing the multilayer material (1) comprising at least the first layer (10) and a second layer (20); feeding the multilayer material (1) through a first such nip (6, 6a) to partially, as seen in a thickness direction of the first layer (10), remove at least some of the predetermined portions of material from the first layer (10); and feeding the multilayer material (1) through a second such nip (6, 6b) to remove a remainder of said at least some of the predetermined portions of material.

IPC Classes  ?

• H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching

Abstract

The document relates to a method of producing a product comprising a substrate with at least one 2D-patterned layer from a multilayer material (1), wherein the multilayer material (1) is passed through at least one nip (6, 6a, 5 6b), provided by a milling cutter (51, 51a, 51b) cooperating with a patterned cliché cylinder (52, 52a, 52b), to selectively remove predetermined portions of material from at least a first layer (10) of the multilayer material (1) in accordance with a pattern of the patterned cliché cylinder (52, 52a, 52b), whereby the 2D-patterned layer is formed from the first layer (10). The method comprises; providing the multilayer material (1) comprising at least the first layer (10) and a second layer (20); feeding the multilayer material (1) through a first such nip (6, 6a) to partially, as seen in a thickness direction of the first layer (10), remove at least some of the predetermined portions of material from the first layer (10); and feeding the multilayer material (1) through a second such nip (6, 6b) to remove a remainder of said at least some of the predetermined portions of material.

IPC Classes  ?

• H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
• B32B 38/10 - Removing layers, or parts of layers, mechanically or chemically
• B23C 5/00 - Milling-cutters

Abstract

A method for milling flex foil includes providing a web (14) of flex foil including a substrate; a first conductive layer arranged on one surface of the substrate; a second conductive layer arranged on an opposite surface of the substrate; a first insulating layer arranged adjacent to the first conductive layer; and a second insulating layer arranged adjacent to the second conductive layer. The method includes dry milling one side of the web using a milling wheel (20-1) and a first cliche pattern (25-1) (including a rotating drum (24-1) and a flexible substrate (26-1)) including raised portions and non-raised portions to selectively remove at least one of the first conductive layer and the first insulating layer. The method includes dry milling an opposite side of the web using a milling wheel (20-2) and a second cliche pattern (25-2) including upper raised portions, lower raised portions and non-raised portions to selectively remove the second insulating layer.

IPC Classes  ?

• H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
• B02C 23/00 - Auxiliary methods or auxiliary devices or accessories specially adapted for crushing or disintegrating not provided for in groups or not specially adapted to apparatus covered by one only of groups
• B02C 23/14 - Separating or sorting of material, associated with crushing or disintegrating with more than one separator
• B02C 23/38 - Adding fluid, other than for crushing or disintegrating by fluid energy in apparatus having multiple crushing or disintegrating zones
• H05K 1/02 - Printed circuits Details
• H05K 1/03 - Use of materials for the substrate
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits

Abstract

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

IPC Classes  ?

• H05K 1/03 - Use of materials for the substrate
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/46 - Manufacturing multi-layer circuits
• B60R 16/02 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric

Abstract

A method for manufacturing a dual conductor laminated substrate includes providing a first laminate including a first insulating layer and a first conductive layer; defining a first trace pattern including one or more traces in the first laminate; providing a second laminate including a second insulating layer and a second conductive layer; defining a second trace pattern including one or more traces in the second laminate; defining access holes in the second insulating layer; at least one of depositing and stenciling a conductive material in the access holes of the second insulating layer; and aligning and attaching the first laminate to the second laminate to create a laminated substrate.

IPC Classes  ?

• H05K 1/09 - Use of materials for the metallic pattern
• H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
• H05K 1/03 - Use of materials for the substrate
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
• H05K 3/46 - Manufacturing multi-layer circuits
• B60R 16/02 - Electric or fluid circuits specially adapted for vehicles and not otherwise provided forArrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric

Abstract

A method for manufacturing a double-sided, single conductor laminate includes providing a laminated substrate that includes a conductive layer, an adhesive layer and a support layer; dry milling a trace pattern in the laminated substrate by removing selected areas of the conductive layer and the adhesive layer; and attaching a first cover layer using a first adhesive layer to the conductive layer. The first cover layer includes one or more precut access holes that align with one or more traces of the trace pattern.

IPC Classes  ?

• H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
• H01P 11/00 - Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type

Abstract

A method for milling flex foil includes providing a web of flex foil including a substrate; a first conductive layer arranged on one surface of the substrate; a second conductive layer arranged on an opposite surface of the substrate; a first insulating layer arranged adjacent to the first conductive layer; and a second insulating layer arranged adjacent to the second conductive layer. The method includes dry milling one side of the web using a first cliché pattern including raised portions and non-raised portions to selectively remove at least one of the first conductive layer and the first insulating layer. The method includes dry milling an opposite side of the web using a second cliché pattern including upper raised portions, lower raised portions and non-raised portions to selectively remove the second insulating layer.

IPC Classes  ?

• B02C 23/00 - Auxiliary methods or auxiliary devices or accessories specially adapted for crushing or disintegrating not provided for in groups or not specially adapted to apparatus covered by one only of groups
• B02C 23/14 - Separating or sorting of material, associated with crushing or disintegrating with more than one separator
• B02C 23/38 - Adding fluid, other than for crushing or disintegrating by fluid energy in apparatus having multiple crushing or disintegrating zones
• H05K 1/02 - Printed circuits Details
• H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits

Abstract

A method for milling flex foil includes providing a web of flex foil including a substrate; a first conductive layer arranged on one surface of the substrate; a second conductive layer arranged on an opposite surface of the substrate; a first insulating layer arranged adjacent to the first conductive layer; and a second insulating layer arranged adjacent to the second conductive layer. The method includes dry milling one side of the web using a first cliché pattern including raised portions and non-raised portions to selectively remove at least one of the first conductive layer and the first insulating layer. The method includes dry milling an opposite side of the web using a second cliché pattern including upper raised portions, lower raised portions and non-raised portions to selectively remove the second insulating layer.

IPC Classes  ?

• B02C 23/00 - Auxiliary methods or auxiliary devices or accessories specially adapted for crushing or disintegrating not provided for in groups or not specially adapted to apparatus covered by one only of groups
• H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits
• H05K 1/02 - Printed circuits Details
• B02C 23/38 - Adding fluid, other than for crushing or disintegrating by fluid energy in apparatus having multiple crushing or disintegrating zones
• B02C 23/14 - Separating or sorting of material, associated with crushing or disintegrating with more than one separator

Abstract

A method for manufacturing a double-sided, single conductor laminate includes providing a laminated substrate that includes a conductive layer, an adhesive layer and a support layer; dry milling a trace pattern in the laminated substrate by removing selected areas of the conductive layer and the adhesive layer; and attaching a first cover layer using a first adhesive layer to the conductive layer. The first cover layer includes one or more precut access holes that align with one or more traces of the trace pattern.

IPC Classes  ?

• H05K 3/04 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits