Abstract

In this method for manufacturing a bonded body, a bonded body comprising a first member, a second member, and a bonding part that includes a sintered body of a metal paste containing metal particles and that joins the first member and the second member is manufactured. The surface shape on the joining side of the second member is a quadrilateral having two pairs of parallel sides X and Y with all corners being right angles. The first member has a main surface that is wider than the quadrilateral. The method comprises: a step A for providing a metal paste coating in a predetermined pattern in a region corresponding to the quadrilateral on the main surface of the first member; a step B for placing the second member on the first member having the coating so as to align with the region to obtain a laminate; and a step C for forming the bonding part by sintering the coating of the laminate. In the step A, the pattern is a honeycomb arrangement of hexagons having three pairs of parallel sides a, b, and c at a predetermined interval, and the coating is provided in the region so as to satisfy the following conditions (i) and (ii). Condition (i): The side X and the side a of a hexagon are parallel to each other. Condition (ii): The side X does not overlap a gap between adjacent hexagons in a direction orthogonal to the side X.

IPC Classes  ?

• H01L 21/52 - Mounting semiconductor bodies in containers
• B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties

Abstract

A photosensitive resin composition for a permanent resist according to the present disclosure contains (A) an acid-modified vinyl group-containing resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, and (D) an isocyanate group-containing silane compound.

IPC Classes  ?

• G03F 7/075 - Silicon-containing compounds
• G03F 7/004 - Photosensitive materials
• H05K 1/03 - Use of materials for the substrate
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits

Abstract

Provided is an electrode active material layer which contains an electrode active material, wherein: the thickness of the electrode active material layer is 50 µm or more; the number of through passages, which reach a depth of 50 µm from the surface of the electrode active material layer, per unit area is 3.50 passages/µm2or more as determined by visualizing pores of the electrode active material layer in a three-dimensional image that is obtained by X-ray CT scanning of the electrode active material layer; and the density of the electrode active material layer is 1.20 g/cm3 or more.

IPC Classes  ?

• H01M 4/02 - Electrodes composed of, or comprising, active material
• H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
• H01M 4/133 - Electrodes based on carbonaceous material, e.g. graphite-intercalation compounds or CFx
• H01M 4/587 - Carbonaceous material, e.g. graphite-intercalation compounds or CFx for inserting or intercalating light metals

Abstract

A photosensitive resin composition containing (A) an acid-modified vinyl group-containing resin, (B) a thermosetting resin, (C) a photopolymerizable compound, (D) a photopolymerization initiator, and (E) an inorganic filler, wherein the inorganic filler (E) contains a first inorganic filler having an average particle size of 0.5 μm or more and a second inorganic filler having an average particle size of 0.3 μm or less, and the solid content mass ratio of the first inorganic filler content to the second inorganic filler content is 6:4 to 8:2.

IPC Classes  ?

• G03F 7/004 - Photosensitive materials

Abstract

Disclosed is a curable resin composition. The curable resin composition contains an epoxy compound, an inorganic filler, a coupling agent, and a polymerization initiator. The epoxy compound includes an alicyclic epoxy compound. The alicyclic epoxy compound content is 60 mass% or more based on the total amount of the epoxy compound.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08G 59/24 - Di-epoxy compounds carbocyclic
• C08K 3/013 - Fillers, pigments or reinforcing additives

Abstract

In this method for producing a composite sheet, particles are arranged on a surface of a sheet layer formed in a sheet shape, and pressure is applied in the thickness direction of the sheet layer, so that the particles are embedded in the sheet layer. In a method for producing another composite sheet, particles are arranged on a surface of a first sheet layer that is formed in a sheet shape and forms a part of a sheet layer, a second sheet layer that is formed in a sheet shape and forms a part of the sheet layer is disposed on the surface of the first sheet layer where the particles are arranged, and pressure is applied to the first sheet layer and the second sheet layer in an opposing direction between the first sheet layer and the second sheet layer, so that the particles are embedded in at least one of the first sheet layer and the second sheet layer. The composite sheet contains particles in the sheet layer, and the particles are distributed only within a certain range in the thickness direction of the sheet layer. The other composite sheet contains particles in the sheet layer, and the particles are arranged in a single layer such that the particles do not overlap in the thickness direction of the sheet layer.

IPC Classes  ?

• B29C 43/28 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of indefinite length incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
• C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
• H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation

Abstract

A photosensitive resin composition containing: (A) a resin having an ethylenically unsaturated bond and an acidic group; (B) a thermosetting resin; (C) a photopolymerizable compound; (D) a photopolymerization initiator; and (E) an inorganic filler, wherein the inorganic filler (E) contains a first inorganic filler having an average particle size of 0.5 μm or more and a second inorganic filler having an average particle size of 0.3 μm or less, and the solid content mass ratio of the first inorganic filler content to the second inorganic filler content is 6:4 to 8:2.

IPC Classes  ?

• G03F 7/004 - Photosensitive materials
• G03F 7/027 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
• G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable

Abstract

A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, a zeta potential of the abrasive grains is negative, the additive includes (A1) a 4-pyrone-based compound represented by General Formula (1) below, and a pH is 5.0 or more. A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, a zeta potential of the abrasive grains is negative, the additive includes (A2) a picolinic acid compound, and a pH is 5.0 or more. A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, a zeta potential of the abrasive grains is negative, the additive includes (A1) a 4-pyrone-based compound represented by General Formula (1) below, and a pH is 5.0 or more. A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, a zeta potential of the abrasive grains is negative, the additive includes (A2) a picolinic acid compound, and a pH is 5.0 or more. A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, a zeta potential of the abrasive grains is negative, the additive includes (A1) a 4-pyrone-based compound represented by General Formula (1) below, and a pH is 5.0 or more. A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, a zeta potential of the abrasive grains is negative, the additive includes (A2) a picolinic acid compound, and a pH is 5.0 or more. [In the formula, X11, X12, and X13 are each independently a hydrogen atom or a monovalent substituent.]

IPC Classes  ?

• C09K 3/14 - Anti-slip materialsAbrasives
• B24B 37/04 - Lapping machines or devicesAccessories designed for working plane surfaces
• C09K 13/00 - Etching, surface-brightening or pickling compositions

Abstract

A pressure-sensitive adhesive composition includes: a (meth)acrylic resin, photopolymerization initiator, and crosslinking agent, wherein the (meth)acrylic resin is a diblock copolymer of an X block and a Y block at a molar ratio from 40:60 to 95:5; the X block includes: structural unit (M-1) having a hydroxy, and structural unit (M-2) having an ethylenically unsaturated group; the Y block includes: structural unit (M-3) derived from ethylenically unsaturated compound (m-3) having an SP value of 20 (J/cm3)1/2 or less; at least one of structural units (M-1) to (M-3) is derived from a (meth)acryloyloxy group; a total amount of structural units (M-1) and (M-2) included in the X block is 18 to 95 mol % relative to all structural units in the X block; and a total amount of structural units (M-1) and (M-2) included in the Y block is 0 to 17 mol % relative to all structural units in the Y block.

IPC Classes  ?

• C09J 7/38 - Pressure-sensitive adhesives [PSA]
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping

Abstract

A permanent magnet manufacturing apparatus includes a compression molding mechanism and a magnetic field generating mechanism. The compression molding mechanism includes a pair of punches facing each other, and a tubular die into which the punches are inserted. The magnetic field generating mechanism includes a pair of coils. At least a part of the compression molding mechanism is disposed inside the coils. A raw material, containing magnet powder, supplied into the die is compressed by the punches while a magnetic field generated by the coil(s) is applied to the raw material. A permanent magnet manufacturing apparatus includes a compression molding mechanism and a magnetic field generating mechanism. The compression molding mechanism includes a pair of punches facing each other, and a tubular die into which the punches are inserted. The magnetic field generating mechanism includes a pair of coils. At least a part of the compression molding mechanism is disposed inside the coils. A raw material, containing magnet powder, supplied into the die is compressed by the punches while a magnetic field generated by the coil(s) is applied to the raw material. A direction of the magnetic field applied to the raw material is changed by at least one operation selected from a group consisting of a movement of an entirety of the magnetic field generating mechanism, a rotation of the entirety of the magnetic field generating mechanism, and a rotation of at least one of the coils.

IPC Classes  ?

• H01F 41/02 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformersApparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils or magnets
• B22F 3/03 - Press-moulding apparatus therefor

Abstract

A design assistance device is configured to assist design of a material in which a plurality of raw materials are to be formulated, by using a machine learning model that has learned a correspondence relationship between design condition information of a material, in which a plurality of raw materials are to be formulated, and property information of the material. The design assistance device includes a memory; and a processor connected to the memory and configured to store information of names and attributes of a plurality of registered raw materials, receive an input of information of a name and an attribute of a raw material to be newly registered, and store the received information, and generate a feature of the raw material inputtable to the machine learning model, from information that is selected as the design condition information and is information of attributes of a plurality of raw materials stored.

IPC Classes  ?

• G16C 60/00 - Computational materials science, i.e. ICT specially adapted for investigating the physical or chemical properties of materials or phenomena associated with their design, synthesis, processing, characterisation or utilisation
• G16C 20/70 - Machine learning, data mining or chemometrics

Abstract

The present disclosure relates to a photosensitive resin composition for a permanent resist, the photosensitive resin composition containing (A) an acid-modified vinyl group-containing resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) a thermosetting resin, and (E) a pigment, but not containing silica.

IPC Classes  ?

• G03F 7/004 - Photosensitive materials

Abstract

Provided is an arylalkyl-modified indene composition comprising a plurality of compounds, each of the compounds having one or more arylalkyl groups on an indene ring and differing from the others in the number of arylalkyl groups in one molecule. The content of the compound or compounds having a single arylalkyl group in one molecule is 1% or less in the composition at the percentage calculated on the basis of the area ratio in a GPC chart. At least one of the arylalkyl groups present in the composition is an arylalkyl group having a polymerizable unsaturated bond-containing group, while at least one of the arylalkyl groups present in the composition is an arylalkyl group having no polymerizable unsaturated bond-containing group.

IPC Classes  ?

• C08F 12/34 - Monomers containing two or more unsaturated aliphatic radicals
• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• C08J 5/18 - Manufacture of films or sheets
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• H05K 1/03 - Use of materials for the substrate

Abstract

The purpose of the present disclosure is to provide a thermosetting adhesive composition in which an increase over time in shear viscosity can be adequately suppressed and which can form an adhesive layer having a suitable degree of tack on a surface.　Disclosed is a thermosetting adhesive composition that contains an epoxy resin, a phenolic resin, a curing accelerator, an inorganic filler and an elastomer. The epoxy resin includes at least one type selected from the group consisting of liquid epoxy resins that are liquids at 25ºC and solid epoxy resins that are solids at 25°C. The phenolic resin includes at least one type selected from the group consisting of liquid phenolic resins that are liquids at 25ºC and solid phenolic resins that are solids at 25°C. The curing accelerator includes at least one type selected from the group consisting of liquid curing accelerators that are liquids at 25ºC and solid curing accelerators that are solids at 25°C. The total content of components that are liquids at 25°C is 5 mass% or more based on the total amount of the thermosetting adhesive composition. The content of liquid epoxy resins is 14 mass% or less based on the total amount of the thermosetting adhesive composition. The shear viscosity of the thermosetting adhesive composition at 95°C is 100-12,000 Pa·s.

IPC Classes  ?

• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• C09J 7/35 - Heat-activated
• C09J 11/06 - Non-macromolecular additives organic
• C09J 121/00 - Adhesives based on unspecified rubbers
• C09J 161/06 - Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
• H01L 21/52 - Mounting semiconductor bodies in containers
• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions

Abstract

This method for producing an aryl-alkylated indene composition involves: adding an arylalkyl group having a polymerizable unsaturated bond-containing group to an indene compound; and adding an arylalkyl group having no polymerizable unsaturated bond-containing group to the indene compound to which the arylalkyl group having a polymerizable unsaturated bond-containing group is added.

IPC Classes  ?

• C08F 12/00 - Homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• B32B 15/082 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising vinyl resinsLayered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising acrylic resins
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H05K 1/03 - Use of materials for the substrate

Abstract

Disclosed is a die bonding film. This die bonding film contains silver-containing particles produced through a reduction method, and a compound represented by formula (1). The silver-containing particle content is 70 mass% or more based on the total amount of the die bonding film. [In formula (1), R1, R2, R3, and R4each independently represent a hydrogen atom, a halogen atom, a methyl group that may be substituted with a halogen atom, or an ethyl group that may be substituted with a halogen atom.　However, at least one of R1, R2, R3, and R4 is a halogen atom, a methyl group that may be substituted with a halogen atom, or an ethyl group that may be substituted with a halogen atom.]

IPC Classes  ?

• H01L 21/52 - Mounting semiconductor bodies in containers
• C09J 7/35 - Heat-activated
• C09J 11/04 - Non-macromolecular additives inorganic
• C09J 11/06 - Non-macromolecular additives organic
• C09J 11/08 - Macromolecular additives
• C09J 201/00 - Adhesives based on unspecified macromolecular compounds
• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions

Abstract

The present invention provides a heat-conducting sheet having excellent adhesion to an adherend. A heat-conducting sheet (1) comprises: a heat-conducting layer (11) that contains a carbon-based material (A); and adhesive layers (12, 13) that include a resin component and a heat-conductive filler, and are positioned on at least part of the respective principal surfaces of the heat-conducting layer. The surface roughness of the adhesive layers is 7.0 μm or less.

IPC Classes  ?

• H01L 23/36 - Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks

Abstract

Provided is an arylalkyl-modified indene composition that contains a plurality of types of compounds having an arylalkyl group on an indene ring, the compounds having different numbers of arylalkyl groups in one molecule, wherein: the content of a compound in which the number of arylalkyl groups in one molecule is 1 is 1% or less as calculated from the area ratio of the GPC chart; at least one of the arylalkyl groups present in the composition has a polymerizable unsaturated bond-containing group; and at least one of the arylalkyl groups present in the composition does not have a polymerizable unsaturated bond-containing group.

IPC Classes  ?

• C08F 12/34 - Monomers containing two or more unsaturated aliphatic radicals
• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• C08J 5/18 - Manufacture of films or sheets
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• H05K 1/03 - Use of materials for the substrate

Abstract

Disclosed is a film, for temporary fixation, used in order to temporarily fix a semiconductor member, which includes a plurality of bump electrodes on one main surface of a semiconductor substrate, to a support member on the main surface side. The minimum melt viscosity of the film for temporary fixation is 60,000 Pa•s or less. The storage elastic modulus at 25°C of a cured product when the film for temporary fixation is cured at 170°C for 1 hour is 300 MPa or greater.

IPC Classes  ?

• H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
• C09J 7/30 - Adhesives in the form of films or foils characterised by the adhesive composition
• C09J 133/00 - Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereofAdhesives based on derivatives of such polymers
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
• H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

A photosensitive resin composition, containing: a binder polymer (A); a photopolymerizable compound (B) having at least one ethylenically unsaturated bond; and a photopolymerization initiator (C), in which the photopolymerization initiator (C) includes an oxime ester-based photopolymerization initiator, and a content of the oxime ester-based photopolymerization initiator is 0.3 parts by mass or more, with respect to a total of 100 parts by mass of the binder polymer (A) and the photopolymerizable compound (B).

IPC Classes  ?

• G03F 7/031 - Organic compounds not covered by group
• G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
• H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Abstract

A photosensitive resin composition contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, a dye, and a solvent, in which the solvent contains at least one selected from the group consisting of a ketone-based solvent having an alicyclic skeleton and an aromatic ether-based solvent.

IPC Classes  ?

• G03F 7/004 - Photosensitive materials
• G03F 7/031 - Organic compounds not covered by group
• G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
• H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Abstract

A method for manufacturing a conductive via-containing substrate is provided, the method including: step a of preparing a substrate provided with a hole and providing a metal paste part containing metal particles and a volatile solvent to cover at least a surface surrounding the hole of the substrate while an inside of the hole is filled with the metal paste part; step b of heating the metal paste part to remove a part of the volatile solvent; step c of removing a part of the metal paste part after heating to expose the surface to form a conductive via precursor in the hole, the conductive via precursor containing the metal particles and a residue of the volatile solvent and having a planarized exposed surface; and step d of firing the conductive via precursor.

IPC Classes  ?

• B22F 7/08 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
• B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
• B22F 1/054 - Nanosized particles
• B22F 1/107 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
• C23C 24/08 - Coating starting from inorganic powder by application of heat or pressure and heat
• H05K 1/09 - Use of materials for the metallic pattern
• H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
• H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits

Abstract

A production method for semiconductor packages according to the present disclosure includes: adhering an adhesive material to a surface of a first sealing material, peeling off the adhesive material from the surface of the first sealing material, and providing a second member to the surface of the first sealing material from which the adhesive material was peeled off.

IPC Classes  ?

• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• C09J 5/00 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers

Abstract

Provided is a resin composition containing a resin component, inorganic particles, and a compound containing an oxyalkylene structure, wherein the maximum particle diameter of the inorganic particles is 5 μm or less.

IPC Classes  ?

• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08K 3/36 - Silica
• C08K 7/18 - Solid spheres inorganic

Abstract

170170 at 170°C in a tensile measurement in the MD direction according to thermomechanical analysis (TMA) is 2.0% or less.

IPC Classes  ?

• H01L 23/28 - Encapsulation, e.g. encapsulating layers, coatings
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

A method for producing a conductive polymer dispersion, the method comprising a step for adding an electric conductivity improving agent to a dispersion that contains a conjugated conductive polymer and a polyanion and dispersing the same, wherein the step is performed at a liquid temperature of 30°C or higher.

IPC Classes  ?

• C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
• C08G 61/12 - Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
• C08K 5/053 - Polyhydroxylic alcohols
• C08K 5/1535 - Five-membered rings
• C08K 5/3415 - Five-membered rings
• C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chainCompositions of derivatives of such polymers
• H01G 9/00 - Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devicesProcesses of their manufacture

Abstract

122 i the thickness of the second resin layer, an absolute value R of the ratio of thickness difference represented by formula (1) is 8.0% or less. The range of variation in an amount of dimensional change in the longitudinal direction as found by a predetermined method is 60 ppm or less. The range of variation in an amount of dimensional change in the transverse direction is 60 ppm or less.

IPC Classes  ?

• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• B29B 11/16 - Making preforms characterised by structure or composition comprising fillers or reinforcements
• B29C 70/06 - Fibrous reinforcements only
• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
• H05K 1/03 - Use of materials for the substrate

Abstract

A sealing resin composition which comprises a curable resin component, a (meth)acrylic copolymer, and a filler, wherein the (meth)acrylic copolymer comprises a first polymer chain that includes a constituent unit derived from methyl methacrylate and a second polymer chain that includes a constituent unit derived from n-butyl acrylate.

IPC Classes  ?

• C08L 101/00 - Compositions of unspecified macromolecular compounds
• C08G 59/62 - Alcohols or phenols
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08K 5/13 - PhenolsPhenolates
• C08L 53/00 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

This powder feeder is for feeding a powder and includes a linear member and a scraping member having an insertion hole into which the linear member has been inserted. This powder feeding method is for feeding a powder using the powder feeder, and comprises adhering the powder to an end portion of the linear member, placing the end portion over a site to be fed, moving the linear member in a pulling-out direction in which the linear member is pulled out from the insertion hole, and scraping the powder adherent to the end portion with the scraping member.

IPC Classes  ?

• B01J 4/00 - Feed devicesFeed or outlet control devices
• G01F 13/00 - Apparatus for measuring by volume and delivering fluids or fluent solid materials, not provided for in the preceding groups
• G01N 1/04 - Devices for withdrawing samples in the solid state, e.g. by cutting

Abstract

A particle dispersion, containing: particles; and a liquid medium, in which a distance of a HSP value of the particles with respect to a HSP value of the liquid medium is 5.50 MPa0.5 or less.

IPC Classes  ?

• C09C 1/30 - Silicic acid

Abstract

This sealing resin composition contains a curable resin component, a (meth)acrylic copolymer, and a filler, and has a viscosity of 300 mPa∙s or less at 140°C.

IPC Classes  ?

• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

170170 at 170°C in a tensile measurement in the MD direction according to thermomechanical analysis (TMA) is 2.0% or less.

IPC Classes  ?

• H01L 23/28 - Encapsulation, e.g. encapsulating layers, coatings
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

This stator core includes a yoke formed in an annular shape, and a plurality of teeth extending from the yoke. The stator core includes a plurality of split cores which are a powder compact of soft magnetic powder coated with an insulating material. The plurality of split cores are arranged in a circumferential direction of the yoke and are joined to each other by press-fitting. The split cores composed of a powder compact of soft magnetic powder coated with an insulating material include: a yoke part extending in an arc shape; and teeth extending from the yoke part. The yoke part includes: a first press-fit part formed at an end part of the split core on a first circumferential direction side and configured to be joined by press-fitting to a split core adjacent on the first circumferential direction side; and a second press-fit part formed at an end part of the split core on a second circumferential direction side and configured to be joined by press-fitting to the split core adjacent on the second circumferential direction side.

IPC Classes  ?

• H02K 1/02 - Details of the magnetic circuit characterised by the magnetic material
• H02K 1/18 - Means for mounting or fastening magnetic stationary parts on to, or to, the stator structures
• H02K 15/02 - Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of stator or rotor bodies

Abstract

This positive photosensitive resin composition includes (A) an alkali-soluble resin, (B) an imide compound, (C) a photoacid generator, and (D) a thermal crosslinking agent. The alkali-soluble resin is a resin including a constituent unit that is a group resulting from removing one or more hydrogen atoms from a bisphenol imide compound represented by formula (I). The imide compound is a compound represented by formula (II). R1 is a hydroxyphenyl group that may be substituted with an alkyl group.

IPC Classes  ?

• G03F 7/023 - Macromolecular quinonediazidesMacromolecular additives, e.g. binders

Abstract

An accepting unit (34) accepts a material physical property value of each of a plurality of materials constituting a semiconductor package substrate that is to be subjected to calculation, a stacking order of each of the plurality of materials, and a value of a predetermined parameter, and a calculating unit (36) calculates a substrate physical property value of the semiconductor package substrate that is to be subjected to calculation, using an integrated calculation formula obtained by adding, using predetermined coefficients, a first calculation formula for calculating, using a rule of mixtures, a change in the substrate physical property value with respect to a predetermined parameter when stress is applied to the semiconductor package substrate in a fiber direction of the material, and a second calculation formula for calculating, using the rule of mixtures, a change in the substrate physical property value with respect to the predetermined parameter when stress is applied in a direction perpendicular to the fiber direction, the coefficients being adjusted such that the substrate physical property value calculated using the integrated calculation formula matches the result of a simulation of the substrate physical property value.

IPC Classes  ?

• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates

Abstract

The present invention improves calculation accuracy when calculating an aggregate. This information processing device comprises: a first acquisition unit that acquires a basic model when calculating an aggregate; a binding determination unit that determines the presence or absence of binding between atoms in the basic model; a constraint condition setting unit that sets a constraint condition between atoms determined to be bound; and a second acquisition unit that acquires an initial model, which is an initial structure model for calculating the aggregate, by instructing a relaxation calculation by disposing, in a calculation space, a relaxation calculation model in which the basic model is disposed in plurality and the constraint condition is set between atoms.

IPC Classes  ?

• G16C 60/00 - Computational materials science, i.e. ICT specially adapted for investigating the physical or chemical properties of materials or phenomena associated with their design, synthesis, processing, characterisation or utilisation
• G16C 20/00 - Chemoinformatics, i.e. ICT specially adapted for the handling of physicochemical or structural data of chemical particles, elements, compounds or mixtures

Abstract

This magnetic powder composition contains a magnetic powder. The magnetic powder contains a nanocrystalline magnetic powder (A1) having an average particle diameter that is greater than 2 μm but is less than 5.5 μm. The nanocrystalline powder content of the magnetic powder composition is no less than 60.5 vol% with respect to the total volume of nonvolatile component contained in the magnetic powder composition.

IPC Classes  ?

• H01F 1/20 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
• B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
• B22F 1/05 - Metallic powder characterised by the size or surface area of the particles
• B22F 1/10 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material
• B22F 3/00 - Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sinteringApparatus specially adapted therefor
• B22F 9/00 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor
• H01F 1/26 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
• H01F 1/33 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials mixtures of metallic and non-metallic particlesMagnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metallic particles having oxide skin
• H01F 1/153 - Amorphous metallic alloys, e.g. glassy metals
• H01F 17/04 - Fixed inductances of the signal type with magnetic core
• H01F 27/255 - Magnetic cores made from particles

Abstract

The method for producing a heat exchanger includes: a before-joining step in which prepared is a stack in which a surface sheet, a solid joining material comprising, as a main component, an amorphous thermoplastic resin which is at least one resin selected from among thermoplastic epoxy resins and phenoxy resins, and a channel formation sheet having a channel in a surface thereof facing the surface sheet have been arranged in this order; and a joining step in which the stack is heated and pressed to melt the solid joining material and join the surface sheet to the channel formation sheet. The amorphous thermoplastic resin has an epoxy equivalent of 1,600 or greater, or the amorphous thermoplastic resin contains no epoxy group and has a heat of fusion of 15 J/g or less.

IPC Classes  ?

• F28F 3/12 - Elements constructed in the shape of a hollow panel, e.g. with channels
• F28F 21/08 - Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal

Abstract

This method for manufacturing a semiconductor package (20) comprises: a step for forming a first insulating layer (32) on a first wiring layer (42); a step for forming a conductor (48) penetrating the first insulating layer and connected to the first wiring layer; a step for forming a second insulating layer (34) constituting a first optical waveguide (44) on the first insulating layer; a step for forming a second wiring layer (46) connected to the conductor on the second insulating layer; and a step for forming a third insulating layer (36) on the second wiring layer.

IPC Classes  ?

• H01L 33/52 - Encapsulations
• H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
• H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

This electrically conductive polymer-containing dispersion liquid contains a conjugated electrically conductive polymer (A), a polyanion (B), a compound (C) having a group represented by formula (1), and a dispersion medium (D). (In formula (1), R1and R2 are each independently an alkyl group having 1-6 carbon atoms, an alkenyl group having 2-6 carbon atoms, an aryl group or an aralkyl group. X is an oxygen atom or a sulfur atom.)

IPC Classes  ?

• C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
• C08K 5/06 - EthersAcetalsKetalsOrtho-esters
• C08K 5/357 - Six-membered rings
• C08L 65/00 - Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chainCompositions of derivatives of such polymers
• C08L 79/00 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups
• H01G 9/028 - Organic semiconducting electrolytes, e.g. TCNQ

Abstract

A liquid curable composition containing a curable resin and an inorganic filler including a titanium-containing high dielectric filler.

IPC Classes  ?

• C08G 59/18 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
• C08G 59/50 - Amines
• C08K 3/24 - AcidsSalts thereof
• C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
• C08L 101/00 - Compositions of unspecified macromolecular compounds
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement

Abstract

Provided is a photosensitive element comprising a support, and a photosensitive layer located on the support. The absorbance of a 365 nm wavelength light in the photosensitive layer is 0.0160 or less per 1 µm of the thickness of the photosensitive layer.

IPC Classes  ?

• G03F 7/004 - Photosensitive materials
• G03F 7/031 - Organic compounds not covered by group

Abstract

[Solution] This active energy ray-curable water/oil-repellent composition contains a urethane compound (A) and a (meth)acrylate compound (B) having three or more (meth)acryloyl groups per molecule. The urethane compound (A) contains a structural unit derived from a hydroxyl group-containing (meth)acrylate (a), a structural unit derived from an organic isocyanate compound (b) having two or more isocyanate groups per molecule, and a structural unit derived from a straight chain saturated alcohol (c) having 12-22 carbon atoms. The ratio of hydroxyl group equivalent weight of the straight chain saturated alcohol (c)/isocyanate group equivalent weight of the organic isocyanate compound (b) is 0.17-0.67.

IPC Classes  ?

• C09K 3/18 - Materials not provided for elsewhere for application to surface to minimize adherence of ice, mist or water theretoThawing or antifreeze materials for application to surfaces
• C08F 290/06 - Polymers provided for in subclass
• C08G 18/28 - Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
• C08G 18/67 - Unsaturated compounds having active hydrogen

Abstract

This method for manufacturing a semiconductor package includes a step of forming a first insulating layer, a step of forming a conductor penetrating the first insulating layer, a step of forming a second insulating layer constituting a first optical waveguide on the first insulating layer, a step of forming a wiring layer connected to the conductor on the second insulating layer, and a step of forming a third insulating layer on the wiring layer.

IPC Classes  ?

• H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
• H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
• H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group

Abstract

A polymer emulsion (B) contains a polymer (A) containing a constituent unit (A-1) represented by the following formula (1), and water. A polymer emulsion (B) contains a polymer (A) containing a constituent unit (A-1) represented by the following formula (1), and water. A polymer emulsion (B) contains a polymer (A) containing a constituent unit (A-1) represented by the following formula (1), and water. In formula (1), R1 represents a hydrogen atom or a methyl group, R2 represents a di- to tetravalent aliphatic saturated hydrocarbon group having 1 to 20 carbon atoms and containing a straight chain or a branched chain optionally having an ether bond, or a divalent alicyclic hydrocarbon group or aromatic hydrocarbon group having 6 to 20 carbon atoms and optionally having a urethane bond, R3 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or a cycloalkyl group or arylalkyl group having 6 to 20 carbon atoms, R4 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, or a cycloalkyl group or arylalkyl group having 6 to 20 carbon atoms, and n represents 1 or 2.

IPC Classes  ?

• C08F 220/18 - Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
• C08F 2/26 - Emulsion polymerisation with the aid of emulsifying agents anionic
• C08F 2/38 - Polymerisation using regulators, e.g. chain terminating agents
• C08L 33/12 - Homopolymers or copolymers of methyl methacrylate
• C09D 5/02 - Emulsion paints
• C09D 133/12 - Homopolymers or copolymers of methyl methacrylate

Abstract

A method for manufacturing a connecting member consisting of a first connecting body and a second connecting body connected together, in which the first connecting body has a first member at one end and the second connecting body has a second member extending along the first member at one end, the method including: a pre-joining step for preparing a laminate formed of the first member, a solid joining agent mainly comprising an amorphous thermoplastic resin which is at least one selected from a thermoplastic epoxy resin and a phenoxy resin, and the second member, arranged in this order; and a joining step for heating and pressurizing the laminate to melt the solid joining agent and join the first member and the second member.

IPC Classes  ?

• B29C 65/48 - Joining of preformed partsApparatus therefor using adhesives
• C09J 5/06 - Adhesive processes in generalAdhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
• C09J 7/35 - Heat-activated
• C09J 163/00 - Adhesives based on epoxy resinsAdhesives based on derivatives of epoxy resins

Abstract

The present invention relates to a coating liquid comprising an aerogel particle, a liquid medium, a first binder resin, and a second binder resin having lower solubility in the liquid medium than the first binder resin.

IPC Classes  ?

• C09D 7/65 - Additives macromolecular
• C09D 7/61 - Additives non-macromolecular inorganic
• C09D 133/10 - Homopolymers or copolymers of methacrylic acid esters
• C09D 163/00 - Coating compositions based on epoxy resinsCoating compositions based on derivatives of epoxy resins

Abstract

Provided is a photosensitive element comprising a support, and a photosensitive layer located on the support. The absorbance of a 365 nm wavelength light in the photosensitive layer is within a range of 0.0120 or more and 0.0160 or less per 1 µm of the thickness of the photosensitive layer.

IPC Classes  ?

• G03F 7/004 - Photosensitive materials
• G03F 7/031 - Organic compounds not covered by group

Abstract

Provided is a method for manufacturing a printed wiring board (101), the method comprising: preparing a substrate (1) that includes a substrate main portion (11) that forms a cavity (11A); providing an insulating portion (2) in the cavity, thereby forming a sheet-like core substrate (10) including the substrate and the insulating portion; and providing a wiring layer (30) including a wiring portion (31) and an insulating resin portion (32) on one or both sides of the core substrate. The substrate main portion is an insulating substrate or a semiconductor substrate, and the insulating portion has a greater coefficient of linear expansion than the substrate main portion. Alternatively, the substrate main portion is a fiber-reinforced resin substrate, a silicon substrate, a glass substrate, or a ceramic substrate, and the insulating portion is a cured film formed by the curing of a photosensitive resin layer or a thermosetting resin layer.

IPC Classes  ?

• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
• H05K 3/46 - Manufacturing multi-layer circuits

Abstract

This method for manufacturing a semiconductor device comprises: a lamination step for disposing an adhesive layer on a first base material surface of a base material layer; a dicing step for cutting the base material layer via dicing so as to produce a plurality of adhesive-equipped semiconductor chips which are each a semiconductor chip having a first chip surface on which the adhesive is disposed; and a bonding step for bonding the adhesive-equipped semiconductor chips to a base body. In the lamination step, the adhesive layer is formed such that at least a portion of an edge section of a chip precursor region, which is situated on the first base material surface and will become the semiconductor chips in the dicing step, does not have the adhesive layer disposed thereon.

IPC Classes  ?

• H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions

Abstract

This nonaqueous secondary battery electrode includes: a current collector; and an electrode active material layer provided on the current collector and having a thickness of 100 µｍ or more. The electrode active material layer contains 80 mass% or more of an electrode active material. In measurements by a surface cutting test (SAICAS) under specific conditions, when an electrode strength at a depth of t [μｍ] from the surface of the electrode active material layer is P(t) [kN/m], P(30) is 0.100 kN/m or more, and the ratio of P(90) to P(30) [P(90)/P(30)] is 0.60 or more.

IPC Classes  ?

• H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
• H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
• H01M 4/66 - Selection of materials
• H01M 4/133 - Electrodes based on carbonaceous material, e.g. graphite-intercalation compounds or CFx
• H01M 4/587 - Carbonaceous material, e.g. graphite-intercalation compounds or CFx for inserting or intercalating light metals

Abstract

This electrode slurry includes a binder polymer, a cellulose derivative, an electrode active material, and an aqueous medium. Given that the peel strength of an electrode active material layer having a thickness of 130 μm is P(T) [mN/mm], a ratio [P(180)/P(90)] of P(180) to P(90) is 0.50 or more, wherein the electrode active material layer is obtained by applying the electrode slurry to a copper foil and drying the resultant for 4 minutes at T°C.

IPC Classes  ?

• H01M 4/139 - Processes of manufacture
• H01M 4/13 - Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulatorsProcesses of manufacture thereof
• H01M 4/62 - Selection of inactive substances as ingredients for active masses, e.g. binders, fillers
• H01M 4/66 - Selection of materials

Abstract

A photosensitive resin composition, containing: an acid-modified vinyl group-containing resin (A); a photopolymerization initiator (B); a photopolymerizable compound (C); and a thermosetting resin (D), in which the acid-modified vinyl group-containing resin (A) contains a first resin with a weight average molecular weight of less than 4000, and a second resin with a weight average molecular weight of 4000 or more, a content of the first resin is greater than 60% by mass, on the basis of a total amount of the acid-modified vinyl group-containing resin (A), and a content of the acid-modified vinyl group-containing resin (A) is 33% by mass or less, on the basis of a total solid content of the photosensitive resin composition.

IPC Classes  ?

• G03F 7/031 - Organic compounds not covered by group
• G03F 7/029 - Inorganic compoundsOnium compoundsOrganic compounds having hetero atoms other than oxygen, nitrogen or sulfur
• G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
• G03F 7/105 - Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
• H05K 3/06 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Abstract

An etching method includes an etching step of bringing an etching gas containing an etching compound into contact with a member to be etched (400) having an etching object (silicon material) and a non-etching object (carbon material) and selectively etching the etching object over the non-etching object. The etching compound is fluoro-dithiethane represented by Chemical Formula CxFyS2, wherein, in Chemical Formula, x is 2 or more and 6 or less and y is 4 or more and 12 or less. The etching gas contains or does not contain at least one type of metal among sodium, magnesium, aluminum, potassium, calcium, chromium, manganese, iron, cobalt, nickel, copper, and molybdenum, and, when the at least one type of metal is contained, the total concentration of all types of the contained metals is 300 ppb by mass or less.

IPC Classes  ?

• C09K 13/00 - Etching, surface-brightening or pickling compositions
• H01L 21/311 - Etching the insulating layers

Abstract

Provided is a method for manufacturing a semiconductor package. The method includes: preparing a package body having a package substrate and a semiconductor member mounted on a mounting region provided within a main surface of the package substrate, while the semiconductor member includes a semiconductor chip; and adhering a reinforcing member including a portion surrounding the mounting region to the package substrate by using an adhesive layer interposed between the reinforcing member and the package substrate. The adhesive layer includes spacer particles.

IPC Classes  ?

• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates

Abstract

This analysis device comprises: a sound absorption coefficient calculation unit that calculates a sound absorption coefficient on the basis of design information of a sound-absorbing structure; a modeling unit that generates a finite element model on the basis of design information of a tire; a sound absorption coefficient setting unit that, on the basis of arrangement information of the sound-absorbing structure relative to the tire, sets, in the finite element model, a sound-absorbing boundary having a sound absorption coefficient; and a sound pressure analysis unit that analyzes the sound pressure distribution in an internal space of the tire on the basis of the finite element model in which the sound-absorbing boundary has been set.

IPC Classes  ?

• B60C 19/00 - Tyre parts or constructions not otherwise provided for
• G01M 17/02 - Tyres

Abstract

This electronic component equipped with an adhesive sheet includes: an adhesive sheet having a base material layer and an ultraviolet-curable adhesive layer provided on the base material layer; and an electronic component provided on the ultraviolet-curable adhesive layer of the adhesive sheet. A surface of the electronic component that is in contact with the ultraviolet-curable adhesive layer has an insulating region and a conductor region. The ultraviolet-curable adhesive layer is a thermally cured product of an adhesive composition. The adhesive composition comprises a (meth)acrylic resin (A) containing structural units represented by formulae (2) and (3). In formula (2), R3represents a hydrogen atom or a methyl group, and R4represents a group that has a hydroxy group on a carbon atom and that has, on a carbon atom adjacent to said carbon atom, a residue obtained by removing a hydrogen atom from a carboxy group of an unsaturated monocarboxylic acid. In formula (3), R5represents a hydrogen atom or a methyl group, and R6 represents a group that has, on a carbon atom, a residue obtained by removing a hydrogen atom from a carboxyl group of an unsaturated monocarboxylic acid and that has, on a carbon atom adjacent to said carbon atom, a residue obtained by removing a hydrogen atom from a carboxyl group of an unsaturated monocarboxylic acid.

IPC Classes  ?

• H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
• C09J 7/28 - Metal sheet
• C09J 7/38 - Pressure-sensitive adhesives [PSA]
• C09J 11/06 - Non-macromolecular additives organic
• C09J 133/04 - Homopolymers or copolymers of esters
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
• H01L 25/10 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices having separate containers
• H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
• H05K 3/20 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern

Abstract

A photosensitive resin composition containing a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, wherein the binder polymer includes a polymer a having a styrene compound as a monomer unit, the photopolymerizable compound includes a polyfunctional monomer having two or more radical reactive groups and at least one selected from the group consisting of a bisphenol-A skeleton and a ditrimethylolpropane skeleton, and the polyfunctional monomer content is 92 mass% or more based on the total amount of the photopolymerizable compound.

IPC Classes  ?

• G03F 7/027 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds

Abstract

Disclosed is a curable composition which contains an acenaphthylene polymer (A) and a compound (B) that has a polymerizable group (excluding a compound that falls into the category of the acenaphthylene polymer (A)), wherein the acenaphthylene polymer (A) is a copolymer of an acenaphthylene compound (a1) and another polymerizable unsaturated bond-containing compound (a2).

IPC Classes  ?

• C08L 25/02 - Homopolymers or copolymers of hydrocarbons
• C08F 12/34 - Monomers containing two or more unsaturated aliphatic radicals
• C08F 232/08 - Copolymers of cyclic compounds containing no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
• C08J 5/24 - Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
• C08L 45/00 - Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring systemCompositions of derivatives of such polymers
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H05K 1/03 - Use of materials for the substrate

Abstract

This information processing device comprises: a summary sentence data generation unit that generates a plurality of summary sentence data from processing target sentence data in accordance with processing instruction data; an extraction unit that extracts key information included in the plurality of summary sentence data for each category constituting the processing target sentence data; and a summary sentence data selection unit that selects summary sentence data to be output from the plurality of summary sentence data using the key information for each category.

IPC Classes  ?

• G06F 40/279 - Recognition of textual entities
• G06F 16/38 - Retrieval characterised by using metadata, e.g. metadata not derived from the content or metadata generated manually
• G06F 40/289 - Phrasal analysis, e.g. finite state techniques or chunking

Abstract

This method for manufacturing a semiconductor package includes: preparing a connection body provided with a plurality of semiconductor chip components and a semiconductor wafer substrate that has a wafer body and a plurality of first electrodes; forming an underfill; forming a sealing layer for collectively sealing the plurality of semiconductor chip components, thereby forming a sealing body; and forming individual pieces from the sealing body to obtain a plurality of semiconductor components. The plurality of first electrodes are arranged on the wafer body at a minimum pitch of 40 μm or less. The underfill is a cured product of an underfill material, and the sealing layer is a cured product of a sealing material. The linear expansion coefficient of the cured product of the underfill material is 6-30 ppm/°C, and the linear expansion coefficient of the cured product of the sealing material is 5-14 ppm/°C. The flexural modulus of the cured product of the sealing material is 5.0-20 GPa at 25°C.

IPC Classes  ?

• H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings

Abstract

An image processing device includes an image acquisition part configured to acquire a target image in which fibers are captured, a first segmentation part configured to generate an individual-object segmentation result detecting each of the fibers included in the target image using a trained individual-object segmentation mode, a second segmentation part configured to generate a category segmentation result recognizing regions where the fibers are captured in the target image using a trained category segmentation model, a region correction part configured to correct the individual-object segmentation result with the category segmentation result, and a result output part configured to output a correction result of the individual-object segmentation result.

IPC Classes  ?

• G06V 10/26 - Segmentation of patterns in the image fieldCutting or merging of image elements to establish the pattern region, e.g. clustering-based techniquesDetection of occlusion
• G06V 10/764 - Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
• G06V 10/82 - Arrangements for image or video recognition or understanding using pattern recognition or machine learning using neural networks

Abstract

This analysis device comprises: a sound absorption rate calculation unit that calculates a sound absorption rate on the basis of design information of a sound absorption structure; a modeling unit that generates a finite element model on the basis of design information of a tire; a sound absorption rate setting unit that sets a sound absorption boundary having a sound absorption rate to a finite element model on the basis of arrangement information of the sound absorption structure with respect to the tire; and a sound pressure analysis unit that analyzes a sound pressure distribution of an internal space of the tire on the basis of the finite element model in which the sound absorption boundary is set.

IPC Classes  ?

• B60C 19/00 - Tyre parts or constructions not otherwise provided for

Abstract

A photosensitive resin composition containing a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, wherein the binder polymer includes a polymer a having a styrene compound as a monomer unit, the photopolymerizable compound includes a polyfunctional monomer having two or more radical reactive groups and at least one selected from the group consisting of a bisphenol-A skeleton and a ditrimethylolpropane skeleton, and the polyfunctional monomer content is 92 mass% or more based on the total amount of the photopolymerizable compound.

IPC Classes  ?

• G03F 7/027 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
• G03F 7/004 - Photosensitive materials

Abstract

This method for manufacturing a semiconductor package includes: preparing a connection body provided with a plurality of semiconductor chip components and a semiconductor wafer substrate that has a wafer body and a plurality of first electrodes; forming an underfill; forming a sealing layer for collectively sealing the plurality of semiconductor chip components, thereby forming a sealing body; and forming individual pieces from the sealing body to obtain a plurality of semiconductor components. The plurality of first electrodes are arranged on the wafer body at a minimum pitch of 40 μm or less. The underfill is a cured product of an underfill material, and the sealing layer is a cured product of a sealing material. The linear expansion coefficient of the cured product of the underfill material is 6-30 ppm/C°, and the linear expansion coefficient of the cured product of the sealing material is 5-20 ppm/C°. The flexural modulus of the cured product of the sealing material is 5.0-20 GPa at 25°C.

IPC Classes  ?

• H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
• H01L 21/56 - Encapsulations, e.g. encapsulating layers, coatings
• H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material

Abstract

Disclosed is a semiconductor device applicable to a 2.xD structure. A semiconductor device 1 includes: a substrate 2; a semiconductor chip 31 mounted on the substrate 2; and a stiffener 4 arranged on the substrate 2 and extending so as to surround the semiconductor chip 31. The stiffener 4 is formed of, for example, SUS430 or an organic material. In the semiconductor device 1, the difference obtained by subtracting an average thermal expansion coefficient of the substrate 2 at 30°C-245°C inclusive from an average thermal expansion coefficient of the stiffener 4 at 30°C-245°C inclusive is -4 ppm/°C to 4 ppm/°C inclusive. The width of the stiffener 4 is larger than 20 mm.

IPC Classes  ?

• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates

Abstract

The present disclosure provides: a positive resist material that exhibits good transmittance for an energy ray used for patterning and that provides a good pattern shape after being exposed; and a pattern-forming method. A positive resist material according to the present disclosure contains a resin (A). The resin (A) is a copolymer including a structural unit (a-1) represented by formula (1) and a structural unit (a-2) represented by formula (2). (In formulae (1) and (2), RAand RBare each a hydrogen atom or a methyl group. R1represents an alkanediyl group having 1-6 carbon atoms, and a portion of said carbon atoms is optionally substituted with an ether bond or an ester bond. R2represents a fluorine atom, a trifluoromethyl group, a cyano group, or a saturated hydrocarbyl group having 1-6 carbon atoms. a represents 1 or 2. b represents an integer of 0-4. Here, 1≤a+b≤5 is satisfied. R4 represents an acid unstable group.)

IPC Classes  ?

• G03F 7/039 - Macromolecular compounds which are photodegradable, e.g. positive electron resists
• C08F 220/30 - Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
• G03F 7/20 - ExposureApparatus therefor

Abstract

The present invention provides a photosensitive resin composition comprising a copolymer having a high refractive index. Also provided is a photosensitive resin composition from which a cured resin film having good light transmittance can be obtained. The present invention further provides a cured resin film having good light transmittance and a high refractive index, and an image display element comprising said cured resin film. The photosensitive resin composition contains a copolymer (A), a reactive diluent (B), a photopolymerization initiator (C), and a solvent (D), wherein the copolymer (A) contains a constitutional unit (a-1) derived from a naphthyl group-containing (meth)acrylate.

IPC Classes  ?

• G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
• C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
• C08F 8/00 - Chemical modification by after-treatment
• C08F 220/04 - AcidsMetals salts or ammonium salts thereof
• C08F 220/10 - Esters
• C08F 290/12 - Polymers provided for in subclasses or
• G02B 5/20 - Filters
• G03F 7/038 - Macromolecular compounds which are rendered insoluble or differentially wettable
• G09F 9/30 - Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
• H10K 59/10 - OLED displays
• H10K 59/38 - Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]

Abstract

A fluorine-containing ether compound represented by R1—[B]-[A]-CH2—R2[—CH2—R3—CH2—R2], CH2—[C]-[D]-R4 ([A] is Formula (2-1), [B] is Formula (2-2), [C] is Formula (3-1), [D] is Formula (3-2), R4 is Formula (4), R1 is a terminal group that may be the same as or different from R4, z is 1 or 2, and R2 is a perfluoropolyether chain. R3 is Formula (5)). A fluorine-containing ether compound represented by R1—[B]-[A]-CH2—R2[—CH2—R3—CH2—R2], CH2—[C]-[D]-R4 ([A] is Formula (2-1), [B] is Formula (2-2), [C] is Formula (3-1), [D] is Formula (3-2), R4 is Formula (4), R1 is a terminal group that may be the same as or different from R4, z is 1 or 2, and R2 is a perfluoropolyether chain. R3 is Formula (5)).

IPC Classes  ?

• C10M 107/38 - Lubricating compositions characterised by the base-material being a macromolecular compound containing halogen
• C08G 65/331 - Polymers modified by chemical after-treatment with organic compounds containing oxygen
• G11B 5/72 - Protective coatings, e.g. anti-static
• G11B 5/725 - Protective coatings, e.g. anti-static containing a lubricant

Abstract

A metal material connecting body, wherein a flat plate-like metal material B is connected with a flat plate-like metal material A by butting a cross section B of the metal material B against a cross section A of the metal material A, and covering at least a part of an opposing portion, which is a region spanning both an end edge portion A of the metal material A and an end edge portion B of the metal material B, with a film including a layer containing a thermoplastic resin as a main component, wherein the film is a film that has undergone melting and solidification at the opposing portion.

IPC Classes  ?

• B32B 37/12 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
• B32B 15/092 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising epoxy resins
• B32B 37/10 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using direct action of vacuum or fluid pressure

Abstract

A method for evaluating fracture toughness of a resin material including: forming, from both ends of a strip-shaped test piece made of the resin material, two notches extending along one straight line perpendicular to the longitudinal direction of the test piece by irradiation with a laser so as to empty between tips of the two notches; and obtaining a load-displacement curve until the test piece is broken, by a tensile test including pulling the test piece in the longitudinal direction of the test piece. This method is particularly useful for the evaluation of resin materials for semiconductors.

IPC Classes  ?

• G01N 3/34 - Investigating strength properties of solid materials by application of mechanical stress by applying repeated or pulsating forces generated by mechanical means, e.g. hammer blows
• G01N 3/00 - Investigating strength properties of solid materials by application of mechanical stress

Abstract

This core piece of a stator core for an axial gap motor is formed by pressing a soft magnetic powder covered with an insulating material and comprises: a tooth part that extends in a first direction and has a peripheral surface around which a winding is wound; a first brim part that is disposed on one side in the first direction of the tooth part; and a second brim part that is disposed on the side opposite from the first brim part in the first direction of the tooth part. The tooth part has a tooth part inner-side surface and a tooth part outer-side surface that are on opposite sides from each other in a second direction, and a tooth part first-side surface and a tooth part second-side surface that are connected to the tooth part inner-side surface and the tooth part outer-side surface and are on opposite sides from each other in a third direction. The tooth part first-side surface and the tooth part second-side surface are disposed parallel to each other and extend straight in the second direction.

IPC Classes  ?

• H02K 1/18 - Means for mounting or fastening magnetic stationary parts on to, or to, the stator structures
• H02K 1/02 - Details of the magnetic circuit characterised by the magnetic material
• H02K 21/24 - Synchronous motors having permanent magnetsSynchronous generators having permanent magnets with stationary armatures and rotating magnets with magnets axially facing the armatures, e.g. hub-type cycle dynamos

Abstract

maxICIC from the crack propagation stress σ, the length a of a notch, and the width B of the test piece. This method is particularly useful for the evaluation of a resin material (for example, a solder resist and an insulating resin layer of a rewiring layer) for a semiconductor.

IPC Classes  ?

• G01N 3/34 - Investigating strength properties of solid materials by application of mechanical stress by applying repeated or pulsating forces generated by mechanical means, e.g. hammer blows
• G01N 3/00 - Investigating strength properties of solid materials by application of mechanical stress

Abstract

A radio wave transmissive member, including an outer layer, an intermediate layer and an inner layer in this order, the radio wave transmissive member having a region in which X, as a thickness of each of the outer layer and the inner layer in a transmission direction of a radio wave, satisfies the following Formula (1) and Formula (2): A radio wave transmissive member, including an outer layer, an intermediate layer and an inner layer in this order, the radio wave transmissive member having a region in which X, as a thickness of each of the outer layer and the inner layer in a transmission direction of a radio wave, satisfies the following Formula (1) and Formula (2): Z - 0.3 mm ≤ X ≤ Z + 0.3 mm Formula ⁢ ( 1 ) Z = λ ÷ √ ε r × 0.5 × Y Formula ⁢ ( 2 ) wherein, in the Formulas, λ represents a wavelength in vacuum of the radio wave, εr represents a relative permittivity of each layer at a frequency of the radio wave, and Y represents an integer of 1 or more.

IPC Classes  ?

• H01Q 1/42 - Housings not intimately mechanically associated with radiating elements, e.g. radome
• G01S 7/03 - Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
• H01Q 1/32 - Adaptation for use in or on road or rail vehicles

Abstract

A radio wave transmissive member. including an outer member. an inner member. and a metal layer that is transmissive to a radio wave. the metal layer being disposed between the outer member and the inner member, and at least one of the outer member of the inner member having a light diffusion feature.

IPC Classes  ?

• G01S 7/02 - Details of systems according to groups , , of systems according to group
• B60R 13/00 - Elements for body-finishing, identifying, or decoratingArrangements or adaptations for advertising purposes
• G01S 7/03 - Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
• G01S 13/931 - Radar or analogous systems, specially adapted for specific applications for anti-collision purposes of land vehicles

Abstract

A frame member has an aluminum-alloy extruded material in which a plurality of nodes are set in a cross-sectional space of an outer peripheral wall and a plurality of ribs connecting the nodes are provided inside the outer peripheral wall, and the frame member has a cross-sectional shape in which a maximum number of the ribs connected to one of the nodes is three or less and there are four or more nodes that are not connected to the ribs.

IPC Classes  ?

• B60K 1/04 - Arrangement or mounting of electrical propulsion units of the electric storage means for propulsion
• H01M 50/224 - Metals

Abstract

A compound contains a first soft magnetic powder, a second soft magnetic powder, and a resin composition. The resin composition contains a thermosetting resin. The particle diameter of the first soft magnetic powder is greater than the particle diameter of the second soft magnetic powder. First soft magnetic particles composing the first soft magnetic powder include a metal portion, and an insulating coating film directly covering the metal portion. At least a part of the metal portion is a soft magnetic alloy containing Fe, Cr, and Si. The insulating coating film contains SiO2. The content of Fe2O3 is 0% by atom or more and 10% by atom or less in a surface region of the first soft magnetic particles where a depth from the outermost surface of the first soft magnetic particles is 100 nm or less.

IPC Classes  ?

• B22F 1/16 - Metallic particles coated with a non-metal
• B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
• B22F 1/103 - Metallic powder containing lubricating or binding agentsMetallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
• H01F 1/147 - Alloys characterised by their composition
• H01F 1/33 - Magnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials mixtures of metallic and non-metallic particlesMagnets or magnetic bodies characterised by the magnetic materials thereforSelection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metallic particles having oxide skin
• H01F 3/08 - Cores, yokes or armatures made from powder
• H05K 9/00 - Screening of apparatus or components against electric or magnetic fields

Abstract

Provided is a method for predicting the occurrence rate of cracking in a resin layer formed of a resin material and provided adjacent to metal wiring in an electronic component. The method may include predicting the occurrence rate of cracking on the basis of a fracture toughness value of the resin material. The method may include predicting the occurrence rate of cracking on the basis of the ratio S2/S1 of the fracture toughness value S2 of the resin material with respect to stress S1 applied to the resin layer in the electronic component.

IPC Classes  ?

• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates
• H01L 23/14 - Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties

Abstract

This core piece, which is for a stator core of an axial gap motor and which is obtained by pressing a soft magnetic powder that is covered with an insulating material, comprises a tooth part, a first flange part, and a second flange part. The tooth part has a tooth part inside surface, a tooth part outside surface, a tooth part first side surface, and a tooth part second side surface. The tooth part first side surface has a tooth part inner first side surface that is connected to the tooth part inside surface, a tooth part outer first side surface that is connected to the tooth part outside surface, and a tooth part intermediate first side surface that is smoothly connected to the tooth part inner first side surface and the tooth part outer first side surface. The tooth part second side surface has a tooth part inner second side surface that is connected to the tooth part inside surface and that is parallel to the tooth part inner first side surface, a tooth part outer second side surface that is connected to the tooth part outside surface and that is parallel to the tooth part outer first side surface, and a tooth part intermediate second side surface that is smoothly connected to the tooth part inner second side surface and the tooth part outer second side surface.

IPC Classes  ?

• H02K 1/18 - Means for mounting or fastening magnetic stationary parts on to, or to, the stator structures
• H02K 1/02 - Details of the magnetic circuit characterised by the magnetic material
• H02K 21/24 - Synchronous motors having permanent magnetsSynchronous generators having permanent magnets with stationary armatures and rotating magnets with magnets axially facing the armatures, e.g. hub-type cycle dynamos

Abstract

This method for evaluating fracture toughness of a resin material comprises: forming a notch extending from an end of a strip-shaped test piece made of a resin material along one straight line perpendicular to the longitudinal direction of the test piece; and obtaining a load-displacement curve until the test piece is broken under a tensile test that includes pulling the test piece in the longitudinal direction of the test piece. This method makes it possible to evaluate the fracture toughness of a resin material for semiconductors (for example, an insulating resin layer of a redistribution layer and a solder resist) with high accuracy. When such a resin material has a large fracture toughness value, the generation of cracks can be suppressed in a resin layer formed from said resin material.

IPC Classes  ?

• G01N 3/34 - Investigating strength properties of solid materials by application of mechanical stress by applying repeated or pulsating forces generated by mechanical means, e.g. hammer blows
• G01N 3/00 - Investigating strength properties of solid materials by application of mechanical stress

Abstract

A polishing liquid for CMP includes abrasive grains, an additive A, a cationic polymer, and water, in which the additive A contains a compound having an ethylenediamine structure bonded to a hydroxyalkyl group or an alkoxide group. A polishing liquid set for CMP includes a first liquid and a second liquid, in which the components of the polishing liquid for CMP are separately stored in the first liquid and the second liquid, the first liquid contains the abrasive grains and water, and the second liquid contains the additive A, the cationic polymer, and water. A polishing method includes a step of polishing a surface to be polished using the polishing liquid for CMP.

IPC Classes  ?

• H01L 21/3105 - After-treatment
• B24B 37/04 - Lapping machines or devicesAccessories designed for working plane surfaces
• C09K 3/14 - Anti-slip materialsAbrasives

Abstract

A polymaleimide resin obtained by reacting a tetracarboxylic dianhydride (a1), a diamine (a2), a triamine (a3), and maleic anhydride (a4), in which the diamine (a2) contains a dimer diamine.

IPC Classes  ?

• C09J 7/38 - Pressure-sensitive adhesives [PSA]
• C09D 179/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
• H05K 1/03 - Use of materials for the substrate

Abstract

A fluorine-containing ether compound represented by the following formula. R1—CH2—R2[—CH2—R2—CH2—R2]x—CH2—R4 (x is an integer of 1 or 2; R2 is a perfluoropolyether chain; at least one of x pieces of R3's is Formula (2-1) or Formula (2-2); and R1 and R4 are each a terminal group having two to four polar groups, has 1 to 9 carbon atoms in a shortest distance between carbon atoms to which adjacent polar groups are bonded, and has an oxygen atom bonded to a methylene group to which R2 is bonded) A fluorine-containing ether compound represented by the following formula. R1—CH2—R2[—CH2—R2—CH2—R2]x—CH2—R4 (x is an integer of 1 or 2; R2 is a perfluoropolyether chain; at least one of x pieces of R3's is Formula (2-1) or Formula (2-2); and R1 and R4 are each a terminal group having two to four polar groups, has 1 to 9 carbon atoms in a shortest distance between carbon atoms to which adjacent polar groups are bonded, and has an oxygen atom bonded to a methylene group to which R2 is bonded)

IPC Classes  ?

• G11B 5/725 - Protective coatings, e.g. anti-static containing a lubricant
• C08G 65/22 - Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
• C08G 65/331 - Polymers modified by chemical after-treatment with organic compounds containing oxygen
• C10M 107/38 - Lubricating compositions characterised by the base-material being a macromolecular compound containing halogen
• C10N 40/18 - Electric or magnetic purposes in connection with recordings on magnetic tape or disc

Abstract

A composition containing a compound represented by the following Formula (1): A composition containing a compound represented by the following Formula (1): A composition containing a compound represented by the following Formula (1): [in the Formula (1), R11 and R12 each independently represent a hydrogen atom or a methyl group; and R13 represents a divalent group having a polyoxyalkylene chain]; and a copolymer containing methyl (meth)acrylate and an alkyl (meth)acrylate having an alkyl group having 2 to 12 carbon atoms, wherein a content of methyl (meth)acrylate is 25% by mass or more based on a total amount of monomer units contained in the copolymer.

IPC Classes  ?

• C08F 287/00 - Macromolecular compounds obtained by polymerising monomers on to block polymers
• C08K 3/22 - OxidesHydroxides of metals
• C08K 9/06 - Ingredients treated with organic substances with silicon-containing compounds
• C08L 51/00 - Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers

Abstract

Provided is a cured product of a photosensitive resin composition. The photosensitive resin composition contains a maleimide resin, a (meth)acrylic monomer, and a photopolymerization initiator. The maleimide resin is a reaction product of a tetracarboxylic dianhydride (a1), an amine (a2), and maleic anhydride (a3). The amine (a2) includes a dimer diamine and the (meth)acrylic monomer includes a multifunctional (meth)acrylic monomer. The cured product has a Tg of 80°C or more and a coefficient of linear expansion at -20°C to 40°C of 120 ppm/°C or less.

IPC Classes  ?

• G03F 7/027 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
• C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
• C08F 283/04 - Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass on to polycarbonamides, polyesteramides or polyimides
• C08F 290/06 - Polymers provided for in subclass
• C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors
• C08K 5/101 - EstersEther-esters of monocarboxylic acids
• C08L 79/08 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide acids or similar polyimide precursors

Abstract

This information processing device shapes unstructured data into structured data, and includes: an edit reception unit that receives, from a user, edits of extraction item information in which the data format of an extraction item for extracting data from the unstructured data is set; a shaping unit that uses a data extraction function provided for each data format to extract the data of the extraction item from the unstructured data, and shapes the extracted data into the structured data; and an output unit that outputs the structured data obtained by the shaping process.

IPC Classes  ?

• G06F 40/177 - Editing, e.g. inserting or deleting of tablesEditing, e.g. inserting or deleting using ruled lines

Abstract

An evaluation system includes at least one processor. The at least one processor is configured to: acquire a target image showing an object having a base material and a coating region on the base material; input the target image to a trained model estimating the coating region from an input image to identify the coating region of the object; and calculate an evaluation value related to the identified coating region.

IPC Classes  ?

• G06T 7/00 - Image analysis
• G06T 7/62 - Analysis of geometric attributes of area, perimeter, diameter or volume
• G06V 10/28 - Quantising the image, e.g. histogram thresholding for discrimination between background and foreground patterns
• G06V 10/34 - Smoothing or thinning of the patternMorphological operationsSkeletonisation

Abstract

An etching method including an etching step of setting the temperature of a member to be etched having an etching object containing silicon to 0° C. or less, bringing an etching gas containing an etching compound into contact with the member to be etched, and etching the etching object, the etching compound being a compound having at least one type of atom among a fluorine atom, a hydrogen atom, and an oxygen atom in the molecule. The etching gas contains or does not contain metal impurities having at least one type of metal. When the etching gas contains the metal impurities, the total concentration of all types of the contained metals is 4000 ppb by mass or less.

IPC Classes  ?

• H01L 21/3065 - Plasma etchingReactive-ion etching
• H01J 37/32 - Gas-filled discharge tubes

Abstract

Such a pattern formation method includes a laminating step of laminating a curable resin layer 3 and a support film 4 on a substrate 2, a curing step of curing the entire curable resin layer 3, a peeling step of peeling the support film 4 from the curable resin layer 3 after curing, a processing step of irradiating the curable resin layer 3 after peeling the support film 4 with an excimer laser light 15 via a mask 14 to process the curable resin layer 3 into a predetermined pattern, and a forming step of removing the curable resin layer 3 after forming a plating layer 17 using the curable resin layer 3 with the predetermined pattern as a mask to form a wiring pattern 16 using the plating layer 17 on the substrate 2.

IPC Classes  ?

• H05K 3/18 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
• H05K 3/00 - Apparatus or processes for manufacturing printed circuits

Abstract

This cooler comprises: a first member including a flat base part to which heat generated by a heating element is transmitted, and a fin part that protrudes from the base part in a direction intersecting the plate surface of the base part; a second member disposed so as to surround the first member; and a stacked member formed by stacking a first layer, which is formed from the same material as that of the first member, and a second layer, which is formed from the same material as that of the second member. The first layer of the stacked member and the first member are joined to each other by welding, and the second layer of the stacked member and the second member are joined to each other by welding.

IPC Classes  ?

• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A photosensitive resin composition according to the present disclosure contains a maleimide compound; a crosslinking agent; and a photopolymerization initiator, in which the maleimide compound is a reaction product of a tetracarboxylic dianhydride (a1), a diamine (a2), a triamine (a3), and maleic anhydride (a4), and the diamine (a2) includes a dimer diamine.

IPC Classes  ?

• G03F 7/031 - Organic compounds not covered by group
• H01L 23/00 - Details of semiconductor or other solid state devices
• H01L 23/498 - Leads on insulating substrates
• H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials

Abstract

A molding resin composition according to the present invention includes a curable resin, an inorganic filler, and a stress relaxer. The inorganic filler includes: at least one of silica particles and alumina particles; and calcium titanate particles. The stress relaxer includes at least one of an indene/styrene/coumarone copolymer, a trialkyl phosphine oxide, and a triaryl phosphine oxide.

IPC Classes  ?

• C08L 63/04 - Epoxynovolacs
• C08G 59/08 - Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
• C08G 59/24 - Di-epoxy compounds carbocyclic
• C08G 59/62 - Alcohols or phenols
• C08K 3/22 - OxidesHydroxides of metals
• C08K 5/5397 - Phosphine oxides

Abstract

Disclosed is an example of a method for fabricating a semiconductor device using a bridge die. Copper posts 22 are provided on a carrier substrate 20, and a semiconductor die 40 that serves as a bridge die is mounted between the copper posts 22. The semiconductor die 40 is mounted by means of a resin layer 43 covering terminal electrodes 42 such that the terminal electrodes 42 face the carrier substrate 20 (face-down). The resin layer 43 is cured and an encapsulant layer 23 is formed. An interconnection layer 24 is formed on one side of the encapsulant layer 23, and an interconnection layer 28 is formed on the other side, through separation of the carrier substrate 20. Active dies 50, 55 are mounted on this interposer P to obtain a semiconductor device 1. According to this fabrication method, the bridge die is mounted face-down, and thus secure mounting can be achieved. Since the expensive active dies are mounted last, fabrication costs can be reduced. The use of NCF or DAF is suitable for the resin layer 43.

IPC Classes  ?

• H01L 23/12 - Mountings, e.g. non-detachable insulating substrates

Abstract

An adhesive set includes a main agent containing a decomplexing agent and an initiator containing an organoborane complex. The decomplexing agent contains maleic anhydride. At least one of the main agent and the initiator further contains a compound having a radically polymerizable group. At least one of the main agent and the initiator further contains at least one selected from the group consisting of a metal halide salt and a compound having a thiocarbonyl thio structure.

IPC Classes  ?

• C09J 11/06 - Non-macromolecular additives organic
• C09J 11/04 - Non-macromolecular additives inorganic

Abstract

A method for manufacturing a semiconductor device includes preparing first and second semiconductor substrates, dividing the second semiconductor substrate into semiconductor chips, and bonding the first organic insulating layer and an insulating layer portion of the semiconductor chip to each other and bonding the first electrode and the second electrode to each other by heating and pressurizing them. Before heating, at least one of a first protrusion amount of the first electrode or a second protrusion amount of the second electrode is a protrusion amount within 130% of a protrusion amount ΔL represented by Formula (1). In Formula (1), D is a layer thickness of the organic insulating layer, ΔT is a temperature difference of a heating temperature, α1 is the linear expansion coefficient of the organic insulating layer, and α2 is the linear expansion coefficient of the electrode. A method for manufacturing a semiconductor device includes preparing first and second semiconductor substrates, dividing the second semiconductor substrate into semiconductor chips, and bonding the first organic insulating layer and an insulating layer portion of the semiconductor chip to each other and bonding the first electrode and the second electrode to each other by heating and pressurizing them. Before heating, at least one of a first protrusion amount of the first electrode or a second protrusion amount of the second electrode is a protrusion amount within 130% of a protrusion amount ΔL represented by Formula (1). In Formula (1), D is a layer thickness of the organic insulating layer, ΔT is a temperature difference of a heating temperature, α1 is the linear expansion coefficient of the organic insulating layer, and α2 is the linear expansion coefficient of the electrode. [ Formula ⁢ 1 ]  Δ ⁢ L = D × Δ ⁢ T × ( α ⁢ 1 - α ⁢ 2 ) 1 + Δ ⁢ T × α ⁢ 2 ( 1 )

IPC Classes  ?

• H01L 23/00 - Details of semiconductor or other solid state devices

Abstract

A sensor cover includes a substrate, and a silver particle layer provided on the substrate, the silver particle layer including a silver particle, in which the silver particle has an electromagnetic wave transmission layer on a surface thereof.

IPC Classes  ?

• G01J 5/04 - Casings
• G01R 29/08 - Measuring electromagnetic field characteristics

Abstract

This method for producing an iron-based sintered sliding member comprises: adding a sulfur alloy powder B having an oxygen content of 5 mass% or less to an iron alloy powder A that contains a total of 1 mass% or more of at least one element selected from the group consisting of Cr, Ca, V, Ti and Mg, so that the sulfur content in a sintered body will be 1 mass% to 10 mass%; compression molding the obtained mixed powder; and sintering the obtained molded body at a temperature within the range of 900ºC to 1200ºC.

IPC Classes  ?

• B22F 5/00 - Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
• B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
• C22C 33/02 - Making ferrous alloys by powder metallurgy

Abstract

Provided is a reactive hot melt adhesive which contains a urethane prepolymer that is a reaction product of a polyol and a polyisocyanate, wherein: the polyol contains a crystalline polyester polyol and a polyalkylene glycol; the crystalline polyester polyol contains a crystalline polyester polyol having a melting point of 30°C to 52°C; the polyalkylene glycol comprises a structural unit that is derived from an alkylene glycol having 4 to 10 carbon atoms; the proportion of the crystalline polyester polyol having a melting point of 30°C to 52°C in the polyol is 30 mass% to 80 mass%; and the proportion of the polyalkylene glycol in the polyol is 30 mass% or less.

IPC Classes  ?

• C09J 175/06 - Polyurethanes from polyesters
• C09J 11/02 - Non-macromolecular additives

Abstract

The present invention pertains to: a resin composition containing (A) a thermosetting resin, (B) a phosphorus-based flame retardant, and (C) boehmite; and a prepreg, a laminate, a printed wiring board, and a semiconductor package in each of which the resin composition is used.

IPC Classes  ?

• C08L 101/00 - Compositions of unspecified macromolecular compounds
• B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
• C08J 5/10 - Reinforcing macromolecular compounds with loose or coherent fibrous material characterised by the additives used in the polymer mixture
• C08K 3/013 - Fillers, pigments or reinforcing additives
• C08K 3/22 - OxidesHydroxides of metals
• C08K 5/521 - Esters of phosphoric acids, e.g. of H3PO4
• H05K 1/03 - Use of materials for the substrate

Abstract

An SiC epitaxial wafer according to the present embodiment comprises: an SiC substrate which has a micropipe; and an SiC epitaxial layer which is formed on the SiC substrate. The SiC epitaxial layer has a density of stacking faults caused by the micropipe of the SiC substrate of less than 0.067 per cm2.

IPC Classes  ?

• C30B 29/36 - Carbides
• C30B 25/20 - Epitaxial-layer growth characterised by the substrate the substrate being of the same materials as the epitaxial layer