POLYMER EMULSION, STORAGE METHOD THEREFOR, TWO-PACK TYPE HEAT-CURABLE RESIN COMPOSITION USING SAID POLYMER EMULSION, CURED RESIN FILM, AND COATING FILM
The purpose of the present invention is to provide a polymer emulsion having excellent preservation stability, a thermosetting resin composition containing the polymer emulsion, and having excellent curability at low temperature, a coating material containing the thermosetting resin composition, a resin cured film obtained by curing the thermosetting resin composition, a coating film including the resin cured film, and a method for storing the polymer emulsion. The present invention includes an invention of a polymer emulsion (B) including a polymer (A) containing a constituent unit (A-1), and water, wherein a content ratio of the constituent unit (A-1) when a total content of all constituent units of the polymer (A) is defined as 100 mol % is 0.5 mol % or more and 40 mol % or less.
Provided is a method for producing a cured product of a resin composition, the method making it possible to obtain a cured product with good physical properties from a resin composition containing an ethylenically unsaturated group-containing resin. The method for producing a cured product of a resin composition according to the present invention irradiates, with light emitted from a light-emitting diode, a resin composition containing an ethylenically unsaturated group-containing resin (A), an ethylenically unsaturated group-containing monomer (B), a photopolymerization initiator (C), and a dye (D) to cure the resin composition. The dye (D) has a maximum absorption wavelength in the 400-1100 nm wavelength range. The light emitted from the light-emitting diode includes light (1) which is in the absorption wavelength range of the photoinitiator (C) and light (2) which is in the absorption wavelength range of the dye (D).
C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
C08F 290/00 - Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
This laminate includes: a base material; and a silver particle layer that is provided on the base material and that contains silver particles. The silver particle layer has an L*of 75 or more in the L*a*b* color system, and has radio wave permeability.
B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
4.
SEALING MATERIAL FOR POWER SEMICONDUCTOR DEVICE, SEALING MEMBER, AND POWER SEMICONDUCTOR DEVICE
The present disclosure relates to a sealing material for use in power semiconductor devices, the sealing material containing a compound having a vinyl phenyl group.
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
C08F 32/08 - Homopolymers or copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
A polishing liquid for CMP containing abrasive grains, a nitrogen-containing compound having an aromatic ring, and water, wherein the abrasive grains include cerium-based particles, and the zeta potential of the abrasive grains is negative. A polishing method comprising a step for using the polishing liquid for CMP to polish a surface to be polished.
In this method for manufacturing a semiconductor device, first, a substrate 10A having a support substrate 11A, and a conductive part 12A and a polyimide film 13A provided on the support substrate 11A is prepared. Thereafter, a surface-side part 132 of the polyimide film 13A is cut by a fly-cutting method. In the method for manufacturing a semiconductor device, the tensile elastic modulus of an organic insulating material constituting the polyimide film 13A is 3.5 GPa or less. By using the organic insulating material having such a tensile elastic modulus, the wear of the device used for the fly-cutting method is suppressed, and the surface roughness of the substrate 10A can be reduced. The substrate 10A with the abovementioned features can be used, for example, for hybrid bonding.
In this method for manufacturing a semiconductor device, prepared first is a substrate 10 that includes a support substrate 11, conducting sections 12 disposed on the support substrate 11, and a polyimide film 13 disposed on the support substrate 11 and the conducting sections 12. In the prepared substrate 10, the polyimide film 13 includes: a first portion 13a that covers a front surface of the support substrate 11 and side surfaces of the conducting sections 12; and a second portion 13b that is located on the first portion 13a and covers an upper surface of the conducting sections 12. In this method for manufacturing a semiconductor device, after at least part of the second portion 13b is cut away by fly-cutting while leaving the first portion 13a, the front surface of the polyimide film 13 is polished. This makes it possible to shorten labor time in a polishing step and easily reduce the surface roughness of the substrate 10. This substrate 10 can be used, for instance, for hybrid bonding.
H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/3205 - Deposition of non-insulating-, e.g. conductive- or resistive-, layers, on insulating layersAfter-treatment of these layers
H01L 21/768 - Applying interconnections to be used for carrying current between separate components within a device
H01L 23/522 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
Disclosed is a film-like adhesive containing a thermosetting resin component and an elastomer. In a DSC curve of the film-like adhesive obtained by differential scanning calorimetry under conditions of a temperature increase rate of 10 °C/min and a measurement temperature range of 30-300 °C, an onset temperature of an exothermic peak observed in the DSC curve is 165 °C or less, a peak temperature is 185 °C or less, and a calorific value is 90 J/g or more.
The member for wiring formation 1, which is an example of an adhesive film with a metal layer, comprises a metal layer 20 and an adhesive layer 10 disposed on the metal layer 20. The adhesive layer 10 includes copper particles 12 and a thermosetting resin composition. The content of the copper particles 12 is 6 vol% or less based on the total volume of the adhesive layer 10.
A wiring formation member 1 that is one example of an adhesive film with a metal layer comprises a metal layer 20 and an adhesive layer 10 that is provided on the metal layer 20. The adhesive layer 10 includes conductive particles 12 and a curable resin composition. A cured product of the adhesive layer 10 has a coefficient of thermal expansion of 1.5%–3.0% when heated from 40°C to 260°C.
Provided is a pipe lining material containing: a composite material (D) including a resin composition and a fiber base material (d); an inner film disposed on one surface of the composite material (D); and an outer film disposed on the other surface. The resin composition includes an ethylenically unsaturated group-containing resin (A), an ethylenically unsaturated group-containing monomer (B), and a photopolymerization initiator (C). The inner film is a colored film that has the maximum absorption wavelength in a wavelength region of 400-1100 nm and transmits light.
B29C 63/26 - Lining or sheathing of internal surfaces
B29C 63/34 - Lining or sheathing of internal surfaces using tubular layer or sheathings
B32B 5/28 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
C08F 290/00 - Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
12.
METHOD FOR PRODUCING OLEFIN-CONTAINING COMPOSITION AND CATALYST FOR PRODUCTION OF OLEFIN-CONTAINING COMPOSITION
Disclosed is a method for producing an olefin-containing composition, the method being characterized by including a step for decomposing a plastic in the presence of zeolite so as to produce an olefin-containing composition that contains an olefin having 2 to 5 carbon atoms. This method for producing an olefin-containing composition is also characterized in that the zeolite is at least one selected from the group consisting of a beta type zeolite containing Rb+and a mordenite type zeolite containing Rb+.
C07C 4/22 - Preparation of hydrocarbons from hydrocarbons containing a larger number of carbon atoms by depolymerisation to the original monomer, e.g. dicyclopentadiene to cyclopentadiene
B01J 29/18 - Crystalline aluminosilicate zeolitesIsomorphous compounds thereof of the mordenite type
B01J 29/70 - Crystalline aluminosilicate zeolitesIsomorphous compounds thereof of types characterised by their specific structure not provided for in groups
B01J 37/02 - Impregnation, coating or precipitation
C08J 11/10 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation
C10G 1/10 - Production of liquid hydrocarbon mixtures from oil shale, oil-sand, or non-melting solid carbonaceous or similar materials, e.g. wood, coal from rubber or rubber waste
13.
SEMICONDUCTOR DEVICE PRODUCTION METHOD AND DICING–DIE BONDING INTEGRATED FILM
This semiconductor device production method includes: a step for, in a heated condition, affixing a film B of a dicing–die bonding integrated film which includes a dicing film (film A) that has a base material film and an adhesive layer provided on the base material film and a die bonding film (the film B) that is provided on the adhesive layer to a plurality of semiconductor chips obtained by singulating a semiconductor wafer; and a step for expanding the film A in a cooled condition, thereby singulating the film B, and manufacturing semiconductor chips with film B pieces, each comprising a semiconductor chip and a film B piece obtained by singulating the film B. The film B has a thickness of 20 μm or less. The tensile stress when stretched by 20% at 0°C via a tensile test of the film A is 15 MPa or greater. The thermal shrinkage at 70°C via thermomechanical analysis is 5% or less.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
14.
DESIGN SUPPORT DEVICE, LEARNING DEVICE, DESIGN SUPPORT METHOD, LEARNING METHOD, AND PROGRAM
This design support device supports design of a metal-supported zeolite catalyst by using a machine learning model that has been trained on a correspondence relationship between a reaction yield of a compound and a parameter of zeolite and a parameter of a metal cation that is supported by ion exchange, the design support device comprising: a parameter generation unit that generates an exhaustive combination of parameters of the zeolite and parameters of the metal cation; a prediction unit that predicts a reaction yield of the compound corresponding to the combination by using the trained machine learning model; and a candidate output unit that outputs data of a candidate metal-supported zeolite catalyst, on the basis of a reaction yield of the compound corresponding to the predicted combination.
Disclosed is a pipe lining material which contains a resin composition and a composite material (E) that contains a fiber base material (e). The resin composition contains an ethylenically unsaturated group-containing resin (A), an ethylenically unsaturated group-containing monomer (B), a photopolymerization initiator (C), and a dye (D). The dye (D) has a maximum absorption wavelength in the wavelength range of 450 nm to 1100 nm. The content of the dye (D) in the resin composition is 0.003 part by mass or more relative to a total of 100 parts by mass of the ethylenically unsaturated group-containing resin (A) and the ethylenically unsaturated group-containing monomer (B).
B29C 63/26 - Lining or sheathing of internal surfaces
C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
C08F 290/00 - Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
16.
METHOD FOR PRODUCING CURED PRODUCT OF RESIN COMPOSITION
The present invention provides a method for producing a cured product of a resin composition, with which it is possible to obtain a cured product having good physical properties from a resin composition that contains an ethylenically unsaturated group-containing resin. This method for producing a cured product of a resin composition comprises irradiating a resin composition which contains an ethylenically unsaturated group-containing resin (A), an ethylenically unsaturated group-containing monomer (B), and a photopolymerization initiator (C) with light emitted from a light-emitting diode through a colored film so as to cure the resin composition, the colored film having a maximum absorption wavelength within the wavelength range of 400 nm to 1,100 nm, and the light emitted from the light-emitting diode including light (1) in the absorption wavelength range of the photopolymerization initiator (C) and light (2) in the absorption wavelength range of the colored film.
C08F 2/44 - Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
C08F 290/00 - Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
17.
SEALING MATERIAL, SEALING MEMBER, AND SEMICONDUCTOR DEVICE
The present disclosure relates to: a sealing material containing a compound having a vinyl phenyl group; a sealing member containing a cured product obtained by using the sealing material; an electronic component device having the sealing member; and the like.
C08G 8/36 - Chemically modified polycondensates by etherifying
C08F 299/02 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
18.
SEALING MATERIAL, SEALING MEMBER, AND SEMICONDUCTOR DEVICE
The present disclosure pertains to a sealing material containing a compound having a structural unit represented by formula (Bb1) (in formula (Bb1), XE represents an organic group including an aromatic ring (however, the organic group does not include a structure represented by (X1) or (X2)), B independently represents a group including a vinyl phenyl group, R independently represents a substituent, I represents an integer of 1-5, and m represents an integer of 0-10).
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
C08F 32/08 - Homopolymers or copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
The present disclosure relates to a method for producing a semiconductor device including a semiconductor element and a sealer, the method including using a sealing material to form the sealer, the sealing material, when heated under the conditions of a heating temperature of 175°C and a heating time of 2 hours, giving a cured object having a glass transition temperature of 200°C or higher.
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
C08F 32/08 - Homopolymers or copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system having condensed rings
Provided is a method for producing an olefin-containing composition, the method comprising a step for producing an olefin-containing composition containing an olefin having 2 to 5 carbon atoms by decomposing a plastic in the presence of zeolite, wherein the zeolite is an MFI-type zeolite containing Rb+.
C10G 1/10 - Production of liquid hydrocarbon mixtures from oil shale, oil-sand, or non-melting solid carbonaceous or similar materials, e.g. wood, coal from rubber or rubber waste
B01J 29/40 - Crystalline aluminosilicate zeolitesIsomorphous compounds thereof of the pentasil type, e.g. types ZSM-5, ZSM-8 or ZSM-11
C08J 11/16 - Recovery or working-up of waste materials of polymers by chemically breaking down the molecular chains of polymers or breaking of crosslinks, e.g. devulcanisation by treatment with inorganic material
21.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND DICING/DIE-BONDING INTEGRATED FILM
The present invention discloses a method for manufacturing a semiconductor device. The method for manufacturing a semiconductor device includes: a step for preparing a laminate including a dicing/die-bonding integrated film which includes a dicing film (film A) having a substrate film and an adhesive layer provided on the substrate film, and a die bonding film (film B) provided on the adhesive layer, and a plurality of semiconductor chips which are provided on the film B of the integrated film and which are formed by dicing a semiconductor wafer; and a step for dicing the film B by expanding the film A of the laminate under cooling conditions to fabricate film B piece-including semiconductor chips comprising the semiconductor chips and film B pieces obtained by dicing the film B. The tensile stress of the film A at 20% stretching at -15°C as determined by a tensile test is 15 MPa or more, and the elongation at break of the film A at -15°C as determined by the tensile test is 500% or less.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
B26F 3/00 - Severing by means other than cuttingApparatus therefor
B28D 5/00 - Fine working of gems, jewels, crystals, e.g. of semiconductor materialApparatus therefor
B28D 7/04 - Accessories specially adapted for use with machines or devices of the other groups of this subclass for supporting or holding work
This film-like adhesive is composed of a resin composition having thermosetting properties and containing a rubber component, and has a first surface and a second surface. The film-like adhesive has a region which is in the vicinity of the first surface and in which the content of the rubber component increases from the second surface side toward the first surface side. A graph obtained through indentation measurement using an atomic force microscope has: a portion G1 in which the elastic modulus gradually increases, and which starts from a measurement result at the first surface; and a portion G2 in which the elastic modulus remains approximately constant, and which begins from the end point of the portion G1.
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
The purpose of the present disclosure is to provide a method for producing an adhesive film that is capable of suppressing breakage and chipping of an unnecessary portion even when the unnecessary portion is peeled off while winding at a constant conveyance speed, and that improves the production efficiency. The method for producing an adhesive film comprises: a delivery step S01 of delivering a long base material film 2 provided with an adhesive layer 3 on one surface side at a predetermined conveyance speed; a cutting step S02 of precutting the adhesive layer 3 with a cutting line S of a predetermined pattern; and a peeling step S03 of peeling an unnecessary portion F of the adhesive layer 3 from one surface side of the base material film 2 and forming a plurality of adhesive layers 3 having a pattern based on the cutting line S on one surface side of the base material film 2 at predetermined intervals. In the cutting step S02, the unnecessary portion F is divided by a division line D dividing in a width direction B of the base material film 2.
C09J 7/00 - Adhesives in the form of films or foils
H01L 21/301 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to subdivide a semiconductor body into separate parts, e.g. making partitions
A method of producing a semiconductor device including: providing a temporary fixing laminate having a supporting substrate; machining a semiconductor member that is temporarily fixed to the supporting substrate; and separating the semiconductor member from the supporting substrate by irradiating the temporary fixing laminate with light from a side of a rear surface of the supporting substrate. A plurality of the irradiation target regions set at the rear surface are sequentially irradiated with light, and each of the irradiation target regions includes a part of the rear surface. The irradiation target regions adjacent to each other partially overlap with each other as reviewed from a direction perpendicular to the rear surface, and a region in which the plurality of the irradiation target regions are combined includes the entire rear surface.
This film adhesion test method comprises: forming, in a film formed on a base, notches reaching the base; attaching an adhesive sheet to a surface of the film in which the notches have been formed; and peeling the sheet off the film. The notches are formed by irradiating of the film with laser light.
The present invention efficiently searches for a manufacturing process capable of realizing a material to be designed that satisfies desired mechanical properties. This material manufacturing process search method is a method for searching for a material manufacturing process for designing a material to be designed, and comprises a computer executing: an analysis step of analyzing a relationship between a manufacturing process for the material to be designed and mechanical properties of the material to be designed; an extraction step of extracting a candidate for the manufacturing process for the material to be designed that satisfies a target value of the mechanical properties, on the basis of an analysis result in the analysis step; a calculation step of calculating, using thermodynamic calculation, data indicating a material structure of the material to be designed, the data affecting the mechanical properties; and a determination step of determining the suitability of the candidate for the manufacturing process on the basis of the data indicating the material structure calculated by performing thermodynamic calculation on the candidate for the manufacturing process in the calculation step.
G16C 60/00 - Computational materials science, i.e. ICT specially adapted for investigating the physical or chemical properties of materials or phenomena associated with their design, synthesis, processing, characterisation or utilisation
C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
C22F 1/04 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
C22F 1/18 - High-melting or refractory metals or alloys based thereon
Provided is a resin composition containing an acrylic polymer that is an easily combustible component, the resin composition having exceptional flame retardancy while maintaining excellent adhesive strength with copper foil and desmear resistance. Also provided are a prepreg, a laminated plate, a metal-clad laminated plate, a printed wiring board, and a semiconductor package that are produced using the resin composition. Specifically, the resin composition contains (A) an acrylic polymer, (B) a thermosetting resin, and (C) an inorganic filler that is surface-treated with a silane coupling agent, the resin composition furthermore containing (D) a silane coupling agent.
C08L 101/00 - Compositions of unspecified macromolecular compounds
B32B 27/20 - Layered products essentially comprising synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
This cooling member is provided with: a flow path member that has a pair of plate materials disposed at an interval, and that forms a flow path through which a fluid flows between one of the plate materials and the other plate material; and a pool that is disposed on the upstream side of the flow path across the entire width of the flow path member between the flow path and an inflow port for the fluid, and in which the fluid is stored, the pool satisfying h < W and h < H, where h is the internal height of the flow path, H is the internal height of the pool, and W is the width dimension of the pool in the flow direction of the fluid.
H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
F28D 1/03 - Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with the heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
F28F 3/00 - Plate-like or laminated elementsAssemblies of plate-like or laminated elements
A design support device supports design of a first compound and design of a second compound containing the first compound, and the design support device includes a first design condition proposing unit configured to propose a candidate for design condition information for the first compound that satisfies required property information for the first compound that is input; and a first property predicting unit configured to perform property prediction of the second compound based on design condition information for the second compound that is input.
This sealing material composition contains an epoxy resin, a curing agent, and an inorganic filler, and in the composition, the ratio of 14C to 12C (14C/12C ratio) is 0.05×10-12to 1.2×10-12.
C08G 59/18 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
C08K 3/013 - Fillers, pigments or reinforcing additives
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
31.
TEST METHOD FOR FILM ADHESION, METHOD FOR PRODUCING STRUCTURE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT DEVICE
Provided is a test method for film adhesion which comprises: forming incisions in a film formed on a substrate, so that the incisions reach the substrate; applying a pressure-sensitive adhesive sheet to the surface of the film having the incisions; and peeling the sheet from the film. The incisions are formed by irradiating the film with laser light.
This core piece is of a stator core of an axial gap motor, the core piece being obtained by pressing a soft magnetic powder which has been coated with an insulating material. The core piece comprises: a tooth part that has a peripheral surface around which a winding is wound; a first flange part that is connected to an end part on one side of the tooth part; and a second flange part that is connected to an end part on the reverse side of the tooth part from the first flange part. The peripheral surface of the tooth part has: an inner peripheral part; an outer peripheral part that is located on the reverse side from the inner peripheral part; and a first side peripheral part and a second side peripheral part that are connected to the inner peripheral part and the outer peripheral part so as to face each other. A first inner-peripheral-side side end, which is an end part on the side of the first side peripheral part that is toward the inner peripheral part, approaches a second inner-peripheral-side side end, which is an end part on the side of the second side peripheral part that is toward the inner peripheral part, the further toward the inner peripheral part.
H02K 1/02 - Details of the magnetic circuit characterised by the magnetic material
H02K 1/18 - Means for mounting or fastening magnetic stationary parts on to, or to, the stator structures
H02K 15/02 - Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of stator or rotor bodies
H02K 21/24 - Synchronous motors having permanent magnetsSynchronous generators having permanent magnets with stationary armatures and rotating magnets with magnets axially facing the armatures, e.g. hub-type cycle dynamos
33.
RESONANCE SOUND ABSORBER, TIRE, AND METHOD FOR MOUNTING RESONANCE SOUND ABSORBER
Provided is a resonance sound absorber to be mounted in an inner cavity portion of a tire. The resonance sound absorber comprises a resonance box including a self-standing outer wall, a hollow portion formed in the inside of the outer wall, and an opening that opens the hollow portion to the outside of the outer wall. The outer wall comprises a bottom wall portion attached to the inner cavity portion and a top wall portion that forms the hollow portion between this top wall and the bottom wall portion. The top wall portion curves in a protruding shape. Provided is a tire comprising the above-mentioned resonance sound mounted in an inner cavity portion. Provided is a method for mounting resonance sound absorber. This method mounts the resonance sound absorber to an inner cavity portion of a tire, the method comprising: a preprocessing step of polishing a mounting region of the inner cavity portion where the resonance sound absorber is to be mounted; and an affixing step of affixing the resonance sound absorber to the mounting region after the preprocessing step.
This replacement door member comprises: a panel member which constitutes a door for a vehicle and to which door glass is not adhered; and an adhesive which is provided to the panel member in a door glass adhesion region, has a flat surface on the opposite side from the panel member side, and retains curability.
A cleaning composition containing: a main material of a cleaning composition; and an amine compound which does not contain an amino group at the terminal of the molecular chain and does contain an amino group at a position other than the terminal of the molecular chain.
A cleaning composition containing: a main material of a cleaning composition; and an amine compound which does not contain an amino group at the terminal of the molecular chain and does contain an amino group at a position other than the terminal of the molecular chain.
This resin composition comprises an epoxy resin, an active ester compound as a curing agent, an inorganic filler containing silica, and a cyclic carbodiimide compound.
This semiconductor device comprises: a substrate; a rectangular first semiconductor chip arranged on the substrate; a plurality of spacers arranged around the first semiconductor chip on the substrate; a second semiconductor chip opposing the substrate so as to cover the first semiconductor chip; and an adhesive layer provided on a surface on the first semiconductor chip side of the second semiconductor chip and adhered to the first semiconductor chip and the plurality of spacers. The plurality of spacers include: a first main spacer and a second main spacer respectively disposed on both sides of the first semiconductor chip in a long-side direction of the first semiconductor chip; and a first additional spacer and a second additional spacer respectively disposed on both sides of the first semiconductor chip in a short-side direction of the first semiconductor chip.
H01L 25/07 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass
H01L 25/18 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices the devices being of types provided for in two or more different main groups of the same subclass of , , , , or
H01L 25/065 - Assemblies consisting of a plurality of individual semiconductor or other solid-state devices all the devices being of a type provided for in a single subclass of subclasses , , , , or , e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group
H10B 80/00 - Assemblies of multiple devices comprising at least one memory device covered by this subclass
39.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR MEMBER
Disclosed is a method for bonding a bridge die 20 having a TSV 23 to a rewiring layer by thermocompression bonding (TCB). In this method, a terminal electrode 22 on the bridge die 20 and an upper end 23a of the TSV 23 are covered with a thermosetting resin film (for example, DAF) to form and cure a resin layer 24. Thereafter, a metal collet C for drawing the bridge die 20 is heated and heat is transferred to an entire surface 24a of the resin layer 24 while a pressure is applied thereto, and a lower end 23b of the TSV 23 and a wiring electrode of the rewiring layer are heat-bonded. According to this method, since heat is transferred from the metal collet C to substantially the entire surface of the bridge die 20, the amount of heat transferred to the junction between the lower end 23b of the TSV 23 and the wiring electrode is increased compared with a method by which heat is only transferred to the outer edge while avoiding the terminal electrode. The pressure at the time of heat-bonding can also be applied to substantially the entire surface of the resin layer 24. Thus, thermocompression bonding can be reliably performed.
Aluminum alloy ingot containing Cu: 0.3 to 1.0 mass %, Mg: 0.6 to 1.2 mass %, Si: 0.9 to 1.4 mass %, Mn: 0.4 to 0.6 mass %, Fe: 0.1 to 0.7 mass %, Cr: 0.09 to 0.25 mass %, and Ti: 0.012 to 0.035 mass %, and in an X-ray diffraction pattern measured using Cu-Kα rays, a peak height of a diffraction peak at a diffraction angle 2θ of 41.6 to 42.0° is a value smaller than 6 times a standard deviation of a background X-ray intensity in a range of a full width at half maximum of the diffraction peak, and in a heat-treated product after heating at 450° C. for 1 hour, a peak height of the diffraction peak at a diffraction angle 2θ of 41.6 to 42.0° is 15 times or more a standard deviation of the background X-ray intensity in the range of a full width at half maximum of the diffraction peak.
C22F 1/047 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with magnesium as the next major constituent
B22D 11/00 - Continuous casting of metals, i.e. casting in indefinite lengths
B22D 11/045 - Continuous casting of metals, i.e. casting in indefinite lengths into open-ended moulds for horizontal casting
C22C 21/02 - Alloys based on aluminium with silicon as the next major constituent
The cooling structure has a refrigerant inlet, a refrigerant outlet, and a flow path made of resin and connecting the refrigerant inlet and the refrigerant outlet, in which a portion of a face configuring the flow path is open.
A method for producing a structure, the structure including a support member and a cured product of a thermosetting resin composition disposed at one face of the support member, the method including: disposing a thermosetting resin composition at both faces of the support member; curing the thermosetting resin composition; and removing a cured product of the thermosetting resin composition disposed at another face of the support member.
A method for evaluating a SiC substrate according to the present embodiment includes: an image acquisition step of acquiring an X-ray topographic image of an entire first surface of a SiC substrate; and an estimation step of estimating a basal plane dislocation density of the SiC substrate from the X-ray topographic image of the entire first surface of the SiC substrate based on learning results of deep learning.
A SiC ingot according to the present embodiment has been identified a value of a basal plane dislocation density obtained by directly measuring at least one of a Si-face, a C-face, and a side-face.
A detergent composition contains a main material of the detergent composition and an amine compound containing an amino group at a position other than the end of the molecular chain, and has a moisture content of 8 mass % or less.
Disclosed is a method for bonding a bridge die 20 provided with TSVs 23 to a rewiring layer through thermocompression bonding (TCB). The method involves covering terminal electrodes 22 on the bridge die 20 and upper ends 23a of the TSVs 23 with a thermosetting resin film (for example, a DAF) to form a resin layer 24 and curing the same. Thereafter, a metal collet C for suctioning the bridge die 20 is heated, pressure is applied while heat is transferred to the entire surface 24a of the resin layer 24, and lower ends 23b of the TSVs 23 and a wiring electrode of the rewiring layer are heat-bonded. According to this method, heat is transferred from the metal collet C to almost the entire surface of the bridge die 20, and thus the quantity of heat transferred to a bonding part between the lower ends 23b of the TSVs 23 and the wiring electrode is increased compared to a method for transferring heat only to an outer edge while avoiding terminal electrodes. Moreover, pressure during heat-bonding can also be applied to almost the entire surface of the resin layer 24. Therefore, the thermocompression bonding can be surely performed.
A detergent composition contains a main material of the detergent composition and an amine compound containing an amino group at a position other than the end of the molecular chain, and has a moisture content of 8 mass % or less.
The present invention provides: a resin composition which exhibits low transmission loss and excellent flame retardancy, and can improve the appearance of a laminate; and the like. Specifically, the resin composition is as follows. The resin composition contains (A) a thermosetting resin, (B) a polymer that has a hydrocarbon chain or a polyether chain, (X) a phosphorus compound-based flame retardant, and (Y) a flame retardant other than the phosphorus compound-based flame retardant, wherein: in cases where the (X) component does not contain (X1) a filler flame retardant, and the (Y) component does not contain (Y1) a filler flame retardant, or in cases where the (X) component contains (X1) a filler flame retardant or the (Y) component contains (Y1) a filler flame retardant, the total content of the (X1) filler flame retardant and the (Y1) filler flame retardant is 25 parts by mass or less with respect to 100 parts by mass of the solid content in the resin composition.
C08L 101/00 - Compositions of unspecified macromolecular compounds
B32B 5/28 - Layered products characterised by the non-homogeneity or physical structure of a layer characterised by the presence of two or more layers which comprise fibres, filaments, granules, or powder, or are foamed or specifically porous one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
C08K 3/013 - Fillers, pigments or reinforcing additives
A bump-equipped circuit member 1 comprises a substrate 2, an electrode 3 provided to one surface of the substrate 2, and a bump 4 provided to the electrode 3. The bump 4 includes electroconductive particles 11, and a base layer 5 that contains tin or a tin alloy and electrically connects the electroconductive particles 11 and the electrode 3 in a state of covering at least some of the electroconductive particles 11. The base layer 5 includes an alloy layer 5A with a metal constituting the electrode 3, and an eutectic solder layer 5B.
H01L 21/60 - Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
This resin composition contains an epoxy resin, an active ester compound that serves as a curing agent, a high dielectric inorganic filler, and a cyclic carbodiimide compound.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
H01B 3/40 - Insulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances plasticsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances resinsInsulators or insulating bodies characterised by the insulating materialsSelection of materials for their insulating or dielectric properties mainly consisting of organic substances waxes epoxy resins
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
51.
SILICON-CONTAINING OXIDE-COATED ALUMINUM NITRIDE PARTICLE AND METHOD OF MANUFACTURING THE SAME
A silicon-containing oxide-coated aluminum nitride particle including an aluminum nitride particle and a silicon-containing oxide coating covering the surface of the aluminum nitride particle. The content of carbon atoms is less than 1000 ppm by mass, and an Si/Al atom ratio of the surface as measured by AES analysis is 0.29 or more and 5.0 or less. In another aspect, the coverage of the silicon-containing oxide coating covering the surface of the aluminum nitride particle as measured by LEIS analysis is 15% or more and 100% or less.
One embodiment relates to a thermosetting resin composition containing (A) a resin having at least one group selected from the group consisting of an acid anhydride group and a carboxy group, (B) an ion trapping agent containing Zr, Mg, and Al, (C) an inorganic filler, and (D) an epoxy resin.
One embodiment of the present invention pertains to a thermosetting resin composition containing: a resin having at least one group selected from the group consisting of acid anhydride groups and a carboxy group; and a trifunctional amine-type epoxy resin.
An adhesive composition comprising a cationically polymerizable compound and a curing agent, wherein the curing agent is a salt of a nitrogen-containing cation with an anion represented by general formula (1). [In formula (1), R1 represents a fluoroalkyl group, a fluoroaryl group, or a fluoroalkyl-substituted aryl group, m is 0 or 1, and n is an integer of 1-4.]
C09J 201/02 - Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups
C07F 5/00 - Compounds containing elements of Groups 3 or 13 of the Periodic Table
C08G 59/68 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups characterised by the catalysts used
This simulation device is provided with: a selection unit that selects target coordinates in a structural space; an addition unit that adds a potential to the target coordinates; a calculation unit that calculates time evolution of the structural space in a first time interval by a first principle calculation; and a prediction unit that predicts time evolution in a second time interval on the basis of a prediction model in which the time is used as an explanatory variable and the target coordinates that have changed due to the application of an artificial force derived from the potential are used as objective variables.
G16C 10/00 - Computational theoretical chemistry, i.e. ICT specially adapted for theoretical aspects of quantum chemistry, molecular mechanics, molecular dynamics or the like
A main purpose of the present disclosure is to provide an adhesive composition which contains a (meth)acrylate having a fluorine-containing organic group and which nevertheless can give cured objects having sufficient adhesion strength and a high infrared-light transmittance. The adhesive composition comprises a (meth) acrylate compound, an epoxy compound, a crosslinking agent, and a photoacid generator. The (meth) acrylate compound includes a (meth) acrylate having a fluorine-containing organic group. The crosslinking agent includes a (meth)acrylic resin comprising a first structural unit, which is derived from a (meth)acrylate having a fluorine-containing organic group, and a second structural unit, which is derived from a (meth)acrylate having a cyclic ether group.
Disclosed is a method for producing a (meth)acrylic resin solution. The method for producing a (meth)acrylic resin solution includes a step in which one or more monomers including a (meth)acrylate compound are polymerized in a solvent having a cyclic ether group but not having a radically polymerizable group, thereby obtaining a (meth)acrylic resin solution.
This method for affixing a film adhesive material comprises: a step for winding one film adhesive material onto one end surface and both plate surfaces of a heated plate member extending in one direction; a step for pressing the one film adhesive material onto both of the plate surfaces; a step for pressing the one film adhesive material onto the one end surface; a step for winding another film adhesive material onto another end surface and both of the plate surfaces of the heated plate member and overlapping the other film adhesive material and the one film adhesive material on both of the plate surfaces; a step for pressing the other film adhesive material onto both of the plate surfaces; and a step for pressing the other film adhesive material onto the other end surface.
This resin composition for molding comprises a curable resin and an inorganic filler containing alumina particles and at least one of calcium titanate particles and strontium titanate particles. The total content of the calcium titanate particles and the strontium titanate particles is 5.0 vol% to 15.0 vol% with respect to the whole inorganic filler, and the content of the whole inorganic filler exceeds 60 vol% with respect to the whole resin composition for molding.
C08L 101/00 - Compositions of unspecified macromolecular compounds
C08G 59/18 - Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
C08K 3/013 - Fillers, pigments or reinforcing additives
The present invention discloses a crosslinking agent. The crosslinking agent contains a (meth)acrylic resin which has a first structural unit derived from a (meth)acrylate that has a fluorine-containing organic group and a second structural unit derived from a (meth)acrylate that has a cyclic ether group.
The polyimide-based resin precursor contains at least one of a constituent unit represented by formula (A1) or a constituent unit represented by formula (A2). At least one of R2or R3is an optionally substituted aromatic group, at least one of R2or R3is a group containing a photopolymerizable group, and R4 represents an aromatic group substituted with a group containing a photopolymerizable group.
C08G 73/06 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromoleculePolyhydrazidesPolyamide acids or similar polyimide precursors
C07C 235/00 - Carboxylic acid amides, the carbon skeleton of the acid part being further substituted by oxygen atoms
62.
METHOD FOR MANUFACTURING WIRING BOARD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, WIRING BOARD, AND SEMICONDUCTOR DEVICE
This method for manufacturing a wiring board comprises: a step for forming a first insulating layer on a support substrate; a step for forming a resist layer on the first insulating layer; a step for forming a plurality of openings including a first opening and a second opening for a wiring electrode and a third opening for a dummy electrode in the resist layer; a step for forming a first wiring electrode and a second wiring electrode in the first opening and the second opening, respectively; a step for forming a first dummy electrode in the third opening; a step for removing the resist layer after forming the first wiring electrode, the second wiring electrode, and the first dummy electrode; and a step for forming a second insulating layer on the first insulating layer so as to cover at least the first dummy electrode. In this manufacturing method, the surfaces of the first wiring electrode and the second wiring electrode are exposed from the second insulating layer, and at least a part of the first dummy electrode is positioned between the first wiring electrode and the second wiring electrode.
This resin composition comprises a copolymer (A), a basic catalyst (B), and a solvent (C). The copolymer (A) includes: a structural unit (a) having an acid group; and a structural unit (pb) having a group represented by formula (1) (in formula (1), R1and R4each independently represent a hydrogen atom or a hydrocarbon group having 1-20 carbon atoms, R2and R3 each independently represent a hydrogen atom or a hydrocarbon group having 1-20 carbon atoms, and * represents a link site with respect to a residue resulting from removing the group of formula (1) from the structural unit (pb)). The contained amount of the basic catalyst (B) is 0.5-10 parts by mass with respect to 100 parts by mass of the copolymer (A).
C08F 265/02 - Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group on to polymers of acids, salts or anhydrides
A method for producing a binder pitch for carbon materials, the method comprising: a step (step 1) in which a petroleum-based heavy oil is heat-treated; a step (step 2) in which the heat-treated product obtained in step 1 is distilled to obtain, as a high-boiling-point fraction, a base pitch having a softening point of 60-110°C, a fixed-carbon content of 50.0 mass% or greater, an initial boiling point of 320-450°C, and a quinoline insoluble content (QI) of 1.0 mass% or less; and a step (step 3) in which a carbon powder is added to and mixed with the base pitch obtained in step 2.
Provided is a method for producing a carbon material using, as binder pitch, pitch that has a softening point of 70-120°C, a fixed carbon content of 50.0 mass% or greater, a quinoline-insoluble content of 18.0 mass% or less, an initial boiling point of 320°C or higher, and a Casson yield value of 0.18 Pa or higher at a temperature higher than the softening point by 100°C.
This adhesive agent film for circuit connection contains a thermoplastic resin, a thermosetting component, conductive particles, and a non-conductive filler. The non-conductive filler includes a non-conductive filler MF having an average linear thermal expansion coefficient of 0ppb/°C or less from 30°C to 150°C.
This organic electronics material contains a charge transporting polymer having a branched structure, the charge transporting polymer including a trivalent structural unit represented by formula (a) and a divalent structural unit represented by formula (b). The charge transporting polymer has a structure which is formed by direct bonding of at least one binding site in the trivalent structural unit and at least one binding site in the divalent structural unit, and which is represented by formula (I). The charge transporting polymer has a weight-average molecular weight of 2,000-500,000. In the formula, Ar1represents a trivalent organic group derived from an aromatic hydrocarbon or an aromatic heterocyclic ring having 2-30 carbon atoms or triaryl amine; Ar2 represents a monovalent organic group derived from an aromatic hydrocarbon having 6-30 carbon atoms and having an electron-withdrawing group or an electron-donating group; and * represents a binding site with another structure.
This organic electronics material includes a charge transporting polymer having a branched structure, a weight average molecular weight of 2,000-500,000, and a structure that is represented by formula (I), that includes a trivalent structural unit represented by formula (a), a divalent structural unit represented by formula (b), and a polymerizable functional group, and that is formed through direct binding of at least one binding hand in the trivalent structural unit and at least one binding hand in the divalent structural unit. In the formulae, Ar1represents an aromatic heterocyclic ring or an aromatic hydrocarbon having 2-30 carbon atoms, or a trivalent organic group derived from triarylamine, Ar2 represents a monovalent organic group derived from an aromatic hydrocarbon having 6-30 carbon atoms, and * represents a binding site with respect to other structures.
C08F 299/02 - Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
Provided is a method for producing an arylamine polymer, the method comprising: reacting a starting material monomer that contains an aromatic compound (A) having two or more triflate groups or halogen atoms directly bonded to an aromatic ring and an aromatic compound (B) having an amino group in the presence of a palladium-containing catalyst and a water-insoluble organic solvent so as to form a reaction liquid that contains an arylamine polymer; forming a mixed liquid comprising the reaction liquid, water, and a water-soluble organic solvent that is compatible with the water-insoluble organic solvent; separating the mixed liquid into an organic phase and an aqueous phase; and recovering the organic phase.
Provided is a method for producing silicon-containing oxide-coated aluminum nitride particles comprising aluminum nitride particles and a silicon-containing oxide film covering the surfaces of the aluminum nitride particles, the method comprising: a first step for crushing agglomerates contained in raw aluminum nitride particles to obtain crushed aluminum nitride particles; a second step for covering the surfaces of the crushed aluminum nitride particles with an organosilicon compound having a specific structure to obtain organosilicon compound-coated aluminum nitride particles; and a third step for heating the organosilicon compound-coated aluminum nitride particles at a heating temperature of 300°C or higher and lower than 1000°C, wherein the reduction rate of the loose bulk density of the crushed aluminum nitride particles relative to the loose bulk density of the raw aluminum nitride particles is at least 10%.
This resin composition for molding contains: an epoxy resin; a curing agent; a release agent including a polyethylene oxide having a weight average molecular weight of 3,500 or more; and an inorganic filler including alumina.
C08L 23/30 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers modified by chemical after-treatment by oxidation
C08L 35/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereofCompositions of derivatives of such polymers
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
72.
MOLDING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
This molding resin composition comprises: an epoxy resin; a curing agent; a release agent containing an oxidized polyethylene; and an inorganic filler containing alumina. A parameter P calculated by formula A on the basis of the weight average molecular weight of the oxidized polyethylene and the content of the oxidized polyethylene with respect to 100 parts by mass of the epoxy resin is 300-1500. In formula A, Mi represents the weight average molecular weight of a type no. i oxidized polyethylene, and Ri represents the content of the type no. i oxidized polyethylene with respect to 100 parts by mass of the epoxy resin.
C08L 23/30 - Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bondCompositions of derivatives of such polymers modified by chemical after-treatment by oxidation
C08L 35/00 - Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereofCompositions of derivatives of such polymers
H01L 23/29 - Encapsulation, e.g. encapsulating layers, coatings characterised by the material
H01L 23/31 - Encapsulation, e.g. encapsulating layers, coatings characterised by the arrangement
73.
ADHESIVE SET, STRUCTURE AND METHOD FOR PRODUCING SAME
Disclosed is an adhesive set that comprises a main agent and a curing agent. The main agent contains a urethane prepolymer. The curing agent contains a polyol including a polyol having a glass transition temperature of 0°C or lower. At least one of the main agent and the curing agent contains a filler including calcium carbonate. The average hydroxyl value of the polyol is 50 mg KOH/g or less. The average number of hydroxyl groups in the polyol is 2.5 or less. The content of the polyol having a glass transition temperature of 0°C or lower is 20 mass% or more relative to the total amount of the main agent and the curing agent. The content of the calcium carbonate is 10 mass% or more relative to the total amount of the main agent and the curing agent.
A wiring-forming member 1 includes an adhesive layer 10 containing conductive particles 12, and a metal layer 20 disposed on the adhesive layer 10. The adhesive layer 10 includes a first adhesive layer 15 containing the conductive particles 12 and an adhesive component, and a second adhesive layer 16 containing an adhesive component.
A polyimide resin precursor including at least one of a structural unit represented by formula (A1) and a structural unit represented by formula (A2), wherein at least one of R2and R3is an optionally substituted aromatic group, and R4 represents an optionally substituted aromatic group.
C08G 73/06 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromoleculePolyhydrazidesPolyamide acids or similar polyimide precursors
76.
RESIN COMPOSITION, MODIFIED RESIN COMPOSITION, AND METHOD FOR PRODUCING MODIFIED RESIN COMPOSITION
Provided is a resin composition containing a copolymer (A), a basic catalyst (B), and a solvent (C), wherein the copolymer (A) contains a structural unit (a) having an acid group and a structural unit (pb) having a group represented by formula (1) (In formula (1), R1and R4each independently are a hydrogen atom or a C1-20 hydrocarbon group, R2and R3 each independently are a hydrogen atom or a C1-20 hydrocarbon group, and * represents a linking site with a residue obtained by removing the group of formula (1) from the structural unit (pb).), and the basic catalyst (B) has a pKa (acidity constant) at 25°C of 4-12.
C08F 265/02 - Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group on to polymers of acids, salts or anhydrides
Provided is a method for cleaning a high-pressure gas container capable of suppressing generation of water inside the high-pressure gas container. The method for cleaning the high-pressure gas container comprises: a pressure accumulation purge step for purging the inside of the high-pressure gas container; and a cleaning step for cleaning the inside of the high-pressure gas container that has undergone the pressure accumulation purge step. The pressure accumulation purge step includes: a depressurization stage of bringing the inside of the high-pressure gas container into a depressurized state; and an inert gas supply stage of supplying an inert gas to the high-pressure gas container. The cleaning step includes: a hydrogen halide supply stage of supplying hydrogen halide to the high-pressure gas container that has undergone the pressure accumulation purge step; a metal oxide removal stage of generating water by reacting the metal oxide, which exists on the inner surface of the high-pressure gas container, with the hydrogen halide, inside the high-pressure gas container that has undergone the hydrogen halide supply stage; and a discharge stage of discharging the water, which was generated in the metal oxide removal stage, and the hydrogen halide from the high-pressure gas container.
Provided is a cleaning method for a high-pressure gas container by which it is possible to suppress the generation of water inside the high-pressure gas container. This cleaning method for a high-pressure gas container includes: a decompression step of decompressing the inside of a high-pressure gas container until an internal pressure becomes 5 Pa or less; and a cleaning step of cleaning the inside of the high-pressure gas container that has been subjected to the decompression step. The cleaning step includes: a hydrogen halide supply stage of supplying hydrogen halide to the high-pressure gas container that has been subjected to the decompression step; a metal oxide removal stage of generating water by causing, inside the high-pressure gas container that has been subjected to the hydrogen halide supply stage, a metal oxide existing on an inner surface of the high-pressure gas container to react with the hydrogen halide supplied in the hydrogen halide supply stage; and a discharge stage of discharging, from the high-pressure gas container, the water generated in the metal oxide removal stage and the hydrogen halide supplied in the hydrogen halide supply stage.
Provided is a polyimide-based resin precursor which contains at least one of a constituent unit represented by formula (A1): [Chemical formula 1] and a constituent unit represented by formula (A2): [Chemical formula 2], wherein at least one of R2and R3represents an aromatic group that may be substituted, and R4 represents an aromatic group that may be substituted.
C08G 73/06 - Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromoleculePolyhydrazidesPolyamide acids or similar polyimide precursors
The present invention addresses the problem of providing an adhesive composition which is capable of securing a sufficient pot life (working life) at room temperature, and is capable of exhibiting a sufficient bonding strength after curing. This adhesive composition contains an organoborane complex, a compound having a radically polymerizable group, and a thermal acid generator. This adhesive composition may additionally contain at least one substance that is selected from the group consisting of a metal halide salt and a compound having a thiocarbonylthio structure.
Disclosed is an adhesive body. The adhesive body comprises a first substrate, a second substrate, and an adhesive layer that bonds the first substrate and the second substrate to each other. The haze of the first substrate and the second substrate is 5% or more. The adhesive layer contains a cured product of an adhesive composition containing: an organoborane complex; a compound having a radically polymerizable group; and a thermal acid generator.
Provided is a corrosion-resistant member that does not tend to react with hydrogen chalcogenide even at high temperature and does not tend to generate chalcogen-containing substances. The corrosion-resistant member is provided in a passivation device having a reaction vessel for performing passivation using a hydrogen chalcogenide gas and forms a portion of the reaction vessel that is in contact with the hydrogen chalcogenide gas. The corrosion-resistant member has a sintered body containing at least one selected from oxides of aluminum, nitrides of aluminum, oxides of zirconium, nitrides of zirconium, oxides of silicon, nitrides of silicon, and nitrides of boron, and the total proportion of oxides of aluminum, nitrides of aluminum, oxides of zirconium, nitrides of zirconium, oxides of silicon, nitrides of silicon, and nitrides of boron in the sintered body is more than 90 mass%.
C04B 35/583 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on boron nitride
C04B 35/14 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on silica
C04B 35/581 - Shaped ceramic products characterised by their compositionCeramic compositionsProcessing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxides based on borides, nitrides or silicides based on aluminium nitride
C04B 41/80 - After-treatment of mortars, concrete, artificial stone or ceramicsTreatment of natural stone of only ceramics
C23C 16/44 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
H01L 21/31 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to form insulating layers thereon, e.g. for masking or by using photolithographic techniquesAfter-treatment of these layersSelection of materials for these layers
This method for producing thin wiring members is for producing a plurality of thin wiring members 1, and comprises: a step for adhering, to a fine wiring layer that has a plurality of wiring parts, an adhesive that has a bending stiffness of 10 × 10-3Nmm2or more; and a step for separating a wiring unit, which has been obtained by adhering the adhesive layer to the fine wiring layer, into individual pieces. This thin wiring member is provided with a fine wiring layer and an adhesive layer that is provided on the fine wiring layer, and the bending stiffness of the adhesive layer is 10 × 10-3Nmm2 or more.
A fluorine-containing ether compound represented by the following formula: R1-[B]-[A]-O—CH2—R2—CH2—O-[C]-[D]-R3 (R1 is an organic group having 7 to 18 carbon atoms, including a group in which a carbonyl carbon atom or nitrogen atom in an amide bond and an aromatic hydrocarbon are directly bonded; R2 is a perfluoropolyether chain; R3 is Formula (2); X1 is a hydrogen atom or an organic group having 7 to 18 carbon atoms, including a group in which a carbonyl carbon atom or nitrogen atom in an amide bond and an aromatic hydrocarbon are directly bonded; [A] is Formula (3-1); [B] is Formula (3-2); [C] is Formula (4-1); [D] is Formula (4-2); and the number of hydroxyl groups in Formula (1) is 3 or more).
A fluorine-containing ether compound represented by the following formula: R1-[B]-[A]-O—CH2—R2—CH2—O-[C]-[D]-R3 (R1 is an organic group having 7 to 18 carbon atoms, including a group in which a carbonyl carbon atom or nitrogen atom in an amide bond and an aromatic hydrocarbon are directly bonded; R2 is a perfluoropolyether chain; R3 is Formula (2); X1 is a hydrogen atom or an organic group having 7 to 18 carbon atoms, including a group in which a carbonyl carbon atom or nitrogen atom in an amide bond and an aromatic hydrocarbon are directly bonded; [A] is Formula (3-1); [B] is Formula (3-2); [C] is Formula (4-1); [D] is Formula (4-2); and the number of hydroxyl groups in Formula (1) is 3 or more).
A prediction apparatus includes a trained model trained by using training data in which a material composition of a material to be learned is associated with a phase fraction of the material to be learned at each temperature within a predetermined temperature range, the trained model being configured to predict a phase fraction at an i+1-th temperature by using a phase fraction predicted by the trained model for one or more temperatures up to an i-th temperature within the predetermined temperature range (where i is an integer of 1 or more). The prediction apparatus is configured to input a material composition of a material to be predicted into the trained model, thereby predicting a phase fraction of the material to be predicted at each temperature within the predetermined temperature range.
A curable resin composition according to one aspect of the present disclosure comprises (A) a rubber component, (B) a compound having an epoxy group, (C) a curing agent, (D) a curing accelerator, and (E) a filler, wherein the rubber component (A) comprises a modified styrene-based elastomer having a degree of modification with maleic anhydride of 1.8-10.0 mass%.
C08L 63/00 - Compositions of epoxy resinsCompositions of derivatives of epoxy resins
B32B 7/12 - Interconnection of layers using interposed adhesives or interposed materials with bonding properties
C08K 3/013 - Fillers, pigments or reinforcing additives
C08K 9/04 - Ingredients treated with organic substances
C08L 53/02 - Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bondsCompositions of derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
A method for manufacturing a semiconductor device includes a tape expanding step of stretching an expansion tape while heating to expand an interval between a plurality of semiconductor chips fixed onto the expansion tape at an expansion rate in a range A per one expansion, a transferring step of transferring the plurality of semiconductor chips to an expansion tape, and repeating the tape expanding step and the transferring step. In a stress-strain curve according to a tensile test of the expansion tape, an elongation range B in which an absolute value of a difference between a MD tensile stress and a TD tensile stress is 2.8 MPa or less overlaps with a part of the range A. The tape expanding step includes expanding the interval by using an elongation value selected from an overlapping range between the range A and the range B as the expansion rate per one expansion.
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
Provided is a method for producing hexafluoro-1,3-butadiene capable of producing hexafluoro-1,3-butadiene at a high yield. The method for producing hexafluoro-1,3-butadiene includes a reaction step of performing dechlorination in which chlorine atoms are eliminated from 1,2,3,4-tetrachlorohexafluorobutane in a reaction solution containing the 1,2,3,4-tetrachlorohexafluorobutane, zinc, at least one of an antioxidant and a polymerization inhibitor, and an organic solvent to yield hexafluoro-1,3-butadiene.
The SiC substrate has a warpage factor F of 300 μm or less, which is obtained from the thickness, the diameter, and a stress at a first outer circumferential end 10 mm inward from an outer circumferential end in the [11-20] direction from a center thereof.
H01L 29/16 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System in uncombined form
H01L 21/66 - Testing or measuring during manufacture or treatment
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A wiring board comprising: conductor wiring; an insulation layer having a first main surface with which a surface of the conductor wiring is brought into firm contact, and a second main surface on the side opposite to the first main surface; a magnetic layer positioned on the second main surface side of the insulation layer; and a conductor layer positioned on the side opposite to the insulation layer with respect to the magnetic layer. The surface or the first main surface has an arithmetic average roughness of 0.1 μm to 5.0 μm.
Disclosed is a photosensitive resin composition which contains a polymer composed of a plurality of kinds of monomers, wherein: the dispersion term of the Hansen solubility parameter as calculated on the basis of the monomers is 16.99 to 17.35 inclusive; the number of carboxylic acids in each molecule as calculated on the basis of the monomers is 0.272 to 0.304 inclusive; the logarithmic value of the octanol/water partition coefficient as calculated on the basis of the monomers is 2.16 to 2.79 inclusive; and the glass transition temperature as calculated on the basis of the monomers is 354 K to 382 K inclusive.
G03F 7/033 - Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
A protective coating composition comprising a urethane resin having a urethane structure and a carbonate structure in the same molecule, and an ethylenically unsaturated compound, wherein the urethane resin is a urethane (meth)acrylate resin, and the erosion resistance of cured products of the protective coating composition is 1.5 hours or more.
This ultrasound element comprises a piezoelectric element that generates ultrasound in the range of 20-100 kHz and an acoustic matching layer that is provided on the piezoelectric element and that includes a resin, wherein the maximum thickness from the surface of the piezoelectric element opposite to the surface on which the acoustic matching layer is disposed to the surface of the acoustic matching layer opposite to the surface on which the piezoelectric element is disposed is not more than 1.5 mm.
A method for manufacturing a semiconductor device is provided, comprising: forming a temporarily bonded body by heating and pressurizing a laminate having a first circuit member, a second circuit member, and a thermosetting adhesive layer by means of pressing members; and forming a connection body by heating the temporarily bonded body in a pressurized atmosphere. The first circuit member may be a semiconductor chip. The laminate is pressed by the pressing members at a predetermined pressure of 1.50 MPa or less. In some or all of the time during which the laminate is heated and pressed by the pressing members, at least one of the pressing members is heated to a temporary bonding temperature equal to or higher than an onset temperature of the thermosetting adhesive layer.
The present invention reduces processing load and improves detection accuracy when detecting a defect. This defect inspection device includes: an image recognition processing unit that performs image recognition processing on captured image data obtained by capturing an image of an inspection target and determines the attributes of regions in the inspection target; a cutting-out unit that cuts out, from the captured image data, partial image data including a region having a specific attribute from among the regions in the inspection target; a prediction unit that predicts the probability of a defect in the partial image data by inputting the partial image data to a trained defect detection model; and a display control unit that superimposes and displays a marker in a display form corresponding to the predicted probability on the position where the partial image data of the captured image data is cut out.
A metal paste for bonding contains metal particles, a dispersion medium, and a sintering accelerator, the metal particles contain copper particles, the sintering accelerator includes a coordinating compound having electron back donation properties, and the coordinating compound is at least one type selected from the group consisting of a nitrogen-containing aromatic heterocyclic compound, an acetylene derivative, an ethylene derivative, an organic arsenic compound, and a cyanide.
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B22F 1/052 - Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
B22F 7/06 - Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting of composite workpieces or articles from parts, e.g. to form tipped tools
B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
H01L 23/00 - Details of semiconductor or other solid state devices
A joint structure including a second panel serving as a member to be joined made from resin, a third adhesive disposed on a join face of the second panel, a bracket serving as a joining member that includes a base made from resin joined to the second panel by the third adhesive and a protruding portion that is contiguous to the base and that protrudes outside from an adhesion region between the base and the second panel, a first coupling portion that is provided at the adhesion region and that couples the bracket and second panel, a second coupling portion that is separated from the first coupling portion at the adhesion region and that couples the bracket and the second panel, and one or more rotation stop portion that is separated from an imaginary line connecting the first coupling portion and the second coupling portion, and that stops the bracket from rotating about an axis of the imaginary line.
This anti-fogging agent contains: silica particles; a silane coupling agent X having a reactive group X; and a polyether compound Y having at least two reactive groups Y capable of reacting with the reactive group X and bonding thereto.
This method for manufacturing a photoelectric composite wiring board includes: a step for forming an optical waveguide by laminating a plurality of layers of different materials on a substrate having a first wiring layer, and while doing so, exposing and developing one layer of the plurality of layers; a step for forming a though-via hole in an insulating layer formed by laminating the plurality of layers; and a step for forming a second wiring layer on the insulating layer, and also forming in the through-via hole a through-via conductor for connecting the first wiring layer and the second wiring layer.
G02B 6/132 - Integrated optical circuits characterised by the manufacturing method by deposition of thin films
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/138 - Integrated optical circuits characterised by the manufacturing method by using polymerisation
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
A method for manufacturing a photoelectric composite wiring board includes the steps for: forming an insulating layer having a plurality of layers composed of different materials on a substrate having a first wiring layer; forming an optical waveguide by exposing at least one layer of the insulating layer; forming a via hole in the insulating layer; forming a second wiring layer on the insulating layer; and forming a via conductor connecting the first wiring layer and the second wiring layer in the via hole.
G02B 6/132 - Integrated optical circuits characterised by the manufacturing method by deposition of thin films
G02B 6/12 - Light guidesStructural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
G02B 6/138 - Integrated optical circuits characterised by the manufacturing method by using polymerisation
H05K 1/11 - Printed elements for providing electric connections to or between printed circuits
