An image analysis system acquires a target image showing one or more objects each of which has a base material and a coating region on the base material, inputs the target image to an instance segmentation model executing instance segmentation to set at least one instance mask corresponding to at least one of the one or more objects, inputs the target image to a semantic segmentation model executing semantic segmentation to set a semantic mask indicating a contour and a coating region of an object set consisting of the at least one object, and identifies, for each of the at least one object, the contour and the coating region of the object based on the at least one instance mask and the semantic mask.
G06V 10/26 - Segmentation de formes dans le champ d’imageDécoupage ou fusion d’éléments d’image visant à établir la région de motif, p. ex. techniques de regroupementDétection d’occlusion
G06V 10/44 - Extraction de caractéristiques locales par analyse des parties du motif, p. ex. par détection d’arêtes, de contours, de boucles, d’angles, de barres ou d’intersectionsAnalyse de connectivité, p. ex. de composantes connectées
G06V 10/774 - Génération d'ensembles de motifs de formationTraitement des caractéristiques d’images ou de vidéos dans les espaces de caractéristiquesDispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant l’intégration et la réduction de données, p. ex. analyse en composantes principales [PCA] ou analyse en composantes indépendantes [ ICA] ou cartes auto-organisatrices [SOM]Séparation aveugle de source méthodes de Bootstrap, p. ex. "bagging” ou “boosting”
G06V 10/82 - Dispositions pour la reconnaissance ou la compréhension d’images ou de vidéos utilisant la reconnaissance de formes ou l’apprentissage automatique utilisant les réseaux neuronaux
G06V 20/69 - Objets microscopiques, p. ex. cellules biologiques ou pièces cellulaires
Provided is a resin composition including: an (A) thermosetting resin; and a (B) acenaphthylene polymer with a number average molecular weight of 1,000 or more.
A photosensitive resin composition contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a sensitizer, in which the photopolymerization initiator contains a hexaarylbiimidazole compound and an N-phenylglycine compound, and the sensitizer contains an anthracene compound.
G03F 7/029 - Composés inorganiquesComposés d'oniumComposés organiques contenant des hétéro-atomes autres que l'oxygène, l'azote ou le soufre
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
H05K 3/10 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché
4.
FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING MEDIUM
Provided is a fluorine-containing ether compound represented by the following formula. R1—CH2—R2[—CH2—R3—CH2—R2]x—CH2—R4 (x represents 1 or 2, R2 represents a perfluoropolyether chain, R3 represents a divalent linking group having one to four polar groups, each R1 and R4 represents an end group having one to four polar groups and having 1 to 50 carbon atoms, at least one of R1 or R4 represents —O—X—CH(OH)—CH2OH (X represents a divalent organic group having 2 to 30 carbon atoms, which may have at least one of one or two polar groups or one to three ether oxygen atoms, and X has at least one carbon atom which is not bonded to either the polar groups or the ether oxygen atoms.)
C10M 105/54 - Compositions lubrifiantes caractérisées en ce que le matériau de base est un composé organique non macromoléculaire contenant des halogènes contenant du carbone, de l'hydrogène, des halogènes et de l'oxygène
C08G 65/331 - Polymères modifiés par post-traitement chimique avec des composés organiques contenant de l'oxygène
C10N 40/18 - Usages électriques ou magnétiques en relation avec des enregistrements sur bandes ou disques magnétiques
G11B 5/725 - Revêtements protecteurs, p. ex. antistatiques contenant un lubrifiant
5.
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING CIRCUIT BOARD
A photosensitive resin composition contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a solvent, in which the solvent contains at least one selected from the group consisting of a ketone-based solvent having an alicyclic skeleton and an aromatic ether-based solvent.
G03F 7/028 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des substances accroissant la photosensibilité, p. ex. photo-initiateurs
G03F 7/32 - Compositions liquides à cet effet, p. ex. développateurs
H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
An embodiment relates to a polyamideimide, including: a structure derived from a compound including at least one selected from the group consisting of a diamine and a diisocyanate, and a structure derived from a carboxylic acid compound including at least a tricarboxylic anhydride, wherein at least one selected from the compound and the carboxylic acid compound includes a compound having a group that includes at least one non-aromatic hydrocarbon group, where a total number of carbon atoms in the at least one non-aromatic hydrocarbon group is eight or more, and at least one selected from the compound and the carboxylic acid compound includes a compound having an aromatic hydrocarbon group.
A selection method for abrasive grains, in which the abrasive grains contain cerium, and the abrasive grains are selected on the basis of a crystallite diameter. Abrasive grains containing cerium, in which a crystallite diameter is 30 nm or more. A polishing liquid containing the above-described abrasive grains and water. A multi-pack polishing liquid having a first liquid containing the above-described abrasive grains and water, and a second liquid containing a component other than the above-described abrasive grains and water, and water. A polishing method including polishing a member to be polished by using the above-described polishing liquid.
This pattern forming method includes: a laminating step of laminating a curable resin layer and a support film on a substrate; a curing step of curing the entire curable resin layer; a processing step of processing the curable resin layer into a predetermined pattern by irradiating the curable resin layer after curing with excimer laser light from a side of the support film through a mask; a peeling step of peeling the support film from the curable resin layer after processing; and a forming step of forming a plating layer using the curable resin layer after processing as a mask, and then removing the curable resin layer to form a wiring pattern by the plating layer on the substrate.
G03F 7/16 - Procédés de couchageAppareillages à cet effet
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G03F 7/115 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires avec des supports ou couches ayant des moyens pour obtenir un effet de réseau ou pour augmenter le contact dans le tirage sous vide
An embodiment relates to a thermosetting resin composition including a resin having at least one group selected from the group consisting of an acid anhydride group and a carboxy group, and a trifunctional amine-type epoxy resin.
Provided is a method for manufacturing an anode where the anode effect is not likely to occur even when an electrolytic solution containing hydrogen fluoride and a metal fluoride is electrolyzed and used for electrolytically synthesizing fluorine gas. The method for manufacturing an anode for fluorine gas electrolytic synthesis includes an anodic treatment step. The anodic treatment step is a step of immersing not only an anode (21) that is an anode substrate including a carbon material but also a cathode (22) in a mixed liquid (10) for manufacturing an anode containing hydrogen fluoride, a metal fluoride, and potassium hexafluoronickelate (IV) and causing a current to flow between the anode (21) and the cathode (22) to perform an anodic treatment of the anode substrate such that nickel fluoride is attached to a surface of the anode substrate.
C25B 11/075 - Électrodes comportant des électro-catalyseurs sur un substrat ou un support caractérisées par le matériau électro-catalytique formé d’un seul élément catalytique ou composé catalytique
11.
FLUORINE-CONTAINING ETHER COMPOUND, LUBRICANT FOR MAGNETIC RECORDING MEDIUM, AND MAGNETIC RECORDING MEDIUM
Provided is a fluorine-containing ether compound represented by Formula (1). R1—CH2—R2—CH2—R3 (1) R2 represents a perfluoropolyether chain. R1 and R3 represent an end group having one to four polar groups and 1 to 50 carbon atoms. At least one of R1 or R3 represents an end group represented by Formula (2). —O—X—CH(OH)—CH2OH (2) X represents a divalent organic group having 2 to 30 carbon atoms, which may have at least one of one or two polar groups or one to three ether oxygen atoms. X has at least one carbon atom which is not bonded to any of the polar groups and the ether oxygen atoms.
An alloy composition calculation apparatus includes an image acquisition unit configured to acquire element images of an alloy; a luminance identifying unit configured to identify, based on luminance values at identical coordinates in the element images, a point in a Cartesian coordinate system in which axes express luminance of the element images respectively; and a composition calculation unit configured to calculate a polar angle for the point, in polar coordinates, as a composition of the alloy.
G01N 23/04 - Recherche ou analyse des matériaux par l'utilisation de rayonnement [ondes ou particules], p. ex. rayons X ou neutrons, non couvertes par les groupes , ou en transmettant la radiation à travers le matériau et formant des images des matériaux
13.
PHOTOSENSITIVE RESIN COMPOSITION, RESIN CURED FILM, COLOR FILTER, AND IMAGE DISPLAY ELEMENT
A photosensitive resin composition according to one embodiment of the present disclosure contains a copolymer (A), a reactive monomer (B), a photopolymerization initiator (C), and a solvent (D). The copolymer (A) includes: a constitutional unit (a-1) having a heterocyclic ring with 5 or more ring members; a constitutional unit (a-2) having a blocked isocyanato group; a constitutional unit (a-3) having a hydroxy group; and a constitutional unit (a-4) having an acid group.
G03F 7/032 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08F 220/28 - Esters contenant de l'oxygène en plus de l'oxygène de la fonction carboxyle ne contenant pas de cycles aromatiques dans la partie alcool
C08F 265/06 - Polymérisation d'esters acryliques ou méthacryliques sur des polymères de ces esters
Provided is a compound powder that has high relative permeability and improves the DC superposition characteristics of a coil component having a magnetic core containing a cured product of the compound powder. The compound powder contains a metal powder and a resin composition. The metal powder is a soft magnetic material. The resin composition includes a heat-curable resin. The D50 of the metal powder is 15-21 μm. The D90 of the metal powder is 35-48 μm.
B22F 3/00 - Fabrication de pièces ou d'objets à partir de poudres métalliques, caractérisée par le mode de compactage ou de frittageAppareils spécialement adaptés à cet effet
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 1/10 - Poudres métalliques contenant des agents lubrifiants ou liantsPoudres métalliques contenant des matières organiques
B22F 1/052 - Poudres métalliques caractérisées par la dimension ou la surface spécifique des particules caractérisées par un mélange de particules de dimensions différentes ou par la distribution granulométrique des particules
H01F 1/20 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre
Provided is a compound that suppresses cracks in cured products of the compound. The compound includes a metal powder and a resin composition. The metal powder is a soft magnetic material. The resin composition includes an epoxy resin and a curing agent. The curing agent includes a first biphenyl aralkyl–type phenol resin and a second biphenyl aralkyl–type phenol resin that have different hydroxyl equivalent weights. The hydroxyl equivalent weight of the first biphenyl aralkyl–type phenol resin is lower than the hydroxyl equivalent weight of the second biphenyl aralkyl–type phenol resin. The resin composition contains 66.8–72.3 parts by mass of the first biphenyl aralkyl–type phenol resin and the second biphenyl aralkyl–type phenol resin per 100 parts by mass of the epoxy resin.
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
H01F 1/20 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre
H01F 1/26 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées les particules étant isolées au moyen de substances organiques macromoléculaires
This solid electrolytic capacitor comprises an anode, a dielectric coating provided on the surface of the anode, and a solid electrolyte layer in contact with the dielectric coating, the solid electrolyte layer containing a conjugated conductive polymer, a polyanion, and an electrical conductivity improving agent, wherein the content of the electrical conductivity improving agent is 76.5-92.5 mass% in 100 mass% of the solid electrolyte layer.
H01G 9/028 - Électrolytes organiques semi-conducteurs, p. ex. TCNQ
C08G 61/12 - Composés macromoléculaires contenant d'autres atomes que le carbone dans la chaîne principale de la macromolécule
H01G 9/00 - Condensateurs électrolytiques, redresseurs électrolytiques, détecteurs électrolytiques, dispositifs de commutation électrolytiques, dispositifs électrolytiques photosensibles ou sensibles à la températureProcédés pour leur fabrication
A slurry containing abrasive grains and water, in which the abrasive grains include cerium oxide particles, a crystallite diameter of the cerium oxide particles is 17.0 nm or more, and a lattice distortion of the cerium oxide particles is 0.10% or more.
A method for manufacturing a semiconductor device, including: sticking a stacked body, which includes a backgrind tape including a base material and a pressure-sensitive adhesive layer formed on the base material, and a bonding adhesive layer formed on the pressure-sensitive adhesive layer, onto a semiconductor wafer including a plurality of electrodes on one of main surfaces, on a side in which the electrode is provided, from the bonding adhesive layer side; grinding the semiconductor wafer to be thin; dicing the thinned semiconductor wafer and the bonding adhesive layer to be singulated into a semiconductor chip with the bonding adhesive layer; and electrically connecting an electrode of the semiconductor chip with the bonding adhesive layer to an electrode of another semiconductor chip or a wiring circuit board, in which the semiconductor wafer and the stacked body have a circular shape in plan view, and in plan view, a diameter A of the semiconductor wafer and a diameter X of the stacked body satisfy a relationship of Expression (1) described below:
A method for manufacturing a semiconductor device, including: sticking a stacked body, which includes a backgrind tape including a base material and a pressure-sensitive adhesive layer formed on the base material, and a bonding adhesive layer formed on the pressure-sensitive adhesive layer, onto a semiconductor wafer including a plurality of electrodes on one of main surfaces, on a side in which the electrode is provided, from the bonding adhesive layer side; grinding the semiconductor wafer to be thin; dicing the thinned semiconductor wafer and the bonding adhesive layer to be singulated into a semiconductor chip with the bonding adhesive layer; and electrically connecting an electrode of the semiconductor chip with the bonding adhesive layer to an electrode of another semiconductor chip or a wiring circuit board, in which the semiconductor wafer and the stacked body have a circular shape in plan view, and in plan view, a diameter A of the semiconductor wafer and a diameter X of the stacked body satisfy a relationship of Expression (1) described below:
A
B32B 7/12 - Liaison entre couches utilisant des adhésifs interposés ou des matériaux interposés ayant des propriétés adhésives
B32B 9/04 - Produits stratifiés composés essentiellement d'une substance particulière non couverte par les groupes comprenant une telle substance comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique
Provided is a photosensitive resin composition containing (X) an inorganic filler that is solid particles having a true density of 1,500 kg/m3 or less. Also provided is a photosensitive resin film formed by using the photosensitive resin composition. Further provided is a multilayered printed wiring board containing an interlayer insulating layer that is formed by using the photosensitive resin composition or the photosensitive resin film and a method for producing the multilayered printed wiring board. Furthermore provided is a semiconductor package including the multilayered printed wiring board and a semiconductor element.
G03F 7/031 - Composés organiques non couverts par le groupe
G03F 7/029 - Composés inorganiquesComposés d'oniumComposés organiques contenant des hétéro-atomes autres que l'oxygène, l'azote ou le soufre
G03F 7/032 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants
Provided is a method for producing a joined body obtained by joining a resin A, a film containing an amorphous thermoplastic resin, which is at least one of a thermoplastic epoxy resin and a phenoxy resin, as a main component, and a resin B in this order. The method includes a first joining step of joining the resin A and the film by melting and then solidifying the film in a state in which the film is in contact with the resin A, and a second joining step of joining the resin A and the resin B by melting and then solidifying the film in a state in which the film joined to the resin A is in contact with the resin B. An epoxy equivalent of the amorphous thermoplastic resin is 1,600 g/eq. or more, or the amorphous thermoplastic resin does not contain an epoxy group, and a heat of fusion of the amorphous thermoplastic resin is 15 J/g or less.
C09J 5/06 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces comprenant un chauffage de l'adhésif appliqué
B29C 65/34 - Assemblage d'éléments préformésAppareils à cet effet par chauffage, avec ou sans pressage avec des éléments chauffés qui restent dans le joint, p. ex. un "élément de soudage perdu"
B29C 65/48 - Assemblage d'éléments préformésAppareils à cet effet en utilisant des adhésifs
B29C 65/50 - Assemblage d'éléments préformésAppareils à cet effet en utilisant des adhésifs utilisant des rubans adhésifs
A slurry contains abrasive grains and water, in which the abrasive grains include cerium oxide particles, and a product P of a ratio R of a peak intensity of a (200) plane to a peak intensity of a (111) plane in an X-ray diffraction measurement of the cerium oxide particles and a crystallite diameter D of the (111) plane of the cerium oxide particles is 7.5 to 11.0 nm. A polishing method includes a step of polishing a surface to be polished using the slurry.
Provided is a method for analyzing a hydrogen halide gas that enables accurate measurement of the content of impurities in the hydrogen halide gas. A hydrogen halide gas is analyzed by an analysis apparatus to measure the content of impurities in the hydrogen halide gas. The analysis apparatus comprises: a hydrogen halide gas container (10); an analysis unit (20); a first flow path (30) that communicates the hydrogen halide gas container (10) with the analysis unit (20); and a second flow path (40) that branches from the first flow path (30). The analysis method comprises: a hydrogen halide gas pressure-accumulation purge step of performing pressure-accumulation purging in the first flow path (30) using the hydrogen halide gas; and an analysis step of continuing to supply the hydrogen halide gas in the hydrogen halide gas container (10) to the first flow path (30), and, while causing a portion of the hydrogen halide gas supplied to the first flow path (30) to flow to the second flow path (40), sending another portion of the hydrogen halide gas supplied to the first flow path (30) to the analysis unit (20) to analyze the hydrogen halide gas.
Provided is a compound that has excellent fluidity and suppresses magnetic loss of a magnetic core that contains a cured product of the compound. The compound contains a metal powder and a resin composition. The metal powder is a soft magnetic material. The resin composition contains a thermosetting resin. The metal powder includes a plurality of submicron particles and a plurality of large particles that have a larger particle diameter than the plurality of submicron particles. The content of the plurality of submicron particles in the metal powder is represented by V1 vol%. The content of the plurality of large particles in the metal powder is represented by V2 vol%. V2/V1 is 29 to 59 inclusive.
H01F 1/20 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre
H01F 1/26 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées les particules étant isolées au moyen de substances organiques macromoléculaires
H01F 1/28 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre dispersées ou suspendues dans un liant
This design support device comprises: a physical property calculation unit that calculates a statistical amount of physical property values of a substance on the basis of information indicating motion of each of a plurality of atoms included in the substance; and a contribution calculation unit that calculates a contribution ratio of each atom to the statistical amount on the basis of a displacement amount of the physical property value of each atom.
G16C 60/00 - Science informatique des matériaux, c.-à-d. TIC spécialement adaptées à la recherche des propriétés physiques ou chimiques de matériaux ou de phénomènes associés à leur conception, synthèse, traitement, caractérisation ou utilisation
25.
COMPOUND, MOLDED BODY, CURED PRODUCT OF COMPOUND, MAGNETIC CORE, AND COIL COMPONENT
Provided is a compound that has a metal powder content of 96.5 mass% or more, has outstanding fluidity, and increases the mechanical strength at high temperatures (e.g., 150°C or higher) of a molded body containing the compound uncured or semi-cured. The compound contains a metal powder and a resin composition. The metal powder is a soft magnetic material. The resin composition contains an epoxy resin and a curing agent. The curing agent contains a triphenylmethane-type phenol resin and a phenol novolac resin. The metal powder content in the compound is 96.5-98.0 mass%. The resin composition content in the compound is 2.0-3.5 mass%. The mass ratio of the triphenylmethane-type phenol resin and the phenol novolac resin to 100 parts by mass of the epoxy resin is 47.0-63.0 parts by mass.
C08L 63/00 - Compositions contenant des résines époxyCompositions contenant des dérivés des résines époxy
C08G 59/40 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde caractérisées par les agents de durcissement utilisés
H01F 1/20 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre
H01F 1/26 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées les particules étant isolées au moyen de substances organiques macromoléculaires
The present invention provides a method for reducing connection failures of semiconductor chips in hybrid bonding used in CoW bonding or C2C bonding. In this method, a semiconductor substrate 100 having a polished surface is diced into individual pieces to obtain a plurality of semiconductor chips 110 each having an insulating portion 102A and electrodes 103. After individualization, the surfaces of the plurality of semiconductor chips 110 are cleaned using a cleaning member 160 having a sponge roller part 162 which is a porous elastic body. For example, a PVA brush is used as the cleaning member 160. After cleaning, the insulating portions 102A of the semiconductor chips 110 are bonded to an insulating layer 202 of a semiconductor substrate 200, and the electrodes 103 of the semiconductor chips 110 are bonded to electrodes 203 of the semiconductor substrate 200. Debris D adhering to the surfaces of the semiconductor chips 110 is effectively removed by cleaning using the cleaning member 160 having the sponge roller part 162.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
27.
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR PACKAGE
The present invention provides: a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent and having a weight average molecular weight (Mw) of less than 6,000 and (B) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent and having a weight average molecular weight (Mw) of 6,000 or more; a photosensitive resin film using the photosensitive resin composition; a printed wiring board; a production method therefor; and a semiconductor package.
In this method for producing a semiconductor device, first, a structure 200 including an interposer 60 in which a groove portion 61 for dividing a surface into a plurality of installation regions 65 is formed, and semiconductor elements 202a and 202b disposed on the respective installation regions 65 is prepared. The semiconductor element 202a is a processor, and the semiconductor element 202b is a memory. In the structure 200, the semiconductor elements 202a and 202b are sealed such that the sealing material 8 enters the groove portion 61. Then, the back surface of the interposer 60 is polished so that the sealing material 8 that has entered the groove portion 61 is exposed. Thereafter, the sealing material 8 is cut off along the groove portion 61 to be individualized, and a plurality of semiconductor devices 201 are acquired.
An adhesive composition containing conductive particles each having a plurality of protrusions on a surface thereof, wherein the conductive particles have a compressive hardness of 350 kgf/mm2 to 1500 kgf/mm2 at 20% compression, and a proportion of an area of the plurality of protrusions to an area of the surface of each conductive particle is 30% or more.
A composition containing a self-assembled structure of a tocopheryl phosphate, a di- or higher valent metal salt, and water. In addition, a freeze-dried product containing a self-assembled structure of a tocopheryl phosphate and a di- or higher valent metal salt, in which the mole ratio of the di- or higher valent metal salt to the tocopheryl phosphate is 0.05 to 12.
A61K 47/24 - Composés organiques, p. ex. hydrocarbures naturels ou synthétiques, polyoléfines, huile minérale, gelée de pétrole ou ozocérite contenant des atomes autres que des atomes de carbone, d'hydrogène, d'oxygène, d'halogènes, d'azote ou de soufre, p. ex. cyclométhicone ou phospholipides
A wound body 1 comprises: a winding core 3 having a cylindrical part 31 including an outer peripheral surface 31a around which a laminated film 2 can be wound; and the laminated film 2 wound around the outer peripheral surface 31a. A step part 32 is provided on the outer peripheral surface 31a as a result of a second end e2 rising in a radial direction R with respect to a first end e1. In the step part 32, a rising portion 32a due to the second end e2 does not overlap the first end e1 in the radial direction R, and a step surface 32b is inclined to the second end e2 side with respect to a line L1 in the radial direction R passing through the first end e1 when the cylindrical part 31 is viewed from an axial direction Z. The laminated film 2 is wound around the outer peripheral surface 31a in a direction opposite to the direction in which the step surface 32b is inclined. The height H1 of the step part 32 is inclusively between 1.05 times and 1.8 times the thickness T1 of the laminated film 2.
This slurry contains: abrasive grains containing cerium-based particles; at least one substance selected from the group consisting of quinaldic acid and salts of quinaldic acid; and at least one substance selected from the group consisting of carboxylic acid and salts of carboxylic acid. Also provided is a polishing method comprising a step in which the slurry is used to polish a polished member. Additionally provided is a component production method including a step in which a component is obtained using a polished member that has been polished by the polishing method. Further provided is a semiconductor component production method including a step in which a semiconductor component is obtained using a polished member that has been polished by the polishing method.
Disclosed is a method for inspecting a semiconductor device 1 comprising: a substrate 2; an insulating layer 4 formed from a solder resist; an interconnect 6 partially disposed in the insulating layer 4; a solder ball 7 formed on the interconnect 6 and partially disposed in the insulating layer 4; and a semiconductor chip 10 disposed on the solder ball 7. In this inspection method, the semiconductor chip 10 and a part of the solder ball 7 are polished and removed by proceeding toward the substrate 2 from a surface 10a on the opposite side of the semiconductor chip 10 relative to the substrate 2. The remaining portion of the solder ball 7 is further removed by etching. Thereafter, a coating material is applied on the insulating layer 4, and defects (cracks 45, 46) included in the insulating layer 4 are inspected by observing the state of the applied coating material. The color of the coating material is, for example, a color such as red or orange, different from the color of the insulating layer 4. This inspection method can be used to improve the accuracy of detecting defects in the insulating layer 4.
H01L 21/66 - Test ou mesure durant la fabrication ou le traitement
G01N 21/91 - Recherche de la présence de criques, de défauts ou de souillures en utilisant la pénétration de colorants, p. ex. de l'encre fluorescente
G01N 21/956 - Inspection de motifs sur la surface d'objets
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
34.
ALUMINUM ALLOY, SUSPENSION MEMBER, METHOD FOR PRODUCING ALUMINUM ALLOY, AND METHOD FOR PRODUCING SUSPENSION MEMBER
The present invention has an alloy composition containing Cu in a range of 0.3 to 0.5 mass%, Mg in a range of 0.65 to 1.25 mass%, Si in a range of 0.9 to 1.5 mass%, Mn in a range of 0.4 to 1.1 mass%, Fe in a range of 0.15 to 1.0 mass%, Cr in a range of 0.09 to 0.25 mass%, Ti in a range of 0.01 to 0.05 mass%, B in a range of 0.0010 to 0.0050 mass%, and Be in a range of 0.001 to 0.01 mass%, with the remainder being constituted by Al and inevitable impurities.
C22C 21/02 - Alliages à base d'aluminium avec le silicium comme second constituant majeur
B22D 11/00 - Coulée continue des métaux, c.-à-d. en longueur indéfinie
B22D 11/04 - Coulée continue des métaux, c.-à-d. en longueur indéfinie dans des moules sans fond
C22C 21/06 - Alliages à base d'aluminium avec le magnésium comme second constituant majeur
C22F 1/05 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid de l'aluminium ou de ses alliages d'alliages de type Al-Si-Mg, c.-à-d. contenant du silicium et du magnésium en proportions sensiblement égales
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
One embodiment of the present invention relates to a chloroprene latex composition. The chloroprene latex composition contains: a chloroprene polymer latex (A) containing a chloroprene polymer; a polymer emulsion (B) containing a polymer in which the content of a constituent unit derived from a carboxylic acid ester monomer containing a vinyl group and a C6-C20 alkyl group is 20 to 100 mass% of all constituent units; and a tackifier (C). The chloroprene polymer has a tetrahydrofuran insoluble fraction of 30 to 90 mass% at 25°C, and the content of solids derived from the polymer emulsion (B) is 0.5 to 25 parts by mass in relation to 100 parts by mass of solids derived from the chloroprene polymer latex (A).
C08L 11/00 - Compositions contenant des homopolymères ou des copolymères du chloroprène
C08F 236/18 - Copolymères de composés contenant plusieurs radicaux aliphatiques non saturés et l'un au moins contenant plusieurs liaisons doubles carbone-carbone le radical ne contenant que deux doubles liaisons carbone-carbone conjuguées contenant des éléments autres que le carbone et l'hydrogène contenant des halogènes contenant du chlore
C08L 23/28 - Compositions contenant des homopolymères ou des copolymères d'hydrocarbures aliphatiques non saturés ne possédant qu'une seule liaison double carbone-carboneCompositions contenant des dérivés de tels polymères modifiées par post-traitement chimique par réaction avec les halogènes ou des composés contenant des halogènes
C08L 33/04 - Homopolymères ou copolymères des esters
This method for estimating a filling time comprises the steps of: measuring a dynamic contact angle of a resin composition for underfill; and estimating the filling time of the resin composition for underfill on the basis of the measured dynamic contact angle.
G01N 13/00 - Recherche des effets de surface ou de couche limite, p. ex. pouvoir mouillantRecherche des effets de diffusionAnalyse des matériaux en déterminant les effets superficiels, limites ou de diffusion
A photosensitive element, including: a support; and a photosensitive layer on the support by using a photosensitive resin composition containing a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a coumarin-based sensitizer, in which a thickness of the photosensitive layer is 30 μm or more.
G03F 7/033 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polymères obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone, p. ex. polymères vinyliques
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
G03F 7/031 - Composés organiques non couverts par le groupe
G03F 7/105 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires avec des substances, p. ex. des indicateurs, pour obtenir des images visibles
38.
RESIN-CLAD METAL FOIL, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
The embodiment relates to a metal foil with resin including: a metal foil; and a resin layer provided on one side of the metal foil and containing a resin composition, the resin composition containing a thermosetting resin (A), a compound that is in a liquid state at 25° C., has a reactive group, and has a molecular weight of 1,000 or less (B), and an inorganic filler (C), as well as a method for manufacturing a printed wiring board and a method for manufacturing a semiconductor package, in each of which the metal foil with resin is used.
C09D 4/06 - Compositions de revêtement, p. ex. peintures, vernis ou vernis-laques, à base de composés non macromoléculaires organiques ayant au moins une liaison non saturée carbone-carbone polymérisable en combinaison avec un composé macromoléculaire autre qu'un polymère non saturé des groupes
C09D 153/00 - Compositions de revêtement à base de copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions de revêtement à base de dérivés de tels polymères
A method for producing a wiring structure is disclosed. The method for producing a wiring structure includes forming, in a support substrate, a modification region that is along a main surface of the support substrate and that is exposed on the main surface; forming a conductor layer on the main surface so as to adhere with the modification region; forming a wiring on the conductor layer; forming an insulating layer on the conductor layer to cover the wiring; separating the support substrate from the conductor layer; and removing the conductor layer.
A method for cleaning a semiconductor chip, the method including: (a) cleaning a plurality of semiconductor chips with a chemical solution, the semiconductor chips being arranged in a region on a surface of an adhesive film in which the region is inside a dicing ring attached to the surface of the adhesive film; and (b) picking up the cleaned semiconductor chips from the surface, in which the chemical solution is one kind selected from the group consisting of solvent-based, acid-based, and alkaline-based chemical solutions. A method for manufacturing a semiconductor device, the method including bonding semiconductor chip having been cleaned by the method for a semiconductor chip to an adherend.
The present disclosure aims to provide a novel boron nitride particle having low dielectric properties and high thermal conductivity, a resin composition containing the same, and uses thereof. A boron nitride particle of the present disclosure includes: a core that contains boron nitride oriented along a direction intersecting the outer periphery of the particle; and a shell that covers at least a part of the core and contains boron nitride oriented along the outer periphery of the particle.
Disclosed is a method for manufacturing a semiconductor device 1, the method comprising the steps of: preparing a structure 100 comprising a substrate 2, a module 3 having a semiconductor chip 31, solder balls 4 disposed between the substrate 2 and the module 3, and an uncured underfill 50 surrounding the solder balls 4; and curing the underfill 50 by raising the temperature of the uncured underfill 50. In the step of curing the uncured underfill 50, a surface 31a of the semiconductor chip 31 opposite to the substrate 2 is heated to transfer heat to the underfill 50, thereby raising the temperature of the underfill 50. The surface 31a of the semiconductor chip 31 is heated, for example, by bringing a heating surface 8a of a heating device 8 into contact with the surface 31a of the semiconductor chip 31 in a state where the structure 100 is sandwiched between a stage 7 and the heating device 8. This manufacturing method can improve the mountability of the manufactured semiconductor device.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
43.
PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
A photosensitive element according to one embodiment of the present disclosure comprises a support body and a photosensitive layer formed on the support body. The photosensitive layer contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, a sensitizer, and an ultraviolet absorber. Per 1 μm thickness of the photosensitive layer, the absorbance for light having a wavelength of 365 nm is 0.025 or greater, and the absorbance for light having a wavelength of 405 nm is 0.010 or greater.
G03F 7/028 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des substances accroissant la photosensibilité, p. ex. photo-initiateurs
G03F 7/031 - Composés organiques non couverts par le groupe
44.
SLURRY, POLISHING METHOD, METHOD FOR PRODUCING COMPONENT, AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENT
This slurry contains abrasive grains, at least one nitrogen-containing aromatic carboxylic acid compound that is selected from the group consisting of nitrogen-containing aromatic carboxylic acids and salts of nitrogen-containing aromatic carboxylic acids, and at least one hydroxycarboxylic acid compound that is selected from the group consisting of hydroxycarboxylic acids and salts of hydroxycarboxylic acids. This polishing method includes a step for polishing a member to be polished with use of the slurry.
In the present invention, a web extending in the longitudinal direction, ribs formed so as to protrude from the web along the thickness direction of the web from each edge on both sides of the web along the longitudinal direction, and excess material protruding from an outer surface of the ribs are integrally formed. If the outer surface of the ribs is viewed in plan view, the thickness (D1) of the excess material in a first region where a position of a parting line formed at a joint of a forging die does not overlap with a position of the web is thinner than the thickness (D2) of the excess material in a second region where the position of the parting line and the position of the web overlap.
The airtight structure body of the disclosure has an airtight section, an underlying layer that covers an edge section of the airtight section and that includes a resin cured product, and an ALD layer that covers the underlying layer.
Provided is a resin composition containing an acrylic polymer serving as a combustible component, the resin composition having excellent flame resistance with satisfactory adhesion strength to a copper foil and desmear resistance maintained. Further, a prepreg, a laminated plate, a metal-clad laminated plate, a printed wiring board, and a semiconductor package that are produced using the resin composition are provided. The resin composition is specifically a resin composition containing an acrylic polymer (A), a thermosetting resin (B), and an inorganic filler (C) surface-treated with a silane coupling agent, further containing a silane coupling agent (D).
C08L 83/10 - Copolymères séquencés ou greffés contenant des segments de polysiloxanes
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
C08J 5/24 - Imprégnation de matériaux avec des prépolymères pouvant être polymérisés en place, p. ex. fabrication des "prepregs"
A biomass utilization support device: acquires biomass information relating to a biobased material and product information for each of a plurality of products including information about materials configuring the products; uses a machine learning model, which has been trained to estimate appropriate values for replacement amounts in a case of replacing a portion of the materials configuring the products with the biobased material, and the acquired biomass information and product information to estimate the appropriate values for each of the plurality of products; calculates, for each of the plurality of products, environmental impact indicators in a case in which a portion of the materials configuring the products has been replaced with the biobased material at the replacement amounts represented by the estimated appropriate values; and outputs support information listing the estimated appropriate values and the calculated environmental impact indicators.
To provide a layer-bonded structure of a stretchable material, a garment, and a method for layer-bonding of a stretchable material, which can decrease stretchability in a predetermined extension direction while reducing an amount of adhesive used when layer-bonding stretchable materials to each other via an adhesive. In a layer-bonded structure of a stretchable material in which stretchable materials are bonded with an adhesion pattern formed with an adhesive, the adhesion pattern is composed of plural adhesion parts in which an adhesive is formed in a dot shape, and the plural adhesion parts have a band shape as a whole by forming an array part arranged in a predetermined extension direction and providing plural rows of the array part.
A binder for use as a component of an electrode for a nonaqueous secondary battery, said binder including a polymer X which includes a polymer block A having a glass transition temperature of 25°C or greater, and a polymer block B having a glass transition temperature of 0°C or less.
Provided are: a highly reliable semiconductor module that comprises a sealing material layer excellent in heat resistance, the semiconductor module preventing peeling or the like of the sealing material layer; a method for manufacturing the semiconductor module; and a semiconductor device. The semiconductor module comprises a semiconductor element and a sealing material layer that covers at least the semiconductor element and includes a low-elasticity core layer and a high-elasticity skin layer disposed on the outer peripheral surface of the core layer.
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
H01L 25/07 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans la sous-classe
52.
PHOTOSENSITIVE ELEMENT, PRODUCTION METHOD THEREFOR, RESIST PATTERN PRODUCTION METHOD, AND CONDUCTIVE PATTERN PRODUCTION METHOD
A photosensitive element 10 comprising: a support film 12; a photosensitive resin film 14 that is disposed on the support film 12; and a protective film 16 that is disposed on the photosensitive resin film 14, wherein at least one of the support film 12 and the protective film 16 is a polypropylene film that has an average thickness of 30 µm or greater and is in contact with the photosensitive resin film, and the average thickness of the photosensitive resin film 14 is 80 µm or greater.
The present disclosure relates to a photosensitive element and a production method therefor, the photosensitive element comprising: a support film; a positive photosensitive resin film that is disposed on the support film; and a protective film that is disposed on the photosensitive resin film, wherein the average thickness of the photosensitive resin film is 80 µm or greater, the photosensitive resin film contains an organic solvent, and the organic solvent content is not less than 7.0 mass% but less than 18.0 mass% with respect to the total amount of the photosensitive resin film.
Provided is a compound containing: magnetic particles; an epoxy resin; a phenoxy resin; and a resin composition containing a curing agent. Also provided is a bonded magnet containing: magnetic particles; an epoxy resin; a phenoxy resin; and a cured product of a resin composition containing a curing agent.
H01F 1/08 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques durs métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées
H01F 1/26 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées les particules étant isolées au moyen de substances organiques macromoléculaires
55.
PHOTOSENSITIVE ELEMENT, PRODUCTION METHOD THEREFOR, RESIST PATTERN PRODUCTION METHOD, AND CONDUCTIVE PATTERN PRODUCTION METHOD
The present disclosure relates to a photosensitive element and a production method therefor, the photosensitive element comprising: a support film; a positive photosensitive resin film that is disposed on the support film; and a protective film that is disposed on the photosensitive resin film, wherein the average thickness of the photosensitive resin film is 80 µm or greater, the photosensitive resin film contains an organic solvent, and the organic solvent content is not less than 7.0 mass% but less than 18.0 mass% with respect to the total amount of the photosensitive resin film.
The present invention provides a binder for use as a component of an electrode of a nonaqueous secondary battery, wherein when an operation comprising step 1 of elongating a test specimen having a length of 25 mm and made of the binder to a length of 30 mm at a constant speed of 5 mm/6 sec and step 2 of contracting the test specimen to a length of 25 mm at a constant speed of 5 mm/6 sec is repeated 450 times, the stress measured 4.5 seconds after the start of step 1 in the 450th operation is 10 N/cm2 or more.
Provided are a highly reliable semiconductor module which includes a sealing material layer excellent in heat resistance and prevents, for example, peeling of the sealing material layer, a method for manufacturing the semiconductor module, and a semiconductor device. This semiconductor module comprises: a semiconductor element; and a sealing material layer that covers at least the semiconductor element and includes a low-elasticity core layer and a high-elasticity skin layer disposed on the outer peripheral surface of the core layer.
A resin composition and the like, which exhibits low transmission loss and excellent flame retardancy, and is capable of improving the appearance of a laminate, contains: (A) a thermosetting resin; (B) a polymer having a hydrocarbon chain or a polyether chain; (X) a phosphorus compound-based flame retardant; and (Y) a flame retardant other than the phosphorus compound-based flame retardant, in which the component (X) does not contain (X1) a filler-type flame retardant, and the component (Y) does not contain (Y1) a filler-type flame retardant, or, in which when the component (X) contains the filler-type flame retardant (X1) or the component (Y) contains the filler-type flame retardant (Y1), a total content of the filler-type flame retardant (X1) and the filler-type retardant (Y1) is 25 parts by mass or less with respect to 100 parts by mass of the solid content in the resin composition.
C08L 51/04 - Compositions contenant des polymères greffés dans lesquels le composant greffé est obtenu par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères greffés sur des caoutchoucs
B32B 5/02 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par les caractéristiques de structure d'une couche comprenant des fibres ou des filaments
B32B 15/14 - Produits stratifiés composés essentiellement de métal adjacent à une couche fibreuse ou filamenteuse
B32B 15/20 - Produits stratifiés composés essentiellement de métal comportant de l'aluminium ou du cuivre
A method for producing this adhesive film includes: a feeding step of feeding a base material film in a long length provided with a bonding layer on one surface at a predetermined conveyance rate; a cutting step of pre-cutting the bonding layer along a cutting line of a predetermined pattern; and a peeling step of peeling an unnecessary portion of the bonding layer from the one surface of the base material film, and forming a plurality of bonding layers having a pattern based on the cutting line on the one surface of the base material film at predetermined intervals, in which in the cutting step, the unnecessary portion is divided by a division line for dividing the base material film in a width direction.
A photosensitive element 10 comprising: a support film 12; a positive photosensitive resin film 14 that is disposed on the support film 12; and a protective film 16 that is disposed on the photosensitive resin film 14, wherein the average thickness of the photosensitive resin film 14 is 150 µm or greater. A production method for a photosensitive element 10, said method comprising: a step for forming a photosensitive resin film 14 having an average thickness of 150 µm or greater by applying a positive photosensitive resin composition onto a support film 12 and then drying the photosensitive resin composition; and a step for providing a protective film 16 on the photosensitive resin film 14.
A method for producing a hydrocarbon-containing composition according to the present disclosure includes heating a plastic decomposition product in the presence of a zeolite containing Rb+. The hydrocarbon-containing composition contains at least one selected from the group consisting of olefins having 2-5 carbon atoms, benzene, toluene, ethylbenzene, and xylene.
C08J 11/16 - Récupération ou traitement des résidus des polymères par coupure des chaînes moléculaires des polymères ou rupture des liaisons de réticulation par voie chimique, p. ex. dévulcanisation par traitement avec une substance inorganique
C10G 1/10 - Production de mélanges liquides d'hydrocarbures à partir de schiste bitumineux, de sable pétrolifère ou de matières carbonées solides non fusibles ou similaires, p. ex. bois, charbon à partir de caoutchouc ou de déchets de caoutchouc
This bonded magnet comprises: magnetic particles; a binder that binds the magnetic particles together; and elastomer particles, wherein a part of the elastomer particles is located in at least a part between the magnetic particles. This compound used for the production of the bonded magnet contains magnetic particles, a resin, and elastomer particles.
H01F 1/08 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques durs métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 1/10 - Poudres métalliques contenant des agents lubrifiants ou liantsPoudres métalliques contenant des matières organiques
B22F 1/102 - Poudres métalliques revêtues de matériaux organiques
B22F 3/00 - Fabrication de pièces ou d'objets à partir de poudres métalliques, caractérisée par le mode de compactage ou de frittageAppareils spécialement adaptés à cet effet
H01F 1/059 - Alliages caractérisés par leur composition contenant des métaux des terres rares et des métaux de transition magnétiques, p. ex. SmCo5 et des éléments Va, p. ex. Sm2Fe17N2
One embodiment of the present invention relates to a curable composition for a sealing material, the composition comprising a compound having a vinylphenyl group and an inorganic filler containing alumina.
C08F 2/44 - Polymérisation en présence d'additifs, p. ex. plastifiants, matières colorantes, charges
C08F 12/00 - Homopolymères ou copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule double liaison carbone-carbone et l'un au moins étant terminé par un noyau carbocyclique aromatique
SULFUR-COPOLYMERIZED CHLOROPRENE LATEX COMPOSITION, METHOD FOR PRODUCING THE SAME, MODIFIED ASPHALT EMULSION COMPOSITION CONTAINING SULFUR-COPOLYMERIZED CHLOROPRENE LATEX COMPOSITION, AND METHOD FOR PRODUCING THE SAME
A sulfur-copolymerized chloroprene latex composition containing sulfur-copolymerized chloroprene latex, a nonionic surfactant and a monobasic acid, in which the monobasic acid has a pKa of 4.0 to 6.0, a method for producing the same, and a modified asphalt emulsion composition.
A method for producing a semiconductor device includes preparing a laminated body including a support member, a light absorption layer, and a temporary fixing material layer containing a cured product of a thermosetting resin component from the support member and temporarily fixing the semiconductor member to the support member via the light absorption layer and the temporary fixing material layer. A push-in depth when on the surface of the temporary fixing material layer on a side where the semiconductor member is disposed, a nanoindentation method using a Berkovich indenter is performed under a condition of 25° C. such that a load is increased at a loading rate of 20 μN/second for 5 seconds, retained at 100 μN for 2 seconds after the load reaches 100 μN, and decreased at an unloading rate of 20 μN/second for 5 seconds until the load is 0 mN is 600 nm or more.
Provided is a composition for forming a solder bump, the composition containing polyvinyl alcohol, a flux, and solder particles, wherein the hydrogen dissociation energy of the flux is 170-230 kJ/mol. Also provided is a film for forming a solder bump, the film being obtained by forming the composition for forming a solder bump into a film shape. Also provided is a method for forming a solder bump, the method comprising: an arrangement step for arranging, on an electrode-side surface of a substrate having an electrode, said film for forming a solder bump; a bump formation step for heating said film for forming a solder bump to a temperature equal to or higher than the melting point of solder particles and then cooling said film; and a cleaning step for cleaning the surface with a cleaning liquid.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
One aspect of the present disclosure provides a bonded magnet comprising magnetic particles and a binder that binds the magnetic particles, wherein the binder contains a biodegradable resin.
H01F 1/059 - Alliages caractérisés par leur composition contenant des métaux des terres rares et des métaux de transition magnétiques, p. ex. SmCo5 et des éléments Va, p. ex. Sm2Fe17N2
H01F 1/08 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques durs métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
68.
PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
A photosensitive element according to the present disclosure comprises a support and a photosensitive layer formed on the support. The photosensitive layer contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a photopolymerization inhibitor. The photopolymerization inhibitor contains a catechol compound that has a 5% mass loss temperature of 250°C or higher and is represented by formula (1). (In formula (1), R0 indicates a monovalent organic group.)
The present invention provides: a thermosetting resin composition including a nitrogen atom-containing compound which is capable of improving tracking resistance; a sealing material; and an electronic component device. The thermosetting resin composition includes a thermosetting resin and a nitrogen atom-containing compound having a nitrogen atom content ratio, as calculated using equation (1), of 67 mass% or greater. (Equation 1) Nitrogen atom content ratio = (the number of nitrogen atoms in the compound × 14) × 100 / (molecular weight)
The present invention provides: a thermosetting resin composition including a nitrogen atom-containing compound which is capable of improving tracking resistance; a sealing material; and an electronic component device. The thermosetting resin composition includes a thermosetting resin and a nitrogen atom-containing compound in the amount of 0.200-1.50 mass% with respect to the total amount of the composition, and has a glass transition temperature of 150°C or higher.
One aspect of the present disclosure provides a compound containing magnetic particles and a thermosetting composition. In the compound, the thermosetting composition contains an epoxy compound having a mesogenic group and a curing agent.
H01F 1/059 - Alliages caractérisés par leur composition contenant des métaux des terres rares et des métaux de transition magnétiques, p. ex. SmCo5 et des éléments Va, p. ex. Sm2Fe17N2
H01F 1/08 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques durs métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées
H01F 41/02 - Appareils ou procédés spécialement adaptés à la fabrication ou à l'assemblage des aimants, des inductances ou des transformateursAppareils ou procédés spécialement adaptés à la fabrication des matériaux caractérisés par leurs propriétés magnétiques pour la fabrication de noyaux, bobines ou aimants
72.
POWER DEVICE PACKAGE, METHOD FOR MANUFACTURING POWER DEVICE PACKAGE, AND MOISTURE-PROOF FILM FOR POWER DEVICE
A power device package comprising a power device sealed with a sealing material layer, and a moisture-proof film layer covering at least part of the sealing material layer of the power device, wherein the moisture-proof film layer has a heat-fusible resin layer, a metal foil layer, and a protective layer, in order from the power device side.
C08G 59/18 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
Provided is a resin composition used for sealing a power semiconductor element in a power semiconductor module to be bonded to a heat dissipation member by sintering. The resin composition contains an epoxy resin, a maleimide compound, and a curing agent.
C08G 59/18 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
Provided is a resin composition used for sealing a power semiconductor element in a power semiconductor module to be bonded to a heat dissipation member by sintering. The resin composition contains an epoxy resin, a maleimide compound, and a triazine skeleton-containing compound.
C08G 59/18 - Macromolécules obtenues par polymérisation à partir de composés contenant plusieurs groupes époxyde par molécule en utilisant des agents de durcissement ou des catalyseurs qui réagissent avec les groupes époxyde
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
76.
THERMOSETTING RESIN COMPOSITION, SEALING MATERIAL, AND ELECTRONIC COMPONENT DEVICE
Provided are a thermosetting resin composition having excellent fluidity, a sealing material, and an electronic component device. This thermosetting resin composition contains: a thermosetting resin; a silane coupling agent containing a silane compound in which an organic functional group having a polyoxyethylene skeleton is bonded to silicon via a hydrocarbon group having 1-10 carbon atoms; and an inorganic filler.
This bonded magnet contains: coated particles including magnetic particles and a coating resin coating the magnetic particles; and a binder that binds the coated particles to each other. The coating resin and the binder are different from each other. This compound contains: coated particles including magnetic particles and a coating resin coating the magnetic particles; and a resin. The coating resin and the resin are different from each other.
H01F 1/08 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques durs métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 1/16 - Particules métalliques revêtues d'un non-métal
B22F 1/102 - Poudres métalliques revêtues de matériaux organiques
B22F 3/00 - Fabrication de pièces ou d'objets à partir de poudres métalliques, caractérisée par le mode de compactage ou de frittageAppareils spécialement adaptés à cet effet
H01F 1/26 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques doux métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées les particules étant isolées au moyen de substances organiques macromoléculaires
H01F 1/057 - Alliages caractérisés par leur composition contenant des métaux des terres rares et des métaux de transition magnétiques, p. ex. SmCo5 et des éléments IIIa, p. ex. Nd2Fe14B
H01F 1/059 - Alliages caractérisés par leur composition contenant des métaux des terres rares et des métaux de transition magnétiques, p. ex. SmCo5 et des éléments Va, p. ex. Sm2Fe17N2
78.
METAL PASTE FOR JOINING, AND JOINED BODY AND METHOD FOR PRODUCING SAME
This metal paste for joining contains metal particles, a dispersion medium, and a reducing agent, contains polyethylene glycol as the reducing agent, and contains a compound A having, in a molecule, at least one group selected from the group consisting of an amino group, a carboxyl group, and an acetylene group, and a hydroxy group.
B22F 1/052 - Poudres métalliques caractérisées par la dimension ou la surface spécifique des particules caractérisées par un mélange de particules de dimensions différentes ou par la distribution granulométrique des particules
B22F 1/102 - Poudres métalliques revêtues de matériaux organiques
B22F 1/107 - Poudres métalliques contenant des agents lubrifiants ou liantsPoudres métalliques contenant des matières organiques contenant des matériaux organiques comportant des solvants, p. ex. pour la coulée en moule poreux ou absorbant
B22F 7/08 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de pièces ou objets composés de parties différentes, p. ex. pour former des outils à embouts rapportés avec une ou plusieurs parties non faites à partir de poudre
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
79.
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING PRINTED WIRING BOARD
This photosensitive resin composition contains (A) a resin having an ethylenically unsaturated bond and an acidic group, (B) a thermosetting resin, (C) a photopolymerizable compound, (D) a photopolymerization initiator, and (E) a triazole compound. The triazole compound (E) has a triazole skeleton and an amino group bonded to the triazole skeleton.
Provided is a thermosetting resin composition excellent in adhesiveness, in a cured state, to an adjacent member such as a metal. Further provided are a sealing material and an electronic component device. This thermosetting resin composition contains a thermosetting resin and a compound having a glycoluril skeleton represented by general formula (1). Moreover, this thermosetting resin composition has a glass transition temperature of 150°C or higher.
Provided is a method for joining a heating element to a heating element or a heat dissipation part to a heat dissipation part through a solid thermally-conductive material. A heating element A and a heat dissipation part B or a heat dissipation part B2 and a heat dissipation part B3 are joined to each other through a solid thermally-conductive material containing a thermoplastic resin and a heat dissipation filler, the thermoplastic resin having a content of 51% by mass or more of a resin component in the solid thermally-conductive material.
To provide a film-shaped bonding material which realizes bonding having a short bonding process time, a long open time and excellent adhesiveness. A method for producing a film-shaped bonding material, including a step of applying a resin composition containing an amorphous thermoplastic resin and a solvent onto a support, and a step of removing the solvent from the resin composition after the application to obtain a film-shaped bonding material laminated on the support, in which the amorphous thermoplastic resin is at least one of a thermoplastic epoxy resin and a phenoxy resin, has an epoxy equivalent of 1,600 g/eq. or more or does not contain an epoxy group, and has a heat of fusion of 15 J/g or less.
The disclosure relates to a block copolymer including: a polyimide block (BI) and a polyamic acid block (BA); and a structural unit (X) having a group (X) that includes at least one non-aromatic hydrocarbon group, where the total number of carbon atoms in the at least one non-aromatic hydrocarbon group is nine or more.
This bonded body comprises: a first member having a metal layer; a second member; and a sintered body of a metal paste for bonding that bonds the metal layer and the second member. The bonding coverage of the sintered body with respect to the metal layer, as determined from formula (I) below using a cross-sectional image of the bonded body observed with a scanning electron microscope, is 65% or more. (I): Bonding coverage (units: %) = 100 × [total length of contacting portion between the sintered body and the metal layer in the cross-sectional image] / [length of interface between the metal layer and the sintered body in the cross-sectional image]
H01L 23/48 - Dispositions pour conduire le courant électrique vers le ou hors du corps à l'état solide pendant son fonctionnement, p. ex. fils de connexion ou bornes
85.
LAMINATE, PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE
B32B 17/04 - Produits stratifiés composés essentiellement d'une feuille de verre ou de fibres de verre, de scorie ou d'une substance similaire sous forme de fibres ou filaments collés ou enrobés dans une substance plastique
B32B 15/04 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
Provided is an FRP precursor which comes to have satisfactory laser processing accuracy and can attain a reduction of variations in dimensional-change ratio. Also provided is an FRP having satisfactory laser processing accuracy and reduced variations in dimensional-change ratio. A printed wiring board and a semiconductor package are further provided. Specifically, the FRP precursor comprises glass cloth and either a heat-curable resin composition or a semi-cured object formed from the heat-curable resin composition, wherein the glass cloth has a K (%), defined by the expression, of 30 or less. In the expression, A indicates warp width (μm), B indicates weft width (μm), a indicates warp-to-warp distance (μm), and b indicates weft-to-weft distance (μm).
Provided is a slurry containing: at least one amino acid component selected from the group consisting of amino acids (excluding arginine) and salts thereof; and an organic amine compound (excluding the amino acid component). The slurry may not contain abrasive grains, or may further contain abrasive grains.
This aluminum alloy forged product is composed of 0.25 mass % or more and 0.55 mass % or less of Cu, 0.60 mass % or more and 1.25 mass % or less of Mg, 0.90 mass % or more and 1.4 mass % or less of Si, 0.35 mass % or more and 0.60 mass % or less of Mn, 0.15 mass % or more and 0.30 mass % or less of Fe, 0.25 mass % or less of Zn, 0.050 mass % or more and 0.30 mass % or less of Cr, 0.01 mass % or more and 0.1 mass % or less of Ti, 0.0010 mass % or more and 0.030 mass % or less of B, 0.0010 mass % or more and 0.050 mass % or less of Zr with a remainder being made up of Al and unavoidable impurities.
C22C 21/02 - Alliages à base d'aluminium avec le silicium comme second constituant majeur
C22C 1/02 - Fabrication des alliages non ferreux par fusion
C22F 1/05 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid de l'aluminium ou de ses alliages d'alliages de type Al-Si-Mg, c.-à-d. contenant du silicium et du magnésium en proportions sensiblement égales
This polishing liquid comprises: abrasive grains containing a cerium-based compound; and a compound A having a plurality of carbon atoms to which at least one selected from the group consisting of a carboxy group, a carboxylate group, a phosphono group, and a phosphonate group is bonded, wherein the carbon atoms are bonded to nitrogen atoms. This polishing liquid comprises: abrasive grains containing a cerium-based compound; and a compound B having a triazole skeleton.
This slurry contains: at least one type of amino acid component selected from the group consisting of amino acids (excluding arginine) and salts thereof; and an organic amine compound (excluding the abovementioned amino acid component). The slurry may contain no abrasive grains, or may further contain abrasive grains.
This metal paste for bonding contains metal particles, a dispersion medium, and a reducing agent, wherein the metal particles contain copper particles and monovalent or divalent copper compound particles.
B22F 9/00 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet
B22F 1/05 - Poudres métalliques caractérisées par la dimension ou la surface spécifique des particules
B22F 7/08 - Fabrication de couches composites, de pièces ou d'objets à base de poudres métalliques, par frittage avec ou sans compactage de pièces ou objets composés de parties différentes, p. ex. pour former des outils à embouts rapportés avec une ou plusieurs parties non faites à partir de poudre
According to the present invention, a polyamide-imide resin composition contains a polyamide-imide resin, and one or more solvents selected from an ether solvent and an acyclic ester solvent.
This method for manufacturing a semiconductor device includes: a step for preparing a laminate that is provided with a silicon carrier substrate and an organic temporary fixing material that is laminated on the silicon carrier substrate; a step for temporarily fixing a semiconductor member to a support member via the organic temporary fixing material; a step for processing the semiconductor member that has been temporarily fixed to the support member; and a step for irradiating the organic temporary fixing material of the laminate with light including infrared light from the silicon carrier substrate side so as to separate the semiconductor member from the support member.
B23K 26/57 - Travail par transmission du faisceau laser à travers ou dans la pièce à travailler le faisceau laser entrant dans une face de la pièce à travailler d’où il est transmis à travers le matériau de la pièce à travailler pour opérer sur une face différente de la pièce à travailler, p. ex. pour effectuer un enlèvement de matière, pour raccorder par fusion, pour modifier ou pour reformer le matériau
C09J 5/00 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces
C09J 7/30 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
A method for manufacturing a semiconductor chip, the method including: preparing a surface-protected laminated body having a semiconductor wafer having a circuit surface and a back surface, a protective layer, and a back grinding tape; grinding the semiconductor wafer from the back surface side, thereby thinning the semiconductor wafer; fixing the surface-protected laminated body onto a dicing tape; peeling the back grinding tape from the surface-protected laminated body; dividing he semiconductor wafer on the dicing tape together with the protective layer, thereby forming a semiconductor chip; and removing the protective layer attached to the semiconductor chip.
Provided is a polymerizable composition containing a polymerizable compound, the polymerizable composition containing: (A) a borate anion; (B) at least one selected from the group consisting of an aromatic carboxylic acid having two or more hydroxy groups, a salt of the aromatic carboxylic acid, and a hydrate of the aromatic carboxylic acid; and (C) a phosphorus compound having a P═O(OH) structure.
A method for producing a joined body includes: a pre-joining step in which a laminated body is prepared by arranging, in the following order, a base material A, which is a fiber reinforced plastic base material, a solid joining agent containing an amorphous thermoplastic resin, which is at least one selected from a thermoplastic epoxy resin and a phenoxy resin, and a base material B, which is a metal base material; and a joining step in which the laminated body is heated and pressurized to melt the solid joining agent and join the base material A and the base material B. The amorphous thermoplastic resin has an epoxy equivalent of 1,600 or more or does not contain an epoxy group and has a heat of fusion of 15 J/g or less.
F16B 11/00 - Assemblage d'éléments structuraux ou parties de machines par collage ou en les pressant l'un contre l'autre, p. ex. soudage sous pression à froid
C09J 5/06 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces comprenant un chauffage de l'adhésif appliqué
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09J 171/10 - Polyéthers dérivés de composés hydroxylés ou de leurs dérivés métalliques de phénols
Provided is a method for producing a joined body obtained by joining a metal base material A, a film containing an amorphous thermoplastic resin, which is at least one selected from a thermoplastic epoxy resin and a phenoxy resin, and a metal base material B in this order. The method includes a first joining step of joining the metal base material A and the film by melting and then solidifying the film in a state in which the film is in surface contact with the metal base material A, and a second joining step of joining the metal base material A and the metal base material B by melting and then solidifying the film in a state in which the film joined to the metal base material A is in surface contact with the metal base material B.
F16B 11/00 - Assemblage d'éléments structuraux ou parties de machines par collage ou en les pressant l'un contre l'autre, p. ex. soudage sous pression à froid
C09J 5/06 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces comprenant un chauffage de l'adhésif appliqué
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09J 171/10 - Polyéthers dérivés de composés hydroxylés ou de leurs dérivés métalliques de phénols
98.
COMPOSITE PARTICLES, BINDER COMPOSITION FOR NONAQUEOUS SECONDARY BATTERIES AND NONAQUEOUS SECONDARY BATTERY ELECTRODE
The composite particle includes a copolymer and a polyrotaxane, the copolymer having a first structural unit derived from a monomer (a1) and a second structural unit derived from a monomer (a2), the monomer (a1) is a nonionic compound having only one ethylenically unsaturated bond, the monomer (a2) is a compound having a carboxy group and only one ethylenically unsaturated bond, and the polyrotaxane has a cyclic molecule having a cyclic skeleton and a chain molecule that penetrates an opening of the cyclic molecule and has stopper groups at both ends, and does not contain an ethylenically unsaturated bond.
A manufacturing method for a magnetic compact includes a supplying step of supplying a compound containing a magnetic powder, a thermosetting resin, and a wax into a mold, a molding step of forming a compact from the compound and removing the wax from the compact by compressing the compound in the mold while applying a magnetic field to the compound in the mold heated at a molding temperature Tm, a demagnetizing step of demagnetizing the compact after the molding step, and a thermal curing step of heating the compact at a temperature equal to or higher than a thermal curing temperature of the thermosetting resin after the demagnetizing step to obtain a magnetic compact. The magnetic powder contains a Sm—Fe—N based permanent magnet. The molding temperature Tm is equal to or higher than a dropping point of the wax and lower than the thermal curing temperature of the thermosetting resin.
B22F 3/24 - Traitement ultérieur des pièces ou objets
H01F 1/059 - Alliages caractérisés par leur composition contenant des métaux des terres rares et des métaux de transition magnétiques, p. ex. SmCo5 et des éléments Va, p. ex. Sm2Fe17N2
H01F 1/08 - Aimants ou corps magnétiques, caractérisés par les matériaux magnétiques appropriésEmploi de matériaux spécifiés pour leurs propriétés magnétiques en matériaux inorganiques caractérisés par leur coercivité en matériaux magnétiques durs métaux ou alliages sous forme de particules, p. ex. de poudre comprimées, frittées ou agglomérées
H01F 13/00 - Appareils ou procédés pour l'aimantation ou pour la désaimantation
100.
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, THERMALLY CONDUCTIVE SHEET, AND METHOD OF MANUFACTURING THERMALLY CONDUCTIVE SHEET
A method of manufacturing a semiconductor device includes: adhering together a heat generating body and a heat dissipating body via a thermally conductive sheet by applying a pressure on the heat generating body and the heat dissipating body in a thickness direction of the thermally conductive sheet with the thermally conductive sheet disposed therebetween, the thermally conductive sheet having a compression modulus of 1.40 MPa or less under a compressive stress of 0.10 MPa at 150° C., and a tack strength of 5.0 N·mm or more at 25° C.
