Provided are a catalyst, which enables the production of a high molecular weight olefin polymer having a polar group and being usable for various applications at a high catalytic activity, and a method for producing such an olefin polymer. Use is made of, as a polymerization catalyst for an olefin having a polar group, a metal complex represented by general formula (C1) [wherein: M represents an element in group 10 of the periodic table; X represents a phosphorus atom (P) or arsenic atom (As); R5 to R11 are as described in claims; at least one of R6 and R7 is an aralkyl group represented by general formula (2) (wherein R12 to R21 are as described in claims); L represents an electron-donating ligand; and q is 0, ½, 1 or 2].
Provided are a catalyst, which enables the production of a high molecular weight olefin polymer having a polar group and being usable for various applications at a high catalytic activity, and a method for producing such an olefin polymer. Use is made of, as a polymerization catalyst for an olefin having a polar group, a metal complex represented by general formula (C1) [wherein: M represents an element in group 10 of the periodic table; X represents a phosphorus atom (P) or arsenic atom (As); R5 to R11 are as described in claims; at least one of R6 and R7 is an aralkyl group represented by general formula (2) (wherein R12 to R21 are as described in claims); L represents an electron-donating ligand; and q is 0, ½, 1 or 2].
A slurry containing abrasive grains and a liquid medium, in which the abrasive grains contain at least one metal compound selected from the group consisting of a metal oxide and a metal hydroxide, the metal compound contains a metal capable of taking a plurality of valences, and when the slurry is brought into contact with a surface to be polished to bring the abrasive grains into contact with the surface to be polished, the slurry yields 0.13 or more in X-ray photoelectron spectroscopy as a ratio of the lowest valence among the plurality of valences of the metal.
A fluorine-containing ether compound is provided which is represented by the following formula: R1—R2—CH2—R3a—CH2—R4a—CH2—R3b—CH2—R4b—CH2—R3c—CH2—R5—R6 (R3a, R3b, and R3c are perfluoropolyether chains; R2, R4a, R4b, and R5 are a divalent linking group having at least one selected from the group consisting of a hydroxyl group, an amino group, a carboxy group, and a sulfo group; R2 has an oxygen atom at an end that is bonded to R1; R5 has an oxygen atom at an end that is bonded to R6; R1 and R6 are an organic group having 1 to 50 carbon atoms or a hydrogen atom, and at least one of them is a group in which a cyano group is bonded to a carbon atom of an organic group having 1 to 8 carbon atoms).
C08G 65/26 - Composés macromoléculaires obtenus par des réactions créant une liaison éther dans la chaîne principale de la macromolécule à partir d'éthers cycliques par ouverture d'un hétérocycle à partir d'éthers cycliques et d'autres composés
C10M 107/38 - Compositions lubrifiantes caractérisées en ce que le matériau de base est un composé macromoléculaire contenant des halogènes
C10N 20/04 - Poids moléculaireRépartition du poids moléculaire
C10N 40/18 - Usages électriques ou magnétiques en relation avec des enregistrements sur bandes ou disques magnétiques
G11B 5/725 - Revêtements protecteurs, p. ex. antistatiques contenant un lubrifiant
4.
SIMULATION DEVICE, SIMULATION METHOD, AND SIMULATION PROGRAM
A simulation device includes a determination unit configured to compute a distance between an atom forming a first molecule and an atom forming a second molecule while performing a molecular dynamics computation, and determine whether or not the first molecule and the second molecule are in close proximity of each other, an imparting unit configured to impart a parameter for increasing a reaction probability with respect to the first molecule and/or the second molecule in a case where the determination unit determines that the first molecule and the second molecule are in close proximity of each other, an elementary reaction generation unit configured to generate an elementary reaction in a transition state, based on a chemical reaction identified in the molecular dynamics computation, and a reaction rate constant computation unit configured to compute a reaction rate constant of the generated elementary reaction.
G16C 10/00 - Chimie théorique computationnelle, c.-à-d. TIC spécialement adaptées aux aspects théoriques de la chimie quantique, de la mécanique moléculaire, de la dynamique moléculaire ou similaires
G16C 20/10 - Analyse ou conception des réactions, des synthèses ou des procédés chimiques
G16C 20/70 - Apprentissage automatique, exploration de données ou chimiométrie
5.
DESIGN SUPPORT DEVICE, DESIGN SUPPORT METHOD, AND DESIGN SUPPORT PROGRAM
This design support device acquires a recommended design parameter group by optimizing a goal-directed acquisition function constructed using a prediction model for predicting an observed value of a characteristic item, acquires an n-th (n is an integer of 1 to (K-1)) observed-value probability distribution by inputting an n-th recommended design parameter group to the prediction model, acquires an n-th conditional expected value on the basis of the n-th observed-value probability distribution, reconstructs each prediction model on the basis of first to n-th prediction result data consisting of the first to n-th recommended design parameter groups and the conditional expected value, reconstructs the goal-directed acquisition function on the basis of the prediction model, acquires an (n+1)-th recommended design parameter group by optimizing the goal-directed acquisition function, and outputs the sequentially acquired first to K-th recommended design parameter groups.
G06F 30/27 - Optimisation, vérification ou simulation de l’objet conçu utilisant l’apprentissage automatique, p. ex. l’intelligence artificielle, les réseaux neuronaux, les machines à support de vecteur [MSV] ou l’apprentissage d’un modèle
G06F 111/06 - Optimisation multi-objectif, p. ex. optimisation de Pareto utilisant le recuit simulé, les algorithmes de colonies de fourmis ou les algorithmes génétiques
6.
SOLID ELECTROLYTE, SOLID ELECTROLYTE SINTERED BODY, AND LITHIUM ION SECONDARY BATTERY
One embodiment of the present invention relates to a solid electrolyte. The solid electrolyte contains one or more elements selected from the group consisting of lithium, titanium, vanadium, oxygen, and an element M1 and an element M2; the element M1 is a group 14 element or zirconium; and the element M2 is a group 13 element.
H01B 1/08 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques oxydes
Disclosed is a film-type adhesive agent which contains an epoxy resin, a phenolic resin, and an elastomer, and which may further contain an inorganic filler. The content of the inorganic filler is 0-10 mass% with respect to the whole mass of the film-type adhesive agent. The content of the elastomer is 20-50 mass% with respect to the whole mass of the film-type adhesive. The content of the elastomer is 40-60 parts by mass with respect to the total amount, i.e., 100 parts by mass, of the epoxy resin and the phenol resin.
C09J 7/35 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif activés par chauffage
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
This resonance sound absorber includes a resonance box having a hollow part, and a hollow neck part connected to the resonance box. The neck part forms an opening communicating with the hollow part of the resonance box and the external space of the resonance box. The opening has an inner outlet open to the hollow part and an outer outlet open to the external space, and an opening area of the inner outlet and an opening area of the outer outlet are different. This tire is provided with the resonance sound absorber, and the resonance sound absorber is attached to a lumen part.
G10K 11/172 - Procédés ou dispositifs de protection contre le bruit ou les autres ondes acoustiques ou pour amortir ceux-ci, en général utilisant des effets de résonance
G10K 11/16 - Procédés ou dispositifs de protection contre le bruit ou les autres ondes acoustiques ou pour amortir ceux-ci, en général
9.
PROGRAM, CONDITION SEARCH APPARATUS, AND CONDITION SEARCH METHOD
A computer is caused to function as a condition storage unit configured to store one or more conditions represented by coordinates in a multi-dimensional space, a candidate condition generating unit configured to generate a plurality of candidate conditions represented by coordinates in the multi-dimensional space, a candidate condition selecting unit configured to calculate, for a coordinate position of each of the candidate conditions, a shortest distance to coordinate positions of the one or more conditions, and to select, as a coordinate position of a new condition, a coordinate position of one of the candidate conditions for which the shortest distance is longest, and a new condition adding unit configured to add the selected coordinate position of the new condition to the coordinate positions of the one or more conditions, wherein the candidate condition selecting unit repeats, until a termination condition is satisfied, a process of calculating, for a coordinate position of each of the candidate conditions, a shortest distance to the coordinate positions of the one or more conditions to which the new condition is added, and selecting, as a coordinate position of a new condition, a coordinate position of one of the candidate conditions for which the shortest distance is longest.
A semiconductor device including: a semiconductor component including a semiconductor chip; a heat dissipation member; and a thermally conductive sheet interposed between the semiconductor component and the heat dissipation member. The thermally conductive sheet includes a resin sheet having a through-hole, and a thermally conductive portion filled in the through-hole. The thermally conductive sheet and the heat dissipation member may be provided on a side opposite to a circuit surface of the semiconductor chip. The heat dissipation member may be a heat spreader or a heat sink.
Provided is a photosensitive resin film containing (A) a compound having an ethylenically unsaturated group, (B) a thermosetting resin, (C) a photopolymerization initiator, and (D) an imidazole compound, said photosensitive resin film having a first surface and a second surface on the reverse side from the first surface, wherein the mass-based concentration of the (D) imidazole compound on the first surface is 0-0.20 mass%, and the mass-based concentration of the (D) imidazole compound on the first surface is lower than the mass-based concentration of the (D) imidazole compound on the second surface. Also provided are a printed wiring board using said photosensitive resin film, a production method therefor, and a semiconductor package.
Provided is a photosensitive multilayer resin film having a first resin composition layer and a second resin composition layer, wherein the first resin composition layer and the second resin composition layer both contain (A) a compound having an ethylenically unsaturated group, (B) a thermosetting resin, and (C) a photopolymerization initiator, the second resin composition layer further contains (D) an imidazole compound, the amount of (D) imidazole compound in the first resin composition layer is 0-0.4 mass%, and the mass-based amount of the (D) imidazole compound in the first resin composition layer is less than the mass-based amount of the (D) imidazole compound in the second resin composition layer. Also provided are a printed wiring board using said photosensitive multilayer resin film, a production method therefor, and a semiconductor package.
G03F 7/027 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques
G03F 7/095 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires ayant plus d'une couche photosensible
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
13.
FILM ADHESIVE, DICING AND DIE-BONDING TWO-IN-ONE FILM, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME
Disclosed is a film adhesive which contains an epoxy resin, a phenol resin, and an elastomer, and which may further contain an inorganic filler. The content of the inorganic filler is 0-5% by mass based on the total amount of the film adhesive. The film adhesive has a storage modulus of 1200 MPa or more at 25° C.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
14.
TRAINING DATA GENERATION DEVICE, TRAINING DATA GENERATION METHOD, AND TRAINING DATA GENERATION PROGRAM
The present invention reduces imbalance in simulation patterns when generating training data for constructing a surrogate model. This training data generation device generates training data for constructing a surrogate model, and has: a determination unit that randomly determines each of an initial value of input data and a final value of the input data; a path generation unit that generates a path by randomly allocating, to each step in a path from the determined initial value to the determined final value, the amount of change that is possible in said step; and a training data generation unit that generates training data including the determined initial value and final value, and the amount of change allocated to each step in the generated path.
Disclosed is a method for manufacturing a semiconductor device. This method for manufacturing a semiconductor device includes: a step for preparing a laminate which includes an integrated dicing/die bonding film that has a base material layer, a tackifier layer, and an adhesive layer in this order, and a plurality of semiconductor chips obtained by individualizing a semiconductor wafer that is provided on the adhesive layer of the integrated dicing/die bonding film; a step for forming a groove in the adhesive layer by irradiating the adhesive layer with a laser through a gap among the plurality of semiconductor chips; and a step for producing semiconductor chips with an adhesive layer piece by individualizing the adhesive layer, in which the groove has been formed, by expanding the base material layer. The thickness of the adhesive layer is 30-50 μm, and the depth of the groove is 45% or less with respect to the thickness of the adhesive layer.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
16.
METHOD FOR MANUFACTURING ELEMENT BODY FOR RESIN GEAR, AND APPARATUS FOR MANUFACTURING ELEMENT BODY
In this method for manufacturing an element body for a resin gear, a dry or wet molding material containing a thermosetting resin powder and fibers is used to make an element body for a resin gear. The method for manufacturing an element body for a resin gear comprises a material filling step for filling the inside of a cylindrical mold with a molding material. In the material filling step, the molding material is sucked into the mold from a suction port on a side surface of the mold.
B29C 43/18 - Moulage par pressage, c.-à-d. en appliquant une pression externe pour faire couler la matière à moulerAppareils à cet effet pour la fabrication d'objets de longueur définie, c.-à-d. d'objets séparés en incorporant des parties ou des couches préformées, p. ex. moulage par pressage autour d'inserts ou sur des objets à recouvrir
B29C 43/56 - Moulage par pressage sous conditions particulières, p. ex. sous vide
B29C 70/68 - Façonnage de matières composites, c.-à-d. de matières plastiques comprenant des renforcements, des matières de remplissage ou des parties préformées, p. ex. des inserts en incorporant ou en surmoulant des parties préformées, p. ex. des inserts ou des couches
F16H 55/06 - Emploi de matériauxEmploi de traitements d'organes dentés ou de vis sans fin pour modifier les propriétés intrinsèques des matériaux
17.
GAS-FILLED CONTAINER AND METHOD OF STORING (E)-1,1,1,4,4,4,-HEXAFLUORO-2-BUTENE
There is provided a gas-filled container in which the purity of filled (E)-1,1,1,4,4,4-hexafluoro-2-butene is less likely to decrease over a long term. The gas-filled container includes: a filled container filled with (E)-1,1,1,4,4,4-hexafluoro-2-butene. A part in contact with the filled (E)-1,1,1,4,4,4-hexafluoro-2-butene of the filled container is formed of a metal having a copper concentration of less than 0.5% by mass.
F17C 1/14 - Récipients sous pression, p. ex. bouteilles de gaz, réservoirs de gaz, cartouches échangeables en aluminiumRécipients sous pression, p. ex. bouteilles de gaz, réservoirs de gaz, cartouches échangeables en acier amagnétique
F17C 5/00 - Procédés ou appareils pour remplir des récipients sous pression de gaz liquéfiés, solidifiés ou comprimés
18.
POLYCRYSTALLINE ALUMINA ABRASIVE GRAINS, METHOD FOR PRODUCING SAME, AND GRINDSTONE
To provide polycrystalline alumina abrasive grains having a small alumina crystal grain size and excellent polishing and grinding performance, a production method capable of producing the polycrystalline alumina abrasive grains at low cost, and a grindstone using the polycrystalline alumina abrasive grains. Polycrystalline alumina abrasive grains having an alumina content of 95.0 mass% or more, a silica content of 0.05-3.30 mass%, a crystal grain size of 0.100-0.400 μm, and a Vickers hardness of 21.00 or more are obtained by a production method including: a step for obtaining a mixed liquid of pseudoboehmite, a specified silica, and water; a step for adding a deflocculating agent to the mixed liquid to obtain a sol; a step for adding an alumina seed to the sol to obtain a seed-containing sol; a step for crushing a dried residue of the seed-containing sol, and then calcining at from 550°C to less than 1200°C; and a step for firing at 1200-1500° C.
B24D 3/00 - Propriétés physiques des corps ou feuilles abrasives, p. ex. surfaces abrasives de nature particulièreCorps ou feuilles abrasives caractérisés par leurs constituants
C01B 33/18 - Préparation de silice finement divisée ni sous forme de sol ni sous forme de gelPost-traitement de cette silice
Provided is a method for producing a molding material for a resin gear. The method for producing a molding material for a resin gear comprises a fusion step in which a resin powder is fused to fibers to form a molding material in a mixed raw material obtained by mixing the fibers and a thermosetting resin powder.
B29B 13/10 - Conditionnement ou traitement physique de la matière à façonner par broyage, p. ex. par triturationConditionnement ou traitement physique de la matière à façonner par tamisageConditionnement ou traitement physique de la matière à façonner par filtration
B29K 105/12 - Présentation, forme ou état de la matière moulée contenant des agents de renforcement, charges ou inserts de longueur réduite, p. ex. filaments coupés, fibres coupées ou crins
Provided is a method for forming a deposition film, with which a deposition film having improved uniformity of a film thickness can be formed. The method for forming a deposition film is a method for forming a deposition film on a substrate (21) on which a pattern (22) is formed, and the method includes a deposition step of placing the substrate (21) on an electrode and applying bias power to the electrode to form a deposition film (40) on the substrate (21) using plasma obtained by plasma-processing a deposition gas. A material constituting the pattern (22) is at least one of a carbon-containing material, a silicon-containing material, and a metal-containing material. In addition, the deposition gas contains unsaturated halon. The unsaturated halon is an unsaturated compound which has a fluorine atom, a bromine atom, and a carbon atom in a molecule and has 2 or 3 carbon atoms. Further, a power density of the bias power applied to the electrode is more than 0 W/cm2 and 0.5 W/cm2 or less.
A method for manufacturing a magnetic recording medium includes successively laminating at least a magnetic layer, a protective film, and a lubricant layer on a nonmagnetic substrate, and performing a heat treatment a surface of the lubricant layer by irradiation of light from an LED light source.
A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, and the additive includes (A) a 4-pyrone-based compound represented by General Formula (1) below, and (B1) a compound of which a 1 mM aqueous solution has a pH of 3.7 or more or (B2) a cyclic compound having at least one functional group selected from the group consisting of a carboxy group, a carboxylate group, an amino group, and a hydroxy group. A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, and the additive includes a compound having two or more nitrogen atoms to which a hydroxyalkyl group is bonded.
A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, and the additive includes (A) a 4-pyrone-based compound represented by General Formula (1) below, and (B1) a compound of which a 1 mM aqueous solution has a pH of 3.7 or more or (B2) a cyclic compound having at least one functional group selected from the group consisting of a carboxy group, a carboxylate group, an amino group, and a hydroxy group. A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, and the additive includes a compound having two or more nitrogen atoms to which a hydroxyalkyl group is bonded.
A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, and the additive includes (A) a 4-pyrone-based compound represented by General Formula (1) below, and (B1) a compound of which a 1 mM aqueous solution has a pH of 3.7 or more or (B2) a cyclic compound having at least one functional group selected from the group consisting of a carboxy group, a carboxylate group, an amino group, and a hydroxy group. A polishing liquid for CMP, containing: abrasive grains; an additive; and water, in which the abrasive grains include cerium-based particles, and the additive includes a compound having two or more nitrogen atoms to which a hydroxyalkyl group is bonded.
[in the formula, X11, X12, and X13 are each independently a hydrogen atom or a monovalent substituent.]
A binder for a nonaqueous secondary battery electrode, the binder containing a copolymer having 4.0- 75.0 mol% of a structural unit derived from a monomer represented by formula (I) (in formula (I), R 1is a hydrogen atom or a methyl group, R2is a hydrogen atom or a hydroxy group, and m and n are 0 or 1) and 25.0-96.0 mol % of a structural unit derived from a monomer represented by formula (II) (R322COOX2, and X1and X244) .
A photosensitive resin composition according to the present disclosure contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a sensitizer. The binder polymer has a first structural unit derived from acrylic acid, a second structural unit derived from styrene or a styrene derivative, and a third structural unit derived from a (meth)acrylate compound. Based on the total mass of structural units derived from polymerizable monomers constituting the binder polymer, the first structural unit content is 9-25 mass%, the second structural unit content is 61 mass% or more, and the third structural unit content is 1-20 mass%.
G03F 7/033 - Composés photopolymérisables non macromoléculaires contenant des doubles liaisons carbone-carbone, p. ex. composés éthyléniques avec des liants les liants étant des polymères obtenus par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carbone, p. ex. polymères vinyliques
G03F 7/40 - Traitement après le dépouillement selon l'image, p. ex. émaillage
G03F 7/42 - Élimination des réserves ou agents à cet effet
H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
Provided is a resin composition comprising: (A) one or more selected from the group consisting of a maleimide resin having at least one N-substituted maleimide group and a derivative of the maleimide resin; (B) a modified conjugated diene polymer obtained by modifying a conjugated diene polymer, having a vinyl group in a side chain, with a maleimide resin having at least two N-substituted maleimide groups; and (C) a copolymer resin comprising a structural unit derived from an aromatic vinyl compound and a structural unit derived from an unsaturated aliphatic hydrocarbon, wherein the content of the structural unit derived from the aromatic vinyl compound is less than 30 mass%. Also provided are a prepreg, a laminate, a resin film, a printed wiring board and a semiconductor package using the resin composition.
C08L 35/00 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone l'un au moins étant terminé par un radical carboxyle et contenant au moins un autre radical carboxyle dans la molécule, ou leurs sels, anhydrides, esters, amides, imides ou nitrilesCompositions contenant des dérivés de tels polymères
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
C08F 299/02 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés
C08J 5/24 - Imprégnation de matériaux avec des prépolymères pouvant être polymérisés en place, p. ex. fabrication des "prepregs"
C08L 51/04 - Compositions contenant des polymères greffés dans lesquels le composant greffé est obtenu par des réactions faisant intervenir uniquement des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères greffés sur des caoutchoucs
C08L 53/02 - Compositions contenant des copolymères séquencés possédant au moins une séquence d'un polymère obtenu par des réactions ne faisant intervenir que des liaisons non saturées carbone-carboneCompositions contenant des dérivés de tels polymères contenant des monomères vinylaromatiques et des diènes conjugués
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
Disclosed is a polymer comprising structural units represented by formula (I) or formula (II) and structural units having an oxiranyl group. (In formula (I): R1represents a hydrogen atom or a methyl group; M represents an alkylene group or an alkylene oxide chain; A represents a group represented by formula (a) or formula (b); and R2represents an alkyl group, an aryl group, an aralkyl group, or a hydrogen atom.) (In formula (a), * represents a bonding position.) (In formula (b), * represents a bonding position.) (In formula (II): R3represents a hydrogen atom or a methyl group; and R4 represents an alkyl group, an aryl group, an aralkyl group, or a hydrogen atom.)
A relationship estimation unit (32) estimates a correspondence relationship between a combination of a coefficient of thermal expansion and an elastic modulus of a circuit board core and a combination of a coefficient of thermal expansion and an elastic modulus of a circuit board using the circuit board core. A reception unit (34) receives a coefficient of thermal expansion of a substrate joined to the circuit board by solder. A reliability estimation unit (36) estimates, for each combination of the coefficient of thermal expansion and the elastic modulus of the circuit board, the reliability of the solder when the substrate and the circuit board are joined by solder. A calculation unit (38) calculates, on the basis of the correspondence relationship, the range of the combination of the coefficient of thermal expansion and the elastic modulus of the circuit board core corresponding to the combination of the coefficient of thermal expansion and the elastic modulus of the circuit board having a reliability greater than or equal to a prescribed value.
A SiC epitaxial wafer including: a SiC substrate; and a SiC epitaxial layer stacked on one surface of the SiC substrate, wherein a diameter of the SiC substrate is 195 mm or more, and a warp is 50 μm or less.
A photosensitive resin composition for a permanent resist according to the present disclosure contains an acid-modified vinyl group-containing resin (A), a thermosetting resin (B), a photopolymerization initiator (C), a photopolymerizable compound (D), and an elastomer (H), the photopolymerizable compound includes a photopolymerizable compound having an isocyanuric skeleton, and the elastomer includes a liquid elastomer or a granular elastomer having an average particle size of less than 4 μm.
C09D 125/18 - Homopolymères ou copolymères de monomères aromatiques contenant des éléments autres que le carbone et l'hydrogène
H01G 9/00 - Condensateurs électrolytiques, redresseurs électrolytiques, détecteurs électrolytiques, dispositifs de commutation électrolytiques, dispositifs électrolytiques photosensibles ou sensibles à la températureProcédés pour leur fabrication
In the method for manufacturing a circuit board, first, a glass laminate 10 having a first outer glass layer 11 including a first surface 10a and a first inner glass layer 13 bonded to the first outer glass layer 11 on a side opposite to the first surface 10a is prepared as a substrate serving as a core of a package substrate. In the method for manufacturing a circuit board, the first surface 10a is irradiated with a laser beam L to form a first hole H1 penetrating at least the first outer glass layer 11 and the first inner glass layer 13 from the first surface 10a toward the second surface 10b. In the method for manufacturing a circuit board, the light absorption rate of the first inner glass layer 13 is lower than the light absorption rate of the first outer glass layer 11. Thus, a hole for providing a connection member 40 for electrically connecting a first terminal 20 formed on the first surface 10a and a second terminal 30 formed on the second surface 10b can be easily formed.
A photosensitive element comprising a support film, an optical adjustment layer, and a photosensitive layer in this order, wherein the optical adjustment layer has an absorbance of 0.060 or less with respect to light having a wavelength of 365 nm, and the optical adjustment layer has a refractive index of 1.800 or less with respect to light having a wavelength of 365 nm.
G03F 7/09 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires
G03F 7/11 - Matériaux photosensibles caractérisés par des détails de structure, p. ex. supports, couches auxiliaires avec des couches de recouvrement ou des couches intermédiaires, p. ex. couches d'ancrage
33.
RELEASE FILM FOR SEMICONDUCTOR MOLDING AND SEMICONDUCTOR PACKAGE PRODUCTION METHOD
This release film for semiconductor molding has a release layer, a conductive layer, and a base material layer in this order, and the release layer contains an ionic compound.
The present invention provides: a resin composition containing (A) a thermosetting resin, (B) an inorganic filler having a true density of no greater than 1,500 kg/m3, and (C) an inorganic filler having a true density exceeding 1,500 kg/m3; a prepreg that includes the resin composition; a layered sheet; a printed circuit board; and a semiconductor package.
C08L 101/00 - Compositions contenant des composés macromoléculaires non spécifiés
B32B 5/28 - Produits stratifiés caractérisés par l'hétérogénéité ou la structure physique d'une des couches caractérisés par la présence de plusieurs couches qui comportent des fibres, filaments, grains ou poudre, ou qui sont sous forme de mousse ou essentiellement poreuses une des couches étant fibreuse ou filamenteuse imprégnée de matière plastique ou enrobée dans une matière plastique
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
C08J 5/24 - Imprégnation de matériaux avec des prépolymères pouvant être polymérisés en place, p. ex. fabrication des "prepregs"
C08K 3/013 - Charges, pigments ou agents de renforcement
This method for predicting a property of an aluminum member comprises: a mechanical property measuring step for measuring a mechanical property after T6 treatment for an unforged first aluminum member and a plurality of forged second aluminum members; a Z-factor calculating step for obtaining a temperature and a strain rate for each forging step by numerical analysis for the second aluminum members during forging, and calculating a Z-factor using the obtained temperature and strain rate; a regression equation deriving step for deriving a regression equation indicating a relationship between the mechanical property and the Z-factor, using a plurality of combinations of the measured value of the mechanical property and the calculated value of the Z factor that correspond through strength; and a mechanical property predicting step for predicting the mechanical property of the third aluminum member after T6 treatment after an arbitrary forging step, using the regression equation.
G01N 3/08 - Recherche des propriétés mécaniques des matériaux solides par application d'une contrainte mécanique par application d'efforts permanents de traction ou de compression
B21J 5/00 - Méthodes pour forger, marteler ou presserÉquipement ou accessoires particuliers
G01N 3/00 - Recherche des propriétés mécaniques des matériaux solides par application d'une contrainte mécanique
36.
SiC EPITAXIAL WAFER AND METHOD OF MANUFACTURING SiC EPITAXIAL WAFER
A SiC epitaxial wafer includes a SiC substrate and an epitaxial layer laminated on the SiC substrate, wherein the epitaxial layer contains an impurity element which determines the conductivity type of the epitaxial layer and boron which has a conductivity type different from the conductivity type of the impurity element, and the concentration of boron is less than 1.0×1014 cm−3 at any position in the plane of the epitaxial layer.
C23C 16/44 - Revêtement chimique par décomposition de composés gazeux, ne laissant pas de produits de réaction du matériau de la surface dans le revêtement, c.-à-d. procédés de dépôt chimique en phase vapeur [CVD] caractérisé par le procédé de revêtement
C23C 16/52 - Commande ou régulation du processus de dépôt
C30B 25/20 - Croissance d'une couche épitaxiale caractérisée par le substrat le substrat étant dans le même matériau que la couche épitaxiale
H01L 21/02 - Fabrication ou traitement des dispositifs à semi-conducteurs ou de leurs parties constitutives
H01L 29/16 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, mis à part les matériaux de dopage ou autres impuretés, seulement des éléments du groupe IV de la classification périodique, sous forme non combinée
H01L 29/167 - Corps semi-conducteurs caractérisés par les matériaux dont ils sont constitués comprenant, mis à part les matériaux de dopage ou autres impuretés, seulement des éléments du groupe IV de la classification périodique, sous forme non combinée caractérisés en outre par le matériau de dopage
The present embodiment relates to a semiconductor package including an organic substrate having a circuit, a semiconductor chip that is mounted on a part of one surface of the organic substrate, and is electrically connected to the circuit, and a metal plate that is adhered to the one surface of the organic substrate in at least a part of a region where the semiconductor chip is not mounted, and is not electrically connected to the circuit, a metal constituting the metal plate having an average thermal expansion coefficient at 30 to 260° C. of 3 to 15 ppm/° C.
This method for manufacturing a semiconductor device involves: forming a preliminary pressure-bonded body by thermo-pressure-bonding a second circuit member having a second insulating film to a first circuit member having a second insulating film by means of a preliminary pressure-bonding head; and forming a bonded body in which the first insulating film and the second insulating film are bonded by pressurizing the preliminary pressure-bonded body while heating. At least one among the first insulating film and the second insulating film is an organic insulating film. The plurality of second circuit members are sequentially thermo-pressure-bonded to the first circuit member by means of the preliminary pressure-bonding head while maintaining the temperature of the preliminary pressure-bonding head within a range of equal to or higher than a predetermined minimum temperature and equal to or lower than the preliminary pressure-bonding temperature.
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
39.
DICING/DIE-BONDING INTEGRATED FILM AND METHOD FOR MANUFACTURING SAME
Disclosed is a dicing/die-bonding integrated film 10 comprising: a dicing film 5 including a base material film 3 and an adhesive layer 2 provided on the base material film 3; and an adhesive layer disposed on the adhesive layer 2 of the dicing film 5 and composed of a die bonding film 1. The loss tangent of the dicing film 5 at 0°C is 0.15 or less.
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
C09J 7/20 - Adhésifs sous forme de films ou de pellicules caractérisés par leur support
A photosensitive resin composition according to the present disclosure contains a binder polymer, a photopolymerizable compound, a photopolymerization initiator, and a sensitizer. The photopolymerizable compound contains a monofunctional (meth)acrylate having a bicyclo skeleton. The contained amount of the monofunctional (meth)acrylate having a bicyclo skeleton is less than 5.0 parts by mass with respect to 100 parts by mass of the total amount of the binder polymer and the photopolymerizable compound.
G03F 7/031 - Composés organiques non couverts par le groupe
G03F 7/40 - Traitement après le dépouillement selon l'image, p. ex. émaillage
G03F 7/42 - Élimination des réserves ou agents à cet effet
H05K 3/06 - Élimination du matériau conducteur par voie chimique ou électrolytique, p. ex. par le procédé de photo-décapage
H05K 3/18 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de la précipitation pour appliquer le matériau conducteur
41.
ALUMINUM NITRIDE FILLER, METHOD FOR PRODUCING ALUMINUM NITRIDE FILLER, RESIN COMPOSITION, AND METHOD FOR PRODUCING RESIN COMPOSITION
Provided is an aluminum nitride filler containing aluminum nitride particles and a coating (a) containing a compound (A) having a polyethyleneimine skeleton and a polyalkylene oxide chain and having a weight average molecular weight of 2,000-10,000. Also provided is a method for producing the aluminum nitride filler.
A resin composition used for coating the sliding surface of a brake rotor, the resin composition containing: at least one compound selected from the group consisting of titanium compounds, magnesium compounds, and lithium compounds; and an epoxy resin or a precursor thereof.
Provided is a film adhesive comprising metal particles, an epoxy resin, a phenolic resin, and an elastomer, wherein the content of the metal particles is not less than 80.0 mass% with respect to the mass of the film adhesive, the epoxy resin contains a first epoxy resin that is liquid at 25°C and a second epoxy resin that is solid at 25°C, and when the content of the metal particles is expressed as 100 mass parts, the content of the first epoxy resin is 4.0-5.5 mass parts.
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
This heat-dissipating structure comprises a conductive member and a cold energy member, and has an adhesive layer and an insulating layer between the conductive member and the cold energy member.
This adhesive composition contains conductive particles having a plurality of protrusions on the surface. The compressive hardness of the conductive particles at 20% compression is 350 kgf/mm2-1500 kgf/mm2. The ratio of the area of the protrusions to the area of the surface of the conductive particles is 30% or more.
H01R 11/01 - Éléments de connexion individuels assurant plusieurs emplacements de connexion espacés pour des organes conducteurs qui sont ou qui peuvent être interconnectés de cette façon, p. ex. pièces d'extrémité pour fils ou câbles supportées par le fil ou par le câble et possédant des moyens pour faciliter la connexion électrique avec quelqu'autre fil, borne, ou organe conducteur, répartiteurs caractérisés par la forme ou par la disposition de l'interconnexion entre leurs emplacements de connexion
H01B 1/00 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
H01B 5/16 - Conducteurs ou corps conducteurs non isolés caractérisés par la forme comprenant un matériau conducteur incorporé à un matériau isolant ou faiblement conducteur, p. ex. du caoutchouc conducteur
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
46.
METHOD FOR PRODUCING NITRIDE FILLER COATED WITH ORGANOSILICON-CONTAINING COMPOUND AND HAVING SILANOL GROUP, AND METHOD FOR PRODUCING SILICA-COATED NITRIDE FILLER COATED WITH ORGANOSILICON-CONTAINING COMPOUND AND HAVING SILANOL GROUP
Provided are a method for producing a nitride filler coated with an organosilicon-containing compound and having a silanol group and a method for producing a silica-coated nitride filler coated with an organosilicon-containing compound and having a silanol group, with which it becomes possible to control the reduction in viscosity of a slurry obtained by mixing with a resin monomer. The method for producing a nitride filler coated with an organosilicon-containing compound and having a silanol group includes: a step 1A in which the surface of a nitride filler is coated with an organic silicone compound containing a specific structure to produce a nitride filler coated with an organosilicon-containing compound; and a step 2A in which the surface of the nitride filler coated with an organosilicon-containing compound is treated with a specific basic substance to produce a nitride filler coated with an organosilicon-containing compound and having a silanol group on the surface thereof. Alternatively, the method includes a step 1P in which the surface of a nitride filler is coated by treating the nitride filler with an organic silicone compound and a basic substance simultaneously while allowing both of the organic silicone compound and the basic substance to coexist in the same atmosphere, thereby producing a nitride filler coated with an organosilicon-containing compound and having a silanol group on the surface thereof.
A resin composition including a maleimide resin (A) obtained by reacting a tetracarboxylic acid dianhydride (a1), a diamine (a2), and maleic anhydride (a3), in which the tetracarboxylic acid dianhydride (a1) contains at least one of a compound represented by the following Formula (1), a compound represented by the following Formula (2), and a compound represented by the following Formula (6), and the diamine (a2) contains a dimer diamine and a second diamine other than a dimer diamine:
A resin composition including a maleimide resin (A) obtained by reacting a tetracarboxylic acid dianhydride (a1), a diamine (a2), and maleic anhydride (a3), in which the tetracarboxylic acid dianhydride (a1) contains at least one of a compound represented by the following Formula (1), a compound represented by the following Formula (2), and a compound represented by the following Formula (6), and the diamine (a2) contains a dimer diamine and a second diamine other than a dimer diamine:
C08G 73/12 - Précurseurs de polyimides non saturés
C08F 283/04 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères prévus par la sous-classe sur des polycarbonamides, des polyesteramides ou des polyimides
A lithium ion conductive solid electrolyte that is a compound represented by a compositional formula Li2-xTi1-xM1xO3, wherein the M1 is at least one metallic element selected from the group consisting of elements of niobium and tantalum, and 0.05≤x≤0.15.
H01B 1/08 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs composés principalement d'autres substances non métalliques oxydes
H01M 10/0525 - Batteries du type "rocking chair" ou "fauteuil à bascule", p. ex. batteries à insertion ou intercalation de lithium dans les deux électrodesBatteries à l'ion lithium
Provided is an electrode binder for a biofuel cell, which can provide an electrode slurry that has a low environmental load, a conductive material of which being good in dispersibility, and is suitable for screen printing and allows production of a biofuel cell that exhibits good output characteristics. The electrode binder for a biofuel cell according to the present invention includes a polymer (A) having a first structural unit derived from a nonionic ethylenically unsaturated monomer (a1), a second structural unit derived from an anionic ethylenically unsaturated monomer (a2), and a third structural unit derived from a crosslinking agent (a3), and the crosslinking agent (a3) has two or more ethylenically unsaturated bonds in one molecule.
A resin composition used for coating the sliding surface of a brake rotor, the resin composition containing: at least one compound selected from the group consisting of titanium compounds, magnesium compounds, and lithium compounds; and an epoxy resin or a precursor thereof.
A polymer for a polishing liquid, wherein the polymer has a first structural unit derived from at least one styrene compound selected from the group consisting of styrene and styrene derivatives and a second structural unit derived from at least one methacrylic acid compound selected from the group consisting of methacrylic acid and salts thereof, and the content of the first structural unit is from more than 0 mol % to 38 mol %.
A method for manufacturing a laminate includes forming a first organic insulating layer including a first thermosetting resin and first inorganic oxide particles on a first support substrate, polishing a first surface of the first organic insulating layer to planarize the first surface, and bonding the polished first surface to a second surface of a second organic insulating layer including a second thermosetting resin and second inorganic oxide particles.
A method for producing a resin composition is disclosed. The method for producing a resin composition includes: obtaining a polyimide resin by reacting a tetracarboxylic dianhydride with a polyamine in an organic solvent; and obtaining a resin composition containing a polymaleimide resin and the organic solvent by reacting the polyimide resin with maleic anhydride. The polyamine contains dimer diamine. The organic solvent contains 1,2,4-trimethylbenzene.
C08G 73/10 - PolyimidesPolyester-imidesPolyamide-imidesPolyamide-acides ou précurseurs similaires de polyimides
C08F 299/02 - Composés macromoléculaires obtenus par des interréactions de polymères impliquant uniquement des réactions entre des liaisons non saturées carbone-carbone, en l'absence de monomères non macromoléculaires à partir de polycondensats non saturés
54.
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
This semiconductor device is provided with: a substrate; a stacked chip comprising a plurality of semiconductor chips stacked on a main surface of the substrate; fixed layers disposed between the main surface of the substrate and the stacked chip and between the plurality of semiconductor chips in the stacked chip; and a filet extending from the fixed layer so as to protrude from between the main surface of the substrate and the stacked chip and between the plurality of semiconductor chips in the stacked chip. The filet is connected to the main surface of the substrate and an end surface of the laminated chip.
H01L 25/065 - Ensembles consistant en une pluralité de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide les dispositifs étant tous d'un type prévu dans une seule des sous-classes , , , , ou , p. ex. ensembles de diodes redresseuses les dispositifs n'ayant pas de conteneurs séparés les dispositifs étant d'un type prévu dans le groupe
H01L 21/56 - Encapsulations, p. ex. couches d’encapsulation, revêtements
55.
DESIGN SUPPORT DEVICE, DESIGN SUPPORT METHOD, PROGRAM, AND DESIGN SUPPORT SYSTEM
This design support device is provided with: an input reception unit that receives an input of a first formulation condition from an operator in a conversation format; a prompt generation unit that generates a prompt incorporating the first formulation condition; a first search unit that searches a database storing past experimental data for experimental data matching the first formulation condition by using a search condition generated by a language model on the basis of the prompt, and if there is no experimental data matching the first formulation condition, searches for experimental data matching a second formulation condition relaxing the first formulation condition; a prediction unit that predicts physical properties of a plurality of candidate formulations generated from formulation of experimental data matching the second formulation condition; a second search unit that searches the plurality of candidate formulations for a candidate formulation matching the first formulation condition on the basis of the search condition; and a formulation display unit that displays a candidate formulation matching the first formulation condition.
G16C 60/00 - Science informatique des matériaux, c.-à-d. TIC spécialement adaptées à la recherche des propriétés physiques ou chimiques de matériaux ou de phénomènes associés à leur conception, synthèse, traitement, caractérisation ou utilisation
56.
TWO-DIMENSIONAL MODEL GENERATION METHOD, TWO-DIMENSIONAL MODEL GENERATION DEVICE, AND PROGRAM
Provided is a two-dimensional model generation method for generating a two-dimensional model of a connection structure that uses tapered threads. The two-dimensional model generation method, which generates a two-dimensional model of a connection structure in which a first column body having a first tapered female thread portion and a second column body having a second tapered female thread portion are connected by a joint body having a body portion, a first tapered male thread portion, and a second tapered male thread portion, causes a computer to perform: a step for receiving input of parameters; a step for drawing a vertically symmetrical body portion, a first tapered male thread portion and a second tapered male thread portion that are vertically symmetrical, and a first tapered female thread portion and a second tapered female thread portion that are vertically symmetrical, on the basis of the input parameters; a step for moving the first tapered male thread portion, the first tapered female thread portion, and the second tapered female thread portion in the horizontal direction radially outward, on the basis of the input parameters; a step for moving the body portion of a joint body in the vertical direction on the basis of the input parameters; a step for moving the second tapered male thread portion in the horizontal direction radially inward on the basis of the input parameters; and a step for moving the second tapered female thread portion along the taper on the basis of the input parameters.
Disclosed is a thermosetting adhesive composition comprising: a thermosetting resin; a thermoplastic resin; an inorganic filler; and a photofragmenting compound that undergoes fragmentation upon irradiation with ultraviolet rays and that generates an amine compound. The thermosetting resin cures when heated in the presence of an amine compound. After irradiation with ultraviolet rays with an illuminance of 80 mW/cm2and a cumulative amount of light of 600 mJ/cm2, shear viscosity at 75°C is 100-6000 Pa･s. After irradiation with ultraviolet rays with an illuminance of 80 mW/cm2and a cumulative amount of light of 600 mJ/cm2 and then heating at 75°C for three hours, the storage modulus at 35°C is 100-4000 MPa.
Disclosed is a thermosetting adhesive composition. The thermosetting adhesive composition contains an epoxy resin, an elastomer, and a curing accelerator. The curing accelerator is a compound that generates a heterocyclic amine compound upon heating.
A CMP polishing solution containing abrasive grains, an iron ion supplying agent, an organic acid, an oxidizing agent, and an aqueous liquid medium, in which the abrasive grains include silica particles having sulfo groups and silica particles not having sulfo groups.
Provided are a catalyst and a method that enable the production of an olefin-based polymer, which has a polar group and is usable for various applications, at high catalytic activity. A metal complex shown in general formula (C1) (in the formula, M represents a palladium atom or a nickel atom, X represents a phosphorus atom (P), R5-R9 are as set forth in the claims, L represents an electron donating ligand, and q is 0, ½, 1, or 2) is used as a catalyst for polymerization of an olefin having a polar group.
C08F 4/80 - MétauxHydrures métalliquesComposés organiques de métalLeur utilisation comme précurseurs de catalyseurs choisis parmi les métaux non prévus dans le groupe choisis parmi les métaux du groupe du fer ou les métaux du groupe du platine
Provided is a compound which comprises a metal powder and a resin composition. The metal powder is a soft magnetic material. The resin composition includes a heat-curable resin. The compound powder includes a plurality of large particles having a particle diameter larger than 500 μm. The content of the large particles in the compound powder is 40-100 mass%. At least some of the plurality of large particles each comprise: at least one metal particle as a component of the metal powder; and the resin composition covering the metal particle.
C08F 212/00 - Copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un noyau carbocyclique aromatique
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 57/00 - Compositions contenant des polymères non spécifiés obtenus par des réactions ne faisant intervenir que des liaisons non saturées carbone-carbone
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
63.
ADHESIVE COMPOSITION, ADHESIVE FILM, LAMINATE, AND METHOD FOR PRODUCING CIRCUIT CONNECTION STRUCTURE
An adhesive composition comprising: a radically polymerizable compound; a radical polymerization initiator; and an acrylic resin that has at least one epoxy group per molecule and that has a weight-average molecular weight of not less than 5,000.
NATIONAL UNIVERSITY CORPORATION SAITAMA UNIVERSITY (Japon)
Inventeur(s)
Takezawa Yoshitaka
Kodama Koichi
Hirose Takuji
Abrégé
A composition for a thermally conductive material is provided, the composition containing a compound represented by formula (1). In the formula, R1to R6each independently represent a group represented by formula (2) or an alkyl group, and at least three of R1to R6are groups represented by formula (2). In the formula, R11 represents an alkyl group or an alkenyl group and p is 1 or 2.
C09K 5/14 - Substances solides, p. ex. pulvérulentes ou granuleuses
C08F 116/12 - Homopolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un radical alcool, éther, aldéhyde, cétone, acétal ou cétal par un radical éther
65.
DIE ATTACHMENT FILM, DICING DIE BONDING FILM, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
This die attachment film is used for bonding a second semiconductor chip to a plurality of spacers disposed around a first semiconductor chip on a substrate, such that the second semiconductor chip covers the first semiconductor chip while straddling the space between the plurality of spacers. The die attachment film presents a minimum melt viscosity of 2000 Pa·s or greater and 9800 Pa·s or less in a range of 90-180°C. The minimum melt viscosity is a value obtained by measuring the dynamic viscoelasticity of the die attachment film in a temperature range including the range of 90-180°C under the condition of a temperature increase rate of 5°C/min and a frequency of 4Hz.
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
C09J 5/06 - Procédés de collage en généralProcédés de collage non prévus ailleurs, p. ex. relatifs aux amorces comprenant un chauffage de l'adhésif appliqué
C09J 7/35 - Adhésifs sous forme de films ou de pellicules caractérisés par la composition de l’adhésif activés par chauffage
C09J 11/04 - Additifs non macromoléculaires inorganiques
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01L 21/301 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour subdiviser un corps semi-conducteur en parties distinctes, p. ex. cloisonnement en zones séparées
66.
LIQUID RESIN COMPOSITION FOR SEALING, AND ELECTRONIC COMPONENT DEVICE
C08F 212/00 - Copolymères de composés contenant un ou plusieurs radicaux aliphatiques non saturés, chaque radical ne contenant qu'une seule liaison double carbone-carbone et l'un au moins étant terminé par un noyau carbocyclique aromatique
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 57/00 - Compositions contenant des polymères non spécifiés obtenus par des réactions ne faisant intervenir que des liaisons non saturées carbone-carbone
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
67.
MOLDED BODY, AUTOMOTIVE MEMBER, AND PRODUCTION METHOD FOR MOLDED BODY
A molded body having a foam region that includes a skin layer A, a foam layer, and a skin layer B in this order in the thickness direction, wherein the average diameter of cells included in the foam layer is 0.40 mm or more.
C08J 9/06 - Mise en œuvre de substances macromoléculaires pour produire des matériaux ou objets poreux ou alvéolairesLeur post-traitement utilisant des gaz de gonflage produits par un agent de gonflage introduit au préalable par un agent chimique de gonflage
B29C 44/00 - Moulage par pression interne engendrée dans la matière, p. ex. par gonflage ou par moussage
B29C 44/02 - Moulage par pression interne engendrée dans la matière, p. ex. par gonflage ou par moussage pour la fabrication d'objets de longueur définie, c.-à-d. d'objets séparés
B29C 45/56 - Moyens pour plastifier ou homogénéiser la matière à mouler ou pour la forcer dans le moule utilisant des éléments de moules mobiles pendant ou après l'injection, p. ex. pour le moulage par injection-pressage
Provided is a polishing liquid containing abrasive grains and an acid component, wherein the acid component contains a compound (excluding sulfuric acid and salts thereof) having at least one type of molecule selected from the group consisting of sulfo groups and sulfonic acid groups, and has a pH of more than 4.5. Also provided is a polishing method comprising a step for polishing a surface using the polishing liquid.
A suspension arm (100) is made of an aluminum alloy having an alloy composition containing 0.25-0.37 mass% Cu, 0.95-1.25 mass% Mg, 0.6-0.75 mass% Si, 0.05-0.12 mass% Mn, 0.15-0.35 mass% Fe, 0.25 mass% or less Zn, 0.050-0.26 mass% Cr, 0.01-0.1 mass% Ti, 0.001-0.03 mass% B, and 0.0010-0.050 mass% Zr, with the remainder being Al and unavoidable impurities, and is a forged product in which the ratio of the tensile strength of a portion where the equivalent strain is maximum to the tensile strength of a portion where the equivalent strain is minimum is 0.84-1.
C22C 21/06 - Alliages à base d'aluminium avec le magnésium comme second constituant majeur
C22C 21/02 - Alliages à base d'aluminium avec le silicium comme second constituant majeur
C22F 1/00 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid
C22F 1/047 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid de l'aluminium ou de ses alliages d'alliages avec le magnésium comme second constituant majeur
C22F 1/05 - Modification de la structure physique des métaux ou alliages non ferreux par traitement thermique ou par travail à chaud ou à froid de l'aluminium ou de ses alliages d'alliages de type Al-Si-Mg, c.-à-d. contenant du silicium et du magnésium en proportions sensiblement égales
70.
ADHESIVE AND METHOD FOR MANUFACTURING CIRCUIT CONNECTION STRUCTURE
Provided is a thermosetting adhesive used when thermocompression bonding a pair of circuit members via a solder connection material in a method for manufacturing a circuit connection structure provided with the pair of circuit members, which are electrically connected by solder bonding, wherein the adhesive has a curing temperature Tc such that the difference (Tc − Tm) between the curing temperature Tc and the melting point Tm of the solder connection material is −20°C or higher, and the melt viscosity of the adhesive at the melting point Tm of the solder connection material is 5.0 × 105 Pa·s or lower.
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
C09J 11/06 - Additifs non macromoléculaires organiques
C09J 163/00 - Adhésifs à base de résines époxyAdhésifs à base de dérivés des résines époxy
C09J 201/00 - Adhésifs à base de composés macromoléculaires non spécifiés
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
Provided is a polishing liquid containing abrasive grains and an acid component, wherein the acid component contains a compound (excluding sulfuric acid and salts thereof) having at least one type of molecule selected from the group consisting of sulfo groups and sulfonic acid groups, and has a pH of more than 4.5. Also provided is a polishing method comprising a step for polishing a surface using the polishing liquid.
Disclosed is a method for producing a joined body obtained by joining a base material A, a solid joining agent containing an amorphous thermoplastic resin, which is at least one of a thermoplastic epoxy resin and a phenoxy resin, as a main component, and a base material B in this order, in which at least the base material A is a thermoplastic resin base material, an epoxy equivalent of the amorphous thermoplastic resin is 1,600 g/eq. or more or the amorphous thermoplastic resin does not contain an epoxy group, and a heat of fusion of the amorphous thermoplastic resin is 15 J/g or less, and the method has a step of superposing and a joining step (1), or has a joining step (2-1) and a joining step (2-2).
B29C 65/48 - Assemblage d'éléments préformésAppareils à cet effet en utilisant des adhésifs
B29C 65/14 - Assemblage d'éléments préformésAppareils à cet effet par chauffage, avec ou sans pressage par énergie ondulatoire ou rayonnement corpusculaire
B32B 15/092 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique comprenant des résines époxy
B32B 27/06 - Produits stratifiés composés essentiellement de résine synthétique comme seul composant ou composant principal d'une couche adjacente à une autre couche d'une substance spécifique
B32B 27/28 - Produits stratifiés composés essentiellement de résine synthétique comprenant des copolymères de résines synthétiques non complètement couverts par les sous-groupes suivants
B32B 27/38 - Produits stratifiés composés essentiellement de résine synthétique comprenant des résines époxy
73.
POLISHING LIQUID FOR CMP, POLISHING LIQUID SET FOR CMP, AND POLISHING METHOD
A polishing liquid for CMP contains abrasive grains, a nitrogen-containing compound, and water. The abrasive grains include cerium-based particles. The nitrogen-containing compound includes: a compound A1 having a condensed ring (a condensed ring having an aromatic five-membered ring with one nitrogen atom); a compound A2 having a quinoline ring and one hydroxy group bonded to the quinoline ring; a compound A3 having an aromatic ring and a hydroxy group bonded to a nitrogen atom; or a compound A4 having a nitrogen-containing aromatic ring to which at least one selected from the group consisting of a hydroxy group and an amino group is bonded.
This radio wave transmission member includes an outer member, an inner member, and a metal layer that can transmit radio waves and that is disposed between the outer member and the inner member. At least one of the outer member and the inner member has a light diffusion function.
This image processing device comprises: an image acquisition unit that acquires a target image in which a plurality of fibers are captured; a first region-division unit that uses a region division model for each individual to generate a first region-division result indicating a region in which the fibers included in the target image are each detected; a second region-division unit that generates a second region-division result indicating a region in which the fibers included in the target image are imaged; a thinning unit that generates a first thinning result and a second thinning result obtained by thinning the first region-division result and the second region-division result, respectively; and a result output unit that outputs an analysis result indicating the axes of the fibers included in the target image on the basis of the first thinning result and the second thinning result.
A slurry containing abrasive grains and a liquid medium, in which the abrasive grains include first particles and second particles in contact with the first particles, the second particles contain at least one metal compound selected from the group consisting of a metal oxide and a metal hydroxide, the metal compound contains a metal capable of taking a plurality of valences, and a ratio of the lowest valence among the plurality of valences of the metal is 0.10 or more in X-ray photoelectron spectroscopy.
In this method for manufacturing a semiconductor device, a semiconductor member 10 that has, on a semiconductor wafer 11, minute copper pillars 12 and solder bumps 13, which are microbumps, is prepared. Subsequently, an underfill material is applied and spread on the semiconductor member 10 so as to cover the copper pillars 12 and the solder bumps 13, and is then cured. Consequently, an insulating resin layer 20 that is thicker than the height of connection parts 14 composed of the copper pillars 12 and the solder bumps 13 is formed. After that, the thick insulating resin layer 20 is ground by a CMP device, and the surfaces 13a of the solder bumps 13A are exposed from the insulating resin layer. According to this method, the uniformity of the heights of the bumps 13 and the smoothness of the surfaces of the bumps 13 can be improved. Since the smoothness of the surfaces is improved, voids are less likely to be generated. In addition, since the insulating resin layer 20 covers each bump 13, a bridge is less likely to be generated. This method may be applied to CoW and WoW.
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
80.
FILM-SHAPED ADHESIVE, ADHESIVE FILM, CONNECTED STRUCTURE, AND METHOD FOR PRODUCING CONNECTED STRUCTURE
Provided is a method for producing a connected structure, the method including: a step in which an adhesive film is laminated on a first electrode-formed surface of a first circuit member having a first electrode formed thereon; and a step in which a second circuit member having a second electrode, is placed over the first circuit member to which the adhesive film has been laminated, so that the first electrode and the second electrode face each other, and the resultant stack is bonded together by hot pressing to electrically connect the first electrode and the second electrode to each other. The adhesive film includes a film-shaped adhesive comprising a thermoplastic resin and a radical-polymerizable compound. When the film-shaped adhesive is heated at 170°C for 5 seconds and then examined by a dynamic viscoelasticity measurement, the waveform of a loss tangent (tanδ) has a plurality of maximal values.
C09J 175/06 - Polyuréthanes à partir de polyesters
C09J 175/14 - Polyuréthanes comportant des liaisons non saturées carbone-carbone
H01R 11/01 - Éléments de connexion individuels assurant plusieurs emplacements de connexion espacés pour des organes conducteurs qui sont ou qui peuvent être interconnectés de cette façon, p. ex. pièces d'extrémité pour fils ou câbles supportées par le fil ou par le câble et possédant des moyens pour faciliter la connexion électrique avec quelqu'autre fil, borne, ou organe conducteur, répartiteurs caractérisés par la forme ou par la disposition de l'interconnexion entre leurs emplacements de connexion
H05K 1/14 - Association structurale de plusieurs circuits imprimés
H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
H05K 3/36 - Assemblage de circuits imprimés avec d'autres circuits imprimés
81.
SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES
A method for producing solder particles, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; and a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses. With respect to this method for producing solder particles, the average particle diameter of the solder particles is from 1 μm to 30 μm; and the C.V. value of the solder particles is 20% or less.
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/32 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à plus de 1550°C
82.
RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR PRODUCING RESIN COMPOSITION
A resin composition containing a curable resin and carbon particles, the carbon particles satisfy at least one of (1) and (2) below. (1) The pH is 5.0 or less, and (2) the average particle size is 80 nm or more.
This method for manufacturing a semiconductor device includes preparing a semiconductor member 10 having solder bumps 13 and minute copper pillars 12 which are micro-bumps on a semiconductor wafer 11. A non-conductive film (NCF) 20 is laminated on the semiconductor member 10 so as to cover the copper pillars 12 and the solder bumps 13. In this lamination, the NCF 20 is configured to be thicker than the heights of connection parts 14 formed of the copper pillars 12 and the solder bumps 13. Thereafter, the thick NCF 20 is ground by CMP to make surfaces 13a of the solder bumps 13 flush with a surface 20c of the NCF 20A. With this method, even when the NCF is applied to the micro-bumps, the thickness variation of the NCF and the remnant of a void can be suppressed. Furthermore, deformation of the micro-bumps during lamination can be suppressed.
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
84.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND INSULATING RESIN MATERIAL
This method for manufacturing a semiconductor device includes preparing a semiconductor member 10 having solder bumps 13 and minute copper pillars 12 which are micro-bumps on a semiconductor wafer 11. Then, an underfill material is applied and spread on the semiconductor member 10 so as to cover the copper pillars 12 and the solder bumps 13, and is cured. Thus, an insulating resin layer 20 thicker than the heights of connection parts 14 formed of the copper pillars 12 and the solder bumps 13 is formed. Thereafter, the thick insulating resin layer 20 is ground by a CMP device, and surfaces 13a of the solder bumps 13A are exposed from the insulating resin layer. With this method, the uniformity of the heights of the bumps 13 and the smoothness of the surfaces of the bumps 13 can be improved. Further, by improving the smoothness of the surfaces, a void is hardly generated. Furthermore, since the insulating resin layer 20 covers each of the bumps 13, a bridge is hardly generated.
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
85.
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND SEALING MATERIAL
Disclosed is a method for suppressing the occurrence of cracks in a thinning process of a silicon wafer. In this method, first, a sealing material 50 is molded by compression molding to the extent that upper end parts 40a of bumps 40 are exposed on a surface 20a side of a silicon wafer 20 on which the bumps 40 are provided. It is preferable that a granule sealing material, for example, is used as the sealing material 50. After the sealing material is molded, the rear surface (surface on the reverse side from the bumps 40) of the silicon wafer 20 is ground by grinding or the like to thin the silicon wafer so that the thickness thereof becomes 30 µm or less. Since the silicon wafer is reinforced using the sealing material before the thinning process, as described above, the occurrence of cracks can be suppressed during the manufacturing of a semiconductor device.
Disclosed is a method for manufacturing a semiconductor package 100. In this method, for example, surface treatment is performed by irradiating, with an oxygen plasma (plasma P), the surface of an insulating resin layer 20 on a printed wiring board which is a substrate 10. The insulating resin layer 20 is formed of, for example, a solder resist including an inorganic filler. The inorganic filler 22, which is deposited on the surface of the solder resist by the irradiation with the plasma P, is removed by ultrasonic cleaning. Thereafter, a plating layer 30 is formed by electroless plating on the solder resist from which the inorganic filler 22 has been removed. With this method, since the inorganic filler that affects electroless plating has been removed, an electroless plating can be reliably deposited on the surface of the solder resist.
A setting unit (32) sets an adhesion state of the interface between materials in a simulation model (40) representing a semiconductor package including a plurality of materials, and a simulation unit (34) uses the simulation model (40) in which the adhesion state of the interface between materials has been set to simulate whether delamination occurs between the materials when force or heat is applied to the semiconductor package.
G06F 30/20 - Optimisation, vérification ou simulation de l’objet conçu
H01L 21/00 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de dispositifs à semi-conducteurs ou de dispositifs à l'état solide, ou bien de leurs parties constitutives
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
The present invention provides a method for manufacturing a motor core of a radial gap motor whereby a motor core of a radial gap motor having an annular back yoke and a plurality of teeth extending from the back yoke is manufactured, the method comprising: a preparing step of preparing a plurality of split cores having arc-shaped back yoke sections and teeth extending from the back yoke sections; an inserting step of inserting the back yoke sections of the plurality of split cores into a back yoke mold that forms the outer and inner circumferential surfaces of the back yoke; and a pressurizing step of pressurizing the back yoke sections of the plurality of split cores in the back yoke mold after the inserting step.
H02K 15/02 - Procédés ou appareils spécialement adaptés à la fabrication, l'assemblage, l'entretien ou la réparation des machines dynamo-électriques des corps statoriques ou rotoriques
C08J 5/24 - Imprégnation de matériaux avec des prépolymères pouvant être polymérisés en place, p. ex. fabrication des "prepregs"
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
C08L 79/00 - Compositions contenant des composés macromoléculaires obtenus par des réactions créant dans la chaîne principale de la macromolécule une liaison contenant uniquement de l'azote, avec ou sans oxygène ou carbone, non prévues dans les groupes
H01L 23/14 - Supports, p. ex. substrats isolants non amovibles caractérisés par le matériau ou par ses propriétés électriques
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
Provided is a method for purifying a bromine gas, the method being capable of selectively removing chlorine molecules from the bromine gas. The method for purifying a bromine gas comprises a purification step for bringing a chlorine-removing agent, which has a metal bromide supported on an adsorbent, into contact with the bromine gas to remove, from the bromine gas, chlorine molecules contained in the bromine gas.
B01D 53/04 - Séparation de gaz ou de vapeursRécupération de vapeurs de solvants volatils dans les gazÉpuration chimique ou biologique des gaz résiduaires, p. ex. gaz d'échappement des moteurs à combustion, fumées, vapeurs, gaz de combustion ou aérosols par adsorption, p. ex. chromatographie préparatoire en phase gazeuse avec adsorbants fixes
B01J 20/08 - Compositions absorbantes ou adsorbantes solides ou compositions facilitant la filtrationAbsorbants ou adsorbants pour la chromatographieProcédés pour leur préparation, régénération ou réactivation contenant une substance inorganique contenant des oxydes ou des hydroxydes des métaux non prévus dans le groupe contenant de l'oxyde ou de l'hydroxyde d'aluminiumCompositions absorbantes ou adsorbantes solides ou compositions facilitant la filtrationAbsorbants ou adsorbants pour la chromatographieProcédés pour leur préparation, régénération ou réactivation contenant une substance inorganique contenant des oxydes ou des hydroxydes des métaux non prévus dans le groupe contenant de la bauxite
B01J 20/28 - Compositions absorbantes ou adsorbantes solides ou compositions facilitant la filtrationAbsorbants ou adsorbants pour la chromatographieProcédés pour leur préparation, régénération ou réactivation caractérisées par leur forme ou leurs propriétés physiques
91.
LAMINATE, METAL-CLAD LAMINATED BOARD, PRINTED WIRING BOARD, ANTENNA DEVICE, ANTENNA MODULE, AND COMMUNICATION DEVICE
Provided is a laminate for which warpage is suppressed even when the insulating materials included in upper and lower layers of a support are different. Also provided are a metal-clad laminated board, a printed wiring board, an antenna device, an antenna module, and a communication device that are obtained using the laminate. The specifics of the laminate are as follows. A laminate according to the present invention has an insulating resin region A at one surface of a support region and an insulating resin region B at the other surface of the support region. Insulating resin region A and insulating resin region B include insulating resin regions that contain different components. The value obtained by multiplying the product of the linear thermal expansion coefficient and the storage elastic modulus (E') of insulating resin region B by α (thickness of insulating resin region B/thickness of insulating resin region A) is 1.1–2.0 times the product of the linear thermal expansion coefficient and the storage elastic modulus (E') of insulating resin region A.
Bell particles comprise a plurality of core particles and porous particles having a plurality of accommodation voids for accommodating the plurality of core particles. A bell particle compact comprises any of the bell particles described above, and a compact containing the bell particles. A method for producing bell particles comprises: a coating step for coating core particles with a water-soluble material; a granulation step for mixing and granulating a plurality of coated core particles, in which the core particles are coated with the water-soluble material, and a plurality of granulation particles; and a washing step for washing granulated products of the plurality of coated core particles and the plurality of granulation particles with a dissolving solution for dissolving the water-soluble material.
B01J 2/00 - Procédés ou dispositifs pour la granulation de substances, en généralTraitement de matériaux particulaires leur permettant de s'écouler librement, en général, p. ex. en les rendant hydrophobes
F16F 15/02 - Suppression des vibrations dans les systèmes non rotatifs, p. ex. dans des systèmes alternatifsSuppression des vibrations dans les systèmes rotatifs par l'utilisation d'organes ne se déplaçant pas avec le système rotatif
This design assistance device assists in designing molecules satisfying desired physical properties, the design assistance device comprising: an input reception unit that receives an input of information about desired physical properties; a search unit that uses a database, which stores information about molecules, to search for information about the molecules satisfying the desired physical properties; a candidate molecule generation unit that generates, from base molecules, information about a plurality of candidate molecules when there is no information about the molecules satisfying the desired physical properties in the database; a prediction unit that predicts information about the physical properties from the information about the candidate molecules; and a presentation unit that selects and presents, on the basis of the information about the predicted physical properties, candidate molecules satisfying the desired physical properties.
Provided is a semiconductor device production method wherein a semiconductor member 10 having a fine copper pillar 12 and a fine solder bump 13 which are a micro bump on a semiconductor wafer 11 is prepared. Then, a non conductive film (NCF) 20 is laminated on the semiconductor member 10 in such a manner as to cover the copper pillar 12 and the solder bump 13. In this lamination, the NCF 20 is configured to have a thickness that is greater than the height of a connection part 14 including the copper pillar 12 and the solder bump 13. Thereafter, the thick NCF 20 is ground by CMP so that a surface 13a of the solder bump 13 and a surface 20c of the NCF 20A are flush with each other. With this method, it is possible to suppress remaining voids and the variation in the thickness of an NCF even when the NCF is applied to a micro bump. It is also possible to suppress a change in the shape of a micro bump during lamination. This method may be applied to CoW and WoW.
H01L 21/304 - Traitement mécanique, p. ex. meulage, polissage, coupe
H01L 21/60 - Fixation des fils de connexion ou d'autres pièces conductrices, devant servir à conduire le courant vers le ou hors du dispositif pendant son fonctionnement
The present invention provides a thermosetting resin composition which is capable of achieving low dielectric constant, low thermal expansibility and high adhesiveness to a conductor. The present invention also provides a prepreg, a resin film, a laminate, a printed wiring board, and a semiconductor package, which are obtained using the thermosetting resin composition. Specifically, the thermosetting resin composition contains (A) a maleimide resin which contains an indane skeleton, (B) a multifunctional maleimide resin, and (C) a maleimide resin which does not contain an indane skeleton.
B32B 15/08 - Produits stratifiés composés essentiellement de métal comprenant un métal comme seul composant ou comme composant principal d'une couche adjacente à une autre couche d'une substance spécifique de résine synthétique
C08J 5/24 - Imprégnation de matériaux avec des prépolymères pouvant être polymérisés en place, p. ex. fabrication des "prepregs"
C08K 3/013 - Charges, pigments ou agents de renforcement
C08L 35/00 - Compositions contenant des homopolymères ou des copolymères de composés possédant un ou plusieurs radicaux aliphatiques non saturés, chacun ne contenant qu'une seule liaison double carbone-carbone l'un au moins étant terminé par un radical carboxyle et contenant au moins un autre radical carboxyle dans la molécule, ou leurs sels, anhydrides, esters, amides, imides ou nitrilesCompositions contenant des dérivés de tels polymères
H01L 23/29 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par le matériau
H01L 23/31 - Encapsulations, p. ex. couches d’encapsulation, revêtements caractérisées par leur disposition
H05K 1/03 - Emploi de matériaux pour réaliser le substrat
96.
PRODUCTION METHOD FOR CHLOROPRENE SEED POLYMER COMPOSITION AND PRODUCTION METHOD FOR RUBBER IMMERSION PRODUCT
One embodiment of the present invention relates to a production method for a chloroprene seed polymer composition. Said production method comprises a first polymerization step and a second polymerization step and is characterized in that: the first polymerization step is for performing emulsion radical polymerization of at least a chloroprene monomer to obtain a chloroprene polymer; and the second polymerization step is for performing emulsion seed polymerization of at least a specific monomer (B-1) or (B-2) with respect to the chloroprene polymer, in an amount of 3-20 parts by mass of with respect to 100 parts by mass of the total of the chloroprene polymer and the monomer (B-1) or (B-2).
C08F 279/02 - Composés macromoléculaires obtenus par polymérisation de monomères sur des polymères de monomères contenant plusieurs liaisons doubles carbone-carbone tels que définis dans le groupe sur des polymères de diènes conjugués
A slurry contains abrasive grains and water, wherein the abrasive grains include cerium oxide particles, the crystallite diameter of the cerium oxide particles is 17.0 nm or more, and the lattice strain of the cerium oxide particles is 0.10% or more.
An information presentation system 1 comprises: an acquisition unit that acquires information about a reference spectrum of a reference color-producing material that serves as a reference; a calculation unit that, on the basis of the reference spectrum, calculates a matching spectrum for causing a response in a subject that coincides with or approximates the response from the color vision system of a reference color vision person who has visually recognized the reference color-producing material; a storage unit that stores information about a plurality of raw material spectra corresponding respectively to a plurality of raw material color-producing materials to be mixed; a selection unit that uses information about the matching spectrum and the information about the plurality of raw material spectra to select, from among the plurality of raw material color-producing materials, a plurality of mixed materials that emit a spectrum that coincides with or approximates the matching spectrum when mixed; and a presentation unit that presents information identifying the plurality of mixed materials.
H04N 1/54 - Conversion des signaux d'image en couleurs en un ensemble de signaux dont quelques-uns représentent des couleurs composées particulières, p. ex. pour l'impression de textiles
G01J 3/46 - Mesure de couleurDispositifs de mesure de couleur, p. ex. colorimètres
100.
DATA MANAGEMENT PROGRAM, DATA MANAGEMENT SYSTEM, AND DATA MANAGEMENT METHOD
This data management program causes a computer to execute: a step for acquiring interest information for collecting one or more compounds; a step for accessing a prescribed information source and collecting compound information indicating one or more compounds corresponding to the interest information from the information source; a step for generating an interest ID which is an identifier for uniquely identifying the interest information; a step for generating, for each of the one or more compounds indicated by the collected compound information, a compound ID which is an identifier for uniquely identifying the compound; a step for generating a compound list by associating each of the one or more compound IDs with the interest ID; and a step for storing the compound list in a database.
