JX Metals Corporation

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IPC Class
C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof 17
C23C 14/34 - Sputtering 17
H05K 1/03 - Use of materials for the substrate 12
C22C 9/00 - Alloys based on copper 11
H01M 10/54 - Reclaiming serviceable parts of waste accumulators 11
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NICE Class
06 - Common metals and ores; objects made of metal 2
09 - Scientific and electric apparatus and instruments 2
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Registered / In Force 102
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1.

Rolled Copper Foil for Secondary Battery, and Secondary Battery Negative Electrode and Secondary Battery Using the Same

      
Application Number 18681628
Status Pending
Filing Date 2022-09-29
First Publication Date 2025-01-09
Owner JX Metals Corporation (Japan)
Inventor Okabe, Fumiya

Abstract

A rolled copper foil for a secondary battery that has heat resistance which maintains high strength even after heat treatment is provided. A rolled copper foil for a secondary battery includes 0.05 to 0.15% by weight of Zr, 0.05% by weight or less of oxygen, and the balance consisting of Cu and unavoidable impurities, wherein a tensile strength in a direction parallel to rolling after a heat treatment at 350° C. for 3 hours is 500 MPa or more, and a rate of change in the tensile strength in the direction parallel to rolling before and after the heat treatment is 15% or less.

IPC Classes  ?

  • H01M 4/66 - Selection of materials
  • H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries

2.

Fe-Pt-C-BASED SPUTTERING TARGET MEMBER, SPUTTERING TARGET ASSEMBLY, METHOD FOR FORMING FILM, AND METHOD FOR PRODUCING SPUTTERING TARGET MEMBER

      
Application Number 18703899
Status Pending
Filing Date 2022-09-22
First Publication Date 2024-12-19
Owner JX Metals Corporation (Japan)
Inventor
  • Kosho, Takashi
  • Horie, Yusuke

Abstract

A Fe—Pt—C based sputtering target member that can suppress the generation of particles during sputtering is provided. A Fe—Pt—C based sputtering target member has a magnetic phase comprising Fe and Pt and a non-magnetic phase including C, wherein in an X-ray diffraction profile obtained by analyzing the sputtering target member by an X-ray diffraction method, the sputtering target member has a carbon-derived diffraction peak at a diffraction angle that satisfies 25.6°≤2θ≤26.2°.

IPC Classes  ?

3.

IGZO SPUTTERING TARGET

      
Application Number 18685373
Status Pending
Filing Date 2022-09-01
First Publication Date 2024-10-17
Owner JX Metals Corporation (Japan)
Inventor
  • Murai, Kazutaka
  • Osada, Kozo

Abstract

An IGZO sputtering target with high relative density while suppressing increase in arcing and particle during sputtering is provided. An IGZO sputtering target includes indium (In), gallium (Ga), zinc (Zn), zirconium (Zr), and oxygen (O), the rest consisting of inevitable impurities, wherein the IGZO sputtering target includes Zr at less than 20 mass ppm and has a relative density is 95% or more.

IPC Classes  ?

4.

METAL-RESIN COMPOSITE ELECTROMAGNETIC SHIELDING MATERIAL

      
Application Number 18580775
Status Pending
Filing Date 2022-07-08
First Publication Date 2024-10-10
Owner JX Metals Corporation (Japan)
Inventor Yamamoto, Yukito

Abstract

A metal-resin composite electromagnetic shielding material, in which N (N is an integer of 1 or more) metal layers and M (M is an integer of 1 or more) resin layers are laminated with adhesive layers interposed therebetween, wherein among the adhesive layers, in the adhesive layer closest to an outer surface of the metal-resin composite electromagnetic shielding material, when observing the adhesive layer from the resin layer side, an air bubble ratio in the adhesive layer is 4.5% or less.

IPC Classes  ?

  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
  • B32B 15/09 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin comprising polyesters
  • B32B 15/20 - Layered products essentially comprising metal comprising aluminium or copper
  • B32B 27/36 - Layered products essentially comprising synthetic resin comprising polyesters

5.

METHOD FOR PROCESSING ELECTRICAL AND ELECTRONIC COMPONENT SCRAPS AND APPARATUS FOR PROCESSING ELECTRONIC COMPONENT SCRAPS

      
Application Number 18287685
Status Pending
Filing Date 2021-11-24
First Publication Date 2024-09-05
Owner JX Metals Corporation (Japan)
Inventor
  • Aoki, Katsushi
  • Kawano, Hiroshi

Abstract

Provided is a method for processing electrical and electronic component scraps and an apparatus for processing electrical and electronic component scraps that can more efficiently sort out desired component scraps from electrical and electronic component scraps using an image recognition processing technique and a sorting device. A method for processing electrical and electronic component scraps including a sorting condition determining step S10 of determining a sorting condition of electrical and electronic component scraps. This step includes an image recognition processing step S12 of recognizing component scraps belonging to a specific component type from a plurality of captured image of the electrical and electronic component scraps including a plurality of component scraps by image recognition processing and acquiring image recognition information including information on a score representing a certainty of recognized component scraps, a detected area, and a number; a classification step S13 of creating classification information classifying the number of recognized component scraps by using the image recognition information; and a condition determining step S14 of determining a score threshold of the image recognition process and a detected area threshold of the component scraps based on the classification information and a processing capacity information of a sorting device sorting the component scraps.

IPC Classes  ?

  • B07C 5/342 - Sorting according to other particular properties according to optical properties, e.g. colour
  • G06T 1/00 - General purpose image data processing
  • G06T 7/00 - Image analysis
  • G06T 7/62 - Analysis of geometric attributes of area, perimeter, diameter or volume
  • G06V 10/764 - Arrangements for image or video recognition or understanding using pattern recognition or machine learning using classification, e.g. of video objects
  • G06V 10/776 - Validation; Performance evaluation

6.

COPPER POWDER

      
Application Number 18560990
Status Pending
Filing Date 2022-02-18
First Publication Date 2024-08-01
Owner JX Metals Corporation (Japan)
Inventor
  • Tsuchihashi, Reina
  • Orikasa, Hironori

Abstract

A copper powder containing copper particles, wherein the copper powder has a packed bulk density of 1.30 g/cm3 to 2.96 g/cm3, and wherein a 50% particle diameter D50 when a cumulative frequency is 50% in a volume-based particle diameter histogram of the copper particles, and a crystallite diameter D determined from a diffraction peak of a Cu (111) plane in an X-ray diffraction profile obtained by powder X-ray diffractometry of the copper powder using Scherrer's formula satisfies D/D50≥0.060.

IPC Classes  ?

  • B22F 1/054 - Nanosized particles
  • B22F 9/04 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using physical processes starting from solid material, e.g. by crushing, grinding or milling
  • B22F 9/24 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions

7.

Copper Foil, Laminate, and Flexible Printed Wiring Board

      
Application Number 18239782
Status Pending
Filing Date 2023-08-30
First Publication Date 2024-06-27
Owner JX Metals Corporation (Japan)
Inventor
  • Ishino, Yuji
  • Ikeda, Takao

Abstract

A copper foil, wherein at least one surface of the copper foil has a developed interfacial area ratio (sdr) of 0.0030 or less.

IPC Classes  ?

8.

Copper Foil, Laminate, and Flexible Printed Wiring Board

      
Application Number 18239837
Status Pending
Filing Date 2023-08-30
First Publication Date 2024-06-27
Owner JX Metals Corporation (Japan)
Inventor
  • Ishino, Yuji
  • Ikeda, Takao
  • Kusunoki, Keisuke

Abstract

A copper foil, wherein at least one surface of the copper foil has a root mean square gradient (Sdq) of 0.120 or less.

IPC Classes  ?

  • H05K 1/02 - Printed circuits - Details
  • C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
  • H05K 1/09 - Use of materials for the metallic pattern

9.

SURFACE-TREATED COPPER FOIL, COPPER-CLADDED LAMINATE PLATE, AND PRINTED WIRING BOARD

      
Application Number JP2023035029
Publication Number 2024/116579
Status In Force
Filing Date 2023-09-26
Publication Date 2024-06-06
Owner JX METALS CORPORATION (Japan)
Inventor Iwasawa,shohei

Abstract

Provided is a surface-treated copper foil that has a copper foil and a heteroaromatic compound layer formed on at least one surface of the copper foil. The heteroaromatic compound layer contains a heteroaromatic compound having a heterocycle containing a nitrogen atom as a heteroatom, and has an Sdr of 0.1-15.0%.

IPC Classes  ?

  • C23C 26/00 - Coating not provided for in groups
  • H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal

10.

SURFACE-TREATED COPPER FOIL, COPPER-CLADDED LAMINATE PLATE, AND PRINTED WIRING BOARD

      
Application Number JP2023035030
Publication Number 2024/116580
Status In Force
Filing Date 2023-09-26
Publication Date 2024-06-06
Owner JX METALS CORPORATION (Japan)
Inventor Iwasawa,shohei

Abstract

Provided is a surface-treated copper foil that has a copper foil and a heteroaromatic compound layer formed on at least one surface of the copper foil. The heteroaromatic compound layer contains a heteroaromatic compound having a heterocyclic ring containing a nitrogen atom as a hetero atom and having Sp of 0.10-1.00 μm.

IPC Classes  ?

  • C23C 26/00 - Coating not provided for in groups
  • H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal

11.

SURFACE-TREATED COPPER FOIL, COPPER-CLADDED LAMINATE PLATE, AND PRINTED WIRING BOARD

      
Application Number JP2023035031
Publication Number 2024/116581
Status In Force
Filing Date 2023-09-26
Publication Date 2024-06-06
Owner JX METALS CORPORATION (Japan)
Inventor Iwasawa,shohei

Abstract

Provided is a surface-treated copper foil that has a copper foil and a heteroaromatic compound layer formed on at least one surface of the copper foil. The heteroaromatic compound layer contains a heteroaromatic compound having a heterocycle containing a nitrogen atom as a heteroatom, and has an Ssk of -2.00 to -0.10.

IPC Classes  ?

  • C23C 26/00 - Coating not provided for in groups
  • H05K 3/38 - Improvement of the adhesion between the insulating substrate and the metal

12.

COPPER POWDER

      
Application Number JP2023029540
Publication Number 2024/116481
Status In Force
Filing Date 2023-08-15
Publication Date 2024-06-06
Owner JX METALS CORPORATION (Japan)
Inventor
  • Moriwaki,kazuhiro
  • Maenishihara,osamu
  • Funabashi,taichi

Abstract

This copper powder has a BET specific surface area of 1.0 m2/g to 10.0 m2/g and includes an organic matter having a molecular weight of 500 or less and a polyether and/or a polyol.

IPC Classes  ?

  • B22F 1/102 - Metallic powder coated with organic material
  • B22F 1/00 - Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 1/05 - Metallic powder characterised by the size or surface area of the particles
  • B22F 9/00 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor
  • B22F 9/24 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions

13.

POSITIVE ELECTRODE ACTIVE MATERIAL FOR ALL-SOLID LITHIUM ION BATTERIES, POSITIVE ELECTRODE FOR ALL-SOLID LITHIUM ION BATTERIES, ALL-SOLID LITHIUM ION BATTERY, AND METHOD FOR PRODUCING POSITIVE ELECTRODE ACTIVE MATERIAL FOR ALL-SOLID LITHIUM ION BATTERIES

      
Application Number 18283092
Status Pending
Filing Date 2021-10-11
First Publication Date 2024-05-30
Owner JX Metals Corporation (Japan)
Inventor Tamura, Tomoya

Abstract

A positive electrode active material for all-solid lithium ion batteries including a core positive electrode active material particle and a coating layer, the core positive electrode active material particle being represented by a composition shown in the following formula (1): A positive electrode active material for all-solid lithium ion batteries including a core positive electrode active material particle and a coating layer, the core positive electrode active material particle being represented by a composition shown in the following formula (1): LiaNibCocMndOe  (1) in which formula (1), 1.0≤a≤1.05, 0.8≤b≤0.9, 1.8≤e≤2.2, b+c+d=1; wherein the coating layer is an oxide of Li and Nb, and a specific surface area X (m2/g) of the positive electrode active material and a Nb content Y (mass %) in the positive electrode active material satisfy a relationship of the following formula (2): A positive electrode active material for all-solid lithium ion batteries including a core positive electrode active material particle and a coating layer, the core positive electrode active material particle being represented by a composition shown in the following formula (1): LiaNibCocMndOe  (1) in which formula (1), 1.0≤a≤1.05, 0.8≤b≤0.9, 1.8≤e≤2.2, b+c+d=1; wherein the coating layer is an oxide of Li and Nb, and a specific surface area X (m2/g) of the positive electrode active material and a Nb content Y (mass %) in the positive electrode active material satisfy a relationship of the following formula (2): 0.65≤Y/X≤1.20  (2).

IPC Classes  ?

  • H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
  • H01M 4/02 - Electrodes composed of, or comprising, active material
  • H01M 4/04 - Processes of manufacture in general
  • H01M 4/36 - Selection of substances as active materials, active masses, active liquids
  • H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
  • H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries

14.

SULFIDE-BASED SOLID ELECTROLYTE AND ALL-SOLID-STATE LITHIUM ION BATTERY

      
Application Number JP2023019551
Publication Number 2024/105906
Status In Force
Filing Date 2023-05-25
Publication Date 2024-05-23
Owner JX METALS CORPORATION (Japan)
Inventor Yamamoto,shoichi

Abstract

41-xx4-xxxI (in the formula, Ha is one or two of Cl, Br, and I, and 0.05

IPC Classes  ?

  • H01B 1/06 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
  • H01B 1/10 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances sulfides
  • H01M 10/052 - Li-accumulators
  • H01M 10/0562 - Solid materials

15.

METHOD FOR RECOVERING METALS

      
Application Number JP2023040447
Publication Number 2024/106310
Status In Force
Filing Date 2023-11-09
Publication Date 2024-05-23
Owner JX METALS CORPORATION (Japan)
Inventor
  • Fujimoto,atsushi
  • Kawai,hidemasa
  • Ariyoshi,hirotaka

Abstract

A method for recovering metals from a metal-containing solution containing nickel ions, lithium ions, and anions of an inorganic acid, the method including: a nickel extraction step including extraction that mixes the metal-containing solution with a solvent while adjusting an equilibrium pH using a pH adjusting agent containing lithium ions, transfers the nickel ions in the metal-containing solution to the solvent, and separates the solvent containing the nickel ions from an extracted solution, wherein in the nickel extraction step, the extraction is carried out under conditions where the total of a lithium ion concentration of the metal-containing solution and a lithium ion concentration of the pH adjusting agent is less than or equal to a lithium ion concentration of a saturated solution of a lithium salt made of the anions of the inorganic acid and the lithium ions contained in the metal-containing solution.

IPC Classes  ?

  • C22B 3/30 - Oximes
  • C22B 3/32 - Carboxylic acids
  • C22B 3/38 - Treatment or purification of solutions, e.g. obtained by leaching by liquid-liquid extraction using organic compounds containing phosphorus
  • C22B 3/40 - Mixtures
  • C22B 3/44 - Treatment or purification of solutions, e.g. obtained by leaching by chemical processes
  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • C22B 3/00 - Extraction of metal compounds from ores or concentrates by wet processes
  • C22B 26/12 - Obtaining lithium
  • C22B 47/00 - Obtaining manganese

16.

ELECTROMAGNETIC WAVE-SHIELDING MATERIAL, COVERING MATERIAL OR EXTERIOR MATERIAL, AND ELECTRIC/ELECTRONIC DEVICE

      
Application Number JP2023038081
Publication Number 2024/101119
Status In Force
Filing Date 2023-10-20
Publication Date 2024-05-16
Owner JX METALS CORPORATION (Japan)
Inventor
  • Ori,yuki
  • Yokoyama,kohei
  • Yamamoto,yukito
  • Ikegawa,jin

Abstract

Provided is an electromagnetic wave-shielding material which exhibits excellent shape retention. An electromagnetic wave-shielding material which contains a laminate which has a non-magnetic resin layer and a non-magnetic metal layer and/or ferromagnetic layer, wherein the value of the anisotropy during fracture (Rc) which is represented by formula (1) is less than or equal to 0 or is greater than or equal to 1.

IPC Classes  ?

  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
  • B32B 7/025 - Electric or magnetic properties
  • C23C 28/00 - Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of main groups , or by combinations of methods provided for in subclasses and
  • H01Q 17/00 - Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems

17.

LAMINATE AND METHOD FOR MANUFACTURING THE SAME

      
Application Number 18284238
Status Pending
Filing Date 2022-03-03
First Publication Date 2024-05-09
Owner JX METALS CORPORATION (Japan)
Inventor
  • Yamamoto, Yukito
  • Satoh, Kazuyuki
  • Sawa, Konosuke
  • Bito, Mitsuo

Abstract

There is provided a laminate that improves the electromagnetic wave shielding effect in a low frequency region. A laminate includes at least one non-magnetic metal layer and at least one magnetic metal layer, wherein the at least one magnetic metal layer contains an amorphous phase.

IPC Classes  ?

  • H01F 1/153 - Amorphous metallic alloys, e.g. glassy metals
  • B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
  • C22C 38/00 - Ferrous alloys, e.g. steel alloys
  • C22C 38/02 - Ferrous alloys, e.g. steel alloys containing silicon
  • C22C 38/16 - Ferrous alloys, e.g. steel alloys containing copper
  • C22C 45/00 - Amorphous alloys

18.

METAL RESIN COMPOSITE ELECTROMAGNETIC SHIELDING MATERIAL

      
Application Number JP2023033800
Publication Number 2024/090069
Status In Force
Filing Date 2023-09-15
Publication Date 2024-05-02
Owner JX METALS CORPORATION (Japan)
Inventor Yamamoto,yukito

Abstract

The present invention provides a metal resin composite electromagnetic shielding material which has high formability. This metal resin composite electromagnetic shielding material is obtained by stacking N metal layers (N is an integer of 1 or more) and M resin layers (M is an integer of 1 or more), and is characterized in that the Value of Forming Limit (VFL) thereof satisfies VFL > 0.24.

IPC Classes  ?

  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
  • B32B 15/08 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
  • H01Q 1/52 - Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

19.

METHOD FOR PRODUCING TANTALUM NITRIDE MATERIAL, AND TANTALUM NITRIDE MATERIAL

      
Application Number JP2023027418
Publication Number 2024/070179
Status In Force
Filing Date 2023-07-26
Publication Date 2024-04-04
Owner
  • JX METALS CORPORATION (Japan)
  • SHINSHU UNIVERSITY (Japan)
Inventor
  • Takahashi, Masato
  • Domen, Kazunari
  • Hisatomi, Takashi

Abstract

A method for producing a tantalum nitride material that includes a nitriding step that heats a precursor containing a lithium tantalum composite oxide in the presence of a nitrogen compound.

IPC Classes  ?

20.

SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE PLATE, AND PRINTED WIRING BOARD

      
Application Number JP2023028811
Publication Number 2024/070245
Status In Force
Filing Date 2023-08-07
Publication Date 2024-04-04
Owner JX METALS CORPORATION (Japan)
Inventor
  • Kusunoki,keisuke
  • Iwasaki,yuichi
  • Komura,toshiyuki

Abstract

Provided is a surface-treated copper foil having a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The surface-treatment layer has a peak material volume Vmp of 0.010-0.080 µm3/µm2and has a Zn deposition amount of 10-250 µg/dm2.

IPC Classes  ?

  • C25D 7/06 - Wires; Strips; Foils
  • C25D 3/38 - Electroplating; Baths therefor from solutions of copper
  • C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
  • C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
  • C25D 5/16 - Electroplating with layers of varying thickness
  • H05K 1/03 - Use of materials for the substrate

21.

SURFACE-TREATED COPPER FOIL, COPPER-CLADDED LAMINATE PLATE, AND PRINTED WIRING BOARD

      
Application Number JP2023028812
Publication Number 2024/070246
Status In Force
Filing Date 2023-08-07
Publication Date 2024-04-04
Owner JX METALS CORPORATION (Japan)
Inventor
  • Komura,toshiyuki
  • Miki,atsushi
  • Kusunoki,keisuke

Abstract

Provided is a surface-treated copper foil including a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The average depth Svk in valley parts in the surface-treated layer is 0.35 to 0.63 μm.

IPC Classes  ?

  • C25D 7/06 - Wires; Strips; Foils
  • C25D 3/38 - Electroplating; Baths therefor from solutions of copper
  • C25D 5/16 - Electroplating with layers of varying thickness
  • H05K 1/03 - Use of materials for the substrate

22.

METHOD FOR REMOVING METAL AND METHOD FOR RECOVERING METAL

      
Application Number JP2023035036
Publication Number 2024/071147
Status In Force
Filing Date 2023-09-26
Publication Date 2024-04-04
Owner JX METALS CORPORATION (Japan)
Inventor
  • Haga,yasufumi
  • Shikada,kei
  • Tokita,yujiro
  • Miyanaga,hiroshi

Abstract

Provided are a method for removing at least one metal that can effectively remove metals from lithium ion battery waste, and a method for recovering metals. A method for removing at least one metal from lithium ion battery waste, wherein the lithium ion battery waste has a cathode material with cathode-derived metals adhering onto a cathode current collector containing aluminum, the aluminum being a metal to be removed, wherein the method includes, in any order: a crushing step of crushing the lithium ion battery waste and separating at least a part of the cathode-derived metals from the cathode current collector; and an alkali separation step of separating at least a part of the cathode-derived metals from the cathode current collector by bring the lithium ion battery waste into contact with an alkaline solution to dissolve the aluminum, wherein the method further includes, after the crushing step, a sieving step of sieving the lithium ion battery waste into a material on sieve and a material under sieve containing the cathode-derived metals separated from the cathode current collector in the crushing step, and wherein, when the sieving step is performed before the alkali separation step, at least a part of the material on sieve obtained in the sieving step is subjected to the alkali separation step.

IPC Classes  ?

  • C22B 1/00 - Preliminary treatment of ores or scrap
  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • C22B 21/00 - Obtaining aluminium
  • C22B 23/02 - Obtaining nickel or cobalt by dry processes
  • H01M 10/54 - Reclaiming serviceable parts of waste accumulators

23.

SURFACE-TREATED COPPER FOIL, COPPER-CLADDED LAMINATE PLATE, AND PRINTED WIRING BOARD

      
Application Number JP2023028813
Publication Number 2024/070247
Status In Force
Filing Date 2023-08-07
Publication Date 2024-04-04
Owner JX METALS CORPORATION (Japan)
Inventor
  • Komura,toshiyuki
  • Miki,atsushi
  • Kusunoki,keisuke

Abstract

Provided is a surface-treated copper foil that has a copper foil and a surface-treated layer which has been formed on at least one surface of the copper foil. The peak material volume Vmp of the surface-treated layer is 0.022-0.060 μm3/μm2.

IPC Classes  ?

  • C25D 7/06 - Wires; Strips; Foils
  • C25D 5/12 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
  • C25D 5/16 - Electroplating with layers of varying thickness
  • H05K 1/03 - Use of materials for the substrate

24.

SURFACE-TREATED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD

      
Application Number JP2023028814
Publication Number 2024/070248
Status In Force
Filing Date 2023-08-07
Publication Date 2024-04-04
Owner JX METALS CORPORATION (Japan)
Inventor
  • Komura,toshiyuki
  • Miki,atsushi
  • Kusunoki,keisuke

Abstract

Provided is a surface-treated copper foil comprising a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The actual volume Vmc of a core portion of the surface-treated layer is 0.35 to 0.55 μm3/μm2.

IPC Classes  ?

  • C25D 7/06 - Wires; Strips; Foils
  • C25D 3/38 - Electroplating; Baths therefor from solutions of copper
  • C25D 5/14 - Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
  • C25D 5/16 - Electroplating with layers of varying thickness
  • H05K 1/03 - Use of materials for the substrate

25.

METAL RECOVERY METHOD

      
Application Number JP2023014766
Publication Number 2024/053147
Status In Force
Filing Date 2023-04-11
Publication Date 2024-03-14
Owner JX METALS CORPORATION (Japan)
Inventor Arakawa,junichi

Abstract

A method for recovering a metal from a battery powder of waste lithium ion batteries, wherein a metal-containing solution that is obtained by leaching the battery powder contains lithium ions, magnesium ions, and at least one kind of metal ions selected from among nickel ions and cobalt ions. This method comprises: a metal extraction step in which a solvent containing a carboxylic acid-based extractant is used in such a manner that the equilibrium pH during the extraction is 6.3 to 7.2, and the metal ions are extracted from the metal-containing solution into the solvent, thereby obtaining a post-metal extraction liquid that contains lithium ions and magnesium ions; and a magnesium extraction step in which a solvent containing a phosphonic acid ester-based extractant is used in such a manner that the equilibrium pH during the extraction is 4.5 to 6.0, and magnesium ions are extracted from the post-metal extraction liquid into the solvent, thereby obtaining a lithium-containing solution that contains lithium ions.

IPC Classes  ?

  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • C22B 3/06 - Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic acid solutions
  • C22B 3/32 - Carboxylic acids
  • C22B 3/38 - Treatment or purification of solutions, e.g. obtained by leaching by liquid-liquid extraction using organic compounds containing phosphorus
  • C22B 3/44 - Treatment or purification of solutions, e.g. obtained by leaching by chemical processes
  • C22B 23/00 - Obtaining nickel or cobalt
  • C22B 26/12 - Obtaining lithium
  • C22B 26/22 - Obtaining magnesium

26.

SPUTTERING TARGET, METHOD FOR PRODUCING MULTILAYER FILM, MULTILAYER FILM AND MAGNETIC RECORDING MEDIUM

      
Application Number JP2023019793
Publication Number 2024/053176
Status In Force
Filing Date 2023-05-26
Publication Date 2024-03-14
Owner JX METALS CORPORATION (Japan)
Inventor
  • Shimizu,masayoshi
  • Masuda,manami
  • Iwabuchi,yasuyuki
  • Honda,kazuya

Abstract

22 as a metal oxide component. Alternatively, this sputtering target contains Co and Pt as metal components, while having a phase that contains all of Co, Nb and O.

IPC Classes  ?

  • C23C 14/34 - Sputtering
  • B22F 1/00 - Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
  • C22C 1/05 - Mixtures of metal powder with non-metallic powder
  • C22C 1/10 - Alloys containing non-metals
  • C22C 5/04 - Alloys based on a platinum group metal
  • C22C 19/07 - Alloys based on nickel or cobalt based on cobalt
  • C22C 32/00 - Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
  • C23C 14/06 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
  • G11B 5/706 - Record carriers characterised by the selection of the material comprising one or more layers of magnetisable particles homogeneously mixed with a bonding agent on a base layer characterised by the composition of the magnetic material
  • G11B 5/851 - Coating a support with a magnetic layer by sputtering
  • H01F 10/16 - Thin magnetic films, e.g. of one-domain structure characterised by magnetic layers characterised by the composition being metals or alloys containing cobalt
  • H01F 41/18 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by cathode sputtering

27.

ALL-SOLID LITHIUM-ION BATTERY

      
Application Number JP2023007387
Publication Number 2024/047911
Status In Force
Filing Date 2023-02-28
Publication Date 2024-03-07
Owner JX METALS CORPORATION (Japan)
Inventor Yamamoto,shoichi

Abstract

αxy4abcd22) (in composition formula 2, 1.00≤a≤1.08, 0.60≤b≤0.90, and b+c+d=1.0); and a negative electrode layer.

IPC Classes  ?

  • H01M 10/0562 - Solid materials
  • H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
  • H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
  • H01M 10/052 - Li-accumulators

28.

METHOD FOR EVALUATING ALL-SOLID-STATE LITHIUM ION BATTERIES

      
Application Number JP2023007391
Publication Number 2024/047912
Status In Force
Filing Date 2023-02-28
Publication Date 2024-03-07
Owner JX METALS CORPORATION (Japan)
Inventor Yamamoto,shoichi

Abstract

Provided is a method for efficiently evaluating the battery characteristics of an oxide-based all-solid-state battery. Provided is a method for evaluating all-solid-state lithium ion batteries that contain a negative electrode layer, a positive electrode layer containing a positive electrode active material, and a solid electrolyte layer containing an oxide-based solid electrolyte. This method for evaluating all-solid-state lithium ion batteries carries out the evaluation of the battery characteristics of an all-solid-state lithium ion battery by comparing the X-ray diffraction pattern of a powder compact obtained by pressing a mixture of the oxide-based solid electrolyte and the positive electrode active material, with the X-ray diffraction pattern of the fired body obtained by firing the powder compact.

IPC Classes  ?

  • H01M 10/058 - Construction or manufacture
  • H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
  • H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
  • H01M 10/052 - Li-accumulators
  • H01M 10/0562 - Solid materials

29.

ELECTROMAGNETIC WAVE SHIELDING MATERIAL, COVERING MATERIAL OR EXTERIOR MATERIAL, AND ELECTRIC/ELECTRONIC APPARATUS

      
Application Number JP2023019389
Publication Number 2024/018752
Status In Force
Filing Date 2023-05-24
Publication Date 2024-01-25
Owner JX METALS CORPORATION (Japan)
Inventor Ori,yuki

Abstract

Provided is an electromagnetic wave shielding material in which cracking and the like during use as an electromagnetic wave shielding member (particularly when bending) can be satisfactorily inhibited. The electromagnetic wave shielding material has a laminated body in which at least one non-magnetic electrically conductive metal layer and at least one ferromagnetic layer are laminated, at least one outermost layer of the laminated body being the non-magnetic electrically conductive metal layer. When the laminated body is bent by a curvature radius of 0.1 mm with the outermost non-magnetic electrically conductive layer on the outside, the bending neutral axis is positioned within the thickness of the outermost non-magnetic electrically conductive metal layer.

IPC Classes  ?

  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
  • B32B 15/04 - Layered products essentially comprising metal comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
  • H01F 1/14 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys

30.

COPPER FOIL FOR FLEXIBLE PRINTED SUBSTRATE, AND COPPER-CLAD LAMINATE, FLEXIBLE PRINTED SUBSTRATE AND ELECTRONIC DEVICE USING SAME

      
Application Number JP2023010013
Publication Number 2024/014057
Status In Force
Filing Date 2023-03-15
Publication Date 2024-01-18
Owner JX METALS CORPORATION (Japan)
Inventor
  • Bando Shinsuke
  • Ishino Yuji

Abstract

PROBLEM TO BE SOLVED: To provide a copper foil for a flexible printed substrate, having good linear circuit properties and suitable for a minute circuit, and a copper-clad laminate, a flexible printed substrate and an electronic device using same. SOLUTION: A copper foil for a flexible printed substrate, which is a rolled copper foil comprising at least 99.96 mass% Cu, with the remainder being unavoidable impurities, wherein when 300°C heat treatment is carried out for 30 minutes and a measurement field of view of 150µm x 150µm of the rolling surface of the rolled copper foil is subjected to EBSD measurement, the average crystal diameter, when a misorientation of 5° or more is considered a crystal boundary, is not more than 5.0µm.

IPC Classes  ?

  • C22C 9/00 - Alloys based on copper
  • C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
  • C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
  • H05K 1/03 - Use of materials for the substrate

31.

ROLLED COPPER FOIL, COPPER-CLAD LAMINATE MANUFACTURING METHOD, FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURING METHOD, AND ELECTRONIC COMPONENT MANUFACTURING METHOD

      
Application Number JP2023020557
Publication Number 2024/014168
Status In Force
Filing Date 2023-06-01
Publication Date 2024-01-18
Owner JX METALS CORPORATION (Japan)
Inventor
  • Ota,akimitsu
  • Cho,shunsuke
  • Nakagawa,kotaro

Abstract

Provided is a rolled copper foil that, when being formed into an FPC, has higher flexibility than conventional products. This rolled copper foil contains 99.9 mass% or more of Cu, and the remaining portion being unavoidable impurities, and exhibits an orientation distribution density of 21.50 or more for S orientations {123}<634> in the surface.

IPC Classes  ?

  • C22C 9/00 - Alloys based on copper
  • C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
  • C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
  • H05K 1/02 - Printed circuits - Details
  • H05K 1/03 - Use of materials for the substrate
  • H05K 1/09 - Use of materials for the metallic pattern

32.

COPPER FOIL, AND COPPER-CLAD LAMINATE AND FLEXIBLE PRINTED WIRING BOARD EACH USING SAME

      
Application Number JP2023020558
Publication Number 2024/014169
Status In Force
Filing Date 2023-06-01
Publication Date 2024-01-18
Owner JX METALS CORPORATION (Japan)
Inventor Kang,gunwoo

Abstract

The present invention provides: a copper foil which has high resistance to folding by sliding or bending; and a copper-clad laminate and a flexible printed wiring board, each of which uses this copper foil. The present invention provides: a copper foil which has an area ratio of the Cube orientation (001)<100> of 92% or more; and a copper-clad laminate and a flexible printed wiring board, each of which uses this copper foil.

IPC Classes  ?

  • C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
  • C22C 9/00 - Alloys based on copper
  • C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
  • H05K 1/03 - Use of materials for the substrate

33.

ROLLED COPPER FOIL, COPPER-CLAD LAMINATED PLATE, PRODUCTION METHOD FOR COPPER-CLAD LAMINATED PLATE, PRODUCTION METHOD FOR FLEXIBLE PRINTED CIRCUIT, AND PRODUCTION METHOD FOR ELECTRONIC COMPONENT

      
Application Number JP2023020559
Publication Number 2024/014170
Status In Force
Filing Date 2023-06-01
Publication Date 2024-01-18
Owner JX METALS CORPORATION (Japan)
Inventor
  • Ota,akimitsu
  • Cho,shunsuke
  • Nakagawa,kotaro

Abstract

Provided is a rolled copper foil which has bending properties superior to those of conventional rolled copper foils when made into an FPC. The rolled copper foil contains at least 99.9 mass% Cu, with the balance being unavoidable impurities, and has a cube orientation area ratio of at least 94.0% as measured after being subjected to a heat treatment at a temperature of 260 °C for 30 minutes in a dryer.

IPC Classes  ?

  • C22C 9/00 - Alloys based on copper
  • C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
  • C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
  • H05K 1/02 - Printed circuits - Details
  • H05K 1/03 - Use of materials for the substrate
  • H05K 1/09 - Use of materials for the metallic pattern

34.

ROLLED COPPER FOIL, COPPER-CLAD LAMINATE, METHOD FOR MANUFACTURING COPPER-CLAD LAMINATE, METHOD FOR MANUFACTURING FLEXIBLE PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

      
Application Number JP2023020562
Publication Number 2024/014173
Status In Force
Filing Date 2023-06-01
Publication Date 2024-01-18
Owner JX METALS CORPORATION (Japan)
Inventor
  • Cho,shunsuke
  • Ota,akimitsu
  • Nakagawa,kotaro

Abstract

Provided is a rolled copper foil having a higher flexibility than in the past when made into an FPC. This rolled copper foil contains 99.9 mass% or more of Cu, with the remainder made up by unavoidable impurities, and in the rolled copper foil, the arithmetic mean value of the grain boundary density measured at a total of three points comprising an arbitrary one point and two points equally set away from the one point by 5 mm in the directions perpendicular to the rolling direction, when heat-treated for a heating retention time of 30 minutes at a dryer internal temperature of 260°C is 38.40 mm-1 or less.

IPC Classes  ?

  • C22C 9/00 - Alloys based on copper
  • C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
  • C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
  • H05K 1/02 - Printed circuits - Details
  • H05K 1/03 - Use of materials for the substrate
  • H05K 1/09 - Use of materials for the metallic pattern

35.

METHOD FOR REMOVING ALUMINUM AND METHOD FOR RECOVERING METALS

      
Application Number JP2023025954
Publication Number 2024/014520
Status In Force
Filing Date 2023-07-13
Publication Date 2024-01-18
Owner JX METALS CORPORATION (Japan)
Inventor
  • Higuchi,naoki
  • Shikada,kei

Abstract

Provided are a method for removing aluminum which can effectively remove aluminum, and a method for recovering metals. A method for removing aluminum includes a leaching step of bringing a raw material obtained from lithium ion battery waste, the raw material having battery powder containing at least aluminum and nickel and/or cobalt, into contact with an acidic leaching solution to leach the battery powder to obtain a leached solution, wherein a molar ratio of fluorine to aluminum (F/Al molar ratio) of the raw material is 1.3 or more, and wherein, in the leaching step, the acidic leaching solution contains calcium and fluorine, aluminum is precipitated with calcium and fluorine, and the resulting precipitate is contained in a leached residue.

IPC Classes  ?

  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • C22B 26/12 - Obtaining lithium
  • H01M 10/54 - Reclaiming serviceable parts of waste accumulators
  • C22B 21/00 - Obtaining aluminium
  • C22B 3/00 - Extraction of metal compounds from ores or concentrates by wet processes

36.

METHOD FOR RECOVERING METALS

      
Application Number JP2023025956
Publication Number 2024/014522
Status In Force
Filing Date 2023-07-13
Publication Date 2024-01-18
Owner JX METALS CORPORATION (Japan)
Inventor
  • Shikada,kei
  • Higuchi,naoki
  • Arakawa,junichi

Abstract

Provided is a method for recovering metals, which can produce a lithium hydroxide solution from a metal-containing solution and appropriately process the impurities separated at that time. The method for recovering metals from battery powder of lithium ion battery waste includes: an acid leaching step of leaching the metals in the battery powder into an acidic leaching solution to obtain a metal-containing solution containing lithium ions and other metal ions; a metal separation step of separating the other metal ions from the metal-containing solution; and, after the metal separation step, an electrodialysis step of subjecting the metal-containing solution containing lithium ions and fluoride ions as impurities to electrodialysis using a bipolar membrane to obtain a lithium hydroxide solution and an acidic solution comprising fluoride ions, wherein the acidic solution obtained in the electrodialysis step is mixed with the acidic leaching solution so that the acidic leaching solution contains calcium in the acidic leaching step, and the fluoride ions are precipitated by the calcium.

IPC Classes  ?

  • C22B 3/06 - Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic acid solutions
  • C22B 3/42 - Treatment or purification of solutions, e.g. obtained by leaching by ion-exchange extraction
  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • C22B 21/00 - Obtaining aluminium
  • C22B 26/12 - Obtaining lithium
  • H01M 10/54 - Reclaiming serviceable parts of waste accumulators

37.

COPPER FOIL FOR FLEXIBLE PRINTED SUBSTRATE, AND COPPER-CLAD LAMINATE, FLEXIBLE PRINTED SUBSTRATE AND ELECTRONIC DEVICE USING SAME

      
Application Number JP2023010012
Publication Number 2024/014056
Status In Force
Filing Date 2023-03-15
Publication Date 2024-01-18
Owner JX METALS CORPORATION (Japan)
Inventor
  • Bando Shinsuke
  • Ishino Yuji

Abstract

PROBLEM TO BE SOLVED: To provide a copper foil for a flexible printed substrate, having good linear circuit properties and suitable for a minute circuit, and a copper-clad laminate, a flexible printed substrate and an electronic device using same. SOLUTION: A copper foil for a flexible printed substrate, which is a rolled copper foil comprising at least 99.96 mass% Cu, with the remainder being unavoidable impurities, wherein when 300°C heat treatment is carried out for 30 minutes and a measurement field of view of 150µm x 150µm of the rolling surface of the rolled copper foil is subjected to EBSD measurement, the standard deviation of the crystal diameter, when a misorientation of 5° or more is considered a crystal boundary, is not more than 3.0µm.

IPC Classes  ?

  • C22C 9/00 - Alloys based on copper
  • C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
  • C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
  • H05K 1/03 - Use of materials for the substrate

38.

ROLLED COPPER FOIL, COPPER-CLAD LAMINATE, METHOD FOR MANUFACTURING COPPER-CLAD LAMINATE, METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC PART

      
Application Number JP2023020560
Publication Number 2024/014171
Status In Force
Filing Date 2023-06-01
Publication Date 2024-01-18
Owner JX METALS CORPORATION (Japan)
Inventor
  • Nakagawa,kotaro
  • Cho,shunsuke
  • Ota,akimitsu

Abstract

Provided is a rolled copper foil having greater flexural properties than conventional flexural properties when passing through CCL manufacturing using a lamination method and being made into FPC. The present invention is a rolled copper foil containing at least 99.9 mass% Cu, the remainder being unavoidable impurities, and having an arithmetic mean Cube area ratio of at least 77.0% when measuring a total of three points, one arbitrary point and two other points separated equidistantly therefrom such as by 5 mm each in a direction perpendicular to rolling, when heat-treated at a soak temperature of 370°C for a soak time of 1 sec.

IPC Classes  ?

  • C22C 9/00 - Alloys based on copper
  • C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
  • C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
  • H05K 1/02 - Printed circuits - Details
  • H05K 1/03 - Use of materials for the substrate
  • H05K 1/09 - Use of materials for the metallic pattern

39.

ROLLED COPPER FOIL, COPPER-CLAD LAMINATE, METHOD FOR PRODUCING COPPER-CLAD LAMINATE, METHOD FOR PRODUCING FLEXIBLE PRINTED WIRING BOARD, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT

      
Application Number JP2023020561
Publication Number 2024/014172
Status In Force
Filing Date 2023-06-01
Publication Date 2024-01-18
Owner JX METALS CORPORATION (Japan)
Inventor
  • Nakagawa,kotaro
  • Ota,akimitsu
  • Cho,shunsuke

Abstract

Provided is a rolled copper foil that has higher flexibility than conventional products when made into an FPC. Rolled copper foil containing 99.9 mass% or more of Cu, the balance being unavoidable impurities, and the arithmetic mean value of the Taylor factor being 2.485 or less as measured at a total of three points including a discretionary point and two points each spaced equidistantly 5 mm therefrom in a direction perpendicular to the rolling direction when heat treated for a heating holding time of 30 minutes at a dryer internal temperature of 260°C.

IPC Classes  ?

  • C22C 9/00 - Alloys based on copper
  • C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
  • C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
  • H05K 1/02 - Printed circuits - Details
  • H05K 1/03 - Use of materials for the substrate
  • H05K 1/09 - Use of materials for the metallic pattern

40.

METHOD FOR REMOVING ALUMINUM AND METHOD FOR RECOVERING METALS

      
Application Number JP2023025955
Publication Number 2024/014521
Status In Force
Filing Date 2023-07-13
Publication Date 2024-01-18
Owner JX METALS CORPORATION (Japan)
Inventor
  • Higuchi,naoki
  • Shikada,kei

Abstract

Provided are a method for removing aluminum which can effectively remove aluminum, and a method for recovering metals. A method for removing aluminum includes: a leaching step of bringing a raw material, the raw material having battery powder, the battery powder being obtained from lithium ion battery waste and comprising at least aluminum and nickel and/or cobalt, into contact with an acidic leaching solution to leach the battery powder to obtain a leached solution containing at least aluminum ions and nickel ions and/or cobalt ions; and a neutralization step of using the leached solution as a metal-containing solution, increasing a pH of the metal-containing solution and separating a neutralized residue to obtain a neutralized solution, wherein a molar ratio of fluorine to aluminum (F/Al molar ratio) of the raw material is 1.3 or more, and wherein, in the neutralization step, the metal-containing solution contains calcium and fluorine, a molar ratio of calcium to aluminum ions (Ca/Al molar ratio) in the metal-containing solution is 0.2 or more, the aluminum ions in the metal-containing solution are precipitated and contained in the neutralized residue together with calcium and fluorine.

IPC Classes  ?

  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • C22B 21/00 - Obtaining aluminium
  • C22B 3/00 - Extraction of metal compounds from ores or concentrates by wet processes
  • H01M 10/54 - Reclaiming serviceable parts of waste accumulators
  • C22B 26/12 - Obtaining lithium

41.

METHOD FOR REMOVING IMPURITIES, AND METHOD FOR RECOVERING METALS

      
Application Number JP2023026110
Publication Number 2024/014540
Status In Force
Filing Date 2023-07-14
Publication Date 2024-01-18
Owner JX METALS CORPORATION (Japan)
Inventor
  • Arakawa,junichi
  • Kashimura,hiromichi
  • Kamiyama,eriko

Abstract

Provided are a method for removing impurities that can effectively remove impurities such as fluoride ions, and a method for recovering metals. The method for removing impurities from a metal-containing solution obtained by leaching battery powder of lithium ion battery waste with an acid, the method including: a metal separation step of separating other metal ions from the metal-containing solution containing lithium ions and the other metal ions; and, after the metal separation step, an electrodialysis step of subjecting the metal-containing solution containing lithium ions, and fluoride ions as impurities, to electrodialysis using a bipolar membrane to obtain a lithium hydroxide solution and an acidic solution, wherein the lithium hydroxide solution is used as a pH adjusting agent in the metal separation step.

IPC Classes  ?

  • C22B 3/22 - Treatment or purification of solutions, e.g. obtained by leaching by physical processes, e.g. by filtration, by magnetic means
  • C22B 3/42 - Treatment or purification of solutions, e.g. obtained by leaching by ion-exchange extraction
  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • C22B 21/00 - Obtaining aluminium
  • H01M 10/54 - Reclaiming serviceable parts of waste accumulators
  • C25B 1/16 - Hydroxides

42.

METHOD FOR RECOVERING METALS

      
Application Number JP2023026111
Publication Number 2024/014541
Status In Force
Filing Date 2023-07-14
Publication Date 2024-01-18
Owner JX METALS CORPORATION (Japan)
Inventor
  • Arakawa,junichi
  • Kashimura,hiromichi
  • Kamiyama,eriko

Abstract

Provided is a method for recovering metals, which can produce a lithium hydroxide solution from a metal-containing solution and appropriately process the impurities separated at that time. The method for recovering metals from battery powder of lithium ion battery waste includes: an acid leaching step of leaching the metals in the battery powder with an acid to obtain a metal-containing solution containing lithium ions and other metal ions including manganese ions and/or aluminum ions; a metal separation step of separating the other metal ions from the metal-containing solution, the metal separation step comprising extraction of manganese ions and/or aluminum ions from the metal-containing solution into a solvent and, after the extraction, stripping of manganese ions and/or aluminum ions from the solvent into a stripping solution; and, after the metal separation step, an electrodialysis step of subjecting the metal-containing solution containing lithium ions and fluoride ions to electrodialysis using a bipolar membrane to obtain a lithium hydroxide solution and an acidic solution containing fluoride ions, wherein the acidic solution obtained in the electrodialysis step is used as at least part of the stripping solution in the metal separation step.

IPC Classes  ?

  • C22B 3/42 - Treatment or purification of solutions, e.g. obtained by leaching by ion-exchange extraction
  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • C22B 21/00 - Obtaining aluminium
  • C22B 26/12 - Obtaining lithium
  • C22B 26/22 - Obtaining magnesium
  • H01M 10/54 - Reclaiming serviceable parts of waste accumulators
  • C22B 47/00 - Obtaining manganese

43.

COPPER POWDER

      
Application Number JP2022029352
Publication Number 2024/009522
Status In Force
Filing Date 2022-07-29
Publication Date 2024-01-11
Owner JX METALS CORPORATION (Japan)
Inventor
  • Tsuchihashi,reina
  • Orikasa,hironori

Abstract

A copper powder wherein the ratio (C/SSA) of the carbon content C (mass%) to the BET specific surface area (m2/g) is 0.07 or less, and in a C1s spectrum obtained by X-ray photoelectron spectroscopy, the peak area ratio (A2/A1) of the area A2 of a peak that has the peak top in the range 288 eV-289.2 eV to the area A1 of a peak that has the peak top in the range 284 eV-285 eV is 0.5 or greater.

IPC Classes  ?

  • B22F 1/00 - Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 1/05 - Metallic powder characterised by the size or surface area of the particles
  • B22F 1/054 - Nanosized particles
  • B22F 9/20 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from solid metal compounds
  • C22C 1/04 - Making non-ferrous alloys by powder metallurgy

44.

METHOD FOR HEAT-TREATING LITHIUM-ION BATTERY WASTE

      
Application Number JP2023015834
Publication Number 2024/004356
Status In Force
Filing Date 2023-04-20
Publication Date 2024-01-04
Owner JX METALS CORPORATION (Japan)
Inventor
  • Miyanaga,hiroshi
  • Haga,yasufumi

Abstract

This method for heat-treating lithium-ion battery waste includes: a battery-heating step for heating the lithium-ion battery waste in a heat treatment furnace; and a gas combustion step for feeding generated gas generated in the heat treatment furnace into a gas combustion furnace, feeding LPG as fuel and burning the generated gas in the gas combustion furnace, and changing the LPG combustion flow rate, which is the fuel feed amount, according to the temperature in the gas combustion furnace. While the temperature inside the heat treatment furnace is increasing, there are at least two ΔLPG increase periods in which ΔLPG, which is the amount by which the LPG combustion flow rate is throttled in the gas combustion furnace, is increased to 0.5 Nm3/h or above. In at least a part of at least the second ΔLPG increase period, the rate of increase in the temperature inside the heat treatment furnace is reduced or the temperature inside the heat treatment furnace is maintained.

IPC Classes  ?

  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • C22B 1/02 - Roasting processes
  • H01M 10/54 - Reclaiming serviceable parts of waste accumulators

45.

SEPARATION METHOD FOR STAINLESS STEEL AND PROCESSING METHOD FOR ELECTRICAL/ELECTRONIC COMPONENT SCRAPS

      
Application Number JP2023019001
Publication Number 2023/228912
Status In Force
Filing Date 2023-05-22
Publication Date 2023-11-30
Owner JX METALS CORPORATION (Japan)
Inventor
  • Takei,takuma
  • Sasaoka,hidetoshi
  • Tanabe,kentaro

Abstract

Provided is: a separation method for stainless steel capable of efficiently separating stainless steel from electrical/electronic component scraps, in particular, crushed scraps obtained by subjecting electrical/electronic component scraps to a crushing processing; and a processing method for electrical/electronic component scraps. The separation method for stainless steel includes: a crushing step S2 for crushing electrical/electronic components; an air flow classification step S3 for classifying the crushed substance obtained in the crushing step by air flow and obtaining, as a heavy substance, excluded stones that include stainless steel; a coarse excluded stone sorting step S4 for sorting and collecting, from the excluded stones, coarse excluded stones having at least a predetermined size; and a first magnetic sorting step S6 for magnetically sorting coarse excluded stones and obtaining, as a magnetized substance, coarse excluded stones that include stainless steel, from the coarse excluded stones.

IPC Classes  ?

  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • B03B 4/02 - Separating by pneumatic tables or by pneumatic jigs using swinging or shaking tables
  • B03B 9/06 - General arrangement of separating plant, e.g. flow sheets specially adapted for refuse
  • B03C 1/00 - Magnetic separation
  • B03C 1/005 - Pretreatment specially adapted for magnetic separation
  • B03C 1/18 - Magnetic separation acting directly on the substance being separated with material carriers in the form of belts with magnets moving during operation
  • B03C 1/24 - Magnetic separation acting directly on the substance being separated with material carried by travelling fields, e.g. generated by stationary magnetic coils; Eddy-current separators, e.g. sliding ramp with material carried by travelling fields
  • B07B 4/08 - Separating solids from solids by subjecting their mixture to gas currents while the mixtures are supported by sieves, screens, or like mechanical elements
  • B07B 7/083 - Selective separation of solid materials carried by, or dispersed in, gas currents using centrifugal force generated by rotating vanes, discs, drums, or brushes
  • B07B 9/00 - Combinations of apparatus for screening or sifting or for separating solids from solids using gas currents; General arrangement of plant, e.g. flow sheets
  • C22B 1/00 - Preliminary treatment of ores or scrap
  • C22B 1/02 - Roasting processes

46.

Indium phosphide substrate, semiconductor epitaxial wafer, method for producing indium phosphide single-crystal ingot and method for producing indium phosphide substrate

      
Application Number 18031088
Grant Number 11926924
Status In Force
Filing Date 2021-10-07
First Publication Date 2023-11-23
Grant Date 2024-03-12
Owner JX METALS CORPORATION (Japan)
Inventor
  • Oka, Shunsuke
  • Kawahira, Keita
  • Noda, Akira

Abstract

Provided is an indium phosphide substrate, a semiconductor epitaxial wafer, a method for producing an indium phosphide single-crystal ingot and a method for producing indium phosphide substrate capable of suppressing concave defects. An indium phosphide substrate has a diameter of 100 mm or less, and at least one of surfaces has zero concave defects detected in the topography channel, by irradiating a laser beam of 405 nm wavelength with S-polarized light on the surface.

IPC Classes  ?

47.

NON-AQUEOUS ELECTROLYTE BATTERY TAB LEAD

      
Application Number JP2023017941
Publication Number 2023/223968
Status In Force
Filing Date 2023-05-12
Publication Date 2023-11-23
Owner JX METALS CORPORATION (Japan)
Inventor
  • Murakami Ryu
  • Osawa Ryouhei
  • Katayama Koichi
  • Oe Atsuo
  • Ouchi Takashi

Abstract

Used in the present invention is a metallic lead conductor which is used in an electrochemical device tab lead including a lead conductor made of a metal and a seal member made of an insulating resin, wherein the lead conductor has a surface that makes contact with the seal member and that has a roughness parameter Spk falling in the range of not less than 0.26 [μm]. Thus, provided is a means that makes it possible to manage the adhesive force between a lead conductor and a seal member more precisely than a conventional means.

IPC Classes  ?

  • H01M 50/533 - Electrode connections inside a battery casing characterised by the shape of the leads or tabs
  • H01M 50/178 - Arrangements of electric connectors penetrating the casing adapted for the shape of the cells for pouch or flexible bag cells
  • H01M 50/184 - Sealing members characterised by their shape or structure
  • H01M 50/534 - Electrode connections inside a battery casing characterised by the material of the leads or tabs
  • H01M 50/553 - Terminals adapted for prismatic, pouch or rectangular cells
  • H01M 50/571 - Methods or arrangements for affording protection against corrosion; Selection of materials therefor

48.

TAB LEAD FOR NONAQUEOUS ELECTROLYTE BATTERIES

      
Application Number JP2023017945
Publication Number 2023/223971
Status In Force
Filing Date 2023-05-12
Publication Date 2023-11-23
Owner JX METALS CORPORATION (Japan)
Inventor
  • Murakami Ryu
  • Osawa Ryouhei
  • Katayama Koichi
  • Oe Atsuo
  • Ouchi Takashi

Abstract

The present invention provides a metal lead conductor which is used for a tab lead for electrochemical devices, the tab lead comprising the metal lead conductor and a sealing material that is formed of an insulating resin, wherein a surface of the lead conductor, the surface coming into contact with the sealing material, has a roughness parameter Sdr of 0.9 or more, thereby enabling the control of the adhesion between the lead conductor and the sealing material to be more accurate than ever before.

IPC Classes  ?

  • H01M 50/533 - Electrode connections inside a battery casing characterised by the shape of the leads or tabs
  • H01M 50/178 - Arrangements of electric connectors penetrating the casing adapted for the shape of the cells for pouch or flexible bag cells
  • H01M 50/184 - Sealing members characterised by their shape or structure
  • H01M 50/534 - Electrode connections inside a battery casing characterised by the material of the leads or tabs
  • H01M 50/553 - Terminals adapted for prismatic, pouch or rectangular cells
  • H01M 50/571 - Methods or arrangements for affording protection against corrosion; Selection of materials therefor

49.

CONDUCTOR

      
Application Number JP2023017946
Publication Number 2023/223972
Status In Force
Filing Date 2023-05-12
Publication Date 2023-11-23
Owner JX METALS CORPORATION (Japan)
Inventor
  • Murakami Ryu
  • Osawa Ryouhei
  • Katayama Koichi
  • Oe Atsuo

Abstract

The present invention provides a metal conductor which comprises a base material and a surface treatment layer that is formed on the base material, wherein the surface treatment layer comprises an Ni-P plating layer that has a P concentration within the range of 4-18 wt%. Consequently, the present invention provides a conductor which is provided with a surface that exhibits excellent durability in a corrosive environment such as an electrolyte solution, while having a low environmental load.

IPC Classes  ?

  • H01M 50/571 - Methods or arrangements for affording protection against corrosion; Selection of materials therefor
  • H01M 50/534 - Electrode connections inside a battery casing characterised by the material of the leads or tabs
  • H01M 50/553 - Terminals adapted for prismatic, pouch or rectangular cells
  • H01M 50/562 - Terminals characterised by the material

50.

TAB LEAD FOR NONAQUEOUS ELECTROLYTE BATTERIES

      
Application Number JP2023017943
Publication Number 2023/223969
Status In Force
Filing Date 2023-05-12
Publication Date 2023-11-23
Owner JX METALS CORPORATION (Japan)
Inventor
  • Murakami Ryu
  • Osawa Ryouhei
  • Katayama Koichi
  • Oe Atsuo
  • Ouchi Takashi

Abstract

The present invention provides a metal lead conductor which is used for a tab lead for electrochemical devices, the tab lead comprising a metal lead conductor and a sealing material that is formed of an insulating resin, wherein a surface of the lead conductor, the surface coming into contact with the sealing material, has a roughness parameter Svk of 0.175 (µm) or more, thereby enabling the control of the adhesion between the lead conductor and the sealing material to be more accurate than ever before.

IPC Classes  ?

  • H01M 50/533 - Electrode connections inside a battery casing characterised by the shape of the leads or tabs
  • H01M 50/178 - Arrangements of electric connectors penetrating the casing adapted for the shape of the cells for pouch or flexible bag cells
  • H01M 50/184 - Sealing members characterised by their shape or structure
  • H01M 50/534 - Electrode connections inside a battery casing characterised by the material of the leads or tabs
  • H01M 50/553 - Terminals adapted for prismatic, pouch or rectangular cells
  • H01M 50/571 - Methods or arrangements for affording protection against corrosion; Selection of materials therefor

51.

TAB LEAD FOR NON-AQUEOUS ELECTROLYTE BATTERY

      
Application Number JP2023017944
Publication Number 2023/223970
Status In Force
Filing Date 2023-05-12
Publication Date 2023-11-23
Owner JX METALS CORPORATION (Japan)
Inventor
  • Murakami Ryu
  • Osawa Ryouhei
  • Katayama Koichi
  • Oe Atsuo
  • Ouchi Takashi

Abstract

Provided is a tab lead for an electrochemical device comprising a metal lead conductor and an insulating resin sealant, wherein the metal lead conductor used for the tab lead has a surface in contact with the sealant on the surface of the lead conductor, the surface having a roughness parameter Sdq in the range of 0.13 or more. The adhesion between the lead conductor and the sealant can be controlled more accurately by means of the lead conductor compared to conventional means.

IPC Classes  ?

  • H01M 50/533 - Electrode connections inside a battery casing characterised by the shape of the leads or tabs
  • H01M 50/178 - Arrangements of electric connectors penetrating the casing adapted for the shape of the cells for pouch or flexible bag cells
  • H01M 50/184 - Sealing members characterised by their shape or structure
  • H01M 50/534 - Electrode connections inside a battery casing characterised by the material of the leads or tabs
  • H01M 50/553 - Terminals adapted for prismatic, pouch or rectangular cells
  • H01M 50/571 - Methods or arrangements for affording protection against corrosion; Selection of materials therefor

52.

STRIP-SHAPED COPPER ALLOY MATERIAL, SEMICONDUCTOR LEAD FRAME USING SAME, SEMICONDUCTOR INTEGRATED CIRCUIT AND ELECTRONIC DEVICE, AND METHOD FOR PRODUCING LEAD FRAME AND METHOD FOR USING STRIP-SHAPED COPPER ALLOY MATERIAL AS LEAD FRAME

      
Application Number JP2023002212
Publication Number 2023/188748
Status In Force
Filing Date 2023-01-25
Publication Date 2023-10-05
Owner JX METALS CORPORATION (Japan)
Inventor Nakatsuma Munehiko

Abstract

The present invention addresses the problem of providing a strip-shaped copper alloy material that exhibits a high strength and that suppresses the production of burring during cutting. The present invention is a strip-shaped copper alloy material composed of Si at more than 0.1 mass%, Ni, and a balance of copper and unavoidable impurities. The strip-shaped copper alloy material has a 0.2% proof stress, as measured by a prescribed method, of at least 550 MPa, and has an elongation at break, measured by a prescribed method wherein heating is performed for 30 minutes at 400°C followed by standing in an air atmosphere and reducing the temperature of the copper alloy to room temperature, of not more than 10%.

IPC Classes  ?

  • C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
  • C22C 9/00 - Alloys based on copper
  • C22C 9/02 - Alloys based on copper with tin as the next major constituent
  • C22C 9/04 - Alloys based on copper with zinc as the next major constituent
  • C22C 9/05 - Alloys based on copper with manganese as the next major constituent
  • C22C 9/10 - Alloys based on copper with silicon as the next major constituent
  • C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
  • C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
  • H01B 1/02 - Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
  • H01B 5/02 - Single bars, rods, wires or strips; Bus-bars

53.

METAL LEACHING METHOD AND METAL RECOVERY METHOD

      
Application Number JP2022039561
Publication Number 2023/188489
Status In Force
Filing Date 2022-10-24
Publication Date 2023-10-05
Owner JX METALS CORPORATION (Japan)
Inventor
  • Shikada,kei
  • Higuchi,naoki
  • Fujimoto,atsushi

Abstract

This method for leaching metals in a battery powder containing at least copper as well as cobalt and/or nickel has a leaching process repeated a plurality of times. The leaching process includes: a first leaching step for leaching the metals in the battery powder using an acidic leachate, finishing leaching before the copper dissolves out, and extracting a leaching residue from a post-leaching solution thereby obtained; and a second leaching step for leaching the metals in the leaching residue from the first leaching step using an acidic leachate, finishing leaching after the copper has dissolved out, and obtaining a post-leaching solution. The post-leaching solution obtained in the second leaching step of a leaching process is used as the acidic leachate in the first leaching step of the next leaching process performed after said leaching process. In the second leaching step of at least one of the leaching processes, the leaching residue is extracted from the post-leaching solution.

IPC Classes  ?

  • C22B 3/06 - Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic acid solutions
  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • C22B 23/00 - Obtaining nickel or cobalt

54.

METHOD FOR LEACHING METAL AND METHOD FOR RECOVERING METAL

      
Application Number JP2023009406
Publication Number 2023/189436
Status In Force
Filing Date 2023-03-10
Publication Date 2023-10-05
Owner JX METALS CORPORATION (Japan)
Inventor
  • Shikada,kei
  • Higuchi,naoki
  • Fujimoto,atsushi

Abstract

A method for leaching at least one metal in battery powder containing at least copper and one or more of cobalt and nickel, the method including a leaching process repeating multiple times, wherein the leaching process includes: a first leaching step of leaching at least one metal in the battery powder in an acidic leaching solution, terminating the leaching before the copper begins to be dissolved, and removing a leached residue from the resulting leached solution; and a second leaching step of leaching at least one metal in the leached residue of the first leaching step in an acidic leaching solution, and terminating the leaching after the copper begins to be dissolved to obtain a leached solution, wherein the leached solution obtained in the second leaching step of the leaching process is used as an acidic leaching solution in a first leaching step of a leaching process followed by said leaching process, and wherein a leached residue is removed from a leached solution in a second leaching step of at least one leaching process.

IPC Classes  ?

  • C22B 3/06 - Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic acid solutions
  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • C22B 15/00 - Obtaining copper
  • C22B 23/00 - Obtaining nickel or cobalt
  • B09B 3/00 - Destroying solid waste or transforming solid waste into something useful or harmless

55.

POSITIVE ELECTRODE ACTIVE MATERIAL FOR LITHIUM-ION BATTERY, POSITIVE ELECTRODE FOR LITHIUM-ION BATTERY, LITHIUM-ION BATTERY, POSITIVE ELECTRODE ACTIVE MATERIAL FOR SOLID-STATE LITHIUM-ION BATTERY, POSITIVE ELECTRODE FOR SOLID-STATE LITHIUM-ION BATTERY, SOLID-STATE LITHIUM-ION BATTERY, METHOD FOR MANUFACTURING POSITIVE ELECTRODE ACTIVE MATERIAL FOR LITHIUM-ION BATTERY, AND METHOD FOR MANUFACTURING POSITIVE ELECTRODE ACTIVE MATERIAL FOR SOLID-STATE LITHIUM-ION BATTERY

      
Application Number JP2022032291
Publication Number 2023/181452
Status In Force
Filing Date 2022-08-26
Publication Date 2023-09-28
Owner JX METALS CORPORATION (Japan)
Inventor Tamura,tomoya

Abstract

abcdeff (In formula (1), the following relationships hold: 1.0 ≤ a ≤ 1.05, 0.8 ≤ b ≤ 0.9, b + c + d + e = 1, 1.8 ≤ f ≤ 2.2, 0.0025 ≤ e/(b + c + d + e) ≤ 0.016, and M is at least one element selected from Zr, Ta, and W.) In a WDX mapping analysis of positive electrode active material particles in a field of view measuring 50μm × 50μm using FE-EPMA, an oxide of M adheres to the surfaces of the positive electrode active material particles, and the oxide of M is not present as individual particles that do not adhere to the surfaces of the positive electrode active material particles.

IPC Classes  ?

  • H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
  • C01G 53/00 - Compounds of nickel
  • H01M 4/36 - Selection of substances as active materials, active masses, active liquids
  • H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
  • H01M 10/052 - Li-accumulators
  • H01M 10/0562 - Solid materials

56.

POSITIVE ELECTRODE ACTIVE MATERIAL FOR LITHIUM ION BATTERY, POSITIVE ELECTRODE FOR LITHIUM ION BATTERY, LITHIUM ION BATTERY, POSITIVE ELECTRODE ACTIVE MATERIAL FOR ALL-SOLID-STATE LITHIUM ION BATTERY, POSITIVE ELECTRODE FOR ALL-SOLID-STATE LITHIUM ION BATTERY, ALL-SOLID-STATE LITHIUM ION BATTERY, METHOD FOR PRODUCING POSITIVE ELECTRODE ACTIVE MATERIAL FOR LITHIUM ION BATTERY, AND METHOD FOR PRODUCING POSITIVE ELECTRODE ACTIVE MATERIAL FOR ALL-SOLID-STATE LITHIUM ION BATTERY

      
Application Number JP2023011631
Publication Number 2023/182458
Status In Force
Filing Date 2023-03-23
Publication Date 2023-09-28
Owner JX METALS CORPORATION (Japan)
Inventor Tamura,tomoya

Abstract

abcdeff (1) (in formula (1), 1.0≤a≤1.05, 0.8≤b≤0.9, b+c+d+e=1, 1.8≤f≤2.2, 0.0025≤e/(b+c+d+e)≤0.016, and M is at least one selected from among Zr, Ta, and W), wherein in the WDX mapping analysis of positive electrode active material particles in a field of view of 50 μm × 50 μm by FE-EPMA, the oxide of M is attached to the surfaces of the positive electrode active material particles, and the oxide of M does not exist as independent particles that are not attached to the surfaces of the positive electrode active material particles.

IPC Classes  ?

  • H01M 4/525 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of nickel, cobalt or iron of mixed oxides or hydroxides containing iron, cobalt or nickel for inserting or intercalating light metals, e.g. LiNiO2, LiCoO2 or LiCoOxFy
  • C01G 53/00 - Compounds of nickel
  • H01M 4/36 - Selection of substances as active materials, active masses, active liquids
  • H01M 4/505 - Selection of substances as active materials, active masses, active liquids of inorganic oxides or hydroxides of manganese of mixed oxides or hydroxides containing manganese for inserting or intercalating light metals, e.g. LiMn2O4 or LiMn2OxFy
  • H01M 10/052 - Li-accumulators
  • H01M 10/0562 - Solid materials

57.

ELECTROMAGNETIC WAVE SHIELDING MATERIAL, COVERING MATERIAL OR EXTERIOR MATERIAL, AND ELECTRIC/ELECTRONIC APPARATUS

      
Application Number JP2022039178
Publication Number 2023/166783
Status In Force
Filing Date 2022-10-20
Publication Date 2023-09-07
Owner JX METALS CORPORATION (Japan)
Inventor
  • Ori,yuki
  • Yamamoto,yukito
  • Yokoyama,kohei

Abstract

Provided is an electromagnetic wave shielding material which has favorable shielding properties in a low-frequency range. The electromagnetic wave shielding material has a structure in which a ferromagnetic layer and a non-magnetic conductive metal layer are laminated, and further has, on at least one surface of the non-magnetic conductive metal layer, a treatment film which contains an alloy containing copper and nickel.

IPC Classes  ?

  • H05K 9/00 - Screening of apparatus or components against electric or magnetic fields
  • B32B 15/01 - Layered products essentially comprising metal all layers being exclusively metallic
  • H01F 1/14 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys

58.

SPUTTERING TARGET AND METHOD FOR PRODUCING SAME

      
Application Number JP2022038962
Publication Number 2023/162327
Status In Force
Filing Date 2022-10-19
Publication Date 2023-08-31
Owner JX METALS CORPORATION (Japan)
Inventor
  • Sato,yusuke
  • Sato,takanori
  • Kaminaga,kengo

Abstract

Provided are a Cu-Al binary alloy sputtering target having a high Al content and a method for producing the same, which make it possible to suppress cracking of a sputtering target. The present invention provides a sputtering target composed of a sintered body containing a binary alloy of Cu and Al, with the balance consisting of unavoidable impurities, wherein the contents (at%) of Cu and Al satisfy the following relational expression: 0.48 ≤ Al/(Cu + Al) ≤ 0.70, and the relative density is 95% or more.

IPC Classes  ?

  • C23C 14/34 - Sputtering
  • B22F 3/14 - Both compacting and sintering simultaneously
  • B22F 9/08 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
  • C22C 1/04 - Making non-ferrous alloys by powder metallurgy
  • C22C 9/01 - Alloys based on copper with aluminium as the next major constituent
  • C22C 21/12 - Alloys based on aluminium with copper as the next major constituent

59.

ALUMINIUM REMOVAL METHOD

      
Application Number JP2022039180
Publication Number 2023/157378
Status In Force
Filing Date 2022-10-20
Publication Date 2023-08-24
Owner JX METALS CORPORATION (Japan)
Inventor Higuchi,naoki

Abstract

An aluminium removal method, comprising: a leaching step in which battery powder obtained from lithium-ion battery waste and containing at least one of aluminium, nickel and cobalt is leached with an acid to obtain a leached solution, which contains at least one of aluminium ions, nickel ions and cobalt ions; and a neutralisation step which consists in increasing the pH of the leached solution to remove aluminium ions, wherein, when aluminium ions are removed in the neutralisation step, an alkaline pH adjuster is added to the leached solution to increase the pH, and when the pH has reached 3.0 to 4.0, iron is added instead of the pH adjuster to further increase the pH.

IPC Classes  ?

  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • C22B 23/00 - Obtaining nickel or cobalt
  • C22B 3/06 - Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic acid solutions
  • C22B 3/44 - Treatment or purification of solutions, e.g. obtained by leaching by chemical processes
  • C22B 3/46 - Treatment or purification of solutions, e.g. obtained by leaching by chemical processes by substitution, e.g. by cementation
  • B09B 3/70 - Chemical treatment, e.g. pH adjustment or oxidation
  • H01M 10/54 - Reclaiming serviceable parts of waste accumulators

60.

RECOVERY METHOD FOR EXTRACTANT IN AQUEOUS SOLUTION AND SEPARATION AND RECOVERY METHOD FOR METAL FROM METAL AQUEOUS SOLUTION

      
Application Number JP2022039179
Publication Number 2023/157377
Status In Force
Filing Date 2022-10-20
Publication Date 2023-08-24
Owner JX METALS CORPORATION (Japan)
Inventor Arakawa,junichi

Abstract

A method for recovering a neodecanoic acid or phosphonic acid ester-based extractant from an aqueous solution containing the neodecanoic acid or phosphonic acid ester-based extractant, wherein the equilibrium pH when recovering the neodecanoic acid or phosphonic acid ester-based extractant is set to be no more than 5.5.

IPC Classes  ?

  • B01D 11/04 - Solvent extraction of solutions which are liquid
  • C22B 3/26 - Treatment or purification of solutions, e.g. obtained by leaching by liquid-liquid extraction using organic compounds
  • C22B 3/38 - Treatment or purification of solutions, e.g. obtained by leaching by liquid-liquid extraction using organic compounds containing phosphorus
  • H01M 10/54 - Reclaiming serviceable parts of waste accumulators

61.

HEAT TREATMENT METHOD FOR LITHIUM ION BATTERY WASTE

      
Application Number JP2022037172
Publication Number 2023/149017
Status In Force
Filing Date 2022-10-04
Publication Date 2023-08-10
Owner JX METALS CORPORATION (Japan)
Inventor
  • Miyanaga,hiroshi
  • Haga,yasufumi

Abstract

Provided is a heat treatment method for lithium ion battery waste, said method comprising: a battery heating step for heating lithium ion battery waste while supplying an inert gas in a heat treatment furnace 1; and a gas combustion step for sending gas that is produced in the heat treatment furnace 1 to a gas combustion furnace 2 and combusting said gas in the gas combustion furnace 2, wherein in the battery heating step, when the lithium ion battery waste is heated while supplying the inert gas in the heat treatment furnace 1, the gauge pressure in the heat treatment furnace 1 is maintained in the range of -0.20 to -0.01 kPa.

IPC Classes  ?

  • H01M 10/54 - Reclaiming serviceable parts of waste accumulators
  • F27D 7/06 - Forming or maintaining special atmospheres or vacuum within heating chambers
  • F27D 17/00 - Arrangement for using waste heat; Arrangement for using, or disposing of, waste gases

62.

Magnetic film and perpendicular magnetic recording medium

      
Application Number 18177244
Grant Number 11939663
Status In Force
Filing Date 2023-03-02
First Publication Date 2023-07-20
Grant Date 2024-03-26
Owner JX Metals Corporation (Japan)
Inventor
  • Masuda, Manami
  • Shimizu, Masayoshi
  • Iwabuchi, Yasuyuki

Abstract

Provided is a sputtering target, the sputtering target containing 0.05 at % or more of Bi and having a total content of metal oxides of from 10 vol % to 60 vol %, the balance containing at least Co and Pt.

IPC Classes  ?

  • G11B 5/706 - Record carriers characterised by the selection of the material comprising one or more layers of magnetisable particles homogeneously mixed with a bonding agent on a base layer characterised by the composition of the magnetic material
  • C04B 35/01 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides
  • C22C 19/07 - Alloys based on nickel or cobalt based on cobalt
  • C23C 14/08 - Oxides
  • C23C 14/14 - Metallic material, boron or silicon
  • C23C 14/34 - Sputtering
  • G11B 5/65 - Record carriers characterised by the selection of the material comprising only the magnetic material without bonding agent characterised by its composition
  • H01F 1/10 - Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of hard-magnetic materials non-metallic substances, e.g. ferrites
  • H01F 41/18 - Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates by cathode sputtering
  • H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
  • C22C 1/04 - Making non-ferrous alloys by powder metallurgy
  • C22C 32/00 - Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ

63.

METHOD FOR RECOVERING METALS FROM LITHIUM ION BATTERY WASTE

      
Document Number 03239131
Status Pending
Filing Date 2022-12-26
Open to Public Date 2023-07-13
Owner JX METALS CORPORATION (Japan)
Inventor
  • Ariyoshi, Hirotaka
  • Ito, Junichi
  • Arakawa, Junichi
  • Abe, Hiroshi

Abstract

Provided is a method for efficiently recovering metals from lithium ion battery waste while reducing the use of sodium hydroxide as a pH adjuster.?A method for recovering metals from lithium ion battery waste includes wet processing of leaching metals containing lithium from lithium ion battery waste with an acid, and extracting the metals from the metal-containing solution in which the metals are dissolved, in which the lithium extracted in the wet processing is used as a pH adjuster used in the wet processing.

IPC Classes  ?

  • C22B 3/04 - Extraction of metal compounds from ores or concentrates by wet processes by leaching
  • C01D 15/02 - Oxides; Hydroxides
  • C01D 15/06 - Sulfates; Sulfites
  • C22B 3/06 - Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic acid solutions
  • C22B 3/44 - Treatment or purification of solutions, e.g. obtained by leaching by chemical processes
  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • C22B 26/12 - Obtaining lithium

64.

Method for removing linear objects, device for removing linear objects, and method for processing electronic/electrical equipment component waste

      
Application Number 17909316
Grant Number 11945000
Status In Force
Filing Date 2021-03-03
First Publication Date 2023-04-06
Grant Date 2024-04-02
Owner JX METALS CORPORATION (Japan)
Inventor Aoki, Katsushi

Abstract

Provided is a method for removing a linear object, a device for removing a linear object, and a method for processing electronic/electrical equipment component waste, which can improve separation efficiency. The method for removing linear objects including: arranging a plurality of filters 3 in a vibrating sieve machine 1 such that the filters 3 are adjacent to each other so as to partially overlap with each other in a feed direction of a raw material, each of the filters 3 comprising a plurality of rods 2 extending at distances in the feed direction of the raw material and a beam portion 21 supporting the plurality of rods 1 at one ends of the plurality of the rods 2, the other ends of the plurality of the rods 2 being free ends; arranging a guide 6 below a tip of one of the filters 3 located on a most downstream side in the feed direction; feeding the raw material containing at least linear objects and plate-form objects into the vibrating sieve machine 1; and sorting the linear objects and the plate-form objects by vibrating the filters 3, sieving the linear objects to an under-sieve side of the vibrating sieve machine 1, and capturing lumpy linear objects with the guide.

IPC Classes  ?

  • B07B 1/12 - Apparatus having only parallel elements
  • B07B 1/36 - Moving screens not otherwise provided for, e.g. swinging, reciprocating, rocking, tilting, or wobbling screens jigging or moving to-and-fro in more than one direction

65.

Indium phosphide substrate

      
Application Number 17787197
Grant Number 12065759
Status In Force
Filing Date 2022-03-07
First Publication Date 2023-03-16
Grant Date 2024-08-20
Owner JX METALS CORPORATION (Japan)
Inventor
  • Oka, Shunsuke
  • Suzuki, Kenji

Abstract

b from the wafer edge on the surface side opposite to the main surface is 150 μm or more to 400 μm or less; and wherein the indium phosphide substrate has a thickness of 330 μm or more to 700 μm or less.

IPC Classes  ?

  • C30B 29/40 - AIIIBV compounds
  • C30B 33/10 - Etching in solutions or melts
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L 21/304 - Mechanical treatment, e.g. grinding, polishing, cutting
  • H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds

66.

PURE COPPER OR COPPER ALLOY POWDER FOR ADDITIVE MANUFACTURING

      
Document Number 03227541
Status Pending
Filing Date 2022-08-30
Open to Public Date 2023-03-09
Owner JX METALS CORPORATION (Japan)
Inventor
  • Watanabe, Hirofumi
  • Shibuya, Yoshitaka
  • Kumagai, Masashi

Abstract

The present invention addresses the problem of providing a pure copper or copper alloy powder which is used for deposition modeling by means of a laser beam system, and which is capable of decreasing the oxygen concentration in a model, while having an increased laser absorptance. The present invention provides a pure copper or copper alloy powder which is provided with an oxide coating, wherein: the oxide coating contains carbon; and the ratio of the oxygen concentration to the carbon concentration ((oxygen concentration)/(carbon concentration)) is 5 or less.

IPC Classes  ?

  • B22F 1/00 - Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
  • B33Y 70/00 - Materials specially adapted for additive manufacturing
  • B22F 10/34 - Process control of powder characteristics, e.g. density, oxidation or flowability
  • B22F 1/14 - Treatment of metallic powder
  • B22F 1/16 - Metallic particles coated with a non-metal
  • B22F 3/105 - Sintering only by using electric current, laser radiation or plasma
  • B22F 3/16 - Both compacting and sintering in successive or repeated steps

67.

COPPER POWDER

      
Document Number 03220714
Status Pending
Filing Date 2022-02-18
Open to Public Date 2022-12-15
Owner JX METALS CORPORATION (Japan)
Inventor
  • Tsuchihashi, Reina
  • Orikasa, Hironori

Abstract

A copper powder containing copper particles, wherein the copper powder has a packed bulk density of 1.30 g/cm3 to 2.96 g/cm3, and wherein a 50% particle diameter D50 when a cumulative frequency is 50% in a volume-based particle diameter histogram of the copper particles, and a crystallite diameter D determined from a diffraction peak of a Cu (111) plane in an X-ray diffraction profile obtained by powder X-ray diffractometry of the copper powder using Scherrer's formula satisfies D/D50 ? 0.060.

IPC Classes  ?

  • B22F 1/00 - Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 9/24 - Making metallic powder or suspensions thereof; Apparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
  • C22C 9/00 - Alloys based on copper

68.

Copper alloy powder having Si coating film and method for producing same

      
Application Number 17771552
Grant Number 11872624
Status In Force
Filing Date 2021-06-25
First Publication Date 2022-11-17
Grant Date 2024-01-16
Owner JX METALS CORPORATION (Japan)
Inventor
  • Watanabe, Hirofumi
  • Shibuya, Yoshitaka

Abstract

Provided is a copper alloy powder which is a metal powder to be used for additive manufacturing by a laser beam system, and which is able to achieve a higher laser absorption rate and additionally suppress heat transfer through necking, and a method for producing this copper alloy powder. A copper alloy powder which contains one or more elements selected from among Cr, Zr and Nb in a total amount of 15 wt % or less, with a balance being made up of Cu and unavoidable impurities, and which is characterized in that a coating film containing Si atoms is formed on the copper alloy powder, and a Si concentration in the copper alloy powder with the coating film is 5 wt ppm or more and 700 wt ppm or less.

IPC Classes  ?

  • B22F 1/16 - Metallic particles coated with a non-metal
  • B22F 1/05 - Metallic powder characterised by the size or surface area of the particles

69.

METHOD FOR PROCESSING ELECTRICAL AND ELECTRONIC COMPONENT SCRAPS AND APPARATUS FOR PROCESSING ELECTRICAL AND ELECTRONIC COMPONENT SCRAPS

      
Document Number 03216141
Status Pending
Filing Date 2021-11-24
Open to Public Date 2022-10-27
Owner JX METALS CORPORATION (Japan)
Inventor
  • Aoki, Katsushi
  • Kawano, Hiroshi

Abstract

Provided is a method for processing electrical and electronic component scraps and an apparatus for processing electrical and electronic component scraps that can more efficiently sort out desired component scraps from electrical and electronic component scraps using an image recognition processing technique and a sorting device. A method for processing electrical and electronic component scraps including a sorting condition determining step S10 of determining a sorting condition of electrical and electronic component scraps. This step includes an image recognition processing step S12 of recognizing component scraps belonging to a specific component type from a plurality of captured image of the electrical and electronic component scraps including a plurality of component scraps by image recognition processing and acquiring image recognition information including information on a score representing a certainty of recognized component scraps, a detected area, and a number; a classification step S13 of creating classification information classifying the number of recognized component scraps by using the image recognition information; and a condition determining step S14 of determining a score threshold of the image recognition process and a detected area threshold of the component scraps based on the classification information and a processing capacity information of a sorting device sorting the component scraps.

IPC Classes  ?

  • B07C 5/34 - Sorting according to other particular properties
  • G01N 21/27 - Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands using photo-electric detection

70.

Raw material discharge device, method of processing of electronic/electrical device component scrap, and method of raw material discharge for electronic/electrical device component scrap

      
Application Number 17615994
Grant Number 11993464
Status In Force
Filing Date 2020-06-02
First Publication Date 2022-10-13
Grant Date 2024-05-28
Owner JX METALS CORPORATION (Japan)
Inventor Aoki, Katsushi

Abstract

Provided are a raw material discharge device, a method of processing an electronic and electrical device component scrap, and a raw material discharging method of an electronic and electrical device component scrap, which are capable of efficiently discharging the raw material having various shapes, specific gravities and shapes in each fixed amount. A raw material discharge device including: a storage unit 1 which stores a raw material and comprising a discharge port 11 at one end; a discharge unit 2 arranged at a bottom surface 15 of the storage unit 1, which conveys the raw material toward the discharge port 11 and discharges the raw material to an outside of the storage unit 1; an adjustment unit 3 including a plurality of struts 31 extending from above to below the discharge unit 2 and adjusting an amount of the raw material to be discharged by holding a part of the raw material with the struts 31; wherein a ratio (d1/d2) of a distance (d1) between a strut 31 closest to a side surface 13, 14 of the storage unit 1 and the side surface 13, 14 of the storage unit 1 to a narrowest distance (d2) between the struts 31 in a center portion of the storage unit 1, and a ratio (H1/H2) of a height of the strut 31 closest to the side surface 13, 14 of the storage unit 1 from a floor to a minimum height (H2) of a strut 31 which is other than the strut 31 closest to the side surface of the storage unit 1 from the floor are respectively adjustable so as to prevent clogging of the raw material being discharged to the outside of the storage unit 1.

IPC Classes  ?

  • B65G 47/19 - Arrangements or applications of hoppers or chutes having means for controlling material flow, e.g. to prevent overloading
  • B65G 15/42 - Belts or like endless load-carriers made of rubber or plastics having ribs, ridges, or other surface projections
  • B65G 47/08 - Devices for feeding articles or materials to conveyors for feeding articles from a single group of articles arranged in orderly pattern, e.g. workpieces in magazines spacing or grouping the articles during feeding
  • B65G 65/08 - Loading or unloading machines comprising essentially a conveyor for moving the loads associated with a device for picking-up the loads with reciprocating pick-up conveyors
  • B65G 65/40 - Devices for emptying otherwise than from the top

71.

Indium phosphide substrate, semiconductor epitaxial wafer, and method for producing indium phosphide substrate

      
Application Number 17289455
Grant Number 11788203
Status In Force
Filing Date 2020-06-04
First Publication Date 2022-10-06
Grant Date 2023-10-17
Owner JX METALS CORPORATION (Japan)
Inventor
  • Oka, Shunsuke
  • Kurita, Hideki
  • Suzuki, Kenji

Abstract

Provided is an indium phosphide substrate, a semiconductor epitaxial wafer, and a method for producing an indium phosphide substrate, which can satisfactorily suppress warpage of the back surface of the substrate. The indium phosphide substrate includes a main surface for forming an epitaxial crystal layer and a back surface opposite to the main surface, wherein the back surface has a SORI value of 2.5 μm or less, as measured with the back surface of the indium phosphide substrate facing upward.

IPC Classes  ?

  • B32B 3/00 - Layered products essentially comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products essentially having particular features of form
  • C30B 25/18 - Epitaxial-layer growth characterised by the substrate
  • C30B 29/40 - AIIIBV compounds
  • C30B 33/10 - Etching in solutions or melts
  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof

72.

Indium phosphide substrate, semiconductor epitaxial wafer, and method for producing indium phosphide substrate

      
Application Number 17289524
Grant Number 11894225
Status In Force
Filing Date 2020-06-04
First Publication Date 2022-09-29
Grant Date 2024-02-06
Owner JX METALS CORPORATION (Japan)
Inventor
  • Oka, Shunsuke
  • Kurita, Hideki
  • Suzuki, Kenji

Abstract

Provided is an indium phosphide substrate, a semiconductor epitaxial wafer, and a method for producing an indium phosphide substrate, which can satisfactorily suppress warpage of the back surface of the substrate. The indium phosphide substrate includes a main surface for forming an epitaxial crystal layer and a back surface opposite to the main surface, wherein the back surface has a BOW value of −2.0 to 2.0 μm, as measured with the back surface of the indium phosphide substrate facing upward.

IPC Classes  ?

  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • B28D 5/04 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor by tools other than of rotary type, e.g. reciprocating tools
  • C30B 25/18 - Epitaxial-layer growth characterised by the substrate
  • C30B 29/40 - AIIIBV compounds
  • C30B 33/10 - Etching in solutions or melts
  • H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds

73.

Indium phosphide substrate, semiconductor epitaxial wafer, and method for producing indium phosphide substrate

      
Application Number 17289491
Grant Number 11901170
Status In Force
Filing Date 2020-06-04
First Publication Date 2022-09-29
Grant Date 2024-02-13
Owner JX METALS CORPORATION (Japan)
Inventor
  • Oka, Shunsuke
  • Kurita, Hideki
  • Suzuki, Kenji

Abstract

Provided is an indium phosphide substrate, a semiconductor epitaxial wafer, and a method for producing an indium phosphide substrate, which can satisfactorily suppress warpage of the back surface of the substrate. The indium phosphide substrate includes a main surface for forming an epitaxial crystal layer and a back surface opposite to the main surface, wherein the back surface has a WARP value of 3.5 μm or less, as measured with the back surface of the indium phosphide substrate facing upward.

IPC Classes  ?

  • H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
  • B28D 5/04 - Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor by tools other than of rotary type, e.g. reciprocating tools
  • C30B 25/18 - Epitaxial-layer growth characterised by the substrate
  • C30B 29/40 - AIIIBV compounds
  • C30B 33/10 - Etching in solutions or melts
  • H01L 29/20 - Semiconductor bodies characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds

74.

IGZO sputtering target

      
Application Number 17563237
Grant Number 11827972
Status In Force
Filing Date 2021-12-28
First Publication Date 2022-07-14
Grant Date 2023-11-28
Owner JX Metals Corporation (Japan)
Inventor
  • Kuwana, Yuhei
  • Osada, Kozo
  • Kajiyama, Jun
  • Murai, Kazutaka

Abstract

An object of the present invention is to provide an IGZO sputtering target capable of improving uniformity for at least one property selected from the number of microcracks in the structure, the number of pores in the sintered body structure, and surface roughness. The IGZO sputtering target according to the present invention has an oxide sintered body, the oxide sintered body comprising indium (In), gallium (Ga), zinc (Zn) and unavoidable impurities, wherein, on a surface of the oxide sintered body, a lightness difference ΔL* satisfies ΔL*<3.0, in which the ΔL* is obtained by subtracting lightness Lc*at a central portion on the surface from lightness Le* at a position of 10 mm from an end portion to the central portion side on the surface, and wherein the oxide sintered body has a relative density of 97.0% or more.

IPC Classes  ?

  • C23C 14/34 - Sputtering
  • C04B 35/453 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on zinc, tin or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates

75.

Semiconductor wafer, radiation detection element, radiation detector, and production method for compound semiconductor monocrystalline substrate

      
Application Number 17439207
Grant Number 11967659
Status In Force
Filing Date 2019-12-05
First Publication Date 2022-06-23
Grant Date 2024-04-23
Owner JX METALS CORPORATION (Japan)
Inventor
  • Murakami, Koji
  • Noda, Akira
  • Hirano, Ryuichi

Abstract

8 Ωcm or less when a voltage of 900 V is applied, and wherein a ratio (variation ratio) of the resistivity at application of 0 V to the resistivity at application of a voltage of 900 V is 20% or less.

IPC Classes  ?

  • H01L 31/0296 - Inorganic materials including, apart from doping material or other impurities, only AIIBVI compounds, e.g. CdS, ZnS, HgCdTe
  • H01L 27/146 - Imager structures
  • H01L 31/08 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
  • H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
  • C30B 29/48 - AIIBVI compounds

76.

Sorting machine and method for treating electronic/electric device component scraps

      
Application Number 17598944
Grant Number 12023684
Status In Force
Filing Date 2020-03-27
First Publication Date 2022-06-16
Grant Date 2024-07-02
Owner JX METALS CORPORATION (Japan)
Inventor Aoki, Katsushi

Abstract

Provided is a sorting machine capable of more easily and efficiently sorting specific parts having a specific shape from raw materials containing various substances having different shapes, and a method for treating electronic and electric device component scraps using the sorting machine. The sorting machine includes a conveying device 1 having a conveying surface 13 which conveys raw materials containing substances having different shapes from a raw material inlet 11 to a receiving port 12; and a gate device 2 provided with a cylindrical roll portion 21 having a rotating function arranged at a certain distance d on the conveying surface to allow at least a part of the raw materials 100 to pass through to the receiving port 12.

IPC Classes  ?

  • B03C 1/23 - Magnetic separation acting directly on the substance being separated with material carried by travelling fields, e.g. generated by stationary magnetic coils; Eddy-current separators, e.g. sliding ramp
  • B03C 1/18 - Magnetic separation acting directly on the substance being separated with material carriers in the form of belts with magnets moving during operation

77.

Method for processing electronic/electrical device component scraps

      
Application Number 17598949
Grant Number 11819885
Status In Force
Filing Date 2020-03-27
First Publication Date 2022-06-09
Grant Date 2023-11-21
Owner JX METALS CORPORATION (Japan)
Inventor
  • Aoki, Katsushi
  • Sasaoka, Hidetoshi

Abstract

Provided is a method for processing electronic and electrical device component scraps, which can selectively recover a substrate scrap including a substance intended to be recovered. A method for processing electronic and electrical device component scraps, including separating a substrate with lead wires contained in the electronic and electrical device component scraps before sorting the electronic and electrical device component scraps by magnetic sorting.

IPC Classes  ?

  • B07B 9/00 - Combinations of apparatus for screening or sifting or for separating solids from solids using gas currents; General arrangement of plant, e.g. flow sheets
  • B03C 1/23 - Magnetic separation acting directly on the substance being separated with material carried by travelling fields, e.g. generated by stationary magnetic coils; Eddy-current separators, e.g. sliding ramp
  • B09B 3/35 - Shredding, crushing or cutting
  • B07B 4/08 - Separating solids from solids by subjecting their mixture to gas currents while the mixtures are supported by sieves, screens, or like mechanical elements
  • B09B 101/17 - Printed circuit boards [PCB]

78.

Method for processing electronic/electrical device component scraps

      
Application Number 17599226
Grant Number 12036582
Status In Force
Filing Date 2020-03-27
First Publication Date 2022-06-09
Grant Date 2024-07-16
Owner JX METALS CORPORATION (Japan)
Inventor
  • Aoki, Katsushi
  • Sasaoka, Hidetoshi
  • Takeda, Tsubasa

Abstract

Provided is a method for processing electronic and electrical device component scrap, which can improve an efficiency of sorting of raw materials fed to the smelting step from electronic and electrical device component scrap, and reduce losses of valuable metals. A method for processing electronic and electrical device component scrap which includes removing powdery objects contained in electronic and electrical device component scrap prior to a step of separating non-metal objects or metal objects from the electronic and electrical device component scrap containing the metal objects and the non-metal objects, using a metal sorter including: a metal sensor, a color camera, an air valve, and a conveyor.

IPC Classes  ?

  • B07C 5/36 - Sorting apparatus characterised by the means used for distribution
  • B03B 9/06 - General arrangement of separating plant, e.g. flow sheets specially adapted for refuse
  • B07C 5/342 - Sorting according to other particular properties according to optical properties, e.g. colour
  • B09B 3/35 - Shredding, crushing or cutting

79.

Niobium sputtering target

      
Application Number 17439123
Grant Number 12020916
Status In Force
Filing Date 2020-01-28
First Publication Date 2022-05-19
Grant Date 2024-06-25
Owner JX Metals Corpo tion (Japan)
Inventor
  • Yamada, Yuki
  • Nagatsu, Kotaro

Abstract

Provided is a niobium sputtering target having improved film thickness uniformity throughout the target life. the rate of change=[maximum value−minimum value]/minimum value  Equation (2).

IPC Classes  ?

  • C23C 14/34 - Sputtering
  • H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering

80.

Semiconductor wafer, radiation detection element, radiation detector, and production method for compound semiconductor monocrystalline substrate

      
Application Number 17439307
Grant Number 12021160
Status In Force
Filing Date 2019-12-05
First Publication Date 2022-05-19
Grant Date 2024-06-25
Owner JX METALS CORPORATION (Japan)
Inventor
  • Murakami, Koji
  • Noda, Akira
  • Hirano, Ryuichi

Abstract

8 Ωcm or less, and wherein a relative variation coefficient of each resistivity to the applied voltages in a range of from 0 to 900 V is 100% or less.

IPC Classes  ?

  • H01L 31/0296 - Inorganic materials including, apart from doping material or other impurities, only AIIBVI compounds, e.g. CdS, ZnS, HgCdTe
  • C30B 11/02 - Single-crystal-growth by normal freezing or freezing under temperature gradient, e.g. Bridgman- Stockbarger method without using solvents
  • C30B 29/48 - AIIBVI compounds
  • C30B 33/02 - Heat treatment
  • G01T 1/24 - Measuring radiation intensity with semiconductor detectors
  • H01L 27/144 - Devices controlled by radiation

81.

Semiconductor material, infrared light receiving element and method for producing semiconductor material

      
Application Number 17293403
Grant Number 11935974
Status In Force
Filing Date 2019-05-23
First Publication Date 2022-01-13
Grant Date 2024-03-19
Owner
  • IBARAKI UNIVERSITY (Japan)
  • JX METALS CORPORATION (Japan)
Inventor
  • Udono, Haruhiko
  • Asahi, Toshiaki

Abstract

2Sn.

IPC Classes  ?

  • H01L 31/032 - Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups
  • C30B 29/52 - Alloys
  • H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof

82.

Titanium copper foil, extended copper article, electronic device component, and auto-focus camera module

      
Application Number 17291706
Grant Number 12000029
Status In Force
Filing Date 2019-08-20
First Publication Date 2022-01-06
Grant Date 2024-06-04
Owner JX Metals Corporation (Japan)
Inventor Tsujie, Kenta

Abstract

in which the β{220}, the β{200}, and the β{311} represent half-value widths of X-ray diffraction peaks at a {220} crystal plane, a {200} crystal plane, and a {311} crystal plane, respectively.

IPC Classes  ?

  • C22C 9/00 - Alloys based on copper
  • C22F 1/08 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
  • G02B 7/09 - Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification adapted for automatic focusing or varying magnification
  • G03B 13/36 - Autofocus systems

83.

Apparatus for analyzing composition of electronic and electrical device part scraps, device for processing electronic and electrical device part scraps, and method for processing electronic and electrical device part scraps

      
Application Number 17290167
Grant Number 12026867
Status In Force
Filing Date 2019-10-30
First Publication Date 2022-01-06
Grant Date 2024-07-02
Owner JX METALS CORPORATION (Japan)
Inventor
  • Goda, Tomonari
  • Kawamura, Toshifumi

Abstract

Provided is an apparatus for analyzing composition of electronic and electrical device part scraps which can determine a composition of part scraps in the electronic and electrical device part scraps in a short time, a device for processing electronic and electrical device part scraps, and a method for processing electronic and electrical device part scraps using those devices. An apparatus for analyzing a composition of electronic and electrical device part scraps including a classification data storage means for storing a classification data for extracting images of a plurality of component types of electronic and electrical device part scraps from a captured image of electronic and electrical device part scraps composed of the plurality of component types and classifying extracted images into each of the plurality of component types, a classification means for classifying the extracted images into each of the plurality of component types extracted from the captured image of the electronic and electrical device part scraps according to the classification data, and analysis means for analyzing at least one of an area, a number, an average particle size, and weight ratio of each of the plurality of component types classified by the classification means.

IPC Classes  ?

  • G06T 7/00 - Image analysis
  • G06T 7/62 - Analysis of geometric attributes of area, perimeter, diameter or volume

84.

COPPER ALLOY POWDER HAVING SI COATING FILM AND METHOD FOR PRODUCING SAME

      
Document Number 03158633
Status In Force
Filing Date 2021-06-25
Open to Public Date 2021-12-30
Grant Date 2023-12-19
Owner JX METALS CORPORATION (Japan)
Inventor
  • Watanabe, Hirofumi
  • Shibuya, Yoshitaka

Abstract

[Problem] To provide: a copper alloy powder which is a metal powder to be used for deposition modeling by a laser beam system, and which achieves a higher laser absorption rate, while being able to be suppressed in heat transfer through necking; and a method for producing this copper alloy powder. [Solution] A copper alloy powder which contains one or more elements selected from among Cr, Zr and Nb in a total amount of 15 wt% or less, with the balance being made up of Cu and unavoidable impurities, and which is characterized in that: a coating film containing Si atoms is formed on the copper alloy powder; and the Si concentration in the copper alloy powder with the coating film is from 5 wt ppm to 700 wt ppm.

IPC Classes  ?

  • B22F 1/16 - Metallic particles coated with a non-metal
  • B33Y 70/00 - Materials specially adapted for additive manufacturing
  • B22F 10/28 - Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
  • B22F 1/145 - Chemical treatment, e.g. passivation or decarburisation
  • C22C 9/00 - Alloys based on copper
  • C01B 33/02 - Silicon

85.

Rolled copper foil for lithium ion battery current collector, and lithium ion battery

      
Application Number 17289622
Grant Number 11984606
Status In Force
Filing Date 2019-08-22
First Publication Date 2021-12-23
Grant Date 2024-05-14
Owner JX Metals Corporation (Japan)
Inventor Kudo, Katsuhiro

Abstract

Provided is a rolled copper foil for a lithium ion battery current collector, which has good adhesion to a negative electrode active material, generates less metal powder during ultrasonic welding, and has a rust prevention property. In the rolled copper foil for a lithium ion battery current collector, a surface of the copper foil has a BTA film, the BTA film has a thickness of 0.6 nm or more and 4.6 nm or less, and the rolled copper foil satisfies the following relationships: 40≤wet tension [mN]/m]+thickness of BTA film [nm]×10≤80; 0.01≤arithmetic average roughness Ra [μm]≤0.25; and wet tension [mN/m]≥35.

IPC Classes  ?

  • H01M 4/66 - Selection of materials
  • B21B 1/40 - Metal rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling foils which present special problems, e.g. because of thinness
  • B21B 3/00 - Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences
  • H01M 4/02 - Electrodes composed of, or comprising, active material
  • H01M 10/0525 - Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries

86.

Easily-crushable copper powder and manufacturing method therefor

      
Application Number 17278096
Grant Number 11920215
Status In Force
Filing Date 2019-07-24
First Publication Date 2021-11-11
Grant Date 2024-03-05
Owner JX Metals Corporation (Japan)
Inventor Furusawa, Hideki

Abstract

Provided is a copper powder manufactured by means of a wet method, wherein the absolute value of the zeta potential of the copper powder is at least 20 mV. The copper powder can be manufactured so as to reduce the burden of the steps of crushing a dry cake and classification, and there is a sufficient reduction in residual secondary particles.

IPC Classes  ?

  • C22C 1/04 - Making non-ferrous alloys by powder metallurgy
  • B22F 1/145 - Chemical treatment, e.g. passivation or decarburisation
  • B22F 1/10 - Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
  • B22F 1/14 - Treatment of metallic powder
  • B22F 1/06 - Metallic powder characterised by the shape of the particles
  • B22F 1/102 - Metallic powder coated with organic material

87.

METHOD FOR PRODUCING MIXED METAL SOLUTION AND METHOD FOR PRODUCING MIXED METAL SALT

      
Document Number 03173296
Status Pending
Filing Date 2021-04-22
Open to Public Date 2021-10-28
Owner JX METALS CORPORATION (Japan)
Inventor
  • Arakawa, Junichi
  • Tajiri, Kazunori

Abstract

A method for producing a mixed metal solution containing manganese ions and at least one of cobalt ions and nickel ions, the method including: an Al removal step of subjecting an acidic solution containing at least manganese ions and aluminum ions, and at least one of cobalt ions and nickel ions, to removal of the aluminum ions by extracting the aluminum ions into a solvent while leaving at least a part of the manganese ions in the acidic solution in an aqueous phase, the acidic solution being obtained by subjecting battery powder of lithium ion batteries to a leaching step; and a metal extraction step of bringing an extracted residual liquid obtained in the Al removal step to an equilibrium pH of 6.5 to 7.5 using a solvent containing a carboxylic acid-based extracting agent, extracting at least one of the manganese ions and at least one of the cobalt ions and the nickel ions into the solvent, and then back-extracting the manganese ions and at least one of the cobalt ions and nickel ions.

IPC Classes  ?

  • B01D 9/02 - Crystallisation from solutions
  • B01D 11/04 - Solvent extraction of solutions which are liquid
  • B09B 3/00 - Destroying solid waste or transforming solid waste into something useful or harmless
  • B09B 5/00 - Operations not covered by a single other subclass or by a single other group in this subclass
  • C22B 3/26 - Treatment or purification of solutions, e.g. obtained by leaching by liquid-liquid extraction using organic compounds
  • C22B 3/32 - Carboxylic acids
  • C22B 3/44 - Treatment or purification of solutions, e.g. obtained by leaching by chemical processes
  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • C22B 23/00 - Obtaining nickel or cobalt
  • C22B 47/00 - Obtaining manganese
  • H01M 10/24 - Alkaline accumulators

88.

Stannous oxide powder

      
Application Number 16494021
Grant Number 11772981
Status In Force
Filing Date 2019-04-11
First Publication Date 2021-10-28
Grant Date 2023-10-03
Owner JX Metals Corporation (Japan)
Inventor Takemoto, Koichi

Abstract

2/g; a TAP density is from 2 to 4 g/cm; a 50% particle diameter is from 30 to 60 μm; and an angle of repose is from 10 to 33°.

IPC Classes  ?

89.

Corrosion resistant CuZn alloy

      
Application Number 16346349
Grant Number 12006563
Status In Force
Filing Date 2018-09-25
First Publication Date 2021-10-14
Grant Date 2024-06-11
Owner JX Metals Corporation (Japan)
Inventor Takahata, Masahiro

Abstract

2 or less based on optical microscopic observation.

IPC Classes  ?

  • C22C 9/04 - Alloys based on copper with zinc as the next major constituent
  • C21D 8/06 - Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of rods or wires
  • C22C 1/02 - Making non-ferrous alloys by melting
  • C22F 1/00 - Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

90.

Sputtering target and method for manufacturing a sputtering target

      
Application Number 17212337
Grant Number 11851748
Status In Force
Filing Date 2021-03-25
First Publication Date 2021-09-30
Grant Date 2023-12-26
Owner JX Metals Corporation (Japan)
Inventor Kajiyama, Jun

Abstract

Provided a sputtering target and a method for manufacturing the sputtering target, in which a penetration of impurities into the target material during bonding is suppressed A sputtering target, wherein an intensity ratio (B/A) of a minimum reflection intensity B to a maximum reflection intensity A of a back surface wave of a target material as measured by a water immersion ultrasonic flaw detection inspection after bonding the target material is 0.70 or more, and wherein a water absorption rate of the target material determined by a relationship of a weight change rate (100×(a−b)/b) is 0.01% to 1.0%, where (a) is a weight after immersion as measured after immersing the target material in water for 10 hours and removing the water on a surface, and (b) is a dry weight of the target material before the immersion.

IPC Classes  ?

91.

Sputtering target, magnetic film and method for producing magnetic film

      
Application Number 16470588
Grant Number 11821076
Status In Force
Filing Date 2018-09-11
First Publication Date 2021-06-10
Grant Date 2023-11-21
Owner JX Metals Corporation (Japan)
Inventor
  • Masuda, Manami
  • Shimizu, Masayoshi
  • Shimojyuku, Akira

Abstract

Provided is a sputtering target that can form a magnetic film having both good magnetic separation between magnetic grains and high coercive force at the same time; a magnetic film; and a method for producing a magnetic film. The sputtering target according to the present invention comprises: 1 at. % or more of Zn, a part or all of Zn forming a complex oxide(s) of Zn—Ti—O and/or Zn—Si—O; and 45 at. % or less of Pt, the balance being Co and inevitable impurities, the atomic percentage being based on an atomic ratio.

IPC Classes  ?

92.

Multi-shank heater

      
Application Number 17051346
Grant Number 11838998
Status In Force
Filing Date 2019-10-29
First Publication Date 2021-03-04
Grant Date 2023-12-05
Owner JX Metals Corporation (Japan)
Inventor
  • Narita, Satoyasu
  • Takamura, Hiroshi

Abstract

Provided is a multi-shank heater to be mounted on a support substrate, wherein, with a normal direction relative to the support substrate, which is a direction from the heater side toward the support substrate side, as a basis, the multi-shank heater has U-shaped pieces in which an angle θ of a planar direction of the U-shaped pieces, which is a direction from the heater side toward the support substrate side, is ±10° or more and ±60° or less. An object of the present invention is to provide a multi-shank heater capable of considerably improving the energy output even when the U-shaped pieces are arranged in a high density and have the same pitch.

IPC Classes  ?

  • H05B 3/64 - Heating elements specially adapted for furnaces using ribbon, rod, or wire heater
  • H05B 3/12 - Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material

93.

Stannous oxide powder

      
Application Number 16978439
Grant Number 11981581
Status In Force
Filing Date 2018-12-06
First Publication Date 2021-02-18
Grant Date 2024-05-14
Owner JX Metals Corporation (Japan)
Inventor
  • Takemoto, Koichi
  • Imori, Toru

Abstract

2/g, a D50 particle size of 20 to 60 μm, and a half width of the particle size distribution of 5 to 30 μm.

IPC Classes  ?

  • C01G 19/02 - Oxides
  • C25D 3/32 - Electroplating; Baths therefor from solutions of tin characterised by the organic bath constituents used

94.

Production method of additive manufactured object using pure copper powder having Si coating

      
Application Number 16978822
Grant Number 11872647
Status In Force
Filing Date 2019-12-26
First Publication Date 2021-02-11
Grant Date 2024-01-16
Owner JX METALS CORPORATION (Japan)
Inventor
  • Watanabe, Hirofumi
  • Yamamoto, Hiroyoshi
  • Shibuya, Yoshitaka
  • Sato, Kenji
  • Morioka, Satoru
  • Chiba, Akihiko
  • Aoyagi, Kenta

Abstract

A production method of an additive manufactured object is provided. The method is an EB-based additive manufacturing method of spreading a pure copper powder, preheating the pure copper powder and thereafter partially melting the pure copper powder by scanning the pure copper powder with an electron beam, solidifying the pure copper powder to form a first layer, newly spreading a pure copper powder on the first layer, preheating the pure copper powder and thereafter partially melting the pure copper powder by scanning the pure copper powder with an electron beam, solidifying the pure copper powder to form a second layer, and repeating the foregoing process to add layers. The pure copper powder is a pure copper powder with a Si coating formed thereon, and the preheating temperature is set to be 400° C. or higher and less than 800° C.

IPC Classes  ?

  • B23K 15/00 - Electron-beam welding or cutting
  • B33Y 10/00 - Processes of additive manufacturing
  • B33Y 70/10 - Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
  • B22F 1/05 - Metallic powder characterised by the size or surface area of the particles
  • B22F 1/16 - Metallic particles coated with a non-metal
  • B22F 10/34 - Process control of powder characteristics, e.g. density, oxidation or flowability
  • B22F 10/36 - Process control of energy beam parameters
  • B22F 1/00 - Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
  • B22F 10/25 - Direct deposition of metal particles, e.g. direct metal deposition [DMD] or laser engineered net shaping [LENS]
  • B22F 10/28 - Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]

95.

Method for recovering Cu and method of preparing electrolytic copper

      
Application Number 16640814
Grant Number 11946116
Status In Force
Filing Date 2018-12-27
First Publication Date 2021-02-04
Grant Date 2024-04-02
Owner JX METALS CORPORATION (Japan)
Inventor Fukano, Yuken

Abstract

Providing a method of recovering Cu from copper ore containing Hg. A method for recovering Cu from copper ore, the method comprising: (A) providing copper ore containing Hg with an amount of 0.2 ppm or more; (B) treating the copper ore to leach Cu and Hg with use of solution containing iodide ions and Fe (3+); and (C) treating post-leaching solution with activated carbon to absorb the iodide ions and Hg.

IPC Classes  ?

96.

Negative thermal expansion material and production method thereof

      
Application Number 17040114
Grant Number 11905175
Status In Force
Filing Date 2020-01-28
First Publication Date 2021-01-28
Grant Date 2024-02-20
Owner JX METALS CORPORATION (Japan)
Inventor
  • Yamazaki, Yoshiki
  • Muneyasu, Kei
  • Mikami, Makoto

Abstract

BG>15. An object of the present invention is to provide a negative thermal expansion material having a low specific gravity, and a negative thermal expansion material having a low Ba content.

IPC Classes  ?

97.

Method of synthesizing molybdenum oxychloride by reacting molybdenum oxide powder and chlorine gas and growing crystals of molybdenum oxychloride from the gaseous raw material

      
Application Number 16955547
Grant Number 11939231
Status In Force
Filing Date 2019-04-12
First Publication Date 2021-01-14
Grant Date 2024-03-26
Owner JX METALS CORPORATION (Japan)
Inventor Takahashi, Hideyuki

Abstract

Provided is a method of producing a high purity molybdenum oxychloride by including means of sublimating and reaggregating a raw material molybdenum oxychloride in a reduced-pressure atmosphere, or means of retaining a gaseous raw material molybdenum oxychloride, which was synthesized in a vapor phase, in a certain temperature range, and thereby growing crystals to obtain a higher purity molybdenum oxychloride having a high bulk density and high hygroscopicity resistance.

IPC Classes  ?

  • C30B 25/16 - Controlling or regulating
  • C01G 39/00 - Compounds of molybdenum
  • C30B 23/00 - Single-crystal growth by condensing evaporated or sublimed materials
  • C30B 23/06 - Heating of the deposition chamber, the substrate, or the materials to be evaporated
  • C23C 16/455 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes characterised by the method of coating characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber

98.

RAW MATERIAL DISCHARGE DEVICE, METHOD OF PROCESSING OF ELECTRONIC/ELECTRICAL DEVICE COMPONENT SCRAP, AND METHOD OF RAW MATERIAL DISCHARGE FOR ELECTRONIC/ELECTRICAL DEVICE COMPONENT SCRAP

      
Document Number 03142590
Status Pending
Filing Date 2020-06-02
Open to Public Date 2020-12-10
Owner JX METALS CORPORATION (Japan)
Inventor Aoki,katsushi

Abstract

Provided are a raw material discharge device, a method of processing of electronic/electrical device component scrap, and a method of raw material discharge for electronic/electrical device component scrap enabling efficient discharge of respective predetermined amounts of a raw material in which raw materials of a variety of shapes, specific gravities, and shapes are mixed together. The invention is a raw material discharge device 100 that is provided with: a storage unit 1 that is provided, at one end, with a discharge port 11 for discharging raw material, and that stores the raw material; a discharge unit 2 that is arranged on a bottom surface 15 of the storage uni1, that transports the raw material toward the discharge port 11, and that discharges same to the outside of the storage unit 1; and an adjustment unit 3 that is provided with a plurality of struts 31 that extend from above to below the discharge unit 2, and that suppresses some of the raw material with the struts 31 to adjust the amount of raw material that is discharged to the outside of the storage unit 1. The device is able to adjust: a ratio (d1/d2) of an interval (d1) between a strut 31 closest to a side surface 13, 14 of the storage unit 1 and the side surface 13, 14 of the storage unit 1, and an interval (d2) that is narrowest of the intervals between struts 31 of a center part of the storage unit 1, as well as a ratio (H1/H2) of a height (H1) from the floor of the strut 31 closest to the side surface 13, 14 of the storage unit 1 and a smallest height (H2) from the floor of a strut 31 other than the strut 31 closest to the side surface of the storage unit 1, so as to prevent clogging of the raw material being discharged to the outside of the storage unit.

IPC Classes  ?

  • B09B 5/00 - Operations not covered by a single other subclass or by a single other group in this subclass
  • B65G 65/44 - Devices for emptying otherwise than from the top using reciprocating conveyors, e.g. jigging conveyors
  • C22B 7/00 - Working-up raw materials other than ores, e.g. scrap, to produce non-ferrous metals or compounds thereof
  • C22B 15/00 - Obtaining copper

99.

Potassium sodium niobate sputtering target and production method thereof

      
Application Number 16956056
Grant Number 11851747
Status In Force
Filing Date 2019-02-15
First Publication Date 2020-11-26
Grant Date 2023-12-26
Owner JX METALS CORPORATION (Japan)
Inventor
  • Sakashita, Ryosuke
  • Takamura, Hiroshi
  • Nara, Atsushi
  • Suzuki, Ryo

Abstract

2. The present invention aims to provide a high density potassium sodium niobate sputtering target capable of industrially depositing potassium sodium niobate films via the sputtering method.

IPC Classes  ?

  • C23C 14/34 - Sputtering
  • C01G 33/00 - Compounds of niobium
  • H01J 37/34 - Gas-filled discharge tubes operating with cathodic sputtering
  • C04B 35/495 - Shaped ceramic products characterised by their composition; Ceramic compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxides based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates

100.

Tungsten sputtering target and method for manufacturing the same

      
Application Number 16758589
Grant Number 11939661
Status In Force
Filing Date 2018-09-07
First Publication Date 2020-11-26
Grant Date 2024-03-26
Owner JX Metals Corporation (Japan)
Inventor
  • Sogawa, Shinji
  • Dasai, Takafumi
  • Nakasumi, Seiji

Abstract

According to one of various aspects of the present invention, a tungsten sputtering target has a purity of tungsten is 5 N (99.999% by weight) or more, and an impurity of carbon and an impurity of oxygen contained in tungsten are 50 ppm by weight or less, respectively, and an average grain size of tungsten crystal is more than 100 μm.

IPC Classes  ?

  • C23C 14/34 - Sputtering
  • B22F 3/15 - Hot isostatic pressing
  • B22F 3/18 - Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor by using pressure rollers
  • C22C 27/04 - Alloys based on tungsten or molybdenum
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