A support for use in a weighing device, the support comprising: a support part for supporting an object during a weight measurement; a mounting part for mounting the support on a weighing device; a thermal break provided between the support part and the mounting part; and an electrically conductive part or electrostatically dissipative part provided around at least part of the thermal break,
Apparatus for determining information relating to the weight or mass of a wafer, the apparatus comprising: a support configured to support the wafer, wherein the support is configured to shield charges on the wafer from above the wafer and from below the wafer; a counterweight arranged to counterbalance at least part of the weight of the support; and a measurement device arranged to generate measurement output indicative of a difference between the combined weight of the support and the wafer supported by the support and a weight counterbalanced by the counterweight.
Apparatus for handling a wafer, comprising: a support for supporting a wafer; an end effector for placing the wafer onto the support or for picking the wafer up from the support; and an actuator for moving the end effector in a vertical direction to place the wafer onto the support or to pick the wafer up from the support, wherein the end effector comprises a sensor, the apparatus is configured to detect an event when placing the wafer onto the support or when picking the wafer up from the support based at least in part on an output of the sensor, and the apparatus is configured to obtain positional information from the actuator when the event is detected.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
A device for changing the temperature of a wafer, the device comprising: a surface that is configured to support the wafer and to exchange heat with the wafer; wherein the surface is patterned or textured to reduce a contact area between the surface and a wafer supported by the surface.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
5.
APPARATUS FOR MEASURING THE MASS AND/OR THE CHANGE IN MASS OF AN OBJECT
G01G 7/02 - Weighing apparatus wherein the balancing is effected by magnetic, electromagnetic, or electrostatic action, or by means not provided for in groups by electromagnetic action
The invention provides a metrology apparatus. The metrology apparatus comprises a mass metrology station for measuring a mass and/or a change in mass of a wafer, and a spectral imaging system for performing spectral imaging of at least part of a wafer.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
G01B 11/06 - Measuring arrangements characterised by the use of optical techniques for measuring length, width, or thickness for measuring thickness
An apparatus for measuring the mass and/or the change in mass of an object, comprising: a load cell; and a magnetic shield that is configured to at least partially magnetically shield at least part of the load cell.
An apparatus for measuring the weight or mass of an object, comprising: a support for supporting the object during a weight or mass measurement; and a load cell; wherein the support is electrically isolated from at least part of the load cell; and wherein the support is electrically connected to ground.
G01G 7/06 - Weighing apparatus wherein the balancing is effected by magnetic, electromagnetic, or electrostatic action, or by means not provided for in groups by electrostatic action
G01G 21/22 - Weigh-pans or other weighing receptaclesWeighing platforms
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
Device comprising: a surface for supporting a wafer; a gas inlet in the surface; a plurality of suction devices for gripping the wafer above the surface and drawing or pulling the wafer towards the surface; a shared vacuum line in fluid communication with the gas inlet in the surface and the plurality of suction devices; and a flow restrictor in a flow path between the shared vacuum line and the gas inlet in the surface.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/687 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
B23B 31/30 - Chucks characterised by features relating primarily to remote control of the gripping means using fluid-pressure means in the chuck
A support for a weighing device, the support comprising : a support part for supporting an object during a weight measurement; and a mounting part for mounting the support on a weighing device; wherein the support part and the mounting part are electrically connected by a component having an electrical resistance greater than or equal to 100 kΩ and less than or equal to 10 MΩ.
G01G 21/22 - Weigh-pans or other weighing receptaclesWeighing platforms
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
An apparatus comprising: a measurement chamber, wherein the measurement chamber has a removable lid; and a plurality of wafer support elements for supporting a wafer from beneath, wherein the plurality of wafer support elements are provided on the lid.
G01G 19/00 - Weighing apparatus or methods adapted for special purposes not provided for in groups
G01G 23/00 - Auxiliary devices for weighing apparatus
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/66 - Testing or measuring during manufacture or treatment
A weighing device for performing a weight measurement on a semiconductor wafer having a specific diameter, the weighing device comprising a weighing pan for supporting the wafer during the weight measurement, wherein: the weighing pan is grounded; and the weighing pan is configured to extend over at least 25% of an area of a surface of the wafer that faces the weighing pan.
G01G 19/00 - Weighing apparatus or methods adapted for special purposes not provided for in groups
G01G 21/22 - Weigh-pans or other weighing receptaclesWeighing platforms
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
G01G 23/00 - Auxiliary devices for weighing apparatus
A device for changing the temperature of a wafer, the device comprising : a surface that is configured to support the wafer and to exchange heat with the wafer, and a space that is configured to receive at least a distal part of an end effector, which is used to support the wafer from beneath, when the end effector is used to lower the wafer onto the surface, wherein the space extends from or to a side of the device; and wherein the space is configured so that the at least a distal part of the end effector can be withdrawn from the space from the side of the device.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
An apparatus comprising: a weighing device for generating measurement output indicative of the weight of an object loaded on the weighing device; and a disturbance element for temporarily disturbing the measurement output of the weighing device while the object is loaded on the weighing device.
G01G 7/02 - Weighing apparatus wherein the balancing is effected by magnetic, electromagnetic, or electrostatic action, or by means not provided for in groups by electromagnetic action
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
15.
METHOD OF USING SENSOR-BASED MACHINE LEARNING TO COMPENSATE ERROR IN MASS METROLOGY
Computer-implemented methods and systems of determining systematic error in a mass measurement of a substrate are disclosed. The methods involve providing sensor readings to a machine learning model as inputs and receiving as an output a value for systematic error and/or a corrected mass measurement. The machine learning model may be continuously checked during production and retrained or replaced based on data collected during production.
A semiconductor wafer mass metrology method comprising: controlling the temperature of a semiconductor waferby: detecting information relating to the temperature of the semiconductor wafer; and controlling cooling or heating of the semiconductor wafer based on the detected information relating to the temperature of the semiconductor wafer; wherein controlling the cooling or heating of the semiconductor wafer comprises controlling a duration of the cooling or heating of the semiconductor wafer; and subsequently loading the semiconductor wafer onto a measurement area of a semiconductor wafer mass metrology apparatus.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
17.
SEMICONDUCTOR WAFER MASS METROLOGY APPARATUS AND SEMICONDUCTOR WAFER MASS METROLOGY METHOD
A semiconductor wafer mass metrology apparatus comprising:a measurement chamber for measuring the weight and/or the mass of a semiconductor wafer;a first temperature changing part for changing a temperature of the semiconductor wafer before the semiconductor wafer is transported into the measurement chamber; and a first temperature sensor for sensing a first temperature, wherein the first temperature is:a temperature of the first temperature changing part; or a temperature of the semiconductor wafer when the semiconductor wafer is on the first temperature changing part,or when the semiconductor wafer leaves the first temperature changing part.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A semiconductor wafer weighing apparatus comprises: a weight force measuring device for measuring a weight force of a semiconductor wafer; and control means configured to control an operation of the apparatus based on detection of acceleration of the apparatus or of a semiconductor wafer loaded on the apparatus by a detector for detecting acceleration of the apparatus or of a semiconductor wafer loaded on the apparatus; wherein: the control means is arranged to determine an error in the output of the weight force measuring device caused by an acceleration of the apparatus or of a semiconductor wafer loaded on the apparatus, using a predetermined relationship that matches the error in the output of the weight force measuring device to acceleration of the apparatus or of a semiconductor wafer loaded on the apparatus for different accelerations of the apparatus or of a semiconductor wafer loaded on the apparatus.
G01G 17/00 - Apparatus for, or methods of, weighing material of special form or property
G01G 23/10 - Means for damping oscillations, e.g. of weigh-beams by electric or magnetic means
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
20.
SEMICONDUCTOR WAFER PROCESSING METHODS AND APPARATUS
A semiconductor wafer processing method comprising controlling the temperature of a semiconductor wafer to be within a predetermined processing temperature range by: causing a first temperature change of the semiconductor wafer using a first temperature changing unit; and subsequently causing a second temperature change using a second temperature changing unit; wherein the first change is greater than the second change; and subsequently loading the semiconductor wafer on a processing area of a semiconductor wafer processing apparatus. Also, a semiconductor wafer processing method comprising controlling the temperature of a semiconductor wafer to be within a predetermined processing temperature range by causing a temperature change of the semiconductor wafer using a temperature changing unit; transporting the semiconductor wafer from the temperature changing unit to a processing area of a semiconductor wafer processing apparatus; and controlling the temperature of the semiconductor wafer during the transporting step.
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
21.
METHOD AND DEVICE FOR DETERMINING INFORMATION RELATING TO THE MASS OF A SEMICONDUCTOR WAFER
A method of determining information relating to the mass of a semiconductor wafer is disclosed. The method comprises loading the semiconductor wafer on to a measurement area of a weighing device having weight compensation means arranged to compensate for a predetermined weight loaded on to the measurement area; generating measurement output indicative of a difference between the weight of the semiconductor wafer and the predetermined weight; and using the measurement output to determine information relating to the mass of the semiconductor wafer. Also discloses is a corresponding weighing device for determining information relating to the mass of a semiconductor wafer.
09 - Scientific and electric apparatus and instruments
Goods & Services
Measuring apparatus for measuring semiconductor wafer mass and mass changes occurring in the semiconductor manufacturing process, for use in the semiconductor manufacturing industry
A method and apparatus for extracting the contents (39) of voids (13) and/or pores present in a semiconductor device to obtain information indicative of the nature of the voids and/or pores, e.g. to assist with metrology measurements. The method includes heating the semiconductor wafer to expel the contents of the voids and/or pores, collecting the expelled material (41) in a collector, and measuring a consequential change in mass of the semiconductor wafer (29) and/or the collector (37), to extract information indicative of the nature of the voids. This information may include information relating to the distribution of the voids and/or pores, and/or the sizes of the voids and/or pores, and/or the chemical contents of the voids and/or pores. The collector may include a condenser having a temperature-controlled surface (e.g. in thermal communication with a refrigeration unit) for condensing the expelled material.
G01N 5/02 - Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid by absorbing or adsorbing components of a material and determining change of weight of the adsorbent, e.g. determining moisture content
H01L 21/66 - Testing or measuring during manufacture or treatment
G01N 5/04 - Analysing materials by weighing, e.g. weighing small particles separated from a gas or liquid by removing a component, e.g. by evaporation, and weighing the remainder
24.
SEMICONDUCTOR WAFER MONITORING APPARATUS AND METHOD
Metrology methods and apparatus for semiconductor wafer fabrication in which data for metrology is obtained by detecting a measurable property of a monitored entity, which is either (i) a wafer transporter (e.g. a FOUP) loaded with one or more wafers to be monitored, or (ii) a plurality of wafers. Performing metrology measurements on a loaded wafer transporter enables the step of extracting wafer (s) from the transporter for metrology measurements to be omitted. Moreover, metrology measurement may be obtained while transporting the wafer (s) between treatment locations. By considering a plurality of wafers as a unit, a single measurement representing a combination of individual wafer responses is obtained. All wafers contribute to the metrology measurement without the need to perform individual wafer measurements.
A semiconductor wafer fabrication metrology method in which process steps are characterised by a change in wafer mass, whereby during fabrication mass is used as a measurable parameter to implement statistical process control on the one or more of process steps. In one aspect, the shape of a measured mass distribution is compared with the shape of a predetermined characteristic mass distribution to monitor the process. An determined empirical relationship between a control variable of the process and the characteristic mass change may enable differences between the measured mass distribution and characteristic mass distribution to provide information about the control variable. In another aspect, the relative position of an individual measured wafer mass change in a current distribution provides information about individual wafer problems independently from general process problems.
A semiconductor wafer metrology technique comprising performing atmospheric buoyancy compensated weighing of a wafer, in which the wafer is weighed in a substantially upright condition. A vertical or near vertical wafer orientation causes the surface area in the direction of a force (weight) sensor to be reduced compared with a horizontal wafer orientation. Hence, the electrostatic force components acting in the same direction as the wafer weight force component is reduced.
A semiconductor wafer metrology technique which corrects for the effect of electrostatic forces on an atmospheric buoyancy compensated weight force measurement of a semiconductor wafer. In one aspect a wafer is weighed in a faraday cage whose is measured independently. A change in the measured weight of the faraday cage can be used to correct the measure weight of the wafer. In another aspect a direct electrostatic measurement can be converted into a weight correction using a predetermined correlation between an electrostatic charge measured by the charge meter and a weight error force. In another aspect the electrostatic measurement may be indirect, e.g. derived from varying the distance between the wafer and a grounded plate parallel to the wafer to effect a change in an electrostatic force between the grounded plate and the wafer.
G01G 9/00 - Methods of, or apparatus for, the determination of weight, not provided for in groups
G01G 23/00 - Auxiliary devices for weighing apparatus
G01G 23/01 - Testing or calibrating of weighing apparatus
G01G 23/16 - Devices for determining tare weight or for cancelling out the tare by zeroising, e.g. mechanically operated electrically or magnetically operated
G01G 21/22 - Weigh-pans or other weighing receptaclesWeighing platforms
H01L 21/00 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid-state devices, or of parts thereof
Measuring apparatus and method for monitoring fabrication of a semiconductor wafer by exciting and measuring vibrations of the wafer substrate. A measurable parameter of vibration (e.g. frequency) is indicative of mass of a vibrating region. Mass change caused by wafer treatment is reflected in changes in vibration measurements taken before and after that treatment. The apparatus includes a wafer support e.g. projecting ledge (19), a vibration exciting device e.g. contact probe (28) or pressure differential applicator, and a measurement device e.g. frequency sensor (62).
