Systems, methods, and structures for improving the performance of thin-film electronic devices, in particular organic LEDs (OLEDs) used in lighting, are disclosed. Enhanced substrates, upon which OLED devices may be deposited, incorporate various structures for extracting light trapped in the device stack and substrate. The substrates provide an improved transparent electrode layer. Methods for forming planarized buried extraction structures to reduce disruption to the deposited device stack layers are disclosed, as are methods for providing smooth, planarized buried metal mesh conductors.
Porous filters having uniform pore size and close packing density are described, along with methods and apparatus for making the porous filters based on nanopatterning. One method includes applying a polymeric liquid to a mold consisting of an array of posts having a desired pore size and distribution. Solidification of polymeric membrane followed by separation from the mold produces a polymer membrane with a predetermined spaced array of pores. A pre-filter film can also be bonded with the membrane during formation to provide increased mechanical support and filtration of larger particles on the input side of the filter. Other process variants are described, including methods for incorporating additional functionalities to the filter.
B01D 69/02 - Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or propertiesManufacturing processes specially adapted therefor characterised by their properties
Systems, methods, and structures for improving the performance of thin-film electronic devices, in particular organic LEDs (OLEDs) used in lighting, are disclosed. Enhanced substrates, upon which OLED devices may be deposited, incorporate various structures for extracting light trapped in the device stack and substrate. The substrates provide an improved transparent electrode layer. Methods for forming planarized buried extraction structures to reduce disruption to the deposited device stack layers are disclosed, as are methods for providing smooth, planarized buried metal mesh conductors.
Porous filters having uniform pore size and close packing density are described, along with methods and apparatus for making the porous filters based on nanopatterning. One method includes applying a polymeric liquid to a mold consisting of an array of posts having a desired pore size and distribution. Solidification of polymeric membrane followed by separation from the mold produces a polymer membrane with a predetermined spaced array of pores. A pre-filter film can also be bonded with the membrane during formation to provide increased mechanical support and filtration of larger particles on the input side of the filter. Other process variants are described, including methods for incorporating additional functionalities to the filter.
B01D 69/02 - Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or propertiesManufacturing processes specially adapted therefor characterised by their properties
The present disclosure advances the art by providing a method and system for forming electronic devices. In particular, and by example only, methods are described for forming devices for harvesting energy in the terahertz frequency range on flexible substrates, wherein the methods provide favorable accuracy in registration of the various device elements and facilitate low-cost R2R manufacturing.
H01L 21/475 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting to form insulating layers thereon, e.g. for masking or by using photolithographic techniquesAfter-treatment of these layers using masks
H01L 21/3213 - Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
H01L 21/308 - Chemical or electrical treatment, e.g. electrolytic etching using masks
H01L 21/32 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to form insulating layers thereon, e.g. for masking or by using photolithographic techniquesAfter-treatment of these layersSelection of materials for these layers using masks
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 31/0352 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
H01L 31/108 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the Schottky type
6.
Methods and apparatus for forming dual polarized images
Methods are described for forming polarized image films in which a displayed image changes depending on the state of polarization of a backside illumination source. Methods are also described for eliminating the leakage of unpolarized light through certain parts of the images resulting in unwanted visual artifacts in these images. Polarized dual graphic films achieving images with higher optical density and uniformity, minimum ghosting and mis-registration, can be made by a manufacturing technique that is faster, capable of higher production volumes, and that can produce polarized images at a lower cost. An exemplary method provides for forming a polarized image or pattern on an oriented substrate by using a negative patterned resist image or pattern formed by graphic arts techniques, followed by the imbibition of a dichroic dye or iodine ink to form a corresponding positive image in the areas not protected by the resist.
The present disclosure advances the art by providing a method and system for forming electronic devices. In particular, and by example only, methods are described for forming devices for harvesting energy in the terahertz frequency range on flexible substrates, wherein the methods provide favorable accuracy in registration of the various device elements and facilitate low-cost R2R manufacturing.
H01L 21/475 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting to form insulating layers thereon, e.g. for masking or by using photolithographic techniquesAfter-treatment of these layers using masks
H01L 21/3213 - Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
H01L 21/308 - Chemical or electrical treatment, e.g. electrolytic etching using masks
H01L 21/32 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to form insulating layers thereon, e.g. for masking or by using photolithographic techniquesAfter-treatment of these layersSelection of materials for these layers using masks
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H01L 31/0352 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
H01L 31/108 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the Schottky type
H01Q 1/24 - SupportsMounting means by structural association with other equipment or articles with receiving set
8.
Fluid application method for improved roll-to-roll pattern formation
Methods, apparatus and systems are disclosed by which patterned layers can be formed in a roll-to-roll process using a variable and programmable means for applying liquids and solutions used in the patterning process.
A method of forming a metal mold for casting a micro-scale dry adhesive structure includes securing a master patch of material including a micro-scale dry adhesive structure on a plating fixture, electroforming the metal mold on the patch of material, and removing the metal mold from the plating fixture and patch of material.
B29C 39/02 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressureApparatus therefor for making articles of definite length, i.e. discrete articles
B23P 15/00 - Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
10.
TOOLS & METHODS FOR PRODUCING NANOANTENNA ELECTRONIC DEVICES
The present disclosure advances the art by providing a method and system for forming electronic devices. In particular, and by example only, methods are described for forming devices for harvesting energy in the terahertz frequency range on flexible substrates, wherein the methods provide favorable accuracy in registration of the various device elements and facilitate low-cost R2R manufacturing.
The present disclosure advances the art by providing a method and system for forming electronic devices. In particular, and by example only, methods are described for forming devices for harvesting energy in the terahertz frequency range on flexible substrates, wherein the methods provide favorable accuracy in registration of the various device elements and facilitate low-cost R2R manufacturing.
H01L 31/18 - Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H01L 31/0352 - SEMICONDUCTOR DEVICES NOT COVERED BY CLASS - Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
H01L 31/108 - Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier the potential barrier being of the Schottky type
H01Q 1/24 - SupportsMounting means by structural association with other equipment or articles with receiving set
12.
Tools and methods for forming semi-transparent patterning masks
Means, apparatus, systems, and/or methods are described for forming improved rigid or flexible semi-transparent imprinting templates. These templates can be used to produce patterning masks having improved resolution that do not require plasma etching for residue removal. The methods and apparatus are compatible with roll-to-roll manufacturing processes and enable roll-to-roll formation of a wide range of metal patterned films.
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
B29C 59/00 - Surface shaping, e.g. embossingApparatus therefor
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
Methods are disclosed by which two-dimensional and three-dimensional pattern layers may be formed on non-planar surfaces, including optical elements such as lenses with one or more cylindrical, spherical or aspheric surfaces. Patterns with features in the micro- and/or nano-size regime comprised of organic, inorganic or metallic materials may be formed by the methods described herein.
Methods, apparatus and systems are disclosed by which patterned layers can be formed in a roll-to-roll process using a variable and programmable means for applying liquids and solutions used in the patterning process.
Means, apparatus, systems, and/or methods are described for forming improved rigid or flexible semi-transparent imprinting templates. These templates can be used to produce patterning masks having improved resolution that do not require plasma etching for residue removal. The methods and apparatus are compatible with roll-to-roll manufacturing processes and enable roll-to-roll formation of a wide range of metal patterned films.
Durable seamless replication tools are disclosed for replication of seamless relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including preparing a recording substrate on the inner surface of a support cylinder, recording and developing a relief pattern in the substrate, creating a durable negative relief replica of the pattern, extracting the resulting durable tool sleeve from a processing cell, and mounting the tool sleeve on a mounting fixture. Apparatus are disclosed for fabricating such seamless replication tools, including systems for recording a desired relief pattern on a photosensitive layer on an inner surface of a support cylinder. Also disclosed are electrodeposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
Durable replication tools are disclosed for replication of relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including recording and developing a relief pattern on a selected surface of a support cylinder, creating a durable layer with a complementary relief replica of the pattern, separating the durable layer from the support cylinder. Apparatus are disclosed for fabricating such replication tools, including systems and apparatus for recording a desired relief pattern on a surface of a support cylinder. Also disclosed are electro deposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.
An aspect of the present disclosure provides for a quarter-wave retarder film that is overlaid onto a linearly-polarized stereoscopic image pair in an appropriate orientation in order to produce an image that is viewable using circularly polarized viewing glasses for increased viewing comfort and head-tilt resistance. Another aspect of the present disclosure enables the production of Stereo Jet-type ink jet images through the use of two separate single-sided clear polarizer substrates with the stretch orientation parallel to the running edge of the support layer. A further aspect of the present disclosure is directed to the production of laminated stereoscopic images in which the spacing of the image planes of the members of the image pair can be made in close proximity, farther proximity, or at an intermediate proximity to achieve desired optical, mechanical and/or visual results.
Techniques are described for improving the quality and yield of vacuum-processed substrates. A system can include a tape-like substrate that is supplied by unwind spool to a web guide, tension control roller, and additional idler rolls. The substrate can then enter a coating zone, following an essentially spiral pathway and traversing the coating source a number of times before exiting the coating zone and rewinding on spool. The effect of multiple passes through various flux areas of source is to smooth and average out the coating thickness non -uniformities resulting from a non-uniform flux. Related methods are described. Embodiments can be particularly well suited for the manufacture of data tapes including, but not limited to, metal evaporated magnetic, magneto-optical, phase change optical, and preformatted, or thin-film electronics, sensors, RFID tags, and solar films, to name a few examples.
Systems and methods are disclosed by which patterns of various materials can be formed on flexible substrates by a continuous roll-to-roll manufacturing process. The patterns may include metallic, transparent conductive, or non-metallic elements with lateral dimensions including in the range from below 100 nanometers to millimeters and with thickness dimensions including the range from tens of Angstroms to greater than 10,000 Angstroms. The substrate may be any material capable of sufficient flexibility for compatibility with roll-based processing equipment, including polymeric films, metallic foils, and thin glass, with polymeric films representing a particularly broad field of application. Methods may include the continuous roll-to-roll formation of a temporary polymeric structure with selected areas open to the underlying substrate, the continuous addition or subtraction of constituent materials, and the continuous removal, where necessary, of the polymeric structure and any excess material.
B44C 1/165 - Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomaniasSheet materials therefor
B65C 9/18 - Label feeding from strips, e.g. from rolls
G06F 3/06 - Digital input from, or digital output to, record carriers
21.
Methods and systems for forming flexible multilayer structures
Techniques are described for fabricating multilayer structures having arrays of conducting elements or apertures in a conductive grid which can be used to form frequency selective surfaces (FSSs), antenna arrays and the like on flexible substrates. Fabrication techniques can include use of a polymer mask or direct dielectric molding. In embodiments utilizing a polymer mask, a temporary 3D polymeric relief pattern is formed on a substrate and used as a mask or stencil to form the desired pattern elements. In an additive process, the conductive material is deposited over the masked surface. Deposition can be followed by mask removal In the subtractive process, the conductive layer can be deposited prior to formation of the polymer mask, and the exposed parts of the underlying conductive layer can be etched. Other embodiments utilize dielectric molding in which the molded structure itself becomes an integral and permanent part of the FSS structure.
H01Q 15/02 - Refracting or diffracting devices, e.g. lens, prism
B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
B82Y 40/00 - Manufacture or treatment of nanostructures
H01Q 1/36 - Structural form of radiating elements, e.g. cone, spiral, umbrella
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
22.
METHODS AND SYSTEMS FOR FORMING FLEXIBLE MULTILAYER STRUCTURES
Techniques are described for fabricating multilayer structures having arrays of conducting elements or apertures in a conductive grid which can be used to form frequency selective surfaces (FSSs), antenna arrays and the like on flexible substrates. Fabrication techniques can include use of a polymer mask or direct dielectric molding. In embodiments utilizing a polymer mask, a temporary 3D polymeric relief pattern is formed on a substrate and used as a mask or stencil to form the desired pattern elements. In an additive process, the conductive material is deposited over the masked surface. Deposition can be followed by mask removal. In the subtractive process, the conductive layer can be deposited prior to formation of the polymer mask, and the exposed parts of the underlying conductive layer can be etched. Other embodiments utilize dielectric molding in which the molded structure itself becomes an integral and permanent part of the FSS structure.
Durable replication tools are disclosed for replication of relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including recording and developing a relief pattern on a selected surface of a support cylinder, creating a durable layer with a complementary relief replica of the pattern, separating the durable layer from the support cylinder. Apparatus are disclosed for fabricating such replication tools, including systems and apparatus for recording a desired relief pattern on a surface of a support cylinder. Also disclosed are electro deposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.
Techniques, methods, systems, and apparatus are disclosed that are useful for creating addressable three-dimensional elements formed on a flexible substrate using continuous roll-to-roll fabrication methods. An array of conductive elements can be formed on a first flexible substrate layer, over which is disposed a second polymer layer containing a three-dimensional micro-scale relief pattern. The second layer can be formed in registration with the underlying electrode pattern. The lowest areas of the micropattern can be etched away, in order to expose the underlying electrode elements. The 3D micropattern can include a volumetric structure capable of being filled with various materials, where the contents of the 3D structure may be further processed by chemical, electrochemical, or physical treatment. The 3D structure may consist of elements in the general form of microvessels disposed in a periodic or non- periodic array.
H01L 21/302 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
Techniques, methods, systems, and apparatus are disclosed that are useful for creating addressable three-dimensional elements formed on a flexible substrate using continuous roll-to-roll fabrication methods. An array of conductive elements can be formed on a first flexible substrate layer, over which is disposed a second polymer layer containing a three-dimensional micro-scale relief pattern. The second layer can be formed in registration with the underlying electrode pattern. The lowest areas of the micropattern can be etched away, in order to expose the underlying electrode elements. The 3D micropattern can include a volumetric structure capable of being filled with various materials, where the contents of the 3D structure may be further processed by chemical, electrochemical, or physical treatment. The 3D structure may consist of elements in the general form of microvessels disposed in a periodic or non-periodic array.
Systems, methods, and apparatus are disclosed for making patterning tools from one or more discrete elements. Such tools can have one or more 'seams' or joints where the individual elements abut which can limit the tools' performance and utility in roll-to-roll manufacturing. Methods are described herein for producing 'near-seamless' tools, that is, tools having seams that exhibit minimum disruption of the tool pattern and thus improved material produced by such tools. The patterning tools can be cylindrical and/or closed in shape.
A pre-formatted optical data storage tape (10) including an elongated linear polymer layer having at least one pattern of optically readable embossments (114) on at least one surface of the polymer layer, and an optical recording layer covering the pattern of optically readable embossments (114) of the elongated linear polymer layer, wherein the optical recording layer is adapted such that recorded marks (120) may be made in the recording layer by directing a focused source of energy into the recording layer.
Systems and methods are disclosed by which patterns of various materials can be formed on flexible substrates by a continuous roll-to-roll manufacturing process. The patterns may include metallic, transparent conductive, or non-metallic elements with lateral dimensions including in the range from below 100 nanometers to millimeters and with thickness dimensions including the range from tens of Angstroms to greater than 10,000 Angstroms. The substrate may be any material capable of sufficient flexibility for compatibility with roll-based processing equipment, including polymeric films, metallic foils, and thin glass, with polymeric films representing a particularly broad field of application. Methods may include the continuous roll-to-roll formation of a temporary polymeric structure with selected areas open to the underlying substrate, the continuous addition or subtraction of constituent materials, and the continuous removal, where necessary, of the polymeric structure and any excess material.
Durable seamless replication tools are disclosed for replication of seamless relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including preparing a recording substrate on the inner surface of a support cylinder, recording and developing a relief pattern in the substrate, creating a durable negative relief replica of the pattern, extracting the resulting durable tool sleeve from a processing cell, and mounting the tool sleeve on a mounting fixture. Apparatus are disclosed for fabricating such seamless replication tools, including systems for recording a desired relief pattern on a photosensitive layer on an inner surface of a support cylinder. Also disclosed are electrodeposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.
patents
