Systems, methods, and structures for improving the performance of thin-film electronic devices, in particular organic LEDs (OLEDs) used in lighting, are disclosed. Enhanced substrates, upon which OLED devices may be deposited, incorporate various structures for extracting light trapped in the device stack and substrate. The substrates provide an improved transparent electrode layer. Methods for forming planarized buried extraction structures to reduce disruption to the deposited device stack layers are disclosed, as are methods for providing smooth, planarized buried metal mesh conductors.
Porous filters having uniform pore size and close packing density are described, along with methods and apparatus for making the porous filters based on nanopatterning. One method includes applying a polymeric liquid to a mold consisting of an array of posts having a desired pore size and distribution. Solidification of polymeric membrane followed by separation from the mold produces a polymer membrane with a predetermined spaced array of pores. A pre-filter film can also be bonded with the membrane during formation to provide increased mechanical support and filtration of larger particles on the input side of the filter. Other process variants are described, including methods for incorporating additional functionalities to the filter.
B01D 69/02 - Membranes semi-perméables destinées aux procédés ou aux appareils de séparation, caractérisées par leur forme, leur structure ou leurs propriétésProcédés spécialement adaptés à leur fabrication caractérisées par leurs propriétés
Systems, methods, and structures for improving the performance of thin-film electronic devices, in particular organic LEDs (OLEDs) used in lighting, are disclosed. Enhanced substrates, upon which OLED devices may be deposited, incorporate various structures for extracting light trapped in the device stack and substrate. The substrates provide an improved transparent electrode layer. Methods for forming planarized buried extraction structures to reduce disruption to the deposited device stack layers are disclosed, as are methods for providing smooth, planarized buried metal mesh conductors.
Porous filters having uniform pore size and close packing density are described, along with methods and apparatus for making the porous filters based on nanopatterning. One method includes applying a polymeric liquid to a mold consisting of an array of posts having a desired pore size and distribution. Solidification of polymeric membrane followed by separation from the mold produces a polymer membrane with a predetermined spaced array of pores. A pre-filter film can also be bonded with the membrane during formation to provide increased mechanical support and filtration of larger particles on the input side of the filter. Other process variants are described, including methods for incorporating additional functionalities to the filter.
B01D 69/02 - Membranes semi-perméables destinées aux procédés ou aux appareils de séparation, caractérisées par leur forme, leur structure ou leurs propriétésProcédés spécialement adaptés à leur fabrication caractérisées par leurs propriétés
The present disclosure advances the art by providing a method and system for forming electronic devices. In particular, and by example only, methods are described for forming devices for harvesting energy in the terahertz frequency range on flexible substrates, wherein the methods provide favorable accuracy in registration of the various device elements and facilitate low-cost R2R manufacturing.
H01L 21/475 - Traitement de corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour changer les caractéristiques physiques ou la forme de leur surface, p. ex. gravure, polissage, découpage pour y former des couches isolantes, p. ex. pour masquer ou en utilisant des techniques photolithographiquesPost-traitement de ces couches en utilisant des masques
H01L 21/3213 - Gravure physique ou chimique des couches, p. ex. pour produire une couche avec une configuration donnée à partir d'une couche étendue déposée au préalable
H01L 21/308 - Traitement chimique ou électrique, p. ex. gravure électrolytique en utilisant des masques
H01L 21/32 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour former des couches isolantes en surface, p. ex. pour masquer ou en utilisant des techniques photolithographiquesPost-traitement de ces couchesEmploi de matériaux spécifiés pour ces couches en utilisant des masques
H01L 21/47 - Couches organiques, p. ex. couche photosensible
H01L 51/00 - Dispositifs à l'état solide qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de tels dispositifs ou de leurs parties constitutives
H01L 31/0352 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails caractérisés par leurs corps semi-conducteurs caractérisés par leur forme ou par les formes, les dimensions relatives ou la disposition des régions semi-conductrices
H01L 31/108 - Dispositifs sensibles au rayonnement infrarouge, visible ou ultraviolet caractérisés par une seule barrière de potentiel ou de surface la barrière de potentiel étant du type Schottky
6.
Methods and apparatus for forming dual polarized images
Methods are described for forming polarized image films in which a displayed image changes depending on the state of polarization of a backside illumination source. Methods are also described for eliminating the leakage of unpolarized light through certain parts of the images resulting in unwanted visual artifacts in these images. Polarized dual graphic films achieving images with higher optical density and uniformity, minimum ghosting and mis-registration, can be made by a manufacturing technique that is faster, capable of higher production volumes, and that can produce polarized images at a lower cost. An exemplary method provides for forming a polarized image or pattern on an oriented substrate by using a negative patterned resist image or pattern formed by graphic arts techniques, followed by the imbibition of a dichroic dye or iodine ink to form a corresponding positive image in the areas not protected by the resist.
The present disclosure advances the art by providing a method and system for forming electronic devices. In particular, and by example only, methods are described for forming devices for harvesting energy in the terahertz frequency range on flexible substrates, wherein the methods provide favorable accuracy in registration of the various device elements and facilitate low-cost R2R manufacturing.
H01L 21/475 - Traitement de corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour changer les caractéristiques physiques ou la forme de leur surface, p. ex. gravure, polissage, découpage pour y former des couches isolantes, p. ex. pour masquer ou en utilisant des techniques photolithographiquesPost-traitement de ces couches en utilisant des masques
H01L 21/3213 - Gravure physique ou chimique des couches, p. ex. pour produire une couche avec une configuration donnée à partir d'une couche étendue déposée au préalable
H01L 21/308 - Traitement chimique ou électrique, p. ex. gravure électrolytique en utilisant des masques
H01L 21/32 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour former des couches isolantes en surface, p. ex. pour masquer ou en utilisant des techniques photolithographiquesPost-traitement de ces couchesEmploi de matériaux spécifiés pour ces couches en utilisant des masques
H01L 21/47 - Couches organiques, p. ex. couche photosensible
H01L 51/00 - Dispositifs à l'état solide qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de tels dispositifs ou de leurs parties constitutives
H01L 31/0352 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails caractérisés par leurs corps semi-conducteurs caractérisés par leur forme ou par les formes, les dimensions relatives ou la disposition des régions semi-conductrices
H01L 31/108 - Dispositifs sensibles au rayonnement infrarouge, visible ou ultraviolet caractérisés par une seule barrière de potentiel ou de surface la barrière de potentiel étant du type Schottky
H01Q 1/24 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets avec appareil récepteur
8.
Fluid application method for improved roll-to-roll pattern formation
Methods, apparatus and systems are disclosed by which patterned layers can be formed in a roll-to-roll process using a variable and programmable means for applying liquids and solutions used in the patterning process.
B29C 35/08 - Chauffage ou durcissement, p. ex. réticulation ou vulcanisation utilisant l'énergie ondulatoire ou un rayonnement corpusculaire
B29C 35/10 - Chauffage ou durcissement, p. ex. réticulation ou vulcanisation utilisant l'énergie ondulatoire ou un rayonnement corpusculaire pour fabriquer des objets de longueur indéfinie
B29C 59/04 - Façonnage de surface, p. ex. gaufrageAppareils à cet effet par des moyens mécaniques, p. ex. par pressage en utilisant des rouleaux ou des courroies sans fin
A method of forming a metal mold for casting a micro-scale dry adhesive structure includes securing a master patch of material including a micro-scale dry adhesive structure on a plating fixture, electroforming the metal mold on the patch of material, and removing the metal mold from the plating fixture and patch of material.
B29C 39/02 - Moulage par coulée, c.-à-d. en introduisant la matière à mouler dans un moule ou entre des surfaces enveloppantes sans pression significative de moulageAppareils à cet effet pour la fabrication d'objets de longueur définie, c.-à-d. d'objets séparés
B23P 15/00 - Fabrication d'objets déterminés par des opérations non couvertes par une seule autre sous-classe ou un groupe de la présente sous-classe
10.
TOOLS & METHODS FOR PRODUCING NANOANTENNA ELECTRONIC DEVICES
The present disclosure advances the art by providing a method and system for forming electronic devices. In particular, and by example only, methods are described for forming devices for harvesting energy in the terahertz frequency range on flexible substrates, wherein the methods provide favorable accuracy in registration of the various device elements and facilitate low-cost R2R manufacturing.
The present disclosure advances the art by providing a method and system for forming electronic devices. In particular, and by example only, methods are described for forming devices for harvesting energy in the terahertz frequency range on flexible substrates, wherein the methods provide favorable accuracy in registration of the various device elements and facilitate low-cost R2R manufacturing.
H01L 31/18 - Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives
H01L 31/0352 - Dispositifs à semi-conducteurs sensibles aux rayons infrarouges, à la lumière, au rayonnement électromagnétique d'ondes plus courtes, ou au rayonnement corpusculaire, et spécialement adaptés, soit comme convertisseurs de l'énergie dudit rayonnement e; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de ces dispositifs ou de leurs parties constitutives; Leurs détails caractérisés par leurs corps semi-conducteurs caractérisés par leur forme ou par les formes, les dimensions relatives ou la disposition des régions semi-conductrices
H01L 31/108 - Dispositifs sensibles au rayonnement infrarouge, visible ou ultraviolet caractérisés par une seule barrière de potentiel ou de surface la barrière de potentiel étant du type Schottky
H01Q 1/24 - SupportsMoyens de montage par association structurale avec d'autres équipements ou objets avec appareil récepteur
12.
Tools and methods for forming semi-transparent patterning masks
Means, apparatus, systems, and/or methods are described for forming improved rigid or flexible semi-transparent imprinting templates. These templates can be used to produce patterning masks having improved resolution that do not require plasma etching for residue removal. The methods and apparatus are compatible with roll-to-roll manufacturing processes and enable roll-to-roll formation of a wide range of metal patterned films.
B29C 59/02 - Façonnage de surface, p. ex. gaufrageAppareils à cet effet par des moyens mécaniques, p. ex. par pressage
B29C 59/00 - Façonnage de surface, p. ex. gaufrageAppareils à cet effet
H01L 51/00 - Dispositifs à l'état solide qui utilisent des matériaux organiques comme partie active, ou qui utilisent comme partie active une combinaison de matériaux organiques et d'autres matériaux; Procédés ou appareils spécialement adaptés à la fabrication ou au traitement de tels dispositifs ou de leurs parties constitutives
Methods are disclosed by which two-dimensional and three-dimensional pattern layers may be formed on non-planar surfaces, including optical elements such as lenses with one or more cylindrical, spherical or aspheric surfaces. Patterns with features in the micro- and/or nano-size regime comprised of organic, inorganic or metallic materials may be formed by the methods described herein.
Methods, apparatus and systems are disclosed by which patterned layers can be formed in a roll-to-roll process using a variable and programmable means for applying liquids and solutions used in the patterning process.
B29C 59/16 - Façonnage de surface, p. ex. gaufrageAppareils à cet effet par énergie ondulatoire ou rayonnement corpusculaire
B29C 35/08 - Chauffage ou durcissement, p. ex. réticulation ou vulcanisation utilisant l'énergie ondulatoire ou un rayonnement corpusculaire
B29C 35/10 - Chauffage ou durcissement, p. ex. réticulation ou vulcanisation utilisant l'énergie ondulatoire ou un rayonnement corpusculaire pour fabriquer des objets de longueur indéfinie
B29C 59/04 - Façonnage de surface, p. ex. gaufrageAppareils à cet effet par des moyens mécaniques, p. ex. par pressage en utilisant des rouleaux ou des courroies sans fin
15.
Tools and methods for forming semi-transparent patterning masks
Means, apparatus, systems, and/or methods are described for forming improved rigid or flexible semi-transparent imprinting templates. These templates can be used to produce patterning masks having improved resolution that do not require plasma etching for residue removal. The methods and apparatus are compatible with roll-to-roll manufacturing processes and enable roll-to-roll formation of a wide range of metal patterned films.
Durable seamless replication tools are disclosed for replication of seamless relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including preparing a recording substrate on the inner surface of a support cylinder, recording and developing a relief pattern in the substrate, creating a durable negative relief replica of the pattern, extracting the resulting durable tool sleeve from a processing cell, and mounting the tool sleeve on a mounting fixture. Apparatus are disclosed for fabricating such seamless replication tools, including systems for recording a desired relief pattern on a photosensitive layer on an inner surface of a support cylinder. Also disclosed are electrodeposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
Durable replication tools are disclosed for replication of relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including recording and developing a relief pattern on a selected surface of a support cylinder, creating a durable layer with a complementary relief replica of the pattern, separating the durable layer from the support cylinder. Apparatus are disclosed for fabricating such replication tools, including systems and apparatus for recording a desired relief pattern on a surface of a support cylinder. Also disclosed are electro deposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.
An aspect of the present disclosure provides for a quarter-wave retarder film that is overlaid onto a linearly-polarized stereoscopic image pair in an appropriate orientation in order to produce an image that is viewable using circularly polarized viewing glasses for increased viewing comfort and head-tilt resistance. Another aspect of the present disclosure enables the production of Stereo Jet-type ink jet images through the use of two separate single-sided clear polarizer substrates with the stretch orientation parallel to the running edge of the support layer. A further aspect of the present disclosure is directed to the production of laminated stereoscopic images in which the spacing of the image planes of the members of the image pair can be made in close proximity, farther proximity, or at an intermediate proximity to achieve desired optical, mechanical and/or visual results.
G02B 27/22 - Autres systèmes optiques; Autres appareils optiques pour produire des effets stéréoscopiques ou autres effets de relief
G02B 27/26 - Autres systèmes optiques; Autres appareils optiques pour produire des effets stéréoscopiques ou autres effets de relief comprenant des moyens de polarisation
Techniques are described for improving the quality and yield of vacuum-processed substrates. A system can include a tape-like substrate that is supplied by unwind spool to a web guide, tension control roller, and additional idler rolls. The substrate can then enter a coating zone, following an essentially spiral pathway and traversing the coating source a number of times before exiting the coating zone and rewinding on spool. The effect of multiple passes through various flux areas of source is to smooth and average out the coating thickness non -uniformities resulting from a non-uniform flux. Related methods are described. Embodiments can be particularly well suited for the manufacture of data tapes including, but not limited to, metal evaporated magnetic, magneto-optical, phase change optical, and preformatted, or thin-film electronics, sensors, RFID tags, and solar films, to name a few examples.
Systems and methods are disclosed by which patterns of various materials can be formed on flexible substrates by a continuous roll-to-roll manufacturing process. The patterns may include metallic, transparent conductive, or non-metallic elements with lateral dimensions including in the range from below 100 nanometers to millimeters and with thickness dimensions including the range from tens of Angstroms to greater than 10,000 Angstroms. The substrate may be any material capable of sufficient flexibility for compatibility with roll-based processing equipment, including polymeric films, metallic foils, and thin glass, with polymeric films representing a particularly broad field of application. Methods may include the continuous roll-to-roll formation of a temporary polymeric structure with selected areas open to the underlying substrate, the continuous addition or subtraction of constituent materials, and the continuous removal, where necessary, of the polymeric structure and any excess material.
B44C 1/165 - Procédés non expressément prévus ailleurs pour la production d'effets décoratifs sur des surfaces pour appliquer des images-transfert ou similaires pour décalcomaniesMatériaux en feuilles utilisés à cet effet
B65C 9/18 - Alimentation en étiquettes à partir de bandes, p. ex. de rouleaux
G06F 3/06 - Entrée numérique à partir de, ou sortie numérique vers des supports d'enregistrement
21.
Methods and systems for forming flexible multilayer structures
Techniques are described for fabricating multilayer structures having arrays of conducting elements or apertures in a conductive grid which can be used to form frequency selective surfaces (FSSs), antenna arrays and the like on flexible substrates. Fabrication techniques can include use of a polymer mask or direct dielectric molding. In embodiments utilizing a polymer mask, a temporary 3D polymeric relief pattern is formed on a substrate and used as a mask or stencil to form the desired pattern elements. In an additive process, the conductive material is deposited over the masked surface. Deposition can be followed by mask removal In the subtractive process, the conductive layer can be deposited prior to formation of the polymer mask, and the exposed parts of the underlying conductive layer can be etched. Other embodiments utilize dielectric molding in which the molded structure itself becomes an integral and permanent part of the FSS structure.
H01Q 15/02 - Dispositifs de réfraction ou diffraction, p. ex. lentille, prisme
B82Y 10/00 - Nanotechnologie pour le traitement, le stockage ou la transmission d’informations, p. ex. calcul quantique ou logique à un électron
B82Y 40/00 - Fabrication ou traitement des nanostructures
H01Q 1/36 - Forme structurale pour éléments rayonnants, p. ex. cône, spirale, parapluie
G03F 7/00 - Production par voie photomécanique, p. ex. photolithographique, de surfaces texturées, p. ex. surfaces impriméesMatériaux à cet effet, p. ex. comportant des photoréservesAppareillages spécialement adaptés à cet effet
22.
METHODS AND SYSTEMS FOR FORMING FLEXIBLE MULTILAYER STRUCTURES
Techniques are described for fabricating multilayer structures having arrays of conducting elements or apertures in a conductive grid which can be used to form frequency selective surfaces (FSSs), antenna arrays and the like on flexible substrates. Fabrication techniques can include use of a polymer mask or direct dielectric molding. In embodiments utilizing a polymer mask, a temporary 3D polymeric relief pattern is formed on a substrate and used as a mask or stencil to form the desired pattern elements. In an additive process, the conductive material is deposited over the masked surface. Deposition can be followed by mask removal. In the subtractive process, the conductive layer can be deposited prior to formation of the polymer mask, and the exposed parts of the underlying conductive layer can be etched. Other embodiments utilize dielectric molding in which the molded structure itself becomes an integral and permanent part of the FSS structure.
Durable replication tools are disclosed for replication of relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including recording and developing a relief pattern on a selected surface of a support cylinder, creating a durable layer with a complementary relief replica of the pattern, separating the durable layer from the support cylinder. Apparatus are disclosed for fabricating such replication tools, including systems and apparatus for recording a desired relief pattern on a surface of a support cylinder. Also disclosed are electro deposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.
B29C 43/00 - Moulage par pressage, c.-à-d. en appliquant une pression externe pour faire couler la matière à moulerAppareils à cet effet
B29C 65/14 - Assemblage d'éléments préformésAppareils à cet effet par chauffage, avec ou sans pressage par énergie ondulatoire ou rayonnement corpusculaire
Techniques, methods, systems, and apparatus are disclosed that are useful for creating addressable three-dimensional elements formed on a flexible substrate using continuous roll-to-roll fabrication methods. An array of conductive elements can be formed on a first flexible substrate layer, over which is disposed a second polymer layer containing a three-dimensional micro-scale relief pattern. The second layer can be formed in registration with the underlying electrode pattern. The lowest areas of the micropattern can be etched away, in order to expose the underlying electrode elements. The 3D micropattern can include a volumetric structure capable of being filled with various materials, where the contents of the 3D structure may be further processed by chemical, electrochemical, or physical treatment. The 3D structure may consist of elements in the general form of microvessels disposed in a periodic or non- periodic array.
H01L 21/302 - Traitement des corps semi-conducteurs en utilisant des procédés ou des appareils non couverts par les groupes pour changer leurs caractéristiques physiques de surface ou leur forme, p. ex. gravure, polissage, découpage
Techniques, methods, systems, and apparatus are disclosed that are useful for creating addressable three-dimensional elements formed on a flexible substrate using continuous roll-to-roll fabrication methods. An array of conductive elements can be formed on a first flexible substrate layer, over which is disposed a second polymer layer containing a three-dimensional micro-scale relief pattern. The second layer can be formed in registration with the underlying electrode pattern. The lowest areas of the micropattern can be etched away, in order to expose the underlying electrode elements. The 3D micropattern can include a volumetric structure capable of being filled with various materials, where the contents of the 3D structure may be further processed by chemical, electrochemical, or physical treatment. The 3D structure may consist of elements in the general form of microvessels disposed in a periodic or non-periodic array.
Systems, methods, and apparatus are disclosed for making patterning tools from one or more discrete elements. Such tools can have one or more 'seams' or joints where the individual elements abut which can limit the tools' performance and utility in roll-to-roll manufacturing. Methods are described herein for producing 'near-seamless' tools, that is, tools having seams that exhibit minimum disruption of the tool pattern and thus improved material produced by such tools. The patterning tools can be cylindrical and/or closed in shape.
A pre-formatted optical data storage tape (10) including an elongated linear polymer layer having at least one pattern of optically readable embossments (114) on at least one surface of the polymer layer, and an optical recording layer covering the pattern of optically readable embossments (114) of the elongated linear polymer layer, wherein the optical recording layer is adapted such that recorded marks (120) may be made in the recording layer by directing a focused source of energy into the recording layer.
Systems and methods are disclosed by which patterns of various materials can be formed on flexible substrates by a continuous roll-to-roll manufacturing process. The patterns may include metallic, transparent conductive, or non-metallic elements with lateral dimensions including in the range from below 100 nanometers to millimeters and with thickness dimensions including the range from tens of Angstroms to greater than 10,000 Angstroms. The substrate may be any material capable of sufficient flexibility for compatibility with roll-based processing equipment, including polymeric films, metallic foils, and thin glass, with polymeric films representing a particularly broad field of application. Methods may include the continuous roll-to-roll formation of a temporary polymeric structure with selected areas open to the underlying substrate, the continuous addition or subtraction of constituent materials, and the continuous removal, where necessary, of the polymeric structure and any excess material.
Systems and methods are disclosed by which patterns of various materials can be formed on flexible substrates by a continuous roll-to-roll manufacturing process. The patterns may include metallic, transparent conductive, or non-metallic elements with lateral dimensions including in the range from below 100 nanometers to millimeters and with thickness dimensions including the range from tens of Angstroms to greater than 10,000 Angstroms. The substrate may be any material capable of sufficient flexibility for compatibility with roll-based processing equipment, including polymeric films, metallic foils, and thin glass, with polymeric films representing a particularly broad field of application. Methods may include the continuous roll-to-roll formation of a temporary polymeric structure with selected areas open to the underlying substrate, the continuous addition or subtraction of constituent materials, and the continuous removal, where necessary, of the polymeric structure and any excess material.
Durable seamless replication tools are disclosed for replication of seamless relief patterns in desired media, for example in optical recording or data storage media. Methods of making such durable replication tools are disclosed, including preparing a recording substrate on the inner surface of a support cylinder, recording and developing a relief pattern in the substrate, creating a durable negative relief replica of the pattern, extracting the resulting durable tool sleeve from a processing cell, and mounting the tool sleeve on a mounting fixture. Apparatus are disclosed for fabricating such seamless replication tools, including systems for recording a desired relief pattern on a photosensitive layer on an inner surface of a support cylinder. Also disclosed are electrodeposition cells for forming a durable tool sleeve having a desired relief pattern. The replication tool relief features may have critical dimensions down to the micron and nanometer regime.
brevets
