System for direct writing on an uneven surface of a workpiece that is covered with a radiation sensitive layer using exposures having different focal planes
The technology disclosed relates to accommodating embedded substrates during direct writing onto a printed circuit board and to other patterning problems that benefit from an extended depth of focus. In particular, it relates to multi-focus direct writing of a workpiece by the continuous or step-wise movement of the workpiece during the sequence of exposures having different focus planes. In one implementation, a multi-arm rotating direct writer is configured for interleaved writing focused on two or more focal planes that generally correspond to two or more surface heights of a radiation sensitive layer that overlays the uneven workpiece. Alternating arms can produce interleaved writing to the two or more focal planes.
B41J 2/435 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
2.
Method and device for automatic storage of tape guides
A system and method for surface mount assembly of PCBs, using an automated pick-and-place machine into which component tapes on reels are fed, uses component tape reels each of which has been pre-threaded into its appropriate tape guide and been stored as a reel/tape guide packet in an automated SMD storage tower, from which appropriate packets are retrieved for coupling to the pick-and-place machine.
H05K 13/00 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
H05K 13/08 - Monitoring manufacture of assemblages
B65D 19/00 - Pallets or like platforms, with or without side walls, for supporting loads to be lifted or lowered
B65D 85/62 - Containers, packaging elements or packages, specially adapted for particular articles or materials for stacks of articlesContainers, packaging elements or packages, specially adapted for particular articles or materials for special arrangements of groups of articles
B65G 1/06 - Storage devices mechanical with means for presenting articles for removal at predetermined position or level
3.
Tape feeder and method for moving a carrier tape towards a picking position in a component mounting machine
A tape feeder, including a tape feeder body and a feeder wagon/linear guide, is used to direct component tape in a linear movement towards a component pick position. The feeder wagon comprises a feeder wagon body slidably mounted to the tape feeder body for movement between a first, pickup position and a second, delivery position. The feeder wagon further comprises a feeder head mounted to the feeder wagon body for movement (1) with the feeder wagon body as it moves along the first path, and (2) along a second path transverse to the first path between a first, tape-engaged position and a second, tape-released position. The feeder head comprises a tape-engaging element engageable with component tape.
An automatic SMD storage tower has a shelfless interior for variable spacing of electronic component reels on pallets or as integral reel/guide units, with a great number of affixing locations on the interior of the SMD storage tower thereby increasing the storage capacity and ease of use. The technology disclosed also includes a reel pallet with shape defined places for holding a component reel and a tape guide with the component tape threaded therethrough.
H05K 13/00 - Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
B65D 19/00 - Pallets or like platforms, with or without side walls, for supporting loads to be lifted or lowered
B65D 85/62 - Containers, packaging elements or packages, specially adapted for particular articles or materials for stacks of articlesContainers, packaging elements or packages, specially adapted for particular articles or materials for special arrangements of groups of articles
B65G 1/06 - Storage devices mechanical with means for presenting articles for removal at predetermined position or level
H05K 13/08 - Monitoring manufacture of assemblages
5.
Method and device for writing photomasks with reduced mura errors
The problem of mura in large area photomasks is solved or at least reduced by setting up a writing system to write a pattern with high accuracy and with the optical axes essentially parallel to the movement axes of the stage, then writing photomasks in two passes with the substrate rotated to different angles on the stage. The angle between the orientation of the first and second pass is larger than about 10 degrees, larger than about 20 degrees or larger than about 35 degrees and it can be approximately 10 degrees, approximately 50 degrees, approximately 60 degrees or approximately 90 degrees. The substrate is physically rotated on the stage and aligned with high accuracy after the rotation and the data driving the first and second exposure passes are derived from the first input data specification but processed according to the known oblique angles, so that the second pass is accurately overlaid on the first pass.
In a method for jetting droplets of viscous medium on a workpiece, a jetting machine iteratively jets the droplets of viscous medium from a jetting nozzle onto a first surface of the workpiece to form a single continuous mass of material at an edge of the first surface of the workpiece. At least a portion of the single continuous mass of material extends past the edge of the first surface and adheres to a second surface of the workpiece.
The technology disclosed relates to methods and systems that can be used to reduce visible artifacts know as mura. In particular, it relates to producing alignment marks by physically modifying appearance of a layer of exposure or radiation sensitive material on a workpiece, then using those alignment marks or transferred direct or inverted images of those marks to realign a writing coordinate system between exposure writing passes, following physical movement of the workpiece within the writing system. The physical modifications described include mechanically pressing a mark into the layer, using a laser to ash or ablate the layer, or applying an ink or other substance to the surface of the laser.
The problem of mura in large area photomasks is solved or at least reduced by setting up a writing system to write a pattern with high accuracy and with the optical axes essentially parallel to the movement axes of the stage, then writing photomasks in two passes with the substrate rotated to different angles on the stage. The angle between the orientation of the first and second pass is larger than about 10 degrees, larger than about 20 degrees or larger than about 35 degrees and it can be approximately 10 degrees, approximately 50 degrees, approximately 60 degrees or approximately 90 degrees. The substrate is physically rotated on the stage and aligned with high accuracy after the rotation and the data driving the first and second exposure passes are derived from the first input data specification but processed according to the known oblique angles, so that the second pass is accurately overlaid on the first pass.
An ejector (1) for jetting droplets (22) of viscous media onto a substrate (23) is disclosed. The ejector comprises a jetting nozzle (2) having a nozzle space (3) and a nozzle outlet (4), and an impacting device (6) for impacting a volume of the viscous medium in the nozzle space such that droplets of viscous medium is jetted from the nozzle space through the nozzle outlet towards the substrate. The ejector also comprise a sensor arrangement (5) arranged after the jetting nozzle in the jetting direction, wherein the sensor arrangement is adapted to detect a jetted droplet of viscous medium passing thereby.
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
B41J 2/04 - Ink jet characterised by the jet generation process generating single droplets or particles on demand
B05C 11/10 - Storage, supply or control of liquid or other fluent materialRecovery of excess liquid or other fluent material
H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
B05B 12/08 - Arrangements for controlling deliveryArrangements for controlling the spray area responsive to condition of liquid or other fluent material discharged, of ambient medium or of target
10.
METHODS AND DEVICES FOR JETTING VISCOUS MEDIUM ON WORKPIECES
An apparatus for depositing and/or jetting viscous medium on a surface of a workpiece includes at least two depositing head assemblies. The at least two depositing head assemblies are configured to move in three dimensional space. The at least two depositing head assemblies are also configured to at least one of concurrently and simultaneously deposit the viscous medium on the workpiece.
B05B 17/06 - Apparatus for spraying or atomising liquids or other fluent materials, not covered by any other group of this subclass operating with special methods using ultrasonic vibrations
H05K 3/12 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using printing techniques to apply the conductive material
H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
H05K 3/30 - Assembling printed circuits with electric components, e.g. with resistor
A laser writer for highly accurate patterning of devices, e.g. large area photomasks, with a numerical modulator which calculates instantaneous values of the modulator RF to be fed to the acoustooptic modulator. Further improvements allow increased resolution by phase control and reduced errors by reducing the RF power variations in the acoustooptic modulator.
Solder paste compositions and methods for applying solder paste. The solder paste includes lubricating additives to the flux to decrease friction and the changes of metal to metal contact between the surfaces of the solder balls and other surfaces that the solder balls come into contact with. The solder paste also includes solder balls of different average sizes, that improves the desirable liquid like properties of the granular paste while further reducing viscosity. As such, the solder paste is used in current screen printing solder paste application methods without the risk of clogging or agglomeration of solder paste particles on surfaces. The solder paste is also used in jetting or dispensing solder paste application methods without the risk of clogging or agglomeration within the cylinders/containers or apertures and nozzles that are used within such methods.
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
The technology disclosed relates to accommodating embedded substrates during direct writing onto a printed circuit board and to other patterning problems that benefit from an extended depth of focus. In particular, it relates to multi-focus direct writing of a workpiece by the continuous or step-wise movement of the workpiece during the sequence of exposures having different focus planes. In one implementation, a multi-arm rotating direct writer is configured for interleaved writing focused on two or more focal planes that generally correspond to two or more surface heights of a radiation sensitive layer that overlays the uneven workpiece. Alternating arms can produce interleaved writing to the two or more focal planes.
The technology disclosed relates to patterning of flexible substrate. One implementation can be applied for production of flexible displays and other electronic devices on flexible substrates. The substrate may be plastic film typically 50-150 microns thick and the size of the pattern features may typically be in the range 1-10 microns across. Larger and smaller structures are possible. The patterning is done by means of optical exposure, either by exposure of a photosensitive resist or lacquer, or by other thermal or photochemical interaction between the light and the substrate. The substrate may typically be loaded as a roll and after exposure and other processing it may be rolled up on a second output roll, so called roll-to-roll (R-to-R) processing.
B41J 2/435 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
B41J 2/47 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
The technology disclosed relates to patterning of flexible substrate. One implementation can be applied for production of flexible displays and other electronic devices on flexible substrates. The substrate may be plastic film typically 50-150 microns thick and the size of the pattern features may typically be in the range 1-10 microns across. Larger and smaller structures are possible. The patterning is done by means of optical exposure, either by exposure of a photosensitive resist or lacquer, or by other thermal or photochemical interaction between the light and the substrate. The substrate may typically be loaded as a roll and after exposure and other processing it may be rolled up on a second output roll, so called roll-to-roll (R-to-R) processing.
A pattern generator includes: a writing tool and a calibration system. The writing tool is configured to generate a pattern on a workpiece arranged on a stage. The calibration system is configured to determine a correlation between a coordinate system of the writing tool and a coordinate system of a calibration plate on one of the stage and the workpiece. The calibration system is also configured to determine the correlation at least partly based on an optical correlation signal, or pattern, in a form of at least one optical beam being reflected from at least one reflective pattern on the surface of the calibration plate.
G01B 11/30 - Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
G01B 11/14 - Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
17.
METHOD AND DEVICE FOR AUTOMATIC STORAGE OF ELECTRONIC COMPONENTS
An automatic SMD storage tower has a shelfless interior for variable spacing of electronic component reels on pallets or as integral reel/guide units, with a great number of affixing locations on the interior of the SMD storage tower thereby increasing the storage capacity and ease of use. The technology disclosed also includes a reel pallet with shape defined places for holding a component reel and a tape guide with the component tape threaded therethrough.
A system and method for surface mount assembly of PCBs, using an automated pick-and-place machine into which component tapes on reels are fed, uses component tape reels each of which has been pre-threaded into its appropriate tape guide and been stored as a reel/tape guide packet in an automated SMD storage tower, from which appropriate packets are retrieved for coupling to the pick-and-place machine.
The invention relates to the field of manufacture and assembly of circuit boards and a method and carrier arrangement for use in the process of mounting of components. In particular, the invention relates to a method for feeding a component tape to a pick-up position at or to a component mounting machine and a carrier arrangement including a component tape holder for holding a component tape carrying consecutively arranged components, at least one base support arranged for supporting and facilitating low-frictional rotation of the component tape holder(s) during feeding of the component tape and a support arrangement arranged for supporting and facilitating a low-frictional rotation of the component tape holder(s) during feeding of the components.
The invention relates to a method of discovering a risk for damaged components in electronic assemblies. The method includes: at a component pick and place mounting device, monitoring a mounting of a component on a workpiece, such as a circuit board, by means of at least one electro-static discharge sensor arranged at the device; and detecting electro-static discharge events during said mounting of the component. Further, the invention relates to a component mounting device for pick and place mounting, including a component mounting head configured to pick and place mount components on a circuit board; and at least one electro-static discharge sensor configured to detect electro-static discharge events during mounting of the components.
G01R 31/18 - Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
The current invention relates to writing or reading a pattern on a surface, such as in microlithography or inspection of mircrolithographic patterns. In particular, Applicant discloses systems recording or reading images by scanning sparse 2D point arrays or grids across the surface, e.g., multiple optical, electron or particle beams modulated in parallel. The scanning and repeated reading or writing creates a dense pixel or spot grid on the workpiece. The grid may be created by various arrays: arrays of light sources, e.g., laser or LED arrays, by lenslet arrays where each lenslet has its own modulator, by aperture plates for particle beams, or arrays of near-field emitters or mechanical probes. For reading systems, the point grid may be created by a sparse point matrix illumination and/or a detector array where each detector element sees only one spot. The idea behind the use of large arrays is to improve throughput. However, the throughput does not scale with the array size, since above a certain size of arrays, previously known schemes fall into in their own tracks and start repeating the same data over and over again. This application discloses methods to scan workpieces with large arrays while preserving the scaling of throughput proportional to array size, even for very large arrays, in fact essentially without limits.
G03B 27/32 - Projection printing apparatus, e.g. enlarger, copying camera
G06K 17/00 - Methods or arrangements for effecting co-operative working between equipments covered by two or more of main groups , e.g. automatic card files incorporating conveying and reading operations
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
A tape feeder, including a tape feeder body and a feeder wagon/linear guide, is used to direct component tape in a linear movement towards a component pick position. The feeder wagon comprises a feeder wagon body slidably mounted to the tape feeder body for movement between a first, pickup position and a second, delivery position. The feeder wagon further comprises a feeder head mounted to the feeder wagon body for movement (1) with the feeder wagon body as it moves along the first path, and (2) along a second path transverse to the first path between a first, tape-engaged position and a second, tape-released position. The feeder head comprises a tape-engaging element engageable with component tape.
Solder paste compositions and methods for applying solder paste. The solder paste includes lubricating additives to the flux to decrease friction and the changes of metal to metal contact between the surfaces of the solder balls and other surfaces that the solder balls come into contact with. The solder paste also includes solder balls of different average sizes, that improves the desirable liquid like properties of the granular paste while further reducing viscosity. As such, the solder paste is used in current screen printing solder paste application methods without the risk of clogging or agglomeration of solder paste particles on surfaces. The solder paste is also used in jetting or dispensing solder paste application methods without the risk of clogging or agglomeration within the cylinders/containers or apertures and nozzles that are used within such methods.
B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
A method and apparatus for applying mounting a mixture, solution or flux to an electronic component in an electronic component mounting apparatus. The method and apparatus includes a plate (200) with cavities (206) of various sizes. The cavities are filled with a viscous molding mixture, solution or flux as electronic component are dipped into the cavity such that a portion of the component is wetted with the mounting solution or flux. The cavities can be filled with a number of different types of solution or flux. The method and apparatus can include a squeegee (202, 204), scraper or blade that is run across the surface of the plate along the rim that defines the opening of the cavity, thereby displacing mixture, solution or flux out of the cavity such that a smooth and uniform surface is created within the cavity. The method and apparatus can include any number of blades. The blades can be angled such that the mixture, solution or flux is pushed in a direction that is relatively perpendicular to the direction in which the blades are moved across the surface of the plate. The blade can be mounted at off-setting positions such that the blades displace the trail of solution or flux that spills out of the path of movement of the other blade.
The present invention describes a method and adaptive optics device inform of an assembly comprising a first deformable mirror, or membrane (201), which is coupled to a first cavity (208) comprised in a hermetically closed cavity, and a second deformable mirror (203) or membrane coupled to a second cavity (211) of the same hermetically closed cavity, wherein the deformable membrane coupled to the second cavity is configured to be used in order to balance or compensate for a change of volume or pressure in the first cavity.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
In general, one aspect of the technology described can be embodied in methods that include the action of applying a writing mechanism having non-isotropic writing properties resulting from different degrees of coherence interaction in a sweep direction and a cross-sweep direction, writing an image pattern twice on a work piece using the writing mechanism rotated relative to the image pattern written on the workpiece between first and second writings, whereby writing with the rotated writing mechanism averages the non-isotropic properties. The lesser included angle separating first and second relative directions of movement between a workpiece and writing mechanism may be 20 degrees or greater, or somewhat less, under conditions described herein.
The technology disclosed relates to improved acousto-optic deflectors (AODs). In particular, it relates to compensation for subtle effects not previously addressed by AOD designers. A shifting center of gravity is described and addressed using advanced power equalisation strategies. Denser writing brushes are provided by using a two-dimensional array of beams with corrections for factors such as angle of incidence at the AOD interface. The compensation and dense brush features can be used separately or in combination.
G02F 1/11 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on acousto-optical elements, e.g. using variable diffraction by sound or like mechanical waves
The technology disclosed relates to improved acousto-optic deflectors (AODs). In particular, it relates to compensation for subtle effects not previously addressed by AOD designers. A shifting center of gravity is described and addressed using advanced power equalisation strategies.
G02F 1/11 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on acousto-optical elements, e.g. using variable diffraction by sound or like mechanical waves
A pick-and-place tool configured to pick and place at least one die on a workpiece includes a mounting head. The mounting head includes a die position determining unit configured to one of measure and detect an actual position of at least one die during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
30.
APPARATUS AND METHODS FOR COMPENSATION OF CARRIER DISTORTION FROM MEASUREMENT MACHINES
In a method for generating a pattern on a workpiece having at least one die placed thereon, positions of the at least one die and at least two global alignment marks on the workpiece are measured, pattern adjustment data is generated, pattern image data associated with the pattern to be written is adjusted based on the generated pattern adjustment data, and the pattern is generated on the workpiece based on the modified pattern adjustment data.
The technology described applies an extended frequency range of over one octave to drive an acousto-optic deflector, thereby defying a design rule of thumb that limited bandwidth to just under one octave. A combination of extended frequency range and well-timed beam blanking reduces the proportion of a so-called chirp signal that is consumed by beam blanking. This increases the working, effective portion of the sweep signal.
G02F 1/11 - Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulatingNon-linear optics for the control of the intensity, phase, polarisation or colour based on acousto-optical elements, e.g. using variable diffraction by sound or like mechanical waves
32.
Method and apparatus for performing pattern reconnection after individual or multipart alignment
A method for patterning a second layer of a work piece in a direct write machine in the manufacturing of a multilayer system-in-package stack. The work piece having a first layer with a plurality of electrical components in the form of dies arbitrarily placed. Each component having connection points where some need to be connected between the components. A first pattern wherein different zones comprising connection points of dies distributed in the first layer are associated with different requirements on alignment. The method comprising the steps of: a. Detecting sacred zones in first pattern that have a high requirement on alignment to selected features of the system-in-package stack or to the placed components; b. Detecting stretch zones of the first pattern that are allowed to have a lower requirement on alignment to other features of the system-in-package stack; c. Transforming the first pattern by calculating adjusted first pattern data comprising transformation of the original circuit pattern such that: i. connection points in adjacent sacred zones are aligned within a pre-settable alignment deviation parameter; and such that ii. deviations between the positions of corresponding connection points in the sacred zones are compensated for in the pattern for connection points of the stretch zones; d. writing a pattern on the layer of the work piece according to the adjusted pattern data. The first pattern may also be simultaneously matched to a second pattern.
A method of patterning a plurality of layers (L1, L2, L3, L4) of a work piece (2404) in a series of writing cycles in one or a plurality of write machines, the workpiece being deviced to have a number of N layers (L1, L2, L3, L4) and layers of the workpiece having one or a plurality of boundary condition (s) for pattern position, the method comprising the steps of: determining the boundary conditions of layers 1 to N, calculating deviations due to the boundary conditions and calculating a compensation for the deviation of the first transformation added with the assigned part of the deviation due to the boundary conditions.
A pattern generator includes: a writing tool and a calibration system. The writing tool is configured to generate a pattern on a workpiece arranged on a stage. The calibration system is configured to determine a correlation between a coordinate system of the writing tool and a coordinate system of a calibration plate on one of the stage and the workpiece. The calibration system is also configured to determine the correlation at least partly based on an optical correlation signal, or pattern, in a form of at least one optical beam being reflected from at least one reflective pattern on the surface of the calibration plate.
G01B 11/14 - Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
35.
PATTERN GENERATORS COMPRISING A CALIBRATION SYSTEM
A pattern generator includes: a writing tool and a calibration system. The writing tool is configured to generate a pattern on a workpiece arranged on a stage. The calibration system is configured to determine a correlation between a coordinate system of the writing tool and a coordinate system of a calibration plate on one of the stage and the workpiece. The calibration system is also configured to determine the correlation at least partly based on an optical correlation signal, or pattern, in a form of at least one optical beam being reflected from at least one reflective pattern on the surface of the calibration plate.
The present invention relates to laser ablation microlithography. In particular, we disclose a new SLM design and patterning method that uses multiple mirrors per pixel to concentrate energy to an energy density that facilitates laser ablation, while keeping the energy density on the SLM mirror surface at a level that does not damage the mirrors. Multiple micro-mirrors can be reset at a very high frequency, far beyond current DMD devices.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
B23K 26/06 - Shaping the laser beam, e.g. by masks or multi-focusing
B23K 26/067 - Dividing the beam into multiple beams, e.g. multi-focusing
37.
METHOD FOR MERGING MULTIPLE GEOMETRICAL PIXEL IMAGES AND GENERATING A SINGLE MODULATOR PIXEL IMAGE
The present invention relates to customizing individual workpieces, such as chip, flat panels or other electronic devices produced on substrates, by direct writing a custom pattern. Customization can be per device, per substrate, per batch or at some other small volume that makes it impractical to use a custom mask or mask set. In particular, it relates to customizing a latent image formed in a radiation sensitive layer over a substrate, merging standard and custom pattern data to form a custom pattern used to produce the customized latent image. A wide variety of substrates can benefit from the technology disclosed.
This invention relates to an improved micro lithographic writer that sweeps a modulated pattern across the surface of a workpiece. The SLM disclosed works in a diffractive mode with a continuous or quasi-continuous radiation source. It uses a long and narrow SLM and takes advantage of diffractive effects along the narrow axis of the SLM to improve writing characteristics along that axis.
The technology disclosed relates to a partially coherent illuminators.In particular, it relates to a partially coherent illuminator that directs laser radiation across multiple areas of an illumination pupil. In some circumstances, this reduces spatial and/or temporal coherence of the laser radiation. It must be used with a continuous laser to provide partially coherent illumination from a coherent laser. It can be combined with a workpiece tracker that effectively freezes the workpiece and extends the time that laser radiation can be applied to expose a pattern stamp on the work piece or, it can be used with a stepper platform, without a tracker.A dynamically controllable aperture architecture is a by product of the technology disclosed.
A method for patterning a workpiece in a direct write machine in the manufacturing of a multilayer stack, wherein a first circuit pattern comprising patterns for connection points is transformed according to determined fitting tolerances to fit to connection points of a second circuit pattern and to circuit pattern(s) of specific features such as random placed dies, or group of dies, on or in the workpiece. The second layer may be a previously formed layer or a layer to be formed on the same workpiece or on a different workpiece for the stack. Pattern data associated with selected die is transformed into adjusted circuit pattern data using the transformation defined by the transformed positions such that the circuit pattern is fitted to the selected die(s).
G06F 19/00 - Digital computing or data processing equipment or methods, specially adapted for specific applications (specially adapted for specific functions G06F 17/00;data processing systems or methods specially adapted for administrative, commercial, financial, managerial, supervisory or forecasting purposes G06Q;healthcare informatics G16H)
An alignment method for the of patterning a work piece in a direct write machine, wherein a reference board provided with board reference features is used to coordinate calibration of a measurement station and a writing station against a common reference. An adjusted pattern is for writing on the work piece is calculated relative to the position of the reference board.
A method for patterning a workpiece in a direct write machine in the manufacturing of a multilayer stack, wherein a first circuit pattern (1304) comprising patterns for connection points is transformed according to determined fitting tolerances to fit to connection points of a second circuit pattern (1306) and to circuit pattern(s) of specific features such as random placed dies, or group of dies, on or in the workpiece. The second layer may be a previously formed layer or a layer to be formed on the same workpiece or on a different workpiece for the stack. Pattern data associated with selected die is transformed into adjusted circuit pattern data using the transformation defined by the transformed positions such that the circuit pattern is fitted to the selected die(s).
A method for patterning a second layer of a work piece in a direct write machine in the manufacturing of a multilayer system-in-package stack. The work piece having a first layer with a plurality of electrical components in the form of dies (1502) arbitrarily placed. Each component having connection points where some need to be connected between the components. A first pattern wherein different zones (1510) comprising connection points of dies distributed in the first layer are associated with different requirements on alignment. The method comprising the steps of: a. Detecting sacred zones in first pattern that have a high requirement on alignment to selected features of the system-in-package stack or to the placed components; b. Detecting stretch zones (1510) of the first pattern that are allowed to have a lower requirement on alignment to other features of the system-in-package stack; c. Transforming the first pattern by calculating adjusted first pattern data comprising transformation of the original circuit pattern such that: i. connection points in adjacent sacred zones are aligned within a pre-settable alignment deviation parameter; and such that ii. deviations between the positions of corresponding connection points in the sacred zones are compensated for in the pattern for connection points of the stretch zones; d. writing a pattern on the layer of the work piece according to the adjusted pattern data. The first pattern may also be simultaneously matched to a second pattern.
A method of patterning a plurality of layers of a work piece in a series of write machines, wherein errors due to different transformation capabilities of different machines are compensated by distributing the errors over the plurality of layers.
G06F 19/00 - Digital computing or data processing equipment or methods, specially adapted for specific applications (specially adapted for specific functions G06F 17/00;data processing systems or methods specially adapted for administrative, commercial, financial, managerial, supervisory or forecasting purposes G06Q;healthcare informatics G16H)
A method for patterning a workpiece provided with dies in a direct write machine, wherein measurement data of positions of the dies in terms of location and orientation together with the workpiece location and orientation relative the writer coordinate system is used to determine a transformation of the measured positions into transformed positions defined in the coordinate system of the direct write machine. Pattern data associated with a selected die, or group of dies, is transformed into adjusted circuit pattern data dependent both on the original pattern data and the transformed positions, wherein the adjusted circuit pattern data represents the circuit pattern of the plurality of dies, or group of dies, such that the adjusted circuit pattern is fitted to a plurality of sub-areas of the workpiece area, and wherein each sub-area is associated with a die, or group of dies, among the plurality of dies distributed on the workpiece. A pattern is then written on the workpiece according to the adjusted circuit pattern data.
A method of patterning a plurality of layers of a work piece in a series of write machines, wherein errors due to different transformation capabilities of different machines are compensated by distributing the errors over the plurality of layers.
A pattern generation system includes an optical system (106) and a rotor (100). The optical system (106) is configured to project a laser image onto an optical scanner c(104). The rotor (100) has a plurality of optical arms (102) arranged at a first angle relative to one another, and further includes the optical scanner (104). The laser image is sequentially reflected by the optical scanner (104) into each of the plurality of optical arms (102) of the rotor (100) to generate a pattern on a workpiece.
A pattern generation system includes an optical system and a rotor. The optical system is configured to project a laser image onto an optical scanner. The rotor has a plurality of optical arms arranged at a first angle relative to one another, and further includes the optical scanner. The laser image is sequentially reflected by the optical scanner into each of the plurality of optical arms of the rotor to generate a pattern on a workpiece.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
49.
OPTICAL SYSTEMS CONFIGURED TO GENERATE MORE CLOSELY SPACED LIGHT BEAMS AND PATTERN GENERATORS INCLUDING THE SAME
An optical arrangement includes a focusing lens and a plurality of light sources. The focusing lens is configured to focus a plurality of light beams to form an array of virtual light sources in an image plane. The plurality of light sources are configured to emit the plurality of light beams such that the light beams cross each other in a plane.
The technology disclosed relates to translating between a Cartesian grid and a curved scanning path that produces varying exposure doses as the scanning head traces the curved scanning path. It can be applied to writing to or reading from a workpiece. In particular, we teach use of varying exposure dose that compensates for the curved scan path to transit a straight axis. This simplifies either modulation of a modulator, from which data is projected onto the workpiece, or analysis of data collected by a detector, onto which partial images of the workpiece are projected.
The technology disclosed relates to an illumination source including numerous laser diodes. In particular, it relates to extending the duty cycle and/or reducing the frequency of component replacement by detecting failure of one or more individual laser diodes and compensating for the failure, without replacing the laser diodes. The technology disclosed can be used in cases of catastrophic laser diode failure by changing the power of remaining laser diodes to restore illumination to the coherence function similar to the pre-failure illumination field. Particular aspects of the technology disclosed are described in the claims, specification and drawings.
The technology disclosed relates to variable tapers to resolve varying overlaps between adjacent strips that are lithographically printed. Technology disclosed combines an aperture taper function with the variable overlap taper function to transform data and compensate for varying overlaps. The variable taper function varies according to overlap variation, including variation resulting from workpiece distortions, rotor arm position, or which rotor arm printed the last stripe. Particular aspects of the present invention are described in the claims, specification and drawings.
The technology disclosed relates to methods and devices that compensate for displacements in a pattern or deformations of workpiece. In particular, that relates to using timing to compensate for displacements along a first axis along the scanning direction while using resampling, interpolation or a similar method to compensate for displacements along a second axis that is substantially orthogonal to the first axis. The scanning direction may be an actual direction of movement of the scanning head or it may be a direction perpendicular to an orientation of an image projected onto a workpiece.
The technology disclosed relates to handling varying pixel overlaps long a first axis as a scanning head sweeps a curved path that is not parallel to the first axis. In particular, we teach use of a variable frequency pixel clock to produce equally spaced pixels along the first axis as a rotor arm scans a curved path that is not parallel to the first axis. The pixel clock has a varying frequency that varies approximately sinusoidally with the position of the scanning head relative to the first axis.
A lithographic workpiece processing tool includes a loading area for loading a workpiece; and a processing area for processing a workpiece. The workpiece processing tool further includes a multi-table system arranged between the loading area and the processing area. The multi-table system includes at least two tables configured to pass each other while moving between the loading area and the processing area. Each of the at least two tables is configured to hold a workpiece.
The novel SLM uses a two dimensional array of mirrors, with columns of mirrors addressed as if they were a single element. By using a two-dimensional array, the resonance frequency, which limits the modulation speed, is determined by the resonance frequency of a single small mirror element and the power handling is determined by the combined area of mirrors. By designing individual mirrors for speed and driving many of them as a single element, it is possible to decouple power handling from modulation speed. The design of the mirrors and the array are further adapted to efficient use in high-speed high-power lithography.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
H04N 1/195 - Scanning arrangements using multi-element arrays the array comprising a two-dimensional array
57.
RECONFIGURABLE MICRO-MECHANICAL LIGHT MODULATOR AND METHOD
The present invention describes a reconfigurable micro-mechanical light modulator including a two-dimensional array of modulating elements with reflecting surfaces organized in multiple rows and columns. The modulating elements are adapted to modulate light impinging on the micro-mechanical light modulator. According to the invention, the array of modulating elements comprises a first and a second set of modulating elements where the second set is a redundant set of modulating elements being configured to be activated in order to substitute the first set of modulating elements in modulating light impinging on the micro- mechanical light modulator, without physically replacing the micro-mechanical light modulator.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
A lithographic workpiece processing tool includes a loading area (108) for loading a workpiece; and a processing area (106) for processing a workpiece. The workpiece processing tool further includes a multi-table system (10) arranged between the loading area and the processing area. The multi-table system includes at least two tables (110, 112) configured to pass each other while moving between the loading area and the processing area. Each of the at least two tables is configured to hold a workpiece.
In a measurement device for measuring a peripheral position in a Cartesian coordinate system, a rotating laser source is configured to emit a laser beam along a radius of a rotator. A reflector is configured to reflect the laser beam in a direction orthogonal to a path of the laser beam, and a scale having a pattern of transparent and reflective areas is positioned at a peripheral position of the measurement device. A detector is configured to provide a sequence of pulses by detecting a reflex or transmission of the rotating laser beam while the laser scans over the scale. The sequence of pulses correspond to Cartesian coordinates of the system.
G01B 11/14 - Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
G01B 11/26 - Measuring arrangements characterised by the use of optical techniques for measuring angles or tapersMeasuring arrangements characterised by the use of optical techniques for testing the alignment of axes
60.
CARTESIAN COORDINATE MEASUREMENT FOR A ROTATING SYSTEM
In a measurement device for measuring a peripheral position in a Cartesian coordinate system, a rotating laser source (206) is configured to emit a laser beam (108) along a radius of a rotator (208). A reflector (610, 710) is configured to reflect the laser beam in a direction orthogonal to a path of the laser beam, and a scale (204, 304, 404, 604, 704) having a pattern (102, 104) of transparent and reflective areas is positioned at a peripheral position of the measurement device. A detector (306) is configured to provide a sequence of pulses (106) by detecting a reflex or transmission of the rotating laser beam (108) while the laser scans over the scale. The sequence of pulses (106) correspond to Cartesian coordinates (X, Y) of the system.
G01B 11/00 - Measuring arrangements characterised by the use of optical techniques
G01D 5/244 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means influencing characteristics of pulses or pulse trainsMechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using electric or magnetic means generating pulses or pulse trains
G01D 5/26 - Mechanical means for transferring the output of a sensing memberMeans for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for convertingTransducers not specially adapted for a specific variable using optical means, i.e. using infrared, visible or ultraviolet light
G01S 17/42 - Simultaneous measurement of distance and other coordinates
61.
GRADIENT ASSISTED IMAGE RESAMPLING IN MICRO-LITHOGRAPHIC PRINTING
The present disclosure relates to the re-sampling of pixel data, with one application being micro-lithography. In particular, it relates to the extraction of modulator pixels from a rasterized image, as a function of how the modulator moves across the rasterized image.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
G06T 9/20 - Contour coding, e.g. using detection of edges
62.
METHODS AND APPARATUSES FOR INCREASING AVAILABLE POWER IN OPTICAL SYSTEMS
A diffractive optical element (DOE) is included in an apparatus for combining a plurality of laser beams. The DOE combines the plurality of laser beams to generate a plurality of spatially distributed laser beams. The DOE is one of movable or stationary. The spatially distributed laser beams are usable to pattern a workpiece.
The technology disclosed relates to scanning of large fiat substrates for reading and writing images. Examples are flat panel displays, PCB's and photovoltaic panels. Reading and writing is to be understood in a broad sense: reading may mean microscopy, inspection, metrology, spectroscopy, interferometry, scatterometry, etc. of a large workpiece, and writing may mean exposing a photoresist, annealing by optical heating, ablating, or creating any other change to the surface by an optical beam. In particular, we disclose a technology that uses a rotating or swinging arm (1140A, 1140B, 1140C) that describes an arc across a workpiece (1111,1112) as it scans, instead of following a traditional straight-line motion.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
The current invention relates to writing or reading a pattern on a surface, such as in microlithography or inspection of mircrolithographic patterns. In particular, Applicant discloses systems recording or reading images by scanning sparse 2D point arrays or grids across the surface, e.g., multiple optical, electron or particle beams modulated in parallel. The scanning and repeated reading or writing creates a dense pixel or spot grid on the workpiece. The grid may be created by various arrays: arrays of light sources, e.g., laser or LED arrays, by lenslet arrays where each lenslet has its own modulator, by aperture plates for particle beams, or arrays of near- field emitters or mechanical probes. For reading systems, the point grid may be created by a sparse point matrix illumination and/or a detector array where each detector element sees only one spot. The idea behind the use of large arrays is to improve throughput. However, the throughput does not scale with the array size, since above a certain size of arrays, previously known schemes fall into in their own tracks and start repeating the same data over and over again. This application discloses methods to scan workpieces with large arrays while preserving the scaling of throughput proportional to array size, even for very large arrays, in fact essentially without limits.
G02B 26/08 - Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
65.
MULTI-FOCUS METHOD OF ENHANCED THREE-DIMENSIONAL EXPOSURE OF RESIST
The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optical, mechanical, fluidic, etc. components, e.g. diffusors, non-reflecting surfaces, Fresnel lenses and Fresnel prisms, computer-generated holograms, lenslet arrays, etc, or to be used as masters for the fabrication of such components by replication. Replication can be done by molding, pressing, embossing, electroplating, etching, as known in the art. This disclosure includes descriptions of using passive absorbing components in thin resist, using high gamma thick resists with high resolution pattern generators, using multiple focal planes including at least one focal plane in the bottom half of the resist, and iterative simulation of patterning and adjustment of an exposure map.
The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optical, mechanical, fluidic, etc. components, e.g. diffusors, non-reflecting surfaces, Fresnel lenses and Fresnel prisms, computer-generated holograms, lenslet arrays, etc, or to be used as masters for the fabrication of such components by replication. Replication can be done by molding, pressing, embossing, electroplating, etching, as known in the art. This disclosure includes descriptions of using passive absorbing components in thin resist, using high gamma thick resists with high resolution pattern generators, using multiple focal planes including at least one focal plane in the bottom half of the resist, and iterative simulation of patterning and adjustment of an exposure map.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
67.
METHOD OF COMPENSATION FOR BLEACHING OF RESIST DURING THREE-DIMENSIONAL EXPOSURE OF RESIST
The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optical, mechanical, fluidic, etc. components, e.g. diffusors, non-reflecting surfaces, Fresnel lenses and Fresnel prisms, computer-generated holograms, lenslet arrays, etc, or to be used as masters for the fabrication of such components by replication. Replication can be done by molding, pressing, embossing, electroplating, etching, as known in the art. This disclosure includes descriptions of using passive absorbing components in thin resist, using high gamma thick resists with high resolution pattern generators, using multiple focal planes including at least one focal plane in the bottom half of the resist, and iterative simulation of patterning and adjustment of an exposure map.
The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optical, mechanical, fluidic, etc. components, e.g. diffusors, non-reflecting surfaces, Fresnel lenses and Fresnel prisms, computer-generated holograms, lenslet arrays, etc, or to be used as masters for the fabrication of such components by replication. Replication can be done by molding, pressing, embossing, electroplating, etching, as known in the art. This disclosure includes descriptions of using passive absorbing components in thin resist, using high gamma thick resists with high resolution pattern generators, using multiple focal planes including at least one focal plane in the bottom half of the resist, and iterative simulation of patterning and adjustment of an exposure map.
The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optical, mechanical, fluidic, etc. components, e.g. diffusors, non-reflecting surfaces, Fresnel lenses and Fresnel prisms, computer-generated holograms, lenslet arrays, etc, or to be used as masters for the fabrication of such components by replication. Replication can be done by molding, pressing, embossing, electroplating, etching, as known in the art. This disclosure includes descriptions of using passive absorbing components in thin resist, using high gamma thick resists with high resolution pattern generators, using multiple focal planes including at least one focal plane in the bottom half of the resist, and iterative simulation of patterning and adjustment of an exposure map.
Methods and apparatuses for patterning workpieces are provided. The methods and apparatuses described herein improve overlay between subsequently patterned layers on a workpiece by introducing an improved alignment method that compensates for workpiece distortions.
The invention relates to methods to improve SLMs, in particular to reflecting micromechanical SLMs, for applications with simple system architecture, high precision, high power handling capability, high throughput, and/or high optical processing capability. Applications include optical data processing, image projection, lithography, image enhancement, holography, optical metrology, coherence and wavefront control, and adaptive optics. A particular aspect of the invention is the achromatization of diffractive SLMs so they can be used with multiple wavelengths sequentially, simultaneously or as a result of spectral broadening in very short pulses.
Devices and methods for manufacturing displays, solar panels and other devices using larger size workpieces are provided. The workpiece is rolled into a cylinder, thereby reducing the physical size by a factor of 3 in one dimension. The stages on which the workpieces are rolled have a cylindrical shape, which allows a more robust and/or compact movement of the glass, reduced machine weight. The workpieces are relatively thin, more flexible, and are rolled onto a cylinder with a diameter of about 1 meter.
B05B 7/00 - Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
B05B 5/00 - Electrostatic spraying apparatusSpraying apparatus with means for charging the spray electricallyApparatus for spraying liquids or other fluent materials by other electric means
H05B 6/00 - Heating by electric, magnetic or electromagnetic fields
B41J 2/435 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
G01B 11/24 - Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
Patterns are written on workpieces, such as, glass sheets and/or plastic sheets used in, for example, electronic display devices such as LCDs. The workpiece may be larger than about 1500 mm may be used. An optical writing head with a plurality of writing units may be used. The workpiece and the writing head may be moved relative to one another to provide oblique writing.
B41J 2/435 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
B41J 2/47 - Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
patents
