System for direct writing on an uneven surface of a workpiece that is covered with a radiation sensitive layer using exposures having different focal planes
The technology disclosed relates to accommodating embedded substrates during direct writing onto a printed circuit board and to other patterning problems that benefit from an extended depth of focus. In particular, it relates to multi-focus direct writing of a workpiece by the continuous or step-wise movement of the workpiece during the sequence of exposures having different focus planes. In one implementation, a multi-arm rotating direct writer is configured for interleaved writing focused on two or more focal planes that generally correspond to two or more surface heights of a radiation sensitive layer that overlays the uneven workpiece. Alternating arms can produce interleaved writing to the two or more focal planes.
B41J 2/435 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par l'irradiation sélective d'un matériau d'impression ou de transfert d'impression
2.
Method and device for automatic storage of tape guides
A system and method for surface mount assembly of PCBs, using an automated pick-and-place machine into which component tapes on reels are fed, uses component tape reels each of which has been pre-threaded into its appropriate tape guide and been stored as a reel/tape guide packet in an automated SMD storage tower, from which appropriate packets are retrieved for coupling to the pick-and-place machine.
H05K 13/00 - Appareils ou procédés spécialement adaptés à la fabrication ou l'ajustage d'ensembles de composants électriques
H05K 13/08 - Contrôle de la fabrication des ensembles
B65D 19/00 - Palettes ou plates-formes analogues, avec ou sans parois latérales, pour supporter les charges à soulever ou à déposer
B65D 85/62 - Réceptacles, éléments d'emballage ou paquets spécialement adaptés à des objets ou à des matériaux particuliers pour agencements particuliers de groupes d'objets
B65G 1/06 - Dispositifs d'emmagasinage mécaniques avec des moyens pour que les objets se présentent à l'enlèvement dans des positions ou à des niveaux prédéterminés
3.
Tape feeder and method for moving a carrier tape towards a picking position in a component mounting machine
A tape feeder, including a tape feeder body and a feeder wagon/linear guide, is used to direct component tape in a linear movement towards a component pick position. The feeder wagon comprises a feeder wagon body slidably mounted to the tape feeder body for movement between a first, pickup position and a second, delivery position. The feeder wagon further comprises a feeder head mounted to the feeder wagon body for movement (1) with the feeder wagon body as it moves along the first path, and (2) along a second path transverse to the first path between a first, tape-engaged position and a second, tape-released position. The feeder head comprises a tape-engaging element engageable with component tape.
An automatic SMD storage tower has a shelfless interior for variable spacing of electronic component reels on pallets or as integral reel/guide units, with a great number of affixing locations on the interior of the SMD storage tower thereby increasing the storage capacity and ease of use. The technology disclosed also includes a reel pallet with shape defined places for holding a component reel and a tape guide with the component tape threaded therethrough.
H05K 13/00 - Appareils ou procédés spécialement adaptés à la fabrication ou l'ajustage d'ensembles de composants électriques
B65D 19/00 - Palettes ou plates-formes analogues, avec ou sans parois latérales, pour supporter les charges à soulever ou à déposer
B65D 85/62 - Réceptacles, éléments d'emballage ou paquets spécialement adaptés à des objets ou à des matériaux particuliers pour agencements particuliers de groupes d'objets
B65G 1/06 - Dispositifs d'emmagasinage mécaniques avec des moyens pour que les objets se présentent à l'enlèvement dans des positions ou à des niveaux prédéterminés
H05K 13/08 - Contrôle de la fabrication des ensembles
5.
Method and device for writing photomasks with reduced mura errors
The problem of mura in large area photomasks is solved or at least reduced by setting up a writing system to write a pattern with high accuracy and with the optical axes essentially parallel to the movement axes of the stage, then writing photomasks in two passes with the substrate rotated to different angles on the stage. The angle between the orientation of the first and second pass is larger than about 10 degrees, larger than about 20 degrees or larger than about 35 degrees and it can be approximately 10 degrees, approximately 50 degrees, approximately 60 degrees or approximately 90 degrees. The substrate is physically rotated on the stage and aligned with high accuracy after the rotation and the data driving the first and second exposure passes are derived from the first input data specification but processed according to the known oblique angles, so that the second pass is accurately overlaid on the first pass.
G03F 1/42 - Aspects liés à l'alignement ou au cadrage, p.ex. marquages d'alignement sur le substrat du masque
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
In a method for jetting droplets of viscous medium on a workpiece, a jetting machine iteratively jets the droplets of viscous medium from a jetting nozzle onto a first surface of the workpiece to form a single continuous mass of material at an edge of the first surface of the workpiece. At least a portion of the single continuous mass of material extends past the edge of the first surface and adheres to a second surface of the workpiece.
The technology disclosed relates to methods and systems that can be used to reduce visible artifacts know as mura. In particular, it relates to producing alignment marks by physically modifying appearance of a layer of exposure or radiation sensitive material on a workpiece, then using those alignment marks or transferred direct or inverted images of those marks to realign a writing coordinate system between exposure writing passes, following physical movement of the workpiece within the writing system. The physical modifications described include mechanically pressing a mark into the layer, using a laser to ash or ablate the layer, or applying an ink or other substance to the surface of the laser.
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
G03F 1/42 - Aspects liés à l'alignement ou au cadrage, p.ex. marquages d'alignement sur le substrat du masque
8.
METHOD FOR WRITING PHOTOMASKS WITH REDUCED MURA ERRORS
The problem of mura in large area photomasks is solved or at least reduced by setting up a writing system to write a pattern with high accuracy and with the optical axes essentially parallel to the movement axes of the stage, then writing photomasks in two passes with the substrate rotated to different angles on the stage. The angle between the orientation of the first and second pass is larger than about 10 degrees, larger than about 20 degrees or larger than about 35 degrees and it can be approximately 10 degrees, approximately 50 degrees, approximately 60 degrees or approximately 90 degrees. The substrate is physically rotated on the stage and aligned with high accuracy after the rotation and the data driving the first and second exposure passes are derived from the first input data specification but processed according to the known oblique angles, so that the second pass is accurately overlaid on the first pass.
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
An ejector (1) for jetting droplets (22) of viscous media onto a substrate (23) is disclosed. The ejector comprises a jetting nozzle (2) having a nozzle space (3) and a nozzle outlet (4), and an impacting device (6) for impacting a volume of the viscous medium in the nozzle space such that droplets of viscous medium is jetted from the nozzle space through the nozzle outlet towards the substrate. The ejector also comprise a sensor arrangement (5) arranged after the jetting nozzle in the jetting direction, wherein the sensor arrangement is adapted to detect a jetted droplet of viscous medium passing thereby.
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
B23K 3/06 - Dispositifs d'alimentation en métal d'apport; Cuves de fusion du métal d'apport
B41J 2/04 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par la mise en contact sélective d'un liquide ou de particules avec un matériau d'impression à jet d'encre caractérisés par le procédé de formation du jet en produisant à la demande des gouttelettes ou des particules séparées les unes des autres
B05C 11/10 - Stockage, débit ou réglage du liquide ou d'un autre matériau fluide; Récupération de l'excès de liquide ou d'un autre matériau fluide
H05K 3/30 - Assemblage de circuits imprimés avec des composants électriques, p.ex. avec une résistance
H05K 3/32 - Connexions électriques des composants électriques ou des fils à des circuits imprimés
B05B 12/08 - Aménagements de commande de la distribution; Aménagements de réglage de l’aire de pulvérisation sensibles à l'état du liquide ou d'un autre matériau fluide expulsé, du milieu ambiant ou de la cible
10.
METHODS AND DEVICES FOR JETTING VISCOUS MEDIUM ON WORKPIECES
An apparatus for depositing and/or jetting viscous medium on a surface of a workpiece includes at least two depositing head assemblies. The at least two depositing head assemblies are configured to move in three dimensional space. The at least two depositing head assemblies are also configured to at least one of concurrently and simultaneously deposit the viscous medium on the workpiece.
B05B 17/06 - Appareils de pulvérisation ou d'atomisation de liquides ou d'autres matériaux fluides, non couverts par les autres groupes de la présente sous-classe opérant suivant des procédés particuliers utilisant des vibrations ultrasonores
H05K 3/12 - Appareils ou procédés pour la fabrication de circuits imprimés dans lesquels le matériau conducteur est appliqué au support isolant de manière à former le parcours conducteur recherché utilisant la technique de l'impression pour appliquer le matériau conducteur
A laser writer for highly accurate patterning of devices, e.g. large area photomasks, with a numerical modulator which calculates instantaneous values of the modulator RF to be fed to the acoustooptic modulator. Further improvements allow increased resolution by phase control and reduced errors by reducing the RF power variations in the acoustooptic modulator.
Solder paste compositions and methods for applying solder paste. The solder paste includes lubricating additives to the flux to decrease friction and the changes of metal to metal contact between the surfaces of the solder balls and other surfaces that the solder balls come into contact with. The solder paste also includes solder balls of different average sizes, that improves the desirable liquid like properties of the granular paste while further reducing viscosity. As such, the solder paste is used in current screen printing solder paste application methods without the risk of clogging or agglomeration of solder paste particles on surfaces. The solder paste is also used in jetting or dispensing solder paste application methods without the risk of clogging or agglomeration within the cylinders/containers or apertures and nozzles that are used within such methods.
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p.ex. par la forme
B23K 35/362 - Emploi de compositions spécifiées de flux
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p.ex. comme enrobages, comme flux; Emploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
The technology disclosed relates to accommodating embedded substrates during direct writing onto a printed circuit board and to other patterning problems that benefit from an extended depth of focus. In particular, it relates to multi-focus direct writing of a workpiece by the continuous or step-wise movement of the workpiece during the sequence of exposures having different focus planes. In one implementation, a multi-arm rotating direct writer is configured for interleaved writing focused on two or more focal planes that generally correspond to two or more surface heights of a radiation sensitive layer that overlays the uneven workpiece. Alternating arms can produce interleaved writing to the two or more focal planes.
The technology disclosed relates to patterning of flexible substrate. One implementation can be applied for production of flexible displays and other electronic devices on flexible substrates. The substrate may be plastic film typically 50-150 microns thick and the size of the pattern features may typically be in the range 1-10 microns across. Larger and smaller structures are possible. The patterning is done by means of optical exposure, either by exposure of a photosensitive resist or lacquer, or by other thermal or photochemical interaction between the light and the substrate. The substrate may typically be loaded as a roll and after exposure and other processing it may be rolled up on a second output roll, so called roll-to-roll (R-to-R) processing.
B41J 2/435 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par l'irradiation sélective d'un matériau d'impression ou de transfert d'impression
B41J 2/47 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par l'irradiation sélective d'un matériau d'impression ou de transfert d'impression utilisant la combinaison du balayage et de la modulation de lumière
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
The technology disclosed relates to patterning of flexible substrate. One implementation can be applied for production of flexible displays and other electronic devices on flexible substrates. The substrate may be plastic film typically 50-150 microns thick and the size of the pattern features may typically be in the range 1-10 microns across. Larger and smaller structures are possible. The patterning is done by means of optical exposure, either by exposure of a photosensitive resist or lacquer, or by other thermal or photochemical interaction between the light and the substrate. The substrate may typically be loaded as a roll and after exposure and other processing it may be rolled up on a second output roll, so called roll-to-roll (R-to-R) processing.
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
16.
Pattern generators, calibration systems and methods for patterning workpieces
A pattern generator includes: a writing tool and a calibration system. The writing tool is configured to generate a pattern on a workpiece arranged on a stage. The calibration system is configured to determine a correlation between a coordinate system of the writing tool and a coordinate system of a calibration plate on one of the stage and the workpiece. The calibration system is also configured to determine the correlation at least partly based on an optical correlation signal, or pattern, in a form of at least one optical beam being reflected from at least one reflective pattern on the surface of the calibration plate.
G01B 11/30 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la rugosité ou l'irrégularité des surfaces
G01B 11/14 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la distance ou la marge entre des objets ou des ouvertures espacés
17.
METHOD AND DEVICE FOR AUTOMATIC STORAGE OF ELECTRONIC COMPONENTS
An automatic SMD storage tower has a shelfless interior for variable spacing of electronic component reels on pallets or as integral reel/guide units, with a great number of affixing locations on the interior of the SMD storage tower thereby increasing the storage capacity and ease of use. The technology disclosed also includes a reel pallet with shape defined places for holding a component reel and a tape guide with the component tape threaded therethrough.
A system and method for surface mount assembly of PCBs, using an automated pick-and-place machine into which component tapes on reels are fed, uses component tape reels each of which has been pre-threaded into its appropriate tape guide and been stored as a reel/tape guide packet in an automated SMD storage tower, from which appropriate packets are retrieved for coupling to the pick-and-place machine.
The invention relates to the field of manufacture and assembly of circuit boards and a method and carrier arrangement for use in the process of mounting of components. In particular, the invention relates to a method for feeding a component tape to a pick-up position at or to a component mounting machine and a carrier arrangement including a component tape holder for holding a component tape carrying consecutively arranged components, at least one base support arranged for supporting and facilitating low-frictional rotation of the component tape holder(s) during feeding of the component tape and a support arrangement arranged for supporting and facilitating a low-frictional rotation of the component tape holder(s) during feeding of the components.
The invention relates to a method of discovering a risk for damaged components in electronic assemblies. The method includes: at a component pick and place mounting device, monitoring a mounting of a component on a workpiece, such as a circuit board, by means of at least one electro-static discharge sensor arranged at the device; and detecting electro-static discharge events during said mounting of the component. Further, the invention relates to a component mounting device for pick and place mounting, including a component mounting head configured to pick and place mount components on a circuit board; and at least one electro-static discharge sensor configured to detect electro-static discharge events during mounting of the components.
G01R 31/18 - Passage aux tests à la file d'articles similaires, p.ex. test "tout ou rien" d'une production de série
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
The current invention relates to writing or reading a pattern on a surface, such as in microlithography or inspection of mircrolithographic patterns. In particular, Applicant discloses systems recording or reading images by scanning sparse 2D point arrays or grids across the surface, e.g., multiple optical, electron or particle beams modulated in parallel. The scanning and repeated reading or writing creates a dense pixel or spot grid on the workpiece. The grid may be created by various arrays: arrays of light sources, e.g., laser or LED arrays, by lenslet arrays where each lenslet has its own modulator, by aperture plates for particle beams, or arrays of near-field emitters or mechanical probes. For reading systems, the point grid may be created by a sparse point matrix illumination and/or a detector array where each detector element sees only one spot. The idea behind the use of large arrays is to improve throughput. However, the throughput does not scale with the array size, since above a certain size of arrays, previously known schemes fall into in their own tracks and start repeating the same data over and over again. This application discloses methods to scan workpieces with large arrays while preserving the scaling of throughput proportional to array size, even for very large arrays, in fact essentially without limits.
G03B 27/32 - Appareils de tirage par projection, p.ex. agrandisseur, appareil photographique de reproduction
G06K 17/00 - Méthodes ou dispositions pour faire travailler en coopération des équipements couverts par plusieurs des groupes principaux , p.ex. fichiers automatiques de cartes incluant les opérations de transport et de lecture
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
G02B 5/00 - OPTIQUE ÉLÉMENTS, SYSTÈMES OU APPAREILS OPTIQUES Éléments optiques autres que les lentilles
A tape feeder, including a tape feeder body and a feeder wagon/linear guide, is used to direct component tape in a linear movement towards a component pick position. The feeder wagon comprises a feeder wagon body slidably mounted to the tape feeder body for movement between a first, pickup position and a second, delivery position. The feeder wagon further comprises a feeder head mounted to the feeder wagon body for movement (1) with the feeder wagon body as it moves along the first path, and (2) along a second path transverse to the first path between a first, tape-engaged position and a second, tape-released position. The feeder head comprises a tape-engaging element engageable with component tape.
Solder paste compositions and methods for applying solder paste. The solder paste includes lubricating additives to the flux to decrease friction and the changes of metal to metal contact between the surfaces of the solder balls and other surfaces that the solder balls come into contact with. The solder paste also includes solder balls of different average sizes, that improves the desirable liquid like properties of the granular paste while further reducing viscosity. As such, the solder paste is used in current screen printing solder paste application methods without the risk of clogging or agglomeration of solder paste particles on surfaces. The solder paste is also used in jetting or dispensing solder paste application methods without the risk of clogging or agglomeration within the cylinders/containers or apertures and nozzles that are used within such methods.
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p.ex. par la forme
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p.ex. comme enrobages, comme flux; Emploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/362 - Emploi de compositions spécifiées de flux
24.
METHOD AND FLUID TRANSFER UNIT HAVING SQUEEGEES FOR PROVIDING A SMOOTH SURFACE OF FLUID
A method and apparatus for applying mounting a mixture, solution or flux to an electronic component in an electronic component mounting apparatus. The method and apparatus includes a plate (200) with cavities (206) of various sizes. The cavities are filled with a viscous molding mixture, solution or flux as electronic component are dipped into the cavity such that a portion of the component is wetted with the mounting solution or flux. The cavities can be filled with a number of different types of solution or flux. The method and apparatus can include a squeegee (202, 204), scraper or blade that is run across the surface of the plate along the rim that defines the opening of the cavity, thereby displacing mixture, solution or flux out of the cavity such that a smooth and uniform surface is created within the cavity. The method and apparatus can include any number of blades. The blades can be angled such that the mixture, solution or flux is pushed in a direction that is relatively perpendicular to the direction in which the blades are moved across the surface of the plate. The blade can be mounted at off-setting positions such that the blades displace the trail of solution or flux that spills out of the path of movement of the other blade.
The present invention describes a method and adaptive optics device inform of an assembly comprising a first deformable mirror, or membrane (201), which is coupled to a first cavity (208) comprised in a hermetically closed cavity, and a second deformable mirror (203) or membrane coupled to a second cavity (211) of the same hermetically closed cavity, wherein the deformable membrane coupled to the second cavity is configured to be used in order to balance or compensate for a change of volume or pressure in the first cavity.
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
In general, one aspect of the technology described can be embodied in methods that include the action of applying a writing mechanism having non-isotropic writing properties resulting from different degrees of coherence interaction in a sweep direction and a cross-sweep direction, writing an image pattern twice on a work piece using the writing mechanism rotated relative to the image pattern written on the workpiece between first and second writings, whereby writing with the rotated writing mechanism averages the non-isotropic properties. The lesser included angle separating first and second relative directions of movement between a workpiece and writing mechanism may be 20 degrees or greater, or somewhat less, under conditions described herein.
The technology disclosed relates to improved acousto-optic deflectors (AODs). In particular, it relates to compensation for subtle effects not previously addressed by AOD designers. A shifting center of gravity is described and addressed using advanced power equalisation strategies. Denser writing brushes are provided by using a two-dimensional array of beams with corrections for factors such as angle of incidence at the AOD interface. The compensation and dense brush features can be used separately or in combination.
G02F 1/11 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p.ex. commutation, ouverture de porte ou modulation; Optique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments acousto-optiques, p.ex. en utilisant la diffraction variable par des ondes sonores ou des vibrations mécaniques analogues
The technology disclosed relates to improved acousto-optic deflectors (AODs). In particular, it relates to compensation for subtle effects not previously addressed by AOD designers. A shifting center of gravity is described and addressed using advanced power equalisation strategies.
G02F 1/11 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p.ex. commutation, ouverture de porte ou modulation; Optique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments acousto-optiques, p.ex. en utilisant la diffraction variable par des ondes sonores ou des vibrations mécaniques analogues
A pick-and-place tool configured to pick and place at least one die on a workpiece includes a mounting head. The mounting head includes a die position determining unit configured to one of measure and detect an actual position of at least one die during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece.
H01L 21/68 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le positionnement, l'orientation ou l'alignement
H01L 21/683 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants pour le maintien ou la préhension
H01L 21/67 - Appareils spécialement adaptés pour la manipulation des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide pendant leur fabrication ou leur traitement; Appareils spécialement adaptés pour la manipulation des plaquettes pendant la fabrication ou le traitement des dispositifs à semi-conducteurs ou des dispositifs électriques à l'état solide ou de leurs composants
30.
APPARATUS AND METHODS FOR COMPENSATION OF CARRIER DISTORTION FROM MEASUREMENT MACHINES
In a method for generating a pattern on a workpiece having at least one die placed thereon, positions of the at least one die and at least two global alignment marks on the workpiece are measured, pattern adjustment data is generated, pattern image data associated with the pattern to be written is adjusted based on the generated pattern adjustment data, and the pattern is generated on the workpiece based on the modified pattern adjustment data.
The technology described applies an extended frequency range of over one octave to drive an acousto-optic deflector, thereby defying a design rule of thumb that limited bandwidth to just under one octave. A combination of extended frequency range and well-timed beam blanking reduces the proportion of a so-called chirp signal that is consumed by beam blanking. This increases the working, effective portion of the sweep signal.
G02F 1/33 - Dispositifs de déflexion acousto-optique
G02F 1/11 - Dispositifs ou dispositions pour la commande de l'intensité, de la couleur, de la phase, de la polarisation ou de la direction de la lumière arrivant d'une source lumineuse indépendante, p.ex. commutation, ouverture de porte ou modulation; Optique non linéaire pour la commande de l'intensité, de la phase, de la polarisation ou de la couleur basés sur des éléments acousto-optiques, p.ex. en utilisant la diffraction variable par des ondes sonores ou des vibrations mécaniques analogues
32.
Method and apparatus for performing pattern reconnection after individual or multipart alignment
A method for patterning a second layer of a work piece in a direct write machine in the manufacturing of a multilayer system-in-package stack. The work piece having a first layer with a plurality of electrical components in the form of dies arbitrarily placed. Each component having connection points where some need to be connected between the components. A first pattern wherein different zones comprising connection points of dies distributed in the first layer are associated with different requirements on alignment. The method comprising the steps of: a. Detecting sacred zones in first pattern that have a high requirement on alignment to selected features of the system-in-package stack or to the placed components; b. Detecting stretch zones of the first pattern that are allowed to have a lower requirement on alignment to other features of the system-in-package stack; c. Transforming the first pattern by calculating adjusted first pattern data comprising transformation of the original circuit pattern such that: i. connection points in adjacent sacred zones are aligned within a pre-settable alignment deviation parameter; and such that ii. deviations between the positions of corresponding connection points in the sacred zones are compensated for in the pattern for connection points of the stretch zones; d. writing a pattern on the layer of the work piece according to the adjusted pattern data. The first pattern may also be simultaneously matched to a second pattern.
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
G03C 5/00 - Procédés photographiques ou agents à cet effet; Régénération de tels agents de traitement
33.
METHOD AND APPARATUS FOR ALIGNMENT OPTIMIZATION WITH RESPECT TO PLURALITY OF LAYERS
A method of patterning a plurality of layers (L1, L2, L3, L4) of a work piece (2404) in a series of writing cycles in one or a plurality of write machines, the workpiece being deviced to have a number of N layers (L1, L2, L3, L4) and layers of the workpiece having one or a plurality of boundary condition (s) for pattern position, the method comprising the steps of: determining the boundary conditions of layers 1 to N, calculating deviations due to the boundary conditions and calculating a compensation for the deviation of the first transformation added with the assigned part of the deviation due to the boundary conditions.
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
34.
Pattern generators, calibration systems and methods for patterning workpieces
A pattern generator includes: a writing tool and a calibration system. The writing tool is configured to generate a pattern on a workpiece arranged on a stage. The calibration system is configured to determine a correlation between a coordinate system of the writing tool and a coordinate system of a calibration plate on one of the stage and the workpiece. The calibration system is also configured to determine the correlation at least partly based on an optical correlation signal, or pattern, in a form of at least one optical beam being reflected from at least one reflective pattern on the surface of the calibration plate.
G01B 11/14 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la distance ou la marge entre des objets ou des ouvertures espacés
35.
PATTERN GENERATORS COMPRISING A CALIBRATION SYSTEM
A pattern generator includes: a writing tool and a calibration system. The writing tool is configured to generate a pattern on a workpiece arranged on a stage. The calibration system is configured to determine a correlation between a coordinate system of the writing tool and a coordinate system of a calibration plate on one of the stage and the workpiece. The calibration system is also configured to determine the correlation at least partly based on an optical correlation signal, or pattern, in a form of at least one optical beam being reflected from at least one reflective pattern on the surface of the calibration plate.
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
The present invention relates to laser ablation microlithography. In particular, we disclose a new SLM design and patterning method that uses multiple mirrors per pixel to concentrate energy to an energy density that facilitates laser ablation, while keeping the energy density on the SLM mirror surface at a level that does not damage the mirrors. Multiple micro-mirrors can be reset at a very high frequency, far beyond current DMD devices.
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
B23K 26/06 - Mise en forme du faisceau laser, p.ex. à l’aide de masques ou de foyers multiples
B23K 26/067 - Division du faisceau en faisceaux multiples, p.ex. foyers multiples
37.
METHOD FOR MERGING MULTIPLE GEOMETRICAL PIXEL IMAGES AND GENERATING A SINGLE MODULATOR PIXEL IMAGE
The present invention relates to customizing individual workpieces, such as chip, flat panels or other electronic devices produced on substrates, by direct writing a custom pattern. Customization can be per device, per substrate, per batch or at some other small volume that makes it impractical to use a custom mask or mask set. In particular, it relates to customizing a latent image formed in a radiation sensitive layer over a substrate, merging standard and custom pattern data to form a custom pattern used to produce the customized latent image. A wide variety of substrates can benefit from the technology disclosed.
This invention relates to an improved micro lithographic writer that sweeps a modulated pattern across the surface of a workpiece. The SLM disclosed works in a diffractive mode with a continuous or quasi-continuous radiation source. It uses a long and narrow SLM and takes advantage of diffractive effects along the narrow axis of the SLM to improve writing characteristics along that axis.
The technology disclosed relates to a partially coherent illuminators.In particular, it relates to a partially coherent illuminator that directs laser radiation across multiple areas of an illumination pupil. In some circumstances, this reduces spatial and/or temporal coherence of the laser radiation. It must be used with a continuous laser to provide partially coherent illumination from a coherent laser. It can be combined with a workpiece tracker that effectively freezes the workpiece and extends the time that laser radiation can be applied to expose a pattern stamp on the work piece or, it can be used with a stepper platform, without a tracker.A dynamically controllable aperture architecture is a by product of the technology disclosed.
A method for patterning a workpiece in a direct write machine in the manufacturing of a multilayer stack, wherein a first circuit pattern comprising patterns for connection points is transformed according to determined fitting tolerances to fit to connection points of a second circuit pattern and to circuit pattern(s) of specific features such as random placed dies, or group of dies, on or in the workpiece. The second layer may be a previously formed layer or a layer to be formed on the same workpiece or on a different workpiece for the stack. Pattern data associated with selected die is transformed into adjusted circuit pattern data using the transformation defined by the transformed positions such that the circuit pattern is fitted to the selected die(s).
G06F 19/00 - Équipement ou méthodes de traitement de données ou de calcul numérique, spécialement adaptés à des applications spécifiques (spécialement adaptés à des fonctions spécifiques G06F 17/00;systèmes ou méthodes de traitement de données spécialement adaptés à des fins administratives, commerciales, financières, de gestion, de surveillance ou de prévision G06Q;informatique médicale G16H)
An alignment method for the of patterning a work piece in a direct write machine, wherein a reference board provided with board reference features is used to coordinate calibration of a measurement station and a writing station against a common reference. An adjusted pattern is for writing on the work piece is calculated relative to the position of the reference board.
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
42.
METHOD AND APPARATUS FOR PERFORMING PATTERN ALIGNMENT
A method for patterning a workpiece in a direct write machine in the manufacturing of a multilayer stack, wherein a first circuit pattern (1304) comprising patterns for connection points is transformed according to determined fitting tolerances to fit to connection points of a second circuit pattern (1306) and to circuit pattern(s) of specific features such as random placed dies, or group of dies, on or in the workpiece. The second layer may be a previously formed layer or a layer to be formed on the same workpiece or on a different workpiece for the stack. Pattern data associated with selected die is transformed into adjusted circuit pattern data using the transformation defined by the transformed positions such that the circuit pattern is fitted to the selected die(s).
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
43.
METHOD AND APPARATUS FOR PERFORMING PATTERN ALIGNMENT
A method for patterning a second layer of a work piece in a direct write machine in the manufacturing of a multilayer system-in-package stack. The work piece having a first layer with a plurality of electrical components in the form of dies (1502) arbitrarily placed. Each component having connection points where some need to be connected between the components. A first pattern wherein different zones (1510) comprising connection points of dies distributed in the first layer are associated with different requirements on alignment. The method comprising the steps of: a. Detecting sacred zones in first pattern that have a high requirement on alignment to selected features of the system-in-package stack or to the placed components; b. Detecting stretch zones (1510) of the first pattern that are allowed to have a lower requirement on alignment to other features of the system-in-package stack; c. Transforming the first pattern by calculating adjusted first pattern data comprising transformation of the original circuit pattern such that: i. connection points in adjacent sacred zones are aligned within a pre-settable alignment deviation parameter; and such that ii. deviations between the positions of corresponding connection points in the sacred zones are compensated for in the pattern for connection points of the stretch zones; d. writing a pattern on the layer of the work piece according to the adjusted pattern data. The first pattern may also be simultaneously matched to a second pattern.
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
44.
Method and apparatus for alignment optimization with respect to plurality of layers for writing different layers with different machine configurations
A method of patterning a plurality of layers of a work piece in a series of write machines, wherein errors due to different transformation capabilities of different machines are compensated by distributing the errors over the plurality of layers.
G06F 19/00 - Équipement ou méthodes de traitement de données ou de calcul numérique, spécialement adaptés à des applications spécifiques (spécialement adaptés à des fonctions spécifiques G06F 17/00;systèmes ou méthodes de traitement de données spécialement adaptés à des fins administratives, commerciales, financières, de gestion, de surveillance ou de prévision G06Q;informatique médicale G16H)
A method for patterning a workpiece provided with dies in a direct write machine, wherein measurement data of positions of the dies in terms of location and orientation together with the workpiece location and orientation relative the writer coordinate system is used to determine a transformation of the measured positions into transformed positions defined in the coordinate system of the direct write machine. Pattern data associated with a selected die, or group of dies, is transformed into adjusted circuit pattern data dependent both on the original pattern data and the transformed positions, wherein the adjusted circuit pattern data represents the circuit pattern of the plurality of dies, or group of dies, such that the adjusted circuit pattern is fitted to a plurality of sub-areas of the workpiece area, and wherein each sub-area is associated with a die, or group of dies, among the plurality of dies distributed on the workpiece. A pattern is then written on the workpiece according to the adjusted circuit pattern data.
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
46.
METHOD AND APPARATUS FOR PERFORMING PATTERN ALIGNMENT
A method of patterning a plurality of layers of a work piece in a series of write machines, wherein errors due to different transformation capabilities of different machines are compensated by distributing the errors over the plurality of layers.
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
H05K 3/00 - Appareils ou procédés pour la fabrication de circuits imprimés
A pattern generation system includes an optical system (106) and a rotor (100). The optical system (106) is configured to project a laser image onto an optical scanner c(104). The rotor (100) has a plurality of optical arms (102) arranged at a first angle relative to one another, and further includes the optical scanner (104). The laser image is sequentially reflected by the optical scanner (104) into each of the plurality of optical arms (102) of the rotor (100) to generate a pattern on a workpiece.
A pattern generation system includes an optical system and a rotor. The optical system is configured to project a laser image onto an optical scanner. The rotor has a plurality of optical arms arranged at a first angle relative to one another, and further includes the optical scanner. The laser image is sequentially reflected by the optical scanner into each of the plurality of optical arms of the rotor to generate a pattern on a workpiece.
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
49.
OPTICAL SYSTEMS CONFIGURED TO GENERATE MORE CLOSELY SPACED LIGHT BEAMS AND PATTERN GENERATORS INCLUDING THE SAME
An optical arrangement includes a focusing lens and a plurality of light sources. The focusing lens is configured to focus a plurality of light beams to form an array of virtual light sources in an image plane. The plurality of light sources are configured to emit the plurality of light beams such that the light beams cross each other in a plane.
The technology disclosed relates to translating between a Cartesian grid and a curved scanning path that produces varying exposure doses as the scanning head traces the curved scanning path. It can be applied to writing to or reading from a workpiece. In particular, we teach use of varying exposure dose that compensates for the curved scan path to transit a straight axis. This simplifies either modulation of a modulator, from which data is projected onto the workpiece, or analysis of data collected by a detector, onto which partial images of the workpiece are projected.
The technology disclosed relates to an illumination source including numerous laser diodes. In particular, it relates to extending the duty cycle and/or reducing the frequency of component replacement by detecting failure of one or more individual laser diodes and compensating for the failure, without replacing the laser diodes. The technology disclosed can be used in cases of catastrophic laser diode failure by changing the power of remaining laser diodes to restore illumination to the coherence function similar to the pre-failure illumination field. Particular aspects of the technology disclosed are described in the claims, specification and drawings.
The technology disclosed relates to variable tapers to resolve varying overlaps between adjacent strips that are lithographically printed. Technology disclosed combines an aperture taper function with the variable overlap taper function to transform data and compensate for varying overlaps. The variable taper function varies according to overlap variation, including variation resulting from workpiece distortions, rotor arm position, or which rotor arm printed the last stripe. Particular aspects of the present invention are described in the claims, specification and drawings.
The technology disclosed relates to methods and devices that compensate for displacements in a pattern or deformations of workpiece. In particular, that relates to using timing to compensate for displacements along a first axis along the scanning direction while using resampling, interpolation or a similar method to compensate for displacements along a second axis that is substantially orthogonal to the first axis. The scanning direction may be an actual direction of movement of the scanning head or it may be a direction perpendicular to an orientation of an image projected onto a workpiece.
The technology disclosed relates to handling varying pixel overlaps long a first axis as a scanning head sweeps a curved path that is not parallel to the first axis. In particular, we teach use of a variable frequency pixel clock to produce equally spaced pixels along the first axis as a rotor arm scans a curved path that is not parallel to the first axis. The pixel clock has a varying frequency that varies approximately sinusoidally with the position of the scanning head relative to the first axis.
A lithographic workpiece processing tool includes a loading area for loading a workpiece; and a processing area for processing a workpiece. The workpiece processing tool further includes a multi-table system arranged between the loading area and the processing area. The multi-table system includes at least two tables configured to pass each other while moving between the loading area and the processing area. Each of the at least two tables is configured to hold a workpiece.
G03B 27/58 - Platines, margeurs ou autres supports pour le matériau sensible
G03B 27/42 - Appareils de tirage par projection, p.ex. agrandisseur, appareil photographique de reproduction pour la reproduction automatique répétée d'un même original
The novel SLM uses a two dimensional array of mirrors, with columns of mirrors addressed as if they were a single element. By using a two-dimensional array, the resonance frequency, which limits the modulation speed, is determined by the resonance frequency of a single small mirror element and the power handling is determined by the combined area of mirrors. By designing individual mirrors for speed and driving many of them as a single element, it is possible to decouple power handling from modulation speed. The design of the mirrors and the array are further adapted to efficient use in high-speed high-power lithography.
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
H04N 1/195 - Dispositions de balayage utilisant des ensembles composés de plusieurs éléments l'ensemble comprenant un ensemble à deux dimensions
57.
RECONFIGURABLE MICRO-MECHANICAL LIGHT MODULATOR AND METHOD
The present invention describes a reconfigurable micro-mechanical light modulator including a two-dimensional array of modulating elements with reflecting surfaces organized in multiple rows and columns. The modulating elements are adapted to modulate light impinging on the micro-mechanical light modulator. According to the invention, the array of modulating elements comprises a first and a second set of modulating elements where the second set is a redundant set of modulating elements being configured to be activated in order to substitute the first set of modulating elements in modulating light impinging on the micro- mechanical light modulator, without physically replacing the micro-mechanical light modulator.
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
A lithographic workpiece processing tool includes a loading area (108) for loading a workpiece; and a processing area (106) for processing a workpiece. The workpiece processing tool further includes a multi-table system (10) arranged between the loading area and the processing area. The multi-table system includes at least two tables (110, 112) configured to pass each other while moving between the loading area and the processing area. Each of the at least two tables is configured to hold a workpiece.
In a measurement device for measuring a peripheral position in a Cartesian coordinate system, a rotating laser source is configured to emit a laser beam along a radius of a rotator. A reflector is configured to reflect the laser beam in a direction orthogonal to a path of the laser beam, and a scale having a pattern of transparent and reflective areas is positioned at a peripheral position of the measurement device. A detector is configured to provide a sequence of pulses by detecting a reflex or transmission of the rotating laser beam while the laser scans over the scale. The sequence of pulses correspond to Cartesian coordinates of the system.
G01B 11/14 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer la distance ou la marge entre des objets ou des ouvertures espacés
G01B 11/26 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour tester l'alignement des axes
60.
CARTESIAN COORDINATE MEASUREMENT FOR A ROTATING SYSTEM
In a measurement device for measuring a peripheral position in a Cartesian coordinate system, a rotating laser source (206) is configured to emit a laser beam (108) along a radius of a rotator (208). A reflector (610, 710) is configured to reflect the laser beam in a direction orthogonal to a path of the laser beam, and a scale (204, 304, 404, 604, 704) having a pattern (102, 104) of transparent and reflective areas is positioned at a peripheral position of the measurement device. A detector (306) is configured to provide a sequence of pulses (106) by detecting a reflex or transmission of the rotating laser beam (108) while the laser scans over the scale. The sequence of pulses (106) correspond to Cartesian coordinates (X, Y) of the system.
G01B 11/00 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques
G01D 5/244 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensible; Moyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminé; Transducteurs non spécialement adaptés à une variable particulière utilisant des moyens électriques ou magnétiques produisant des impulsions ou des trains d'impulsions
G01D 5/26 - Moyens mécaniques pour le transfert de la grandeur de sortie d'un organe sensible; Moyens pour convertir la grandeur de sortie d'un organe sensible en une autre variable, lorsque la forme ou la nature de l'organe sensible n'imposent pas un moyen de conversion déterminé; Transducteurs non spécialement adaptés à une variable particulière utilisant des moyens optiques, c. à d. utilisant de la lumière infrarouge, visible ou ultraviolette
G01S 17/42 - Mesure simultanée de la distance et d'autres coordonnées
61.
GRADIENT ASSISTED IMAGE RESAMPLING IN MICRO-LITHOGRAPHIC PRINTING
The present disclosure relates to the re-sampling of pixel data, with one application being micro-lithography. In particular, it relates to the extraction of modulator pixels from a rasterized image, as a function of how the modulator moves across the rasterized image.
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
G06T 9/20 - Codage des contours, p.ex. utilisant la détection des contours
62.
METHODS AND APPARATUSES FOR INCREASING AVAILABLE POWER IN OPTICAL SYSTEMS
A diffractive optical element (DOE) is included in an apparatus for combining a plurality of laser beams. The DOE combines the plurality of laser beams to generate a plurality of spatially distributed laser beams. The DOE is one of movable or stationary. The spatially distributed laser beams are usable to pattern a workpiece.
The technology disclosed relates to scanning of large fiat substrates for reading and writing images. Examples are flat panel displays, PCB's and photovoltaic panels. Reading and writing is to be understood in a broad sense: reading may mean microscopy, inspection, metrology, spectroscopy, interferometry, scatterometry, etc. of a large workpiece, and writing may mean exposing a photoresist, annealing by optical heating, ablating, or creating any other change to the surface by an optical beam. In particular, we disclose a technology that uses a rotating or swinging arm (1140A, 1140B, 1140C) that describes an arc across a workpiece (1111,1112) as it scans, instead of following a traditional straight-line motion.
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
The current invention relates to writing or reading a pattern on a surface, such as in microlithography or inspection of mircrolithographic patterns. In particular, Applicant discloses systems recording or reading images by scanning sparse 2D point arrays or grids across the surface, e.g., multiple optical, electron or particle beams modulated in parallel. The scanning and repeated reading or writing creates a dense pixel or spot grid on the workpiece. The grid may be created by various arrays: arrays of light sources, e.g., laser or LED arrays, by lenslet arrays where each lenslet has its own modulator, by aperture plates for particle beams, or arrays of near- field emitters or mechanical probes. For reading systems, the point grid may be created by a sparse point matrix illumination and/or a detector array where each detector element sees only one spot. The idea behind the use of large arrays is to improve throughput. However, the throughput does not scale with the array size, since above a certain size of arrays, previously known schemes fall into in their own tracks and start repeating the same data over and over again. This application discloses methods to scan workpieces with large arrays while preserving the scaling of throughput proportional to array size, even for very large arrays, in fact essentially without limits.
G02B 26/08 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables pour commander la direction de la lumière
65.
MULTI-FOCUS METHOD OF ENHANCED THREE-DIMENSIONAL EXPOSURE OF RESIST
The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optical, mechanical, fluidic, etc. components, e.g. diffusors, non-reflecting surfaces, Fresnel lenses and Fresnel prisms, computer-generated holograms, lenslet arrays, etc, or to be used as masters for the fabrication of such components by replication. Replication can be done by molding, pressing, embossing, electroplating, etching, as known in the art. This disclosure includes descriptions of using passive absorbing components in thin resist, using high gamma thick resists with high resolution pattern generators, using multiple focal planes including at least one focal plane in the bottom half of the resist, and iterative simulation of patterning and adjustment of an exposure map.
The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optical, mechanical, fluidic, etc. components, e.g. diffusors, non-reflecting surfaces, Fresnel lenses and Fresnel prisms, computer-generated holograms, lenslet arrays, etc, or to be used as masters for the fabrication of such components by replication. Replication can be done by molding, pressing, embossing, electroplating, etching, as known in the art. This disclosure includes descriptions of using passive absorbing components in thin resist, using high gamma thick resists with high resolution pattern generators, using multiple focal planes including at least one focal plane in the bottom half of the resist, and iterative simulation of patterning and adjustment of an exposure map.
G03F 7/00 - Production par voie photomécanique, p.ex. photolithographique, de surfaces texturées, p.ex. surfaces imprimées; Matériaux à cet effet, p.ex. comportant des photoréserves; Appareillages spécialement adaptés à cet effet
67.
METHOD OF COMPENSATION FOR BLEACHING OF RESIST DURING THREE-DIMENSIONAL EXPOSURE OF RESIST
The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optical, mechanical, fluidic, etc. components, e.g. diffusors, non-reflecting surfaces, Fresnel lenses and Fresnel prisms, computer-generated holograms, lenslet arrays, etc, or to be used as masters for the fabrication of such components by replication. Replication can be done by molding, pressing, embossing, electroplating, etching, as known in the art. This disclosure includes descriptions of using passive absorbing components in thin resist, using high gamma thick resists with high resolution pattern generators, using multiple focal planes including at least one focal plane in the bottom half of the resist, and iterative simulation of patterning and adjustment of an exposure map.
The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optical, mechanical, fluidic, etc. components, e.g. diffusors, non-reflecting surfaces, Fresnel lenses and Fresnel prisms, computer-generated holograms, lenslet arrays, etc, or to be used as masters for the fabrication of such components by replication. Replication can be done by molding, pressing, embossing, electroplating, etching, as known in the art. This disclosure includes descriptions of using passive absorbing components in thin resist, using high gamma thick resists with high resolution pattern generators, using multiple focal planes including at least one focal plane in the bottom half of the resist, and iterative simulation of patterning and adjustment of an exposure map.
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
69.
Method of compensation for bleaching of resist during three-dimensional exposure of resist
The field of this disclosure is making three-dimensional topographic structures by means of graduated exposure in a photosensitive material, such as a photoresist, photosensitive polymide, or similar. Such patterns may be written either to be used directly as optical, mechanical, fluidic, etc. components, e.g. diffusors, non-reflecting surfaces, Fresnel lenses and Fresnel prisms, computer-generated holograms, lenslet arrays, etc, or to be used as masters for the fabrication of such components by replication. Replication can be done by molding, pressing, embossing, electroplating, etching, as known in the art. This disclosure includes descriptions of using passive absorbing components in thin resist, using high gamma thick resists with high resolution pattern generators, using multiple focal planes including at least one focal plane in the bottom half of the resist, and iterative simulation of patterning and adjustment of an exposure map.
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
G03C 5/00 - Procédés photographiques ou agents à cet effet; Régénération de tels agents de traitement
70.
Method and apparatus for overlay compensation between subsequently patterned layers on workpiece
Methods and apparatuses for patterning workpieces are provided. The methods and apparatuses described herein improve overlay between subsequently patterned layers on a workpiece by introducing an improved alignment method that compensates for workpiece distortions.
G03F 9/00 - Mise en registre ou positionnement d'originaux, de masques, de trames, de feuilles photographiques, de surfaces texturées, p.ex. automatique
71.
Spatial light modulator with structured mirror surfaces
The invention relates to methods to improve SLMs, in particular to reflecting micromechanical SLMs, for applications with simple system architecture, high precision, high power handling capability, high throughput, and/or high optical processing capability. Applications include optical data processing, image projection, lithography, image enhancement, holography, optical metrology, coherence and wavefront control, and adaptive optics. A particular aspect of the invention is the achromatization of diffractive SLMs so they can be used with multiple wavelengths sequentially, simultaneously or as a result of spectral broadening in very short pulses.
G02B 26/00 - Dispositifs ou dispositions optiques pour la commande de la lumière utilisant des éléments optiques mobiles ou déformables
G03B 27/42 - Appareils de tirage par projection, p.ex. agrandisseur, appareil photographique de reproduction pour la reproduction automatique répétée d'un même original
72.
Platforms, apparatuses, systems and methods for processing and analyzing substrates
Devices and methods for manufacturing displays, solar panels and other devices using larger size workpieces are provided. The workpiece is rolled into a cylinder, thereby reducing the physical size by a factor of 3 in one dimension. The stages on which the workpieces are rolled have a cylindrical shape, which allows a more robust and/or compact movement of the glass, reduced machine weight. The workpieces are relatively thin, more flexible, and are rolled onto a cylinder with a diameter of about 1 meter.
B05B 7/00 - Appareillages de pulvérisation pour débiter des liquides ou d'autres matériaux fluides provenant de plusieurs sources, p.ex. un liquide et de l'air, une poudre et un gaz
B05B 5/00 - Pulvérisation électrostatique; Dispositifs de pulvérisation comportant des moyens pour charger électriquement le pulvérisat; Pulvérisation de liquides ou d'autres matériaux fluides par voies électriques
H05B 6/00 - Chauffage par champs électriques, magnétiques ou électromagnétiques
B41J 2/435 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par l'irradiation sélective d'un matériau d'impression ou de transfert d'impression
G01B 11/24 - Dispositions pour la mesure caractérisées par l'utilisation de techniques optiques pour mesurer des contours ou des courbes
Patterns are written on workpieces, such as, glass sheets and/or plastic sheets used in, for example, electronic display devices such as LCDs. The workpiece may be larger than about 1500 mm may be used. An optical writing head with a plurality of writing units may be used. The workpiece and the writing head may be moved relative to one another to provide oblique writing.
B41J 2/435 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par l'irradiation sélective d'un matériau d'impression ou de transfert d'impression
B41J 2/47 - Machines à écrire ou mécanismes d'impression sélective caractérisés par le procédé d'impression ou de marquage pour lequel ils sont conçus caractérisés par l'irradiation sélective d'un matériau d'impression ou de transfert d'impression utilisant la combinaison du balayage et de la modulation de lumière
brevets
