Abstract

The present invention provides a cylindrical brush assembly designed for precision cleaning of circular wafers and delicate surfaces. The brush features polyvinyl alcohol (PVA) nodules of varying lengths along one side of a cylindrical core, enabling conformity to changing gap sizes when applied at an angle to the wafer. This ensures consistent contact and uniform cleaning across the entire surface. A modular design with replaceable nodule holders allows for easy customization and maintenance. An integrated RFID tracking system embedded in the end cap monitors usage and wear levels in real time. The cleaning method involves rotating the brush at an angle relative to the wafer surface, with the nodules adapting to surface contours for optimal efficiency. While tailored for semiconductor wafer cleaning, the assembly is adaptable for other industrial applications requiring precision cleaning.

IPC Classes  ?

• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
• A46B 13/00 - Brushes with driven brush bodies
• A46B 7/04 - Bristle carriers arranged in the brush body interchangeably
• A46B 9/02 - Position or arrangement of bristles in relation to surface of the brush body, e.g. inclined, in rows, in groups
• B08B 1/34 - Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis parallel to the surface
• H01L 21/02 - Manufacture or treatment of semiconductor devices or of parts thereof
• A46B 3/00 - Brushes characterised by the way in which the bristles are fixed or joined in or on the brush body or carrier

Abstract

The present invention provides a cylindrical brush assembly designed for precision cleaning of circular wafers and delicate surfaces. The brush features polyvinyl alcohol (PVA) nodules of varying lengths along one side of a cylindrical core, enabling conformity to changing gap sizes when applied at an angle to the wafer. This ensures consistent contact and uniform cleaning across the entire surface. A modular design with replaceable nodule holders allows for easy customization and maintenance. An integrated RFID tracking system embedded in the end cap monitors usage and wear levels in real time. The cleaning method involves rotating the brush at an angle relative to the wafer surface, with the nodules adapting to surface contours for optimal efficiency. While tailored for semiconductor wafer cleaning, the assembly is adaptable for other industrial applications requiring precision cleaning.

IPC Classes  ?

• A46B 9/12 - Non-adjustable supports
• A46B 7/00 - Bristle carriers arranged in the brush body
• A46B 9/02 - Position or arrangement of bristles in relation to surface of the brush body, e.g. inclined, in rows, in groups
• A46D 1/00 - BristlesSelection of materials for bristles
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

Abstract

A method for manufacturing a cylindrical brush of a cleaning tool, comprises a cylindrical brush having a core member, a plurality of rail plates, a plurality of polyvinyl alcohol (PVA) nodule foam bars and a pair of end caps. The core member includes an outer wall having a plurality of core holes and a pair of openings. The plurality of rail plates having a plurality of rail holes arranged along the outer wall of the core member. The plurality of polyvinyl alcohol (PVA) nodule foam bars is installed at each of the plurality of rail plates such that each of a plurality of nodules of the PVA nodule foam bar aligns with the plurality of core holes and with the plurality of rail holes. The pair of end caps encloses the pair of openings of the core member.

IPC Classes  ?

• B29L 31/42 - Brushes
• H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

Abstract

A method for manufacturing a cylindrical brush of a cleaning tool, comprises a cylindrical brush having a core member, a plurality of rail plates, a plurality of polyvinyl alcohol (PVA) nodule foam bars and a pair of end caps. The core member includes an outer wall having a plurality of core holes and a pair of openings. The plurality of rail plates having a plurality of rail holes arranged along the outer wall of the core member. The plurality of polyvinyl alcohol (PVA) nodule foam bars is installed at each of the plurality of rail plates such that each of a plurality of nodules of the PVA nodule foam bar aligns with the plurality of core holes and with the plurality of rail holes. The pair of end caps encloses the pair of openings of the core member.

IPC Classes  ?

• B29C 45/26 - Moulds
• A46B 3/00 - Brushes characterised by the way in which the bristles are fixed or joined in or on the brush body or carrier
• A46B 9/00 - Arrangements of the bristles in the brush body
• A46B 9/02 - Position or arrangement of bristles in relation to surface of the brush body, e.g. inclined, in rows, in groups
• A46B 9/12 - Non-adjustable supports
• A46B 11/06 - Brushes with reservoir or other means for applying substances, e.g. paints, pastes, water connected to supply pipe
• A46B 13/00 - Brushes with driven brush bodies
• A46B 13/04 - Brushes with driven brush bodies power-driven with reservoir or other means for supplying substances
• A46D 1/00 - BristlesSelection of materials for bristles
• B29C 45/00 - Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mouldApparatus therefor
• B29C 45/17 - Component parts, details or accessoriesAuxiliary operations
• B29C 45/40 - Removing or ejecting moulded articles