42 - Scientific, technological and industrial services, research and design
Goods & Services
Non-downloadable computer software program using artificial intelligence for use in a laboratory in the field of materials science and materials development; Non-downloadable computer software program using artificial intelligence for use in scientific research in the field of materials science and materials development; Non-downloadable computer software program using artificial intelligence for collecting, analyzing and organizing data in the field of materials science and materials development; Non-downloadable computer software program using artificial intelligence to write documents and emails in the field of materials science and materials development
2.
OPTICALLY CLEAR RESIN COMPOSITION, FLEXIBLE OPTICAL FILM AND IMAGE DISPLAY DEVICE
A photocurable resin composition for forming an optically clear film. The photocurable resin composition includes a polyfunctional thiol monomer comprising 2 thiol functional groups, a polyfunctional (meth)acrylate monomer comprising 2 (meth)acryloyl functional groups, a photo-initiator present in a concentration of about 1 parts per hundred (phr) or less, a sterically hindered phenolic antioxidant present in a concentration of about 5 phr or less, and a phosphite antioxidant present in a concentration of about 5 phr or less.
A photocurable resin composition for forming an optically clear film. The photocurable resin composition includes a polyfunctional thiol monomer comprising 2 thiol functional groups, a polyfunctional (meth)acrylate monomer comprising 2 (meth)acryloyl functional groups, a photo-initiator present in a concentration of about 1 parts per hundred (phr) or less, a sterically hindered phenolic antioxidant present in a concentration of about 5 phr or less, and a phosphite antioxidant present in a concentration of about 5 phr or less.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
4.
Photopatterned planarization layers for flexible electronics
Provided is a method for forming an organic planarization layer. The method includes forming lithographically-patterned arrays atop a substrate; disposing a thiol-based photocurable resin on to the lithographically-patterned arrays to form a photocurable planarization layer; and curing the photocurable planarization layer to form a flat surface above the lithographically-patterned array.
Provided are methods for selecting a polymer for use as a flexible electronics substrate. An example method includes selecting a thermosetting polymer from a plurality of polymers, wherein the thermosetting polymer: undergoes a thermomechanical transition at a transition temperature between room temperature and the highest temperature observed during processing from the glassy to the rubbery regime; wherein the thermosetting polymer has a Young's modulus below 3 GPa in the glassy regime and wherein the thermosetting polymer has a Young's modulus above 0.3 MPa in the rubbery regime. The method further includes producing a flexible electronic substrate from the selected polymer.
C08G 73/10 - Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
B05D 3/06 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
B05D 3/12 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
C08L 101/12 - Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
G03F 7/09 - Photosensitive materials - characterised by structural details, e.g. supports, auxiliary layers
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
6.
OPTICALLY CLEAR ADHESIVES USING SEMI-INTERPENETRATING POLYMER NETWORKS
Provided are semi -interpenetrating optically clear adhesives, methods of use, and methods of manufacture. An example semi-interpenetrating optically clear adhesive comprises a transparent polymer network comprised of at least two or more interpenetrating polymer networks, wherein at least one polymer network is a thermoset material and at least one other polymer network is a thermoplastic material, yielding an optically clear adhesive with a transparency above 80% and an elastic toughness above 1 MJ/m3.
Display modules typically incorporate a transparent hard material such as glass on the outside of the module in order to better protect the display stack from scratches, dents, and other mechanical deformations. However, as displays move to novel form factors such as bendable, foldable, and reliable display modules, these transparent hard materials (e.g., glass) may not be used due to their limited flexibility. Therefore, it is desirable that replacement materials be sufficiently flexible while maintaining the desirable optical (e.g., >90% transmission and low yellow index) and mechanical properties (e.g., pencil hardness>H) that comparable glass hard materials offer.
B32B 27/28 - Layered products essentially comprising synthetic resin comprising copolymers of synthetic resins not wholly covered by any one of the following subgroups
G02B 1/14 - Protective coatings, e.g. hard coatings
09 - Scientific and electric apparatus and instruments
42 - Scientific, technological and industrial services, research and design
Goods & Services
Automated laboratory equipment, namely, computer and networking hardware in the field of product research and development; hand operated laboratory tools for manipulating laboratory samples in the fields of chemical synthesis and materials processing and design; downloadable software for the design and development of automation and robotics computer hardware; downloadable software in the field of research and development of chemicals, agro- and biochemical goods, raw organic materials, biomaterials, electronic and optical materials, metals, meta and nano-materials, polymers, composites, cosmetics, coatings, dyes, alloys, cleaning agents, foods, lubricants, fuels and pesticides; downloadable software for data automation and collection services using proprietary software to evaluate, analyze and collect data; hand operated laboratory tools for manipulating laboratory samples for research and development of new products, chemicals, materials for others; hand operated laboratory tools for manipulating laboratory samples for research and development of chemicals, agro- and biochemical goods, raw organic materials, cosmetics, coatings, dyes, alloys, cleaning agents, foods, lubricants, fuels, and pesticides Scientific and technological services, namely, consulting in the field of product research and development; industrial analysis and research services in the fields of chemical synthesis and materials processing and design; design and development of software; design and development of automation and robotics computer hardware; consulting services in the field of research and development of chemicals, agro- and biochemical goods, raw organic materials, biomaterials, electronic and optical materials, metals, meta and nano-materials, polymers, composites, cosmetics, coatings, dyes, alloys, cleaning agents, foods, lubricants, fuels and pesticides; data automation and collection services using proprietary software to evaluate, analyze and collect data; research and development of new products, chemicals, materials for others; research and development for others of chemicals, agro- and biochemical goods, raw organic materials, cosmetics, coatings, dyes, alloys, cleaning agents, foods, lubricants, fuels, and pesticides
Provided are flexible color filters and methods of manufacturing flexible color filters. An example flexible color filter comprises a transparent flexible substrate comprising a thermoset thiol-click polymer. An example method of manufacturing a flexible color filter comprises dispensing a release layer on a stiff carrier substrate; dispensing a polymer resin on the release layer; curing the polymer resin into a transparent film; fabricating a flexible color filter on the transparent film; and removing the flexible color filter from the release layer and stiff carrier substrate.
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
B29C 41/02 - Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
10.
Temporary bonding layer for flexible electronics fabrication
Provided are microelectronics substrates and methods of manufacturing and using the microelectronics substrate. An example of a microelectronics substrate includes a carrier, a silicate bonding layer, and a flexible substrate, wherein the flexible substrate is bonded to the silicate bonding layer. The microelectronics substrate comprises a peel strength between the flexible substrate and silicate bonding layer; wherein the peel strength between the flexible substrate and the silicate bonding layer is below 1 kgf/m.
H01L 21/68 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for positioning, orientation or alignment
H01L 21/683 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for supporting or gripping
B32B 17/10 - Layered products essentially comprising sheet glass, or fibres of glass, slag or the like comprising glass as the main or only constituent of a layer, next to another layer of a specific substance of synthetic resin
B32B 37/26 - Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the laminating process, e.g. release layers or pressure equalising layers
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
H01L 23/24 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel, at the normal operating temperature of the device
11.
OPTICALLY CLEAR ADHESIVES USING SEMI-INTERPENETRATING POLYMER NETWORKS
Provided are semi -interpenetrating optically clear adhesives, methods of use, and methods of manufacture. An example semi -interpenetrating optically clear adhesive comprises a transparent polymer network comprised of at least two or more interpenetrating polymer networks, wherein at least one polymer network is a thermoset material and at least one other polymer network is a thermoplastic material, yielding an optically clear adhesive with a transparency above 80% and an elastic toughness above 1 MJ/m3.
Provided is a method for forming an organic planarization layer. The method includes forming lithographically-patterned arrays atop a substrate; disposing a thiol-based photocurable resin on to the lithographically-patterned arrays to form a photocurable planarization layer; and curing the photocurable planarization layer to form a flat surface above the lithographically-patterned array.
H01L 29/04 - Semiconductor bodies characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
Display modules typically incorporate a transparent hard material such as glass on the outside of the module in order to better protect the display stack from scratches, dents, and other mechanical deformations. However, as displays move to novel form factors such as bendable, foldable, and reliable display modules, these transparent hard materials (e.g., glass) may not be used due to their limited flexibility. Therefore, it is desirable that replacement materials be sufficiently flexible while maintaining the desirable optical (e.g., >90% transmission and low yellow index) and mechanical properties (e.g., pencil hardness > H) that comparable glass hard materials offer.
B29D 11/00 - Producing optical elements, e.g. lenses or prisms
G02B 11/04 - Optical objectives characterised by the total number of simple and compound lenses forming the objective and their arrangement having two lenses only arranged C C
14.
POLYMER SUBSTRATE DESIGN PARAMETERS FOR ELECTRONIC MICROFABRICATION
Provided are methods for selecting a polymer for use as a flexible electronics substrate. An example method includes selecting a thermosetting polymer from a plurality of polymers, wherein the thermosetting polymer: undergoes a thermomechanical transition at a transition temperature between room temperature and the highest temperature observed during processing from the glassy to the rubbery regime; wherein the thermosetting polymer has a Young's modulus below 3 GPa in the glassy regime and wherein the thermosetting polymer has a Young's modulus above 0.3 MPa in the rubbery regime. The method further includes producing a flexible electronic substrate from the selected polymer.
Provided are flexible color filters and methods of manufacturing flexible color filters. An example flexible color filter comprises a transparent flexible substrate comprising a thermoset thiol-click polymer. An example method of manufacturing a flexible color filter comprises dispensing a release layer on a stiff carrier substrate; dispensing a polymer resin on the release layer; curing the polymer resin into a transparent film; fabricating a flexible color filter on the transparent film; and removing the flexible color filter from the release layer and stiff carrier substrate.
Provided are microelectronics substrates and methods of manufacturing and using the microelectronics substrate. An example of a microelectronics substrate includes a carrier, a silicate bonding layer, and a flexible substrate, wherein the flexible substrate is bonded to the silicate bonding layer. The microelectronics substrate comprises a peel strength between the flexible substrate and silicate bonding layer; wherein the peel strength between the flexible substrate and the silicate bonding layer is below 1 kgf/m.
H01L 23/24 - Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel, at the normal operating temperature of the device
A bulk substrate for stretchable electronics. The bulk substrate is manufactured with a process that forms a soft-elastic region of the bulk substrate. The soft-elastic region includes a strain capacity of greater than or equal to 25% and a first Young's modulus below 10% of a maximum local modulus of the bulk substrate. The process also forms a stiff-elastic region of the bulk substrate. The stiff-elastic region includes a strain capacity of less than or equal to 5% and a second Young's modulus greater than 10% of the maximum local modulus of the bulk substrate.
A bulk substrate for stretchable electronics. The bulk substrate is manufactured with a process that forms a soft-elastic region of the bulk substrate. The soft-elastic region includes a strain capacity of greater than or equal to 25% and a first Young's modulus below 10% of a maximum local modulus of the bulk substrate. The process also forms a stiff-elastic region of the bulk substrate. The stiff-elastic region includes a strain capacity of less than or equal to 5% and a second Young's modulus greater than 10% of the maximum local modulus of the bulk substrate.
H05K 3/00 - Apparatus or processes for manufacturing printed circuits
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
20.
Polymer substrate for flexible electronics microfabrication and methods of use
Provided are flexible electronics stacks and methods of use. An example flexible electronics stack includes a flexible polymeric substrate film and a rigid inorganic electronic component. The flexible polymeric substrate film includes a thermoset polymer prepared by curing a monomer solution; wherein the monomer solution comprises about 25 wt % to about 65 wt % of one or more thiol monomers and from about 25 wt % to about 65 wt % of one or more co-monomers.
H01L 27/12 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
B05D 1/00 - Processes for applying liquids or other fluent materials
B05D 1/28 - Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
H05K 1/18 - Printed circuits structurally associated with non-printed electric components
H01L 27/32 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
H01L 51/00 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
Provided are flexible electronics stacks and methods of use. An example flexible electronics stack includes a flexible polymeric substrate film and a rigid inorganic electronic component. The flexible polymeric substrate film includes a thermoset polymer prepared by curing a monomer solution; wherein the monomer solution comprises about 25 wt% to about 65 wt% of one or more thiol monomers and from about 25 wt% to about 65 wt% of one or more co-monomers.
H01L 27/01 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate comprising only passive thin-film or thick-film elements formed on a common insulating substrate
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Supporting, insulating and protective interlayer dielectric materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Supporting, insulating and protective interlayer dielectric materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware
17 - Rubber and plastic; packing and insulating materials
Goods & Services
Supporting, insulating and protective interlayer dielectric materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware
