CONTACT PROBE AND CONTACTING MEMBER THEREOF, METHOD OF MANUFACTURING CONTACTING MEMBER, PROBE SYSTEM USING THE CONTACTING MEMBER, METHOD OF TESTING UNPACKAGED SEMICONDUCTOR DEVICE, TESTED SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME
A contacting member of a contact probe for a probe system for performing a functionality test to a DUT includes a body, a contact tip, and a tip transition section between the body and the contact tip. A bottom side of the contacting member, which faces toward the DUT when testing the DUT, includes a lower surface at the body, a tip bottom surface at the contact tip, and a tip transition surface at the tip transition section. A contact end of the contact tip for contacting the DUT is located on a front side of the tip bottom surface. A rear side of the tip bottom surface and the lower surface have a height difference therebetween. The tip transition surface gradually changes in height from the lower surface to the rear side of the tip bottom surface. The contacting member has high precision and structural strength.
An adhered multilayer die unit includes at least one probe zone and at least one non-probe zone for probes to be inserted in the probe zone. The adhered multilayer die unit includes dies and at least one adhesive layer. Each die includes at least one connecting surface, and through holes in the at least one probe zone for the probes to be inserted through the through holes of each die. The at least one adhesive layer adheres the connecting surfaces of the dies to each other. The at least one adhesive layer is entirely in the at least one non-probe zone. Accordingly, the adhered multilayer die unit of the invention has great structural strength in large-area condition, avoids drilling process difficulty problem and size restriction of fastening combining manner, avoids adhesive spillage and its affection on probes, and avoids adhesive-caused problems of adhesive spillage and die levelness deviation.
A probe head includes multiple probes and guide plates. Each probe includes a first end, a second end, and a probe body. The first end abuts a contact pad of a device under test. The second end abuts a contact pad of a board of a probe system. The probe body extends between the first end and the second end according to a longitudinal development axis. The guide plate includes a guide-hole pair for a probe pair of the probe head to respectively pass through, and the guide-hole pair slidably accommodate the pair of probes. The guide plate further includes an extension hole extending from one guide hole of the guide-hole pair to another guide hole. The extension hole intersects with at least one of the first guide holes and is located substantially between the probe pair on the first guide plate.
A test system and a method for data verification for the same are provided. The test system includes a main control unit having a control host and an analyzer, and a probe assembly that includes at least one probe-head with probe tips and a cable linked to the analyzer. The probe assembly is configured to contact one of testing circuits of a calibration standard assembly via the probe tips for performing a calibration process. In the method, incident data is inputted to the calibration standard assembly for generating measured uncorrected data, and afterwards the measured uncorrected data can be verified by performing relative comparison on any two sets of the measured uncorrected data.
A probe system and a probe card, a probe head and a guide plate structure thereof are described herein. The probe head includes a plurality of probes and guide plates. Each probe includes a first end, a second end, and a probe body. The first end is configured to abut a contact pad of the device under test. The second end is configured to abut a contact pad of a board of the probe system. The probe body extends between the first end and the second end according to a longitudinal development axis. The guide plate includes a pair of first guide holes for a pair of probes to pass through, and the pair of first guide holes are configured to slidably accommodate the pair of probes. The material between the pair of first guide holes in the guide plate has a relative dielectric constant not greater than 6, so as to reduce the return loss between the probe head and the device under test.
A probe head includes multiple probes and guide plates. Each probe includes a first end, a second end, and a probe body. The first end abuts a contact pad of a device under test. The second end abuts a contact pad of a board of a probe system. The probe body extends between the first end and the second end according to a longitudinal development axis. The guide plate includes a guide-hole pair for a probe pair of the probe head to respectively pass through, and the guide-hole pair slidably accommodate the pair of probes. The guide plate further includes an extension hole extending from one guide hole of the guide-hole pair to another guide hole to provide compensating impedance between the guide-hole pair, improve impedance matching when probing the device under test with the probe pair, and reduce return loss between the probe head and the device under test.
A method for adjusting position of probing base comprises steps of providing a probing machine comprising a probing holder, a first probing base having a first probing needle comprising a plurality of first probing bodies wherein two adjacent tips of the first probing bodies h a first pitch, and a second probing base having a second probe comprising a plurality of second probing bodies in which two adjacent tips of the second probing bodies has a second pitch, thereafter, grabbing the first probing base and connecting the first probing base to the probing holder, acquiring first image with respect to the plurality of first probing bodies through visual identification module, and finally, adjusting roll angle of probing tips of the plurality of first needle bodies according to the first image. Alternatively, the present invention further provides a probing machine using the method for testing DUTs having different pitches.
A membrane probe card includes probes each having a base electrically connected with a trace of a membrane wiring structure, and a probe tip protruding from the base. The base has a tip placement section and an extension section, which extend from a first side edge to a second side edge of the base in order. The probe tip is made by laser processing and electroplating, located at the tip placement section, and provided with a fixed end portion connected with the base in a way that the width of the tip placement section is greater than the width of the fixed end portion. A distance from a center of the probe tip to the first side edge is less than a distance from the center of the probe tip to the second side edge. As such, requirements of fine pitch and probe height may be achieved.
A position-adjustable probing device comprises a stationary probe comprising a first coaxial structure having a first needle core, a first dielectric layer, and a first exterior conductive layer, and a first and a second movable probes. The first movable probe arranged at a first side of the stationary probe comprises a ground needle core, and a first extending structure comprising a first planar structure electrically contacted with the stationary probe through a first movement, a first top surface and a first bottom surface. The second movable probe arranged at a second side of the stationary needle comprises a second coaxial structure comprising a second needle core, a second dielectric layer, and a second exterior conductive layer, and a second extending structure comprising a second planar structure electrically contacted with the stationary probe through a second movement, a second top surface, and a second bottom surface.
A circuit board for a semiconductor testing includes first and second substrates, first and second insulating dielectric layers attached to the lower surface of the first substrate and the upper surface of the second substrate respectively and attached to each other, and electrically conductive fillers disposed in first and second through holes of the first and second insulating dielectric layers and electrically connected with first and second electrically conductive pads of the first and second substrates. For the first through holes, compared with the upper ends thereof, the lower ends thereof have larger width or smaller interval. For the second through holes, compared with the lower ends thereof, the upper ends thereof have larger width or smaller interval. A method of manufacturing the circuit board is also disclosed. Accordingly, an alignment problem in connecting substrates by the insulating dielectric layer may be improved, thereby enhancing the circuit integrity.
A circuit board detection device includes a base, a stage assembly, a first gantry support, and a first probe assembly. The stage assembly is arranged on the base and includes a linear drive module, a rotary motor, and a platform. The platform is configured to carry a circuit board and can be driven by the linear drive module to move along a first axial direction. The platform can also be driven by the rotary motor to rotate relative to a first rotation axis. The first gantry support is fixed on the base and includes a first beam. The first beam extends along a second axial direction perpendicular to the first axial direction to span over the linear drive module, and includes a first probe guide rail. The first probe assembly is arranged on the first probe guide rail to be movable along the second axial direction.
PROBE CARDS, DUT SIDE MODULES OF THE PROBE CARDS, TESTING METHODS AND SYSTEMS THAT INCLUDE THE PROBE CARDS, TESTED DEVICES AND METHODS OF PRODUCING TESTED DEVICES BY UTILIZING THE PROBE CARDS
A probe card includes a structure stiffener unit including a base with a lower surface where central and peripheral supporting elements protrude out and a main circuit board is fixed, a space transformer and a probe head disposed thereunder, which are disposed to the supporting elements by bolts and defined with central and peripheral regions located correspondingly to the central and peripheral supporting elements respectively, and a metal supporting member fixed on the space transformer in a direct contact manner and located correspondingly to the central region. The supporting member has a lower surface coplanar with the lower end surface of the peripheral supporting element, which is abutted on the space transformer, and an upper surface against which the central supporting element is abutted. The space transformer has great structural strength, flatness and heat dissipation effect for satisfying the large-area requirement and great electrical property testing stability.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
13.
POSITIONING METHOD AND PROBE SYSTEM FOR PERFORMING THE SAME, METHOD FOR OPERATING PROBE SYSTEM, AND METHOD FOR UTILIZING PROBE SYSTEM TO PRODUCE A TESTED SEMICONDUCTOR DEVICE
A positioning method and probe system for performing the same, a method for operating probe system, and a method for utilizing probe system to produce a tested semiconductor device are provided. The positioning method is used for positioning a plurality of probe assemblies with an under-test device including a plurality of pads, each of the probe assemblies have at least one probe tip that corresponds to each of the pads for contact, and at least one fixed probe assembly and at least one motorized probe assembly are defined among the probe assemblies during a positioning process.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 31/26 - Testing of individual semiconductor devices
A probe head includes a probe seat, and vertical probes each having a head portion including a head portion installation section with a first width, and a probe tip section including a probe tip contact part with a second width smaller than the first width and a probe tip gradually narrowing part which is located between the head portion installation section and the probe tip contact part, gradually narrows from the first width to the second width, and has a first length smaller than a second length of the probe tip contact part. The head portion installation section protrudes out of a lower surface of the probe seat for a length smaller than the sum of the first and second lengths. The vertical probe is great in current withstanding capability, structural strength and life time, and meets the requirement of probing tiny electrically conductive contacts.
A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, an insulating component, and an adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The insulating component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The adhesive member is disposed on the first substrate, arranged on at least a part of the side surface of the second substrate, and disposed at an outer side of the insulating component.
A probe head includes upper, middle and lower dies having upper, middle and lower guiding holes respectively, and a plurality of spring probes. The spring probe includes upper and lower abutting sections disposed in the upper and lower guiding holes, a spring section connecting the upper and lower abutting sections, and a barrel disposed on the periphery of the spring section and inserted in the middle guiding hole. The spring probes include adjacent first and second probes whose barrels has first and second outer diameters and are accommodated in first and second middle guiding holes having first and second widths. The difference between the first width and outer diameter and/or the difference between the second width and outer diameter is larger than or equal to 10 micrometers, and/or the difference between the first and second outer diameters is larger than or equal to 5 μm. Alternatively, the middle guiding holes include a multi-probe matching hole, and the outer diameters of two adjacent barrels accommodated therein are larger than the smallest distance therebetween. The present invention is capable of satisfying the test requirements of fine pitch and impedance matching.
PROBE CARD, METHOD FOR DESIGNING PROBE CARD, METHOD FOR PRODUCING TESTED SEMICONDUCTOR DEVICE METHOD FOR TESTING UNPACKAGED SEMICONDUCTOR BY PROBE CARD, DEVICE UNDER TEST AND PROBE SYSTEM
A probe card, a method for designing the probe card, a method for producing a tested semiconductor device, a method for testing an unpackaged semiconductor by the probe card, a device under test, and a probe system are provided. The probe card includes a wiring substrate, a connection carrier board, and a probe device. At least two probes form a differential pair electrically connected to a loopback line of the connection carrier board to form a test signal loopback path. The probe device has a probe device impedance on the test signal loopback path. The loopback line has a loopback line impedance on the test signal loopback path. A difference between the probe device impedance on the test signal loopback path and the loopback line impedance on the test signal loopback path is in an impedance range.
A motorized chuck stage controlling method adapted to a wafer probing device is provided. The wafer probing device includes a control rod and a motorized chuck stage. The control rod can be moved between an upper limit position and a lower limit position, and the motorized chuck stage is moved along a Z-axis direction in response to a movement of the control rod. One purpose of the motorized chuck stage controlling method is to allow the operator to define the highest position to which the motorized chuck stage can be moved in response to the movement of the control rod, thereby preventing the probe and the wafer from colliding with each other.
G01R 31/308 - Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
B23Q 3/16 - Devices holding, supporting, or positioning, work or tools, of a kind normally removable from the machine controlled in conjunction with the operation of the tool
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
A wafer inspection system includes probe and supporting devices opposite to each other. The probe device includes a probe and an electrically conductive module for transmitting test signal of a driver IC. The supporting device includes a chuck, an annular elastic module detachably disposed on the chuck, and a carrier. The chuck has a supporting portion located correspondingly to a hollow portion of the annular elastic module, which is larger than or equal to the carrier in size on an imaginary horizontal plane, enabling the carrier carrying a wafer to be placed on the supporting portion to be electrically connected with the annular elastic module. When the wafer is contacted by the probe, the electrically conductive module is abutted against the annular elastic module to form a short-path test loop. As a result, it is convenient to pick and place the carrier and wafer, enhancing inspection efficiency.
An optical path correction subassembly, an optical detection assembly, and an optical detection system are provided. The optical path correction subassembly can be optionally configured to be applied to a light detector. The optical path correction subassembly includes a holder structure and an optical path correction structure carried by the holder structure, and the optical path correction structure has a light beam guiding surface arranged as a reverse inclination inclined relative to a vertical line. The light beam guiding surface of the optical path correction structure can be configured to effectively or accurately guide a predetermined light beam to a light receiving surface of the light detector so as to facilitate collection of the predetermined light beam. The light beam guiding surface of the optical path correction structure can be arranged at an acute angle relative to the light receiving surface of the light detector.
A probe card and a wafer testing assembly thereof are provided. The wafer testing assembly includes a printed circuit board, a space transformer, a plurality of copper pillars and a plurality of strengthening structure units. The printed circuit board includes a bottom surface and a plurality of first contacts arranged on the bottom surface. The space transformer includes a top surface and a plurality of second contacts. The second contacts are arranged on the top surface and corresponding to the first contacts. The copper pillars are respectively arranged between the first contacts and the second contacts. Two ends of each of the copper pillars are respectively electrically connected to the first contacts and the second contacts. The strengthening structure units are arranged on the bottom surface of the printed circuit board and respectively surrounding the copper pillars.
An optical detection system and an alignment method for a predetermined target object are provided. The optical detection system includes a chuck stage, an optical detection module, a vision inspection module and a control module. The chuck stage includes a chuck configured for carrying a plurality of predetermined objects to be tested. The optical detection module includes an optical probe device, and the optical probe device is configured to be disposed above the chuck for optically detecting the predetermined object. The vision inspection module includes an image capturing device and an image display device. The image capturing device is configured for capturing a real-time image of the predetermined object in real time, and the image display device is configured for displaying the real-time image of the predetermined object in real time. The control module is configured to execute the alignment method for the predetermined target object.
G01B 11/30 - Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
G01B 11/26 - Measuring arrangements characterised by the use of optical techniques for measuring angles or tapersMeasuring arrangements characterised by the use of optical techniques for testing the alignment of axes
A probe system and a machine apparatus thereof are provided. The machine apparatus can be configured for optionally carrying at least one probe assembly. The machine apparatus includes a temperature control carrier module, a machine frame structure and a temperature shielding structure. The temperature control carrier module can be configured for carrying at least one predetermined object. The machine frame structure can be configured for partially covering the temperature control carrier module, and the machine frame structure has a frame opening for exposing the temperature control carrier module. The temperature shielding structure can be disposed on the machine frame structure for partially covering the frame opening, and the temperature shielding structure has a detection opening for exposing the at least one predetermined object. The temperature shielding structure has a gas guiding channel formed thereinside for allowing a predetermined gas in the gas guiding channel.
G01B 11/26 - Measuring arrangements characterised by the use of optical techniques for measuring angles or tapersMeasuring arrangements characterised by the use of optical techniques for testing the alignment of axes
G01R 1/18 - Screening arrangements against electric or magnetic fields, e.g. against earth's field
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
G06T 7/33 - Determination of transform parameters for the alignment of images, i.e. image registration using feature-based methods
A vertical probe head includes upper and lower die units having upper and lower through holes, and probes each including a body portion between the die units, tail and head portion installation parts in the upper and lower through holes respectively, and a head portion contact part for electrically contacting a device under test. The probes include a pair of signal probes including at least one distinctive probe, for which, the body portion is smaller in width than the head portion installation part, and a body portion center line is deviated from a head portion installation part center line toward the probe paired thereto. For the paired probes, a head portion contact part pitch is larger than a body portion pitch for matching a large-pitch high-speed differential pair of the device under test, great impedance matching effect, and consistent contact force and stable elasticity of the probes in operation.
A circuit board for semiconductor test includes first and second sub-circuit boards, and an insulating dielectric layer therebetween. Each sub-circuit board includes a substrate and circuits including upper and lower contacts. The insulating dielectric layer includes through holes, and connecting conductors disposed therein and electrically connected with the upper and lower contacts of two sub-circuit boards. The circuit board is defined with central and peripheral regions. The lower contacts of the first sub-circuit board in the central region are electrically connected with a probe head. The upper contacts of the second sub-circuit board in the peripheral region are electrically connected with a tester, larger in pitch than the lower contacts of the first sub-circuit board in the central region, and larger in amount than the lower contacts of the first sub-circuit board in the peripheral region. The circuit board has great power test uniformity.
A trace embedded probe device includes a circuit board including an insulating layer unit whose upper surface has first recesses and a second recess located therebetween, grounding traces and a signal trace whose trace main bodies are disposed in the recesses respectively and flush in elevation with the upper surface, and a grounding layer disposed on a lower surface of the insulating layer unit and connected with the grounding traces by conductive vias penetrating through the first recesses and the lower surface and provided therein with conductive layers. The trace main bodies, grounding layer and conductive layers are made of a same metal material. Probes are disposed on the grounding and signal traces respectively. The probe device is easy in control of distance, width, thickness and surface roughness of the traces, and beneficial to achieve the requirements of thin copper traces, fine pitch and high frequency testing.
A wafer inspection system includes a supporting device having electrically connected supporting and contact portions for supporting a wafer's back, and a probe device having a probe and elastic contact members. When a probe tip of the probe contacts the wafer's front, a contact tip of the elastic contact member is abutted against a contact surface of the contact portion. The contact tip is higher than the probe tip. The contact surface is higher than the wafer's front. Alternatively, the contact surface having a radius larger than or equal to twice the wafer's radius. The horizontal distance between the probe tip and the contact tip is larger than or equal to twice the wafer's radius. This satisfies the test requirement of short-pulse test signal and prevents the structural design and transmitting stability of the elastic contact members from being affected by the inspection temperature.
An optical detection system and a laser providing module without using an optical fiber thereof are provided. The optical detection system includes a carrier module, a laser light providing module, and an electrical detection module. The carrier module is configured to carry a plurality of photodiodes. The laser light providing module is disposed above the carrier module. The electrical detection module is adjacent to the carrier module. The laser light providing module is configured to convert a laser light source into a plurality of laser light beams, thereby simultaneously and respectively exciting two corresponding ones of the photodiodes. The electrical detection module is configured to simultaneously and electrically contact the corresponding photodiodes so as to obtain an electrical signal generated by each of the photodiodes.
A probe head includes a middle die, upper and lower die units, at least one of which includes inner and outer dies detachably fastened to the middle die and each other, and a plurality of buckled probes inserted through the upper and lower die units. The inner die has an outer connecting surface connected with an inner surface of the outer die, where an installation recess is provided, an inner connecting surface connected with the middle die, and a probe installation section having a protruding portion protruding from the outer connecting surface and located in the installation recess, and a recessed portion recessed from the inner connecting surface and located correspondingly to the protruding portion. The protruding portion and the installation recess have a horizontal distance therebetween. Therefore, the outer die is horizontally fine adjustable to make the positions of the probes meet the requirement.
A heat dissipatable die unit includes an outer die, a metal heat dissipating layer and an inner die piled in order. The inner die includes a probe installation section, and a peripheral portion surrounding the probe installation section and having an inner connecting surface for being connected to a die and an outer connecting surface opposite thereto. The probe installation section has a recessed portion recessed from the inner connecting surface, and a protruding portion protruding from the outer connecting surface, thereby forming a level difference portion bordering the peripheral portion. The outer die includes an installation recess and a supporting portion surrounding the installation recess. The installation recess is recessed from an inner surface of the supporting portion and accommodates the protruding portion of the inner die. The metal heat dissipating layer is disposed between the peripheral portion and the supporting portion to attain heat dissipating effect.
A probe card and a manufacturing method of a probe card are provided. The probe card includes a probe head, first and second substrates, a first elastic component, and a first adhesive member. The second substrate is disposed between the probe head and the first substrate, and is disposed on the first substrate. The second substrate faces the first substrate and includes second contacts. The second contacts are electrically connected to first contacts of the first substrate. The first elastic component is disposed between the first substrate and the second substrate, and disposed at an outer side of the second contacts. The first adhesive member is disposed on the first substrate, annularly arranged on the side surface of the second substrate, and disposed at an outer side of the first elastic component.
A chip chuck includes front and back slopes obliquely extending toward a bottom surface from front and back edges of a top surface having a chip placement area for supporting a chip under test, and is defined with an imaginary vertical reference line perpendicular to the chip placement area and an imaginary horizontal reference line. The front and back slopes are connected with the chip placement area and each provided with an included acute angle with respect to the imaginary horizontal reference line, thereby avoiding interference with light emitted from the chip. A chip supporting device includes a chip chuck, and an optical sensing module fixed relative thereto and including an optical sensor whose light receiving surface faces toward a back light emitting surface of the chip, thereby enabling optical characteristic inspection of front and back light emitting surfaces of the chip at the same time.
The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.
A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.
The present invention provides a probe card comprising a probe base, at least one impedance-matching probes, and a plurality of first probes. The probe base has a probing side and a tester side opposite to the probing side. Each impedance-matching probe has a probing part and a signal transmitting part electrically coupled to the probing part, wherein one end of the signal transmitting part is arranged at tester side, and the signal transmitting part has a central probing axis. Each first probe has a probing tip and a cantilever part coupled to the probing tip, wherein the cantilever part is coupled to the probe base and has a first central axis such that an included angle is formed between the central probing axis and the first central axis.
A probe assembly, adapted to test high-speed signal transmission lines of printed circuit boards, includes two pogo pins for providing high-frequency differential test signals, and both sides of the pogo pin include no metal layer (grounding layer). Experiments have found that when the two pogo pins test a to-be-tested object, the test signal will be coupled to the metal layers on both sides of the pogo pins to generate a radiation resonance, resulting in a loss of the test signal on a specific frequency band, and further reducing the effective bandwidth of the probe assembly. The metal layers on both sides of the pogo pins of the probe assembly are reduced, so that the foregoing radiation resonance phenomenon can be avoided.
A macro and micro inspection apparatus includes a macro inspection station including a housing, a robot arm and a visual recognition system, and a device under test storage station and a micro inspection station disposed on two sides of the macro inspection station, respectively. The robot arm including an end effector adapted for carrying and turning over a device under test is disposed in the housing in a way that the end effector enables to enter the device under test storage station and the micro inspection station. The visual recognition system includes at least one image capturing device disposed in the housing for shooting toward the end effector for capturing the image of the device under test. The invention, which also provides an inspection method using the inspection apparatus, is structurally simple, space-saving, avoids problems caused by manual inspection, and brings high inspection efficiency.
A probe station includes a base, a adaptor, a probe holder and a probe. The adaptor has a first portion and a second portion away from the first portion towards a first direction by a first length. The first portion connects to the base. A probe holder connects to the second portion and extends towards a second direction opposite to the first direction by a second length. The probe connects to an end of the probe holder away from the second portion and extends towards the second direction by a third length. A product of a thermal coefficient of the adaptor and the first length is equal to a sum of a product of a thermal coefficient of the probe holder and the second length and a product of a thermal coefficient of the probe and the third length.
A method for compensating to a first distance between a probe tip and a device under test (DUT) after a temperature change of the DUT includes: capturing a first image having the probe and its reflected image on a reflective surface of the DUT at a first temperature; measuring a second distance between a reference point of the probe and its reflected image; changing the first temperature of the DUT to a second temperature; capturing a second image having the probe and its reflected image on the reflective surface at the second temperature; measuring a third distance between the reference point of the probe and its reflected image; dividing the difference between the third and the second distances by two to obtain a fourth distance; and determining a relative position between the probe and the DUT by the fourth distance to compensate to the first distance.
G01R 31/319 - Tester hardware, i.e. output processing circuits
G01K 7/01 - Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat using semiconducting elements having PN junctions
G01C 3/02 - Measuring distances in line of sightOptical rangefinders Details
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
A probe head includes upper and lower die units, and a linear probe inserted therethrough and thereby defined with tail, body and head portions. A first bottom surface of the upper die unit and a second top surface of the lower die unit face each other, thereby defining an inner space wherein the body portion is located and includes a plurality of sections each having front width larger than or equal to back width, including a narrowest section whose upper and lower ends have a distance from the first bottom surface and the second top surface respectively. The head and tail portions are offset from each other along two horizontal axes and the body portion is thereby curved. The present invention is favorable in dynamic behavior control of the linear probe which is easy in manufacturing, lower in cost and has more variety in material.
A wafer probe station includes a thermal chuck, a chuck stage, a platen, some probes, a first focusing device, a second focusing device and a thermal plate. The thermal chuck heats up to an operational temperature and holds a device under test (DUT). The chuck stage connects with the thermal chuck and moves the thermal chuck. The thermal chuck locates between the chuck stage and the platen. The probes are disposed on the platen and configured to contact with the DUT. The first focusing device is disposed on the platen to focus on the DUT. The second focusing device is disposed on the chuck stage to focus on the probes. The thermal plate locates between the second focusing device and the platen and is configured to heat up to the operational temperature. The thermal plate has a through hole aligning with the second focusing device.
A probe card and a probe module thereof are provided. The probe card includes a first strengthening board, a fixed frame, a probe module, and a slidable frame. The first strengthening board includes a top surface, a bottom surface, and a mounting hole. An inner wall of the mounting hole is formed with an inner flange. The fixed frame is disposed on the top surface of the first strengthening board and surrounds the mounting hole. The probe module is disposed in the mounting hole and includes an outer flange including a physical region and multiple gap regions. The physical region abuts against the inner flange of the first strengthening board. The slidable frame is disposed on an inner wall of the fixed frame and is slidable between a released position and a fixed position. Multiple pressing portions are disposed on an inner wall of the slidable frame.
An image processing method includes the steps of lighting up at least a part of light emitting units of a light emitting device; capturing a plurality of detection images corresponding to a plurality of sections of the light emitting device respectively, wherein each section includes a plurality of lighted-up light emitting units, each detection image includes a plurality of light spots respectively corresponding to the light emitting units of the associated section, and every two adjacent sections have an overlap area including at least one lighted-up light emitting unit; and stitching the detection images of the adjacent sections together by taking the light spots corresponding to at least one lighted-up light emitting unit of the overlap area as alignment reference spots, so that the light emitting statuses of all the light emitting units are presented by a single image.
A light emitting element detecting method includes the steps of generating a first control signal to open a shutter of an image capturing device which captures an image toward a light outlet of a light emitting element, generating a pulse signal to light up the light emitting element, generating a second control signal to close the shutter of the image capturing device and obtaining a detection image, and determining the light emitting status of the light outlet of the light emitting element according to the detection image. As a result, the present invention can accurately detect whether the light outlet of the light emitting element has the problem of emitting no light or flashing.
An optical inspection system includes a brightness inspection module for inspecting the brightness of a light emitting element, an integrated inspection module for inspecting the near field optical characteristic and the beam quality factor of the light emitting element, and a far field inspection module for inspecting the far field optical characteristic of the light emitting element. As a result, the optical inspection system is space-saving and capable of reducing the distance and time of the movement of the device under test.
A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.
An optical test equipment includes a chuck, a light receiving device corresponding in position to an opening of the chuck, a transparent heating plate disposed on the chuck or light receiving device in a way that the bottom surface of the transparent heating plate faces toward the light receiving device for a wafer to be disposed on the top surface of the transparent heating plate, allowing light to pass through the top and bottom surfaces and being powered to generate heat to heat the wafer, and a probing device including a seat and a probe protruding from the seat toward the top surface of the transparent heating plate for probing a light emitting chip of the wafer. The equipment can perform light emitting efficiency test to the light emitting chip on the wafer before dicing and heat the light emitting chip at the same time.
A probing apparatus includes a carrier having an opening, a supporter disposed on the carrier in a way that its bottom surface faces toward the carrier, its top surface for disposition of a wafer, and its light permeable portion allowing light to pass through the top and bottom surfaces corresponding in position to the opening, an air heating device having a covering plate and an air supply unit, and a probing device having a probe protruding out of the bottom surface of the air heating device. A thermal air source provides thermal air to a heating space between the bottom surface of the air heating device and the top surface of the supporter through an air supply passage of the air supply unit. The probing apparatus can test light emitting efficiency of a light emitting chip in the wafer and heat the chip at the same time.
A wafer testing method adapted to test a thin wafer. The thin wafer is combined with a vacuum-release substrate to form a wafer-assembly, and the wafer-assembly is placed in a wafer cassette. The vacuum-release substrate is attached to a front surface of the wafer with an attaching force which is sensitive to air pressure. The method includes the following steps. First, taking out the wafer-assembly from the wafer cassette, then transferring the wafer-assembly to a warpage-detection-device and placing the wafer-assembly on a first stage of the warpage-detection-device. Then, detecting warpage of the wafer. If the warpage of the wafer is less than a warpage threshold, the wafer-assembly is taken out from the first stage, and the wafer-assembly is turned over to place the wafer-assembly on a second stage. Then, applying negative pressure to the vacuum-release substrate to eliminate the attaching force. Then, removing the vacuum-release substrate.
A method of positioning probe tips relative to pads includes: focusing on each of the probe tips in a first image as viewed by a microscope and collecting the coordinates of the corresponding probe tip relative to a first reference point in the first image; focusing on each of the pads in a second image as viewed by the microscope and collecting the coordinates of the corresponding pad relative to a second reference point in the second image, a relative position of the second reference point to the first reference point being predetermined; matching the pads with the probe tips when the quantity of the probe tips and the pads are equal while minimizing a maximum value of the distances calculated between each of the probe tips and the corresponding pad; and moving the probe tips to touch the pads with the maximum value minimized.
An adjustable probe device includes fixed and movable probes, at least one of which is a signal probe having a coaxial structure. The movable probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. Another adjustable probe device includes a first movable probe for being grounded, and fixed and second movable probes both having a coaxial structure. Any of the two movable probes is selectable to be a functioning probe in a way that the contact ends of the functioning and fixed probes are located on a same plane for contacting two pads of a DUT at the same time, and the functioning probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. As a result, the probe interval is adjustable, lowering the cost of the impedance testing apparatus for circuit boards.
A wafer inspection method, wherein a motorized chuck stage is controlled by a control rod to be displaced between an upper position and a lower position along Z-axis direction, to change a relative position of a wafer on the motorized chuck stage relative to a probe. The control rod is movable between an upper and an lower limit positions. The wafer inspection method includes: determining a position of the control rod based on a measurement signal; determining a first moving direction and a moving distance of the control rod based on a change of the measurement signal; generating a control signal based on the moving distance of the control rod; controlling the motorized chuck stage to be displaced along a second moving direction opposite to the first moving direction; and controlling an objective lens module to keep focusing on the wafer when the motorized chuck stage is on the move.
A probe head includes a probe seat having upper, middle and lower dies, an electrically conductive layer inside the probe seat, a first spring probe penetrating through the probe seat, and at least two shorter second spring probes penetrating through the lower die in a way that top ends of the second spring probes are located inside the probe seat and abutted against the electrically conductive layer. Another probe head includes the aforesaid probe seat, an electrically conductive layer partially inside the probe seat and partially outside the probe seat, a first spring probe penetrating through the probe seat, and a shorter second spring probe penetrating through the lower die in a way that a top end of the second spring probe is located inside the probe seat and abutted against the electrically conductive layer. As such, fine pitch requirement and different high frequency testing requirements are fulfilled.
A probe head includes a probe seat, a first spring probe penetrating through upper, middle and lower dies of the probe seat for transmitting a first test signal, and at least two shorter second spring probes penetrating through the lower die for transmitting a second test signal with higher frequency. Two second spring probes are electrically connected in a way that top ends thereof are abutted against two electrically conductive contacts on a bottom surface of the middle die electrically connected by a connecting circuit therein. The lower die has a communicating space and at least two lower installation holes communicating therewith and each accommodating a second spring probe partially located in the communicating space. The probe head is adapted for concurrent high and medium or low frequency signal tests, meets fine pitch and high frequency testing requirements and prevents probe cards from too complicated circuit design.
A probing apparatus includes a frame, a testing device, a rotatable testing platform, and a probe module. The testing device is disposed on the frame and is displaceable along an X direction and a Y direction perpendicular to the X direction. The rotatable testing platform is disposed on the frame and is rotatable around a rotating axis extending in the X direction. A direction perpendicular to the X direction and the Y direction is a Z direction, and the rotatable testing platform and the testing device are located at different positions of the Z direction. The probe module is disposed on the rotatable testing platform.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01L 21/67 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
A probe head includes an upper guide plate, a lower guide plate, and a plurality of probes. The upper guide plate includes a groove, and the upper guide plate is provided with an upper surface, a lower surface and a plurality of probe holes vertically penetrating the upper surface and the lower surface along a first direction. The groove is depressed from the upper surface, and provided with a groove bottom surface. The groove bottom surface is located between the upper surface and the lower surface. The lower guide plate is disposed on the upper guide plate. The probe is disposed in the groove. An end portion of a probe tail of the probe is located between the groove bottom surface and the upper surface. A probe card is also provided and the probe card includes a circuit board, a space transformer, and the probe head.
09 - Scientific and electric apparatus and instruments
Goods & Services
Test pins for testing circuit boards; Probe cards for testing semiconductor wafer; Testing apparatus for testing printed circuit boards; Probes for testing the radiofrequency or RF of semiconductors
A wafer probe station includes a first shielding box, a chuck, a stage, a second shielding box, an electronic testing instrument, a manipulator and a cable. The first shielding box has a first chamber. The chuck is located in the first chamber to hold a device under test. The stage connects to the chuck to move the chuck. The second shielding box is outside the first shielding box and forms a second chamber with the first shielding box. The first and the second shielding boxes shield against an electromagnetic field. The electronic testing instrument is inside the second chamber. The manipulator is outside the first shielding box and has a probe arm penetrating into the first chamber. The probe arm is movable by the manipulator to hold a probe to contact the device under test. The cable connects between the electronic testing instrument and the probe.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 1/04 - HousingsSupporting membersArrangements of terminals
G01R 1/18 - Screening arrangements against electric or magnetic fields, e.g. against earth's field
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
A probe head includes a linear probe which is flattened at least one of tail, body and head portions thereof and thereby defined with first and second width axes, along which each of the tail, body and head portions is defined with first and second widths, and upper and lower die units having upper and lower installation holes respectively, wherein the tail and head portions are inserted respectively, which are offset from each other along the second width axis so that the body portion is curved. The first and second widths of the body portion are respectively larger and smaller than the first and second widths of at least one of the tail and head portions. As a result, the probes of the same probe head are consistent in bending direction and moving behavior and prevented from rotation, drop and escape.
A display method of a display apparatus is provided. The method includes: displaying, on a touch display apparatus, a first window and a second window that overlap with each other, where the first window is smaller than the second window; displaying a first image on the first window, and displaying a second image on the second window, where the second image is an image captured by the camera module in real time; displaying the first image on the second window and displaying the second image on the first window according to the first touch instruction; and displaying the first image on the first window and displaying the second image on the second window according to the second touch instruction.
G06F 3/0488 - Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
G09G 3/00 - Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
G06F 3/0484 - Interaction techniques based on graphical user interfaces [GUI] for the control of specific functions or operations, e.g. selecting or manipulating an object, an image or a displayed text element, setting a parameter value or selecting a range
A control method of a touch display apparatus applicable to a probe station is provided. The probe station includes a movable element. The movable element is a chuck stage, a camera stage, a probe platen, or a positioner. The control method of a touch display apparatus includes displaying a first window and a second window on a touch display apparatus; displaying an operation interface on the first window and displaying a real-time image on the second window; and detecting a touch instruction generated on the operation interface, where the movable element moves according to the touch instruction.
G06F 3/0488 - Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
G06F 3/0484 - Interaction techniques based on graphical user interfaces [GUI] for the control of specific functions or operations, e.g. selecting or manipulating an object, an image or a displayed text element, setting a parameter value or selecting a range
A wafer inspection method was provided. A motorized chuck stage is controlled by a control rod to be displaced between an upper position and a lower position of an adjustment range along a Z-axis direction, to change a relative position of a wafer on the motorized chuck stage relative to a probe. The control rod is movable between an upper limit position and a lower limit position in a displacement range. The wafer inspection method includes: determining a position of the control rod in the displacement range based on a measurement signal; determining a moving direction and a moving distance of the control rod based on a change of the measurement signal; generating a control signal based on the moving distance of the control rod; and controlling, based on the control signal, the motorized chuck stage and a camera stage to be displaced the same distance.
An aligning method for use in semiconductor inspection apparatus is provided. The semiconductor inspection apparatus includes a stage and a touch-control screen. The aligning method includes defining a reference direction; displaying an image of a device under test supported by the stage on the touch-control screen; detecting a first touch point and a second touch point occurred on the touch-control screen; defining a straight line according to the first touch point and the second touch point; calculating an included angle defined by the straight and the reference direction; and rotating the stage according to the included angle.
A probe card includes a printed circuit board (PCB), a connection substrate electrically connected with the PCB, a probe head, and a signal path switching module disposed on a lateral periphery surface or a bottom surface of the connection substrate, electrically connected with probe needles of the probe head and the connection substrate and including first and second circuit lines with first and second inductors respectively, and a capacitor electrically connected between the first and second circuit lines. A test signal from a tester is transmitted between the tester and a device under test (DUT) via the PCB, the connection substrate, the first and second circuit lines and the probe needles. A loopback test signal from the DUT is transmitted back to the DUT via the probe needles, parts of the first and second circuit lines and the capacitor.
09 - Scientific and electric apparatus and instruments
Goods & Services
Semiconductor wafer processing machines, namely, wafer loader probes for testing integrated circuits; test pins for testing circuit boards; probes for testing semiconductors; probe cards for use in connection with inspection of semiconductors and liquid crystal display panels; probe cards for testing semiconductor wafers; testing apparatus for testing circuit boards; testing apparatus for testing integrated circuits; testing apparatus for testing semiconductors; software for performing radiofrequency or RF calibration; computer software for driving probe card; computer software for testing semiconductor devices; probes for testing the radiofrequency or RF of semiconductors
A probe card includes a wiring board, a top cover, a retractable structure and a probe. The top cover couples with the wiring board and has an air inlet. The retractable structure connects with the top cover and includes a first and a second rings. The first ring has vent holes. A top surface of the first ring and a first bottom surface of the top cover define a homogenized space communicating with the air inlet and the vent holes. The second ring couples with the first ring and has jet holes communicating with the vent holes. Outlets of the jet holes locate on a second bottom surface of the second ring. A first inner sidewall of the first ring and a second inner sidewall of the second ring define a pressure space. The probe connects with the wiring board and extends to the pressure space.
A method for compensating probe misplacement and a probe apparatus are provided. The method is applicable to a probe module which includes a probe and a fixing base. The probe includes a probe body section and a probe tip section. The probe body section is fixed on the fixing base. The method includes: measuring a temperature of a probe body of the probe body section of the probe; calculating, according to the temperature of the probe body, thermal expansion amount of the probe along a length direction of the probe body section; calculating a compensation value according to the thermal expansion amount; moving the probe or a to-be-tested element according to the calculated compensation value, to align a probe tip of the probe tip section with the to-be-tested element or align the to-be-tested element with the probe tip of the probe tip section.
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A47B 88/497 - Sliding drawersSlides or guides therefor with other guiding mechanisms, e.g. scissor mechanisms
A47B 88/457 - Actuated drawers operated by electrically-powered actuation means
G01K 13/00 - Thermometers specially adapted for specific purposes
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A wafer cassette includes a case, a plurality of wafer trays, and a plurality of transmission mechanisms. The wafer trays are disposed in the case. Each of the wafer trays includes a central opening, a first groove, and a second groove. The diameter of the second groove is greater than that of the first groove. A bottom surface of the second groove is higher than that of the first groove. The first and second grooves surround the central opening. Each of the transmission mechanisms is connected to the corresponding wafer tray to move the wafer tray between a pick-up position and a received position. Since the wafer tray has grooves with different diameters, the wafer tray is capable of receiving wafers with different sizes.
G01R 31/01 - Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass productionTesting objects at points as they pass through a testing station
H01L 21/677 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components for conveying, e.g. between different work stations
A47B 88/497 - Sliding drawersSlides or guides therefor with other guiding mechanisms, e.g. scissor mechanisms
A47B 88/457 - Actuated drawers operated by electrically-powered actuation means
G01K 13/00 - Thermometers specially adapted for specific purposes
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
H01L 21/673 - Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereofApparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components using specially adapted carriers
A47B 88/988 - Drawers having means for organising or sorting the content in the form of holders for positioning specific articles
72.
Method of calibrating and debugging testing system
A method of calibrating and debugging a testing system is provided. First, values of different electrical path segments are calibrated, and parameters of the electrical path segments while being calibrated are saved. After calibration, electrical tests can be processed on a DUT. If the testing system malfunctions, the values of the electrical path segments are calibrated again to compare the current parameters to the previously saved parameters. The component which goes wrong can be found out quickly in this way.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 35/00 - Testing or calibrating of apparatus covered by the other groups of this subclass
A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with two first pads, two second pads, and two first sub-circuits. The first pads and the second pads are electrically connected to the first sub-circuits. The second substrate has a top surface, a bottom surface, a lateral edge, and two openings. The bottom surface of the second substrate is attached to the top surface of the first substrate. The openings extend from the top surface to the bottom surface of the second substrate. The first pads of the first substrate are in the opening of the second substrate; the second pads of the first substrate are not covered by the second substrate. The second substrate is further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate.
A temperature control system and method are provided. The system includes a first channel, a second channel, a heating element, a DUT chamber, a converter, a first PID controller, and at least one switching regulator. The heating element is disposed downstream of the first and the second channels to heat the first air from the first channel or the second air from the second channel according to an input power so as to provide mixing air with a temperature into the DUT chamber. The converter converts an AC power to a DC power. The first PID controller provides a first input signal according to a first set point and an amount of power consumed by the heating element. The input power is adjusted by the switching regulator to drive the heating element according to the first input signal. Thus, the use of electrical power is more efficient.
A test machine includes a base, a testing platform, a probe platform, a control lever, a temporary positioning mechanism and a damper. The testing platform connects with the base and carries a device under test. The probe platform connects with the base and moves along a longitudinal direction. The probe platform connects with a probe. The control lever connects with the base and the probe platform which is driven by the control lever to move along the longitudinal direction. The temporary positioning mechanism connects with the control lever and temporarily holds the probe platform and the control lever at a specific position. The damper connects with the base. When a distance between the probe and the DUT is shorter than a buffering distance, the damper abuts against the control lever or the probe platform to reduce a velocity of the probe moving towards the DUT.
A temperature controlling equipment includes a connection head of a fluid output device, an isolation hood, a drying chamber and a dry air source. The connection head of the fluid output device has an output nozzle and a first fluid output pipe. The isolation hood has a hood body and a second fluid output pipe. The hood body defines a working space. The output nozzle is communicated with the working space. The second fluid output pipe is communicated with the working space and the first fluid output pipe. The first fluid output pipe and the second fluid output pipe have a connection interface in between. The connection interface is at least partially located in the drying chamber. The dry air source is communicated with the drying chamber and is configured to provide a dry air to the drying chamber.
F26B 5/04 - Drying solid materials or objects by processes not involving the application of heat by evaporation or sublimation of moisture under reduced pressure, e.g. in a vacuum
F26B 3/04 - Drying solid materials or objects by processes involving the application of heat by convection, i.e. heat being conveyed from a heat source to the materials or objects to be dried by a gas or vapour, e.g. air the gas or vapour circulating over, or surrounding, the materials or objects to be dried
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
A cooling system includes a cooling device, a controller and a defrosting unit. The cooling device has a compressor, a condenser, an expander, an evaporator, a cooling channel and a coolant. The coolant is functioned in the evaporator to thermally exchange with a working fluid in a pipe. The controller is adapted for controlling the temperature of the working fluid by controlling the cooling device. The defrosting unit has a switch disposed on the cooling channel and located between the compressor and the condenser, and a defrosting channel connected with the switch. After passing through the switch, the coolant is optionally fed to anyone of the cooling channel and the defrosting channel. After flowing through the defrosting channel, the coolant passes through the evaporator and then flows back to the compressor. As a result, the cooling system is capable of fast defrosting without using a heater.
The instant disclosure provides an operating method of inspecting equipment, with the method applicable to semiconductor inspecting equipment having a movable element. The method includes: displaying a wafer graphic by a touch display; detecting a touch signal generated by the touch display; detecting the magnification of the wafer graphic when the touch signal is generated; and determining the moving speed of the movable element based on the magnification of the wafer graphic when the touch signal is generated. In addition, the moving direction of the movable element can be determined according to the touch signal. Through the instant disclosure, the operator can more intuitively operate each movable element of semiconductor inspecting equipment.
G06F 3/0484 - Interaction techniques based on graphical user interfaces [GUI] for the control of specific functions or operations, e.g. selecting or manipulating an object, an image or a displayed text element, setting a parameter value or selecting a range
G06F 3/041 - Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
G06F 3/0488 - Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
A working fluid output device for a temperature control system includes an output head, a fitting module and a quick release mechanism. A bottom plate of the output head and a top plate of the fitting module each have an installing surface and a through hole. The quick release mechanism has first and second units disposed on the two installing surfaces, respectively. The first unit includes an operable member having a positioning portion and configured to be operated by a user to move the positioning portion move between lock and unlocked positions to enable that the first unit is detachably coupled with the second unit and the fitting module is detachably attached to the output head in a way that the installing surfaces face each other and the through holes communicate with each other.
F25B 45/00 - Arrangements for charging or discharging refrigerant
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
A fluid discharge device includes a discharge tube, an outer tube and at least one baffle. The discharge tube has a discharge port. The discharge tube has an end surface adjacent to the discharge port. The outer tube is sleeved outside the discharge tube. The outer tube has at least one passage. The passage is configured to flow a clean dry air. The passage has an outlet. The baffle is disposed outside the outlet. When the clean dry air passes through the outlet, at least part of the clean dry air is blocked by the baffle and is directed to the end surface of the discharge tube.
B05B 7/16 - Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas incorporating means for heating the material to be sprayed
B05B 7/08 - Spray pistolsApparatus for discharge with separate outlet orifices, e.g. to form parallel jets, to form intersecting jets
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
09 - Scientific and electric apparatus and instruments
Goods & Services
[ Probes for testing integrated circuits; test pins for testing circuit boards; probes for testing semiconductors; probe cards for use in connection with inspection of semiconductors and liquid crystal display panels; probe cards for testing wafer; testing apparatus for testing circuit boards; testing apparatus for testing integrated circuits; testing apparatus for testing semiconductors; ] RF calibration software; computer software for driving probe card; computer software for testing semiconductor device [ ; RF probes ]
09 - Scientific and electric apparatus and instruments
Goods & Services
[ Probes for testing integrated circuits; test pins for testing circuit boards; probes for testing semiconductors; probe cards for use in connection with inspection of semiconductors and liquid crystal display panels; probe cards for testing wafer; testing apparatus for testing circuit boards; testing apparatus for testing integrated circuits; testing apparatus for testing semiconductors; ] RF calibration software; computer software for driving probe card; computer software for testing semiconductor device [ ; RF probes ]
A probe card for contacting an LED chip of flip-chip type includes a circuit board, two probes and a fixing seat. The circuit board has a mounting surface and a lateral edge. Each probe has a connecting portion mounted on the circuit board, an extending portion extending from the connecting portion, a cantilever portion connected with the extending portion and protruding out of the lateral edge, and a contacting portion extending from the cantilever portion. The fixing seat is mounted on the mounting surface of the circuit board and has a fixing surface. A part of the extending portion is located between the circuit board and the fixing seat. A test equipment for testing optical characteristics of an LED chip of flip-chip type is provided with the probe card.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
An apparatus for probing die electricity includes a substrate, a converting plate, a needle module and a reinforcement structure. The converting plate includes two opposite surfaces respectively having a plurality of first and second conductive elements. The needle module has a plurality of needles respectively and electrically connected to the plurality second conductive elements. The reinforcement structure is made from a polymer gel and disposed between the converting plate and the substrate.
A probe device includes a spring probe and a probe seat. The spring probe includes a needle and a spring sleeve sleeved onto the needle and provided with at least one spring section and at least one non-spring section. The probe seat includes a plurality of dies stacked together and at least one guiding hole through which the spring probe is inserted. An upper edge and a lower edge of the guiding hole of the probe seat are arranged corresponding in position to the non-spring section of the spring sleeve. As a result, the spring probe is prevented from getting jammed due to the contact of the spring section of the spring sleeve with the upper and lower edges of the guiding hole.
An assembling method for a vertical probe device includes steps of disposing a lower die on a jig by inserting supporting columns through jig holes of the lower die, fastening a positioning film on the supporting columns, installing probe needles and an upper die in a way that the positioning film is located between the upper and lower dies without contacting the upper die, unfastening the positioning film, and removing the jig so that the upper and lower dies, positioning film and probe needles constitute the device. A maintaining method for the device includes steps of inserting the supporting columns through the jig holes, fastening the positioning film to the jig, and removing the upper die. The probe needles and upper die are easily removed and installed and the probe needles are reliable. The vertical probe device is applicable for accommodating electronic components on the top thereof.
G01R 31/01 - Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass productionTesting objects at points as they pass through a testing station
G01R 3/00 - Apparatus or processes specially adapted for the manufacture of measuring instruments
09 - Scientific and electric apparatus and instruments
Goods & Services
Semiconductor testing apparatus; testing apparatus for testing printed circuit boards; environmental test chamber, namely, temperature simulation equipment; environmental conditioning equipment, namely, thermal chucks for testing and conditioning semiconductors and electrical equipment; apparatus for delivering air at a controlled temperature, namely, apparatus for maintaining precise temperatures on semiconductors and electrical equipment being tested and conditioned; apparatus for the analyzing and testing of temperature-sensitive items, namely, apparatus for analyzing and testing semiconductors and electrical equipment; measuring and control devices for heating and air conditioning technology; apparatus for testing electrical components under controlled temperature conditions; temperature controllers for testing semiconductor and electrical components; thermostats
09 - Scientific and electric apparatus and instruments
Goods & Services
Semiconductor testing apparatus; testing apparatus for testing printed circuit boards; environmental test chamber, namely, temperature simulation equipment; environmental conditioning equipment, namely, thermal chucks for testing and conditioning semiconductors and electrical equipment; apparatus for delivering air at a controlled temperature, namely, apparatus for maintaining precise temperatures on semiconductors and electrical equipment being tested and conditioned; apparatus for the analyzing and testing of temperature-sensitive items, namely, apparatus for analyzing and testing semiconductors and electrical equipment; measuring and control devices for heating and air conditioning technology; apparatus for testing electrical components under controlled temperature conditions; temperature controllers for testing semiconductor and electrical components; thermostats
91.
Testing system and method for testing of electrical connections
A testing system includes a test machine, a plurality of probe sets, a data input device, a controller, a memory, and a data output device. The test machine has a platform for a DUT to be placed thereon, and a test arm which is movable relative to the platform. The probe sets are provided on the test machine with at least one probe set provided on the test arm to contact the DUT. The data input device is used to input information about the DUT. The controller is electrically connected to the test arm, the probe set on the test arm, and the data input device to move the test arm to a predetermined position according to the inputted information, and to make the probe set contact the DUT for electrical test. The memory saves electrical test result, which is outputted by the data output device.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
An electrical testing device includes a base having two parallel first rails, a platform provided on the base, a support provided between the first rails, a test arm, a rotary table provided on the test arm, a plurality of holders provided on the rotary table, and a plurality of probe sets respectively provided on the holders. The support has a second rail provided thereon, and is moveable relative to the base and the platform. The test arm is provided on the second rail and above the platform, wherein the test arm is moveable along with the support, and is also movable relative to the support. The rotary table is moveable or rotatable relative to the test arm. The holders are moveable along with the rotary table, and are also moveable or rotatable relative to the rotary table. The probe sets are moveable along with the holders.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 1/04 - HousingsSupporting membersArrangements of terminals
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
An electrical testing machine includes a base having two parallel first rails, a platform provided on the base, a probe holder provided on the base and having a plurality of placement locations, a support provided between the first rails and having a second rail thereon, a test arm provided on the second rail and above the platform, a receiving seat provided on the test arm, and a plurality of probe sets, wherein one of the probe sets is engaged on the receiving seat, while the others are respectively provided on the placement locations. The support is movable relative to the base and the platform. The test arm is movable along with the support, and is also movable relative to the support. The receiving seat is movable or rotatable relative to the test arm. The probe set engaged on the receiving seat is movable along with the receiving seat.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 1/04 - HousingsSupporting membersArrangements of terminals
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
A method of operating a testing system is provided, wherein the testing system has a test machine and a probe module, which has a first probe set and a second probe set. One of the first probe set and the second probe set can be connected to the test machine. The method includes the following steps: connect the test machine and the first probe set; calibrate the testing system; abut the first probe set against a DUT to do electrical tests; disconnect the first probe set and the DUT; disconnect the test machine and the first probe set; connect the test machine and the second probe set; calibrate the testing system again; abut the second probe set against the DUT to do electrical tests.
G01R 31/00 - Arrangements for testing electric propertiesArrangements for locating electric faultsArrangements for electrical testing characterised by what is being tested not provided for elsewhere
G01R 31/28 - Testing of electronic circuits, e.g. by signal tracer
G01R 35/00 - Testing or calibrating of apparatus covered by the other groups of this subclass
95.
Method for making support structure for probing device
A method for making a support structure for a probing device includes a step of providing a substrate having first internal conductive lines, a carrier having second internal conductive lines and a thickness less than 2 mm for packaging an integrated circuit chip, solder balls, and photoresist support blocks made by lithography in a way that the solder balls and the photoresist support blocks are disposed between the substrate and the carrier, the photoresist support blocks separately arranged from each other, and at least one of the photoresist support blocks is disposed between two adjacent solder balls. The method further includes a step of electrically connecting the first internal conductive lines with the second internal conductive lines respectively by soldering the carrier and the substrate with the solder balls by reflow soldering.
A heating device includes a housing having a flow channel, a heater disposed in the flow channel, an optical rod, a light guider and a photodetector. The optical rod has a transparent body, a first end portion, and a second end portion located inside the housing. The light guider is provided at the second end portion for guiding lights emitted by the heater toward the first end portion. The photodetector is located around the first end portion and faces the second end portion for indirectly receiving the lights emitted by the heater to the light guider through the transparent body. The temperature of the heater can be measured efficiently and timely by using the photodetector having a high responding speed, such that an overheat or damage of the heater can be prevented by controlling the heater based on the measured temperature.
A method of manufacturing a space transformer includes providing a carrier substrate made for a chip package, forming an insulated layer disposed on the carrier substrate, and forming a conductive block. The carrier substrate is formed with elongated first and second wires. The first wire has an elongated contact which is longer than the width of the first wire. The insulated layer is formed with a hole corresponding in position to the elongated contact. The conductive block is formed with an elongated connecting column located in the hole and connected with the elongated contact, and a cylindrical contact pad exposed at the outside of the insulated layer, larger-sized than the elongated connecting column is connected with the elongated connecting column. As a result, the cylindrical contact pad has sufficient area and structural strength for contact with a probe needle.
H05K 3/40 - Forming printed elements for providing electric connections to or between printed circuits
G01R 3/00 - Apparatus or processes specially adapted for the manufacture of measuring instruments
H05K 3/14 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material
H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
H05K 3/32 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
G01R 1/20 - Modifications of basic electric elements for use in electric measuring instrumentsStructural combinations of such elements with such instruments
H01R 43/20 - Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
An assembly method of direct-docking probing device is provided. First, a space transforming plate made by back-end-of-line semiconductor manufacturing process is provided, so the thickness of the space transforming plate is predetermined by the client of probe card manufacturer. Then a reinforcing plate in which a plurality of circuits disposed is provided, which has larger mechanical strength than the space transforming plate. After that the reinforcing plate and the space transforming plate are joined and electrically connected by a plurality of solders so as to form a space transformer. Then, a conductive elastic member and a probe interface board are provided. Thereafter, the space transformer and the conductive elastic member are mounted on the probe interface board. After that, at least one vertical probe assembly having a plurality of vertical probes is mounted on the space transforming plate, and the vertical probes is electrically connected with the space transforming plate.
An integrated high-speed probe system is provided. The integrated high-speed probe system includes a circuit substrate for transmitting low-frequency testing signals from a tester through a first probe of the probe assembly to a DUT, and a high-speed substrate for transmitting high-frequency testing signals from the tester to the DUT. The high-speed substrate extends from the upper surface of the circuit substrate in the testing area to the lower surface of the circuit substrate in the probe area for being adjacent to the probe assembly and electrically connecting the second probe. In this way, the tester can transmit testing signals of different frequencies through the integrated high-speed probe system.
A probe module, which supports loopback test and is provided between a PCB and a DUT, includes a substrate, a probe base, two probes, two signal path switchers, and a capacitor. The substrate has two first connecting circuits and two second connecting circuits, wherein an end of each first connecting circuit is connected to the PCB. The probe base is provided between the substrate and the DUT with the probes provided thereon, wherein an end of each probe is exposed and electrically connected to one second connecting circuit, while another end thereof is also exposed to contact the DUT. Each signal path switcher is provided on the probe base, and respectively electrically connected to another end of one first and one second connecting circuits. The capacitor is provided on the probe base with two ends electrically connected to the two signal path switchers.
