Nanonex Corporation

United States of America

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        Patent 10
        Trademark 2
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        United States 9
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IPC Class
B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing 4
G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor 4
B29C 39/08 - Introducing the material into the mould by centrifugal force 2
B29C 43/04 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles using movable moulds 2
B29C 43/10 - Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies 2
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1.

Imprint lithography system and method for manufacturing

      
Application Number 14776568
Grant Number 10105883
Status In Force
Filing Date 2014-03-16
First Publication Date 2016-02-11
Grant Date 2018-10-23
Owner NANONEX CORPORATION (USA)
Inventor
  • Tan, Hua
  • Hu, Lin
  • Zhang, Wei
  • Chou, Stephen Y.

Abstract

A nanoimprint lithography system and method for manufacturing substrates with nano-scale patterns, having a process chamber with transparent sections on both top and side walls, a robot for automatic molds and substrates loading and unloading, and optical and stage apparatuses to obtain the desired spatial relationship between the mold and substrate, with an enclosed volume referring to mold mini-chamber being formed between the mold/holder and top wall of the chamber and with the process chamber and mini-chamber being capable of both vacuuming and pressurizing, and inside the chamber, a ring shape seal assembly is installed and a mold support assembly can be installed that aids in imprinting all the way to the edge of the substrate with various embodiments for carrying out fluid pressure imprinting, separation, measurement and control of mold and substrate gap, substrate thickness, and system axial force.

IPC Classes  ?

  • B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
  • B29C 43/58 - Measuring, controlling or regulating
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
  • B29C 39/02 - Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressureApparatus therefor for making articles of definite length, i.e. discrete articles
  • B29C 43/02 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles
  • B29L 9/00 - Layered products

2.

System and methods of mold/substrate separation for imprint lithography

      
Application Number 14776607
Grant Number 10108086
Status In Force
Filing Date 2014-03-17
First Publication Date 2016-02-04
Grant Date 2018-10-23
Owner NANONEX CORPORATION (USA)
Inventor
  • Tan, Hua
  • Hu, Lin
  • Chou, Stephen Y.

Abstract

A nanoimprint system and methods for separating imprinted substrates with nano-scale patterns from mold for manufacturing. Generally, the system includes means to create, monitor, and control relative movement between the mold and substrate for separation. It is capable of controlling where and when the separation happens and finishes. The relative movement may be generated by motion stages, springs, stage driven flexures, inflatable O-rings, gas flow, and other mechanical means. It may be monitored by separation force, overhead camera, and vacuum/pressures in different area of the system. The relative movement may be any combination of stages movements and movement sequences. The separation speed, direction, and force can be well controlled in the system to achieve fast and reliable separation between mold and substrate, and at the same time maintain the pattern shape and details on the consolidated imprint resist.

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
  • B82Y 40/00 - Manufacture or treatment of nanostructures
  • B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
  • B29C 43/50 - Removing moulded articles
  • B29C 43/56 - Compression moulding under special conditions, e.g. vacuum
  • B29C 43/58 - Measuring, controlling or regulating
  • B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing

3.

Fast nanoimprinting methods using deformable mold

      
Application Number 14301101
Grant Number 09533445
Status In Force
Filing Date 2014-06-10
First Publication Date 2015-03-12
Grant Date 2017-01-03
Owner NANONEX CORPORATION (USA)
Inventor
  • Zhang, Wei
  • Tan, Hua
  • Hu, Lin
  • Chou, Stephen Y.

Abstract

Methods for nanoimprint lithography using a deformable mold. Generally, the method includes a deformable mold fixed firmly onto a hollow mold holder around its full periphery is attached to top inner surface of the chamber and positioned underneath the transparent section. The central area of the mold is freely accessible from underneath through the opening of the mold holder. At beginning of the imprinting, the substrate with a layer of resist is positioned underneath the mold at a predetermined gap between them and a substrate is moved up to contact with the mold either under vacuum or under atmosphere. After consolidating the resist, the substrate is separated from the mold by either direct pull-down enabled by stage movement or deforming the mold enabled by differential pressure between the mold mini-chamber and the bulk volume of the chamber, or mixing of both.

IPC Classes  ?

  • B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing
  • B82Y 10/00 - Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
  • B82Y 40/00 - Manufacture or treatment of nanostructures
  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor
  • B29L 7/00 - Flat articles, e.g. films or sheets

4.

IMPRINT LITHOGRAPHY SYSTEM AND METHOD FOR MANUFACTURING

      
Application Number US2014030106
Publication Number 2014/145360
Status In Force
Filing Date 2014-03-16
Publication Date 2014-09-18
Owner NANONEX CORPORATION (USA)
Inventor
  • Tan, Hua
  • Hu, Lin
  • Zhang, Wei
  • Chou, Stephen Y.

Abstract

A nanoimprint lithography system and method for manufacturing substrates with nano-scale patterns, having a process chamber with transparent sections on both top and side walls, a robot for automatic molds and substrates loading and unloading, and optical and stage apparatuses to obtain the desired spatial relationship between the mold and substrate, with an enclosed volume referring to mold mini-chamber being formed between the mold/holder and top wall of the chamber and with the process chamber and mini-chamber being capable of both vacuuming and pressurizing, and inside the chamber, a ring shape seal assembly is installed and a mold support assembly can be installed that aids in imprinting all the way to the edge of the substrate with various embodiments for carrying out fluid pressure imprinting, separation, measurement and control of mold and substrate gap, substrate thickness, and system axial force.

IPC Classes  ?

  • B29C 39/08 - Introducing the material into the mould by centrifugal force
  • B29C 43/04 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
  • B29C 59/16 - Surface shaping, e.g. embossingApparatus therefor by wave energy or particle radiation

5.

MOLD AND SUBSTRATE SEPARATION FOR IMPRINT LITHOGRAPHY

      
Application Number US2014030655
Publication Number 2014/145826
Status In Force
Filing Date 2014-03-17
Publication Date 2014-09-18
Owner NANONEX CORPORATION (USA)
Inventor
  • Tan, Hua
  • Hu, Lin
  • Chou, Stephen Y

Abstract

A nanoimprint system and methods for separating imprinted substrates with nano-scale patterns from mold for manufacturing. Generally, the system includes means to create, monitor, and control relative movement between the mold and substrate for separation. It is capable of controlling where and when the separation happens and finishes. The relative movement may be generated by motion stages, springs, stage driven flexures, inflatable O-rings, gas flow, and other mechanical means. It may be monitored by separation force, overhead camera, and vacuum/pressures in different area of the system. The relative movement may be any combination of stages movements and movement sequences. The separation speed, direction, and force can be well controlled in the system to achieve fast and reliable separation between mold and substrate, and at the same time maintain the pattern shape and details on the consolidated imprint resist.

IPC Classes  ?

  • B29C 39/08 - Introducing the material into the mould by centrifugal force
  • B29C 43/04 - Compression moulding, i.e. applying external pressure to flow the moulding materialApparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
  • B29C 43/10 - Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies

6.

Fast nanoimprinting apparatus using deformale mold

      
Application Number 13011844
Grant Number 08747092
Status In Force
Filing Date 2011-01-21
First Publication Date 2011-07-28
Grant Date 2014-06-10
Owner Nanonex Corporation (USA)
Inventor
  • Zhang, Wei
  • Tan, Hua
  • Hu, Lin
  • Chou, Stephen Y.

Abstract

The invention disclosed apparatuses and methods to do nanoimprint lithography using a deformable mold. Generally, the apparatus has a chamber with a transparent section on its top wall, which is capable of vacuuming and pressurizing. The deformable mold fixed firmly onto a hollow mold holder around its full periphery is attached to top inner surface of the chamber and positioned underneath the transparent section. The central area of the mold is freely accessible from underneath through the opening of the mold holder. An enclosed volume referring to mold mini-chamber is formed between the mold/holder and top wall of the chamber. Inside chamber, a stage assembly is installed. A chuck to vacuumly hold a substrate is mounted on top of the stage assembly. At beginning of the imprinting, the substrate with a layer of resist is positioned underneath the mold at a predetermined gap between them. Then, the substrate is moved up to contact with the mold either under vacuum or under atmosphere. The substrate and mold may be pressed further by introducing higher pressure inside the chamber. After consolidating the resist, the substrate is separated from the mold by either direct pull-down enabled by stage movement or deforming the mold enabled by differential pressure between the mold mini-chamber and the bulk volume of the chamber, or mixing of both.

IPC Classes  ?

  • B29C 59/16 - Surface shaping, e.g. embossingApparatus therefor by wave energy or particle radiation
  • B29C 70/44 - Shaping or impregnating by compression for producing articles of definite length, i.e. discrete articles using isostatic pressure, e.g. pressure difference-moulding, vacuum bag-moulding, autoclave-moulding or expanding rubber-moulding
  • B29C 35/08 - Heating or curing, e.g. crosslinking or vulcanising by wave energy or particle radiation
  • B29C 43/10 - Isostatic pressing, i.e. using non-rigid pressure-exerting members against rigid parts or dies

7.

Nanogap electronic detector for measuring properties of a biomolecule stretched in a nanochannel, and method thereof

      
Application Number 12761867
Grant Number 09810680
Status In Force
Filing Date 2010-04-16
First Publication Date 2010-10-21
Grant Date 2017-11-07
Owner Nanonex Corporation (USA)
Inventor
  • Chou, Stephen Y.
  • Liang, Xiaogan

Abstract

The present invention provides methods and apparatus for measuring a property of an sample, the apparatus can manipulate, detect, and analyze the sample composed of single molecules, single small particles or single small samples of matter by drawing the sample into a nanofluidic channel and stretching the sample within the channel, passing the stretched sample through a gap having a width of less than or equal to 20 nm of a nanogap detector positioned inside or adjacent to the nanofluidic channel and measuring an output from the nanogap detector representative of the property of the sample.

IPC Classes  ?

  • G01N 27/00 - Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
  • G01N 33/487 - Physical analysis of biological material of liquid biological material
  • B82Y 35/00 - Methods or apparatus for measurement or analysis of nanostructures
  • C12Q 1/68 - Measuring or testing processes involving enzymes, nucleic acids or microorganismsCompositions thereforProcesses of preparing such compositions involving nucleic acids
  • B01L 3/00 - Containers or dishes for laboratory use, e.g. laboratory glasswareDroppers

8.

IMPRINT LITHOGRAPHY WITH IMPROVED SUBSTRATE/MOLD SEPARATION

      
Application Number US2007085783
Publication Number 2008/067394
Status In Force
Filing Date 2007-11-28
Publication Date 2008-06-05
Owner NANONEX CORPORATION (USA)
Inventor
  • Zhang, Wei
  • Tan, Hua
  • Hu, Lin
  • Chou, Stephen Y

Abstract

In imprint lithography, a mold (300) having a pattern of projecting and recessed regions is pressed into a moldable surface (302) on a substrate (301) The thus-imprinted moldable surface (302) is permitted to at least partially harden to retain the Imprint, and the substrate (301) and mold (300) are separated. In accordance with the invention, the substrate (301) is separated from the mold (300) by bending laterally distal regions (300A and 300B) (regions away from the center toward the edges) of the mold (300) transversely away from the interface and transversely restraining the substrate (301) The mold (300) can then be easily separated from the substrate (301) by transverse displacement (300) Apparatus for effecting such separation is also described (e. g. Figs 5 and 6).

IPC Classes  ?

  • G03F 7/00 - Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfacesMaterials therefor, e.g. comprising photoresistsApparatus specially adapted therefor

9.

Method and apparatus to apply surface release coating for imprint mold

      
Application Number 11945470
Grant Number 08337959
Status In Force
Filing Date 2007-11-27
First Publication Date 2008-06-05
Grant Date 2012-12-25
Owner Nanonex Corporation (USA)
Inventor
  • Zhang, Wei
  • Hu, Lin
  • Tan, Hua
  • Gao, He
  • Kong, Linshu
  • Chou, Stephen Y.

Abstract

In imprint lithography, the mold is coated with a surface release layer for a non-sticking separation. Bonding strength of the release layer to the mold depends on the cleanness of the surface and the process of release layer deposition. In accordance with the invention, the mold is disposed in an evacuable chamber, cleaned to remove surface organic contamination and coated with the surface release layer in a chamber, all without relocation or undesired time delay. The chamber encloses a support chuck for the mold or substrate, a surface cleaner unit adjacent the support, a heating source adjacent the support, and advantageously, sensors of measuring chamber pressure, vapor partial pressure and moisture concentration. A vapor source connected to the chamber supplies release surfactant vapor. The mold is cleaned, and the cleaning is followed by vapor phase deposition of the surfactant. The mold is advantageously heated. Typical ways of cleaning include exposure to ozone or plasma ion etch. Surfactant vapor may be generated by liquid surface vaporization, liquid injection or spray vaporization. A surface adhesion promoter can be coated on the substrate by a similar method with the same apparatus.

IPC Classes  ?

  • H05H 1/24 - Generating plasma
  • C23C 16/00 - Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
  • B05D 3/00 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
  • B05D 3/02 - Pretreatment of surfaces to which liquids or other fluent materials are to be appliedAfter-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking

10.

Die imprint by double side force-balanced press for step-and-repeat imprint lithography

      
Application Number 11945407
Grant Number 08025829
Status In Force
Filing Date 2007-11-27
First Publication Date 2008-05-29
Grant Date 2011-09-27
Owner Nanonex Corporation (USA)
Inventor
  • Zhang, Wei
  • Tan, Hua
  • Hu, Lin
  • Chou, Stephen Y.

Abstract

In accordance with the invention, step-and-repeat imprint lithography is effected by applying balanced pressing forces from both sides of a substrate. The pressing forces are substantially equal in amplitude and opposite in direction. With the pressing forces thus balanced, the fixture that steps and holds the substrate does not bear the load of imprinting. The balance allows use of a high resolution aligning stage to carry the substrate and to maintain high accuracy of positioning without being shifted by change of load. With this method, sufficient imprint pressure can be used to obtain high quality patterning, a thin and uniform residual layer, and a high fidelity pattern.

IPC Classes  ?

  • B29C 59/02 - Surface shaping, e.g. embossingApparatus therefor by mechanical means, e.g. pressing

11.

AIR CUSHION PRESS

      
Serial Number 78715423
Status Registered
Filing Date 2005-09-19
Registration Date 2006-08-29
Owner Nanonex Corporation ()
NICE Classes  ? 07 - Machines and machine tools

Goods & Services

Nanoimprint lithography machines

12.

ENGINE FOR NANOTECHNOLOGY

      
Serial Number 78392979
Status Registered
Filing Date 2004-03-30
Registration Date 2006-02-07
Owner Nanonex Corporation ()
NICE Classes  ? 07 - Machines and machine tools

Goods & Services

Nanoimprint Lithography Machines And Resists and Masks For Use Therewith For Producing Nanoscale Devices