A filter comprises a stack of wafers (28). Each of the wafers has a through hole (6). Edges (7) of the holes together define an internal tube. An interface (32) between adjacent wafers defines filter channels. The filter channels comprises first coarse filter channels (20), second coarse filter channels (22) and fine filter channels (26). The first coarse filter channels are open towards an outer rim (5), extend in a direction from the outer rim and are closed towards the internal tube. The second coarse filter channels are arranged in an opposite manner. The fine filter channels connect the first and second coarse filter channels. The first and second coarse filter channels extend radially (R) and the fine filter channels extend tangentially (T). The first and second coarse filter channels are defined by recesses in a surface of a first wafer and the fine filter channels are defined by recesses, each one encircling the hole, in a surface of a second wafer.
B01D 29/46 - Edge filtering elements, i.e. using contiguous impervious surfaces of flat, stacked bodies
B01D 29/44 - Edge filtering elements, i.e. using contiguous impervious surfaces
B01D 29/56 - Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups Filtering elements therefor with multiple filtering elements, characterised by their mutual disposition in series connection
B01D 29/58 - Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups Filtering elements therefor with multiple filtering elements, characterised by their mutual disposition in series connection arranged concentrically or coaxially
2.
Method of manufacturing a nozzle arrangement and method for in-situ repairing a nozzle arrangement
A nozzle arrangement for use in a gas thruster is presented. At least one heater micro structure (20) is arranged in a stagnation chamber (12) of the gas thruster. The heater microstructure (20) comprises a core of silicon or a silicon compound coated by a surface metal or metal compound coating. The heater microstructure (20) is manufactured in silicon or a silicon compound and covered by a surface metal coating. The heater microstructure (20) is mounted in the stagnation chamber (12) before or after the coverage of the surface metal or metal compound coating. The coverage is performed by heating the heater microstructure and flowing a gas comprising low quantities of a metal compound. The compound decomposes at the heated heater microstructure (20), forming the surface metal or metal compound coating. The same principles of coating can be used for repairing the heater microstructure (20) in situ. The driving gas comprises preferably a compound exhibiting an exothermic reaction when coming into contact with a catalytically active material. If the gas is exposed to heater microstructures being covered with the catalytically active material, the gas is further heated by the catalytic reaction.
A micromechanical pressure relief valve arrangement (10) comprises a stack of wafers (13). An active pressure relief valve (20) is realized within the stack of wafers (13). A passive pressure relief valve (30) is also realized within said stack of wafers (13), arranged in parallel to the active pressure relief valve (20). A check valve (50), also realized within the stack of wafers (13), is arranged in series with both the active pressure relief valve (20) and the passive pressure relief valve (30).
F16K 15/14 - Check valves with flexible valve members
F16K 17/28 - Excess-flow valves actuated by the difference of pressure between two places in the flow line acting directly on the cutting-off member operating in one direction only
A wafer assembly (30) includes a substrate (71), in turn including a wafer (70) or a stack of wafers. The wafer assembly (30) further includes an electrical connection (32) arranged through at least a part of the substrate (71). The electrical connection (32) is made by low-resistance silicon. The electrical connection (32) is positioned in a hole (84) penetrating at least a part of the substrate (71). A surface (78) of the substrate (71) confining the hole (84) is electrically insulating. The electrical connection (32) has at least one protrusion (75), which protrudes transversally to a main extension (83) of the hole (84) and the protrusion (75) protrudes outside a minimum hole diameter (85), as projected in the main extension (83) of the hole (84). Preferably, the protrusion (75) is supported by a support surface (81) of the substrate (71). A manufacturing method is also disclosed.
A high-pressure fire safety valve (1) comprises a disc (10) that is capable of mechanically withstanding a high-pressure difference. The disc (10) has a multitude of holes (12) penetrating through the disc (10). Each of the holes (12) has a smallest diameter (d) of less than 100 micrometer. The high- pressure fire safety valve ( 1) further comprises a sealing substance (20) in a solid phase, sealing each of the holes (12). The sealing substance (20) exhibits a phase transition into a fluid state at elevated temperatures. This configuration results in that the multitude of holes (12) constitute straight evacuation channels for the high pressure when the sealing substance (20) has performed said phase transition. A high-pressure gas container comprising such a high-pressure fire safety valve and a manufacturing method for such a high-pressure fire safety valve are also disclosed.
F16K 17/38 - Safety valvesEqualising valves actuated in consequence of extraneous circumstances, e.g. shock, change of position of excessive temperature
A single use valve (10) comprises a plate (12) having an internal filter structure (28). A sealing substance (20) covers an inlet (14) to the filter structure (28). A heater arrangement (16) is arranged at the plate (12) in the vicinity of the sealing substance (20) for converting electrical current into heat and thereby melting or evaporating the sealing substance (20). The heater arrangement (16) conducts at least a part of the current, and preferably the entire current, along a conduction path not including the sealing substance (20). The melting of the sealing substance (20) thereby becomes independent on the existence of a complete electrical connection through the sealing substance (20). The heater arrangement (16) has therefore preferably its main heat emission in an area surrounding the sealing substance (20). The sealing substance (20) can be of any non-porous material.
F16K 17/14 - Safety valvesEqualising valves opening on surplus pressure on one sideSafety valvesEqualising valves closing on insufficient pressure on one side with fracturing member
F16K 17/40 - Safety valvesEqualising valves with fracturing member, e.g. fracturing diaphragm, fusible joint
7.
NOZZLE ARRANGEMENT FOR USE IN A GAS THRUSTER, GAS THRUSTER, METHOD FOR MANUFACTURING A NOZZLE ARRANGEMENT, METHOD FOR IN-SITU REPAIRING OF A NOZZLE ARRANGEMENT AND A METHOD FOR OPERATING A GAS THRUSTERS
A nozzle arrangement for use in a gas thruster is presented. At least one heater micro structure (20) is arranged in a stagnation chamber (12) of the gas thruster. The heater microstructure (20) comprises a core of silicon or a silicon compound coated by a surface metal or metal compound coating. The heater microstructure (20) is manufactured in silicon or a silicon compound and covered by a surface metal coating. The heater microstructure (20) is mounted in the stagnation chamber (12) before or after the coverage of the surface metal or metal compound coating. The coverage is performed by heating the heater microstructure and flowing a gas comprising low quantities of a metal compound. The compound decomposes at the heated heater microstructure (20), forming the surface metal or metal compound coating. The same principles of coating can be used for repairing the heater microstructure (20) in situ. The driving gas comprises preferably a compound exhibiting an exothermic reaction when coming into contact with a catalytically active material. If the gas is exposed to heater microstructures being covered with the catalytically active material, the gas is further heated by the catalytic reaction.
A wafer assembly (30) comprises a substrate (71), in turn comprising a wafer (70) or a stack of wafers. The wafer assembly (30) further comprises an electrical connection (32) arranged through at least a part of the substrate (71). The electrical connection (32) is made by low-resistance silicon. The electrical connection (32) is positioned in a hole (84) penetrating at least a part of the substrate (71). A surface (78) of the substrate (71) confining the hole (84) is electrically insulating. The electrical connection (32) has at least one protrusion (75), which protrudes transversally to a main extension (83) of the hole (84) and the protrusion (75) protrudes outside a minimum hole diameter (85), as projected in the main extension (83) of the hole (84). Preferably, the protrusion (75) is supported by a support surface (81) of the substrate (71). A manufacturing method is also disclosed.
A single use valve (10) comprises a plate (12) having an internal filter structure (28). A sealing substance (20) covers an inlet (14) to the filter structure (28). A heater arrangement (16) is arranged at the plate (12) in the vicinity of the sealing substance (20) for converting electrical current into heat and thereby melting or evaporating the sealing substance (20) . The heater arrangement (16) conducts at least a part of the current, and preferably the entire current, along a conduction path not including the sealing substance (20) . The melting of the sealing substance (20) thereby becomes independent on the existence of a complete electrical connection through the sealing substance (20). The heater arrangement (16) has therefore preferably its main heat emission in an area surrounding the sealing substance (20). The sealing substance (20) can be of any non-porous material.
F03G 7/06 - Mechanical-power-producing mechanisms, not otherwise provided for or using energy sources not otherwise provided for using expansion or contraction of bodies due to heating, cooling, moistening, drying, or the like
F16K 13/10 - Arrangements for cutting-off by means of liquid or granular medium
An isolation valve system comprises a main body (32), an actuator body (34) and a sealing membrane (307). The sealing membrane (307) is arranged at a high pressure portion (36) of the isolation valve system. The sealing membrane (307) mechanically attaches the actuator body (34) to the main body (32). The sealing membrane (307) further seals the high pressure portion (36) from a low pressure portion (38). A burst plug (315) is arranged against the main body (32) and supports the actuator body (34). An activation arrangement (50) is arranged for allowing an at least partial displacement of the burst plug (315), typically causing a phase transition. The sealing membrane (307) is dimensioned to break when the actuator body (34) is moved due to the displacement of the burst plug (315). The isolation valve system comprises preferably a stack (30) of substrates (301- 304) being bonded together. The substrates (301-304) have micromechanical structures, which form at least the actuator body (34) and the sealing membrane (307).
F16K 31/02 - Operating meansReleasing devices electricOperating meansReleasing devices magnetic
F16K 13/00 - Other constructional types of cut-off apparatusArrangements for cutting-off
F16K 7/12 - Diaphragm cut-off apparatus, e.g. with a member deformed, but not moved bodily, to close the passage with flat, dished, or bowl-shaped diaphragm
G01L 9/12 - Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elementsTransmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in capacitance
B64G 1/40 - Arrangements or adaptations of propulsion systems
patents
