Abstract

The present invention relates to a solder paste containing solder powder and a flux, wherein the solder powder is a lead-free solder alloy having a solidus temperature of 150° C. or less, the flux contains: a rosin; a solvent; a thixotropic agent; and an organic acid and an imidazole as an activator, the organic acid includes one or more kinds of dicarboxylic acids having 4 to 6 carbon atoms, and the imidazole includes one or more kinds among imidazole compounds having 3 to 6 carbon atoms and derivatives thereof.

IPC Classes  ?

• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
• C22C 12/00 - Alloys based on antimony or bismuth
• C22C 13/02 - Alloys based on tin with antimony or bismuth as the next major constituent

Goods & Services

Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; flux-cored solder.

Goods & Services

Soft solder alloys; solder pastes; soldering wire of metal; soft solders in the form of washer, ring, pellet, powder, ribbon, ball, wire and bar; soft solder preforms made of metal; flux-cored soft solder

Goods & Services

(1) Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; flux-cored solder.

Goods & Services

Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; brazing alloys; flux-cored solder; non-ferrous metals and their alloys; iron and steel.

Goods & Services

Soft solder alloys; solder pastes; soldering wire of metal; soft solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; soft solder preforms made of metal; brazing alloys; flux-cored soft solder; non-ferrous metals and their alloys; irons and steels

Goods & Services

Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; brazing alloys; flux-cored solder; non-ferrous metals and their alloys; iron and steel.

Goods & Services

Soft solder alloys; solder pastes; soldering wire of metal; soft solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; soft solder preforms made of metal; brazing alloys; flux-cored soft solder; non-ferrous metals and their alloys; irons and steels

Goods & Services

Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; brazing alloys; flux-cored solder; non-ferrous metals and their alloys; iron and steel.

Goods & Services

(1) Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; brazing alloys; flux-cored solder; non-ferrous metals and their alloys; iron and steel.

Abstract

The present invention relates to a solder paste which contains a solder powder and a flux, wherein: the solder powder is composed of a lead-free solder alloy that has a solidus temperature of 150°C or less; the flux contains rosin, a solvent, a thixotropic agent, and an organic acid and an imidazole serving as activators; the organic acid contains one or more dicarboxylic acids having 4 to 6 carbon atoms; and the imidazole contains one or more substances that are selected from among imidazole compounds having 3 to 6 carbon atoms and derivatives of these imidazole compounds.

IPC Classes  ?

• C22C 12/00 - Alloys based on antimony or bismuth
• C22C 13/02 - Alloys based on tin with antimony or bismuth as the next major constituent
• C22C 28/00 - Alloys based on a metal not provided for in groups
• B23K 35/22 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• B23K 35/363 - Selection of compositions of fluxes for soldering or brazing

Abstract

By using a solder paste including powder of a lead-free solder alloy mainly composed of Sn and a metal particle with a melting point higher than a melting point of the lead-free solder alloy, in which the metal particle is formed. of a Cu—Ni alloy having a Ni content of 0.1 to 90% by mass, or formed of a Cu—Co alloy having a Co content of 0.1 to 90% by mass, a solder bonded body that has heat resistance, thermal conductivity, and reliability higher than ever can be formed.

IPC Classes  ?

• B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
• B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent

Abstract

Provided is a solder-metal mesh composite material in which a lead-free solder layer formed of Sn—Cu—Ni-based lead-free solder contains metal mesh having high thermal conductivity, a void occupancy in a cross-section in a thickness direction is 15% or less, and the Sn—Cu—Ni-based lead-free solder contains 0.1 to 2% by weight of Cu, 0.002 to 1% by weight of Ni, and Sn as a remainder or contains 0.1 to 2% by weight of Cu, 0.002 to 1% by weight of Ni, 0.001 to 1% by weight of Ge, and Sn as a remainder.

IPC Classes  ?

• B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
• C22C 13/00 - Alloys based on tin
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C

Abstract

Provided is a preformed solder including a lead-free solder mainly composed of Sn and a metal particle with a melting point higher than a melting point of the lead-free solder. The metal particle is formed of a Cu-Ni alloy having a Ni content of 0.1 to 90% by mass, or a Cu-Co alloy having a Co content of 0.1 to 90% by mass, and the lead-free solder may contain Ni when the metal particle is formed of the Cu-Ni alloy, or contains Ni when the metal particle is formed of the Cu-Co alloy, and (Cu,Ni) 6Sn5 is formed on a surface of the metal particle. With this preformed solder, a bonded portion having heat resistance, thermal conductivity, and reliability higher than ever can be formed.

IPC Classes  ?

• B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent

Abstract

A lead-free solder alloy includes Ag in an amount of 0.3 to 4.0% by mass, Cu in an amount of 0.1 to 2.0% by mass, Fe in an amount of 0.005 to 0.05% by mass, Ni in an amount of 0.01 to 0.5% by mass, Ga in an amount of 0.001 to 0.1% by mass, and Sn as the balance.

IPC Classes  ?

• C22C 13/00 - Alloys based on tin
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• B23K 103/08 - Non-ferrous metals or alloys

Abstract

A lead-free solder alloy consisting essentially of: 32 mass % or more and 40 mass % or less of Bi; 0.1 mass % or more and 1.0 mass % or less of Sb; 0.1 mass % or more and 1.0 mass % or less of Cu; 0.001 mass % or more and 0.1 mass % or less of Ni; and a remainder of Sn with unavoidable impurities. The lead-free solder alloy further contains specific elements in amounts in predetermined ranges.

IPC Classes  ?

• C22C 13/02 - Alloys based on tin with antimony or bismuth as the next major constituent
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• B23K 103/08 - Non-ferrous metals or alloys

Abstract

2 between the first and second metal base materials, thereby joining the first and second metal material.

IPC Classes  ?

• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
• C22C 28/00 - Alloys based on a metal not provided for in groups

Abstract

With a method for manufacturing a solder preform that includes a step in which lead-free solder particles and particles of a metal with a higher melting point than the lead-free solder are mixed by stirring, a step in which a homogeneous powder is obtained in a particulate state, a step in which the mixed powder is compression-molded to obtain a compression-molded article, and a step in which the compression-molded article is molded into a prescribed shape by an extrusion molding device to obtain an extrusion-molded article, it is possible to provide a method for manufacturing a solder preform that allows a solder preform in which metal particles are dispersed uniformly in a lead-free solder to be obtained with simpler size management of the metal particles than was previously possible, without the metal particles becoming smaller, flux being left behind, or the like.

IPC Classes  ?

• B23K 35/14 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape not specially designed for use as electrodes for soldering
• B23K 35/40 - Making wire or rods for soldering or welding

Goods & Services

Solder alloys; solder pastes; soldering wires of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; flux-cored solders.

Abstract

The purpose of the present invention is to provide a lead-free solder alloy and a solder bonded body that, despite no addition of "Ni", have solderability and bonding characteristics as with a "Ni"-added lead-free solder alloy.　This lead-free solder alloy is characterized in that Sn-Cu is used as a basic composition and that the basic composition contains one or more selected from the group consisting of Co, Mn, Pd, Rh, and Fe. By using the lead-free solder alloy, it is possible to achieve: a lead-free solder alloy that, as compared with a "Ni"-containing lead-free solder, is free from Ni sensitization, and exhibits excellent solderability and workability during soldering and excellent mechanical characteristics and bonding reliability; and a solder bonded body using the lead-free solder alloy.

IPC Classes  ?

• C22C 13/00 - Alloys based on tin
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C

Abstract

According to the present invention, a solder bonded body that has more excellent heat resistance, thermal conductivity and reliability than ever before is able to be formed by a solder paste which contains a lead-free solder alloy powder that is mainly composed of Sn and metal particles that have a higher melting point than the lead-free solder alloy, wherein the metal particles are formed of a Cu-Ni alloy having an Ni content of from 0.1% by mass to 90% by mass or a Cu-Co alloy having a Co content of from 0.1% by mass to 90% by mass.

IPC Classes  ?

• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22C 19/03 - Alloys based on nickel or cobalt based on nickel
• B23K 35/22 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
• B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C

Abstract

Provided is a solder-metal mesh composite material characterized in that a metal mesh that exhibits high thermal conductivity is contained within a lead-free solder layer formed from a Sn-Cu-Ni-based lead-free solder, the proportion of pores in a cross section in the thickness direction is 15% or less, and the Sn-Cu-Ni-based lead-free solder either contains 0.1-2 wt% of Cu and 0.002-1 wt% of Ni, with the remainder being Sn, or contains 0.1-2 wt% of Cu, 0.002-1 wt% of Ni and 0.001-1 wt% of Ge, with the remainder being Sn. This solder-metal mesh composite material is a member that exhibits heat resistance, excellent thermal conductivity and high bonding reliability. In cases where the solder-metal mesh composite material is used as a solder bonding material at a bonding section of an electronic device or a heat-dissipating material, because the number of pores in a soldered body is low, it is possible to efficiently transfer heat generated by an electronic component and form a bonding section having superior thermal conductivity and high bonding reliability.

IPC Classes  ?

• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• C22C 13/00 - Alloys based on tin
• B23K 35/14 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape not specially designed for use as electrodes for soldering
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• B23K 35/40 - Making wire or rods for soldering or welding

Goods & Services

Soft solder alloys; solder pastes; soldering wires of metal; soft solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; soft solder preforms made of metal; flux-cored soft solders

Abstract

655 is formed on the surface of the metal particles. This preform solder can be used to form a solder-bound part having excellent heat resistance, thermal conductivity, and reliability superior to those of conventional products.

IPC Classes  ?

• B23K 35/14 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape not specially designed for use as electrodes for soldering
• B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
• B22F 1/02 - Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition comprising coating of the powder
• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22C 19/03 - Alloys based on nickel or cobalt based on nickel

Abstract

A lead-free solder alloy contains: 32 mass% or more and 40 mass% or less of Bi; 0.1 mass% or more and 1.0 mass% or less of Sb; 0.1 mass% or more and 1.0 mass% or less of Cu; 0.001 mass% or more and 0.1 mass% or less of Ni; and a remainder of Sn with unavoidable impurities, or the lead-free solder alloy further contains specific elements in amounts in predetermined ranges. Accordingly, it is possible to form a solder joint part that maintains a low level of the melting point of the Sn-Bi-based solder alloy, has better physical characteristics than those in conventional art, and has higher reliability than those in conventional art.

IPC Classes  ?

• C22C 13/02 - Alloys based on tin with antimony or bismuth as the next major constituent
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C

Abstract

The present invention is capable of forming a solder joint part, which has better physical characteristics than before and higher reliability than before while maintaining the melting point of a Sn-Bi-based solder alloy at a low level, by using a lead-free solder alloy containing 32-40 mass% of Bi, 0.1-1.0 mass% of Sb, 0.1-1.0 mass% of Cu, 0.001-0.1 parts by mass of Ni, and the remainder consisting of Sn and inevitable impurities, or a lead-free solder alloy further containing a specific element in a predetermined range.

IPC Classes  ?

• C22C 13/02 - Alloys based on tin with antimony or bismuth as the next major constituent
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C

Abstract

In the present invention, corrosion of a nozzle used in a spot solder bath, for instance, can be inhibited by a lead-free solder alloy containing 0.3 to 4.0 mass% of Ag, 0.1 to 2.0 mass% of Cu, 0.005 to 0.05 mass% of Fe, 0.01 to 0.5 mass% of Ni, 0.001 to 0.1 mass% of Ga and Sn as the balance.

IPC Classes  ?

• C22C 13/00 - Alloys based on tin
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C

Abstract

The present invention relates to a solder joint part production method, wherein at least one metal substrate among a first metal substrate and a second metal substrate is an alloy in which the Ni content is 0 to less than 44% by weight and the Cu content exceeds 56% by weight, and the solder is a soldering alloy comprising Ga and unavoidable impurities or is a soldering alloy having a melting point of 30°C or lower and comprising Ga as the main component, the method comprises the step of coating the solder on the surface of the first metal substrate and then placing the second metal substrate over the coated solder, and the step of heating at a temperature of 90°C or lower, under a rare gas atmosphere or under an ambient air atmosphere, or in a liquid, causing CuGa2 or (Cu,Ni)Ga2 to be generated between the first metal substrate and the second metal substrate and joining first and second metal materials. The present invention allows metal members on a substrate to be joined to one another even at 90°C or lower, and in addition, can provide a production method for a solder joint part having pliability so as not to be ruptured readily even on a deformable substrate such as a flexible substrate, and can provide a solder joint part obtained by the production method.

IPC Classes  ?

• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
• C22C 9/06 - Alloys based on copper with nickel or cobalt as the next major constituent
• C22C 28/00 - Alloys based on a metal not provided for in groups
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C

Abstract

This lead-free solder alloy exhibits extremely favorable creep characteristics as a result of the added quantity of Cu being 0.1-2.0 mass%, the added quantity of Ni being 0.01-1.0 mass% and the added quantity of Ge being 0.001-2.0 mass%, with the remainder comprising Sn and unavoidable impurities, and enables a synergistic improvement in weld strength by adding, in the aforementioned composition, 0.1-5.0 mass% of Bi and/or Sb in place of Sn. This lead-free solder alloy may contain 0.1-8.0 mass% of Bi and/or 0.1-6.5 mass% of Sb. In addition, the ratio (Ge/Cu) of the content of Ge relative to that of Cu may be 0.005-0.5. In addition, the lead-free solder alloy may contain 0.1-8.0 mass% of Bi and 0.1-6.5 mass% of Sb, and the ratio (Bi/Sb) of the content of Bi relative to that of Sb may be 0.02-50.

IPC Classes  ?

• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• C22C 13/00 - Alloys based on tin
• C22C 13/02 - Alloys based on tin with antimony or bismuth as the next major constituent

Goods & Services

Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; brazing alloys; flux-cored solder; non-ferrous metals and their alloys; iron and steel.

Goods & Services

Soft solder alloys; solder pastes; soldering wire of metal; soft solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; soft solder preforms made of metal; flux-cored soft solder; non-ferrous metals and their alloys

Goods & Services

(1) Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; flux-cored solder; non-ferrous metals and their alloys

Goods & Services

Soft solder alloys; solder pastes; soldering wire of metal; soft solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; soft solder preforms made of metal; flux-cored soft solder; non-ferrous metals and their alloys

Goods & Services

solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; brazing alloys; flux-cored solder; non-ferrous metals and their alloys; iron and steel.

Abstract

Provided is a tool for retaining a solder wire coil formed by winding a solder wire in a cylindrical shape, said tool being provided with: a first shape-retaining member which has a cylindrical outer core body to be inserted in a central hole of the solder wire coil and a first flange part that covers one end face of the solder wire coil; and a second shape-retaining member which has an inner core body to be inserted in the outer core body and a second flange part that covers the other end face of the solder wire coil, wherein the outer core body has formed therein one of more slits that extend in an axial direction from a leading end thereof, the inner circumferential surface of the outer core body has formed thereon a ridge extending in the circumferential direction, and the outer circumferential surface of the inner core body has formed therein an engagement groove that is brought into engagement with the ridge.

IPC Classes  ?

• B65H 75/18 - Constructional details
• B65H 75/14 - Kinds or types of circular or polygonal cross-section with two end flanges
• B65H 75/22 - Constructional details collapsibleConstructional details with removable parts

Abstract

Provided are a solder joint in which βSn grains are oriented in a specific desired direction, the βSn grains having a desired structure, and a bonding method relating to the solder joint. Provided is a solder joint in which at least two copper substrates (2) are bonded to each other using a lead-free solder alloy including Sn. A solder ball (1) relating to the lead-free solder alloy comprises: one or a plurality of nucleation grains (4); and a single grain βSn of which a [001] direction is parallel with a facet plane of the nucleation grains (4), and which is crystal-oriented in a specific direction with respect to the copper substrates (2).

IPC Classes  ?

• B23K 1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• C22C 13/00 - Alloys based on tin

Abstract

A smartphone 7 is provided with a camera 71 capable of reading tank identification information assigned to a solder tank 3, and reading sample identification information assigned to a container 6, and an identification information acquiring unit 72 which transmits the tank identification information and the sample identification information to a solder management server device 1, wherein the solder management server device 1 includes: a sample information storage unit 17 which associates with one another and stores the tank identification information and the sample identification information transmitted from the smartphone 7; and an analysis result acquiring unit 12 which acquires a component analysis result of a sample accommodated in the container 6 and the sample identification information assigned to the container 6, and causes the same to be associated with one another and stored by the sample information storage unit 17.

IPC Classes  ?

• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 3/06 - Solder feeding devicesSolder melting pans

Abstract

The lead-free solder alloy according to the present invention is a Sn-Ag-Cu-based lead-free solder alloy that is used for soldering a member to be joined that contains Al at least in the surface layer thereof, the lead-free solder alloy comprising Ni and an auxiliary agent, the difference in standard electrode potential between the auxiliary agent and Al being 0.7 V or lower. The solder joint of the present invention is such that, by using said lead-free solder alloy, the auxiliary agent is distributed in a joint portion with the member to be joined that contains Al at least in the surface layer thereof, and the difference in standard electrode potential between the member to be joined and the solder alloy is reduced.

IPC Classes  ?

• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• C22C 13/00 - Alloys based on tin

Abstract

This solder joint has used therein an Sn-Cu-Ni-Bi-Ge-based lead-free solder alloy, wherein the lead-free solder alloy is configured from an alloy comprising 0.1-2.0% by weight of a Cu additive, 0.05-0.5% by weight of a Ni additive, 0.1-8% by weight of a Bi additive, and 0.006-0.1% by weight of a Ge additive, the balance being Sn and unavoidable impurities. This solder joint is provided with a joining part to an assembly in which the generation of Cu3Sn is suppressed.

IPC Classes  ?

• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• C22C 13/00 - Alloys based on tin

Goods & Services

Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; brazing alloys; flux-cored solder; non-ferrous metals and their alloys; iron and steel.

Goods & Services

Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; brazing alloys; flux-cored solder; non-ferrous metals and their alloys; iron and steel.

Abstract

A solder wire coil H shape retainer 10 on which a solder wire is wound in a cylindrical shape has: a first shape retaining member 1 that comprises a cylindrical outer core body 11 inserted into a center hole H11 of the solder wire coil H and a first flange 12 that covers one end face of the solder wire coil H; and a second shape retaining member 2 that comprises an inner core body 21 inserted into the outer core body 11 and a second flange 22 that covers the other end face of the solder wire coil H. A slit is formed on the outer core body 11 of the first shape retaining member 1 so as to extend in the axial direction thereof, and at least a portion of the outer core body 11 is partitioned into a plurality of divided pieces 15 by the slit.

IPC Classes  ?

• B65H 75/14 - Kinds or types of circular or polygonal cross-section with two end flanges

Goods & Services

Soldering fluxes; soldering paste; soldering preparations; soldering chemicals; brazing fluxes; brazing preparations; brazing chemicals; industrial chemicals; chemicals; detergents for industrial use; detergents for use in manufacturing processes. Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; brazing alloys; flux-cored solder; non-ferrous metals and their alloys; iron and steel.

Goods & Services

Soldering fluxes; soldering paste; soldering preparations; soldering chemicals; brazing fluxes; brazing preparations; brazing chemicals; industrial chemicals; chemicals; detergents for industrial use; detergents for use in manufacturing processes. Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; brazing alloys; flux-cored solder; non-ferrous metals and their alloys; iron and steel.

Goods & Services

Soldering fluxes; soldering paste; soldering preparations; soldering chemicals; brazing fluxes; brazing preparations; brazing chemicals; industrial chemicals; chemicals; detergents for industrial use; detergents for use in manufacturing processes. Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; brazing alloys; flux-cored solder; non-ferrous metals and their alloys; iron and steel. Demonstration of goods; distribution and dissemination of advertising materials; on-line advertising on computer networks; distribution of samples; organization of trade fairs for commercial or advertising purposes; organization of exhibitions for commercial or advertising purposes; commercial administration of the licensing of the goods and services of others; sales promotion for others; marketing services; presentation of goods on communication media, for retail purposes; advertising and publicity services; business management analysis or business consultancy; market analysis and research services; providing information concerning commercial sales; business management of hotels; promoting the goods and services of others through the administration of sales and promotional incentive schemes involving trading stamps; import-export agency services; compilation of information into computer databases; rental of publicity and marketing materials; providing business information, namely providing newspaper article information in the field of business; commercial information and advice for consumers; retail services or wholesale services for printed matter; retail services or wholesale services for paper and stationery.

Goods & Services

Soldering paste Solder alloys of common metal; solder pastes; flux-cored solder; non-ferrous metals and their alloys

Abstract

A solder wire bobbinless coil includes a solder wire coil formed by winding a solder wire into a hollow columnar, the solder wire coil having a first coil opening at one end of the hollow columnar, and a second coil opening at the other end of the hollow columnar; and a covering film covering an outer surface of the solder wire coil. The covering film has a first film opening smaller than the first coil opening on a portion covering the first coil opening and a second film opening equal to or smaller than the second coil opening on a portion covering the second coil opening, and the first film opening includes, at a peripheral area thereof, a first protruding portion extending so as to protrude to an inner side of the first coil opening.

IPC Classes  ?

• B23K 3/06 - Solder feeding devicesSolder melting pans
• B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape

Abstract

Provided is a lead-free solder alloy and soldering capable of maintaining strong joining strength even in a high-temperature state after soldering and having high reliability and versatility. The lead-free solder alloy composition of the present invention has Sn—Cu—Ni as a basic composition, which includes 0.1 to 2.0 mass % of Cu, and 0.01 to 0.5 mass % of Ni, 0.1 to 5 mass % of Bi, and 76.0 to 99.5 mass % of Sn, such that it is possible to implement soldering with high reliability without decreasing joining strength of a soldered joint even in a state of being exposed to high temperature for a long time, as well as joining strength at the time of bonding.

IPC Classes  ?

• C22C 13/00 - Alloys based on tin
• C22C 13/02 - Alloys based on tin with antimony or bismuth as the next major constituent
• B23K 35/362 - Selection of compositions of fluxes
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• H01R 4/02 - Soldered or welded connections
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
• B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape

Goods & Services

Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; brazing alloys; flux-cored solder; non-ferrous metals and their alloys; iron and steel.

Goods & Services

Solder alloys; solder pastes; solders in the form of powder, ribbon, ball, wire or bar; flux-cored solder

Abstract

f) of the reaction tubes (30, 40) for forming, in the spiral flows (e, j), nanoparticles (26) from the ingredient material (12) and discharging a generation liquid (65) containing the nanoparticles (26).

IPC Classes  ?

• B22F 9/24 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions
• B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
• B22F 9/02 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using physical processes
• B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites
• B82Y 40/00 - Manufacture or treatment of nanostructures

Abstract

A silver electrode joint having a high joint strength obtained by actively minimizing the particle size of a silver-zinc intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, the joint including silver at least as the surface layer thereof, using a solder alloy which comprises 2-9 wt % of zinc, 0.0001-0.1 wt % of manganese and the balance consisting of tin, the solder joint having a joint interface wherein the particle size of a silver-zinc intermetallic compound, which is formed by silver being the surface layer of the article to be joined and zinc in the solder alloy, is 5 μm or less.

IPC Classes  ?

• B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
• C22C 13/00 - Alloys based on tin
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 35/28 - Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
• B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
• B23K 35/00 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
• B23K 103/08 - Non-ferrous metals or alloys
• B23K 103/12 - Copper or alloys thereof
• B23K 103/18 - Dissimilar materials
• B23K 101/36 - Electric or electronic devices

Abstract

The purpose of the present invention is to provide a lead-free solder alloy and solder in which it is possible to maintain high junction strength that does not decrease even in a high temperature state after soldering, the lead-free solder alloy and solder having a high degree of reliability and versatility. In the present invention, the basis composition is Sn-Cu-Ni, the lead-free alloy composition containing 0.1-2.0 mass% of Cu, 0.01-0.5 mass% of Ni, 0.1-5 mass% of Bi, and 76.0-99.5 mass% of Sn. As a result of such a lead-free alloy composition, the junction strength of the solder does not decrease during soldering even when the solder is exposed to high temperatures over a long period of time, as shall be apparent, thereby enabling highly reliable soldering.

IPC Classes  ?

• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• C22C 13/00 - Alloys based on tin
• C22C 13/02 - Alloys based on tin with antimony or bismuth as the next major constituent
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering

Abstract

　The purpose of the present invention is to provide a lead-free solder alloy and solder in which it is possible to maintain high junction strength that does not decrease even in a high temperature state after soldering, the lead-free solder alloy and solder having a high degree of reliability and versatility. In the present invention, the basis composition is Sn-Cu-Ni, the lead-free alloy composition containing 0.1-2.0 mass% of Cu, 0.01-0.5 mass% of Ni, 0.1-5 mass% of Bi, and 76.0-99.5 mass% of Sn. As a result of such a lead-free alloy composition, the junction strength of the solder does not decrease during soldering even when the solder is exposed to high temperatures over a long period of time, as shall be apparent, thereby enabling highly reliable soldering.

IPC Classes  ?

• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• C22C 13/00 - Alloys based on tin
• C22C 13/02 - Alloys based on tin with antimony or bismuth as the next major constituent
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering

Abstract

　Provided is a glass for an automotive vehicle capable of preventing cracking in glass substrate for an automotive vehicle over time when one surface of a metal terminal is soldered to a silver electrode formed on the glass substrate using a solder alloy and flux. Also provided is a soldering method. The metal terminal is copper or brass, and the soldering is performed by keeping the ratio of the area of flux applied to the silver electrode before soldering to the area of the one surface of the metal terminal at 3:1-20:1.

IPC Classes  ?

• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
• B23K 3/04 - Heating appliances
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• B60J 1/00 - WindowsWindscreensAccessories therefor
• C22C 13/00 - Alloys based on tin

Abstract

The purpose of the present invention is to inhibit the formation of Cu3SnIMC in a lead-free, low-melting, Sn-Cu based brazing filler metal and thereby provide a low-melting brazing filler metal which can attain improved joint reliability. This brazing filler metal is an Sn-Cu alloy which further contains 0.1 to 2.0mass% of Ni. Specifically, the brazing filler metal has an Sn-Cu-Ni alloy composition that contains 0.1 to 2.0mass% of Ni and 7.6 to 41.4mass%, which corresponds to a hyper-eutectic range, of Cu with the balance being Sn and unavoidable impurities. Thus, the present invention makes it possible to inhibit the formation of Cu3SnIMC in a joint. Further, the melting point of the brazing filler metal is adjustable within a range of 415 to 640ºC, so that the brazing filler metal can be easily processed into various shapes.

IPC Classes  ?

• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• C22C 13/00 - Alloys based on tin

Abstract

An oxygen source-containing composite nanometal paste including at least composite nanometal particles, in which an organic coating layer is formed around a submicron or smaller silver core, and an oxygen source, which feeds oxygen contributing to pyrolysis at a pyrolysis temperature range in which the organic coating layer is pyrolyzed. The oxygen source comprises an oxygen-containing metal compound, and the oxygen content of the oxygen source is within a range of 0.01 mass % to 2 mass % per 100 mass % of the composite nanometal particles.

IPC Classes  ?

• B22F 1/00 - Metallic powderTreatment of metallic powder, e.g. to facilitate working or to improve properties
• B23K 35/30 - Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
• B23K 35/34 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
• H01L 23/00 - Details of semiconductor or other solid state devices
• B22F 3/10 - Sintering only
• B23K 35/00 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
• C22C 5/06 - Alloys based on silver
• C22C 9/00 - Alloys based on copper
• B23K 35/36 - Selection of non-metallic compositions, e.g. coatings, fluxesSelection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
• B23K 35/02 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
• B82Y 30/00 - Nanotechnology for materials or surface science, e.g. nanocomposites
• B22F 3/14 - Both compacting and sintering simultaneously
• C09J 9/02 - Electrically-conducting adhesives

Abstract

A nanoparticle production method, production device and automatic production device that allow continuous mass production of nanoparticles with a uniform particle diameter and allow freely adjusting the generation time are provided. This nanoparticle production device is characterized by being configured from: reaction tubes (30, 40) which are filled with the same solvent (11) as that in a raw material solution (18), which is used in nanoparticle production and comprises a raw material substance (12) mixed into the solvent (11); a temperature controller (22) which controls the temperature of the solvent (11) in the reaction tubes (30, 40) to the synthesis temperature of the nanoparticles (26); inflow ends (30e, 40e) of the reaction tubes into which the raw material solution (18) is supplied; rotors (35, 45) which form spiral flows (e, j) along the inner surface of the outer walls (30h, 40h) of the reaction tubes while mixing the raw material solution (18) supplied and the solvent (11) present in the reaction tubes (30, 40); and outflow ends (30f, 40f) of the reaction tubes (30, 40) for forming, in the spiral flows (e, j), nanoparticles (26) from the raw material substance (12) and discharging a generated solution (65) containing the nanoparticles (26).

IPC Classes  ?

• B22F 9/24 - Making metallic powder or suspensions thereofApparatus or devices specially adapted therefor using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions

Abstract

An Ag electrode joint having a high joint strength can be obtained by actively minimizing the particle size of an Ag-Zn intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, which comprises Ag at least as the surface layer thereof, using a solder alloy which comprises 2-9 wt% of Zn, 0.0001-0.1 wt% of Mn and the balance consisting of Sn, said solder joint having a joint interface wherein the particle size of an Ag-Zn intermetallic compound, that is formed by Ag being the surface layer of the article to be joined and Zn in the solder alloy, is 5 μm or less.

IPC Classes  ?

• B23K 1/20 - Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
• B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• C22C 13/00 - Alloys based on tin
• B23K 101/38 - Conductors
• B23K 103/18 - Dissimilar materials

Abstract

The present invention provides a brazing material which has a low melting point and is easy to use. A low melting point brazing material of the present invention is formed from 0.3-41.4% by weight of Cu, 0.04-2% by weight of Ni and the balance made up of Sn. The Cu content is preferably 7.6-41.4% by weight. In addition, 0.006-0.1% by weight of Al or 0.001-1% by weight of Ge may be added into this low melting point brazing material.

IPC Classes  ?

• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• C22C 13/00 - Alloys based on tin

Abstract

The present invention provides a lead-free solder alloy having high reliability and excellent solder bonding properties and suited for the mounting of micronized electronic components at low cost. The lead-free solder alloy according to the present invention has a composition containing 0.5 to 1.5 wt % of Ag, 0.3 to 1.5 wt % of Cu, 0.01 to 0.2 wt % of Ni, 1.0 wt % or less of Ga, and the balance being Sn and unavoidable impurities.

IPC Classes  ?

• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• C22C 13/00 - Alloys based on tin
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

The purpose of the present invention is to pyrolyze and thereby remove to a higher efficiency the organic coating layer of composite nanometal particles during joining by sintering, sintering in an inert gas atmosphere, and the like, and improve the joining strength and electrical conductivity of the composite nanometal paste. The present invention provides an oxygen source-containing composite nanometal paste comprising at least composite nanometal particles, wherein an organic coating layer is formed around a submicron or smaller silver nucleus, and an oxygen source for feeding the oxygen that participates in the pyrolysis at the pyrolysis temperature zone where the organic coating layer is pyrolyzed. The oxygen content of the oxygen source is within a range of 0.01 to 2 mass% per 100 mass% of composite nanometal particles. The present invention also provides a joining method that uses the paste.

IPC Classes  ?

• H01B 1/22 - Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
• B22F 1/02 - Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition comprising coating of the powder
• H01B 1/00 - Conductors or conductive bodies characterised by the conductive materialsSelection of materials as conductors
• H01L 21/52 - Mounting semiconductor bodies in containers
• H05K 1/09 - Use of materials for the metallic pattern

Abstract

A highly reliable joint which is inhibited, during operation, from suffering a volume change accompanying phase transformation or suffering troubles such as strains or cracks caused by a volume change is rendered possible with an Sn-Cu solder alloy by regulating the cooling temperature of the solder alloy in a process ranging from a molten state to solidification and thereby intensively causing the intermetallic compound Cu6Sn5 which generates in the solidified joint to transform into stable-state orthorhombic crystals. When an Sn-Cu alloy which is held molten at a temperature of 186ºC or higher is cooled, the temperature of the alloy is controlled so as to result in a cooling temperature curve that passes through the region of 100% stable orthorhombic crystals defined by the time-temperature-transformation curves (TTT curves) shown in Fig. 6b.

IPC Classes  ?

• B23K 1/19 - Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 31/02 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to soldering or welding
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• C22C 13/00 - Alloys based on tin
• H01L 21/52 - Mounting semiconductor bodies in containers
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• B23K 101/36 - Electric or electronic devices

Abstract

The present invention addresses the problem of providing, at low cost, a lead-free solder alloy which has high reliability and excellent joining characteristics and which is suitable for mounting a microscopic electronic component. This lead-free solder alloy has a composition comprising 0.5 to 1.5 wt.% of Ag, 0.3 to 1.5 wt.% of Cu, 0.01 to 0.2 wt.% of Ni and 1.0 wt.% or less of Ga, with the remainder comprising Sn and unavoidable impurities.

IPC Classes  ?

• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• C22C 13/00 - Alloys based on tin
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

This solder alloy contains Al and/or Al2O3 in the amount of 0.006-0.15 wt% in an Sn-Cu hypereutectic area. In addition, this solder alloy comprises Cu in the amount of 0.7-7.6 wt%, and Al and/or Al2O3 in the amount of 0.006-0.5 wt%, with the remainder being Sn. Preferably, the amount of Cu contained is 2.0 wt% or greater. This solder alloy also has Ni substituted for Sn in the amount of 0.03-0.1 wt% of the composition thereof. Furthermore, this solder alloy has Ag substituted for Sn in the amount of 0.1-3.5 wt% of the composition thereof.

IPC Classes  ?

• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• C22C 13/00 - Alloys based on tin

Abstract

Provided is a wire solder with high tensile strength and pull cut resistance. An apparatus for feeding the wire solder is also provided. The wire solder has an extended wire solder and a core wire having a higher tensile strength than the wire solder. The core wire is made of thermosetting resin or Joulean heat generating material. The wire solder has a single or multiple strands bound together. The wire solder is supplied from upstream of a location of soldering while the core wire is rewound under tension at a location downstream of the location of soldering. The apparatus for feeding the wire solder comprises a wire solder storage section where the wire solder with a core wire is stored and a core wire rewinding member that takes up an end of the core wire to rewind the core wire. While the core rewinding member is rotated to rewind the core wire, the single or multiple strands of solder are heated to perform soldering at the location of soldering upstream of the core wire rewinding member.

IPC Classes  ?

• B23K 35/14 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape not specially designed for use as electrodes for soldering
• B23K 3/06 - Solder feeding devicesSolder melting pans
• B23K 35/40 - Making wire or rods for soldering or welding
• B23K 101/42 - Printed circuits

Abstract

A flux for soldering and a soldering paste containing the flux are provided, the paste suffering no viscosity change with time and neither filming nor becoming non-flowable.  The soldering paste has satisfactory applicability, printability, and soldering properties.  The flux for soldering comprises the following components: a resin, a thixotropic agent, an activator, a solvent, and nanotubes of a glucopyranosylamine type.  A soldering powder for use in the soldering paste preferably contains neither lead nor any lead alloy and comprises Sn-Cu-Ni or Sn-Ag-Cu as a major component.

IPC Classes  ?

• B23K 35/363 - Selection of compositions of fluxes for soldering or brazing
• B23K 35/22 - Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
• C22C 13/00 - Alloys based on tin
• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

Generation of voids is suppressed by means of a conventional apparatus without using attached apparatuses, such as a pressure reducing apparatus, in solder bonding wherein a BGA ball solder and a cream solder are used. The ball solder and the cream solder have a relationship where the liquidus temperature of the ball solder alloy is lower than the solidus temperature of the solder alloy in the cream solder. The ball solder and the cream solder are bonded by a reflow method. The liquidus temperature of the ball solder alloy and the solidus temperature of the solder alloy in the cream solder is 1°C or higher. The ball solder and the solder alloy used for the cream solder have a eutectic composition.

IPC Classes  ?

• H05K 3/34 - Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
• B23K 1/00 - Soldering, e.g. brazing, or unsoldering
• B23K 35/26 - Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C

Goods & Services

Soldering alloys.

Goods & Services

(1) Solder alloys.

Goods & Services

Soldering fluxes. Soldering alloys of tin.

Goods & Services

[ Soldering fluxes ] Soldering alloys of tin

Goods & Services

Soldering fluxes. Non ferrous metals and their alloys, including solder alloys.

Goods & Services

Nonferrous metals and their alloys.

Goods & Services

Soldering preparations of all kinds, soldering preparations being anodes, solder paste, solder wire, solder preforms, solder beads, solder ingots; lead-free solders, in particular lead-free electronic solders.

Goods & Services

Non ferrous metals and their alloys, namely, [ metal alloys for further manufacturing, ] soft solder alloys, and hard solder alloys, [ tin and its alloys ]

Goods & Services

Nonferrous metals and their alloys for further manufacturing

Goods & Services

Non-ferrous metals and their alloys.