The present invention relates to a solder paste containing solder powder and a flux, wherein the solder powder is a lead-free solder alloy having a solidus temperature of 150° C. or less, the flux contains: a rosin; a solvent; a thixotropic agent; and an organic acid and an imidazole as an activator, the organic acid includes one or more kinds of dicarboxylic acids having 4 to 6 carbon atoms, and the imidazole includes one or more kinds among imidazole compounds having 3 to 6 carbon atoms and derivatives thereof.
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
C22C 12/00 - Alliages à base d'antimoine ou de bismuth
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
Solder alloys; solder pastes; soldering wire of metal;
solders in the form of washer, ring, pellet, powder, ribbon,
ball, wire or bar; solder preforms made of metal; flux-cored
solder.
Soft solder alloys; solder pastes; soldering wire of metal; soft solders in the form of washer, ring, pellet, powder, ribbon, ball, wire and bar; soft solder preforms made of metal; flux-cored soft solder
(1) Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; flux-cored solder.
Solder alloys; solder pastes; soldering wire of metal;
solders in the form of washer, ring, pellet, powder, ribbon,
ball, wire or bar; solder preforms made of metal; brazing
alloys; flux-cored solder; non-ferrous metals and their
alloys; iron and steel.
Soft solder alloys; solder pastes; soldering wire of metal; soft solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; soft solder preforms made of metal; brazing alloys; flux-cored soft solder; non-ferrous metals and their alloys; irons and steels
Solder alloys; solder pastes; soldering wire of metal;
solders in the form of washer, ring, pellet, powder, ribbon,
ball, wire or bar; solder preforms made of metal; brazing
alloys; flux-cored solder; non-ferrous metals and their
alloys; iron and steel.
Soft solder alloys; solder pastes; soldering wire of metal; soft solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; soft solder preforms made of metal; brazing alloys; flux-cored soft solder; non-ferrous metals and their alloys; irons and steels
Solder alloys; solder pastes; soldering wire of metal;
solders in the form of washer, ring, pellet, powder, ribbon,
ball, wire or bar; solder preforms made of metal; brazing
alloys; flux-cored solder; non-ferrous metals and their
alloys; iron and steel.
(1) Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; brazing alloys; flux-cored solder; non-ferrous metals and their alloys; iron and steel.
The present invention relates to a solder paste which contains a solder powder and a flux, wherein: the solder powder is composed of a lead-free solder alloy that has a solidus temperature of 150°C or less; the flux contains rosin, a solvent, a thixotropic agent, and an organic acid and an imidazole serving as activators; the organic acid contains one or more dicarboxylic acids having 4 to 6 carbon atoms; and the imidazole contains one or more substances that are selected from among imidazole compounds having 3 to 6 carbon atoms and derivatives of these imidazole compounds.
C22C 12/00 - Alliages à base d'antimoine ou de bismuth
C22C 13/02 - Alliages à base d'étain avec l'antimoine ou le bismuth comme second constituant majeur
C22C 28/00 - Alliages à base d'un métal non mentionné dans les groupes
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/363 - Emploi de compositions spécifiées de flux pour le brasage ou le soudage
By using a solder paste including powder of a lead-free solder alloy mainly composed of Sn and a metal particle with a melting point higher than a melting point of the lead-free solder alloy, in which the metal particle is formed. of a Cu—Ni alloy having a Ni content of 0.1 to 90% by mass, or formed of a Cu—Co alloy having a Co content of 0.1 to 90% by mass, a solder bonded body that has heat resistance, thermal conductivity, and reliability higher than ever can be formed.
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
C22C 9/06 - Alliages à base de cuivre avec le nickel ou le cobalt comme second constituant majeur
13.
SOLDER-METAL MESH COMPOSITE MATERIAL AND METHOD FOR PRODUCING SAME
Provided is a solder-metal mesh composite material in which a lead-free solder layer formed of Sn—Cu—Ni-based lead-free solder contains metal mesh having high thermal conductivity, a void occupancy in a cross-section in a thickness direction is 15% or less, and the Sn—Cu—Ni-based lead-free solder contains 0.1 to 2% by weight of Cu, 0.002 to 1% by weight of Ni, and Sn as a remainder or contains 0.1 to 2% by weight of Cu, 0.002 to 1% by weight of Ni, 0.001 to 1% by weight of Ge, and Sn as a remainder.
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
Provided is a preformed solder including a lead-free solder mainly composed of Sn and a metal particle with a melting point higher than a melting point of the lead-free solder. The metal particle is formed of a Cu-Ni alloy having a Ni content of 0.1 to 90% by mass, or a Cu-Co alloy having a Co content of 0.1 to 90% by mass, and the lead-free solder may contain Ni when the metal particle is formed of the Cu-Ni alloy, or contains Ni when the metal particle is formed of the Cu-Co alloy, and (Cu,Ni) 6Sn5 is formed on a surface of the metal particle. With this preformed solder, a bonded portion having heat resistance, thermal conductivity, and reliability higher than ever can be formed.
A lead-free solder alloy includes Ag in an amount of 0.3 to 4.0% by mass, Cu in an amount of 0.1 to 2.0% by mass, Fe in an amount of 0.005 to 0.05% by mass, Ni in an amount of 0.01 to 0.5% by mass, Ga in an amount of 0.001 to 0.1% by mass, and Sn as the balance.
A lead-free solder alloy consisting essentially of: 32 mass % or more and 40 mass % or less of Bi; 0.1 mass % or more and 1.0 mass % or less of Sb; 0.1 mass % or more and 1.0 mass % or less of Cu; 0.001 mass % or more and 0.1 mass % or less of Ni; and a remainder of Sn with unavoidable impurities. The lead-free solder alloy further contains specific elements in amounts in predetermined ranges.
With a method for manufacturing a solder preform that includes a step in which lead-free solder particles and particles of a metal with a higher melting point than the lead-free solder are mixed by stirring, a step in which a homogeneous powder is obtained in a particulate state, a step in which the mixed powder is compression-molded to obtain a compression-molded article, and a step in which the compression-molded article is molded into a prescribed shape by an extrusion molding device to obtain an extrusion-molded article, it is possible to provide a method for manufacturing a solder preform that allows a solder preform in which metal particles are dispersed uniformly in a lead-free solder to be obtained with simpler size management of the metal particles than was previously possible, without the metal particles becoming smaller, flux being left behind, or the like.
B23K 35/14 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme non spécialement conçus pour servir d'électrodes pour le brasage
B23K 35/40 - Fabrication de fils ou de barres pour le brasage ou le soudage
Solder alloys; solder pastes; soldering wires of metal;
solders in the form of washer, ring, pellet, powder, ribbon,
ball, wire or bar; solder preforms made of metal; flux-cored
solders.
The purpose of the present invention is to provide a lead-free solder alloy and a solder bonded body that, despite no addition of "Ni", have solderability and bonding characteristics as with a "Ni"-added lead-free solder alloy. This lead-free solder alloy is characterized in that Sn-Cu is used as a basic composition and that the basic composition contains one or more selected from the group consisting of Co, Mn, Pd, Rh, and Fe. By using the lead-free solder alloy, it is possible to achieve: a lead-free solder alloy that, as compared with a "Ni"-containing lead-free solder, is free from Ni sensitization, and exhibits excellent solderability and workability during soldering and excellent mechanical characteristics and bonding reliability; and a solder bonded body using the lead-free solder alloy.
According to the present invention, a solder bonded body that has more excellent heat resistance, thermal conductivity and reliability than ever before is able to be formed by a solder paste which contains a lead-free solder alloy powder that is mainly composed of Sn and metal particles that have a higher melting point than the lead-free solder alloy, wherein the metal particles are formed of a Cu-Ni alloy having an Ni content of from 0.1% by mass to 90% by mass or a Cu-Co alloy having a Co content of from 0.1% by mass to 90% by mass.
C22C 9/06 - Alliages à base de cuivre avec le nickel ou le cobalt comme second constituant majeur
C22C 19/03 - Alliages à base de nickel ou de cobalt, seuls ou ensemble à base de nickel
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
22.
SOLDER-METAL MESH COMPOSITE MATERIAL AND METHOD FOR PRODUCING SAME
Provided is a solder-metal mesh composite material characterized in that a metal mesh that exhibits high thermal conductivity is contained within a lead-free solder layer formed from a Sn-Cu-Ni-based lead-free solder, the proportion of pores in a cross section in the thickness direction is 15% or less, and the Sn-Cu-Ni-based lead-free solder either contains 0.1-2 wt% of Cu and 0.002-1 wt% of Ni, with the remainder being Sn, or contains 0.1-2 wt% of Cu, 0.002-1 wt% of Ni and 0.001-1 wt% of Ge, with the remainder being Sn. This solder-metal mesh composite material is a member that exhibits heat resistance, excellent thermal conductivity and high bonding reliability. In cases where the solder-metal mesh composite material is used as a solder bonding material at a bonding section of an electronic device or a heat-dissipating material, because the number of pores in a soldered body is low, it is possible to efficiently transfer heat generated by an electronic component and form a bonding section having superior thermal conductivity and high bonding reliability.
B23K 35/14 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme non spécialement conçus pour servir d'électrodes pour le brasage
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
B23K 35/40 - Fabrication de fils ou de barres pour le brasage ou le soudage
Soft solder alloys; solder pastes; soldering wires of metal; soft solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; soft solder preforms made of metal; flux-cored soft solders
24.
PREFORM SOLDER AND SOLDER-BOUND BODY FORMED USING SAID PREFORM SOLDER
655 is formed on the surface of the metal particles. This preform solder can be used to form a solder-bound part having excellent heat resistance, thermal conductivity, and reliability superior to those of conventional products.
B23K 35/14 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme non spécialement conçus pour servir d'électrodes pour le brasage
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 1/02 - Traitement particulier des poudres métalliques, p.ex. en vue de faciliter leur mise en œuvre, d'améliorer leurs propriétés; Poudres métalliques en soi, p.ex. mélanges de particules de compositions différentes comportant un enrobage des particules
C22C 9/06 - Alliages à base de cuivre avec le nickel ou le cobalt comme second constituant majeur
C22C 19/03 - Alliages à base de nickel ou de cobalt, seuls ou ensemble à base de nickel
A lead-free solder alloy contains: 32 mass% or more and 40 mass% or less of Bi; 0.1 mass% or more and 1.0 mass% or less of Sb; 0.1 mass% or more and 1.0 mass% or less of Cu; 0.001 mass% or more and 0.1 mass% or less of Ni; and a remainder of Sn with unavoidable impurities, or the lead-free solder alloy further contains specific elements in amounts in predetermined ranges. Accordingly, it is possible to form a solder joint part that maintains a low level of the melting point of the Sn-Bi-based solder alloy, has better physical characteristics than those in conventional art, and has higher reliability than those in conventional art.
The present invention is capable of forming a solder joint part, which has better physical characteristics than before and higher reliability than before while maintaining the melting point of a Sn-Bi-based solder alloy at a low level, by using a lead-free solder alloy containing 32-40 mass% of Bi, 0.1-1.0 mass% of Sb, 0.1-1.0 mass% of Cu, 0.001-0.1 parts by mass of Ni, and the remainder consisting of Sn and inevitable impurities, or a lead-free solder alloy further containing a specific element in a predetermined range.
In the present invention, corrosion of a nozzle used in a spot solder bath, for instance, can be inhibited by a lead-free solder alloy containing 0.3 to 4.0 mass% of Ag, 0.1 to 2.0 mass% of Cu, 0.005 to 0.05 mass% of Fe, 0.01 to 0.5 mass% of Ni, 0.001 to 0.1 mass% of Ga and Sn as the balance.
The present invention relates to a solder joint part production method, wherein at least one metal substrate among a first metal substrate and a second metal substrate is an alloy in which the Ni content is 0 to less than 44% by weight and the Cu content exceeds 56% by weight, and the solder is a soldering alloy comprising Ga and unavoidable impurities or is a soldering alloy having a melting point of 30°C or lower and comprising Ga as the main component, the method comprises the step of coating the solder on the surface of the first metal substrate and then placing the second metal substrate over the coated solder, and the step of heating at a temperature of 90°C or lower, under a rare gas atmosphere or under an ambient air atmosphere, or in a liquid, causing CuGa2 or (Cu,Ni)Ga2 to be generated between the first metal substrate and the second metal substrate and joining first and second metal materials. The present invention allows metal members on a substrate to be joined to one another even at 90°C or lower, and in addition, can provide a production method for a solder joint part having pliability so as not to be ruptured readily even on a deformable substrate such as a flexible substrate, and can provide a solder joint part obtained by the production method.
This lead-free solder alloy exhibits extremely favorable creep characteristics as a result of the added quantity of Cu being 0.1-2.0 mass%, the added quantity of Ni being 0.01-1.0 mass% and the added quantity of Ge being 0.001-2.0 mass%, with the remainder comprising Sn and unavoidable impurities, and enables a synergistic improvement in weld strength by adding, in the aforementioned composition, 0.1-5.0 mass% of Bi and/or Sb in place of Sn. This lead-free solder alloy may contain 0.1-8.0 mass% of Bi and/or 0.1-6.5 mass% of Sb. In addition, the ratio (Ge/Cu) of the content of Ge relative to that of Cu may be 0.005-0.5. In addition, the lead-free solder alloy may contain 0.1-8.0 mass% of Bi and 0.1-6.5 mass% of Sb, and the ratio (Bi/Sb) of the content of Bi relative to that of Sb may be 0.02-50.
Solder alloys; solder pastes; soldering wire of metal;
solders in the form of washer, ring, pellet, powder, ribbon,
ball, wire or bar; solder preforms made of metal; brazing
alloys; flux-cored solder; non-ferrous metals and their
alloys; iron and steel.
Soft solder alloys; solder pastes; soldering wire of metal; soft solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; soft solder preforms made of metal; flux-cored soft solder; non-ferrous metals and their alloys
(1) Solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; flux-cored solder; non-ferrous metals and their alloys
Soft solder alloys; solder pastes; soldering wire of metal; soft solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; soft solder preforms made of metal; flux-cored soft solder; non-ferrous metals and their alloys
solder alloys; solder pastes; soldering wire of metal; solders in the form of washer, ring, pellet, powder, ribbon, ball, wire or bar; solder preforms made of metal; brazing alloys; flux-cored solder; non-ferrous metals and their alloys; iron and steel.
Provided is a tool for retaining a solder wire coil formed by winding a solder wire in a cylindrical shape, said tool being provided with: a first shape-retaining member which has a cylindrical outer core body to be inserted in a central hole of the solder wire coil and a first flange part that covers one end face of the solder wire coil; and a second shape-retaining member which has an inner core body to be inserted in the outer core body and a second flange part that covers the other end face of the solder wire coil, wherein the outer core body has formed therein one of more slits that extend in an axial direction from a leading end thereof, the inner circumferential surface of the outer core body has formed thereon a ridge extending in the circumferential direction, and the outer circumferential surface of the inner core body has formed therein an engagement groove that is brought into engagement with the ridge.
Provided are a solder joint in which βSn grains are oriented in a specific desired direction, the βSn grains having a desired structure, and a bonding method relating to the solder joint. Provided is a solder joint in which at least two copper substrates (2) are bonded to each other using a lead-free solder alloy including Sn. A solder ball (1) relating to the lead-free solder alloy comprises: one or a plurality of nucleation grains (4); and a single grain βSn of which a [001] direction is parallel with a facet plane of the nucleation grains (4), and which is crystal-oriented in a specific direction with respect to the copper substrates (2).
A smartphone 7 is provided with a camera 71 capable of reading tank identification information assigned to a solder tank 3, and reading sample identification information assigned to a container 6, and an identification information acquiring unit 72 which transmits the tank identification information and the sample identification information to a solder management server device 1, wherein the solder management server device 1 includes: a sample information storage unit 17 which associates with one another and stores the tank identification information and the sample identification information transmitted from the smartphone 7; and an analysis result acquiring unit 12 which acquires a component analysis result of a sample accommodated in the container 6 and the sample identification information assigned to the container 6, and causes the same to be associated with one another and stored by the sample information storage unit 17.
The lead-free solder alloy according to the present invention is a Sn-Ag-Cu-based lead-free solder alloy that is used for soldering a member to be joined that contains Al at least in the surface layer thereof, the lead-free solder alloy comprising Ni and an auxiliary agent, the difference in standard electrode potential between the auxiliary agent and Al being 0.7 V or lower. The solder joint of the present invention is such that, by using said lead-free solder alloy, the auxiliary agent is distributed in a joint portion with the member to be joined that contains Al at least in the surface layer thereof, and the difference in standard electrode potential between the member to be joined and the solder alloy is reduced.
This solder joint has used therein an Sn-Cu-Ni-Bi-Ge-based lead-free solder alloy, wherein the lead-free solder alloy is configured from an alloy comprising 0.1-2.0% by weight of a Cu additive, 0.05-0.5% by weight of a Ni additive, 0.1-8% by weight of a Bi additive, and 0.006-0.1% by weight of a Ge additive, the balance being Sn and unavoidable impurities. This solder joint is provided with a joining part to an assembly in which the generation of Cu3Sn is suppressed.
Solder alloys; solder pastes; soldering wire of metal;
solders in the form of washer, ring, pellet, powder, ribbon,
ball, wire or bar; solder preforms made of metal; brazing
alloys; flux-cored solder; non-ferrous metals and their
alloys; iron and steel.
Solder alloys; solder pastes; soldering wire of metal;
solders in the form of washer, ring, pellet, powder, ribbon,
ball, wire or bar; solder preforms made of metal; brazing
alloys; flux-cored solder; non-ferrous metals and their
alloys; iron and steel.
A solder wire coil H shape retainer 10 on which a solder wire is wound in a cylindrical shape has: a first shape retaining member 1 that comprises a cylindrical outer core body 11 inserted into a center hole H11 of the solder wire coil H and a first flange 12 that covers one end face of the solder wire coil H; and a second shape retaining member 2 that comprises an inner core body 21 inserted into the outer core body 11 and a second flange 22 that covers the other end face of the solder wire coil H. A slit is formed on the outer core body 11 of the first shape retaining member 1 so as to extend in the axial direction thereof, and at least a portion of the outer core body 11 is partitioned into a plurality of divided pieces 15 by the slit.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
06 - Métaux communs et minerais; objets en métal
Produits et services
Soldering fluxes; soldering paste; soldering preparations;
soldering chemicals; brazing fluxes; brazing preparations;
brazing chemicals; industrial chemicals; chemicals;
detergents for industrial use; detergents for use in
manufacturing processes. Solder alloys; solder pastes; soldering wire of metal;
solders in the form of washer, ring, pellet, powder, ribbon,
ball, wire or bar; solder preforms made of metal; brazing
alloys; flux-cored solder; non-ferrous metals and their
alloys; iron and steel.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
06 - Métaux communs et minerais; objets en métal
Produits et services
Soldering fluxes; soldering paste; soldering preparations;
soldering chemicals; brazing fluxes; brazing preparations;
brazing chemicals; industrial chemicals; chemicals;
detergents for industrial use; detergents for use in
manufacturing processes. Solder alloys; solder pastes; soldering wire of metal;
solders in the form of washer, ring, pellet, powder, ribbon,
ball, wire or bar; solder preforms made of metal; brazing
alloys; flux-cored solder; non-ferrous metals and their
alloys; iron and steel.
01 - Produits chimiques destinés à l'industrie, aux sciences ainsi qu'à l'agriculture
06 - Métaux communs et minerais; objets en métal
35 - Publicité; Affaires commerciales
Produits et services
Soldering fluxes; soldering paste; soldering preparations;
soldering chemicals; brazing fluxes; brazing preparations;
brazing chemicals; industrial chemicals; chemicals;
detergents for industrial use; detergents for use in
manufacturing processes. Solder alloys; solder pastes; soldering wire of metal;
solders in the form of washer, ring, pellet, powder, ribbon,
ball, wire or bar; solder preforms made of metal; brazing
alloys; flux-cored solder; non-ferrous metals and their
alloys; iron and steel. Demonstration of goods; distribution and dissemination of
advertising materials; on-line advertising on computer
networks; distribution of samples; organization of trade
fairs for commercial or advertising purposes; organization
of exhibitions for commercial or advertising purposes;
commercial administration of the licensing of the goods and
services of others; sales promotion for others; marketing
services; presentation of goods on communication media, for
retail purposes; advertising and publicity services;
business management analysis or business consultancy; market
analysis and research services; providing information
concerning commercial sales; business management of hotels;
promoting the goods and services of others through the
administration of sales and promotional incentive schemes
involving trading stamps; import-export agency services;
compilation of information into computer databases; rental
of publicity and marketing materials; providing business
information, namely providing newspaper article information
in the field of business; commercial information and advice
for consumers; retail services or wholesale services for
printed matter; retail services or wholesale services for
paper and stationery.
A solder wire bobbinless coil includes a solder wire coil formed by winding a solder wire into a hollow columnar, the solder wire coil having a first coil opening at one end of the hollow columnar, and a second coil opening at the other end of the hollow columnar; and a covering film covering an outer surface of the solder wire coil. The covering film has a first film opening smaller than the first coil opening on a portion covering the first coil opening and a second film opening equal to or smaller than the second coil opening on a portion covering the second coil opening, and the first film opening includes, at a peripheral area thereof, a first protruding portion extending so as to protrude to an inner side of the first coil opening.
B23K 3/06 - Dispositifs d'alimentation en métal d'apportCuves de fusion du métal d'apport
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
Provided is a lead-free solder alloy and soldering capable of maintaining strong joining strength even in a high-temperature state after soldering and having high reliability and versatility. The lead-free solder alloy composition of the present invention has Sn—Cu—Ni as a basic composition, which includes 0.1 to 2.0 mass % of Cu, and 0.01 to 0.5 mass % of Ni, 0.1 to 5 mass % of Bi, and 76.0 to 99.5 mass % of Sn, such that it is possible to implement soldering with high reliability without decreasing joining strength of a soldered joint even in a state of being exposed to high temperature for a long time, as well as joining strength at the time of bonding.
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
Solder alloys; solder pastes; soldering wire of metal;
solders in the form of washer, ring, pellet, powder, ribbon,
ball, wire or bar; solder preforms made of metal; brazing
alloys; flux-cored solder; non-ferrous metals and their
alloys; iron and steel.
f) of the reaction tubes (30, 40) for forming, in the spiral flows (e, j), nanoparticles (26) from the ingredient material (12) and discharging a generation liquid (65) containing the nanoparticles (26).
B22F 9/24 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet par un procédé chimique avec réduction de mélanges métalliques à partir de mélanges métalliques liquides, p. ex. de solutions
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B22F 9/02 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet par des procédés physiques
B82Y 30/00 - Nanotechnologie pour matériaux ou science des surfaces, p. ex. nanocomposites
B82Y 40/00 - Fabrication ou traitement des nanostructures
A silver electrode joint having a high joint strength obtained by actively minimizing the particle size of a silver-zinc intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, the joint including silver at least as the surface layer thereof, using a solder alloy which comprises 2-9 wt % of zinc, 0.0001-0.1 wt % of manganese and the balance consisting of tin, the solder joint having a joint interface wherein the particle size of a silver-zinc intermetallic compound, which is formed by silver being the surface layer of the article to be joined and zinc in the solder alloy, is 5 μm or less.
The purpose of the present invention is to provide a lead-free solder alloy and solder in which it is possible to maintain high junction strength that does not decrease even in a high temperature state after soldering, the lead-free solder alloy and solder having a high degree of reliability and versatility. In the present invention, the basis composition is Sn-Cu-Ni, the lead-free alloy composition containing 0.1-2.0 mass% of Cu, 0.01-0.5 mass% of Ni, 0.1-5 mass% of Bi, and 76.0-99.5 mass% of Sn. As a result of such a lead-free alloy composition, the junction strength of the solder does not decrease during soldering even when the solder is exposed to high temperatures over a long period of time, as shall be apparent, thereby enabling highly reliable soldering.
The purpose of the present invention is to provide a lead-free solder alloy and solder in which it is possible to maintain high junction strength that does not decrease even in a high temperature state after soldering, the lead-free solder alloy and solder having a high degree of reliability and versatility. In the present invention, the basis composition is Sn-Cu-Ni, the lead-free alloy composition containing 0.1-2.0 mass% of Cu, 0.01-0.5 mass% of Ni, 0.1-5 mass% of Bi, and 76.0-99.5 mass% of Sn. As a result of such a lead-free alloy composition, the junction strength of the solder does not decrease during soldering even when the solder is exposed to high temperatures over a long period of time, as shall be apparent, thereby enabling highly reliable soldering.
Provided is a glass for an automotive vehicle capable of preventing cracking in glass substrate for an automotive vehicle over time when one surface of a metal terminal is soldered to a silver electrode formed on the glass substrate using a solder alloy and flux. Also provided is a soldering method. The metal terminal is copper or brass, and the soldering is performed by keeping the ratio of the area of flux applied to the silver electrode before soldering to the area of the one surface of the metal terminal at 3:1-20:1.
The purpose of the present invention is to inhibit the formation of Cu3SnIMC in a lead-free, low-melting, Sn-Cu based brazing filler metal and thereby provide a low-melting brazing filler metal which can attain improved joint reliability. This brazing filler metal is an Sn-Cu alloy which further contains 0.1 to 2.0mass% of Ni. Specifically, the brazing filler metal has an Sn-Cu-Ni alloy composition that contains 0.1 to 2.0mass% of Ni and 7.6 to 41.4mass%, which corresponds to a hyper-eutectic range, of Cu with the balance being Sn and unavoidable impurities. Thus, the present invention makes it possible to inhibit the formation of Cu3SnIMC in a joint. Further, the melting point of the brazing filler metal is adjustable within a range of 415 to 640ºC, so that the brazing filler metal can be easily processed into various shapes.
An oxygen source-containing composite nanometal paste including at least composite nanometal particles, in which an organic coating layer is formed around a submicron or smaller silver core, and an oxygen source, which feeds oxygen contributing to pyrolysis at a pyrolysis temperature range in which the organic coating layer is pyrolyzed. The oxygen source comprises an oxygen-containing metal compound, and the oxygen content of the oxygen source is within a range of 0.01 mass % to 2 mass % per 100 mass % of the composite nanometal particles.
B22F 1/00 - Poudres métalliquesTraitement des poudres métalliques, p. ex. en vue de faciliter leur mise en œuvre ou d'améliorer leurs propriétés
B23K 35/30 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 1550 C
B23K 35/34 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau comprenant des corps qui facilitent le travail des métaux lorsqu'ils sont chauffés
H01L 23/00 - Détails de dispositifs à semi-conducteurs ou d'autres dispositifs à l'état solide
B23K 35/36 - Emploi de compositions non métalliques spécifiées, p. ex. comme enrobages, comme fluxEmploi de matériaux de brasage ou de soudage spécifiés associé à l'emploi de compositions non métalliques spécifiées, dans lequel l'emploi des deux matériaux est important
B23K 35/02 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme
B82Y 30/00 - Nanotechnologie pour matériaux ou science des surfaces, p. ex. nanocomposites
A nanoparticle production method, production device and automatic production device that allow continuous mass production of nanoparticles with a uniform particle diameter and allow freely adjusting the generation time are provided. This nanoparticle production device is characterized by being configured from: reaction tubes (30, 40) which are filled with the same solvent (11) as that in a raw material solution (18), which is used in nanoparticle production and comprises a raw material substance (12) mixed into the solvent (11); a temperature controller (22) which controls the temperature of the solvent (11) in the reaction tubes (30, 40) to the synthesis temperature of the nanoparticles (26); inflow ends (30e, 40e) of the reaction tubes into which the raw material solution (18) is supplied; rotors (35, 45) which form spiral flows (e, j) along the inner surface of the outer walls (30h, 40h) of the reaction tubes while mixing the raw material solution (18) supplied and the solvent (11) present in the reaction tubes (30, 40); and outflow ends (30f, 40f) of the reaction tubes (30, 40) for forming, in the spiral flows (e, j), nanoparticles (26) from the raw material substance (12) and discharging a generated solution (65) containing the nanoparticles (26).
B22F 9/24 - Fabrication des poudres métalliques ou de leurs suspensionsAppareils ou dispositifs spécialement adaptés à cet effet par un procédé chimique avec réduction de mélanges métalliques à partir de mélanges métalliques liquides, p. ex. de solutions
An Ag electrode joint having a high joint strength can be obtained by actively minimizing the particle size of an Ag-Zn intermetallic compound at the solidification point. A joint obtained by joining an article to be joined, which comprises Ag at least as the surface layer thereof, using a solder alloy which comprises 2-9 wt% of Zn, 0.0001-0.1 wt% of Mn and the balance consisting of Sn, said solder joint having a joint interface wherein the particle size of an Ag-Zn intermetallic compound, that is formed by Ag being the surface layer of the article to be joined and Zn in the solder alloy, is 5 μm or less.
The present invention provides a brazing material which has a low melting point and is easy to use. A low melting point brazing material of the present invention is formed from 0.3-41.4% by weight of Cu, 0.04-2% by weight of Ni and the balance made up of Sn. The Cu content is preferably 7.6-41.4% by weight. In addition, 0.006-0.1% by weight of Al or 0.001-1% by weight of Ge may be added into this low melting point brazing material.
The present invention provides a lead-free solder alloy having high reliability and excellent solder bonding properties and suited for the mounting of micronized electronic components at low cost. The lead-free solder alloy according to the present invention has a composition containing 0.5 to 1.5 wt % of Ag, 0.3 to 1.5 wt % of Cu, 0.01 to 0.2 wt % of Ni, 1.0 wt % or less of Ga, and the balance being Sn and unavoidable impurities.
The purpose of the present invention is to pyrolyze and thereby remove to a higher efficiency the organic coating layer of composite nanometal particles during joining by sintering, sintering in an inert gas atmosphere, and the like, and improve the joining strength and electrical conductivity of the composite nanometal paste. The present invention provides an oxygen source-containing composite nanometal paste comprising at least composite nanometal particles, wherein an organic coating layer is formed around a submicron or smaller silver nucleus, and an oxygen source for feeding the oxygen that participates in the pyrolysis at the pyrolysis temperature zone where the organic coating layer is pyrolyzed. The oxygen content of the oxygen source is within a range of 0.01 to 2 mass% per 100 mass% of composite nanometal particles. The present invention also provides a joining method that uses the paste.
H01B 1/22 - Matériau conducteur dispersé dans un matériau organique non conducteur le matériau conducteur comportant des métaux ou des alliages
B22F 1/02 - Traitement particulier des poudres métalliques, p.ex. en vue de faciliter leur mise en œuvre, d'améliorer leurs propriétés; Poudres métalliques en soi, p.ex. mélanges de particules de compositions différentes comportant un enrobage des particules
H01B 1/00 - Conducteurs ou corps conducteurs caractérisés par les matériaux conducteurs utilisésEmploi de matériaux spécifiés comme conducteurs
H01L 21/52 - Montage des corps semi-conducteurs dans les conteneurs
H05K 1/09 - Emploi de matériaux pour réaliser le parcours métallique
63.
PROCESS FOR PRODUCING SOLDER JOINT WITH IMPROVED RELIABILITY
A highly reliable joint which is inhibited, during operation, from suffering a volume change accompanying phase transformation or suffering troubles such as strains or cracks caused by a volume change is rendered possible with an Sn-Cu solder alloy by regulating the cooling temperature of the solder alloy in a process ranging from a molten state to solidification and thereby intensively causing the intermetallic compound Cu6Sn5 which generates in the solidified joint to transform into stable-state orthorhombic crystals. When an Sn-Cu alloy which is held molten at a temperature of 186ºC or higher is cooled, the temperature of the alloy is controlled so as to result in a cooling temperature curve that passes through the region of 100% stable orthorhombic crystals defined by the time-temperature-transformation curves (TTT curves) shown in Fig. 6b.
B23K 31/02 - Procédés relevant de la présente sous-classe, spécialement adaptés à des objets ou des buts particuliers, mais non couverts par un seul des groupes principaux relatifs au brasage ou au soudage
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
The present invention addresses the problem of providing, at low cost, a lead-free solder alloy which has high reliability and excellent joining characteristics and which is suitable for mounting a microscopic electronic component. This lead-free solder alloy has a composition comprising 0.5 to 1.5 wt.% of Ag, 0.3 to 1.5 wt.% of Cu, 0.01 to 0.2 wt.% of Ni and 1.0 wt.% or less of Ga, with the remainder comprising Sn and unavoidable impurities.
This solder alloy contains Al and/or Al2O3 in the amount of 0.006-0.15 wt% in an Sn-Cu hypereutectic area. In addition, this solder alloy comprises Cu in the amount of 0.7-7.6 wt%, and Al and/or Al2O3 in the amount of 0.006-0.5 wt%, with the remainder being Sn. Preferably, the amount of Cu contained is 2.0 wt% or greater. This solder alloy also has Ni substituted for Sn in the amount of 0.03-0.1 wt% of the composition thereof. Furthermore, this solder alloy has Ag substituted for Sn in the amount of 0.1-3.5 wt% of the composition thereof.
Provided is a wire solder with high tensile strength and pull cut resistance. An apparatus for feeding the wire solder is also provided. The wire solder has an extended wire solder and a core wire having a higher tensile strength than the wire solder. The core wire is made of thermosetting resin or Joulean heat generating material. The wire solder has a single or multiple strands bound together. The wire solder is supplied from upstream of a location of soldering while the core wire is rewound under tension at a location downstream of the location of soldering. The apparatus for feeding the wire solder comprises a wire solder storage section where the wire solder with a core wire is stored and a core wire rewinding member that takes up an end of the core wire to rewind the core wire. While the core rewinding member is rotated to rewind the core wire, the single or multiple strands of solder are heated to perform soldering at the location of soldering upstream of the core wire rewinding member.
B23K 35/14 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par des propriétés mécaniques, p. ex. par la forme non spécialement conçus pour servir d'électrodes pour le brasage
B23K 3/06 - Dispositifs d'alimentation en métal d'apportCuves de fusion du métal d'apport
B23K 35/40 - Fabrication de fils ou de barres pour le brasage ou le soudage
National Institute of Advanced Industrial Science and Technology (Japon)
Inventeur(s)
Nishimura Tetsuro
Kawahara Mitsuhiro
Asakawa Masumi
Shimizu Toshimi
Abrégé
A flux for soldering and a soldering paste containing the flux are provided, the paste suffering no viscosity change with time and neither filming nor becoming non-flowable. The soldering paste has satisfactory applicability, printability, and soldering properties. The flux for soldering comprises the following components: a resin, a thixotropic agent, an activator, a solvent, and nanotubes of a glucopyranosylamine type. A soldering powder for use in the soldering paste preferably contains neither lead nor any lead alloy and comprises Sn-Cu-Ni or Sn-Ag-Cu as a major component.
B23K 35/363 - Emploi de compositions spécifiées de flux pour le brasage ou le soudage
B23K 35/22 - Baguettes, électrodes, matériaux ou environnements utilisés pour le brasage, le soudage ou le découpage caractérisés par la composition ou la nature du matériau
B23K 35/26 - Emploi de matériaux spécifiés pour le soudage ou le brasage dont le principal constituant fond à moins de 400°C
Generation of voids is suppressed by means of a conventional apparatus without using attached apparatuses, such as a pressure reducing apparatus, in solder bonding wherein a BGA ball solder and a cream solder are used. The ball solder and the cream solder have a relationship where the liquidus temperature of the ball solder alloy is lower than the solidus temperature of the solder alloy in the cream solder. The ball solder and the cream solder are bonded by a reflow method. The liquidus temperature of the ball solder alloy and the solidus temperature of the solder alloy in the cream solder is 1°C or higher. The ball solder and the solder alloy used for the cream solder have a eutectic composition.
Non ferrous metals and their alloys, namely, [ metal alloys for further manufacturing, ] soft solder alloys, and hard solder alloys, [ tin and its alloys ]
