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2024
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Invention
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Inductive angular position sensor.
A receiver coil of an inductive angular position sensor can h... |
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Invention
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Bonding module pins to an electronic substrate.
A method for attaching a terminal pin to a circu... |
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Invention
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Dual-side cooling semiconductor packages and related methods.
A dual-side cooling (DSC) semicond... |
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Invention
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Semiconductor wafer and method of ball drop on thin wafer with edge support ring.
A semiconducto... |
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Invention
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Semiconductor wafer and method of wafer thinning.
A semiconductor wafer has a base material. The... |
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Invention
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Jet ablation die singulation systems and related methods.
Implementations of a method singulatin... |
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Invention
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Method and system for a fin-based voltage clamp.
A method of clamping a voltage includes providi... |
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Invention
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Power module package baseplate with step recess design.
Implementations described herein are rel... |
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Invention
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Power system having multi-trigger all-phase activation.
A multi-phase power system configured to... |
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Invention
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Secure serial bus with automotive applications.
Secure serial bus communication methods and devi... |
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Invention
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Monitoring temperature per phase in a multiphase power stage.
A multiphase power stage that incl... |
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Invention
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Methods for mitigating lag in image sensor devices.
Implementations of a method of mitigating la... |
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Invention
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Coupled guard rings for edge termination.
A semiconductor device includes an active device regio... |
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Invention
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Method for defining a gap height within an image sensor package.
According to an aspect, an imag... |
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Invention
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Supports for thinned semiconductor substrates and related methods.
Implementations of a semicond... |
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Invention
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Multidie supports and related methods.
Implementations of a semiconductor device may include a f... |
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Invention
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Offset cancel systems and methods for resolver-type sensors.
Implementations of a resolver senso... |
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Invention
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Lidar system with dynamic resolution.
An imaging system may include a silicon photomultiplier wi... |
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Invention
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Molded packaging for wide band gap semiconductor devices.
A semiconductor device package may inc... |
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Invention
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Acoustic sensing of proximate obstacles.
An illustrative controller includes: a transmitter to d... |
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Invention
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Anti-flare semiconductor packages and related methods.
Implementations of semiconductor packages... |
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Invention
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Scintillator crystal and photomultiplier assemblies with improved emission detection.
In a gener... |
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Invention
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Flip chip and pre-molded clip power modules. Devices and methods are disclosed for high power inv... |
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Invention
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Semiconductor package model generation systems and related methods. Implementations of an object ... |
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Invention
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Electroplating systems and methods. In a general aspect, an electroplating system (100) includes ... |
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Invention
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Semiconductor packages with wettable flanks and related methods. Implementations of a leadframe f... |
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Invention
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Semiconductor package model generation systems and related methods.
Implementations of an object... |
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Invention
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Copper pad metallization systems and related methods. Implementations of a method of forming an i... |
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Invention
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Semiconductor packages with wettable flanks and related methods.
Implementations of a leadframe ... |
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Invention
|
Trimming circuit for bandgap references.
An electrical circuit includes positive and negative vo... |
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Invention
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Compact direct-bonded metal substrate package. A compact power inverter (100, 400, 450) is effici... |
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Invention
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Rotor for inductive position sensor.
An inductive position sensor subsystem is disclosed. The in... |
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2023
|
Invention
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Planar jfet device with reduced gate resistance. A junction field effect transistor (JFET) (100) ... |
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Invention
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Termination structures for mosfets.
Shielded gate semiconductor devices are disclosed for use in... |
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Invention
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Substrate parasite reduction technique.
A protection circuit is disclosed for use in automotive ... |
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Invention
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Adaptive pulse control for high-voltage level shifters.
Signal converters, systems for power con... |
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Invention
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Image sensor packages and related methods.
Implementations of an image sensor package may includ... |
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Invention
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Analog-to-digital converter for signal sampling.
A system may include an analog-to-digital conve... |
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Invention
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Diagnosing power rail over-voltage and under-voltage conditions.
Power monitors, power supply ci... |
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Invention
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Copper pad metallization systems and related methods.
Implementations of a method of forming an ... |
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Invention
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Integration of semiconductor device assemblies with thermal dissipation mechanisms.
In a general... |
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Invention
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Planar jfet device with reduced gate resistance.
A junction field effect transistor (JFET) inclu... |
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Invention
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Copper features and related methods of forming.
Implementations of a method of forming a copper ... |
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Invention
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Temporary substrate carriers.
Implementations of a substrate carrier may include a frame includi... |
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Invention
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Compact direct-bonded metal substrate package.
A compact power inverter is efficiently laid out ... |
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Invention
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Pads for image sensors and related methods.
Implementations of a pad for an image sensor may inc... |
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Invention
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Die-substrate interface including locking features.
A die-attach process that creates a bond str... |
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Invention
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Igniter circuit having an adjustable over dwell time.
An ignition system may include an igniter ... |
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Invention
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Hybrid analog-to-digital converter.
A system may include a hybrid analog-to-digital converter (A... |
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2021
|
P/S
|
Semiconductors; integrated circuits; microchips; microprocessors; sensors, namely, image sensors,... |
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P/S
|
Semiconductors, integrated circuits, microchips,
microprocessors, sensors, semiconductor packagi... |
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2015
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P/S
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Semiconductors and integrated circuits. |
|
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P/S
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Semiconductor devices and integrated circuits. |
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P/S
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Semiconductor devices and integrated circuits |
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2014
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P/S
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Semiconductor devices. Foundry services, namely, custom manufacture and assembly of semiconductor... |
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P/S
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Semiconductor devices |
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2008
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P/S
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Reference designs in the field of technical design of low-power products, namely computer boards,... |
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P/S
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Printed reference designs related to the technical design of
low-power products, namely, compute... |
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P/S
|
Printed reference designs related to the technical design of
low-power products, namely computer... |
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P/S
|
Cameras; photographic and optical sensors for cameras,
digital cameras, cellular phones and vide... |
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P/S
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Printed reference designs related to the technical design of low-power products, namely, computer... |
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P/S
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Image and optical sensors for use in cameras, digital cameras, cell telephones, mobile telephones... |
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2006
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P/S
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Integrated circuits. |
|
|
P/S
|
Integrated circuits |
|
|
P/S
|
Design of low-power products, namely computers,
semiconductors, microprocessors, power supplies,... |
|
|
P/S
|
Design of low-power products, namely, computers, semiconductors, microprocessors, power supplies,... |
|
|
P/S
|
semiconductor devices |
|
2001
|
P/S
|
Semiconductors |
|
2000
|
P/S
|
Semiconductors and parts therefor. Assembly of semiconductors for others; manufacture of semicond... |
|
|
P/S
|
Semiconductors and parts therefor Assembly of semiconductors for others; manufacture of semicondu... |
|
|
P/S
|
Semiconductors and parts therefor [ Assembly of semiconductors for others; manufacture of semicon... |
|
|
P/S
|
SEMICONDUCTORS, INTEGRATED CIRCUITS, TRANSISTORS FOR AUTOMOBILE STARTERS AND ALTERNATORS, IGBTS, ... |
|
|
P/S
|
transistors, namely metal-oxide silicon field effect transistors |
|
1999
|
P/S
|
Assembly of semiconductors for others; manufacture of semiconductors to the specifications of oth... |
|
|
P/S
|
[ Semiconductors and parts therefor ] Assembly of semiconductors for others, and manufacture of s... |
|
|
P/S
|
Assembly of semiconductors for others; and manufacture of semiconductors to the specifications of... |
|
|
P/S
|
Semiconductors and parts therefor |
|
|
P/S
|
Semiconductors and parts therefore. Assembly of semiconductors for others, and manufacture of sem... |
|
|
P/S
|
Semiconductors and parts therefor, in Class 9. Storage and inventory of semiconductors and parts ... |
|
|
P/S
|
Semiconductors and parts therefore |
|
|
P/S
|
Assembly of semiconductors for others, and manufacture of semiconductors to the specifications of... |
|
|
P/S
|
Semiconductors and parts therefor, in class 9. Storage of inventory of semiconductors and parts t... |
