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2026
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Invention
|
Trench-implemented poly diodes and resistors.
In a general aspect, a semiconductor device can in... |
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Invention
|
Single switch direct cooling assemblies and related method.
Implementations of a dual sided cool... |
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Invention
|
Power module package with molded via and dual side press-fit pin.
A module includes an assembly ... |
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Invention
|
Power module package with stacked direct bonded metal substrates.
A package includes a first dir... |
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Invention
|
System and method for communicating driver readiness to a controller.
A switching regulator is d... |
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Invention
|
Semiconductor structures and methods of manufacturing semiconductor structures.
A semiconductor ... |
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|
Invention
|
Vertical fin-based field effect transistor (finfet) with varying conductivity regions.
A semicon... |
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Invention
|
Sensor array module for an advanced driver assistance system.
A smart ultrasonic integrated-circ... |
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|
Invention
|
Switching oscillation reduction for power semiconductor device modules.
In a general aspect, a h... |
|
|
Invention
|
Power transistors with resonant clamping circuits.
In a general aspect, a circuit includes a met... |
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|
Invention
|
Power converter, controller, and method with overcurrent protection.
An illustrative controller ... |
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|
Invention
|
System with zero overvoltage switching.
A switch system includes (i) high-side and low-side tran... |
|
2025
|
P/S
|
Semiconductors; integrated circuits; microchips; microprocessors; sensors, namely, electronic sen... |
|
|
Invention
|
Kelvin scheme package.
Implementations of semiconductor packages may include a plurality of semi... |
|
|
Invention
|
Power module.
A method includes attaching a power electronic substrate to a bottom of a frame. T... |
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|
Invention
|
Heat exchangers for semiconductor device assemblies.
A power electronics assembly may include a ... |
|
|
Invention
|
Mosfet with monolithically integrated current sense.
A MOSFET device is disclosed. The MOSFET de... |
|
|
Invention
|
Direct drive cascoded switching circuit.
A cascoded switch system includes a JFET, a MOSFET, and... |
|
|
Invention
|
Transistor gate runner topology.
A transistor is disclosed. The transistor includes a terminatio... |
|
|
Invention
|
Irregular direct bonded metal (dbm) and connection substrate. Described implementations provide a... |
|
|
Invention
|
Leveling control for semiconductor device package attachment. In a general aspect, a semiconducto... |
|
|
Invention
|
Embedded semiconductor device packages and methods of manufacture. A method (300) includes formin... |
|
|
Invention
|
Embedded semiconductor device packages and methods of manufacture. A semiconductor device package... |
|
|
Invention
|
Semiconductor device module with stacked interconnections and methods of manufacture. In a genera... |
|
|
Invention
|
Combined via and solder bump for three-dimensional integration of an infrared detector.
An infra... |
|
|
Invention
|
Outer bending leadframe technology.
Described implementations provide an apparatus that includes... |
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|
Invention
|
Hybrid bond die seal and crack stop structures.
A semiconductor device is disclosed. The semicon... |
|
|
Invention
|
Transistor with active area under gate runner.
A transistor is disclosed. The transistor include... |
|
|
Invention
|
Semiconductor die-stack having sealed edges.
Three-dimensional integration of devices, such as i... |
|
|
Invention
|
Heat sink with integrated vapor chamber for semiconductor device assemblies.
Heat sinks for powe... |
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|
Invention
|
Reflow jig designs and related methods.
Implementations of a jig may include at least one pocket... |
|
|
Invention
|
Structures and methods for self-aligned gate-drain overlap trench mosfets.
A self-aligned gate-d... |
|
|
Invention
|
Semiconductor device metallization structure for reliability and robustness.
A semiconductor dev... |
|
|
Invention
|
Low power phase detection.
Methods, devices, and systems employing low power digital signal phas... |
|
|
Invention
|
Image sensor with in-package noise-decoupling.
An image sensor includes a noise-decoupling devic... |
|
|
Invention
|
Pin for transfer molded semiconductor device package.
An apparatus includes a base, a tip, and a... |
|
|
Invention
|
Input offset compensation for a comparator circuit. A comparator circuit is disclosed. The compar... |
|
|
Invention
|
Average current regulation for dc-dc power converters.
A DC-DC converter circuit is disclosed. T... |
|
|
Invention
|
Irregular direct bonded metal (dbm) and connection substrate.
Described implementations provide ... |
|
|
Invention
|
Bootstrapped switch circuit with high linearity.
A bootstrapped switch circuit is disclosed. The... |
|
|
Invention
|
Image sensor packages and related methods.
An image sensor package may include an image sensor s... |
|
|
Invention
|
Direct drive cascoded switching circuit. A cascoded switch system is disclosed. The cascoded swit... |
|
|
Invention
|
Light detection and ranging devices with reconfigurable microcells.
A light detection and rangin... |
|
|
Invention
|
Automated mutli-modal sensing synchronization.
Systems, devices, and methods are described to sy... |
|
2024
|
Invention
|
Panel level packaging for modular embedded devices.
A semiconductor device package includes a fi... |
|
|
Invention
|
Embedded semiconductor device packages and methods of manufacture.
In a general aspect, a method... |
|
|
Invention
|
Embedded semiconductor device packages and methods of manufacture.
In a general aspect, a semico... |
|
|
Invention
|
Chip scale packaging with double-sided plating for embedded devices.
A semiconductor device pack... |
|
|
Invention
|
Trench isolation for spad-based semiconductor device.
A semiconductor device is disclosed. The s... |
|
|
Invention
|
Image sensor with in-pixel histogramming.
Imaging circuitry is provided that includes an array o... |
|
|
Invention
|
Leveling control for semiconductor device package attachment.
In a general aspect, a semiconduct... |
|
2021
|
P/S
|
Semiconductors; integrated circuits; microchips; microprocessors; sensors, namely, image sensors,... |
|
|
P/S
|
Semiconductors, integrated circuits, microchips,
microprocessors, sensors, semiconductor packagi... |
|
2015
|
P/S
|
Semiconductors and integrated circuits. |
|
|
P/S
|
Semiconductor devices and integrated circuits. |
|
|
P/S
|
Semiconductor devices and integrated circuits |
|
2014
|
P/S
|
Semiconductor devices. Foundry services, namely, custom manufacture and assembly of semiconductor... |
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|
P/S
|
Semiconductor devices |
|
2008
|
P/S
|
Reference designs in the field of technical design of low-power products, namely computer boards,... |
|
|
P/S
|
Printed reference designs related to the technical design of
low-power products, namely, compute... |
|
|
P/S
|
Printed reference designs related to the technical design of
low-power products, namely computer... |
|
|
P/S
|
Cameras; photographic and optical sensors for cameras,
digital cameras, cellular phones and vide... |
|
|
P/S
|
Printed reference designs related to the technical design of low-power products, namely, computer... |
|
|
P/S
|
Image and optical sensors for use in cameras, digital cameras, cell telephones, mobile telephones... |
|
2006
|
P/S
|
Integrated circuits. |
|
|
P/S
|
Integrated circuits |
|
|
P/S
|
Design of low-power products, namely computers,
semiconductors, microprocessors, power supplies,... |
|
|
P/S
|
Design of low-power products, namely, computers, semiconductors, microprocessors, power supplies,... |
|
|
P/S
|
semiconductor devices |
|
2001
|
P/S
|
Semiconductors |
|
2000
|
P/S
|
Semiconductors and parts therefor. Assembly of semiconductors for others; manufacture of semicond... |
|
|
P/S
|
Semiconductors and parts therefor Assembly of semiconductors for others; manufacture of semicondu... |
|
|
P/S
|
Semiconductors and parts therefor [ Assembly of semiconductors for others; manufacture of semicon... |
|
|
P/S
|
SEMICONDUCTORS, INTEGRATED CIRCUITS, TRANSISTORS FOR AUTOMOBILE STARTERS AND ALTERNATORS, IGBTS, ... |
|
|
P/S
|
transistors, namely metal-oxide silicon field effect transistors |
|
1999
|
P/S
|
Assembly of semiconductors for others; manufacture of semiconductors to the specifications of oth... |
|
|
P/S
|
[ Semiconductors and parts therefor ] Assembly of semiconductors for others, and manufacture of s... |
|
|
P/S
|
Assembly of semiconductors for others; and manufacture of semiconductors to the specifications of... |
|
|
P/S
|
Semiconductors and parts therefor |
|
|
P/S
|
Semiconductors and parts therefore. Assembly of semiconductors for others, and manufacture of sem... |
|
|
P/S
|
Semiconductors and parts therefor, in Class 9. Storage and inventory of semiconductors and parts ... |
|
|
P/S
|
Semiconductors and parts therefore |
|
|
P/S
|
Assembly of semiconductors for others, and manufacture of semiconductors to the specifications of... |
