AURAS Technology Co., Ltd.

Taiwan, Province of China


 
Total IP 67
Total IP Rank # 20,324
IP Activity Score 2.7/5.0    74
IP Activity Rank # 9,600
Stock Symbol 3324 (tpex)
ISIN TW0003324000
Market Cap. 62.5B  (TWD)
Industry Computer Distribution
Sector Technology
Dominant Nice Class Scientific and electric apparatu...

Patents

Trademarks

65 1
0 0
0 0
1
 
Last Patent 2025 - Gravity heat dissipation device
First Patent 2015 - Mini wide-angle lens module
Last Trademark 2002 - Auras
First Trademark 2001 - AURAS

Industry (Nice Classification)

Latest Inventions, Goods, Services

2024 Invention Gravity heat dissipation device. A gravity heat dissipation device includes a fixed frame, a hea...
Invention Fluid heat dissipation device. A fluid heat dissipation device includes a first cold plate, a fi...
Invention Loop heat pipe one-way circulation device. A loop heat pipe one-way circulation device includes ...
Invention Heat dissipation device. A heat dissipation device includes an inclined heat pipe and a pluralit...
2023 Invention Interface card quick release device. An interface card quick release device includes a housing, ...
Invention Anti-wear screw. An anti-wear screw includes a U-shaped anti-wear clip and a locking screw. The ...
Invention Heat dissipation device. A heat dissipation device is provided and includes: a first vapor chamb...
Invention Heat dissipation device. A heat dissipation device includes a main fixed base plate, a main heat...
Invention Heat dissipation device. A heat dissipation device includes a vapor chamber for contacting a heat...
2022 Invention Liquid cooling device. A liquid cooling device includes a water cooling radiator, a first pump a...
Invention Flexible vapor chamber. A flexible vapor chamber includes a first flexible casing, a second flex...
Invention Cold plate. A cold plate is provided and includes: a casing formed with an accommodating groove; ...
Invention Vapor chamber and heat dissipation device with same. A vapor chamber and a heat dissipation devic...
Invention Heat dissipation module. A heat dissipation module includes a main vapor chamber, at least one au...
Invention Heat dissipation device. A heat dissipation device is provided and includes: a casing; a base uni...
Invention Liquid cooling head with a heat dissipating liquid flowing from a cooling plate to an impeller. A...
Invention Two-phase cold plate. A two-phase cold plate includes a base, an upper cover, a heat exchange cav...
Invention Heat dissipation device. A heat dissipation device is provided and includes: a first vapor chambe...
Invention Coolant distribution unit. A coolant distribution unit includes a casing, a control module, a pow...
2021 Invention Electronic package and heat dissipation structure thereof, comprising bonding pillars. An electro...
Invention Bolster. A bolster is provided and includes a bottom plate including a side plate extending upwar...
Invention Liquid cooling device. A liquid cooling device includes a heat dissipation shell and a dual fin m...
Invention Fluid cooling device. A fluid cooling device includes a bottom plate, an adhesive layer and a spr...
Invention Liquid cooling head and manufacturing method thereof. A liquid cooling head manufacturing method ...
Invention Liquid cooling head and liquid cooling device with the same. A liquid cooling head includes a bot...
Invention Thin vapor chamber. A thin vapor chamber is provided. The thin vapor chamber includes an upper p...
Invention Heat dissipation device. A heat dissipation device is provided and includes: a temperature equali...
Invention Heat dissipation device. A heat dissipation device is provided and includes a vapor chamber unit,...
Invention Three-dimensional heat dissipating device. A three-dimensional heat dissipating device includes a...
Invention Vapor chamber structure. A vapor chamber structure including a main vapor chamber, at least one ...
Invention Three-dimensional heat dissipating device. A three-dimensional heat dissipating device includes ...
Invention Liquid cooling module and its liquid cooling head. A liquid cooling head includes a chassis, an i...
Invention Liquid cooling head device. A liquid cooling head device includes a base, a cover covering the ba...
Invention Heat dissipation module. A heat dissipation module is provided and includes a cold plate having a...
2020 Invention Cold plate. A cold plate is provided and includes: a housing disposed with a chamber; a base comb...
Invention Heat dissipation base. A heat dissipation base includes a fixing plate and a metal heat conductio...
Invention Liquid-cooling radiator module. A liquid-cooling radiator module includes a first reservoir, a se...
Invention Leakage detection system. A leakage detection system is provided and includes a substrate provide...
Invention Dynamic nameplate. A dynamic nameplate is provided, which includes: a base disposed on a circuit ...
Invention Liquid-cooling heat dissipation device. A liquid-cooling heat dissipation device includes a water...
Invention Vapor chamber. The present disclosure provides a vapor chamber including an upper plate and a lo...
Invention Fastening device and heat dissipation module with the same. A fastening device includes a fixing...
Invention Vapor chamber. A vapor chamber is provided, which includes: a substrate; a diversion layer dispo...
Invention Liquid-cooling heat dissipation module
Invention Cold plate. A cold plate is provided and includes a casing, a guiding baffle, a base, a first inl...
Invention Cold plate. Provided is a cold plate including: a heat absorption space for a working medium to b...
Invention Flexible vapor chamber. A flexible vapor chamber for an electronic device includes an upper cove...
Invention Vapor chamber. A vapor chamber includes an upper plate and a lower plate. The lower plate is att...
Invention Vapor chamber. A vapor chamber includes an upper plate, a lower plate and a fixing frame. The lo...
2002 G/S Magnetic coded cards readers; microcomputers; microprocessors; central processing units; coolers ...
2001 G/S Magnetic coded card readers; microcomputers; microprocessors; central processing units; cooling f...