Abstract

A manifold liquid drainage system includes a first liquid drain body and a manifold assembly. The first liquid drain body includes a first hollow flow channel and a plurality of first openings. The manifold assembly is fixed to at least one of the first openings and communicates with the first hollow flow channel, wherein the manifold assembly includes a pipe, a quick release joint, an electronic flow valve, and a control circuit board. The pipe is connected to one of the openings. The electronic flow valve is installed between the pipe and the quick release joint. The control circuit board controls the electronic flow valve to regulate the liquid flow through the pipe.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F16K 31/02 - Operating meansReleasing devices electricOperating meansReleasing devices magnetic
• F16L 37/107 - Bayonet-type couplings

Abstract

A three-dimensional gas-liquid dual phase heat dissipation device includes a vapor chamber module and a water-cooling head. The vapor chamber module includes a vapor chamber. The vapor chamber includes a first cover plate, a second cover plate and a side wall surrounding the first cover plate and the second cover plate to form a hollow chamber therein. The first cover plate is used to contact a heat source, and the water-cooling head is fixed on the second cover plate of the vapor chamber.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means

Abstract

A gravity heat dissipation device includes a fixed frame, a heat conduction block, a first heat pipe and a second heat pipe. The heat conduction block is installed in the fixed frame and used to contact a heat source. The first heat pipe is connected to the heat conduction block, and a connection portion of the first heat pipe is located below a heat absorption portion of the first heat pipe and a heat dissipation portion of the first heat pipe. The second heat pipe is connected to the heat conduction block and the first heat pipe, and a first connection portion is located above a heat absorption portion of the second heat pipe and a first heat dissipation portion of the second heat pipe.

IPC Classes  ?

• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes

Abstract

A fluid heat dissipation device includes a first cold plate, a first adapter and a fluid delivery pipeline. The first cold plate is used to cool a first heat source, the first adapter is connected to the first cold plate, and the fluid delivery pipeline is connected to the first adapter and fluidly communicated with the first cold plate to improve the production efficiency and quality of the fluid heat dissipation device.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A heat dissipation device includes an inclined heat pipe and a plurality of inclined heat dissipation fins. The inclined heat pipe includes an inclined heat dissipation area, and each inclined heat dissipation fin includes an inclined heat dissipation portion. In addition, the inclined heat dissipation area of the inclined heat pipe is fixed to the inclined heat dissipation portion so that the inclined heat dissipation area of the inclined heat pipe forms a predetermined angle relative to a horizontal plane.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A loop heat pipe one-way circulation device includes a lower cover plate and an upper casing closely connected to the lower cover plate. The upper casing includes a fluid inlet, a fluid outlet, a joint surface, a heat absorption area and a gas discharge cavity. The joint surface is in close contact with the lower cover plate, and the heat absorption area is formed between the fluid inlet and the fluid outlet. In addition, the heat absorption area includes a heat absorption area inner surface height, and the gas discharge cavity has a gas discharge cavity height, and the gas discharge cavity height is greater than the heat absorption area inner surface height.

IPC Classes  ?

• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes

Abstract

An anti-wear screw includes a U-shaped anti-wear clip and a locking screw. The U-shaped anti-wear clip is used to clamp on a heat dissipation substrate, and the locking screw is passed through the U-shaped anti-wear clip to fix the heat dissipation substrate. In addition, the anti-wear screw further includes a pressure spring installed between the locking screw and the U-shaped anti-wear clip to exert pressure on the U-shaped anti-wear clip and the heat dissipation substrate.

IPC Classes  ?

• F16B 5/02 - Joining sheets or plates to one another or to strips or bars parallel to them by means of fastening members using screw-thread
• F16B 5/06 - Joining sheets or plates to one another or to strips or bars parallel to them by means of clamps or clips

Abstract

An interface card quick release device includes a housing, a release device and a release link. The release link is arranged in the housing. In addition, the housing includes an ejector, and a first end of the release link is movably coupled to the ejector. In addition, the release device controls the release link to push up an interface card.

IPC Classes  ?

• H05K 7/14 - Mounting supporting structure in casing or on frame or rack

Abstract

A heat dissipation device is provided and includes: a first vapor chamber having a first chamber and two first openings; and a second vapor chamber disposed on the first vapor chamber and having a second chamber, two bending portions and a middle portion. The two bending portions are inserted into the two first openings respectively to connect the first vapor chamber, such that the second chamber is in communication with the first chamber.

IPC Classes  ?

• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure

Abstract

A heat dissipation module includes a main vapor chamber, at least one auxiliary vapor chamber, a main heat dissipation fin set and at least one auxiliary heat dissipation fin set. The auxiliary vapor chamber is in fluid communication with the main vapor chamber, the main heat dissipation fin set is installed on the main vapor chamber, the auxiliary heat dissipation fin set is connected to the auxiliary vapor chamber, and the auxiliary vapor chamber is arranged between the main heat dissipation fin set and the auxiliary heat dissipation fin set.

IPC Classes  ?

• F04D 29/58 - CoolingHeatingDiminishing heat transfer
• F04D 29/42 - CasingsConnections for working fluid for radial or helico-centrifugal pumps
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F04D 17/02 - Radial-flow pumps specially adapted for elastic fluids, e.g. centrifugal pumpsHelico-centrifugal pumps specially adapted for elastic fluids having non-centrifugal stages, e.g. centripetal
• F04D 25/06 - Units comprising pumps and their driving means the pump being electrically driven

Abstract

A heat dissipation device includes a main fixed base plate, a main heat pipe set, a lower heat dissipation fin set and an upper heat dissipation module. The main heat pipe set is fixed on the main fixed base plate, and the lower heat dissipation fin set is also fixed on the main fixed base plate, and the main heat pipe set passes through the lower heat dissipation fin set, and is exposed on the lower heat dissipation fin set. In addition, the upper heat dissipation module is detachably installed on the lower heat dissipation fin set and contacts the main heat pipe set.

IPC Classes  ?

• H01L 23/427 - Cooling by change of state, e.g. use of heat pipes
• F28F 1/12 - Tubular elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
• H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A heat dissipation device includes a vapor chamber for contacting a heat source; at least one heat pipe having a first end and a second end connected to the vapor chamber; at least one partition disposed inside the heat pipe to partition the inside of the heat pipe into a first channel and a second channel isolated from each other; and a heat dissipation fin set disposed on the vapor chamber and partially covers the heat pipe. The vapor chamber is filled with a liquid working medium that absorbs the heat of the heat source and then gasifies into a gaseous working medium. The gaseous working medium moves into the first channel and the second channel to be condensed by the heat dissipation fin set, so the gaseous working medium is liquefied into the liquid working medium, and then the liquid working medium flows back into the vapor chamber.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means

Abstract

A liquid cooling device includes a water cooling radiator, a first pump and a cold plate. The water cooling radiator has a first surface and a second surface, the first surface and the second surface are located on opposite sides of the water cooling radiator, the first pump is disposed on the first surface or the second surface of the water cooling radiator, and the cold plate is disposed on the second surface of the water cooling radiator.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means

Abstract

A flexible vapor chamber includes a first flexible casing, a second flexible casing, a plurality of capillary strips and a plurality of inner capillary layers. The capillary strips are installed between the first flexible casing and the second flexible casing, and the inner capillary layers are arranged between the first flexible casing and the second flexible casing, and the capillary strips.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means

Abstract

A cold plate is provided and includes: a casing formed with an accommodating groove; a base coupled to the casing to define an action space together with the casing, where the action space communicates with the accommodating groove; a heat transfer structure disposed on an inner side of the base for transferring a heat energy generated by a heat source in contact with an outer side of the base to a working medium in the action space; and a pump having a stator disposed in the accommodating groove.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A heat dissipation device is provided and includes: a casing; a base unit combined with the casing to form a water collecting chamber, a water inlet chamber, an action space and a water outlet chamber; a heat transfer structure disposed on an inner side of the base unit; a water inlet pipeline unit communicated with the water collecting chamber; a water outlet pipeline unit communicated with the water outlet chamber; and a pump unit disposed outside the casing and the base unit, and connected with the water inlet pipeline unit and the water outlet pipeline unit, so as to drive a working medium.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A heat dissipation device is provided and includes: a first vapor chamber filled with a first working fluid therein and used for contacting at least one heat source; at least one heat transfer structure disposed on a side of the first vapor chamber; and a second vapor chamber filled with a second working fluid therein and connected to the first vapor chamber via the heat transfer structure, where the first working fluid absorbs heat of the heat source and then vaporizes, and the vaporized first working fluid transfers the heat to the second working fluid via the heat transfer structure.

IPC Classes  ?

• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A two-phase cold plate includes a base, an upper cover, a heat exchange cavity and a cooling fin module. The upper cover is installed on the base, the heat exchange cavity is formed between the base and the upper cover, and the cooling fin module is installed in the heat exchange cavity. The upper cover includes at least one nozzle module and a plurality of two-phase fluid channels. The two-phase fluid channels are respectively located on both sides of the nozzle module, and the nozzle module sprays a heat dissipating fluid to the cooling fin module, and the heat dissipating fluid flows along the cooling fin module to the two-phase fluid channels on both sides of the cooling fin module to cool the cooling fin module.

IPC Classes  ?

• F04D 29/58 - CoolingHeatingDiminishing heat transfer
• F04D 29/42 - CasingsConnections for working fluid for radial or helico-centrifugal pumps
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F04D 17/02 - Radial-flow pumps specially adapted for elastic fluids, e.g. centrifugal pumpsHelico-centrifugal pumps specially adapted for elastic fluids having non-centrifugal stages, e.g. centripetal
• F04D 25/06 - Units comprising pumps and their driving means the pump being electrically driven

Abstract

A liquid cooling head includes an upper casing, an impeller, a bottom casing and a skived fin cooling plate. The upper casing has an inlet and an outlet, the upper casing is fixed on the bottom casing, and the impeller is arranged between the upper casing and the skived fin cooling plate. In addition, the skived fin cooling plate is fixed on the bottom casing, and the impeller sucks the heat-dissipating liquid from the inlet and drives the heat-dissipating liquid passing through the skived fin cooling plate, upwardly passing through the impeller and then discharged from the outlet.

IPC Classes  ?

• F04D 29/58 - CoolingHeatingDiminishing heat transfer
• F04D 29/42 - CasingsConnections for working fluid for radial or helico-centrifugal pumps
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F04D 17/02 - Radial-flow pumps specially adapted for elastic fluids, e.g. centrifugal pumpsHelico-centrifugal pumps specially adapted for elastic fluids having non-centrifugal stages, e.g. centripetal
• F04D 25/06 - Units comprising pumps and their driving means the pump being electrically driven

Abstract

A vapor chamber and a heat dissipation device with the vapor chamber are provided. The vapor chamber includes a first plate, a second plate, a first capillary strip, a first communication structure and a working medium. An accommodation space is defined by the first plate and the second plate collaboratively. The first capillary strip is installed in the accommodation space. The accommodation space is divided into a first region and a second region by the first capillary strip. The working medium is accommodated within the accommodation space. The working medium flows between the first region and the second region through the first communication structure. Since the working medium is guided to flow in the accommodation space by the first capillary strip and the first communication structure, the heat dissipating efficacy is enhanced.

IPC Classes  ?

• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure

Abstract

A coolant distribution unit includes a casing, a control module, a power supply module, a heat exchange module, an integrated pipe, and a fluid driving module. The power supply module is electrically connected to the control module, the integrated pipe includes a plurality of inlets and an outlet to collect and output a cooled working fluid, the fluid driving module is electrically connected to the control module and the power supply module, and the fluid driving module is in fluid communication with the heat exchange module. The control module, power supply module, heat exchange module, integrated pipe, and fluid driving module are all arranged in the casing.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

An electronic package includes an electronic component and a heat dissipation structure, wherein the heat dissipation structure has a plurality of bonding pillars, and a metal layer is formed on the bonding pillars, so as to stably dispose the heat dissipation structure on the electronic component via the bonding pillars and the metal layer.

IPC Classes  ?

• H01L 23/373 - Cooling facilitated by selection of materials for the device
• H01L 23/488 - Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements consisting of soldered or bonded constructions
• H01L 23/532 - Arrangements for conducting electric current within the device in operation from one component to another including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials

Abstract

A bolster is provided and includes a bottom plate including a side plate extending upwards from a side of the bottom plate and a holding portion bending inwards from an edge of the side plate, a pillar vertically provided on the bottom plate and adjacent to the holding portion, and a torsion bar including two end portions and a main body portion, where one of the two end portions is fixed in the pillar and restricted by the holding portion, and the main body portion is restricted by the side plate. The bolster can effectively reduce warpage and deformation of the bottom plate.

IPC Classes  ?

• G06F 1/16 - Constructional details or arrangements
• H05K 7/02 - Arrangements of circuit components or wiring on supporting structure
• H05K 7/14 - Mounting supporting structure in casing or on frame or rack

Abstract

A fluid cooling device includes a bottom plate, an adhesive layer and a spray cooling cover. The bottom plate includes a substrate and a chip, and the spray cooling cover is fixed on the bottom plate by an adhesive layer. In addition, the spray cooling cover includes a fluid inlet and a plurality of fluid outlets to utilize a working fluid to cool the chip directly.

IPC Classes  ?

• G06F 1/16 - Constructional details or arrangements
• H05K 5/00 - Casings, cabinets or drawers for electric apparatus
• H05K 7/00 - Constructional details common to different types of electric apparatus
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A liquid cooling device includes a heat dissipation shell and a dual fin module. The heat dissipation shell includes a cooling cavity, and the dual fin module is fixed in the cooling cavity to separate the cooling cavity into an upper cooling space and a lower cooling space, so that a cooling fluid enters the cooling cavity and flows into the upper cooling space and the lower cooling space to cool a chip in the lower cooling space.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A liquid cooling head manufacturing method includes the following steps. First, a liquid channel main body is provided. Then, a heat dissipation bottom plate and a heat sink are disposed in different recessed indentations in the liquid channel main body. The heat dissipation bottom plate and the heat sink are welded in the liquid channel main body and a cover plate is sealed on the liquid channel main body.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• B23K 31/02 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to soldering or welding
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28F 9/18 - Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling by welding
• B23K 101/14 - Heat exchangers
• G06F 1/20 - Cooling means

Abstract

A liquid cooling head includes a bottom plate, a heat dissipation plate, a partition plate and an upper cover plate. The bottom plate includes an opening, and the heat dissipation plate, the partition plate and the upper cover plate are fixed to the bottom plate. The partition plate divides the opening into a plurality of cooling chambers, and each cooling chamber is equipped with a cooling liquid inlet, a cooling liquid outlet, a pump and an electric control device. The cooling liquid inlet and the cooling liquid outlet are formed in the upper cover plate, the pump is fluid-connected to the cooling liquid outlet, and the electric control device drives the pump to rotate, so that the cooling liquid flows through the cooling chamber to cool one heat source below the heat dissipation plate. In addition, a liquid cooling device with the liquid cooling head is also disclosed therein.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• B23K 31/02 - Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups relating to soldering or welding
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28D 21/00 - Heat-exchange apparatus not covered by any of the groups
• F28F 9/18 - Arrangements for sealing elements into header boxes or end plates by permanent joints, e.g. by rolling by welding
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• B23K 101/14 - Heat exchangers
• G06F 1/20 - Cooling means

Abstract

A heat dissipation device is provided and includes: a temperature equalizing plate unit; at least one first vapor chamber unit and at least one second vapor chamber unit disposed on an outer surface of the temperature equalizing plate unit; at least one first tower fin set disposed on the outer surface of the temperature equalizing plate unit to sleeve the first and second vapor chamber units and partially expose the second vapor chamber unit; and at least one second tower fin set disposed on a part of a surface of the first tower fin set to sleeve the exposed part of the second vapor chamber unit.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• F28F 1/22 - Tubular elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means having portions engaging further tubular elements
• F28F 1/32 - Tubular elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements

Abstract

A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe, a working fluid and a solder bonding portion. The vapor chamber includes an inner cavity and a first joint. The first joint is formed with a passage being in communication with the inner cavity. The heat pipe is provided with a pipe space and a second joint. The pipe space is in communication with the inner cavity through the passage. The second joint is sleeved to surround the first joint such that one end surface of the second joint is directly contacted with one surface of the vapor chamber. The working fluid is filled within the pipe space and the inner cavity. The solder bonding portion connected to the second joint and the surface of the vapor chamber for integrating the heat pipe and the vapor chamber together.

IPC Classes  ?

• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• F28F 1/32 - Tubular elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
• F28F 1/12 - Tubular elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element

Abstract

A heat dissipation device is provided and includes a vapor chamber unit, a heat pipe set provided on an outer surface of the vapor chamber unit, a first fin set provided on the outer surface of the vapor chamber unit and sleeving the heat pipe set, and a second fin set stacked on the first fin set and sleeving the heat pipe set, where the fin arrangement direction of the first fin set is different from the fin arrangement direction of the second fin set.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• F28F 1/22 - Tubular elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means having portions engaging further tubular elements
• F28F 1/32 - Tubular elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements

Abstract

A leakage detection system is provided and includes a substrate provided between a first element and a second element, and at least one sensing unit provided on the substrate to generate an electrical signal when coming into contact with a leakage liquid. As such, warnings can be provided when coming into contact with the leakage liquid to avoid significant loss of assets.

IPC Classes  ?

• G01M 3/16 - Investigating fluid tightness of structures by using fluid or vacuum by detecting the presence of fluid at the leakage point using electric detection means
• G06F 1/20 - Cooling means
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A cold plate is provided and includes: a housing disposed with a chamber; a base combined with the housing to form a working space separated from the chamber but connected with the chamber through an interconnecting structure to allow a working medium to flow within the chamber and the working space; a heat transfer structure disposed on the inner side of the base; and a pump disposed within the working space to drive the working medium in the working space. As such, the cold plate can provide better heat dissipation performance.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28D 9/00 - Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
• F28F 3/12 - Elements constructed in the shape of a hollow panel, e.g. with channels
• F28D 21/00 - Heat-exchange apparatus not covered by any of the groups

Abstract

A heat dissipation module is provided and includes a cold plate having a housing, and a frame body disposed on the housing and having two sidewalls and at least one first rib, where the two sidewalls are positioned at two sides of the housing, respectively, and the first rib is used to provide a deformation resistance so that the heat dissipation module will not be seriously deformed when secured.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28D 21/00 - Heat-exchange apparatus not covered by any of the groups
• F28F 3/00 - Plate-like or laminated elementsAssemblies of plate-like or laminated elements

Abstract

A dynamic nameplate is provided, which includes: a base disposed on a circuit board; and a rotating member disposed on the base through a bearing, so that the rotating member can rotate relative to the base. The dynamic nameplate can provide dynamic effects without using a conventional motor.

IPC Classes  ?

• H02K 1/14 - Stator cores with salient poles
• H02K 7/116 - Structural association with clutches, brakes, gears, pulleys or mechanical starters with gears
• H02K 7/08 - Structural association with bearings
• G09F 3/02 - Forms or constructions
• G09F 3/08 - Fastening or securing by means not forming part of the material of the label itself
• H02K 3/18 - Windings for salient poles
• H05K 1/02 - Printed circuits Details

Abstract

A heat dissipation base includes a fixing plate and a metal heat conduction block. The fixing plate includes a plurality of heat pipe partitions and a plurality of heat pipe fixing openings, and the heat pipe fixing openings are formed between the heat pipe partitions. The metal heat conduction block is fixed to the fixing plate, and the fixing plate further includes a plurality of supporting portions to support shear surfaces at two ends of the heat conduction block.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• H01L 23/427 - Cooling by change of state, e.g. use of heat pipes

Abstract

A liquid cooling head includes a chassis, an inlet channel, a thermally-conducting structure, a liquid gathering structure, a drain channel and a pump set. The chassis includes a lower chamber and an upper chamber communicated with the lower chamber through a connection opening. The inlet channel is disposed on one side of the chassis, and communicated with the upper chamber for radiating the heat of the working fluid away. The thermally-conducting structure is disposed in the lower chamber for gathering the working fluid passed through the thermally-conducting structure. The drain channel is disposed on one side of the chassis to be communicated with the lower chamber. The pump set for pushing the working fluid in the lower chamber to discharge the working fluid outwards from the drain channel.

IPC Classes  ?

• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A liquid cooling head device includes a base, a cover covering the base, an inlet portion disposed on the base, an outlet portion formed on the cover, and a fluid pump having a housing and a fan blade. The base includes a diversion channel, an opening and a first chamber connected to the diversion channel and the opening. A second chamber is formed between the cover and the base, and connected to the first chamber through the opening. The inlet portion is connected to the first chamber through the diversion channel. The housing covers one surface of the cover, so that a third chamber is collectively defined by the housing and the cover, and connected with the second chamber and the outlet portion. The fan blade is located in the third chamber, and the diversion channel is located between the fan blade and the first chamber.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H02K 7/14 - Structural association with mechanical loads, e.g. with hand-held machine tools or fans

Abstract

A liquid-cooling radiator module includes a first reservoir, a second reservoir, a heat dissipation stacked structure, a radiator inlet and a radiator outlet. The first reservoir includes a first chamber and a second chamber. The second reservoir includes a third chamber and a fourth chamber. A fin tube layer of the heat dissipation stacked structure is sandwiched between the first reservoir and the second reservoir. The radiator inlet is connected to the first reservoir and the first chamber. The radiator outlet is connected to the second reservoir and the fourth chamber. A part of fin tubes of the fin tube layer communicates with the first chamber and the third chamber, another part of the fin tubes communicates with the third chamber and the second chamber, and one another part of the fin tubes communicates with the second chamber and the fourth chamber.

IPC Classes  ?

• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• F28D 1/053 - Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with the heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A coolant distribution unit includes a casing, a control module, a power supply module, a heat exchange module, and a fluid driving module. The power supply module is electrically connected to the control module, the fluid driving module is electrically connected to the control module and the power supply module, and the fluid driving module is in fluid communication with the heat exchange module. The control module, power supply module, heat exchange module, and fluid driving module are all arranged in the casing. In addition, the control module controls the power supply module to output a corresponding electrical power to the fluid driving module according to an operation status of the fluid driving module.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A liquid-cooling heat dissipation device includes a water-cooling module, a water-tank module, a power module, a first and a second water-cooling radiators. The water-cooling module includes a base, a plate, an isolating structure and a heat-conducting unit. The isolating structure connects between the base and the plate. The plate, the isolating structure and the base define a first chamber. The isolating structure and the plate define a second and a third chambers. The first, the second and the third chambers are isolated from each other. The heat-conducting unit is partially located within the first chamber and partially exposed from the base. The first and the second water-cooling radiators connect to the plate and communicate between the water-cooling module and the water-tank module. The power module drives a medium to flow between the water-cooling module and the water-tank module through the first and the second water-cooling radiators.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A cold plate is provided and includes a casing, a guiding baffle, a base, a first inlet passage, an outlet passage and a pump. The guiding baffle is disposed in the casing and defines a fluid storage chamber together with the casing. The fluid storage chamber is filled with a working medium. The guiding baffle includes a communication opening. The base, the casing and guiding baffle together define a working space. The working medium flows into the working space through the communication opening, and the base is used for absorbing thermal energy and transfers the thermal energy to the working medium. The first inlet passage communicates with the fluid storage chamber and allows the cooled working medium to flow into the fluid storage chamber. The outlet passage communicates with the working space to allow the heated working medium to be discharged from the working space.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

Provided is a cold plate including: a heat absorption space for a working medium to be filled therein; a heat transfer structure disposed on a base within the heat absorption space for transferring thermal energy generated from a heat source that is in contact with the base to the working medium; and a flow guide structure disposed in the heat absorption space for guiding the working medium. The flow guide structure of the cold plate can effectively improve the efficiency of thermal energy absorption of the working medium.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

A heat dissipation system and a coolant distribution module for plural electronic components of an electronic computing device are provided. The heat dissipation system includes plural water-cooling heads, a heat dissipation device and the coolant distribution module. When a fluid medium flows through the heat dissipation device, the heat dissipation device exchanges heat with the fluid medium. The coolant distribution module is connected between the plural water-cooling heads and the heat dissipation device. The coolant distribution module includes a main body and a power module. The module main body includes a cooled fluid chamber. The cooled fluid chamber includes plural first outlets corresponding to the plural water-cooling heads. The power module is installed in the module main body. The power module drives the fluid medium to be outputted from the plural first outlets. Consequently, the fluid medium is transferred through a circulating loop.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means

Abstract

A heat dissipation device includes two connected components and a flexible metal conduit. Each connected component is selected from a manifold, a quick connector, an evaporator, a condenser or a pump. The two connected components are in communication with each other through the flexible metal conduit. The use of the flexible metal conduit is effective to absorb the designing tolerance. In addition, the flexible metal conduit is recyclable.

IPC Classes  ?

• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• H01L 23/367 - Cooling facilitated by shape of device
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H01L 23/427 - Cooling by change of state, e.g. use of heat pipes

Abstract

A heat exchanger includes a heat-absorbing part, two vapor conduits, a return conduit and a condensing part. The heat-absorbing part includes a vapor zone and a liquid zone. A first end of each vapor conduit is connected with the vapor zone of the heat-absorbing part. A first end of the return conduit is connected with the liquid zone of the heat-absorbing part. The condensing part includes a vapor-inputting chamber, a liquid-outputting chamber, a partition plate, a communication chamber, a first condenser tube group and a second condenser tube group. The vapor-inputting chamber is connected with a second end of each vapor conduit. The liquid-outputting chamber is connected with a second end of the return conduit. A loop is defined by the heat-absorbing part, the at least two vapor conduits, the return conduit and the condensing part collaboratively.

IPC Classes  ?

• F25B 39/04 - Condensers
• F28D 7/00 - Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall

Abstract

A composite-type heat pipe includes a working fluid, a first capillary structure, a second capillary structure and a pipe body. The first capillary structure has a smooth surface. The second capillary structure has plural trenches. The pipe body accommodates the working fluid. The pipe body includes a first section and a second section. The second section is connected with the first section. The first capillary structure is formed on a first inner wall of the first section. The second capillary structure with the trenches is formed on a second inner wall of the second section. The trenches extend along an axial direction of the pipe body.

IPC Classes  ?

• F28D 15/00 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes

Abstract

A vapor chamber and a heat dissipation device with the vapor chamber are provided. The vapor chamber includes a first plate, a second plate, a first capillary strip, a first communication structure and a working medium. An accommodation space is defined by the first plate and the second plate collaboratively. The first capillary strip is installed in the accommodation space. The accommodation space is divided into a first region and a second region by the first capillary strip. The working medium is accommodated within the accommodation space. The working medium flows between the first region and the second region through the first communication structure. Since the working medium is guided to flow in the accommodation space by the first capillary strip and the first communication structure, the heat dissipating efficacy is enhanced.

IPC Classes  ?

• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure

Abstract

A rotatable water-cooling tube and an electronic device with the water-cooling tube are provided. The water-cooling tube includes a first tube body, a second tube body, a third tube body, a first connector and a second connector. The first tube body is in communication with the second tube body and the third tube body through the first connector and the second connector. The first tube body is rotatable with the first connector and the second connector. Consequently, the first tube body can be freely rotated to a proper position. The technology of the present invention is helpful to assemble and disassemble the heat generation component under the rotatable water-cooling tube.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H05K 1/02 - Printed circuits Details
• G06F 1/20 - Cooling means

Abstract

A water-cooling head includes a casing, an inclined flow-guiding structure and a bottom plate assembly. The casing includes an inlet and an outlet. A liquid is fed into the inlet. The inclined flow-guiding structure is disposed within the casing, and includes plural first openings. A bottom end of the inclined flow-guiding structure is located under the inlet. A top end of the inclined flow-guiding structure is arranged beside the outlet. The top end is located at a level higher than the bottom end. A second opening is formed in the bottom end. The bottom plate assembly is assembled with the casing, and located under the inclined flow-guiding structure. The bottom plate assembly includes a fin group. After the liquid is transferred to the fin group through the second opening or the plural first openings, the liquid is exited from the outlet.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F25D 11/00 - Self-contained movable devices associated with refrigerating machinery, e.g. domestic refrigerators
• F25D 21/04 - Preventing the formation of frost or condensate
• F25D 21/14 - Collecting or removing condensed and defrost waterDrip trays
• F25D 23/02 - DoorsCovers
• F25D 27/00 - Lighting arrangements
• G06F 1/20 - Cooling means

Abstract

A water cooling head includes water cooling head includes a casing, a base and a pump. The casing includes an inlet and an outlet. An outer side of the base has a heat-absorbing surface. A thermal conduction structure is disposed on an inner side of the base. An active space is defined by the base and the casing collaboratively. The pump includes a first magnetic element, a second magnetic element, an impeller and a pivotal part. The first magnetic element is located outside the active space. The first magnetic element is arranged between the impeller and the base along a direction perpendicular to the base. The pivotal part, the second magnetic element and the impeller are disposed within the active space. The pivotal part is connected with the impeller and arranged between the impeller and the base. The second magnetic element is installed on the pivotal part.

IPC Classes  ?

• F28D 15/00 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
• F04D 29/02 - Selection of particular materials
• F28D 15/02 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes
• F04D 1/02 - Radial-flow pumps, e.g. centrifugal pumpsHelico-centrifugal pumps having non-centrifugal stages, e.g. centripetal
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• F04D 13/06 - Units comprising pumps and their driving means the pump being electrically driven

Abstract

A water-cooling head includes a casing, a base, an input channel, an output channel and a pump. An active space is defined by the base and the casing collaboratively. A working medium is filled in the active space. The heat absorbed by the base is transferred to the working medium. The input channel is in communication with the active space. The cooled working medium is introduced into the active space through the input channel. The output channel is in communication with the active space. The heated working medium is outputted from the active space through the output channel. The pump is installed on the casing, and includes an impeller. The impeller is disposed within the active space and located near the output channel. The impeller is driven to guide the working medium to be outputted from the active space through the output channel.

IPC Classes  ?

• F28F 3/12 - Elements constructed in the shape of a hollow panel, e.g. with channels
• F04D 1/04 - Helico-centrifugal pumps
• F04D 29/20 - Mounting rotors on shafts
• F04D 29/24 - Vanes
• F28F 9/02 - Header boxesEnd plates
• F28D 1/02 - Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with the heat-exchange conduits immersed in the body of fluid
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F04D 29/26 - Rotors specially adapted for elastic fluids
• F04D 29/58 - CoolingHeatingDiminishing heat transfer

Abstract

A water-cooling head includes a casing, a base, a thermal conduction structure and a pump. An active space is defined by the base and the casing collaboratively. A working medium is filled in the active space. The pump includes a fixing element, a shaft and an impeller. After the fixing element is fixed, the fixing element is contacted with the base or contacted with the thermal conduction structure, and the shaft is fixed on the fixing element. Consequently, the impeller is stably rotated about the shaft, and the performance and the reliability of the water-cooling head are enhanced.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28D 1/02 - Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with the heat-exchange conduits immersed in the body of fluid

Abstract

A pump module includes a main body, a first pump and a second pump. The main body includes a fluid channel, a first mounting hole and a second mounting hole. The fluid channel is exposed through the first mounting hole and the second mounting hole. The first pump is installed in the first mounting hole and sealedly coupled with the first mounting hole. The second pump is installed in the second mounting hole and sealedly coupled with the second mounting hole. A working liquid in the fluid channel is transferred through the first pump and the second pump sequentially. Even if one of the first pump and the second pump is damaged, the other of the first pump and the second pump is normally operated to move the working liquid in the fluid channel.

IPC Classes  ?

• F04D 13/14 - Combinations of two or more pumps the pumps being all of centrifugal type
• G06F 1/20 - Cooling means
• F04D 15/00 - Control, e.g. regulation, of pumps, pumping installations, or systems
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids
• F04D 13/12 - Combinations of two or more pumps
• F04D 3/00 - Axial-flow pumps
• F04D 1/06 - Multi-stage pumps
• F04D 29/04 - Shafts or bearings, or assemblies thereof
• F04D 29/00 - Details, component parts, or accessories
• F04D 29/42 - CasingsConnections for working fluid for radial or helico-centrifugal pumps
• F04D 29/08 - Sealings
• F04D 29/64 - MountingAssemblingDisassembling of axial pumps

Abstract

A clustered heat dissipation device and a chassis are provided. The clustered heat dissipation device includes a heat-absorbing manifold, plural heat-absorbing heads and plural connection pipes. The heat-absorbing manifold includes an inlet chamber and an outlet chamber. The inlet chamber includes at least one first liquid inlet and plural first liquid outlets. The outlet chamber includes plural second liquid inlets and at least one second liquid outlet. The heat-absorbing manifold is in thermal contact with a first heat source. The plural connection pipes are connected with the heat-absorbing heads and the corresponding first liquid outlets and connected with the heat-absorbing heads and the corresponding second liquid inlets.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28D 15/00 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
• F28F 21/02 - Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
• F28F 21/08 - Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
• H05K 5/02 - Casings, cabinets or drawers for electric apparatus Details

Abstract

A water-cooling heat dissipating system includes a pump and a water-cooling head. The water-cooling head includes a base, a first chamber and a second chamber. The base is in contact with an electronic component. The first chamber and the second chamber are located over the base and separated from each other. The first chamber includes a first inlet and a first outlet. The first inlet is in fluid communication with the pump. The second chamber includes a second inlet and a second outlet. The second inlet is fluid communication with the first outlet. The liquid continuously flows through the first chamber and the second chamber. The heat from the electronic component is transferred to the liquid within the first chamber and the second chamber through the base, and released through the first outlet and the second outlet.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means
• F28F 3/12 - Elements constructed in the shape of a hollow panel, e.g. with channels
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids

Abstract

A heat dissipation device includes a first fin group, a second fin group, a heat pipe and a base. The base is in thermal contact with a heat source. The heat pipe includes a first pipe part and a second pipe part. The second pipe part is connected with the first pipe part and extended upwardly. The first pipe part is arranged between the base and the second fin group. The second pipe part is penetrated through the first fin group. The distance between a top surface of the first fin group and the base is larger than the distance between a top surface of the second fin group and the base. Since influences of the dissipating area and the wind resistance are taken into consideration, the heat dissipation device has enhanced heat dissipating efficacy.

IPC Classes  ?

• F28D 15/04 - Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls in which the medium condenses and evaporates, e.g. heat-pipes with tubes having a capillary structure
• F28F 1/24 - Tubular elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
• F28F 1/14 - Tubular elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally

Abstract

A water-cooling heat dissipation module includes a hot-water heat exchange structure, a cold-water heat exchange structure, a fluid communication structure and a fan. The fluid communication structure is in communication with the hot-water heat exchange structure and the cold-water heat exchange structure. The fan and the hot-water heat exchange structure are opposed to each other with respect to the cold-water heat exchange structure. An airflow produced by the fan blows the cold-water heat exchange structure and the hot-water heat exchange structure sequentially. Consequently, the cold-water heat exchange structure will not receive the heat from the hot-water heat exchange structure through the airflow.

IPC Classes  ?

• F28D 1/06 - Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with the heat-exchange conduits forming part of, or being attached to, the tank containing the body of fluid
• G06F 1/20 - Cooling means

Abstract

An electronic device with a heat-dissipating function and a liquid-cooling radiator module are provided. The electronic device includes a first circuit board, a second circuit board and a liquid-cooling radiator module. The second circuit board is mounted on the first circuit board. The liquid-cooling radiator module is attached on the second circuit board and in thermal contact with an electronic component of the second circuit board. The liquid-cooling radiator module includes plural airflow channels and a fan. The plural airflow channels are in parallel with the second circuit board. The fan produces airflow toward the plural airflow channel. After the airflow passes through the plural airflow channels, the airflow is outputted in a direction parallel with the second circuit board. Since the airflow is not obstructed by the adjacent function circuit boards, the heat-dissipating efficiency is enhanced.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• G06F 1/20 - Cooling means
• F04D 17/16 - Centrifugal pumps for displacing without appreciable compression
• F04D 29/52 - CasingsConnections for working fluid for axial pumps
• F04D 29/58 - CoolingHeatingDiminishing heat transfer
• F04D 19/00 - Axial-flow pumps specially adapted for elastic fluids
• F04D 17/02 - Radial-flow pumps specially adapted for elastic fluids, e.g. centrifugal pumpsHelico-centrifugal pumps specially adapted for elastic fluids having non-centrifugal stages, e.g. centripetal
• F04D 25/06 - Units comprising pumps and their driving means the pump being electrically driven
• H01L 23/473 - Arrangements for cooling, heating, ventilating or temperature compensation involving the transfer of heat by flowing fluids by flowing liquids

Abstract

A securing mechanism is provided for facilitating attaching a heat dissipation element. The securing mechanism includes a first fixing part, a second fixing part, a first arm and a second arm. The first arm and the second arm are connected with the first fixing part and the second fixing part. A first bent structure is protruded from the first arm and toward the second arm. A second bent structure is protruded from the second arm and toward the first arm. The securing mechanism is fixed on the heat dissipation element through the first fixing part and the second fixing part. The heat dissipation element is pressed by the first bent structure and the second bent structure. Consequently, the heat dissipation element is attached on the heat source.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating
• F28F 9/00 - CasingsHeader boxesAuxiliary supports for elementsAuxiliary members within casings
• H01L 23/40 - Mountings or securing means for detachable cooling or heating arrangements

Abstract

A liquid-cooling heat dissipating module includes a water-cooling radiator, a water-cooling head and an external pump. The water-cooling radiator includes a radiator inner channel, a radiator outlet tube and a radiator inlet tube. The water-cooling head assembly includes a water-cooling head and a bracket. The water-cooling head includes a first chamber, a head inlet and a head outlet. The head outlet is connected with the radiator inlet tube. The bracket is contacted with the water-cooling head. The external pump is contacted with the water-cooling head assembly. The external pump includes a second chamber, a pump inlet, a pump outlet and a pump tube. Two ends of the pump tube are connected with the pump outlet and the head inlet, respectively. The radiator inner channel, the radiator outlet tube, the radiator inlet tube, the first chamber, the pump tube and the second chamber are in fluid communication.

IPC Classes  ?

• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Abstract

An infinity mirror includes a light-transmissible and reflective layer, a reflective layer, a light-transmissible layer and at least one light-emitting element. The light-transmissible and reflective layer is disposed on a top surface of the light-transmissible layer. The reflective layer is disposed on a bottom surface of the light-transmissible layer. The at least one light-emitting element emits a light beam. The light-transmissible layer includes a pattern zone and a non-pattern zone. There is a height difference between the pattern zone and the non-pattern zone of the light-transmissible layer. The infinity mirror can provide a multi-mirror image effect.

IPC Classes  ?

• G02B 5/08 - Mirrors
• G02B 17/00 - Systems with reflecting surfaces, with or without refracting elements
• G09F 19/16 - Advertising or display means not otherwise provided for using special optical effects involving the use of mirrors

Abstract

A heat sink includes a bottom surface, a top surface, plural first fins and plural second fins. The plural first fins and the plural second fins are alternately and separately arranged between the top surface and the bottom surface along a specified axis direction. Moreover, plural airflow channels are defined by the plural first fins, the plural second fins, the top surface and the bottom surface collaboratively. The first fin has a first non-overlapped zone and a second non-overlapped zone with respect to a projection area of the second fin along the specified axis direction. The first non-overlapped zone is located at an airflow inlet. In the first non-overlapped zone, the lower portion is wider than the upper portion. The second non-overlapped zone is located at an airflow outlet. In the second non-overlapped zone, the upper portion is wider than the lower portion.

IPC Classes  ?

• F28F 7/00 - Elements not covered by group , , or
• H05K 7/20 - Modifications to facilitate cooling, ventilating, or heating

Goods & Services

Magnetic coded cards readers; microcomputers; microprocessors; central processing units; coolers for use with central processing units, namely heat sinks. Cooling fans for use as a component part of other goods, namely computers, electrical power supplies and photocopying machines.

Goods & Services

Magnetic coded card readers; microcomputers; microprocessors; central processing units; cooling fans for use as a component part of other goods, namely, computers, electrical power supplies and photocopying machines; coolers for use with central processing units, namely heat sinks