Shin-Etsu Handotai Co., Ltd.

Japan

Create a watch for Shin-Etsu Handotai Co., Ltd.
Total IP 1,283
Total IP Rank # 1,057
IP Activity Score 3.4/5.0    489
IP Activity Rank # 1,444
Parent Entity Shin-Etsu Chemical Co., Ltd.
Dominant Nice Class Scientific and electric apparatu...

Patents

Trademarks

445 2
0 0
832 4
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Last Patent 2025 - Substrate for electronic device ...
First Patent 1983 - Apparatus for chemical etching o...
Last Trademark 2023 - IG-NANA
First Trademark 2000 - EP-NANA

Subsidiaries

1 subsidiaries without IP

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Industry (Nice Classification)

Latest Inventions, Goods, Services

2025 Invention Silicon substrate and heat treatment method for silicon substrate. The present invention provides...
Invention Method for measuring resistivity of silicon single crystal. The present invention is a method fo...
2024 Invention Method for determining defect region of silicon single-crystal substrate. The present invention i...
Invention Method for manufacturing heteroepitaxial wafer. The present invention is a method for manufacturi...
Invention Manufacturing method for nitride semiconductor epitaxial substrate, nitride semiconductor epitaxi...
Invention Method for evaluating crystallinity of 3c-sic film. The present invention provides a method for e...
Invention Pinhole and deaeration failure inspection method for bag body in which sealed storage container i...
Invention Epitaxial wafer and production method therefor. The present invention is an epitaxial wafer compr...
Invention Soi wafer and method for manufacturing same. The present invention is a SOI wafer comprising, in ...
Invention Method for manufacturing epitaxial wafer. The present invention is a method for manufacturing an ...
Invention Method for manufacturing epitaxial wafer. Provided is a method for manufacturing an epitaxial waf...
Invention Single-crystal silicon substrate and method for producing single-crystal silicon substrate. The p...
Invention Nitride semiconductor epitaxial wafer and method for manufacturing nitride semiconductor epitaxia...
Invention Cleaning process device. The present invention is a cleaning process device 1 comprising a horn-t...
Invention Diamond substrate and method for manufacturing diamond substrate. The present invention is a diam...
Invention Spin etching device, spin etching method, and wafer holding method. The present invention is a sp...
Invention Heteroepitaxial wafer and method for manufacturing same. The present invention provides a heteroe...
Invention Production method for gan epitaxial film and production method for semiconductor device. The pres...
Invention Silicon single crystal manufacturing device. The present invention is a device for manufacturing ...
Invention Method for manufacturing sic substrate, method for manufacturing semiconductor device, sic substr...
Invention Method for manufacturing nitride semiconductor substrate, method for manufacturing hybrid ic, and...
Invention Method for applying resin to wafer and method for manufacturing wafer. The present invention pert...
Invention Cylindrical grinding machine and cylindrical grinding method. The present invention provides a cy...
Invention Method for producing joined substrate and method for producing semiconductor device. The present ...
Invention High mobility substrate having δ-doped layer and method for manufacturing high mobility substrate...
Invention Polishing cloth cleaning method. The present invention is a polishing cloth cleaning method in wh...
2023 G/S Semiconductor silicon wafers; Semiconductor silicon ingots sold as an integral component of semic...
Invention Substrate for electronic device and method for producing the same. The present invention is a su...
Invention Method for growing diamond on silicon substrate and method for selectively growing diamond on sil...
2022 Invention Substrate for high-frequency device, and method for producing same. A substrate for a high-frequ...
Invention Nitride semiconductor substrate and method for producing same. A nitride semiconductor substrate...
Invention Wafer having micro-led structure, method for manufacturing wafer having micro-led structure, and ...
Invention Nitride semiconductor substrate and method for producing same. The present invention is a nitrid...
Invention Method for manufacturing bonded semiconductor wafer. A method for manufacturing a bonded semicon...
Invention Nitride semiconductor substrate and method for producing nitride semiconductor substrate. The pr...
Invention Substrate for electronic device and method for producing the same. A substrate for an electronic...
Invention Nitride semiconductor substrate and manufacturing method therefor. A nitride semiconductor subst...
Invention Nitride semiconductor substrate and method for manufacturing nitride semiconductor substrate. Th...
Invention Method for manufacturing bonded semiconductor wafer. The present invention provides a method for...
Invention Method for separating a bonded wafer. The present disclosure provides a method for separating a ...
Invention Epitaxial wafer and production method therefor. An epitaxial wafer production method, including ...
Invention Method for manufacturing nitride semiconductor wafer, and nitride semiconductor wafer. A method ...
Invention Method for producing heteroepitaxial film. A method for efficiently producing a heteroepitaxial ...
Invention Nitride semiconductor substrate and method for manufacturing same. A nitride semiconductor subst...
Invention Method for manufacturing nitride semiconductor substrate. A method for manufacturing a nitride s...
Invention Nitride semiconductor substrate and method for manufacturing the same. A nitride semiconductor s...
Invention Temporarily bonded wafer and method for manufacturing the wafer. A temporarily bonded wafer in w...
Invention Method for producing silicon single crystal. The present invention provides a method for produci...
Invention Method for producing heteroepitaxial wafer. The present invention provides a method for producin...
Invention Bonded wafer and method for producing bonded wafer. A bonded wafer, wherein an epitaxial wafer h...
Invention Method of manufacturing compound semiconductor bonded substrate and compound semiconductor bonded...
2000 G/S Semiconductor silicon wafers, semiconductor silicon ingots.