Shin-Etsu Handotai Co., Ltd.

Japon

 
Quantité totale PI 1 289
Rang # Quantité totale PI 1 019
Note d'activité PI 3,4/5.0    516
Rang # Activité PI 1 400
Parent Shin-Etsu Chemical Co., Ltd.
Classe Nice dominante Appareils et instruments scienti...

Brevets

Marques

439 2
0 0
844 4
0
 
Dernier brevet 2025 - Cleaning process device
Premier brevet 1983 - Apparatus for chemical etching o...
Dernière marque 2023 - IG-NANA
Première marque 2000 - EP-NANA

Filiales

1 subsidiaries without IP

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Industrie (Classification de Nice)

Derniers inventions, produits et services

2024 Invention Cleaning process device. The present invention is a cleaning process device 1 comprising a horn-t...
Invention Spin etching device, spin etching method, and wafer holding method. The present invention is a sp...
Invention Heteroepitaxial wafer and method for manufacturing same. The present invention provides a heteroe...
Invention Production method for gan epitaxial film and production method for semiconductor device. The pres...
Invention Silicon single crystal manufacturing device. The present invention is a device for manufacturing ...
Invention Method for manufacturing sic substrate, method for manufacturing semiconductor device, sic substr...
Invention Method for manufacturing nitride semiconductor substrate, method for manufacturing hybrid ic, and...
Invention Method for applying resin to wafer and method for manufacturing wafer. The present invention pert...
Invention Cylindrical grinding machine and cylindrical grinding method. The present invention provides a cy...
Invention Method for producing joined substrate and method for producing semiconductor device. The present ...
Invention High mobility substrate having δ-doped layer and method for manufacturing high mobility substrate...
Invention Polishing cloth cleaning method. The present invention is a polishing cloth cleaning method in wh...
Invention Method for manufacturing semiconductor substrate, semiconductor substrate, and semiconductor devi...
Invention Epitaxial wafer, soi wafer, and method for manufacturing same. The present invention pertains to ...
Invention Defect evaluation method for semiconductor substrate. The present invention provides a defect eva...
Invention Semiconductor substrate production method, semiconductor substrate, and semiconductor device. The...
2023 Invention Method for producing epitaxial substrate, and epitaxial substrate. The present invention provides...
Invention Method for manufacturing 3c-sic single-crystal epitaxial substrate, method for manufacturing 3c-s...
Invention Heteroepitaxial single-crystal-silicon substrate, epitaxial substrate, semiconductor device, and ...
Invention Method for producing heteroepitaxial substrate. This method for producing a heteroepitaxial subst...
P/S Semiconductor silicon wafers; Semiconductor silicon ingots sold as an integral component of semic...
2022 Invention Method for manufacturing bonded semiconductor wafer. A method for manufacturing a bonded semicon...
Invention Substrate for electronic device and method for producing the same. A substrate for an electronic...
Invention Nitride semiconductor substrate and manufacturing method therefor. A nitride semiconductor subst...
Invention Nitride semiconductor substrate and method for manufacturing nitride semiconductor substrate. Th...
Invention Method for separating a bonded wafer. The present disclosure provides a method for separating a ...
Invention Epitaxial wafer and production method therefor. An epitaxial wafer production method, including ...
Invention Method for manufacturing nitride semiconductor wafer, and nitride semiconductor wafer. A method ...
Invention Nitride semiconductor substrate and method for manufacturing same. A nitride semiconductor subst...
Invention Method for manufacturing nitride semiconductor substrate. A method for manufacturing a nitride s...
Invention Nitride semiconductor substrate and method for manufacturing the same. A nitride semiconductor s...
Invention Temporarily bonded wafer and method for manufacturing the wafer. A temporarily bonded wafer in w...
Invention Method for producing silicon single crystal. The present invention provides a method for produci...
Invention Method for producing heteroepitaxial wafer. The present invention provides a method for producin...
Invention Substrate for semiconductor device and method for manufacturing the same. The present invention ...
Invention Epitaxial wafer for ultraviolet ray emission device and method for manufacturing the same. An ep...
Invention Method for carrying wafer and wafer-carrying apparatus. The present invention is a method for ca...
Invention Bonded wafer and method for producing bonded wafer. A bonded wafer, wherein an epitaxial wafer h...
Invention Clean room. The present invention is a clean room including a stocker area in which an article m...
Invention Debris determination method. A debris determination method of determining, using an image obtain...
Invention Debris determination method. A debris determination method of determining, from an image obtaine...
Invention Method for forming thermal oxide film on semiconductor substrate and method for producing semicon...
Invention Wafer marking method, method of producing nitride semiconductor device and nitride semiconductor ...
Invention Packaging member for packaging object to be transported between clean rooms, packaging method, an...
Invention Method of manufacturing compound semiconductor bonded substrate and compound semiconductor bonded...
Invention Silicon wafer manufacturing method. The present invention is a silicon wafer manufacturing metho...
Invention Apparatus for manufacturing single crystal. The present invention is an apparatus for manufactur...
Invention Method for manufacturing epitaxial wafer for ultraviolet ray emission device, method for manufact...
2021 Invention Method for manufacturing bonded wafer, and bonded wafer. A method for manufacturing a bonded waf...
2000 P/S Semiconductor silicon wafers, semiconductor silicon ingots.