Shinkawa Ltd.

Japon


 
Quantité totale PI 417
Rang # Quantité totale PI 3 069
Note d'activité PI 3,2/5.0    286
Rang # Activité PI 2 483
Classe Nice dominante Machines et machines-outils

Brevets

Marques

158 0
0 0
257 2
0
 
Dernier brevet 2025 - Mounting apparatus, mounting met...
Premier brevet 1983 - Inner lead bonder
Dernière marque 2017 - Intelligent Bonder
Première marque 2007 - Shinkawa

Industrie (Classification de Nice)

Derniers inventions, produits et services

2024 Invention Wire bonding device and recovery method. A wire bonding device for performing wire bonding on a p...
Invention Flux supply device and flux supply method. This flux supply device comprises: a flux pot that ret...
Invention Production device for semiconductor device. A production device (10) is equipped with a base (12)...
Invention Mounting device and method for detecting displacement of bonding head provided to mounting device...
Invention Wire bonding device and method for calibrating same. Provided is a method for calibrating a wire ...
Invention Wire bonding device, wire bonding method, and wire bonding program. A wire bonding device (1) com...
Invention Method for manufacturing semiconductor device. This method for manufacturing a semiconductor devi...
2023 Invention Clamp device, and control method and control program for same. A wire clamp device (70) comprises...
Invention Mounting device, mounting method, and mounting control program. Provided is a mounting device equ...
Invention Mounting device, mounting method, and mounting control program. Provided is a mounting device com...
Invention Device for manufacturing semiconductor device and method for suctioning member. This device for m...
Invention Horn unit, ultrasonic horn and jig. A horn unit equipped with an ultrasonic horn (10) and a jig (...
Invention Manufacturing apparatus for semiconductor device and manufacturing method. A manufacturing appara...
Invention Semiconductor device manufacturing device and manufacturing method. A semiconductor device manufa...
Invention Three-phase coil structure and linear motor. The present invention provides a compact, high-perfo...
2022 Invention Wire bonding method and device. A wire bonding method and a wire bonding device are presented. Th...
Invention Bonding apparatus, bonding method, and bonding control program. A bonding apparatus 1 comprises: ...
Invention Electronic component mounting apparatus and electronic component mounting method. This electronic...
Invention Semiconductor device manufacturing device and inspection method. A semiconductor device manufactu...
Invention Inspection device, mounting apparatus, inspection method, and non-transitory computer readable re...
Invention Inspection device, mounting device, inspection method, and program. This inspection device compri...
2021 Invention Manufacturing apparatus of semiconductor device. A manufacturing apparatus (10) for manufacturing...
Invention Mounting apparatus, mounting method, and recording medium. A mounting apparatus includes a mount...
Invention Mounting apparatus, mounting method, and recording medium. A mounting apparatus obtains calibrat...
Invention Wire tension adjustment method and wire tension adjuster. f) of a bonding arm (14) is detected, a...
Invention Pin wire forming method, wire bonding apparatus, and bonding tool. The present invention include...
Invention Bonding apparatus and alignment method. A bonding apparatus includes: a clamper able to clamp a w...
Invention Flux transfer apparatus, flux transfer method, and mounting apparatus. A flux transfer apparatus...
Invention Electric circuit abnormality detection device. An electric circuit abnormality detection device ...
Invention Flux transfer apparatus. A flux transfer apparatus (100) includes: a stage (12), having a concave...
Invention Manufacturing apparatus and manufacturing method of semiconductor device. A wire bonding apparat...
Invention Bump-forming device, bump-forming method, and non-transitory computer-readable medium. A bump-fo...
Invention Ultrasonic composite vibration device and manufacturing apparatus of semiconductor device. An ul...
Invention Ultrasonic horn and manufacturing apparatus of semiconductor device. An ultrasonic horn (50) incl...
Invention Manufacturing method of semiconductor device and wire bonding apparatus. A manufacturing method ...
Invention Wire bonding system, inspection device, wire bonding method, and recording medium. A wire bondin...
Invention Wire bonding device, maintenance method and non-transitory computer-readable recording medium rec...
Invention Manufacturing apparatus of semiconductor device and manufacturing method of semiconductor device....
Invention Conveyance device, conveyance method, and non-transitory computer readable medium. This conveyan...
Invention Suction device, suction unit, suction method, and computer-readable recording medium. A suction ...
Invention Mounting device, and method for detecting degree of parallelism of mounting device. In this meth...
Invention Bonding apparatus and bonding method. A bonding apparatus includes: a movable bonding head part ...
Invention Bonding apparatus, bonding method, and computer readable storage medium. A bonding apparatus inc...
Invention Position control apparatus, position control method, position control recording medium, and bondi...
2020 Invention Mounting head. A mounting head for bonding a chip to a bonding target includes: a mounting tool ...
Invention Semiconductor device manufacturing method and manufacturing apparatus. The semiconductor device ...
Invention Measurement device, measurement method, and bonding system. The present invention can provide a ...
Invention Semiconductor device manufacturing device and manufacturing method. A semiconductor device manuf...
Invention Substrate holder and bonding system. A bonding system (90) is provided with a bonding device (80...
Invention Mounting device and mounting method. In this mounting device (10) for mounting a semiconductor c...
2017 P/S Semiconductor manufacturing machines and systems. Repair or maintenance of integrated circuits ma...