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2012
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Invention
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Integrated circuit packaging system with tiebar-less design and method of manufacture thereof. A ... |
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2009
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Invention
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Semiconductor assembly with component pads attached on die back side. One or more electronic comp... |
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Invention
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Method of manufacture for semiconductor package with flow controller. A semiconductor package can... |
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Invention
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Multi-layer semiconductor package with vertical connectors and method of manufacture thereof. A s... |
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2007
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Invention
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Direct via wire bonding and method of assembling the same. A method for electrically connecting a... |
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Invention
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Molding compound flow controller. A semiconductor package can comprise a die stack attached to a ... |
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Invention
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Semiconductor package with flow controller. A semiconductor package can comprise a die stack atta... |
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Invention
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Leadframe package for mems microphone assembly. A cavity semiconductor package has a pre-molded l... |
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2006
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Invention
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Multi-layer semiconductor package. A semiconductor package comprises a base substrate with a semi... |
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Invention
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Pick-up heads and systems for die bonding and related applications. Pick-up heads and systems are... |
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Invention
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Methods for manufacturing thermally enhanced flip-chip ball grid arrays. Methods for fabricating ... |
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Invention
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Fusible i/o interconnection systems and methods for flip-chip packaging involving substrate-mount... |
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Invention
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Semiconductor assembly with component attached on die back side. One or more electronic component... |
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Invention
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Nested integrated circuit package on package system. A package on package system (100) is provide... |
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2004
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Invention
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Bump-on-lead flip chip interconnection. A flip chip interconnect is made by mating the interconne... |
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Invention
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Flip chip interconnection pad layout. A flip chip interconnect pad layout has the die signal pads... |
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Invention
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Bonding tool for mounting semiconductor chips. A vacuum bonding tool for pick-and-place and bondi... |
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Invention
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Dbg system and method with adhesive layer severing. An array of grooves (23) is formed in a first... |
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Invention
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Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of b... |
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2002
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Invention
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Self-coplanarity bumping shape for flip chip. A stud bump structure for electrical interconnectio... |
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Invention
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Process for precise encapsulation of flip chip interconnects. A method for encapsulating flip chi... |
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2001
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Invention
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Flip chip-in-leadframe package and process. A method for connecting a chip to a leadframe include... |
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Invention
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Method of forming flip chip interconnection structure. A flip chip interconnection structure is f... |
