Catlam LLC

United States of America

 
Total IP 27
Total IP Rank # 53,496
IP Activity Score 2/5.0    15
IP Activity Rank # 56,949

Patents

Trademarks

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0 0
3 0
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Last Patent 2023 - Semi-additive process for printe...
First Patent 2014 - Method for forming traces of a p...

Latest Inventions, Goods, Services

2023 Invention Semi-additive process for printed circuit boards. A circuit board has a dielectric core, a foil ...
2022 Invention Circuit board traces in channels using electroless and electroplated depositions. A circuit layer...
2021 Invention Circuit board traces in channels using electroless and electroplated depositions. A circuit laye...
Invention Multi-layer circuit board with traces thicker than a circuit board. A multi-layer circuit board i...
2020 Invention Electroless and electrolytic deposition process for forming traces on a catalytic laminate. A pro...
Invention Catalytic laminate with conductive traces formed during lamination. A circuit board is formed fro...
Invention Circuit board using non-catalytic laminate with catalytic adhesive overlay. A catalytic resin is ...
Invention Process for fabrication of a printed circuit board using a semi-additive process and removable ba...
2019 Invention Multi-layer circuit board with traces thicker than a circuit board layer. A multi-layer circuit b...
Invention Method for making a multi-layer circuit board using conductive paste with interposer layer. A mul...
Invention Catalytic circuit board with traces and vias. A catalytic resin is formed by mixing a resin and e...
2018 Invention Method and apparatus for forming contacts on an integrated circuit die using a catalytic adhesive...
Invention Circuit board with catalytic adhesive. A catalytic resin is formed by mixing a resin and either h...
2017 Invention Process for printed circuit boards using backing foil. A method for making a circuit board uses a...
Invention Process for forming traces on a catalytic laminate. A process for making a circuit board from a c...
Invention Multi-layer circuit board using interposer layer and conductive paste. A multi-layer circuit boar...
Invention Circuit board apparatus and method. A catalytic resin is formed by mixing a resin and either homo...
2016 Invention Integrated circuit wafer integration with catalytic laminate or adhesive. A catalytic laminate is...
Invention Catalytic laminate apparatus and method. A catalytic resin is formed by mixing a resin and either...
Invention Via in a printed circuit board. A via in a printed circuit board is composed of a patterned metal...
Invention Printed circuit board. A printed circuit board includes a laminate substrate. The laminate subst...
Invention Method for wafer level packaging. ++ to Cu. Metal traces are formed in trace channels within the ...
2014 Invention Methods for forming embedded traces. A printed circuit board includes a laminate substrate. The l...
Invention Method for forming traces of a printed circuit board. A printed circuit board includes a laminate...