2023
|
Invention
|
Semi-additive process for printed circuit boards.
A circuit board has a dielectric core, a foil ... |
2022
|
Invention
|
Circuit board traces in channels using electroless and electroplated depositions. A circuit layer... |
2021
|
Invention
|
Circuit board traces in channels using electroless and electroplated depositions.
A circuit laye... |
|
Invention
|
Multi-layer circuit board with traces thicker than a circuit board. A multi-layer circuit board i... |
2020
|
Invention
|
Electroless and electrolytic deposition process for forming traces on a catalytic laminate. A pro... |
|
Invention
|
Catalytic laminate with conductive traces formed during lamination. A circuit board is formed fro... |
|
Invention
|
Circuit board using non-catalytic laminate with catalytic adhesive overlay. A catalytic resin is ... |
|
Invention
|
Process for fabrication of a printed circuit board using a semi-additive process and removable ba... |
2019
|
Invention
|
Multi-layer circuit board with traces thicker than a circuit board layer. A multi-layer circuit b... |
|
Invention
|
Method for making a multi-layer circuit board using conductive paste with interposer layer. A mul... |
|
Invention
|
Catalytic circuit board with traces and vias. A catalytic resin is formed by mixing a resin and e... |
2018
|
Invention
|
Method and apparatus for forming contacts on an integrated circuit die using a catalytic adhesive... |
|
Invention
|
Circuit board with catalytic adhesive. A catalytic resin is formed by mixing a resin and either h... |
2017
|
Invention
|
Process for printed circuit boards using backing foil. A method for making a circuit board uses a... |
|
Invention
|
Process for forming traces on a catalytic laminate. A process for making a circuit board from a c... |
|
Invention
|
Multi-layer circuit board using interposer layer and conductive paste. A multi-layer circuit boar... |
|
Invention
|
Circuit board apparatus and method. A catalytic resin is formed by mixing a resin and either homo... |
2016
|
Invention
|
Integrated circuit wafer integration with catalytic laminate or adhesive. A catalytic laminate is... |
|
Invention
|
Catalytic laminate apparatus and method. A catalytic resin is formed by mixing a resin and either... |
|
Invention
|
Via in a printed circuit board. A via in a printed circuit board is composed of a patterned metal... |
|
Invention
|
Printed circuit board.
A printed circuit board includes a laminate substrate. The laminate subst... |
|
Invention
|
Method for wafer level packaging. ++ to Cu. Metal traces are formed in trace channels within the ... |
2014
|
Invention
|
Methods for forming embedded traces. A printed circuit board includes a laminate substrate. The l... |
|
Invention
|
Method for forming traces of a printed circuit board. A printed circuit board includes a laminate... |