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2025
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Invention
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Semiconductor package device and method of manufacturing the same.
A semiconductor package devic... |
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Invention
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Electronic package and suction device.
A method for manufacturing an electronic package and a su... |
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Invention
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Semiconductor package structure.
A semiconductor package structure is provided. The semiconducto... |
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Invention
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Detection module.
The present disclosure provides a detection module including a carrier configu... |
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Invention
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Substrate structure including embedded semiconductor device and method of manufacturing the same.... |
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Invention
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Electronic package.
An electronic package is provided. The electronic package includes an amplif... |
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Invention
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Semiconductor substrate, semiconductor package, method of manufacturing the same.
A semiconducto... |
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Invention
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Electronic device package and method for manufacturing the same.
An electronic device package in... |
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Invention
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Optoelectronic package structure and method of manufacturing the same.
An optoelectronic package... |
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Invention
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Wearable device.
The present disclosure provides a wearable device. The wearable device includes... |
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Invention
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Optical module.
An optical module is disclosed. The optical module includes a carrier and a lid ... |
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Invention
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Semiconductor device package.
A semiconductor device package includes a substrate and a conducti... |
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Invention
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Semiconductor package structure and method for manufacturing the same.
A semiconductor package s... |
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Invention
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Electronic device.
An electronic device and method of manufacturing the same are provided. The e... |
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Invention
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Electronic device.
An electronic device is disclosed. The electronic device includes a carrier, ... |
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2024
|
Invention
|
Electronic device.
The present disclosure provides an electronic device. The electronic device i... |
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|
Invention
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Package structure.
A package structure includes a substrate, an electronic device and a heat dis... |
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|
Invention
|
Package structure.
A package structure is provided. The package structure includes a first subst... |
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|
Invention
|
Package structure.
A package structure is provided. The package structure includes a first elect... |
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|
Invention
|
Electronic device.
An electronic device is provided. The electronic device includes a carrier, a... |
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|
Invention
|
Package structure.
A package structure is provided. The package structure includes a substrate, ... |
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|
Invention
|
Electronic device.
An electronic device is provided. The electronic device includes a photonic c... |
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|
Invention
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Electronic device.
An electronic device is provided. The electronic device includes a first circ... |
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|
Invention
|
Package structure.
A package structure is provided. The package structure includes a leadframe, ... |
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|
Invention
|
Package structure.
A package structure and a method of manufacturing a package structure are pro... |
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Invention
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Electronic device.
An electronic device is provided. The electronic device includes a plurality ... |
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|
Invention
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Power module.
The present disclosure relates to a power module. The power module includes a firs... |
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Invention
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Package structure.
A package structure is provided. The package structure includes an electronic... |
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G/S
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Etching process of semiconductor wafer; semiconductor packaging processing in the nature of custo... |
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|
Invention
|
Bonding structure.
A bonding structure is provided. The bonding structure includes a first subst... |
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Invention
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Package structure.
A package structure is provided. The package structure includes a processing ... |
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|
Invention
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Method of forming package structure.
A method of forming a package structure is provided. The me... |
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|
Invention
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Electronic device.
An electronic device is provided. The electronic device includes an electroni... |
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|
Invention
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Flexible sensing module.
The present disclosure relates to a sensing module and a flexible sensi... |
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|
Invention
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Electronic device.
An electronic device and a method of manufacturing an electronic device are p... |
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|
Invention
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Electronic device package.
The present disclosure relates to an electronic device package that i... |
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|
Invention
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Electronic device.
An electronic device is provided. The electronic device includes a directing ... |
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Invention
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Electronic system and semiconductor module.
An electronic system and a semiconductor module is p... |
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2022
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G/S
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Chips [integrated circuits]; Circuit boards; Semiconductors; Semiconductor substrates; Micro-circ... |
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G/S
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Etching of semiconductor wafers; custom manufacture of semiconductor packaging in the nature of s... |
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2018
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G/S
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Custom manufacture of integrated semiconductor packages in the nature of semiconductor chip housi... |
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G/S
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Integrated packages of semiconductor integrated circuits, packages, components and modules; integ... |
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2012
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G/S
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Etching of semiconductor wafers; etching of integrated circuits; manufacture of semiconductors, i... |
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2010
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G/S
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Semiconductor device, Product featuring semiconductor package, namely, computer hardware in the n... |
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2009
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G/S
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Circuit board; Semiconductor; Semiconductor substrate; Micro-circuit; Integrated circuit; Electro... |
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G/S
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Semiconductor Chip; Circuit board; Semiconductor; Semiconductor substrate; Micro-circuit; Integra... |
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G/S
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Integrated circuit chips; circuit boards; semiconductors; semiconductor devices; integrated circu... |
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G/S
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Treatment of materials; processing and treatment of materials in the field of semiconductors, and... |
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2008
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G/S
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Processing of materials, namely, silicon wafers and single silicon wafers Design for others in th... |
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G/S
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Semiconductor devices; Product featuring semiconductor package, namely, computer hardware in the ... |
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2005
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G/S
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Integrated circuits; integrated circuits that contain solder balls; semiconductor device |
